A chip packaging multi-layer stacking equipment

Abstract

The present invention belongs to the technical field of chip stacking equipment, specifically a chip packaging multilayer stacking equipment, including packaging equipment, a workbench is installed in the packaging equipment, and a chip is arranged on the top of the workbench; the packaging equipment is provided with a moving mechanism for driving the soldering flux to move, and a spraying mechanism arranged on the moving mechanism for rapid spraying; the present invention starts the second servo motor in the second movable frame, so that the second servo motor moves the second movable frame longitudinally through the second screw rod. When the horizontal soldering flux is sprayed, the first servo motor is started again, so that the first servo motor moves the first movable frame longitudinally, and then the soldering flux is sprayed longitudinally, and the longitudinal welding is performed using a welding gun.

Description

Technical Field

[0001] The invention belongs to the technical field of chip stacking equipment, in particular to a chip packaging multi-layer stacking equipment. Background Art

[0002] Chip stacking packaging, also known as 3D packaging or stacked packaging, is an advanced integrated circuit packaging technology. This technology stacks multiple chips vertically together to achieve higher integration, performance and smaller footprint. Packaging equipment is often used when stacking chips.

[0003] When the chip packaging equipment is stacking the chips, it is necessary to continuously apply flux on the lower chip so as to weld and package it with the upper chip. After the flux is applied, welding is performed using the welding gun in the chip packaging equipment.

[0004] In order to improve the welding quality, a circle of flux is usually applied around the rectangular chip, and welding is performed after a circle of flux is applied, which results in a long interval between the application of flux and welding. Since the flux is usually in liquid form, after being exposed to the air for a long time, the solvent in the flux will gradually evaporate, resulting in reduced adhesion of the flux, and its welding performance cannot be effectively exerted, resulting in unsatisfactory welding results.

[0005] To this end, the present invention provides a chip packaging multi-layer stacking device. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problems is: a chip packaging multilayer stacking device described in the present invention includes a packaging device, a workbench is installed in the packaging device, and a chip is arranged on the top of the workbench; a moving mechanism for driving the soldering flux to move, and a spray mechanism for quickly spraying is arranged on the moving mechanism in the packaging device; the moving mechanism includes a first servo motor and a boss fixedly installed in the packaging device, a first screw rod is installed between the first servo motor and the boss, a first movable frame is movably connected to the surface of the first screw rod, a second servo motor is fixedly installed in the first movable frame, a second screw rod is fixedly installed at the output end of the second servo motor, a rectangular frame is fixedly installed in the packaging device, and the A slider is slidably connected in the rectangular frame, one end of the second screw rod away from the second servo motor is connected to the slider, and the surface of the second screw rod is movably connected to the second movable frame; the spray mechanism includes a loading box fixedly installed in the second movable frame, a spray pipe connected to the inside of the loading box is fixedly installed at the bottom of the second movable frame, and a welding gun is installed on the loading box through a sliding component; the sliding component includes an arc-shaped limit frame fixedly installed at the bottom of the second movable frame, the bottom of the limit frame is rotatably connected to the welding gun, the surface of the welding gun is wrapped with magnetic material, and an electromagnet is fixedly installed in the rectangular frame; a control mechanism for controlling the amount of flux and a protective mechanism for protecting the first screw rod and the second screw rod are provided in the second movable frame.

[0008] Furthermore, the quantity control mechanism includes an electric push rod fixedly installed in the second movable frame, and a rectangular groove connected to the interior is provided on one side of the spray tube close to the electric push rod. A rectangular plate is arranged in the spray tube, and one side of the rectangular plate is connected to the output end of the electric push rod. A sealing gasket is fixedly installed on the surface of the rectangular plate, and a sealing groove for the sealing gasket to be clamped is provided in the spray tube.

[0009] Furthermore, the protective mechanism includes two first telescopic components and two second telescopic components, one end of the two first telescopic components is fixedly connected to the first movable frame, the ends of the two first telescopic components away from the first movable frame are respectively fixedly connected to the boss and the first servo motor, one end of the two second telescopic components is fixedly connected to the second movable frame, the ends of the two second telescopic components away from the second movable frame are respectively fixedly connected to the slider and the first movable frame, the first telescopic component and the second telescopic component are composed of a number of sealed sliding hollow cylinders; two air outlet pipes are fixedly installed on the bottom of the second movable frame, and the first telescopic component and the second telescopic component are respectively connected to the two air outlet pipes through the air guide pipe.

