Laser positioning lamination machine, method, device, controller and medium

Abstract

The present application provides a laser positioning lamination machine, method, device, controller and medium, including: an adsorption unit; an infrared transceiver unit; multiple sensor units, including a visual sensor unit, a displacement sensor unit and an angle sensor unit, wherein the visual sensor unit is used to collect image information corresponding to a photovoltaic module and a photovoltaic glass; the displacement sensor unit is used to detect the displacement information of the bus bar extension end corresponding to the photovoltaic module; the angle sensor unit is used to detect the angle information of the photovoltaic glass and the bus bar extension end; a controller is used to control the adsorption unit to adsorb the photovoltaic glass, and control the infrared transceiver unit to emit infrared light toward the photovoltaic glass and the photovoltaic module to obtain the spot position of the infrared light on the photovoltaic glass and the bus bar extension end of the photovoltaic module; obtain image information, displacement information and angle information; and control the adsorption unit to place the photovoltaic glass on the photovoltaic module according to the image information, displacement information, angle information and spot position to complete the lamination.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic technology, and in particular to a laser positioning wafer assembly machine, method, device, controller and medium. Background Art

[0002] In the field of building integrated photovoltaics (BIPV), the back glass assembly process is one of the key links, which directly affects the quality and reliability of BIPV products. Traditional back glass assembly positioning methods usually rely on manual visual or simple mechanical assisted positioning, which have many shortcomings. For example, manual visual positioning is not only inefficient, but also easily affected by the operator's experience and ambient light, resulting in low positioning accuracy. Although simple mechanical assisted positioning has improved the positioning speed to a certain extent, due to its simple structure, it is difficult to achieve precise fine-tuning, and inaccurate positioning often occurs.

[0003] Inaccurate positioning will not only reduce the efficiency of assembly, but also cause serious problems such as poor electrical connection and unstable component performance during subsequent use, seriously affecting the quality and reliability of BIPV products. With the continuous development of BIPV technology and the increasing application scenarios, the market has put forward higher requirements for the accuracy and speed of assembly positioning. The existing positioning methods can no longer meet this demand. Therefore, the development of an efficient and accurate positioning device has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] The present application provides a laser positioning lamination machine, method, device, controller and medium, aiming to solve the problem that the traditional back panel glass lamination positioning method usually relies on manual visual or simple mechanical assisted positioning, and these methods have many shortcomings. For example, manual visual positioning is not only inefficient, but also easily affected by the operator's experience and ambient light, resulting in low positioning accuracy. Although simple mechanical assisted positioning has improved the positioning speed to a certain extent, due to its simple structure, it is difficult to achieve precise fine-tuning, and inaccurate positioning often occurs. Inaccurate positioning will not only reduce the efficiency of lamination, but also cause serious problems such as poor electrical connection and unstable component performance during subsequent use, seriously affecting the quality and reliability of BIPV products. With the continuous development of BIPV technology and the increasing application scenarios, the market has put forward higher requirements for the accuracy and speed of lamination positioning. The existing positioning methods can no longer meet this demand. Therefore, the development of an efficient and accurate positioning device has become a technical problem that needs to be solved urgently.

[0005] In a first aspect, the present application provides a laser positioning wafer assembly machine, comprising:

[0006] A plurality of adsorption modules, wherein the plurality of adsorption modules are used to cooperatively place the back panel glass on the assembly to be assembled, so as to complete the assembly of the back panel glass and the assembly to be assembled;

[0007] A plurality of support modules, at least one of the support modules is disposed on one of the adsorption modules;

[0008] A laser positioning module, which is movably disposed in the supporting module and is used to emit laser positioning light;

[0009] An adjusting module, which is disposed on the supporting module and connected to the laser positioning module, and is used to adjust the position and angle of the laser positioning module;

[0010] A controller, wherein the controller is electrically connected to the adsorption module, the laser positioning module and the adjustment module, and the controller is used to control the laser positioning module to emit laser positioning light when controlling the adsorption module to adsorb the back panel glass, and to control the adsorption module to move the component to be combined and to move the laser positioning module through the adjustment module until it is determined by the laser positioning light that the protruding end of the bus bar of the component to be combined coincides with the drilled hole of the back panel glass, and then control the adsorption module to place the back panel glass on the component to be combined to complete the combination of the back panel glass and the component to be combined.

[0011] In some embodiments, it also includes: a cover body, which is arranged on the outside of the adsorption module, the support module, the laser positioning module, the adjustment module and the controller, so that the laser positioning laminating machine can complete the lamination of the back panel glass and the assembly to be laminarized in a darkroom environment.

