Tin-plated copper alloy wire production management and control method, system and equipment

Abstract

The invention is suitable for the technical field of tinned copper alloy wires, and particularly relates to a tinned copper alloy wire production management and control method, system and equipment, and the method comprises the steps: obtaining to-be-processed order information in a virtual tinning system and an order system; x tinned copper alloy wire models are obtained; wherein the tinned copper alloy wire model is obtained after simulation production is carried out through a virtual tinning system according to production parameters indicated by the order information to be processed, and X is a positive integer larger than or equal to 3; analyzing the X tinned copper alloy wire models to obtain extraction and examination scheme information; the X tinned copper alloy wire models are detected according to the extraction and examination scheme information, and then production control information is determined; according to the tinned copper alloy wire production management and control method provided by the invention, detection modes can be diversified, detected abnormal conditions can be adjusted and modified, detection of the tinned copper alloy wire and treatment after detection reach expected targets, and the production efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of tinned copper alloy wires, and in particular, relates to a production control method, system and equipment for tinned copper alloy wires. Background Art

[0002] Tinned copper alloy wire is a wire material with tin plated on the surface of copper or copper alloy wire. Tinned copper alloy wire combines the excellent conductivity of copper and the corrosion resistance of tin, and is mainly used in the electronic and electrical industry, the automotive industry, and the communications industry.

[0003] In the related art, in the tinning process of copper alloy wires, most of the time, after all the copper alloy wires are tinned, technicians or machines will perform simple inspections. The inspection method is single and it is impossible to adjust and modify the abnormal conditions detected. Therefore, the inspection of tinned copper alloy wires and the post-inspection treatment are difficult to achieve the expected goals, affecting production efficiency. Summary of the invention

[0004] The embodiments of the present application provide a tin-plated copper alloy wire production control method, system and equipment, which can solve the problem that the detection and post-detection processing of tin-plated copper alloy wire are difficult to achieve the expected goals due to the single detection method and the inability to adjust to abnormal situations.

[0005] In a first aspect, an embodiment of the present application provides a tinned copper alloy wire production control method, comprising:

[0006] Obtaining pending order information in the virtual tinning system and the order system; wherein the pending order information is used to indicate production parameters of the tinned copper alloy wire to be processed;

[0007] Obtain X tinned copper alloy wire models; wherein the tinned copper alloy wire models are obtained by simulating production by the virtual tinning system according to the production parameters indicated by the to-be-processed order information, and X is a positive integer greater than or equal to 3;

[0008] Analyze the X tin-plated copper alloy wire models to obtain sampling plan information; wherein the sampling plan information is used to indicate a sampling inspection plan formulated for the tin-plating conditions of the X tin-plated copper alloy wire models;

[0009] After testing X tin-plated copper alloy wire models according to the sampling plan information, production control information is determined; wherein the production control information is used to control the tin-plated copper alloy wire production equipment.

[0010] The tinned copper alloy wire production control method provided by the present application obtains the pending order information in the virtual tinning system and the order system, and can obtain the pending order information in the virtual tinning system and the order system in real time, which can reduce production delays caused by information lags, and can also help optimize inventory management; obtain X tinned copper alloy wire models, the production process can be simulated and optimized, so as to improve product quality, these models are generated based on actual production parameters, and can truly reflect various situations in the production process. By analyzing these models, potential problems can be discovered in advance and improved, and similar problems in actual production can be minimized; the X tinned copper alloy wire models are analyzed to obtain the sampling plan information, which can make the sampling test representative, thereby improving the accuracy and reliability of the test results. Through the random inspection plan information, the key links in the production process can be monitored, and problems in production can be discovered and solved; after the X tin-plated copper alloy wire models are tested according to the random inspection plan information, the production control information can be determined, and the quality control situation in the production process can be accurately evaluated. The test results can be used as the basis for production control information. The detection methods are diversified, and the detected abnormal situations can be adjusted and modified. The detection of tin-plated copper alloy wires and the post-detection treatment can achieve the expected goals and improve production efficiency.

[0011] In a possible implementation manner of the first aspect, analyzing the X tinned copper alloy wire models to obtain the random review plan information includes:

[0012] Acquire X tin-plated images corresponding to the X tin-plated copper alloy wire models;

[0013] Performing image analysis on the X tin-plating images to obtain tin-plating abnormality information; wherein the tin-plating abnormality information is used to indicate the number of copper alloy wires with tin-plating defects;

[0014] Formulate sampling plan information based on the tin plating abnormality information.

[0015] In a possible implementation manner of the first aspect, performing image analysis on the X tinning images to obtain tinning abnormality information includes:

[0016] Performing image analysis on the X tin-plated images to obtain reference image information; wherein the reference image information is used to reflect the tin-plated image that best meets the tin-plating quality requirements among the X tin-plated images relative to the other tin-plated images;

[0017] Acquire first comparison position information in the reference image information; wherein the first comparison position information is used to reflect the key tinning position local image in the reference image information, and the number of the key tinning position local images is at least three;

[0018] Acquire second comparison position information corresponding to each of the remaining tin-plated images other than the reference image information; wherein the second comparison position information is used to reflect each key tin-plated position local image in the remaining tin-plated images other than the reference image information in the X tin-plated images, and the number of the key tin-plated position local images is at least three;

[0019] The tin plating abnormality information is determined according to the first comparison position information and each of the second comparison position information.

[0020] In a possible implementation manner of the first aspect, determining the tin plating abnormality information according to the first comparison position information and each of the second comparison position information includes:

[0021] The at least three key tinning position local images indicated by the first comparison position information are weighted according to a preset weight rate, and the at least three key tinning position local images indicated by the second comparison position information are weighted according to a preset weight value;

[0022] After the weight allocation is completed, a difference comparison is performed one-to-one between each local image of the key tinning position indicated by the first comparison position information and each local image of the key tinning position indicated by the second comparison position information;

[0023] After the difference comparison is completed, the problem analysis is performed on the tinned copper alloy wire model corresponding to the reference image information and all other remaining tinned copper alloy wire models to obtain basic problem information; wherein the basic problem information is used to reflect the thickness of the tinned layer on the tinned copper alloy wire model;

[0024] On the basis of the basic problem information, each key tinning position local image indicated by the second comparison position that does not match each key tinning position local image indicated by the first comparison position information is determined as each tinning problem information; wherein the tinning problem information is used to indicate a copper alloy wire with a tinning defect;

[0025] The tin plating problem information is accumulated respectively to obtain the tin plating abnormality information.

[0026] In a possible implementation manner of the first aspect, performing image analysis on the X tin-plated images to obtain reference image information includes:

[0027] Acquire historical image information and preset difference information based on the to-be-processed order information; wherein the historical image information is used to indicate images that meet order requirements in historical production, and the preset difference information is used to indicate an allowable difference between the tin-plated image and the historical image information;

[0028] Compare the X tin-plated images with the historical image information respectively to obtain a plurality of first comparison information; wherein the first comparison information is used to indicate the difference between the tin-plated image and the historical image information;

[0029] If the difference indicated by the first comparison information is within the allowable difference range of the preset difference information, scoring the plurality of first comparison information to obtain a plurality of comparison result information; wherein the comparison result information is used to indicate the score value obtained after scoring;

[0030] The comparison result information with the highest score among the plurality of comparison result information is determined as the reference image information.

