Totally-enclosed packaging integrated circuit temperature test insulation device and test method

Abstract

According to the totally-enclosed packaged integrated circuit temperature test heat preservation device and the test method, the test heat preservation device comprises a heat preservation base and a totally-enclosed metal cover, the totally-enclosed metal cover is adopted on the upper portion, heat preservation and temperature locking can be further achieved while air is isolated, and meanwhile an assembly structure of the upper base and the lower base is arranged; the base and the metal cover are combined to form a totally-closed space, so that the temperature can be kept in a stable state, the problems of'high-temperature running 'and'low-temperature frosting' in the temperature measurement process of the device to be measured are solved, and repeated operation in the test process is avoided.

Description

Technical Field

[0001] The invention relates to a temperature test insulation device and a test method for a fully enclosed packaged integrated circuit, belonging to the technical field of component packaging. Background Art

[0002] Small Out-line package (SOP) is a very common component packaging form, one of the surface mount packages. The pins are led out from both sides of the package in a gull-wing shape (L-shaped). The main materials are plastic and ceramic. SOP packaging is a common packaging form for military and aerospace integrated circuits. It is characterized by small size, small parasitic parameters, suitable for high-frequency use, and high reliability. Common ones include SOP8, SOP16, SOP28, etc. The difference between different packaging forms mainly lies in the shell volume and the number of pins.

[0003] Due to the structure of SOP packaged devices, the SOP packaged devices need to be loaded into the adapter device for testing during the test, and then the device with the installed devices is placed in the high and low temperature test chamber for a certain period of time until the device housing and junction temperature meet the requirements of the test conditions. Finally, the device with the installed devices is taken out of the high and low temperature test chamber and placed on the test bench of the test equipment for full parameter testing of high and low temperature electrical performance. However, the traditional device is open. After the device with the installed devices is taken out of the high and low temperature test chamber, the device housing is directly exposed to the air, so that the temperature stress of the device does not meet the requirements of the test conditions. Taking the low temperature test as an example, after the device is exposed to the air, the device surface and pins will quickly frost.

[0004] As the time of contact with air increases, water droplets will quickly form on the surface and pins of the traditional device equipped with SOP packaged devices. The water droplets will cover the surface and pins of the device. After measuring the surface temperature of the device shell, it is found that the temperature of the device has dropped to 120.3℃ about 10 seconds after the device is taken out of the high temperature (125℃) box environment. According to the high temperature test part of the temperature control during electrical testing of GJB548C-2021, the device temperature should not be lower than the specified shell temperature or junction temperature by more than 3℃ during the test. This statistical analysis found that the temperature change of the device exceeded the specified range in a very short time of 10 seconds. About 7 seconds after the device was taken out of the low temperature (-55℃) box environment, the temperature had dropped to -49.3℃. According to the low temperature test part of the temperature control during electrical testing of GJB548C-2021, the device temperature should not be lower than the specified shell temperature or junction temperature by more than 5℃ during the test. This statistical analysis found that the temperature change of the device exceeded the allowable range in a very short time of 7 seconds.

[0005] The above problems will result in the inability to maintain the temperature stress during high and low temperature tests of the device, and the test results will show quality risks such as poor device connectivity and abnormal power supply current. Summary of the invention

[0006] The technical problem solved by the present invention is: in view of the problem that quality risks are easily generated during high and low temperature tests of devices in the current prior art, a fully enclosed packaged integrated circuit temperature testing insulation device and a testing method are proposed.

[0007] The present invention solves the above technical problems by the following technical solutions:

[0008] A fully enclosed packaged integrated circuit temperature test insulation device comprises an insulation base and a fully enclosed metal cover, the insulation base comprises an upper base and a lower base, a raised portion is arranged in the middle position of the lower base, a fixing hole is arranged on the outer frame of the raised portion, an independent spring pin is arranged in the middle position of the upper base facing the lower base, the raised portion of the lower base fixes the independent spring pin of the upper base through the fixing hole, and is used to connect the pins of the device to be tested and realize the stable connection between the upper base and the lower base; mounting holes are arranged at the four corners of the outer sides of the upper base and the lower base, a positioning hole is arranged in the middle position of the left and right edges of the upper base, and an inner concave strip is arranged in the middle position of the upper and lower mounting surfaces of the upper base; the fully enclosed metal cover is fastened to the upper base through the inner concave strip, and is connected to the outer side of the insulation base through the mounting hole, and the connection is strengthened through the positioning hole.

