Matching part, testing device and testing method

Abstract

The invention discloses a matching part, a testing device and a testing method, and the matching part comprises a supporting part, the top of the supporting part is provided with a supporting surface, and the bottom of the supporting part can be inserted into a substrate of a testing pedestal; the elastic contact piece is arranged on the supporting surface and is used for forming electric contact with the testing part of the chip, and the elastic contact piece has conductivity; the first channel part comprises a first communication section and a second communication section; the first communicating section penetrates through the top and the bottom of the supporting part; the elastic contact piece is provided with the second communication section, and the second communication section is communicated with one end of the first communication section.

Description

[0001] This application is a divisional application of the invention with a filing date of June 18, 2024, an invention name of “A testing device and a testing method” and an application number of 202410792925.8. Technical Field

[0002] The present application relates to the technical field of testing equipment, and in particular to a matching component, a testing device and a testing method. Background Art

[0003] Currently, during chip testing, a driving component (such as a piston, etc.) of a driving device directly contacts the chip surface to push the chip to move, so that the electrical contact points on the chip surface directly contact the test connection points of the testing device.

[0004] Since the driving component of the driving device directly contacts the chip and applies pressure to it to ensure that the electrical contact points of the chip are in direct contact with the test connection points of the test device, it is easy to damage the chip. In addition, since the driving device is located above the chip, foreign objects such as internal parts of the driving device or dust and impurities can easily fall onto the chip. When the driving component of the driving device contacts the chip, foreign objects can easily be clamped between the driving component and the chip. In the process of the driving component applying pressure to the chip, the presence of foreign objects can more easily cause damage to the chip. In addition, damage to the chip can cause subsequent continuous damage (for example, debris generated by damage to the previous chip can affect the detection of the next chip), seriously affecting the test efficiency and test effect of the test device. Summary of the invention

[0005] In view of this, the present application provides a matching component and a testing device to reduce the probability of chip damage and ensure testing efficiency and testing effect. The present application also provides a testing method.

[0006] To achieve the above objectives, this application provides the following technical solutions:

[0007] A mating component, comprising:

[0008] A support portion, wherein the top of the support portion has a support surface, and the bottom of the support portion can be inserted into a substrate of a test base;

[0009] An elastic contact piece, which is disposed on the supporting surface and is used to form an electrical contact with the testing portion of the chip, and has electrical conductivity;

[0010] a first channel portion, the first channel portion comprising a first connecting section and a second connecting section;

[0011] The first connecting section passes through the top and the bottom of the supporting portion;

[0012] The elastic contact member has a second communicating section, and the second communicating section is communicated with one end of the first communicating section.

[0013] Optionally, in the above-mentioned matching component, the elastic contact piece is an annular component, and the second connecting section is a hollow structure of the annular component;

[0014] And / or, the supporting surface is a plane, the bottom surface of the elastic contact piece is a plane matching the supporting surface, and the top surface of the elastic contact piece has a concave surface that is concave along the edge of the elastic contact piece toward the center thereof.

[0015] The present application also provides a testing device for testing a chip to be tested, comprising:

[0016] A test base, the test base having an air flow channel, a predetermined position of the test base having a matching component, the matching component being used to be electrically connected to the test portion of the chip;

[0017] The matching components include:

[0018] A support portion, wherein the top of the support portion has a support surface, and the bottom of the support portion is inserted into a substrate of the test base;

[0019] An elastic contact member, the elastic contact member is disposed on the supporting surface and is used to form an electrical contact with the testing portion of the chip, and the elastic contact member has conductivity;

[0020] a first channel portion of the airflow channel, the first channel portion comprising a first connecting section and a second connecting section;

[0021] The first connecting section passes through the top and the bottom of the supporting portion;

[0022] The elastic contact member has a second communicating section, and the second communicating section is communicated with one end of the first communicating section;

[0023] A power mechanism is provided, wherein the power mechanism can generate a non-contact driving force for the chip to move toward or away from the test base through the air flow channel.

[0024] Optionally, in the above-mentioned test device, the power mechanism has a first state; in the first state, the power mechanism can generate a non-contact driving force for the chip toward the test base;

[0025] in,

[0026] During the process of testing the chip, the power mechanism is in a first state, so that the testing portion of the chip is electrically connected to the matching component.

[0027] Optionally, in the above-mentioned testing device, the power mechanism includes an inflatable component, and an air outlet of the inflatable component is connected to the air flow channel;

[0028] The power mechanism also has a second state. In the second state, the inflatable component is in an air supply state, and the airflow generated by the air supply passes through the air outlet of the inflatable component and the airflow channel in sequence.