[0012] In some embodiments, it also includes: a visual acquisition module, which is oriented toward the back panel glass and the component to be assembled, and is used to acquire assembly image information, and the assembly image information at least includes the back panel glass, the component to be assembled and the laser positioning light; wherein the controller is electrically connected to the visual acquisition module, and is used to determine, based on the assembly image information, that the protruding end of the bus bar of the component to be assembled coincides with the drilled hole of the back panel glass.

[0013] In some embodiments, the laser positioning assembly machine further includes a support frame and a micro-adjustment module, and the assembly to be assembled is placed on the support frame via the micro-adjustment module; and the adsorption module is controlled to place the back panel glass on the assembly to be assembled.

[0014] In a second aspect, the present application provides a laser positioning method, which is applied to a controller of a laser positioning wafer assembly machine provided in any embodiment of the present application; the method comprises:

[0015] When controlling the adsorption module to adsorb the back panel glass, controlling the laser positioning module to emit laser positioning light;

[0016] Acquire first image information acquired by a visual acquisition module;

[0017] Analyze the first image information to confirm first deviation information between the laser positioning light and the extended end of the busbar of the assembly to be assembled;

[0018] Controlling the adjustment module to move the laser positioning module according to the first deviation information so that the laser positioning light is aligned with the extended end of the bus bar and obtaining the second image information collected by the visual collection module;

[0019] Analyze the second image information to confirm second deviation information between the laser positioning light and the drilling hole of the back plate glass;

[0020] Controlling the adsorption module to move the back glass according to the second deviation information so that the drilling hole of the back glass, the laser positioning light and the extended end of the bus bar coincide with each other;

[0021] The adsorption module is controlled to place the back panel glass on the assembly to be assembled, so as to complete the assembly of the back panel glass and the assembly to be assembled.

[0022] In some embodiments, the analysis of the first image information to confirm the first deviation information between the laser positioning light and the protruding end of the bus bar of the assembly to be assembled includes: performing target detection on the first image information to obtain the protruding end center point information corresponding to the bus bar protruding end and the spot center point information corresponding to the laser positioning light; calculating the first deviation information corresponding to the protruding end center point information and the spot center point information; the first deviation information includes horizontal deviation, vertical deviation and angular deviation.

[0023] Exemplarily, the performing target detection on the first image information to obtain the extension end center point information corresponding to the bus bar extension end and the spot center point information corresponding to the laser positioning light includes: extracting the edge information of the bus bar extension end in the first image information according to a preset edge detection algorithm; performing contour recognition on the first image information according to a preset contour corresponding to the bus bar extension end to obtain the contour information corresponding to the bus bar extension end; calculating the extension end center point information according to the edge information and the contour information; extracting a high-brightness area with a brightness greater than a preset brightness in the first image, the high-brightness area being the spot area corresponding to the laser positioning light; and calculating the spot center point information according to the spot area.

[0024] In some embodiments, controlling the adjustment module to move the laser positioning module according to the first deviation information includes: parsing the first image information to obtain the adjustment module center point position information corresponding to the laser positioning light; generating control information according to the adjustment module center point position information and the first deviation information, so as to control the adjustment module to move the laser positioning module until the laser positioning light is aligned with the protruding end of the bus bar according to the control information.

[0025] In some embodiments, controlling the adsorption module to move the back panel glass according to the second deviation information includes: parsing the second deviation information to obtain the drilling center coordinates corresponding to the drilling hole of the back panel glass and the light spot center coordinates corresponding to the laser positioning light; generating second control information according to the drilling center coordinates and the light spot center coordinates; controlling the adsorption module to move the back panel glass according to the second control information so that the drilling hole of the back panel glass, the laser positioning light and the extended end of the bus bar coincide with each other.

[0026] Exemplarily, the generating of the second control information according to the drilling center coordinates and the light spot center coordinates includes: parsing the second image information to obtain the busbar position information corresponding to the extended end of the busbar; obtaining the busbar center coordinates according to the busbar position information; generating the second control information according to the busbar center coordinates, the drilling center coordinates and the light spot center coordinates; the second control information includes horizontal control information, vertical control information and angle control information; the expressions of the horizontal control information, the vertical control information and the angle control information include

[0027] ;

[0028] ;

[0029] ;

[0030] in, is the horizontal control information, is the vertical control information, is the angle control information, ( , ) is the coordinate of the drilling center, ( , ) is the center coordinate of the busbar, ( , ) are the center coordinates of the light spot.