[0010] Furthermore, a connecting pipe connected to the interior is fixedly installed on the surface of the outlet pipe, a first arc-shaped guide plate is fixedly installed in the outlet pipe, a second arc-shaped guide plate is fixedly installed on the bottom of the first guide plate, and the bottom of the second guide plate is fixedly connected to the inner wall of the outlet pipe.

[0011] Furthermore, one end of the connecting pipe away from the air outlet pipe is rotatably connected to an end cover via a torsion spring, and an arc-shaped limiting rod is fixedly installed on the surface of the connecting pipe.

[0012] Furthermore, the electric push rod and the rectangular plate are installed via a connecting mechanism, the connecting mechanism includes a fixed tube fixedly connected to the rectangular plate, a sliding tube is fixedly installed on the output end of the electric push rod, and the sliding tube slides in the fixed tube; a pull rod is fixedly installed on the output end of the electric push rod, a storage box is fixedly installed on the bottom of the pull rod, the storage box is located directly below the spray tube, a storage groove is opened inside the storage box, and a filter screen connected to the storage groove is installed on the top of the storage box.

[0013] Furthermore, the top of the filter screen is rotatably connected to a plurality of dredging rods via a torsion spring, and the dredging rods are cone-shaped.

[0014] Furthermore, the second servo motor is provided with a heating mechanism for heating the flux in the loading box, and the heating mechanism includes a connecting pipe connected to the inside of the loading box, and one end of the connecting pipe away from the loading box is connected to the tail end of the second servo motor.

[0015] Furthermore, a connecting rod is fixedly installed at the output end of the electric push rod, a bottom plate is slidably connected inside the loading box, a plurality of stirring plates are fixedly installed on the top of the bottom plate, and one end of the connecting rod away from the electric push rod is fixedly connected to the bottom plate.

[0016] The beneficial effects of the present invention are as follows:

[0017] 1. A chip packaging multilayer stacking device described in the present invention starts the second servo motor in the second movable frame, and allows the second servo motor to move longitudinally with the second movable frame through the second screw rod. After the horizontal solder flux is sprayed, the first servo motor is started again, and the first servo motor is allowed to move longitudinally with the first movable frame, and then the solder flux is sprayed longitudinally, and longitudinal welding is performed using a welding gun. Repeat the above operation, so that the welding gun completes the rectangular movement, and then completes the rectangular welding of the chip. Through the above steps, the work of spraying solder flux on the chip can be completed, and a rectangular solder flux is sprayed on the rectangular chip, so as to facilitate the subsequent chip stacking operation. When the solder flux is sprayed through the spray pipe, the welding gun at the bottom of the second movable frame will immediately follow the welding, thereby greatly shortening the time between spraying solder flux and welding, thereby reducing the time that the solder flux is exposed to the air, and also reducing the occurrence of solder flux contamination, optimizing the welding temperature, ensuring that the temperature is controlled within the optimal range during the welding process, avoiding overheating or overcooling, and further improving the welding quality.

[0018] 2. A chip packaging multilayer stacking device described in the present invention is contracted and stretched by the first telescopic component and the second telescopic component. During contraction and stretching, the internal gas is transported to the air outlet pipe through the air guide pipe, and sprayed to the flux sprayed from the spray pipe through the air outlet pipe. Blowing out a small amount of gas can make the flux evenly distributed on the surface of the chip, ensuring that the flux can cover all areas that need to be welded during welding, thereby improving the welding effect. At the same time, a small amount of gas can reduce the temperature of the flux and reduce the loss of volatile components in the flux, thereby maintaining its chemical activity and welding performance. At the same time, the performance of the flux can also be maintained, which can reduce the defects of cold welding or poor solder joints during welding. When a large amount of gas is blown to the welding gun through the connecting pipe. The welding gun is cooled by gas to prevent the welding gun from overheating after long-term use. Excessive temperature will damage the internal components of the welding gun and shorten its service life.

