Semiconductor device and mounting and dismounting method thereof

Abstract

The invention relates to a semiconductor device and a dismounting method thereof, and the device comprises a transmission unit which comprises a transmission cavity and a first supporting part for supporting the transmission cavity; the at least one process unit is arranged in the circumferential direction of the transmission unit, each process unit comprises a process cavity and a second supporting part for supporting the process cavity, and the process cavity is connected with the side wall of the transmission cavity; and the auxiliary unit comprises a third supporting part, and at least one process unit is accommodated in a space formed by the third supporting part. The process unit, the transmission unit and the auxiliary unit in the semiconductor equipment can be transported independently, so that the equipment is carried more flexibly, and the second supporting part is designed to be detachable so as to adapt to the carrying requirement of the process cavity.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a semiconductor equipment and a disassembly and assembly method thereof. Background Art

[0002] In semiconductor equipment, such as CVD, epitaxy, and etching equipment, the process unit structure is complex and usually consists of multiple subsystems such as control, pipelines, heating, cooling, transmission, and process chambers. Semiconductor equipment itself has strict requirements on equipment space utilization, which requires each subsystem to be reasonably laid out and integrated within a limited space. Similarly, unreasonable allocation and layout will increase the difficulty of equipment installation, lack of maintainability, and even cause unstable system operation.

[0003] Considering transportation safety and convenience, the process unit will be completely disassembled for transportation during the transportation stage, which increases transportation costs and the difficulty of reinstallation.

[0004] Therefore, there is a need to provide a semiconductor device with high integration that is easy to install and transport. Summary of the invention

[0005] In order to solve the problems of semiconductor equipment, especially epitaxial equipment, high transportation cost, low integration, etc., the present invention proposes a semiconductor device that can well solve the above problems.

[0006] The semiconductor device comprises:

[0007] A transmission unit, comprising a transmission cavity and a first supporting portion supporting the transmission cavity;

[0008] At least one process unit is arranged along the circumference of the transmission unit, each process unit comprises a process chamber and a second support portion supporting the process chamber, the process chamber is connected to a side wall of the transmission chamber;

[0009] The auxiliary unit includes a third supporting portion, and a space formed by the third supporting portion accommodates at least one process unit.

[0010] Preferably, the second support portion includes a plurality of support rods, at least some of the support rods of the second support portion can be quickly disassembled, and the second support portion with at least some of the support rods removed and the first support portion form a fourth support portion.

[0011] Preferably, the second supporting portion also includes a base and a fastener for fixing the plurality of support rods; the fastener is connected to the side wall of the process chamber, the plurality of support rods are connected between the base and the fastener, and the support rod close to the transmission unit is a detachable support rod.

[0012] Preferably, the number of the support rods is at least 4, and the number of the detachable support rods is at least 2.

[0013] Preferably, the detachable support rods are connected by pins.

[0014] Preferably, the two ends of the detachable support rod are provided with a first groove or a first protrusion, the side of the first groove or the first protrusion is provided with a hole, the base and the fastener are provided with a second protrusion or a second groove, the side of the second groove or the second protrusion is provided with a hole, and the pin connection is achieved through the cooperation of the first groove and the second protrusion or the first protrusion and the second groove and the hole.

[0015] Preferably, the first groove or the first protrusion extends in a direction from the transmission unit to the process unit.

[0016] Preferably, a moving part is provided at the bottom of the base.

[0017] Preferably, the moving component is a universal wheel.

[0018] Preferably, the process unit further comprises a pipeline assembly, and the pipeline assembly is arranged at the bottom of the process chamber.

[0019] Preferably, the auxiliary unit further includes a cover shell, and a heat exchange system disposed in the cover shell, the third support portion is supported on the bottom of the cover shell, and the heat exchange system is connected to the process unit for cooling the upper portion of the process chamber.

[0020] In addition, the present invention also provides a method for disassembling and assembling a semiconductor device, comprising the following steps:

[0021] During assembly, the process chamber is fixedly connected to the transmission chamber, and then part of the support rods in the second support part are removed so that the remaining support rods and the first support part form a fourth support part;

[0022] During disassembly, the dismantled support rod is connected to the process chamber, and the connection between the process chamber and the transmission chamber is released, so that the second support portion supports the process chamber.