[0029] Optionally, in the above-mentioned testing device, the testing base comprises a substrate, and the matching component is inserted into the substrate;

[0030] The airflow channel also has a second channel portion that penetrates the substrate, and the second channel portion is arranged alternately with the matching component.

[0031] Optionally, in the above-mentioned testing device, the elastic contact member is an annular component, and the second connecting section is a hollow structure of the annular component;

[0032] And / or, the supporting surface is a plane, the bottom surface of the elastic contact piece is a plane matching the supporting surface, and the top surface of the elastic contact piece has a concave surface that is concave along the edge of the elastic contact piece toward the center thereof.

[0033] The present application also provides a testing method, using any of the testing devices described above, including:

[0034] Placing the chip to be tested at a predetermined position of the test base of the test device so that the matching component of the test base is arranged correspondingly to the test portion of the chip;

[0035] Switching the power mechanism to a first state so that the power mechanism generates a non-contact driving force on the chip toward the test base, so that the matching component of the test base is electrically connected to the test portion of the chip;

[0036] Using the testing device to test the chip;

[0037] After the test is completed, the power mechanism is switched to the second state, so that the power mechanism generates a non-contact driving force on the chip facing away from the test base, and the chip after the test is moved out of the predetermined position of the test base.

[0038] Optionally, in the above test method, when the power mechanism is in the second state, the inflatable component of the power mechanism is in an air supply state, and the airflow generated by the air supply passes through the air outlet of the inflatable component and the airflow channel of the test base in sequence.

[0039] Optionally, in the above test method, after the tested chip is moved out of the predetermined position of the test base, the method further includes using the airflow generated by the power mechanism to purge the test base. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 A schematic diagram of the structure of a testing device provided in an embodiment of the present application;

[0042] Figure 2 A schematic diagram of the structure of a test base provided in an embodiment of the present application;

[0043] Figure 3 A schematic diagram of the main structure of the matching components provided in the embodiment of the present application;

[0044] Figure 4 A schematic diagram of a top view of the structure of a first matching component provided in an embodiment of the present application;

[0045] Figure 5 A schematic diagram of a top view of the structure of a second matching component provided in an embodiment of the present application;

[0046] Figure 6 A schematic diagram of a first state of a matching component and a testing unit provided in an embodiment of the present application;

[0047] Figure 7 A schematic diagram of a second state of a matching component and a testing unit provided in an embodiment of the present application;

[0048] Figure 8 A schematic diagram of the structure of a third matching component and a testing unit provided in an embodiment of the present application;

[0049] Fig. 9 A schematic diagram of the test method provided in the embodiment of the present application. DETAILED DESCRIPTION

[0050] The present application discloses a testing device to reduce the probability of chip damage and ensure testing efficiency and testing effect. The present application also provides a testing method.

[0051] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0052] like Figure 1 and Figure 2 As shown, the embodiment of the present application provides a testing device for testing a chip 100 to be tested, including a testing base 200 and a power mechanism 300. During the test, the chip 100 to be tested is placed on the testing base 200, and the power mechanism 300 applies force to the chip 100 to ensure the connection effect between the chip 100 to be tested and the testing base 200.

[0053] The test base 200 has a matching component 210 at a predetermined position, and the matching component 210 is used to be electrically connected to the test part 110 of the chip 100 to be tested; the power mechanism 300 has a first state; in the first state, the power mechanism 300 can generate a non-contact driving force for the chip 100 to be tested toward the test base 200. The non-contact driving force is the force generated by the contact between the non-physical component and the chip 100 to be tested or the force generated by the physical component and the chip 100 to be tested in a non-contact state.

[0054] In the process of testing the chip 100 to be tested, the power mechanism 300 is in the first state, so that a reliable and stable electrical connection is formed between the test portion 110 of the chip 100 to be tested and the matching component 210 .

[0055] The test device provided in the embodiment of the present application generates a non-contact driving force on the chip 100 to be tested in the first state by the power mechanism 300, so that the chip 100 to be tested has a tendency to move toward the test base 200, thereby ensuring the positioning effect of the chip 100 to be tested at the predetermined position of the test base 200 and the electrical connection effect between the test part 110 of the chip 100 to be tested and the matching component 210 of the test base 200. The non-contact driving force generated by the power mechanism 300 is applied to the chip 100 to be tested, ensuring the contact stability of the electrical connection between the test part 110 of the chip 100 to be tested and the matching component 210, so as to facilitate subsequent testing. By adopting the non-contact driving force, the damage to the chip 100 to be tested caused by hard contact with the chip 100 to be tested is avoided, and the probability of damage to the chip 100 is effectively reduced, thereby reducing the situation where the subsequent test is affected by the damage of the chip 100, ensuring the test efficiency of the test device on the chip 100 to be tested, and also improving the test effect of the chip 100.