[0009] The independent spring pins are Pogo-Pin type independent spring pins, and the number of which is set to match the fixing holes set on the outer frame of the raised part; the positions of the mounting holes set at the four corners of the upper base and the lower base are symmetrically arranged with respect to the center of the insulation base.

[0010] Pin pressing strips are arranged on both sides of the outer edge of the fully enclosed metal cover, and the fully enclosed metal cover is fixedly connected to the heat preservation base through the pin pressing strips and the mounting holes.

[0011] The fully enclosed metal cover comprises an upper metal cover and a lower metal cover;

[0012] The upper metal cover and the lower metal cover are placed in the positioning holes at the corresponding positions of the lower metal cover through the iron columns on the left and right sides of the upper metal cover. The hook-type fixing handles on the front and rear sides of the upper metal cover are fastened with the concave strips at the corresponding positions of the lower metal cover for fixed connection. Mounting columns are arranged on the insulation base. The upper and lower bottom parts of the lower metal cover are provided with hook-type fixing handles through the mounting columns. The concave strips at the corresponding positions of the lower metal cover are fastened with the hook-type fixing handles. Springs are respectively arranged in the left and right middle parts of the upper parts of the hook-type fixing handles for controlling the opening and closing states of the upper base and the upper metal cover.

[0013] Rotating bodies are arranged on both sides of the upper metal cover, and rotating body mounting holes are evenly distributed in the middle of the upper metal cover for realizing the installation of the rotating body. Raised rotating vertical blocks are arranged on the left and right ends of the outer side of the upper metal cover for realizing the opening and closing state actions of the upper base and the upper metal cover.

[0014] A first position mark is set on each connection position between the insulation base and the fully enclosed metal cover to define the first position of the base and the metal cover. During installation, the upper and lower positions correspond one to one. After the installation is completed, the installation result of the insulation device can be judged by checking whether the first position mark corresponds.

[0015] The fully enclosed metal cover is provided with a rotation opening and closing indication mark, and the rotating vertical block realizes the opening and closing state of the fully enclosed metal cover device pin pressing frame and the insulation base by controlling the rotation according to the rotation direction indicated by the rotation opening and closing indication mark.

[0016] The number of the fixing holes for fixing the independent spring pins is the same as the number of the mounting holes arranged at the four corners of the outer side of the heat preservation base.

[0017] The number of the rotating body installation holes is set according to the installation position relationship between the rotating body and the rotating vertical block or the size of the rotating body and the firmness of the rotating process after installation.

[0018] A testing method implemented according to a testing heat preservation device comprises:

[0019] According to the first position mark, the fully enclosed metal cover is matched with the first position of the insulation base one by one, the insulation base is stably placed and fixedly connected through the outer frame of the raised part of the lower base, and the pins of the device under test are set one by one with the independent spring pins;

[0020] According to the rotating opening and closing indication mark, open the hook-type fixing handle and rotate it, align the lower base with the positioning holes in the middle of the left and right sides of the upper base, place it firmly and securely;

[0021] According to the rotation opening and closing indication mark next to the rotating body set in the middle of the upper metal cover, the rotating vertical blocks set on both sides of the upper metal cover are rotated to achieve the tightening, closing and loosening state of the fully enclosed metal cover device pin pressing frame and the pin of the device under test.

[0022] The advantages of the present invention compared with the prior art are:

[0023] (1) The present invention provides a fully enclosed packaged integrated circuit temperature test insulation device and test method, which adopts a fully enclosed package form, has a stable overall structural design, is quick and convenient to install, has strong low-temperature insulation, excellent high-temperature temperature lock performance, and higher detection efficiency. The upper part of the device adopts a fully enclosed metal cover, which can further insulate and lock the temperature while isolating the air. During the installation process, the upper and lower handles on the fully enclosed metal cover can be pressed tightly with one hand, the fully enclosed metal cover is fastened to the base, and the rotating vertical block is tightened, which is easy to install;

[0024] (2) The base of the present invention is 1 cm thick and the metal cover is 2.5 cm high. The base and the metal cover are combined into a fully enclosed space, which isolates the air and is not easy to frost. It can play a strong low-temperature heat preservation role. At the same time, the base and the metal cover are combined into a fully enclosed space, which can maintain the temperature in a stable state. The fully enclosed device solves the previous problems of "high temperature runaway" and "low temperature frost", and avoids repetitive operations during the test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The structural diagram of the high and low temperature test insulation device for SOP28 packaged integrated circuit provided by the invention;