[0023] The present invention has the following beneficial effects:

[0024] The process units, transfer units and auxiliary units in semiconductor equipment can all be transported separately. This modular design makes the equipment more flexible to transport, especially when long-distance transportation is required or in space-constrained environments.

[0025] The second support part of the equipment is designed to be detachable to meet the transportation requirements of the process chamber. During assembly, part of the support rods are removed, and the remaining support rods and the first support part jointly support the process chamber and the transfer chamber. During disassembly, the removed support rods can be reconnected to the process chamber, so that the process unit can be transported separately. Universal wheels are set at the bottom of the base of the process unit to make it easier during transportation.

[0026] A reasonable spatial layout has been carried out to make the spatial structure of the semiconductor equipment more compact. In addition, pipeline components are also provided inside the process unit to facilitate the installation of components such as air pipes and cables, further improving the integration of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic structural diagram of the semiconductor device of the present invention;

[0028] Figure 2 It is a structural schematic diagram of the process unit of the present invention;

[0029] Figure 3 It is a partial enlarged view of the detachable support rod of the unit of the present invention;

[0030] Figure 4 It is a top view of the semiconductor device of the present invention. DETAILED DESCRIPTION

[0031] The semiconductor device and its disassembly and assembly method proposed in the present invention are further described in detail below in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that can be produced by the present invention and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0032] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0033] In the description of the present invention, it should be understood that the terms "center", "height", "thickness", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0034] The semiconductor device provided by the present invention may be, for example, an epitaxial device, a rapid thermal processing device, an etching device, etc. Figure 1As shown, the semiconductor device includes a transmission unit 100, at least one process unit 200 and an auxiliary unit 300, wherein the transmission unit 100 is used to transmit wafers and distribute wafers to each process unit 200, and the process unit 200 is used to perform process treatment on the wafer, such as at least one of epitaxy, rapid thermal processing and etching. The auxiliary unit 300 is mainly used to provide auxiliary functions to the process unit 200, such as heat exchange, water circuit, circuit, gas circuit, radio frequency source, etc. The transmission unit 100 includes a transmission chamber 101 and a first support part supporting the transmission chamber 101, and the process unit 200 includes a process chamber 201 and a second support part supporting the process chamber 201. The wafer located in the transmission chamber 101 can be transported to each process chamber 201 or transported out of each process chamber 201 by a handling tool (such as a robot). The transmission chamber 101 can be configured as a polygonal chamber, such as a quadrilateral, hexagon or octagon. Each side of the polygonal chamber has a side wall. Taking the octagonal chamber as an example, it has eight side walls, and each side wall is provided with a wafer transmission port connected to the process chamber 201. The process unit 200 is arranged around the transmission unit 100, and each side wall can mount a process unit 200. The multiple side walls of the transmission chamber 101 can connect multiple process chambers 201, and each process chamber 201 can be arranged on the side wall of the transmission chamber 101 for easy connection. The auxiliary unit 300 includes a third support part, and the third support part constitutes a frame structure. The space formed in the middle of the frame structure can accommodate a process unit 200. An accessory device and a cover are arranged above the third support portion, and the accessory device is arranged in the cover. The accessory device and the cover are arranged above the process unit 200. The accessory device can be at least one of a heat exchange system, a radio frequency system, an air circuit, an electric circuit or a water circuit. The accessory device and the process unit 200 are distributed in upper and lower layers in the vertical direction. Taking the heat exchange system as an example, the heat exchange system is used to dissipate heat in the area above the process unit 200. The accessory devices arranged vertically can improve the utilization rate of the space.