[0031] In some embodiments, the laser positioning laminating machine also includes a support frame and a fine-adjustment module, and the component to be combined is placed on the support frame through the fine-adjustment module; the control of the adsorption module to place the back panel glass on the component to be combined includes: obtaining the third image information collected by the visual acquisition module; parsing the third image information to obtain the overlap information corresponding to the back panel glass and the component to be combined; generating fine-adjustment information according to the overlap information, so as to control the fine-adjustment module to fine-tune the position of the component to be combined according to the fine-adjustment information; after the fine-tuning is completed, controlling the adsorption module to place the back panel glass on the component to be combined, so as to eliminate the overlap between the component to be combined and the back panel glass after lamination.

[0032] In a third aspect, the present application provides a laser positioning device, which is applied to a controller of a laser positioning wafer assembly machine provided in any embodiment of the present application; the device includes:

[0033] The light emitting module is used to control the laser positioning module to emit laser positioning light when the adsorption module is controlled to adsorb the back panel glass;

[0034] A first acquisition module, used to acquire first image information acquired by the visual acquisition module;

[0035] An information analysis module, used for analyzing the first image information and confirming first deviation information between the laser positioning light and the extended end of the busbar;

[0036] A second acquisition module, configured to control the adjustment module to move the laser positioning module according to the first deviation information, so that the laser positioning light is aligned with the extended end of the busbar of the assembly to be assembled and acquire the second image information acquired by the visual acquisition module;

[0037] a deviation analysis module, used for analyzing the second image information to confirm second deviation information between the laser positioning light and the drilling hole of the back plate glass;

[0038] A control movement module, used for controlling the adsorption module to move the back plate glass according to the second deviation information, so that the drilling hole of the back plate glass, the laser positioning light and the extended end of the bus bar are overlapped;

[0039] The lamination completion module is used to control the adsorption module to place the back panel glass on the assembly to be laminated, so as to complete the lamination of the back panel glass and the assembly to be laminated.

[0040] In a fourth aspect, the present application provides a controller, comprising a memory and a processor, the memory being used to store a computer program, the processor being used to execute the computer program and to implement the steps of the laser positioning method provided in any embodiment of the present application when executing the computer program.

[0041] In a fifth aspect, the present application provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the processor implements the steps of the laser positioning method provided in any embodiment of the present application.

[0042] The embodiments of the present application provide a laser positioning laminating machine, method, device, controller and medium. The present application proposes a laser positioning laminating machine, which aims to improve the accuracy and efficiency of back panel glass laminating positioning. The specific technical contents are as follows:

[0043] Multiple adsorption modules: used to coordinately place the back panel glass on the assembly to be assembled to ensure that the back panel glass can be accurately aligned.

[0044] Multiple supporting modules: at least one supporting module is arranged on an adsorption module, and is used to support and fix the laser positioning module and the adjustment module.

[0045] Laser positioning module: It can be movably set in the support module to emit laser positioning light to help accurately align the back panel glass and the components to be assembled.

[0046] Adjustment module: It is arranged on the support module and connected to the laser positioning module, and is used to adjust the position and angle of the laser positioning module to ensure that the laser positioning light can accurately illuminate the target position.

[0047] Controller: Electrically connected to the adsorption module, laser positioning module and adjustment module, used to control the overall assembly process. Control the adsorption module to adsorb the backplane glass, and control the laser positioning module to emit laser positioning light. By controlling the adsorption module to move the assembly to be assembled and the adjustment module to move the laser positioning module, the laser positioning light determines that the extended end of the busbar of the assembly to be assembled coincides with the drilled hole of the backplane glass. Finally, control the adsorption module to place the backplane glass on the assembly to be assembled to complete the assembly operation.

[0048] Furthermore, the provided laser positioning laminating machine has at least the following beneficial effects:

[0049] 1. Improve positioning accuracy: Through the precise irradiation of the laser positioning module, the alignment accuracy between the back panel glass and the components to be assembled can be significantly improved, reducing the impact of human errors and ambient light.

[0050] 2. Improve the efficiency of assembly: Multiple adsorption modules work together to quickly place the back glass on the assembly to be assembled, increasing the assembly speed. The automated control system reduces the time of manual operation and further improves production efficiency.

[0051] 3. Enhanced reliability and stability: The combination of laser positioning technology and automated adjustment modules ensures the stability and reliability of the assembly process, reducing problems such as poor electrical connections and unstable component performance.