[0056] The matching component 210 may be a pogo pin, and the test unit 110 may be a pin header or a solder ball. The test device provided in the embodiment of the present application may be an ATE (Automatic Test Equipment) test device, which is a device used to test the performance and function of a semiconductor chip. Of course, the test device provided in the embodiment of the present application may also be other devices used to test the chip 100.

[0057] In a specific embodiment, in the first state, the non-contact driving force generated by the power mechanism 300 on the chip 100 to be tested is an attractive force, wherein the attractive force can be an attractive force generated by airflow or a magnetic attraction force generated by a magnetic attraction device.

[0058] The power mechanism 300 can be arranged on the side of the chip 100 to be tested facing the test base 200, and avoids arranging the power mechanism 300 on the side of the chip 100 to be tested facing away from the test base 200, so as to facilitate the transfer of the chip 100 to be tested to the test base 200 by a manipulator or other handling device. Of course, the power mechanism 300 can also be arranged at other positions, and it is only necessary to ensure that the non-contact driving force (attraction force) generated by the power mechanism 300 on the chip 100 to be tested in the first state can drive the chip 100 to be tested to move toward the test base 200 or have a tendency to move toward the test base 200.

[0059] Furthermore, the power mechanism 300 includes an air suction component; the test base 200 has an air flow channel, and the air suction port of the air suction component is connected to the air flow channel; in the first state, the air suction component is in an air suction state, and the airflow generated by the suction passes through the air flow channel and the air suction port of the air suction component in sequence.

[0060] That is, the testing device in the embodiment of the present application is used to test the chip to be tested, including:

[0061] A test base 200, wherein a matching component 210 is provided at a predetermined position of the test base 200, and the matching component 210 is used to be electrically connected to the test portion 110 of the chip 100; the test base 200 has an air flow channel;

[0062] The power mechanism 300 has a first state; in the first state, the power mechanism 300 can generate a non-contact driving force for the chip 100 toward the test base 200, and the non-contact driving force is an attractive force; the power mechanism 300 includes an air suction component, and the air suction port of the air suction component is connected to the air flow channel;

[0063] in,

[0064] During the process of testing the chip 100, the power mechanism 300 is in the first state, the air suction component is in the air suction state, and the airflow generated by the air suction passes through the airflow channel and the air suction port of the air suction component in sequence, generating an attraction force on the chip 100 toward the test base 200, so that the test part 110 of the chip 100 is electrically connected to the matching component 210. The test device provided in the embodiment of the present application, through the power mechanism 300 in the first state, makes the air suction component in the air suction state, and the airflow generated by the air suction passes through the airflow channel and the air suction port of the air suction component in sequence, generating an attraction force on the chip 100 toward the test base 200, so that the chip 100 to be tested has a tendency to move toward the test base 200, thereby ensuring the positioning effect of the chip 100 to be tested at the predetermined position of the test base 200 and the electrical connection effect between the test part 110 of the chip 100 to be tested and the matching component 210 of the test base 200. The attraction force generated by the power mechanism 300 is a non-contact driving force, which ensures the contact stability of the electrical connection between the test part 110 of the chip 100 to be tested and the matching component 210, so as to facilitate subsequent testing. By adopting a non-contact driving force, the chip 100 to be tested is avoided from being damaged by hard contact with the chip 100 to be tested, and the probability of damage to the chip 100 is effectively reduced, thereby reducing the situation where the subsequent test is affected by the damage of the chip 100, ensuring the test efficiency of the test device on the chip 100 to be tested, and improving the test effect of the chip 100.

[0065] In the first state, the air suction component is in the air suction state, thereby driving the external gas to form an air flow to flow through the air flow channel to the air suction port of the air suction component. In this process, the air flow can flow from the side of the chip 100 to be tested that is not facing the test base 200 along the edge of the chip 100 to the side of the chip 100 to be tested that is facing the test base 200, so that the air flow drives the chip 100 to be tested to move toward the test base 200 or makes the chip 100 to be tested have a tendency to move toward the test base 200. Alternatively, in the first state, the air suction component is in the air suction state, through the air flow channel of the test base 200, so that the gas between the chip 100 to be tested and the test base 200 forms an air flow to flow through the air flow channel to the air suction port of the air suction component, so that a negative pressure is formed between the chip 100 to be tested and the test base 200, and the side of the chip 100 to be tested that is not facing the test base 200 is subjected to atmospheric pressure and moves toward the test base 200 or forms a tendency to move toward the test base 200.

[0066] The suction component sucks the outside air to drive the outside air to form an airflow movement, thereby generating an attraction force for the chip 100 to be tested toward the test base 200 .