[0031] In a possible implementation manner of the first aspect, the method further includes:

[0032] If the difference indicated by the first comparison information is not within the allowable difference range of the preset difference information, error information is obtained; wherein the error information is used to indicate the error value between the tinning image and the historical image information and possible abnormality of the tinning device;

[0033] The tin plating device is subjected to abnormality detection based on the error information.

[0034] In a possible implementation manner of the first aspect, after the difference comparison is completed, problem analysis is performed on the tinned copper alloy wire model corresponding to the reference image information and all other remaining tinned copper alloy wire models to obtain basic problem information, including:

[0035] After the difference comparison is completed, the image of the tinned copper alloy wire model corresponding to the reference image information is acquired again to obtain reference segmentation information; wherein the reference segmentation information is used to indicate a cross-sectional image of the tinned copper alloy wire model displayed after the tinned copper alloy wire model is segmented;

[0036] Capturing images of all the remaining tin-plated copper alloy wire models again to obtain a plurality of segmented image information; wherein the segmented image information is used to indicate the cross-sectional image of the tin-plated copper alloy wire model displayed after the remaining tin-plated copper alloy wire model is segmented;

[0037] Determine the tinning layer requirements according to the pending order information, and respectively determine the first tinning information on the reference cutting information and the plurality of second tinning information on the plurality of cutting image information; wherein the first tinning information is used to indicate the thickness value of the tinning layer on the cross-sectional image indicated by the reference cutting information, and the second tinning information is used to indicate the thickness value of the tinning layer on the cross-sectional image indicated by the cutting image information;

[0038] The first tin plating information and a plurality of the second tin plating information are compared in thickness value to obtain basic tin plating problem information.

[0039] In a possible implementation manner of the first aspect, comparing the thickness values ​​of the first tinning information and the plurality of second tinning information to obtain basic tinning problem information includes:

[0040] Convert the thickness value indicated by the first tin plating information into a standard value; wherein the standard value conversion is used to indicate that the thickness value is converted into a standard value 1 according to a conversion rule;

[0041] comparing the thickness values ​​indicated by the second tin plating information with the thickness values ​​indicated by the first tin plating information respectively;

[0042] If the thickness value indicated by the second tin plating information is less than the thickness value indicated by the first tin plating information, converting the thickness value indicated by the second tin plating information into a first standard value in a first conversion manner, wherein the first standard value is less than 1;

[0043] If the thickness value indicated by the second tin plating information is greater than the thickness value indicated by the first tin plating information, converting the thickness value indicated by the second tin plating information into a second standard value in a second conversion manner, wherein the second standard value is greater than 1;

[0044] The standard value converted from the thickness value indicated by the first tin plating information and the standard value converted from the thickness value indicated by the second tin plating information are calculated, and then the calculated result is compared with the preset average value to obtain the basic tin plating problem information.

[0045] In a second aspect, an embodiment of the present application provides a tinned copper alloy wire production control system, comprising:

[0046] A first acquisition unit is used to acquire pending order information in the virtual tinning system and the order system; wherein the pending order information is used to indicate production parameters of the tinned copper alloy wire to be processed;

[0047] A second acquisition unit is used to acquire X tinned copper alloy wire models; wherein the tinned copper alloy wire models are obtained by simulating production by the virtual tinning system according to the production parameters indicated by the to-be-processed order information, and X is a positive integer greater than or equal to 3;

[0048] An analysis unit, used for analyzing the X tin-plated copper alloy wire models to obtain sampling scheme information; wherein the sampling scheme information is used to indicate a sampling inspection scheme formulated for the tin-plating conditions of the X tin-plated copper alloy wire models;

[0049] A result unit is used to determine production control information after testing X tin-plated copper alloy wire models according to the sampling plan information; wherein the production control information is used to control the tin-plated copper alloy wire production equipment.

[0050] In a third aspect, an embodiment of the present application provides a tin-plated copper alloy wire production control device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements a method as described in any one of the first aspects above.

[0051] In a fourth aspect, an embodiment of the present application provides a computer program product. When the computer program product is run on a tin-plated copper alloy wire production control equipment, the tin-plated copper alloy wire production control equipment executes the tin-plated copper alloy wire production control method described in any one of the above-mentioned first aspects.

[0052] It can be understood that the beneficial effects of the second to fourth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0054] Figure 1 It is a schematic diagram of the process of a tinned copper alloy wire production control method provided in one embodiment of the present application;

[0055] Figure 2 It is a schematic diagram of the implementation process of step S300 in the tinned copper alloy wire production control method provided in one embodiment of the present application;

[0056] Figure 3 It is a schematic diagram of the implementation process of step S320 in the tinned copper alloy wire production control method provided in one embodiment of the present application;

[0057] Figure 4 It is a schematic diagram of the implementation process of step S324 in the tinned copper alloy wire production control method provided in one embodiment of the present application;

[0058] Figure 5 It is a schematic diagram of the implementation process of step S321 in the tinned copper alloy wire production control method provided in one embodiment of the present application;

[0059] Figure 6It is a schematic diagram of the implementation process of step S3243 in the tinned copper alloy wire production control method provided in one embodiment of the present application;

[0060] Figure 7 It is a schematic diagram of the implementation process of step S32434 in the tinned copper alloy wire production control method provided in one embodiment of the present application;

[0061] Figure 8 It is a structural schematic diagram of a tinned copper alloy wire production control system provided in an embodiment of the present application;

[0062] Fig. 9 It is a structural schematic diagram of the tinned copper alloy wire production control equipment provided in an embodiment of the present application. DETAILED DESCRIPTION

[0063] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0064] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0065] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0066] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0067] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0068] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0069] Tinned copper alloy wire is a wire material with tin plated on the surface of copper or copper alloy wire. Tinned copper alloy wire combines the excellent conductivity of copper and the corrosion resistance of tin, and is mainly used in the electronic and electrical industry, the automotive industry, and the communications industry.

[0070] In the related art, in the tinning process of copper alloy wires, most of the time, after all the copper alloy wires are tinned, technicians or machines will perform simple inspections. The inspection method is single and it is impossible to adjust and modify the abnormal conditions detected. Therefore, the inspection of tinned copper alloy wires and the post-inspection treatment are difficult to achieve the expected goals, affecting production efficiency.

[0071] To solve the above problems, the embodiments of the present application provide a tin-plated copper alloy wire production control method, system and equipment.

[0072] In this method, the pending order information in the virtual tinning system and the order system is obtained, and the pending order information in the virtual tinning system and the order system can be obtained in real time, which can reduce production delays caused by information lag and help optimize inventory management; X tinned copper alloy wire models are obtained, and the production process can be simulated and optimized to improve product quality. These models are generated based on actual production parameters and can truly reflect various situations in the production process. By analyzing these models, potential problems can be discovered in advance and improved, and similar problems in actual production can be reduced as much as possible; by analyzing the X tinned copper alloy wire models, the sampling plan information can be obtained, which can make the sampling test representative, thereby improving the accuracy and reliability of the test results. Through the random inspection plan information, the key links in the production process can be monitored, and problems in production can be discovered and solved; after the X tin-plated copper alloy wire models are tested according to the random inspection plan information, the production control information can be determined, and the quality control situation in the production process can be accurately evaluated. The test results can be used as the basis for production control information. The detection methods are diversified, and the detected abnormal situations can be adjusted and modified. The detection of tin-plated copper alloy wires and the post-detection treatment can achieve the expected goals and improve production efficiency.