[0019] 3. The chip packaging multilayer stacking equipment described in the present invention realizes the control of the flux flow rate through the designed control mechanism in cooperation with the connection mechanism, and can also close the end of the spray tube to reduce the impurities entering the flux through the spray tube. The closed spray tube can reduce the loss of volatile components in the flux and extend its storage time and service life. When the spray tube is not working, the electric push rod brings the storage box back to the bottom of the spray tube, and the storage groove in the storage box is used to collect the residual dripping flux. At the same time, the conical dredging rod can dredge the port of the spray tube to prevent the residual flux from solidifying at the port, resulting in the blockage of the port of the spray tube.

[0020] 4. The chip packaging multilayer stacking equipment described in the present invention guides the hot air generated by the second servo motor when it is working into the loading box through the connecting pipe, thereby heating the flux in the loading box, and the output end of the electric push rod will move with the bottom plate and several stirring plates through the connecting rod when moving, and the stirring plate can stir the flux in the loading box, so that the hot air can fully and evenly heat the flux in the loading box, thereby improving the heating efficiency. The heating of the flux is achieved through the designed heating mechanism, and heating the flux can reduce its viscosity, improve its wetting properties, and make it easier for the solder to penetrate and cover the welding surface, thereby improving the quality of the solder joint. At the same time, it can also activate its chemical composition, help remove oxides and impurities on the metal surface, ensure that the welding surface is clean, and improve welding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the packaging device in the present invention.

[0023] Figure 2 It is a structural schematic diagram of the workbench in the present invention.

[0024] Figure 3 It is a structural schematic diagram of the first servo motor in the present invention.

[0025] Figure 4 The present invention Figure 2 Schematic diagram of the structure at point A.

[0026] Figure 5 It is a schematic cross-sectional structural diagram of the first movable frame in the present invention.

[0027] Figure 6 It is a schematic cross-sectional structural diagram of the second telescopic component in the present invention.

[0028] Figure 7 It is a schematic cross-sectional structural diagram of the second movable frame in the present invention.

[0029] Figure 8 It is a structural schematic diagram of the electric push rod in the present invention.

[0030] Fig. 9 It is a schematic cross-sectional structural diagram of the storage box in the present invention.

[0031] Fig.10 It is a schematic diagram of the top view of the rectangular plate in the present invention.

[0032] Fig.11 It is a schematic diagram of the cross-sectional structure of the air outlet pipe in the present invention.

[0033] Fig.12It is a schematic diagram of the cross-sectional structure of the fixed pipe in the present invention.

[0034] Fig.13 It is a schematic cross-sectional view of the structure of the glue storage box in the present invention.

[0035] Fig.14 It is a schematic cross-sectional structural diagram of the first telescopic component in the present invention.

[0036] Fig.15 It is a schematic diagram of the structure of the welding gun in the present invention when viewed from above.

[0037] Fig.16 It is a schematic diagram of the upward structure of the limit frame in the present invention.

[0038] In the figure: 1. Packaging equipment; 2. Workbench; 3. Chip;

[0039] 10. Moving mechanism; 11. First servo motor; 12. First screw rod; 13. Boss; 14. First movable frame; 15. Second servo motor; 16. Second screw rod; 17. Rectangular frame; 18. Slider; 19. Second movable frame;

[0040] 20. Spraying mechanism; 21. Loading box; 22. Spraying tube; 23. Welding gun;

[0041] 30. Control mechanism; 31. Electric push rod; 32. Rectangular groove; 33. Rectangular plate; 34. Sealing pad;

[0042] 40. Protective mechanism; 41. First telescopic assembly; 42. Second telescopic assembly; 43. Air outlet pipe; 44. Connecting pipe; 45. First guide plate; 46. Second guide plate; 47. End cover; 48. Limit rod;

[0043] 50. Connecting mechanism; 51. Fixed tube; 52. Sliding tube; 53. Pull rod; 54. Storage box; 55. Filter screen; 56. Storage slot; 57. Dredging rod;

[0044] 60. Heating mechanism; 61. Connecting pipe; 62. Connecting rod; 63. Bottom plate; 64. Stirring plate;

[0045] 70. Sliding assembly; 71. Limiting frame; 72. Sliding block; 73. Electromagnet. DETAILED DESCRIPTION