[0052] 4. Stronger adaptability: The movable setting of the laser positioning module and the adjustment module enables the laminating machine to adapt to back glass and components to be laminarized of different sizes and shapes, with greater versatility and flexibility.

[0053] 5. Meet high market requirements: With the development of BIPV technology and the increase in application scenarios, the market has put forward higher requirements for the accuracy and speed of assembly positioning. The laser positioning assembly machine can effectively meet these requirements and improve product quality and market competitiveness.

[0054] In summary, the laser positioning and assembly machine integrates multiple adsorption modules, support modules, laser positioning modules and adjustment modules, and combines them with an intelligent controller to achieve efficient and precise backplane glass assembly positioning, significantly improving the quality and production efficiency of BIPV products.

[0055] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0057] Figure 1 It is a structural schematic diagram of a laser positioning wafer assembly machine provided in one embodiment of the present application;

[0058] Figure 2 is a schematic flow chart of the steps of a laser positioning method provided by an embodiment of the present application;

[0059] Figure 3 It is a structural schematic diagram of a laser positioning device provided in one embodiment of the present application;

[0060] Figure 4 It is a schematic block diagram of the structure of a controller provided in one embodiment of the present application.

[0061] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0063] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0064] It should be understood that, in order to facilitate the clear description of the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, the words "first", "second", etc. are used to distinguish the same items or similar items with substantially the same functions and effects. Those skilled in the art can understand that the words "first", "second", etc. do not limit the quantity and execution order, and the words "first", "second", etc. do not necessarily limit the difference.

[0065] It should be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0066] It should also be understood that the term “and / or” used in the specification and appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0067] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0068] In the field of building integrated photovoltaics (BIPV), the back glass assembly process is one of the key links, which directly affects the quality and reliability of BIPV products. Traditional back glass assembly positioning methods usually rely on manual visual or simple mechanical assisted positioning, which have many shortcomings. For example, manual visual positioning is not only inefficient, but also easily affected by the operator's experience and ambient light, resulting in low positioning accuracy. Although simple mechanical assisted positioning has improved the positioning speed to a certain extent, due to its simple structure, it is difficult to achieve precise fine-tuning, and inaccurate positioning often occurs.

[0069] Inaccurate positioning will not only reduce the efficiency of assembly, but also cause serious problems such as poor electrical connection and unstable component performance during subsequent use, seriously affecting the quality and reliability of BIPV products. With the continuous development of BIPV technology and the increasing application scenarios, the market has put forward higher requirements for the accuracy and speed of assembly positioning. The existing positioning methods can no longer meet this demand. Therefore, the development of an efficient and accurate positioning device has become a technical problem that needs to be solved urgently.

[0070] To solve the above problems, please refer to Figure 1 The present application provides a laser positioning laminating machine, comprising: a plurality of adsorption modules 2, wherein the plurality of adsorption modules 2 are used to cooperatively place the back panel glass on the assembly to be laminated, so as to complete the laminating of the back panel glass and the assembly to be laminated; a plurality of support modules, wherein at least one of the support modules is arranged on one of the adsorption modules 2; a laser positioning module 3, wherein the laser positioning module 3 can be movably arranged in the support module, and is used to emit laser positioning light; an adjustment module 4, wherein the adjustment module 4 is arranged on the support module and is connected to the laser positioning module 3, and is used to adjust the position and angle of the laser positioning module 3; a controller, The controller is electrically connected to the adsorption module 2, the laser positioning module 3 and the adjustment module 4. The controller is used to control the laser positioning module 3 to emit laser positioning light when controlling the adsorption module 2 to adsorb the back panel glass, and to control the adsorption module 2 to move the component to be combined and to move the laser positioning module 3 through the adjustment module 4 until it is determined by the laser positioning light that the protruding end of the bus bar of the component to be combined coincides with the drilled hole of the back panel glass, and then control the adsorption module 2 to place the back panel glass on the component to be combined to complete the combination of the back panel glass and the component to be combined.