[0073] The tin-plated copper alloy wire production control method provided in the embodiment of the present application can be applied to the tin-plated copper alloy wire production control equipment. At this time, the tin-plated copper alloy wire production control equipment is the executor of the tin-plated copper alloy wire production control method provided in the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of the tin-plated copper alloy wire production control equipment.

[0074] For example, the tinned copper alloy wire production control equipment can be a control platform or control panel in a production workshop, or a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a desktop computer, a smart large screen, etc. The tinned copper alloy wire production control equipment can be connected to the tinned copper alloy wire production equipment in communication to control the tinned copper alloy wire production equipment or receive signals sent by the tinned copper alloy wire production equipment; wherein the tinned copper alloy wire production equipment can be a machine for producing tinned copper alloy wire, and the tinned copper alloy wire production equipment includes a tinning machine, a wire drawing machine, an annealing machine, etc.

[0075] In order to better understand the tin-plated copper alloy wire production control method provided in the embodiment of the present application, the specific implementation process of the tin-plated copper alloy wire production control method provided in the embodiment of the present application is exemplarily introduced below.

[0076] Figure 1 A schematic flow chart of a tinned copper alloy wire production control method provided in an embodiment of the present application is shown, and the tinned copper alloy wire production control method includes:

[0077] S100, obtaining pending order information in the virtual tinning system and the order system; wherein the pending order information is used to indicate production parameters of the tinned copper alloy wire to be processed.

[0078] For example, you can directly query the database. You can directly access the database of the virtual tinning system and the order system by writing SQL query statements. First, determine the table and field in the database that stores the pending order information. For example, suppose there is a table called 'Orders' in the database, which contains fields 'Order ID', 'Product Type', 'ProductionParameters', etc. You can use SQL statements to obtain all pending order information: SQL, SELECT * FROM Orders WHERE Status = 'Pending'; you can also obtain it through the API interface, which can be called programmatically to obtain pending order information. Usually, the API interface provides a specific endpoint for querying pending orders. For example, you can use the following HTTP request: GET / api / orders status = pending.

[0079] S200, obtaining X tin-plated copper alloy wire models; wherein the tin-plated copper alloy wire model is obtained by simulating production by a virtual tin-plating system according to production parameters indicated by the to-be-processed order information, and X is a positive integer greater than or equal to 3.

[0080] Exemplarily, X tin-plated copper alloy wire models may be established by a virtual tin-plating system; the virtual tin-plating system simulates manufacturing through production parameters indicated by the to-be-processed order information, thereby obtaining the tin-plated copper alloy wire model.

[0081] S300, analyzing X tin-plated copper alloy wire models to obtain sampling plan information; wherein the sampling plan information is used to indicate a sampling inspection plan formulated for the tin-plating conditions of the X tin-plated copper alloy wire models.

[0082] For example, X-ray fluorescence spectrometry (XRF) can be used to analyze X tin-plated copper alloy wire models to obtain sampling plan information; X-ray fluorescence spectrometry can be used to make a preliminary assessment of the thickness and composition of the tin-plated layer; X-ray fluorescence spectrometry (XRF) is a non-destructive analysis technology that can quickly provide chemical composition information of the coating. Through X-ray fluorescence spectrometry (XRF) analysis, it can be determined whether the tin content in the tin-plated layer meets the standard requirements, and the uniformity of the coating can be preliminarily judged. The surface morphology of the tin-plated layer is observed in detail using a scanning electron microscope (SEM). SEM can provide high-resolution images, so as to observe whether there are cracks, bubbles or other defects on the surface of the coating, and then generate sampling plan information based on the detected tin-plating defects.

[0083] In one possible implementation, see Figure 2, S300, analyzes X tinned copper alloy wire models and obtains the sampling plan information, including:

[0084] S310, obtaining X tinning images corresponding to the X tinned copper alloy wire models.

[0085] Exemplarily, each tin-plated copper alloy wire model can be photographed using a high-precision imaging device to capture the detailed features of the tin-plated layer, and the acquired tin-plated image can be preprocessed using image processing technology (the preprocessing steps include removing noise, adjusting contrast and brightness, etc., so that the image quality meets the requirements of subsequent analysis), and the preprocessed tin-plated image can be feature extracted using an image analysis algorithm, so that X tin-plated images corresponding to the X tin-plated copper alloy wire models can be obtained.

[0086] S320, performing image analysis on the X tin-plating images to obtain tin-plating abnormality information; wherein the tin-plating abnormality information is used to indicate the number of copper alloy wires with tin-plating defects.

[0087] Exemplarily, an advanced image recognition algorithm can be used to analyze each tinned image frame by frame, identify defects in the tinned layer, such as bubbles, cracks, uneven thickness, etc., and classify and count the identified defects. Defects can be classified according to their type and severity, and the number of copper alloy wires with defects in each tinned copper alloy wire model can be counted. Frame-by-frame analysis can be to scan each image (it can be scanned at a preset moving speed, which can be 1 cm per second, etc., but is not limited to this), detect the actual content in the image (for example, the shadow area, height or size on the image); tinning abnormality information can also be associated with the corresponding tinned copper alloy wire model, so that each model has a complete quality analysis result to obtain tinning abnormality information.

[0088] In one possible implementation, see Figure 3 , S320, performing image analysis on the X tinning images to obtain tinning abnormality information, including:

[0089] S321, performing image analysis on the X tin-plated images to obtain reference image information; wherein the reference image information is used to reflect the tin-plated image that best meets the tin-plated quality requirements among the X tin-plated images relative to the other tin-plated images.

[0090] Exemplarily, all tin-plated images can be preprocessed, key features can be extracted from the preprocessed images, and then the characteristic indicators of each tin-plated image can be calculated and analyzed using image processing methods. By comparing the indicators, a comprehensive score of each image can be obtained, and the tin-plated image with the highest score can be selected as the reference image according to the scoring results. Among them, the preprocessing includes graying, filtering and denoising, contrast enhancement, etc. to improve the image quality and reduce interference factors; the extraction method of key features can be implemented using image processing technologies such as edge detection, texture analysis, and morphological operations. The extracted key features can be the thickness, uniformity, glossiness, number of defects, etc. of the tin-plated layer; the reference image should meet or be close to the quality requirements in terms of thickness, uniformity, glossiness, and number of defects.

[0091] In one possible implementation, see Figure 5 , S321, performing image analysis on the X tinning images to obtain reference image information, including:

[0092] S3211, obtaining historical image information and preset difference information based on the order information to be processed; wherein the historical image information is used to indicate images that meet the order requirements in historical production, and the preset difference information is used to indicate the allowable difference between the tin-plated image and the historical image information.

[0093] For example, historical image information and preset difference information related to the current order can be obtained by querying the historical production database. The historical image information record contains tinned image samples that meet the requirements of specific orders in previous production processes. These historical image samples are analyzed to extract key features, such as tinned layer thickness, uniformity, glossiness, and surface defects, and the key features obtained are used as a benchmark for evaluating whether the current tinned image meets the standard. Then, based on the historical image information, the preset difference that meets the historical standard requirements is determined.

[0094] S3212, respectively compare the X tin-plating images with the historical image information to obtain a plurality of first comparison information; wherein the first comparison information is used to indicate the difference between the tin-plating image and the historical image information.