[0046] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0047] like Figures 1 to 16As shown, a chip packaging multilayer stacking device according to an embodiment of the present invention includes a packaging device 1, a workbench 2 is installed in the packaging device 1, and a chip 3 is arranged on the top of the workbench 2; a moving mechanism 10 for driving the solder flux to move is arranged in the packaging device 1, and a spraying mechanism 20 for quickly spraying is arranged on the moving mechanism 10; the moving mechanism 10 includes a first servo motor 11 and a boss 13 fixedly installed in the packaging device 1, a first screw rod 12 is installed between the first servo motor 11 and the boss 13, and a first movable frame 14 is movably connected to the surface of the first screw rod 12, and a first movable frame 14 is fixed in the first movable frame 14. A second servo motor 15 is installed, a second screw rod 16 is fixedly installed at the output end of the second servo motor 15, a rectangular frame 17 is fixedly installed in the packaging device 1, a slider 18 is slidably connected in the rectangular frame 17, one end of the second screw rod 16 away from the second servo motor 15 is connected to the slider 18, and a second movable frame 19 is movably connected to the surface of the second screw rod 16; the spray mechanism 20 includes a loading box 21 fixedly installed in the second movable frame 19, a spray pipe 22 connected to the inside of the loading box 21 is fixedly installed at the bottom of the second movable frame 19, and a welding gun 23 is installed on the loading box 21 through a sliding assembly 70;

[0048] The sliding assembly 70 includes an arc-shaped limit frame 71 fixedly mounted on the bottom of the second movable frame 19 , the bottom of the limit frame 71 is rotatably connected to a welding gun 23 , the surface of the welding gun 23 is wrapped with magnetic material, and an electromagnet 73 is fixedly mounted in the rectangular frame 17 .

[0049] During operation, when it is necessary to stack the chips 3 on the workbench 2, the first servo motor 11 in the packaging device 1 is first started, and the first servo motor 11 is moved with the first movable frame 14 through the first screw 12, so that the second movable frame 19 with the spray tube 22 is at the starting end of the chip 3 spraying solder flux. At this time, the second servo motor 15 in the second movable frame 19 is started, and the second servo motor 15 is moved longitudinally with the second movable frame 19 through the second screw 16. At this time, the electromagnet in the limit frame 71 is started, so that the electromagnet and the welding gun 23 repel each other with the same polarity, thereby temporarily fixing the welding gun 23. At this time, the welding gun 23 and the spray tube 22 are in the same horizontal direction, and the spray tube 22 will also spray solder flux. After the horizontal soldering flux is sprayed, the internal magnetism of the electromagnet is changed while the power is turned on, so that the electromagnet and the welding gun 23 attract each other (this belongs to the prior art and will not be repeated again), and the welding gun 23 slides in the limit frame 71 and swings over the second screw 16 (there is resistance between the sliding block 72 and the welding gun 23, and a certain force needs to be applied to make the welding gun 23 rotate, such as the hinged structure of the mobile phone holder, which has a certain resistance), so that the welding gun 23 and the spray pipe 22 are in the same longitudinal direction. Then start the first servo motor 11, let the first servo motor 11 move longitudinally with the first movable frame 14, and then complete the longitudinal spraying operation of the soldering flux, and use the soldering gun 23 to perform longitudinal welding. Repeat the above operation, so that the soldering gun 23 completes the rectangular movement, and then completes the rectangular welding of the chip 3. Through the above steps, the work of spraying soldering flux can be completed on the chip 3, and a rectangular soldering flux is sprayed on the rectangular chip 3, so as to facilitate the subsequent stacking operation of the chip 3. When the flux is sprayed through the spray tube 22, the welding gun 23 at the bottom of the second movable frame 19 will immediately follow the welding, thereby greatly shortening the time between spraying the flux and welding, thereby reducing the time the flux is exposed to the air, and reducing the occurrence of flux contamination, optimizing the welding temperature, ensuring that the temperature is controlled within the optimal range during the welding process, avoiding overheating or overcooling, and further improving the welding quality.

[0050] It should be noted that, in order to preferably enable the welding gun 23 to pass over the second screw rod 16 , the outer surface of the sliding block 72 may also be wrapped with a magnetic material, similar to the above.