[0026] Figure 2 A schematic diagram of the internal structure of the test insulation device provided for the invention;

[0027] Figure 3 A side view of the structure of the test insulation device provided for the invention;

[0028] Figure 4 A schematic diagram of parameter information of each part of the heat preservation device provided for the invention. DETAILED DESCRIPTION

[0029] A fully enclosed packaged integrated circuit temperature test insulation device and test method, comprising a test insulation base and a fully enclosed metal cover. The upper part adopts a fully enclosed metal cover, which can further insulate and lock the temperature while isolating the air. At the same time, an assembly structure of an upper and lower base is provided. The base and the metal cover are combined into a fully enclosed space, which can maintain the temperature in a stable state and solve the problems of "high temperature runaway" and "low temperature frosting" during the temperature measurement of the device to be tested, thereby avoiding repetitive operations during the test.

[0030] The following is further described in conjunction with the accompanying drawings and preferred embodiments of the specification:

[0031] In the current embodiment, the structure of the fully enclosed SOP28 packaged integrated circuit high and low temperature test insulation device is as follows: Figure 1 As shown, it is mainly composed of a base, a fully enclosed metal cover 2, a first position mark and a rotating opening and closing indication mark.

[0032] The base is divided into an upper base 1-1 and a lower base 1-2. The lower base 1-2 has a raised outer frame with a concave interior. A Pogo-Pin type independent spring pin 3 is installed in the middle of the upper and lower bases 1-2. The upper base 1-1 is inserted into the lower base 1-2 through the raised portion of the lower base 1-2, and 28 Pogo-Pin type independent spring pins 3 of the device are fixed through 4 fixing holes on the raised outer frame of the lower base 1-2. There are 4 corresponding installation position holes at the four outer corners of the upper and lower bases 1-2. There is a positioning hole for the upper fully enclosed metal cover 2 in the middle of the left and right sides of the upper base 1-1, and an inner concave strip for the combined installation of the upper fully enclosed metal thick cover is left in the middle of the upper and lower tops of the upper base 1-1. The device pins on the two sides of the bottom of the fully enclosed metal cover 2 are pressed to fix the strip frame, and the strip frame and the lower part of the metal cover are fixed through the four corner mounting holes and the middle mounting columns on the left and right sides. The upper and lower bottoms of the lower part of the metal cover are combined to install the barb-type fixed handle 6 through the iron column combination. The opening and closing states of the base and the upper fully enclosed metal cover 2 can be controlled by the upper spring. A rotating body is provided in the middle of the upper part of the metal cover, and 4 corresponding mounting position holes 4 of the rotating body are evenly distributed in the middle of the upper cover. Raised rotating vertical blocks 5 are provided on the left and right sides of the upper cover. The overall structure of each component is as follows Figure 1 shown.

[0033] The upper metal cover and the lower metal cover are placed into the positioning holes at the corresponding positions of the lower metal cover through the iron columns on the left and right sides of the upper metal cover, and then the barb-shaped fixed handles 6 on the front and rear sides of the upper metal cover are buckled to tighten the concave strips at the corresponding positions of the lower metal cover for fixed connection. The heat preservation base 1 is provided with mounting columns, and the upper and lower bottoms of the lower metal cover are provided with barb-shaped fixed handles 6 through the mounting columns. The barb-shaped fixed handles 6 are buckled to tighten the concave strips at the corresponding positions of the lower metal cover. The upper left and right middle parts of the barb-shaped fixed handles 6 are respectively provided with springs for controlling the opening and closing states of the upper base 1-1 and the upper metal cover. The left and right ends of the outer side of the upper metal cover are provided with raised rotating vertical blocks 5 for the opening and closing states of the upper base 1-1 and the upper metal cover.