[0095] Exemplarily, X tin-plated images can be pre-processed for comparison, each tin-plated image can be compared with the historical image information one by one, and the first comparison information between each tin-plated image and the historical image information can be calculated. The purpose of the pre-processing for comparison is to satisfy the image quality, and the processing steps include adjusting the brightness, contrast and color balance of the image to eliminate external factors that may affect the comparison results. In the comparison process, image processing algorithms, such as template matching or feature point matching, can be used to identify the similarities and differences between images; calculating the first comparison information between each tin-plated image and the historical image information can be achieved by calculating the mean square error between the images, the structural similarity index or other appropriate image similarity measurement methods. In addition, the calculated difference values ​​can be summarized to form a difference matrix. By analyzing the difference matrix, it can be identified which tin-plated images have the smallest difference with the historical image information, that is, they are most in line with the historical standards.

[0096] S3213: If the difference indicated by the first comparison information is within the allowable difference range of the preset difference information, score the multiple first comparison information to obtain multiple comparison result information; wherein the comparison result information is used to indicate the score value obtained after scoring.

[0097] Exemplarily, an initial score can be assigned to the first comparison information of each tin-plated image according to the scoring criteria. The initial score can be determined based on the size of the difference value. The smaller the difference, the higher the initial score. In addition, the weighting factor can be added. Based on the weighting factor, the specific features of the tin-plated image, such as the thickness, uniformity, glossiness and surface defects of the tin-plated layer, can be further scored, and the comparison result information can be finally obtained. For example, if the difference value is within the excellent range, the initial score is the highest score; if the difference value is within the unqualified range, the initial score is the lowest score. The definition of the scoring criteria can include different levels, such as excellent, good, qualified and unqualified, and each level corresponds to a specific range of difference values. According to the score adjusted by the weighting factor, the influence of the initial score and the weighting factor is taken into account to obtain a more accurate score value.

[0098] S3214: Determine the comparison result information with the highest score among the multiple comparison result information as the reference image information.

[0099] Exemplarily, the scoring matrix can be sorted so that the final score of each tin-plated image is arranged in order from high to low. Based on the data in the scoring matrix, the tin-plated image with the highest score is selected as a potential reference image, and then the thickness, uniformity, glossiness, surface defects and other characteristics of the tin-plated layer are checked. If all requirements are met, the tin-plated image with the highest score can be determined as the reference image information.

[0100] In a possible implementation, the method further includes:

[0101] S3213A, if the difference indicated by the first comparison information is not within the allowable difference range of the preset difference information, error information is obtained; wherein the error information is used to indicate the error value between the tinning image and the historical image information and possible abnormalities of the tinning device.

[0102] For example, the tinning image and the historical image can be compared in detail. Through image processing technology, the key features of the two images can be extracted and compared pixel by pixel. During the comparison process, the system will calculate the difference value of each pixel point and summarize these difference values ​​to obtain error information. For example, if the difference value indicated by the first comparison information is 5, and the allowable difference range of the preset difference information is 4, it can be considered that the error value between the tinning image and the historical image information is too large, and the control amount parameter of the tinning port of the tinning device may be wrong or the tinning gun muzzle of the tinning device may be damaged, resulting in an abnormality in the tinning device.

[0103] With such a setting, the possible abnormal problems of the tinning device and the parts of the tinning device that may have problems can be understood in detail through error information, thereby reducing waste of time and helping to improve quality.

[0104] S3214A, performs abnormality detection on the tinning device based on error information.

[0105] Exemplarily, after the error information is obtained, the tinning device can be detected for abnormalities. Among them, abnormality detection can be a multi-dimensional analysis of the error information by combining historical data and current tinning process parameters. For example, if the error is mainly concentrated in a specific area of ​​the tinning image, it can be judged that the tinning muzzle is partially damaged or the control parameters are improperly set in this area. At the same time, the operation log of the tinning device can also be checked to see if there are other related abnormal records for comprehensive judgment. Further, if the abnormality is confirmed, the tinning parameters can be adjusted for trial operation to observe whether the error value has improved. If the error value still exceeds the allowable range after adjusting the parameters, a clear abnormality report will be given according to the size of the error value at this time, and the possible causes of the abnormality and the affected components will be pointed out.

[0106] S322, obtaining first comparison position information in the reference image information; wherein the first comparison position information is used to reflect the key tinning position local image in the reference image information, and the number of the key tinning position local images is at least three.

[0107] For example, the key tinning positions in the reference image can be automatically extracted through image recognition technology to identify the most important areas in the tinning process, such as solder joints, edges and seams. The first comparison position information can be obtained by extracting the local images of solder joints, edges and seams; or the first comparison position information can be located using a preset template matching technology. A series of templates can be pre-set in the system, and the templates correspond to the key positions that need special attention in the tinning process. Through template matching, these key positions can be quickly located and the corresponding local images can be extracted. It can also be combined with the operator's experience input to manually select the key tinning positions. In some cases, the operator may have a deeper understanding of the tinning process and can manually select the key positions based on experience. The system can provide an interactive interface that allows the operator to mark the key positions on the reference image and extract the corresponding local images.

[0108] S323, obtaining second comparison position information corresponding to each of the remaining tin-plated images other than the reference image information; wherein the second comparison position information is used to reflect each key tin-plated position local image in the remaining tin-plated images other than the reference image information in the X tin-plated images, and the number of the key tin-plated position local images is at least three.

[0109] For example, the tinned images can be aligned through image registration technology. Since there may be slight displacement or deformation during the tinning process, directly comparing the key tinned positions in different images may lead to errors. Through image registration technology, the system can accurately align each tinned image with the reference image to obtain the second comparison position information. It is also possible to extract the key positions in each tinned image using feature point matching technology. The system can identify the feature points of the key tinned positions in the reference image, and then find the corresponding feature points in the remaining tinned images, and obtain the second comparison position information based on the feature points.

[0110] S324, determining tin plating abnormality information according to the first comparison position information and each second comparison position information.

[0111] For example, image difference analysis technology can be used to compare local images of key tinning positions. By comparing the local images of key tinning positions in the reference image with the corresponding local images in the remaining tinning images pixel by pixel, the differences between the images can be identified. The differences between the images may indicate problems in the tinning process, such as uneven tinning, missed plating, etc., so as to determine whether there is a tinning anomaly. Statistical analysis methods can also be used to analyze the key tinning positions in each tinning image. The system can perform statistical analysis on the local images of key tinning positions in each tinning image, such as calculating the mean value, standard deviation, etc., to determine whether there is a tinning anomaly. By comparing the statistical results in each tinning image with the statistical results in the reference image, the system can identify abnormal conditions.

[0112] In one possible implementation, see Figure 4 S324, determining tinning abnormality information according to the first comparison position information and each second comparison position information, including:

[0113] S3241, weighting the at least three key tinning position local images indicated by the first comparison position information according to a preset weight ratio, and at the same time, weighting the at least three key tinning position local images indicated by each second comparison position information also according to a preset weight value.

[0114] Exemplarily, corresponding weight values ​​or corresponding weight ratios may be obtained or set according to the positions of the three key tinning position local images on the tinned copper alloy wire. For example, the first key tinning position local image among the three key tinning position local images is the center portion of the tinned copper alloy wire, the second key tinning position local image is the edge portion of the tinned copper alloy wire, and the third key tinning position local image is the corner portion of the tinned copper alloy wire. Then, the weights may be allocated based on the center portion being larger than the edge portion and larger than the corner portion, with the center portion having the largest weight, the edge portion having the second largest weight, and the corner portion having the smallest weight, so as to allocate the weight ratios of the three key tinning position local images.