[0035] Optionally, a plurality of process units 200 are provided, each process unit 200 corresponds to an auxiliary unit 300, a cover 301 is provided above the third support portion of each auxiliary unit 300, the auxiliary device is provided in the cover 301, the third support portion is supported at the bottom of the cover 301, and the auxiliary device is connected to the corresponding process unit 200 to provide corresponding auxiliary functions to the corresponding process chamber 201. Figure 1As shown, the frame structure of the third support part is mainly composed of a plurality of rods 302, and the sides of the bottom of the rods 302 are provided with retractable wheels 303, and the wheels can be raised and lowered. When raised, they are retracted and do not work. When lowered, they can be moved during transportation through the wheels 303. Optionally, the wheels 303 are raised and lowered by threads. Further optionally, the number of the rods 302 is four vertical rods, and the projection of the frame structure formed on the horizontal plane is a trapezoid. Similarly, the first support part is also composed of a plurality of vertical rods 102.

[0036] In order to facilitate the handling of the semiconductor equipment, the transmission unit 100, the process unit 200 and the auxiliary unit 300 of the present invention can be transported separately. Since the transmission unit 100, the process unit 200 and the auxiliary unit 300 are fixed in the corresponding position after assembly and have a large floor space, it is not convenient to transport. In order to overcome the transportation problem, each unit needs to be disassembled and assembled during transportation, especially the process unit 200 is attached to the transmission unit 100 by a sealed connection. If it is transported as a whole, it is necessary to maintain the sealing relationship and position relationship between the two during transportation, which has relatively high transportation requirements. In this case, it is a better transportation solution to disassemble the process unit 200 and the transmission unit 100 and transport them separately, which can reduce the difficulty of transportation. Therefore, the second support part is configured to be disassembled according to the handling requirements of the process chamber 201. The second support part includes a plurality of support rods 202, and at least part of the support rods 202 of the second support part are detachable. Preferably, the detachable connection is a quick detachable connection. These support rods 202 can support the process chamber 201 alone when the process unit is removed from the transmission unit 100. At the same time, when the process unit is installed on the transmission unit 100, at least some of the support rods 202 can be removed, so that the process unit can be supported together with the transmission unit 100 by the remaining support rods 202 that have not been removed. Preferably, for the stability of the support, the support rods 202 can be arranged as 4 vertical rods, and the 4 support rods 202 form a frame structure; wherein 2 support rods 202 are arranged close to the transmission unit 100, and 2 support rods are arranged away from the transmission unit 100; the projection of the frame structure formed by the 4 support rods on the horizontal plane is a trapezoid, and the 2 support rods close to the transmission unit 100 are arranged at the two corners of the upper bottom of the trapezoid, and the 2 support rods away from the transmission unit 100 are arranged at the two corners of the lower bottom of the trapezoid, and the upper bottom of the trapezoid is parallel to the side wall of the transmission unit 100. Further preferably, at least some of the support rods 202 can be removed to be the 2 support rods close to the transmission unit 100.

[0037] Furthermore, the second support part further includes a base 203 and a fastener 204 for fixing the plurality of support rods 202; the fastener 204 is connected to the side wall of the process chamber 201, and the plurality of support rods 202 are connected between the base 203 and the fastener 204. Specifically, the upper end of the support rod 202 is connected to the fastener 204, and the lower end is connected to the base 203. The fastener 204 is an annular hoop, which is tightly clamped on the outside of the process chamber 201, and the surface of the annular hoop is connected to the upper end of the support rod 202.

[0038] Furthermore, if Figure 1-2 As shown, the support rod 202 near the transmission unit 100 is set as a detachable support rod 221. When the process chamber 201 is connected to the transmission chamber 101, the partially detachable support rod 221 of the second support part is removed, that is, the partially detachable support rod 221 near the transmission unit 100 is removed, and then the fourth support part is formed with the first support part, and the fourth support part is used to support the transmission chamber 101 and the process chamber 201. The fourth support part includes the partially undetached support rods 202 of the second support part and all the rods 102 of the first support part. The semiconductor equipment with these detachable support rods 221 removed can make the assembled structure simpler, increase space, and facilitate the arrangement of water, electricity, gas lines and electronic components (such as MFC, etc.).