[0067] The power mechanism 300 may also have a magnetic attraction component that generates magnetic attraction with the chip 100 to be tested, so that the chip 100 to be tested moves toward the test base 200 or has a tendency to move toward the test base 200 under the action of the magnetic attraction.

[0068] like Figure 2 As shown, in the test device provided in the embodiment of the present application, the test base 200 includes a substrate 230, and the matching component 210 is inserted into the substrate 230; the air flow channel has a first channel portion 220 that penetrates the substrate 230, and the first channel portion 220 and the matching component 210 are arranged alternately. That is, the orthographic projections of the first channel portion 220 and the matching component 210 on the substrate 230 in this embodiment do not overlap.

[0069] In this embodiment, there are multiple first channel portions 220 and matching components 210, and they are all arranged in a matrix. Since the first channel portions 220 and the matching components 210 are arranged alternately, in order to improve the effect of arranging the first channel portions 220 and the matching components 210 on the substrate 230, each first channel portion 220 is surrounded by four matching components 210, and each matching component 210 is surrounded by four first channel portions 220.

[0070] It is understandable that, since the matching component 210 is inserted into the substrate 230, the substrate 230 at least has a matching hole for inserting the matching component 210. When processing the substrate 230, the matching hole can be pre-processed on the substrate 230 so that the matching hole and the first channel portion 220 are arranged alternately, and then the matching component 210 is inserted into the matching hole to realize the operation of inserting the matching component 210 into the substrate 230.

[0071] The matching component 210 can also be directly inserted into the solid part of the substrate 230 where the first channel portion 220 is not provided, and the stability of the matching component 210 inserted into the substrate 230 is ensured by the structural deformation of the substrate 230. For example, during the process of inserting the matching component 210 into the substrate 230, the area where the solid part of the substrate 230 contacts the insertion end of the matching component 210 is deformed by pressure, and a groove or through-hole structure is formed that wraps the outer periphery of the matching component 210, so as to ensure the stability of the matching component 210 inserted into the substrate 230. The substrate 230 can be made of elastic materials such as rubber, and the matching component 210 is generally made of metal materials. During the process of inserting the matching component 210 into the substrate 230, the solid part of the substrate 230 is squeezed by the matching component 210 to form a groove or through-hole structure. After the matching component 210 is inserted into the predetermined position, the groove wall of the groove or the inner wall of the through-hole squeezes the outer wall of the matching component 210 under the elastic action, thereby further improving the stability of the matching component 210 inserted into the substrate 230.

[0072] The first channel portion 220 can be a through hole that penetrates the substrate 230, so that when the suction component is in the suction state, it can generate a downward attraction (close to the substrate 230) on the chip 100, generating a downward pressing force on the chip 100, so that the test portion 110 of the chip 100 contacts the mating component 210, so as to facilitate subsequent testing.

[0073] In a specific embodiment, there are multiple first channel portions 220 that are evenly arranged, so that when the air intake component is in an air intake state, multiple evenly distributed airflows are formed to pass through the multiple first channel portions 220 respectively, thereby generating a uniform attraction force on the chip 100.

[0074] like Figure 2 and Figure 3 As shown, in order to improve the stability of the electrical connection (contact) between the test unit 110 and the matching component 210, the air flow channel further has a second channel portion 240, and the second channel portion 240 runs through the matching component 210. That is, in the first state, the air intake component is in the air intake state, and the air intake component can drive the air flow formed by the external air to pass through the second channel portion 240.

[0075] That is, the air suction component can drive the airflow formed by the external air to pass through the second channel portion 240 , and can also realize a non-contact driving force (attractive force) for the chip 100 to be tested toward the test base 200 .

[0076] In another embodiment, the air flow channel has the second channel portion 240 but does not have the first channel portion 220. That is, the air suction component can drive the air flow formed by the outside air to pass only through the second channel portion 240, and the non-contact driving force (attractive force) formed is used as the driving force for the chip 100 to be tested to move toward the test base 200.

[0077] In an embodiment where the air inlet of the second channel portion 240 is located in the area where the mating component 210 contacts the test portion 110, since the second channel portion 240 passes through the mating component 210 and the test portion 110 is electrically connected to the mating component 210, the test portion 110 can close the air inlet of the second channel portion 240 when the mating component 210 and the test portion 110 are electrically connected (contacted), thereby forming a negative pressure inside the second channel portion 240, further improving the stability of the electrical connection (contact) between the mating component 210 and the test portion 110.

[0078] In the embodiment where the air inlet of the second channel portion 240 is located in the non-contact area between the mating component 210 and the test portion 110, since the second channel portion 240 passes through the mating component 210, the air intake assembly can drive the airflow formed by the external air to flow into the second channel portion 240 after passing through the test portion 110, so that the airflow generates a force that drives the test portion 110 toward the mating component 210, which also improves the stability of the electrical connection (contact) between the mating component 210 and the test portion 110.