[0115] S3242, when the weight allocation is completed, a difference comparison is performed one-to-one between each key tinning position local image indicated by the first comparison position information and each key tinning position local image indicated by the second comparison position information.

[0116] Exemplarily, a pixel-by-pixel difference calculation is performed on each pair of corresponding local images of key tinning positions. A difference image can be obtained by calculating the difference between the pixel values ​​of the two images at the same position. This difference image reflects the degree of difference between the two images. In order to improve the accuracy of evaluating tinning abnormalities, the difference image can be further processed. For example, a threshold can be set for further processing. Only when the difference exceeds this threshold, the position is considered to be abnormal, which can reduce misjudgment caused by slight measurement errors. The difference images of all corresponding positions can be summarized to calculate a comprehensive difference evaluation value. The difference evaluation value can reflect the abnormality of the entire tinplate. If the comprehensive difference evaluation value exceeds the preset threshold, it is considered that the tinplate is abnormal and further inspection or rework is required.

[0117] S3243, after the difference comparison is completed, the problem analysis is performed on the tin-plated copper alloy wire model corresponding to the reference image information and all other remaining tin-plated copper alloy wire models to obtain basic problem information; wherein the basic problem information is used to reflect the thickness of the tin-plated layer on the tin-plated copper alloy wire model.

[0118] For example, the reference image information can be compared with each remaining tinned copper alloy wire model to determine the consistency of the tinned layer thickness. Through pixel-by-pixel analysis, the difference area of ​​the tinned layer thickness can be identified. Through image processing technology, the difference area of ​​each tinned copper alloy wire model can generate a basic problem information. Image processing technology can be such as edge detection and morphological operations, which can mainly perform further refinement analysis on the difference area, which helps to obtain more accurate basic problem information.

[0119] In one possible implementation, see Figure 6 , S3243, after the difference comparison is completed, the tinned copper alloy wire model corresponding to the reference image information and all other remaining tinned copper alloy wire models are analyzed to obtain basic problem information, including:

[0120] S32431, after the difference comparison is completed, the image of the tin-plated copper alloy wire model corresponding to the reference image information is acquired again to obtain reference cutting information; wherein the reference cutting information is used to indicate the cross-sectional image of the tin-plated copper alloy wire model displayed after the tin-plated copper alloy wire model is cut.

[0121] For example, the tinned copper alloy wire model can be accurately cut by simulating the cutting function. After the cutting is completed, the cross section of the cut tinned copper alloy wire model is determined to obtain a cross-sectional image. It can also be that after the cutting is completed, a high-resolution microscope or scanning electron microscope is used to collect images of the cut surface, and a clear cross-sectional image is obtained by adjusting the focal length and magnification of the microscope. The collected cross-sectional image will be analyzed by image processing software. The software will automatically identify the boundary between the tinned layer and the copper alloy substrate, and calculate the thickness of the tinned layer. The image segmentation technology can be used to separate the image area of ​​the tinned layer from the substrate material, so that the thickness of the tinned layer can be measured more accurately and areas with uneven thickness can be identified.

[0122] S32432, acquiring images of all the remaining tin-plated copper alloy wire models again to obtain a plurality of segmented image information; wherein the segmented image information is used to indicate the cross-sectional image of the tin-plated copper alloy wire model displayed after the remaining tin-plated copper alloy wire model is segmented.

[0123] Exemplarily, after the tin-plated copper alloy wire model corresponding to the reference image is segmented, other tin-plated copper alloy wire models that do not belong to the reference image are also segmented, and the segmentation method (the same as the cutting method of S32431) is as follows: one or more tin-plated copper alloy wire models can be accurately segmented by a simulated cutting function, and after the segmentation is completed, the cross section of the segmented tin-plated copper alloy wire model is determined to obtain a cross-sectional image; or after the segmentation is completed, a high-resolution microscope or scanning electron microscope is used to collect images of the segmented surface, and a clear cross-sectional image is obtained by adjusting the focal length and magnification of the microscope; the collected cross-sectional image will be analyzed by image processing software. The software will automatically identify the boundary between the tin-plated layer and the copper alloy substrate, and calculate the thickness of the tin-plated layer. The image segmentation technology can be used to separate the image area of ​​the tin-plated layer and the substrate material, so that the thickness of the tin-plated layer can be measured more accurately and the area with uneven thickness can be identified.

[0124] S32433, determine the tin plating requirements according to the order information to be processed, and respectively determine the first tin plating information on the reference cutting information and the multiple second tin plating information on the multiple cutting image information; wherein the first tin plating information is used to indicate the thickness value of the tin plating on the cross-sectional image indicated by the reference cutting information, and the second tin plating information is used to indicate the thickness value of the tin plating on the cross-sectional image indicated by the cutting image information.

[0125] For example, the cross-sectional image on the reference cut information can be imported into the image processing software, and the software will automatically identify the boundary of the tin-plated layer and calculate the thickness value of the tin-plated layer. This thickness value is the first tin-plated information, which is the reference standard for all subsequent analyses; for each cross-sectional image on the cut image information, the analysis process of the above image processing software is repeated, and the software automatically identifies the boundary of the tin-plated layer on each cross-sectional image and calculates the corresponding tin-plated layer thickness value, which is a plurality of second tin-plated information.

[0126] S32434, compare the thickness values ​​of the first tinning information and the plurality of second tinning information to obtain basic tinning problem information.

[0127] For example, the thickness value of the tinned layer obtained in S32433 may be input into the software system, and the thickness values ​​of the first tinned information and the plurality of second tinned information may be compared, and basic tinned problem information may be obtained after the comparison. The software system may be capable of processing and analyzing a large amount of thickness value data. In the software system, the thickness value of the first tinned information may be recorded and stored, and the thickness values ​​of the plurality of second tinned information may be imported into the system one by one and compared with the first tinned information. During the comparison process, the thickness difference between each second tinned information and the first tinned information may be calculated, and the tinned problem may be judged according to the difference, such as the tinned parameters of the tinned device may be disordered, resulting in unsatisfactory tinned conditions, or the tinned port of the tinned device may be too large, too small, or the tinned port may be blocked, and the basic tinned problem information may be obtained.

[0128] In one possible implementation, see Figure 7 , S32434, compare the thickness values ​​of the first tinning information and the plurality of second tinning information to obtain basic tinning problem information, including:

[0129] S324341, converting the thickness value indicated by the first tinning information into a standard value; wherein the standard value conversion is used to indicate that the thickness value is converted into a standard value 1 according to a conversion rule.

[0130] For example, in the process of standard value conversion, a standard thickness value recognized by an industry or set within the company can be selected as the standard value 1; for example, assuming that the thickness value indicated by the first tinning information is 10, it is set as the standard value 1 by dividing by 10. When the subsequent thickness values ​​are converted, the conversion method is divided by 10 to obtain each standard value or the thickness value 20 indicated by the first tinning information, and 20 is divided by 20 to set it as the standard value 1. When the subsequent thickness values ​​are converted, the conversion method is divided by 20. It can be adjusted according to actual conditions, but is not limited to the above-mentioned limited values.