[0039] like Figure 2 As shown, the detachable support rods 221 in the support rods are all close to one side of the transmission chamber 101. Therefore, the detachable support rods 221 can also be installed back on the annular hoop 204 of the process chamber 201 as part of the second support portion after the process chamber 201 is separated from the transmission chamber 101, so as to support the process chamber 201 during transportation. In order to facilitate disassembly, the detachable connection adopts a quick detachable connection method, such as a pin and hole matching connection.

[0040] Specifically, Figure 2-3 As shown, the two ends of the detachable support rod 221 are provided with a first groove or a first protrusion, and the side of the first groove or the first protrusion is provided with a hole, and the base 203 and the fastener 204 are provided with a second protrusion or a second groove, and the side of the second groove or the second protrusion is provided with a hole, and the pin connection is achieved through the cooperation of the first groove and the second protrusion, or the cooperation of the first protrusion and the second groove, and the hole. Optionally, the two ends of the support rod can be the first groove at the same time, or the first protrusion at the same time, or one end can be the first groove and the other end can be the first protrusion. Similarly, the second protrusion or the second groove on the base 203 and the fastener 204 changes with the setting and cooperation of the two ends of the support rod.

[0041] Preferably, Figure 2-3As shown, the detachable support rod 221 is provided with a first groove 222 at one end (lower end) close to the base 203, and a first protrusion 223 at one end (upper end) close to the fastener. Correspondingly, the base 203 is provided with a second protrusion, and the fastener 204 is provided with a second groove. Further preferably, the pin and the hole are only located at the lower end of the support rod 221, that is, corresponding holes are only provided on the side of the first groove 222 and the second protrusion at the lower end, as shown in FIG. Figure 3 As shown, the pin is inserted into the above-mentioned hole to achieve a quick disassembly connection, and the first protrusion 223 and the second groove at the upper end are not provided with holes and pins, wherein a sealing plate is provided at one end of the length of the second groove extending from the fastener 204 to prevent the first protrusion 223 from slipping off from the second groove, that is, the connection between the first protrusion 223 and the second groove at the upper end is movable, and the connection between the two is achieved by the gravity of the process chamber 201. The advantage is that the fastener 204 of the process chamber 201 is located very high, which is inconvenient for the staff to perform disassembly operations, especially when the process unit 200 is fully hung around the transmission unit 100, there is no space for disassembly operations, but the lower end of the support rod is a position where the staff can easily perform disassembly operations, so the staff only needs to pull the pin at the lower end out of the air, and then pull the support rod outward, and after the lower end is detached, the upper end is automatically detached, which is convenient for disassembly.

[0042] Preferably, the first groove 222 and the first protrusion 223 extend in a direction from the transmission unit 100 to the process unit 200. This has the advantage that it is convenient for the staff to stand outside to perform the disassembly operation. After the pin is pulled out, the support rod can be disassembled by only pulling the support rod toward the process unit 200 from the transmission unit 100.

[0043] Preferably, a movable part 231 is provided at the bottom of the base 203, and the movable part 231 is a universal wheel. This can facilitate the separate transportation of the process unit 200, and can also reinforce the structure composed of the support rods 202 through the base 203. Figure 3 Optionally, the universal wheel is liftable, and does not work when it is raised, supported by the supporting feet, and can roll when it is lowered.

[0044] Preferably, the process unit 200 further includes a pipeline assembly, which is disposed at the bottom of the process chamber 201. It is used to install gas pipes and cables connected from the remote gas and electrical control module to the process chamber. The pipeline assembly and the process chamber 201 are modularly installed and transported, which can improve the integration of the process unit 200.

[0045] In addition, the present invention also provides a method for disassembling and assembling a semiconductor device, comprising:

[0046] During assembly, the process chamber 201 is fixedly connected to the transmission chamber 101, and then part of the support rods (detachable support rods 221) in the second support part are removed, so that the remaining support rods 202 and the first support part form a fourth support part to jointly support the process chamber 201 and the transmission chamber 101; Figure 4 Figure 4 FIG. 1 is a top view of the semiconductor device of the present invention, as shown in FIG. Figure 4 As an example, an epitaxial device is shown, in which the transfer unit 100 is octagonal and has eight side walls, on which different process units 200 are mounted, with 7 process units 200 being mounted.