[0071] Specifically, the laser positioning laminating machine is a device for laminating the back panel glass of building integrated photovoltaic (BIPV) with the assembly to be laminar. Its core technology includes multiple adsorption modules 2, support modules, laser positioning modules 3, adjustment modules 4 and controllers. Through the coordinated work of multiple adsorption modules 2, the back panel glass is accurately placed on the assembly to be laminar. The adsorption module 2 usually uses a vacuum suction cup or other types of adsorption parts to ensure the stability and accuracy of the glass during movement. The support module is used to fix and support the adsorption module 2 to ensure that there is no positional offset during the laminating process. At least one support module is provided with a laser positioning module 3 and an adjustment module 4. The laser positioning module 3 is mounted on the support module and can be movably arranged. It emits laser positioning light for accurately aligning the laminating position of the back panel glass and the assembly to be laminar. The adjustment module 4 is connected to the laser positioning module 3 to adjust the position and angle of the laser positioning module 3. Through the fine adjustment of the adjustment module 4, it is ensured that the laser positioning light can accurately irradiate the predetermined laminating position. The controller is the hub of the entire system, electrically connecting the adsorption module 2, the laser positioning module 3 and the adjustment module 4. The controller achieves precise bonding through the following steps: Control the adsorption module 2 to adsorb the backplane glass. Control the laser positioning module 3 to emit laser positioning light. By controlling the adsorption module 2 to move the assembly to be bonded and by moving the laser positioning module 3 through the adjustment module 4, the backplane glass and the assembly to be bonded are precisely aligned. When the laser positioning light determines that the extended end of the busbar of the assembly to be bonded coincides with the drilled hole of the backplane glass, the controller controls the adsorption module 2 to place the backplane glass on the assembly to be bonded to complete the bonding.

[0072] For example, suppose there are two assemblies to be assembled on a production line, and each assembly has a busbar extension that needs to be aligned with the drilled hole on the back glass. The specific usage steps are as follows:

[0073] Adsorption of back panel glass: Multiple adsorption modules 2 adsorb the back panel glass through vacuum suction cups and lift it to an appropriate height.

[0074] Laser positioning: The laser positioning module 3 emits laser positioning light to illuminate the extended end of the busbar of the assembly to be assembled.

[0075] Adjusting the position: The controller adjusts the position and angle of the laser positioning module 3 through the adjusting module 4 to ensure that the laser positioning light accurately irradiates the extended end of the busbar.

[0076] Moving components: The controller controls the adsorption module 2 to move the assembly to be assembled so that the extended end of the bus bar is aligned with the drilled hole of the back panel glass.

[0077] Alignment confirmation: When the laser positioning light shows that the extended end of the busbar coincides with the drill hole, the controller sends a confirmation signal.

[0078] Placing glass: The controller controls the adsorption module 2 to accurately place the back panel glass on the component to be assembled to complete the assembly.

[0079] Furthermore, the provided laser positioning wafer assembly machine and its examples have the following beneficial effects:

[0080] 1. Improve the accuracy of assembly: The laser positioning module 3 provides high-precision positioning light to ensure the precise alignment of the back panel glass and the components to be assembled, which significantly improves the accuracy of assembly.

[0081] 2. Improve production efficiency: The use of the automatic control and adjustment module 4 reduces manual intervention and improves the automation level of the assembly process, thereby greatly improving production efficiency.

[0082] 3. Reduce human errors: Through the coordinated work of the controller and the laser positioning module 3, the errors in the traditional manual visual or simple mechanical assisted positioning methods are avoided, making the assembly process more reliable.

[0083] 4. Adapt to different components: The laser positioning assembly machine can flexibly adjust the position and angle of the laser positioning module 3 to adapt to components to be assembled of different sizes and shapes, thereby improving the versatility and flexibility of the equipment.

[0084] 5. Improve product quality: High-precision assembly not only improves the electrical connection performance of the components, but also ensures the overall performance and reliability of the components, thereby enhancing the market competitiveness of BIPV products.

[0085] In summary, the laser positioning and lamination machine effectively solves the shortcomings of traditional backplane glass lamination positioning methods through its automation, high precision and flexible adjustment characteristics, and significantly improves the quality and production efficiency of BIPV products.

[0086] In some embodiments, it also includes: a cover body 1, which is arranged on the outside of the adsorption module 2, the support module, the laser positioning module 3, the adjustment module 4 and the controller, so that the laser positioning laminating machine can complete the lamination of the back panel glass and the component to be laminarized in a darkroom environment.

[0087] The cover 1 is arranged outside the adsorption module 2, the support module, the laser positioning module 3, the adjustment module 4 and the controller. The arrangement of the cover 1 enables the laser positioning laminating machine to complete the laminating process of the back panel glass and the assembly to be laminating in a darkroom environment.