[0131] In this way, through this standard value conversion method, the thickness values ​​of all tinning information can be compared under the same benchmark, so as to more accurately identify and solve basic tinning problems. This systematic approach helps to improve the stability of the tinning process and the reliability of the coating quality, and ultimately improve the overall quality and production efficiency of the product.

[0132] S324342, compare the thickness values ​​indicated by the plurality of second tin plating information with the thickness values ​​indicated by the first tin plating information respectively.

[0133] For example, the thickness value of the first tinning information can be input into the software as a reference value, and the thickness value data of each second tinning information can be imported one by one. The software system will automatically perform the following steps: compare the thickness value of each second tinning information with the thickness value of the first tinning information, calculate the difference between the two, sort the second tinning information according to the thickness difference value, so as to identify which tinning information has the closest thickness value to the first tinning information and which has a large difference, and by setting a reasonable threshold, the second tinning information with a thickness difference value exceeding the normal range can be identified; it is also possible to directly calculate manually through the obtained thickness value to obtain the comparison result.

[0134] S324343, if the thickness value indicated by the second tin plating information is smaller than the thickness value indicated by the first tin plating information, convert the thickness value indicated by the second tin plating information into a first standard value by a first conversion method, and the first standard value is smaller than 1.

[0135] Exemplarily, a conversion rule can be determined so that the thickness value of the second tin-plating information can be converted to a first standard value less than 1. According to the setting of the proportional factor, the proportional factor can map the thickness value to a specific range. When calculating the proportional factor, the proportional factor is calculated based on the thickness value of the first tin-plating information and the setting of the first standard value. For example, if the thickness value of the first tin-plating information is 12 microns, the thickness value indicated by the second tin-plating information is 6 microns, and the thickness value indicated by the second tin-plating information is less than the thickness value indicated by the first tin-plating information, the thickness value of the first tin-plating information can be 12 microns as 1, and then 11 microns can be converted to the first standard value according to this method, because 12 microns is 1, 8 can be converted to 0.5 which is less than 1; the method for converting 12 microns to 1 is that 12 microns can be divided into 12 parts, and then 1 is divided into 10 parts. Because 12 microns is converted to 1, 12 is equal to 10, so 1 part of 1 is 1.2 parts of 12, so 6 is converted to 0.5; it can also be directly divided by 10, 15, 20 or 30, etc., but not limited to this.

[0136] S324344, if the thickness value indicated by the second tin plating information is greater than the thickness value indicated by the first tin plating information, convert the thickness value indicated by the second tin plating information into a second standard value by a second conversion method, and the second standard value is greater than 1.

[0137] Exemplarily, a conversion rule can be determined so that the thickness value of the second tinning information can be converted to a first standard value greater than 1. According to the setting of the proportional factor, the proportional factor can map the thickness value to a specific range. When calculating the proportional factor, the proportional factor is calculated based on the thickness value of the first tinning information and the setting of the first standard value. For example, if the thickness value of the first tinning information is 12 microns, the thickness value indicated by the second tinning information is 24 microns, and the thickness value indicated by the second tinning information is greater than the thickness value indicated by the first tinning information, the thickness value of the first tinning information can be 12 microns as 1, then the micron is converted to the second standard value according to this method, because 12 microns is 1, 24 can be converted to 2 greater than 1; the method of converting 12 microns to 1 is that 12 microns can be divided into 12 parts, then 1 is divided into 10 parts, because 12 microns is converted to 1, so 12 is equal to 10, so 1 part of 1 is 1.2 parts of 12, so 24 is converted to 2 according to the same method; it can also be directly divided by 5, 10, 20 or 30, etc., but not limited to this.

[0138] S324345, calculate the standard value converted from the thickness value indicated by the first tinning information and the standard value converted from the thickness value indicated by the second tinning information, and then compare the calculated result with the preset average value to obtain basic tinning problem information.

[0139] Exemplarily, according to the conversion rules described above, the thickness values ​​of the first tinning information and the second tinning information are converted into the first standard value and the second standard value respectively, and the first standard value and the second standard value are calculated to obtain a comprehensive comparison result. By finding the average value, difference or ratio, etc.; for example, the average value of two standard values ​​can be calculated, or the difference between them can be calculated, and a preset average value can be set. This preset average value is based on historical data, theoretical calculations or industry standards to evaluate whether the tinning process is stable, and then the calculated result is compared with the preset average value. If the calculated result is close to the preset average value, it indicates that the tinning process is stable and the coating quality is reliable. If the calculated result deviates greatly from the preset average value, it indicates that there may be problems in the tinning process.

[0140] In one feasible manner, in step S324345, the standard value is used for calculation. After the average value is calculated, it can be performed according to the specific method described below. For example, there are three first standard values, namely 0.98, 0.99 and 0.97. Then the first standard value is averaged to obtain an average value of 0.98. Because the standard value is 1, it does not meet the tinning requirements. Then the tinning amount can be adjusted according to the obtained average value. The tinning amount can be set to 0.98, and 0.98 can be converted into tinning equipment parameters corresponding to the tinning parameters and complying with the rules according to the parameter setting rules of the tinning parameters. After the parameters are set, tinning is performed. After the tinning is completed, the next round of operations is performed (the steps are repeated according to the above method, and the specific steps are adjusted according to actual needs. The operation can be started again from S100, or the operation can be performed only for this step, which is not limited here) until there is no tinning abnormality at all.

[0141] S3244, based on the basic problem information, the local images of the key tinning positions indicated by the second comparison position information that do not match the local images of the key tinning positions indicated by the first comparison position information are determined as the tinning problem information; wherein the tinning problem information is used to indicate the copper alloy wire with tinning defects.

[0142] Exemplarily, local images of each key tin-plating position indicated by the first comparison position information can be obtained by using a high-precision image acquisition device. These images will be used as reference images. The local images indicated by the first comparison position information will be compared with the local images indicated by the second comparison position information. The non-matching parts will be identified through image processing techniques, such as edge detection and feature matching. For each non-matching local image, a detailed analysis will be performed to determine whether there are tin-plating defects. The tin-plating defects may include uneven thickness of the tin-plating layer, shedding of the tin-plating layer, rough surface of the tin-plating layer, etc. The identified local images with tin-plating defects are then marked, and their specific positions on the copper alloy wires are recorded.

[0143] S3245, accumulate the tin plating problem information respectively to obtain the tin plating abnormality information.

[0144] Exemplarily, the collected tinning problem information can be sorted according to type and severity. For example, the problem information can be divided into three levels: mild, medium and severe; a table or database software can be used to record and calculate the number of occurrences and cumulative values ​​of each problem information, so that no problem information is missed in the statistical process, so as to obtain accurate tinning abnormality information, and then analyze the distribution of tinning abnormality information based on the cumulative statistical results. For example, the types of problems that occur frequently and the problems with high severity can be found; for example, for the types of problems that occur frequently, the process parameters can be adjusted, the concentration of the tinning solution can be optimized, or the equipment can be repaired, so that the measures can be targeted and operational.

[0145] With this arrangement, through this cumulative statistical and analytical method, it is possible to fully grasp the abnormal conditions in the tinning process, discover and solve problems in the production process, and help improve product quality and production efficiency.

[0146] S330, formulate sampling plan information based on tin plating abnormality information.