[0079] After the chip 100 is tested and completed, the chip 100 needs to be moved out of the predetermined position of the test base 200. Among them, the relatively moving away force generated between the chip 100 and the test base 200 can more conveniently move the chip 100 out of the predetermined position of the test base 200. In this embodiment, the power mechanism 300 also includes an inflatable component, and the air outlet of the inflatable component is connected to the air flow channel; the power mechanism 300 also has a second state, in which the inflatable component is in an air supply state, and the airflow generated by the air supply passes through the air outlet and the air flow channel of the inflatable component in sequence. That is, the inflatable component is in an air supply state, and the airflow provided by the inflatable component can flow toward the chip 100 through the air outlet and the air flow channel of the inflatable component, thereby pushing the chip 100 away from the test base 200 or causing the chip 100 to move away from the test base 200.

[0080] In the process of the robot arm taking the chip 100 , the robot arm may take the chip 100 by suction or grasping, and then drive the chip 100 to move out of the predetermined position of the test base 200 through the robot arm.

[0081] When the chip 100 needs to be moved out from the predetermined position of the test base 200, the inflation component can be first placed in an air supply state, and the provided airflow flows toward the chip 100 through the airflow channel, so that the chip 100 moves away from the test base 200 or has a tendency to move away from the test base 200, so that the robot arm can pick up the chip 100, effectively avoiding damage to the chip 100 caused by collision or friction during the process of the robot arm picking up the chip 100.

[0082] In order to ensure the impact on the chip 100 during and after the test, the suction component and the inflation component cannot be operated at the same time. That is, during the test, the suction component is in the suction state and the inflation component is in the non-inflation state; after the test is completed, the suction component is in the non-inflation state and the inflation component can be in the inflation state.

[0083] The airflows driven by the air intake assembly and the air charging assembly all pass through the air flow channel, which can effectively improve the utilization rate of the air flow channel, avoid setting up separate channels corresponding to the air intake assembly and the air charging assembly, and effectively simplify the structure.

[0084] Furthermore, the air suction component and the inflation component can be independent components, such as the air suction component is an air pump and the inflation component is a blower, etc.; the air suction component and the inflation component can also be the same device, such as an air pump device, etc.

[0085] like Figure 3 As shown, the test device provided in the embodiment of the present application, the matching component 210 includes a support portion 211 and an elastic contact member 212. Among them, the top of the support portion 211 has a support surface, and the bottom of the support portion 211 is inserted into the substrate 230 of the test base 200; the elastic contact member 212 is arranged on the support surface and is used to form an electrical contact with the test portion 110 of the chip 100 to be tested, and the elastic contact member 212 is conductive. The elastic modulus of the support portion 211 is greater than the elastic modulus of the elastic contact member 212, so that the support portion 211 can provide a stable supporting force for the elastic contact member 212. Among them, the support portion 211 can be made of materials such as copper, iron or alloy that are not easily elastically deformed. The elastic contact member 212 can conduct electricity and is elastic. An elastic non-conductive material (such as rubber) can be used as the main structure of the elastic contact member 212, and a conductive material can be added to make a conductive component (such as a metal wire) arranged on or in the main structure, so that the elastic contact member 212 is conductive and elastic. The elastic contact member 212 may also be made of conductive and elastic materials, such as conductive gel, a composite material of carbon nanotubes and polymer elastomer, or a nickel-based high-conductivity and high-elasticity alloy, etc. The conductive gel may be a metal gel, or an ion-loaded gel, a conductive polymer gel, or a supramolecular conductive gel, etc.

[0086] Preferably, the elastic contact member 212 is made of metal gel, wherein the specific metal gel may be metal-organic gel, small molecule metal gel or metal nano material gel.

[0087] The top of the support portion 211 may be located on one side of the substrate 230 , and the bottom of the support portion 211 may be located on the other side of the substrate 230 , that is, the support portion 211 passes through the substrate 230 .

[0088] Metal gel has good conductivity and elasticity, and also has good airtightness (similar to jelly). Figure 6 and Figure 7 As shown, when the elastic contact member 212 contacts the test part 110, the second channel part 240 forms a cavity, and the cavity is connected to the suction port of the suction component. After the suction component sucks air into the cavity, the cavity formed by the second channel part 240 is evacuated, and the negative pressure state inside the second channel part 240 is maintained, so that the test part 110 of the chip 100 can be adsorbed on the matching component 210 (similar to the contact effect of pressing down), and can have good contact, so as to optimize the test of electrical connection.