[0051] The protective mechanism 40 includes two first telescopic components 41 and two second telescopic components 42, one end of the two first telescopic components 41 is fixedly connected to the first movable frame 14, the ends of the two first telescopic components 41 away from the first movable frame 14 are respectively fixedly connected to the boss 13 and the first servo motor 11, one end of the two second telescopic components 42 is fixedly connected to the second movable frame 19, the ends of the two second telescopic components 42 away from the second movable frame 19 are respectively fixedly connected to the slider 18 and the first movable frame 14, the first telescopic components 41 and the second telescopic components 42 are composed of a plurality of sealed sliding hollow cylinders; two air outlet pipes 43 are fixedly installed at the bottom of the second movable frame 19, and the first telescopic components 41 and the second telescopic components 42 are respectively connected to the two air outlet pipes 43 through air guide pipes.

[0052] Specifically, a connecting pipe 44 connected to the inside is fixedly installed on the surface of the outlet pipe 43, a first arc-shaped guide plate 45 is fixedly installed in the outlet pipe 43, a second arc-shaped guide plate 46 is fixedly installed at the bottom of the first guide plate 45, and the bottom of the second guide plate 46 is fixedly connected to the inner wall of the outlet pipe 43. One end of the connecting pipe 44 away from the outlet pipe 43 is rotatably connected to an end cap 47 through a torsion spring, and a curved limiting rod 48 is fixedly installed on the surface of the connecting pipe 44.

[0053] When working, when the first servo motor 11 moves the first movable frame 14, the first movable frame 14 will continuously slide and shrink and stretch the first telescopic component 41, and when the second servo motor 15 moves the second movable frame 19, it will also continuously shrink and stretch the second telescopic component 42. The first telescopic component 41 and the second telescopic component 42 are both composed of a plurality of hollow cylinders sealed and slidably connected, so when shrinking and stretching, the internal gas will be transported to the outlet pipe 43 through the air guide pipe (with a one-way valve), and sprayed to the flux sprayed from the spray pipe 22 through the outlet pipe 43. It should be noted that the first telescopic component 41 and the second telescopic component 42 are both equipped with an air inlet pipe with a one-way valve. When passing through the outlet pipe 43, the gas will be diverted by the first guide plate 45 and the second guide plate 46, and only a small amount of gas will be blown out through the outlet pipe 43. By blowing out a small amount of gas, the flux can be evenly distributed on the surface of the chip 3, ensuring that the flux can cover all areas that need to be welded during welding, thereby improving the welding effect. At the same time, a small amount of gas can lower the temperature of the flux and reduce the loss of volatile components in the flux, thereby maintaining its chemical activity and welding performance. At the same time, it can also maintain the performance of the flux and reduce the defects of cold soldering or poor solder joints during welding.

[0054] A large amount of gas in the gas outlet pipe 43 is guided to the connecting pipe 44 by the second guide plate 46, and rotates to push open the end cover 47 of the connecting pipe 44. At the same time, the limiting rod 48 limits the end cover 47 so that the end cover 47 is opened in an inclined state. At this time, a large amount of gas is blown toward the welding gun 23 through the connecting pipe 44. The welding gun 23 is cooled by the gas to prevent the welding gun 23 from overheating after long-term use. Excessive temperature will damage the internal components of the welding gun 23 and shorten its service life.

[0055] The quantity control mechanism 30 includes an electric push rod 31 fixedly installed in the second movable frame 19, and a rectangular groove 32 connected to the interior is provided on one side of the spray tube 22 close to the electric push rod 31. A rectangular plate 33 is provided in the spray tube 22, and one side of the rectangular plate 33 is connected to the output end of the electric push rod 31. A sealing gasket 34 is fixedly installed on the surface of the rectangular plate 33, and a sealing groove for the sealing gasket 34 to be clamped is provided in the spray tube 22.