[0147] For example, the collected tin plating abnormal information can be analyzed in detail to identify the types of frequently occurring problems, problems with higher severity, and representative abnormal situations. According to the analysis results of the abnormal information, a random inspection plan can be designed to determine the random inspection plan information; the frequency of random inspections, the number of samples for random inspections, and the specific methods of random inspections can be determined. For example, the frequency of random inspections can be increased for frequently occurring problem types, or the number of random inspection samples can be increased for problems with higher severity. Random sampling, stratified sampling, or systematic sampling can be used. Random inspections according to the designed random inspection plan will help improve the standardization and accuracy of the random inspection process and avoid the influence of human factors on the random inspection results. Record key data during the random inspection process.

[0148] In this way, through the formulation and implementation of this random inspection plan based on tinning abnormal information, potential problems in the production process can be effectively discovered and solved, which is conducive to the stability and reliability of product quality. This helps to improve the market competitiveness of enterprises and win the trust and satisfaction of customers.

[0149] S400, after testing X tin-plated copper alloy wire models according to the sampling plan information, determine the production control information; wherein the production control information is used to control the tin-plated copper alloy wire production equipment.

[0150] For example, according to the sampling plan information, the X tinned copper alloy wire models are tested one by one using automated testing equipment, which can quickly and accurately measure the thickness, uniformity and other key quality indicators of the tinned layer, adjust and control the indicators, and determine the final production control information. When collecting test data and performing real-time analysis, the testing equipment transmits the collected data to the central control system, and the system performs real-time analysis to identify any abnormal conditions that deviate from the standard; and generates production control instructions. Based on the real-time analysis results, the system will generate specific production control instructions, which will guide the production equipment to make corresponding adjustments, which will help the production process meet quality standards.

[0151] With this setting, the quality control situation in the production process can be accurately evaluated. The test results can be used as the basis for production control information, the diversification of detection methods can be improved, and the detected abnormal conditions can be adjusted and modified. The detection and post-detection treatment of tin-plated copper alloy wire can achieve the expected goals, which will further improve production efficiency.

[0152] S401, after completing the detection of S400 sampling scheme information, the technicians can analyze the X tinned copper alloy wire models by comparing various parameters and performance indicators. The technicians control the chemical composition of the tinned copper alloy wire so that the tin content is within the specified range to improve the electrical conductivity and oxidation resistance of the wire. At the same time, the purity of the copper alloy is tested to improve the wire's good mechanical properties and corrosion resistance. The technicians test the physical properties of the tinned copper alloy wire and measure key indicators such as tensile strength, elongation and hardness of the wire to improve the reliability and durability of the wire in practical applications; after determining the production control information, the technicians input this information into the tinned copper alloy wire production control system of the production equipment. By real-time monitoring and adjusting the production parameters, the production process of the tinned copper alloy wire can always be in the best state, which not only improves production efficiency, but also reduces the scrap rate and improves the production quality of the tinned copper alloy wire.

[0153] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0154] Corresponding to the tin-plated copper alloy wire production control method described in the above embodiment, the embodiment of the present application also provides a tin-plated copper alloy wire production control system, and each unit of the system can implement each step of the tin-plated copper alloy wire production control method. Figure 8 A structural block diagram of a tinned copper alloy wire production control system provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0155] Reference Figure 8 The tinned copper alloy wire production control system includes:

[0156] A first acquisition unit is used to acquire pending order information in the virtual tinning system and the order system; wherein the pending order information is used to indicate production parameters of the tinned copper alloy wire to be processed;

[0157] A second acquisition unit is used to acquire X tinned copper alloy wire models; wherein the tinned copper alloy wire model is obtained by simulating production by a virtual tinning system according to production parameters indicated by the to-be-processed order information, and X is a positive integer greater than or equal to 3;

[0158] An analysis unit, used for analyzing X tin-plated copper alloy wire models to obtain sampling plan information; wherein the sampling plan information is used to indicate a sampling inspection plan formulated for the tin-plating conditions of the X tin-plated copper alloy wire models;

[0159] The result unit is used to determine the production control information after testing X tin-plated copper alloy wire models according to the sampling plan information; wherein the production control information is used to control the tin-plated copper alloy wire production equipment.

[0160] It should be noted that the information interaction, execution process, etc. between the above-mentioned systems / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0161] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0162] The present application also provides a tinned copper alloy wire production control device, Fig. 9 This is a schematic diagram of the structure of the tinned copper alloy wire production control equipment provided in one embodiment of the present application. Fig. 9As shown, the tinned copper alloy wire production control device 6 of this embodiment includes: at least one processor 60 ( Fig. 9 Only one is shown), at least one memory 61 ( Fig. 9 Only one is shown) and a computer program 62 stored in the at least one memory 61 and executable on the at least one processor 60. When the processor 60 executes the computer program 62, the tinned copper alloy wire production control device 6 implements the steps in any of the above-mentioned tinned copper alloy wire production control method embodiments, or the tinned copper alloy wire production control device 6 implements the functions of each module / unit in the above-mentioned system embodiments.

[0163] Exemplarily, the computer program 62 can be divided into one or more modules / units, which are stored in the memory 61 and executed by the processor 60 to complete the present application. The one or more modules / units can be a series of computer program instruction segments that can complete specific functions, and the instruction segments are used to describe the execution process of the computer program 62 in the tinned copper alloy wire production control device 6.

[0164] The tinned copper alloy wire production control device 6 can be a computing device such as a desktop computer or a notebook. The tinned copper alloy wire production control device can include, but is not limited to, a processor 60 and a memory 61. Those skilled in the art can understand that Fig. 9 It is only an example of the tinned copper alloy wire production control equipment 6 and does not constitute a limitation on the tinned copper alloy wire production control equipment 6. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components, for example, it may also include input and output devices, network access equipment, buses, etc.

[0165] The processor 60 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0166] In some embodiments, the memory 61 may be an internal storage unit of the tinned copper alloy wire production control device 6, such as a hard disk or memory of the tinned copper alloy wire production control device 6. In other embodiments, the memory 61 may also be an external storage device of the tinned copper alloy wire production control device 6, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the tinned copper alloy wire production control device 6. Further, the memory 61 may also include both the internal storage unit and the external storage device of the tinned copper alloy wire production control device 6. The memory 61 is used to store operating systems, applications, boot loaders, data and other programs, such as program codes of computer programs, etc. The memory 61 may also be used to temporarily store data that has been output or is to be output.

[0167] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0168] An embodiment of the present application provides a computer program product. When the computer program product is run on a tinned copper alloy wire production control device, the tinned copper alloy wire production control device implements the steps in any of the above-mentioned method embodiments.

[0169] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the process in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device capable of carrying the computer program code to the tinned copper alloy wire production control equipment, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. For example, U disk, mobile hard disk, disk or optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0170] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0171] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0172] In the embodiments provided in the present application, it should be understood that the disclosed tinned copper alloy wire production control system, equipment and method can be implemented in other ways. For example, the tinned copper alloy wire production control system and equipment embodiments described above are merely schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0173] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0174] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for controlling the production of tinned copper alloy wires, characterized in that: include: Obtaining pending order information in the virtual tinning system and the order system; wherein the pending order information is used to indicate production parameters of the tinned copper alloy wire to be processed; Obtain X tinned copper alloy wire models; wherein the tinned copper alloy wire models are obtained by simulating production by the virtual tinning system according to the production parameters indicated by the to-be-processed order information, and X is a positive integer greater than or equal to 3; Analyze the X tin-plated copper alloy wire models to obtain sampling plan information; wherein the sampling plan information is used to indicate a sampling inspection plan formulated for the tin-plating conditions of the X tin-plated copper alloy wire models; After testing X tin-plated copper alloy wire models according to the sampling plan information, production control information is determined; wherein the production control information is used to control tin-plated copper alloy wire production equipment.