[0034] The side view of the fully enclosed SOP28 packaged integrated circuit high and low temperature test insulation device structure is as follows Figure 2 The height measurement diagram is shown in Figure 3 As shown; the functions of each part of the insulation device are described as follows:

[0035] Base: A Pogo-Pin type independent spring pin 3 is installed in the middle of the upper and lower bases 1-2. The upper base 1-1 is inserted into the lower base 1-2 through the raised part of the lower base 1-2, and the 28 Pogo-Pin type independent spring pins 3 of the device are fixed through the 4 fixing holes on the raised outer frame of the lower base 1-2. There are 4 corresponding installation position holes at the four corners of the upper and lower bases 1-2. There is a positioning hole for the fully enclosed metal cover 2 in the middle of the left and right sides of the upper base 1-1. An inner concave strip for the combined installation of the upper fully enclosed metal thick cover is left in the middle of the upper and lower tops of the upper base 1-1;

[0036] Fully enclosed metal cover 2: The device pins on the two sides of the fully enclosed metal cover 2 are pressed to fix the strip frame, and the strip frame and the lower part of the metal cover are fixed through the four corner mounting holes and the middle mounting columns on the left and right sides. The upper and lower bottoms of the lower part of the metal cover are combined to install the barb-type fixed handle 6 through the iron column combination. The opening and closing states of the base and the upper fully enclosed metal cover 2 can be controlled by the upper spring. Rotating bodies are provided on both sides of the upper cover of the metal cover, and 4 corresponding mounting position holes 4 of the rotating bodies are evenly distributed in the middle of the upper cover. Raised rotating vertical blocks 5 are provided on the left and right sides of the upper cover;

[0037] First position mark: used to define the first position of the base and the metal cover. The upper and lower positions correspond to each other during installation, which is convenient for checking the first position of the device after installation.

[0038] Rotation opening and closing indicator: Rotate in the direction of the arrow to realize the fully enclosed metal cover 2 device pin pressing frame and the device pins to close and release the state.

[0039] The temperature measurement method of the temperature measuring device is as follows: Figure 2 As shown, firstly, the first position of the device is aligned with the first position of the lower base 1-2 of the device, and then the device is stably placed on the concave part inside the raised outer frame of the lower base 1-2 of the device, so that the device pins correspond to the Pogo-Pin type independent spring pins 3 one by one;

[0040] Pinch it with your hands in the direction indicated by the left and right arrows in the figure, open the hook-shaped fixed handle 6, and then place it vertically downward as indicated by the downward arrow, align it with the positioning holes in the middle of the left and right sides of the upper base 1-1, and release your hands after it is placed steadily;

[0041] According to the rotation opening and closing indication mark beside the middle rotating body of the metal cover upper cover, rotate the vertical rotating blocks on both sides of the metal cover upper cover to realize the pressing and loosening state of the device pin pressing frame of the fully enclosed metal cover 2 and the device pin.

[0042] In the device design of this embodiment, the upper part of the device adopts a fully enclosed metal cover 2, which can further keep the temperature while isolating the air, and is quick and convenient to install. By pressing the upper and lower handles on the fully enclosed metal cover 2 with one hand, the fully enclosed metal cover 2 is fastened to the base, and the rotating vertical block 5 is tightened;

[0043] Among them, the schematic diagram of the size of the fully enclosed metal cover is as follows Figure 4 (a) shows the upper base dimensions. Figure 4 (b) shows the dimensions of the lower base. Figure 4 (c)

[0044] The device of this embodiment has strong low-temperature heat preservation performance, because the base is 1 cm thick, the metal cover is 2.5 cm high, and the base and the metal cover are combined into a fully enclosed space, which isolates the air and is not easy to frost, and can play a strong low-temperature heat preservation performance; high-temperature heat locking performance is excellent, and the base and the metal cover are combined into a fully enclosed space, which can keep the temperature in a stable state;

[0045] With the detection method proposed in the current embodiment, the fully enclosed device solves the previous problems of "high temperature runaway" and "low temperature frosting", and avoids repetitive operations during the test process.

[0046] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

[0047] The contents not described in detail in the specification of the present invention belong to the common knowledge of those skilled in the art.

Claims

1. A fully enclosed packaged integrated circuit temperature test insulation device, characterized in that: It includes a heat-insulating base and a fully enclosed metal cover. The heat-insulating base includes an upper base and a lower base. A raised part is arranged in the middle of the lower base. A fixing hole is arranged on the outer frame of the raised part. An independent spring pin is arranged in the middle of the side of the upper base facing the lower base. The raised part of the lower base fixes the independent spring pin of the upper base through the fixing hole, which is used to connect the pins of the device to be tested and realize the stable connection between the upper base and the lower base. Mounting holes are arranged at the four corners of the outer sides of the upper base and the lower base, positioning holes are arranged in the middle of the left and right edges of the upper base, and an inner concave strip is arranged in the middle of the upper and lower mounting surfaces of the upper base. The fully enclosed metal cover is fastened to the upper base through the inner concave strip, and is connected to the outer side of the heat-insulating base through the mounting hole, and the connection is strengthened through the positioning hole.