[0056] Specifically, the electric push rod 31 and the rectangular plate 33 are installed through a connecting mechanism 50, and the connecting mechanism 50 includes a fixed tube 51 fixedly connected to the rectangular plate 33, and a sliding tube 52 is fixedly installed at the output end of the electric push rod 31, and the sliding tube 52 slides in the fixed tube 51; a pull rod 53 is fixedly installed at the output end of the electric push rod 31, and a storage box 54 is fixedly installed at the bottom of the pull rod 53. The storage box 54 is located directly below the spray tube 22, and a storage groove 56 is opened inside the storage box 54. A filter 55 connected to the storage groove 56 is installed on the top of the storage box 54. The top of the filter 55 is rotatably connected to a plurality of dredging rods 57 through a torsion spring, and the dredging rods 57 are cone-shaped.

[0057] During operation, the electric push rod 31 drives the rectangular plate 33 to move to control the flow of the solder flux in the spray tube 22, so that the solder flux is sprayed according to the amount required by different chips 3. Before the spray tube 22 starts to work, the electric push rod 31 is started, and the output end of the electric push rod 31 slides with the sliding tube 52 in the fixed tube 51. At this time, the output end of the electric push rod 31 moves with the storage box 54 through the pull rod 53, so that the storage box 54 leaves the bottom of the spray tube 22, thereby opening the port of the spray tube 22. When the sliding tube 52 slides to the maximum limit in the fixed tube 51, it moves with the fixed tube 51 and the rectangular plate 33, and then moves with the rectangular plate 33 and the sealing gasket 34, so as to control the solder flux in the loading box 21 to flow into and out of the spray tube 22. The above-designed mechanism can control the flux flow rate, and at the same time can close the end of the spray tube 22 to reduce impurities entering the flux through the spray tube 22. Closing the spray tube 22 can reduce the loss of volatile components in the flux and extend its storage time and service life.

[0058] When the spray tube 22 is not working, the electric push rod 31 brings the storage box 54 back to the bottom of the spray tube 22, and the storage groove 56 in the storage box 54 is used to collect the residual dripping flux. At the same time, the conical clearing rod 57 can clear the port of the spray tube 22 to prevent the residual flux from solidifying at the port and causing the port of the spray tube 22 to be blocked.

[0059] The second servo motor 15 is provided with a heating mechanism 60 for heating the solder flux in the loading box 21. The heating mechanism 60 includes a connecting pipe 61 connected to the inside of the loading box 21. The end of the connecting pipe 61 away from the loading box 21 is connected to the tail end of the second servo motor 15. A connecting rod 62 is fixedly installed at the output end of the electric push rod 31. A bottom plate 63 is slidably connected to the inside of the loading box 21. A plurality of stirring plates 64 are fixedly installed on the top of the bottom plate 63. The end of the connecting rod 62 away from the electric push rod 31 is fixedly connected to the bottom plate 63.

[0060] When working, the hot air generated by the second servo motor 15 is directed into the loading box 21 through the connecting pipe 61, thereby heating the solder flux in the loading box 21, and the output end of the electric push rod 31 will move with the bottom plate 63 and a plurality of stirring plates 64 through the connecting rod 62 when moving, and the stirring plates 64 can stir the solder flux in the loading box 21, so that the hot air can fully and evenly heat the solder flux in the loading box 21, thereby improving the heating efficiency. The heating of the solder flux is achieved by the designed heating mechanism 60, and the heating of the solder flux can reduce its viscosity, improve its wetting properties, and make it easier for the solder to penetrate and cover the welding surface, thereby improving the quality of the solder joint. At the same time, its chemical composition can also be activated to help remove oxides and impurities on the metal surface, ensure a clean welding surface, and improve welding efficiency.