[0047] During disassembly, the removed support rod 221 is connected to the process chamber 201, and the connection between the process chamber 201 and the transmission chamber 101 is released, so that the second support part supports the process chamber 201 and independently supports the process chamber 201. Optionally, after the removed support rod 221 is connected to the process chamber 201, a pin is inserted into the hole to achieve fixation.

[0048] The process unit, the transmission unit and the auxiliary unit in the semiconductor device of the present invention can be transported separately. This modular design makes the transportation of the equipment more flexible, especially in the case of long-distance transportation or in a space-constrained environment.

[0049] The second support part of the equipment is designed to be detachable, especially quickly removable, to meet the transportation requirements of the process chamber. During assembly, part of the support rods are removed, and the remaining support rods and the first support part jointly support the process chamber and the transfer chamber. After disassembly, the removed support rods can be reconnected to the process chamber, so that the process unit can be transported separately. Universal wheels are provided at the bottom of the base of the process unit to make it easier to transport.

[0050] A reasonable spatial layout has been carried out to make the spatial structure of the semiconductor equipment more compact. In addition, pipeline components are also provided inside the process unit to facilitate the installation of components such as air pipes and cables, further improving the integration of the equipment.

[0051] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A semiconductor device, characterized in that: include: A transmission unit, comprising a transmission cavity and a first supporting portion supporting the transmission cavity; At least one process unit is arranged along the circumference of the transmission unit, each process unit comprises a process chamber and a second support portion supporting the process chamber, the process chamber is connected to a side wall of the transmission chamber; The auxiliary unit includes a third supporting portion, and a space formed by the third supporting portion accommodates at least one process unit.

2. The semiconductor device according to claim 1, wherein: The second support portion includes a plurality of support rods. At least some of the support rods of the second support portion can be quickly disassembled. The second support portion with at least some of the support rods removed and the first support portion form a fourth support portion.

3. The semiconductor device according to claim 2, wherein: The second supporting part also includes a base and a fastener for fixing the plurality of supporting rods; the fastener is connected to the side wall of the process chamber, the plurality of supporting rods are connected between the base and the fastener, and the supporting rod close to the transmission unit is a detachable supporting rod.

4. The semiconductor device according to claim 3, wherein: The number of the support rods is at least 4, and the number of the detachable support rods is at least 2.

5. The semiconductor device according to claim 3, wherein: The detachable support rods are connected by pins.

6. The semiconductor device according to claim 5, wherein: The two ends of the detachable support rod are provided with a first groove or a first protrusion, and the side of the first groove or the first protrusion is provided with a hole. The base and the fastener are both provided with a second protrusion or a second groove, and the side of the second groove or the second protrusion is provided with a hole. The pin connection is achieved through the cooperation of the first groove and the second protrusion or the first protrusion and the second groove and the hole.

7. The semiconductor device according to claim 6, wherein: The first groove or the first protrusion extends in a direction from the transmission unit to the process unit.

8. The semiconductor device according to claim 3, wherein: A moving part is arranged at the bottom of the base.

9. The semiconductor device according to claim 8, wherein: The moving part is a universal wheel.

10. The semiconductor device according to claim 1, wherein: The process unit further comprises a pipeline assembly, and the pipeline assembly is arranged at the bottom of the process chamber.

11. The semiconductor device according to claim 1, wherein The auxiliary unit also includes a cover shell and a heat exchange system disposed in the cover shell. The third support portion is supported on the bottom of the cover shell. The heat exchange system is connected to the process unit and is used to cool the upper part of the process chamber.

12. A method for disassembling and assembling a semiconductor device according to any one of claims 1 to 11, characterized in that: include: During assembly, the process chamber is fixedly connected to the transmission chamber, and then part of the support rods in the second support part are removed so that the remaining support rods and the first support part form a fourth support part; During disassembly, the dismantled support rod is connected to the process chamber, and the connection between the process chamber and the transmission chamber is released, so that the second support portion supports the process chamber.

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