[0089] Furthermore, the elastic contact member 212 has no adhesiveness, and therefore, the elastic contact member 212 will not stick to the testing portion 110 of the chip 100 .

[0090] The elastic contact piece 212 can be made of non-sticky metal gel, or other non-sticky conductive elastic materials (such as the above-mentioned composite material of carbon nanotubes and polymer elastomers or nickel-based high-conductivity and high-elasticity alloy), which are not limited here and are all within the scope of protection.

[0091] In the prior art, the electrical contact points of the chip made of metal materials are in hard contact with the test connection points of the test device, which can easily cause damage to the electrical contact points of the chip or the test connection points of the test device. The debris generated by the damage can also easily cause damage to the test device.

[0092] In the embodiment of the present application, the above-mentioned arrangement enables the elastic contact piece 212 to have a certain degree of softness. When the test part 110 of the chip 100 contacts the elastic contact piece 212, the test part 110 and the elastic contact piece 212 are in non-rigid contact. In addition, the elastic contact piece 212 can be elastically deformed under the squeezing of the test part 110, so that the elastic contact piece 212 forms a structure that wraps the test part 110, making the test part 110 of the chip 100 not easily damaged, thereby reducing the probability of damage to the test device.

[0093] Furthermore, the support portion 211 and the elastic contact member 212 may be a combined structure that can be relatively disassembled and assembled, that is, the elastic contact member 212 may be replaced individually without replacing the entire matching component 210, thereby effectively reducing repair and maintenance costs.

[0094] like Figure 6 and Figure 7 As shown, the second channel portion 240 of the airflow channel includes a first connecting section 241 and a second connecting section 242; the first connecting section 241 passes through the top and the bottom of the support portion 211; the elastic contact piece 212 has a second connecting section 242, and the second connecting section 242 is connected to one end of the first connecting section 241.

[0095] Among them, one end of the second connecting section 242 is connected with one end of the first connecting section 241, and the other end of the second connecting section 242 faces the test part 110, and the test part 110 can close the other end of the second connecting section 242, so that the second channel part 240 forms a structure in which the first end (the other end of the second connecting section 242) is closed and the second end of the second channel part 240 (the other end of the first connecting section 241) is connected to the suction component and / or the inflation component of the power mechanism 300, so that a negative pressure can be formed in the second channel part 240, and under the action of the external atmospheric pressure, the test part 110 is pressed against the elastic contact piece 212, and the elastic contact piece 212 is elastically deformed, which further improves the stability of the electrical connection (contact) between the mating component 210 and the test part 110.

[0096] like Figure 4 As shown, in this embodiment, the elastic contact member 212 is an annular component, and the second connecting section 242 is a hollow structure of the annular component.

[0097] like Figure 5 As shown, there are multiple elastic contact members 212 and they are arranged along the same circumferential direction. The elastic contact members 212 may be columnar structures or other protruding structures, so that the end faces (the side facing away from the support portion 211) of the multiple elastic contact members 212 can all contact the end of the test portion 110. The second connecting section 242 is located in the middle of the structure surrounded by the multiple elastic contact members 212.

[0098] like Figure 6 and Figure 7 As shown, the end of the test part 110 has a spherical surface, which is a curved surface convex toward the elastic contact member 212. Through the above arrangement, the central area of ​​the end of the test part 110 (the highest point of the spherical surface and the vicinity) can be sunk into the hollow structure of the annular component, which can further improve stability. Figure 6 As shown, in this embodiment, the top surface of the elastic contact member 212 is a plane, and a concave surface is formed along the edge of the elastic contact member 212 toward the center thereof by contacting with and being pressed by the testing portion 110 .

[0099] like Figure 8 As shown, in another embodiment, the support surface is a plane, the bottom surface of the elastic contact member 212 is a plane matching the support surface, and the top surface of the elastic contact member 212 has a concave surface that is concave toward the center along the edge of the elastic contact member 212. Through the above arrangement, the connection stability between the matching component 210 and the test part 110 is effectively improved.

[0100] In another embodiment, the support surface is a concave surface that is concave along the edge of the support portion 211 toward its center, the elastic contact member 212 is an elastic layer or elastic gasket located on the concave surface, and the elastic contact member 212 has a through hole to serve as the second connecting section 242.

[0101] like Figure 1 , Figure 2 and Fig. 9 As shown, the embodiment of the present application also provides a testing method, using any of the above-mentioned testing devices, including the steps of:

[0102] S1: placing the chip 100 to be tested at a predetermined position of the test base 200 of the test device, so that the matching component 210 of the test base 200 is arranged corresponding to the test portion 110 of the chip 100 to be tested;

[0103] A robot can be used to clamp the chip 100 to be tested and move it, so as to facilitate the operation of placing the chip 100 to be tested at a predetermined position of the test base 200 of the test device, wherein the robot can belong to any of the above-mentioned test devices, that is, the test device includes a robot capable of moving the chip 100. The chip 100 to be tested can also be placed at the predetermined position manually.