[0061] Working principle: When the chip 3 on the workbench 2 needs to be stacked, the first servo motor 11 in the packaging device 1 is first started, and the first servo motor 11 is moved with the first movable frame 14 through the first screw rod 12, so that the second movable frame 19 with the spray tube 22 is at the starting end of the chip 3 spraying flux. At this time, the second servo motor 15 in the second movable frame 19 is started, and the second servo motor 15 is moved longitudinally with the second movable frame 19 through the second screw rod 16. At this time, the electromagnet in the limit frame 71 is started, so that the electromagnet and the welding gun 23 are repelled by the same sex, and then the welding gun 23 is temporarily fixed. At this time, the welding gun 23 and the spray tube 22 are in the same horizontal direction, and the spray tube 22 will also spray out the flux. When the horizontal flux is sprayed, the internal magnetism of the electromagnet is changed while the power is turned on, so that the electromagnet and the welding gun 23 are attracted by opposite sexes, and the welding gun 23 slides in the limit frame 71 and swings over the second screw rod 16, so that the welding gun 23 and the spray tube 22 are in the same longitudinal direction. Then start the first servo motor 11, and let the first servo motor 11 move the first movable frame 14 longitudinally, and then complete the longitudinal spraying operation of the soldering flux, and use the soldering gun 23 to perform longitudinal welding. Repeat the above operation, so that the soldering gun 23 completes the rectangular movement, and then completes the rectangular welding of the chip 3. Through the above steps, the soldering flux can be sprayed on the chip 3, and a rectangular soldering flux is sprayed on the rectangular chip 3, so as to facilitate the subsequent stacking operation of the chip 3. When the soldering flux is sprayed through the spray pipe 22, the soldering gun 23 at the bottom of the second movable frame 19 will immediately follow the welding.

[0062] When the first servo motor 11 moves the first movable frame 14, the first movable frame 14 will continuously slide and shrink and stretch the first telescopic assembly 41. When the second servo motor 15 moves the second movable frame 19, it will also continuously shrink and stretch the second telescopic assembly 42. The first telescopic assembly 41 and the second telescopic assembly 42 are both composed of a plurality of hollow cylinders that are sealed and slidably connected. Therefore, when shrinking and stretching, the internal gas will be transported to the outlet pipe 43 through the air guide pipe, and sprayed to the solder flux sprayed from the spray pipe 22 through the outlet pipe 43. When the gas passes through the outlet pipe 43, it will be diverted by the first guide plate 45 and the second guide plate 46, and only a small amount of gas will be blown out through the outlet pipe 43. A large amount of gas in the outlet pipe 43 is guided to the connecting pipe 44 by the second guide plate 46, and the end cover 47 of the connecting pipe 44 is rotated to open. At the same time, the limit rod 48 limits the end cover 47, so that the end cover 47 is opened in an inclined state. At this time, a large amount of gas is blown to the welding gun 23 through the connecting pipe 44.

[0063] Before the spray tube 22 starts working, the electric push rod 31 is started, and the output end of the electric push rod 31 slides with the sliding tube 52 in the fixed tube 51. At this time, the output end of the electric push rod 31 moves with the storage box 54 through the pull rod 53, so that the storage box 54 leaves the bottom of the spray tube 22, thereby opening the port of the spray tube 22. When the sliding tube 52 slides to the maximum limit in the fixed tube 51, it moves with the fixed tube 51 and the rectangular plate 33, and then moves with the rectangular plate 33 and the sealing gasket 34, thereby controlling the flux in the loading box 21 to flow into and out of the spray tube 22. When the spray tube 22 is not working, the electric push rod 31 returns to the bottom of the spray tube 22 with the storage box 54, and the storage groove 56 in the storage box 54 is used to collect the residual dripping flux, and the conical dredging rod 57 can dredge the port of the spray tube 22.

[0064] The hot air generated by the second servo motor 15 when it is working is guided into the loading box 21 through the connecting pipe 61, so that the flux in the loading box 21 is heated, and the output end of the electric push rod 31 will move with the bottom plate 63 and a plurality of stirring plates 64 through the connecting rod 62 when moving, and the stirring plates 64 can stir the flux in the loading box 21, so that the hot air can fully and evenly heat the flux in the loading box 21, thereby improving the heating efficiency.