2. The tinned copper alloy wire production control method according to claim 1, characterized in that: The X tinned copper alloy wire models are analyzed to obtain the random inspection plan information, including: Acquire X tin-plated images corresponding to the X tin-plated copper alloy wire models; Performing image analysis on the X tin-plating images to obtain tin-plating abnormality information; wherein the tin-plating abnormality information is used to indicate the number of copper alloy wires with tin-plating defects; Formulate sampling plan information based on the tin plating abnormality information.

3. The tinned copper alloy wire production control method according to claim 2, characterized in that: The performing image analysis on the X tinning images to obtain tinning abnormality information includes: Performing image analysis on the X tin-plated images to obtain reference image information; wherein the reference image information is used to reflect the tin-plated image that best meets the tin-plating quality requirements among the X tin-plated images relative to the other tin-plated images; Acquire first comparison position information in the reference image information; wherein the first comparison position information is used to reflect the key tinning position local image in the reference image information, and the number of the key tinning position local images is at least three; Acquire second comparison position information corresponding to each of the remaining tin-plated images other than the reference image information; wherein the second comparison position information is used to reflect each key tin-plated position local image in the remaining tin-plated images other than the reference image information in the X tin-plated images, and the number of the key tin-plated position local images is at least three; The tin plating abnormality information is determined according to the first comparison position information and each of the second comparison position information.

4. The tinned copper alloy wire production control method according to claim 3, characterized in that: The determining the tinning abnormality information according to the first comparison position information and each of the second comparison position information includes: The at least three key tinning position local images indicated by the first comparison position information are weighted according to a preset weight rate, and the at least three key tinning position local images indicated by the second comparison position information are weighted according to a preset weight value; After the weight allocation is completed, a difference comparison is performed one-to-one between each local image of the key tinning position indicated by the first comparison position information and each local image of the key tinning position indicated by the second comparison position information; After the difference comparison is completed, the problem analysis is performed on the tinned copper alloy wire model corresponding to the reference image information and all other remaining tinned copper alloy wire models to obtain basic problem information; wherein the basic problem information is used to reflect the thickness of the tinned layer on the tinned copper alloy wire model; On the basis of the basic problem information, each key tinning position local image indicated by the second comparison position that does not match each key tinning position local image indicated by the first comparison position information is determined as each tinning problem information; wherein the tinning problem information is used to indicate a copper alloy wire with a tinning defect; The tin plating problem information is accumulated respectively to obtain the tin plating abnormality information.

5. The tin-plated copper alloy wire production control method according to claim 3, characterized in that: The performing image analysis on the X tin-plated images to obtain reference image information includes: Acquire historical image information and preset difference information based on the to-be-processed order information; wherein the historical image information is used to indicate images that meet order requirements in historical production, and the preset difference information is used to indicate an allowable difference between the tin-plated image and the historical image information; Compare the X tin-plated images with the historical image information respectively to obtain a plurality of first comparison information; wherein the first comparison information is used to indicate the difference between the tin-plated image and the historical image information; If the difference indicated by the first comparison information is within the allowable difference range of the preset difference information, scoring the plurality of first comparison information to obtain a plurality of comparison result information; wherein the comparison result information is used to indicate the score value obtained after scoring; The comparison result information with the highest score among the plurality of comparison result information is determined as the reference image information.

6. The tinned copper alloy wire production control method according to claim 5, characterized in that: The method further comprises: If the difference indicated by the first comparison information is not within the allowable difference range of the preset difference information, error information is obtained; wherein the error information is used to indicate the error value between the tinning image and the historical image information and possible abnormality of the tinning device; The tin plating device is subjected to abnormality detection based on the error information.

7. The tinned copper alloy wire production control method according to claim 4, characterized in that: After the difference comparison is completed, the tinned copper alloy wire model corresponding to the reference image information and all other remaining tinned copper alloy wire models are subjected to problem analysis to obtain basic problem information, including: After the difference comparison is completed, the image of the tinned copper alloy wire model corresponding to the reference image information is acquired again to obtain reference segmentation information; wherein the reference segmentation information is used to indicate a cross-sectional image of the tinned copper alloy wire model displayed after the tinned copper alloy wire model is segmented; Capturing images of all the remaining tin-plated copper alloy wire models again to obtain a plurality of segmented image information; wherein the segmented image information is used to indicate the cross-sectional image of the tin-plated copper alloy wire model displayed after the remaining tin-plated copper alloy wire model is segmented; Determine the tinning layer requirements according to the pending order information, and respectively determine the first tinning information on the reference cutting information and the plurality of second tinning information on the plurality of cutting image information; wherein the first tinning information is used to indicate the thickness value of the tinning layer on the cross-sectional image indicated by the reference cutting information, and the second tinning information is used to indicate the thickness value of the tinning layer on the cross-sectional image indicated by the cutting image information; The first tin plating information and a plurality of the second tin plating information are compared in thickness value to obtain basic tin plating problem information.

8. The tinned copper alloy wire production control method according to claim 7, characterized in that: The step of comparing the thickness values ​​of the first tinning information and the plurality of second tinning information to obtain basic tinning problem information includes: Convert the thickness value indicated by the first tin plating information into a standard value; wherein the standard value conversion is used to indicate that the thickness value is converted into a standard value 1 according to a conversion rule; comparing the thickness values ​​indicated by the second tin plating information with the thickness values ​​indicated by the first tin plating information respectively; If the thickness value indicated by the second tin plating information is less than the thickness value indicated by the first tin plating information, converting the thickness value indicated by the second tin plating information into a first standard value in a first conversion manner, wherein the first standard value is less than 1; If the thickness value indicated by the second tin plating information is greater than the thickness value indicated by the first tin plating information, converting the thickness value indicated by the second tin plating information into a second standard value in a second conversion manner, wherein the second standard value is greater than 1; The standard value converted from the thickness value indicated by the first tin plating information and the standard value converted from the thickness value indicated by the second tin plating information are calculated, and then the calculated result is compared with the preset average value to obtain the basic tin plating problem information.

9. A tinned copper alloy wire production control system, characterized in that: include: A first acquisition unit is used to acquire pending order information in the virtual tinning system and the order system; wherein the pending order information is used to indicate production parameters of the tinned copper alloy wire to be processed; A second acquisition unit is used to acquire X tinned copper alloy wire models; wherein the tinned copper alloy wire models are obtained by simulating production by the virtual tinning system according to the production parameters indicated by the to-be-processed order information, and X is a positive integer greater than or equal to 3; An analysis unit, used for analyzing the X tin-plated copper alloy wire models to obtain sampling scheme information; wherein the sampling scheme information is used to indicate a sampling inspection scheme formulated for the tin-plating conditions of the X tin-plated copper alloy wire models; A result unit is used to determine production control information after testing X tin-plated copper alloy wire models according to the sampling plan information; wherein the production control information is used to control the tin-plated copper alloy wire production equipment.

10. A tinned copper alloy wire production control device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the method according to any one of claims 1 to 8 is implemented.

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