2. A fully enclosed packaged integrated circuit temperature test and insulation device according to claim 1, characterized in that: The independent spring pins are Pogo-Pin type independent spring pins, and the number of which is set to match the fixing holes set on the outer frame of the raised part; the positions of the mounting holes set at the four corners of the upper base and the lower base are symmetrically arranged with respect to the center of the insulation base.

3. A fully enclosed packaged integrated circuit temperature test and insulation device according to claim 1, characterized in that: Pin pressing strips are arranged on both sides of the outer edge of the fully enclosed metal cover, and the fully enclosed metal cover is fixedly connected to the heat preservation base through the pin pressing strips and the mounting holes.

4. A fully enclosed packaged integrated circuit temperature test and insulation device according to claim 1, characterized in that: The fully enclosed metal cover comprises an upper metal cover and a lower metal cover; The upper metal cover and the lower metal cover are placed in the positioning holes at the corresponding positions of the lower metal cover through the iron columns on the left and right sides of the upper metal cover. The hook-type fixing handles on the front and rear sides of the upper metal cover are fastened with the concave strips at the corresponding positions of the lower metal cover for fixed connection. Mounting columns are arranged on the insulation base. The upper and lower bottom parts of the lower metal cover are provided with hook-type fixing handles through the mounting columns. The concave strips at the corresponding positions of the lower metal cover are fastened with the hook-type fixing handles. Springs are respectively arranged in the left and right middle parts of the upper parts of the hook-type fixing handles for controlling the opening and closing states of the upper base and the upper metal cover.

5. A fully enclosed packaged integrated circuit temperature test and insulation device according to claim 1, characterized in that: Rotating bodies are arranged on both sides of the upper metal cover, and rotating body mounting holes are evenly distributed in the middle of the upper metal cover for realizing the installation of the rotating body. Raised rotating vertical blocks are arranged on the left and right ends of the outer side of the upper metal cover for realizing the opening and closing state actions of the upper base and the upper metal cover.

6. A fully enclosed packaged integrated circuit temperature test and insulation device according to claim 1, characterized in that: A first position mark is set on each connection position between the insulation base and the fully enclosed metal cover to define the first position of the base and the metal cover. During installation, the upper and lower positions correspond one to one. After the installation is completed, the installation result of the insulation device can be judged by checking whether the first position mark corresponds.

7. A fully enclosed packaged integrated circuit temperature test and insulation device according to claim 3, characterized in that: The fully enclosed metal cover is provided with a rotation opening and closing indication mark, and the rotating vertical block realizes the opening and closing state of the fully enclosed metal cover device pin pressing frame and the insulation base by controlling the rotation according to the rotation direction indicated by the rotation opening and closing indication mark.

8. A temperature test and insulation device for a fully enclosed packaged integrated circuit according to claim 2, characterized in that: The number of the fixing holes for fixing the independent spring pins is the same as the number of the mounting holes arranged at the four corners of the outer side of the heat preservation base.

9. The fully enclosed packaged integrated circuit temperature test and insulation device according to claim 5, characterized in that: The number of the rotating body installation holes is set according to the installation position relationship between the rotating body and the rotating vertical block or the size of the rotating body and the firmness of the rotating process after installation.

10. A testing method implemented by the testing heat preservation device according to claim 1, characterized in that include: According to the first position mark, the fully enclosed metal cover is matched with the first position of the insulation base one by one, the insulation base is stably placed and fixedly connected through the outer frame of the raised part of the lower base, and the pins of the device under test are set one by one with the independent spring pins; According to the rotating opening and closing indication mark, open the hook-type fixing handle and rotate it, align the lower base with the positioning holes in the middle of the left and right sides of the upper base, place it firmly and securely; According to the rotation opening and closing indication mark next to the rotating body set in the middle of the upper metal cover, the rotating vertical blocks set on both sides of the upper metal cover are rotated to achieve the tightening, closing and loosening state of the fully enclosed metal cover device pin pressing frame and the pin of the device under test.

Images