[0065] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A chip packaging multilayer stacking device, comprising a packaging device, a workbench is installed in the packaging device, and a chip is arranged on the top of the workbench; characterized in that: The packaging device is provided with a moving mechanism for driving the soldering flux to move, and a spraying mechanism for rapidly spraying the flux arranged on the moving mechanism; The moving mechanism includes a first servo motor and a boss fixedly installed in the packaging device, a first screw rod is installed between the first servo motor and the boss, a first movable frame is movably connected to the surface of the first screw rod, a second servo motor is fixedly installed in the first movable frame, a second screw rod is fixedly installed at the output end of the second servo motor, a rectangular frame is fixedly installed in the packaging device, a slider is slidably connected in the rectangular frame, an end of the second screw rod away from the second servo motor is connected to the slider, and the second movable frame is movably connected to the surface of the second screw rod; The spray mechanism comprises a loading box fixedly mounted in the second movable frame, a spray pipe connected to the inside of the loading box is fixedly mounted at the bottom of the second movable frame, and a welding gun is mounted on the loading box through a sliding assembly; The sliding assembly includes an arc-shaped limit frame fixedly installed at the bottom of the second movable frame, the bottom of the limit frame is rotatably connected to a welding gun, the surface of the welding gun is wrapped with a magnetic material, and an electromagnet is fixedly installed in the rectangular frame; The second movable frame is provided with a control mechanism for controlling the amount of flux, and a protective mechanism for protecting the first screw rod and the second screw rod. The protective mechanism includes two first telescopic components and two second telescopic components. One end of the two first telescopic components is fixedly connected to the first movable frame, and the ends of the two first telescopic components away from the first movable frame are respectively fixedly connected to the boss and the first servo motor, one end of the two second telescopic components is fixedly connected to the second movable frame, and the ends of the two second telescopic components away from the second movable frame are respectively fixedly connected to the slider and the first movable frame. The first telescopic component and the second telescopic component are composed of a number of sealed sliding hollow cylinders.

2. A chip packaging multilayer stacking device according to claim 1, characterized in that: The quantity control mechanism includes an electric push rod fixedly installed in the second movable frame. A rectangular groove connected to the interior is provided on one side of the spray tube close to the electric push rod. A rectangular plate is arranged in the spray tube. One side of the rectangular plate is connected to the output end of the electric push rod. A sealing gasket is fixedly installed on the surface of the rectangular plate. A sealing groove for the sealing gasket to be clamped is provided in the spray tube.

3. A chip packaging multilayer stacking device according to claim 1, characterized in that: Two air outlet pipes are fixedly installed at the bottom of the second movable frame, and the first telescopic assembly and the second telescopic assembly are respectively connected to the two air outlet pipes through the air guide pipe.

4. A chip packaging multilayer stacking device according to claim 3, characterized in that: A connecting pipe connected to the inside is fixedly installed on the surface of the air outlet pipe, a first arc-shaped guide plate is fixedly installed in the air outlet pipe, a second arc-shaped guide plate is fixedly installed on the bottom of the first guide plate, and the bottom of the second guide plate is fixedly connected to the inner wall of the air outlet pipe.

5. A chip packaging multilayer stacking device according to claim 4, characterized in that: One end of the connecting pipe away from the air outlet pipe is rotatably connected with an end cover through a torsion spring, and an arc-shaped limiting rod is fixedly installed on the surface of the connecting pipe.

6. A chip packaging multi-layer stacking device according to claim 2, characterized in that: The electric push rod is installed with the rectangular plate through a connecting mechanism, the connecting mechanism includes a fixed tube fixedly connected with the rectangular plate, and a sliding tube is fixedly installed at the output end of the electric push rod, and the sliding tube slides in the fixed tube; A pull rod is fixedly installed at the output end of the electric push rod, a storage box is fixedly installed at the bottom of the pull rod, the storage box is located directly below the spray tube, a storage groove is opened inside the storage box, and a filter screen connected to the storage groove is installed on the top of the storage box.

7. A chip packaging multi-layer stacking device according to claim 6, characterized in that: The top of the filter screen is rotatably connected to a plurality of dredging rods through a torsion spring, and the dredging rods are in a cone shape.

8. A chip packaging multi-layer stacking device according to claim 2, characterized in that: The second servo motor is provided with a heating mechanism for heating the solder flux in the loading box. The heating mechanism includes a connecting pipe connected to the inside of the loading box. One end of the connecting pipe away from the loading box is connected to the tail end of the second servo motor.

9. A chip packaging multi-layer stacking device according to claim 8, characterized in that: A connecting rod is fixedly installed at the output end of the electric push rod, a bottom plate is slidably connected inside the loading box, a plurality of stirring plates are fixedly installed on the top of the bottom plate, and one end of the connecting rod away from the electric push rod is fixedly connected to the bottom plate.

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