[0104] The matching component 210 of the test base 200 is arranged corresponding to the test part 110 of the chip 100 to be tested. The test part 110 can contact with the matching component 210 of the test base 200 under the action of gravity of the chip 100 to be tested, or there can be a gap between the matching component 210 of the test base 200 and the test part 110 of the chip 100 to be tested.

[0105] S2: Switch the power mechanism 300 to the first state, so that the power mechanism 300 generates a non-contact driving force on the chip 100 to be tested toward the test base 200, so that the matching component 210 of the test base 200 is electrically connected to the test portion 110 of the chip 100 to be tested;

[0106] In step S1, when the matching component 210 of the test base 200 is in contact with the test part 110 of the chip 100 to be tested, the chip 100 to be tested can have a movement tendency toward the test base 200 through a non-contact driving force, thereby improving the contact stability between the matching component 210 and the test part 110, so as to ensure the stability of the electrical connection between the matching component 210 of the test base 200 and the test part 110 of the chip 100 to be tested.

[0107] In a specific embodiment, the matching component 210 includes a supporting portion 211 and an elastic contact piece 212. The elastic contact piece 212 is electrically conductive and elastic, so that the test part 110 is in non-rigid contact with the elastic contact piece 212. That is, on the basis of ensuring that the matching component 210 is electrically connected to the test part 110, the elastic contact piece 212 of the matching component 210 can be elastically deformed under the pressure of the test part 110 to form a structure that wraps the test part 110, thereby reducing the probability of damage to the test part 110 of the chip 100.

[0108] In step S1, when there is a gap between the matching component 210 of the test base 200 and the test section 110 of the chip 100 to be tested, the chip 100 to be tested can be moved toward the test base 200 by a non-contact driving force, so that the matching component 210 contacts the test section 110. Under the action of the non-contact driving force, the contact stability between the matching component 210 and the test section 110 can be effectively improved to ensure the stability of the electrical connection between the matching component 210 of the test base 200 and the test section 110 of the chip 100 to be tested.

[0109] S3: Testing the chip 100 to be tested using a testing device;

[0110] During the test, the power mechanism 300 can continuously generate a stable non-contact driving force to ensure the stability of the electrical connection between the matching component 210 and the test part 110 during the test.

[0111] S4: After the test is completed, the tested chip 100 is moved out of the predetermined position of the test base 200 .

[0112] A robot can be used to clamp the chip 100 after the test is completed and move it, so as to realize the operation of moving the chip 100 out of the predetermined position of the test base 200, wherein the robot can belong to any of the above-mentioned test devices, that is, the test device includes a robot capable of moving the chip 100. The chip 100 can also be moved out of the predetermined position of the test base 200 manually.

[0113] The testing method provided in the embodiment of the present application has the same technical effect as the above-mentioned testing device and will not be described in detail here.

[0114] Further, when the power mechanism 300 is in the second state, the inflatable component of the power mechanism 300 is in the air supply state, and the airflow generated by the air supply passes through the air outlet and the airflow channel of the inflatable component in sequence;

[0115] In step S4 , after the test is completed, the power mechanism 300 is switched to the second state, so that the power mechanism 300 generates a non-contact driving force for the tested chip 100 to move away from the predetermined position of the test base 200 .

[0116] Among them, when the power mechanism 300 switches to the second state so that the power mechanism 300 generates a non-contact driving force for the tested chip 100 facing away from the test base 200, the inflation component is in an air supply state, and the airflow generated by the air supply passes through the air outlet and the airflow channel of the inflation component in sequence, and the airflow is applied to the side of the chip 100 facing the test base 200. This facilitates the application of a pushing force on the chip 100 away from the test base 200, thereby reducing the force between the chip 100 and the test base 200 approaching each other (including the gravity of the chip 100), so as to facilitate the robot to pick up the chip 100 and move the chip 100 out of the predetermined position of the test base 200.

[0117] The airflow applied to the surface of the chip 100 facing the test base 200 can also completely offset the gravity of the chip 100, and the chip 100 can be moved away from the test base 200 under the driving force of the airflow on the chip 100, so as to move the chip 100 out of the predetermined position of the test base 200.

[0118] In order to further improve the test effect of the chip 100 and prevent foreign objects such as dust or impurities from reaching the predetermined position of the test base 200 and affecting the position of the chip 100 to be tested, after the chip 100 that has been tested is moved out of the predetermined position of the test base 200, the test base 200 is purged by the airflow generated by the power mechanism 300. The air suction component and / or the air filling component of the power mechanism 300 can be used to purge the test base 200. By purging the test base 200, foreign objects such as dust or impurities are effectively prevented from reaching the test base 200, thereby improving the test effect.

[0119] Specifically, when the suction component of the power mechanism 300 is in the suction state, it can drive the airflow from the side of the test base 200 toward the chip 100 through the air flow channel to the suction port of the suction component, and can make the airflow carry foreign matter such as dust or impurities into the air flow channel, thereby achieving purging of the test base 200.

[0120] When the inflation component of the power mechanism 300 is in the air supply state, it can drive the airflow from the air outlet of the inflation component through the airflow channel to flow toward the side of the test base 200 facing the chip 100, so that the airflow can carry foreign objects such as dust or impurities away from the test base 200, thereby purging the test base 200.

[0121] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0122] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A mating component, comprising: A support portion, wherein the top of the support portion has a support surface, and the bottom of the support portion can be inserted into a substrate of a test base; An elastic contact piece, which is disposed on the supporting surface and is used to form an electrical contact with the testing portion of the chip, and has electrical conductivity; a first channel portion, the first channel portion comprising a first connecting section and a second connecting section; The first connecting section passes through the top and the bottom of the supporting portion; The elastic contact member has a second communicating section, and the second communicating section is communicated with one end of the first communicating section.

2. The mating component according to claim 1, wherein the elastic contact member is an annular component, and the second connecting section is a hollow structure of the annular component; And / or, the supporting surface is a plane, the bottom surface of the elastic contact piece is a plane matching the supporting surface, and the top surface of the elastic contact piece has a concave surface that is concave along the edge of the elastic contact piece toward the center thereof.

3. A testing device for testing a chip to be tested, comprising: A test base, the test base having an air flow channel, a predetermined position of the test base having a matching component, the matching component being used to be electrically connected to the test portion of the chip; The matching components include: A support portion, wherein the top of the support portion has a support surface, and the bottom of the support portion is inserted into a substrate of the test base; An elastic contact member, the elastic contact member is disposed on the supporting surface and is used to form an electrical contact with the testing portion of the chip, and the elastic contact member has conductivity; a first channel portion of the airflow channel, the first channel portion comprising a first connecting section and a second connecting section; The first connecting section passes through the top and the bottom of the supporting portion; The elastic contact member has a second communicating section, and the second communicating section is communicated with one end of the first communicating section; A power mechanism is provided, wherein the power mechanism can generate a non-contact driving force for the chip to move toward or away from the test base through the air flow channel.

4. The test device according to claim 3, wherein the power mechanism has a first state; in the first state, the power mechanism can generate a non-contact driving force for the chip toward the test base; in, During the process of testing the chip, the power mechanism is in a first state, so that the testing portion of the chip is electrically connected to the matching component.

5. The testing device according to claim 3 or 4, wherein the power mechanism comprises an inflatable component, and an air outlet of the inflatable component is connected to the air flow channel; The power mechanism also has a second state. In the second state, the inflatable component is in an air supply state, and the airflow generated by the air supply passes through the air outlet of the inflatable component and the airflow channel in sequence.

6. The test device according to claim 5, wherein the test base comprises a base plate, and the mating component is inserted into the base plate; The airflow channel also has a second channel portion that penetrates the substrate, and the second channel portion is arranged alternately with the matching component.

7. The testing device according to claim 4, wherein the elastic contact member is an annular component, and the second connecting section is a hollow structure of the annular component; And / or, the supporting surface is a plane, the bottom surface of the elastic contact piece is a plane matching the supporting surface, and the top surface of the elastic contact piece has a concave surface that is concave along the edge of the elastic contact piece toward the center thereof.

8. A testing method, using the testing device according to any one of claims 3 to 7, comprising: Placing the chip to be tested at a predetermined position of the test base of the test device so that the matching component of the test base is arranged correspondingly to the test portion of the chip; Switching the power mechanism to a first state so that the power mechanism generates a non-contact driving force on the chip toward the test base, so that the matching component of the test base is electrically connected to the test portion of the chip; Using the testing device to test the chip; After the test is completed, the power mechanism is switched to the second state, so that the power mechanism generates a non-contact driving force on the chip facing away from the test base, and the chip after the test is moved out of the predetermined position of the test base.

9. The testing method as described in claim 8, wherein when the power mechanism is in the second state, the inflation component of the power mechanism is in an air supply state, and the airflow generated by the air supply passes through the air outlet of the inflation component and the airflow channel of the test base in sequence.

10. The testing method according to claim 8 or 9, further comprising, after the tested chip is moved out of the predetermined position of the testing base, using the airflow generated by the power mechanism to purge the testing base.

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