[0088] In a darkroom environment, interference from external light can be avoided, making the laser positioning light clearer and more accurate, thereby improving positioning accuracy. The darkroom environment reduces the impact of ambient light changes on the assembly process, making the entire assembly process more stable and reliable. Some special application scenarios (such as high-precision requirements, sensitive materials, etc.) need to be operated in a darkroom environment, and this embodiment can meet these needs.

[0089] In some embodiments, it also includes: a visual acquisition module, which is oriented toward the back panel glass and the component to be assembled, and is used to acquire assembly image information, and the assembly image information at least includes the back panel glass, the component to be assembled and the laser positioning light; wherein the controller is electrically connected to the visual acquisition module, and is used to determine, based on the assembly image information, that the protruding end of the bus bar of the component to be assembled coincides with the drilled hole of the back panel glass.

[0090] The visual acquisition module faces the back panel glass and the assembly to be assembled, and is used to collect the assembled image information. The assembled image information at least includes the back panel glass, the assembly to be assembled, and the laser positioning light. The controller is electrically connected to the visual acquisition module, and determines whether the extended end of the busbar of the assembly to be assembled coincides with the drilled hole of the back panel glass according to the assembled image information.

[0091] The visual acquisition module can provide real-time feedback of assembly image information, and the controller can perform precise alignment based on this information, further improving assembly accuracy. Through the collaborative work of the visual acquisition module and the controller, a higher level of automated control is achieved, reducing manual intervention and improving production efficiency. The visual acquisition module can provide multi-angle image information, which helps detect other potential problems in the assembly process, such as glass offset and component deformation.

[0092] In some embodiments, the laser positioning assembly machine further includes a support frame and a micro-adjustment module 4, and the assembly to be assembled is placed on the support frame via the micro-adjustment module 4; the adsorption module 2 is controlled to place the back panel glass on the assembly to be assembled.

[0093] The support frame is used to support the assembly to be assembled. The micro-adjustment module 4 is connected to the support frame and is used to finely adjust the position of the assembly to be assembled. The controller controls the adsorption module 2 to place the back panel glass on the assembly to be assembled after being adjusted by the micro-adjustment module 4 to complete the assembly.

[0094] The micro-adjustment module 4 can adjust the position of the assembly to be assembled at a subtle level to ensure its precise alignment with the back glass. The setting of the support frame and the micro-adjustment module 4 makes the assembly to be assembled more stable during the assembly process and reduces the risk of positional displacement. The flexibility of the micro-adjustment module 4 allows the assembly machine to adapt to assemblies to be assembled of different sizes and shapes, improving the versatility of the equipment. Through the coordinated work of the controller and the micro-adjustment module 4, the operator can perform the assembly operation more conveniently, reducing the cumbersome adjustment steps.

[0095] See also Figure 2 , Figure 2The figure is a schematic flow chart of a laser positioning method provided in an embodiment of the present application. The laser positioning method can be implemented by a controller of a laser positioning wafer assembly machine provided in any embodiment of the present application, and the controller can be a microcontroller unit (MCU).

[0096] Specifically, Figure 2 As shown, the provided laser positioning method includes steps S101 to S107. The details are as follows:

[0097] Step S101. When controlling the adsorption module to adsorb the back panel glass, controlling the laser positioning module to emit laser positioning light.

[0098] Specifically, the adsorption module adsorbs the back panel glass through a vacuum suction cup or other adsorption parts. The laser positioning module starts to emit laser positioning light while the adsorption module adsorbs the back panel glass. Assuming that the back panel glass has been lifted above the component to be assembled, the controller sends a command to the adsorption module to make it adsorb the back panel glass. At the same time, the controller activates the laser positioning module to make it emit laser positioning light to the component to be assembled. The efficiency of assembly is improved by synchronizing adsorption and laser positioning. Reduce unnecessary waiting: Laser positioning starts during the adsorption process, saving assembly time.

[0099] Step S102: Acquire first image information acquired by the visual acquisition module.

[0100] Specifically, the visual acquisition module faces the back panel glass and the assembly to be assembled, and collects the first image information. The image information includes the relative positions of the back panel glass, the assembly to be assembled, and the laser positioning light. For example, the visual acquisition module captures the initial position of the back panel glass and the assembly to be assembled, and sends the image information to the controller. By obtaining the image information of the initial position, basic data is provided for subsequent deviation analysis. The initial position is recorded to facilitate comparison and adjustment in subsequent steps.

[0101] Step S103: Analyze the first image information to confirm the first deviation information between the laser positioning light and the protruding end of the bus bar of the assembly to be assembled.

[0102] Specifically, the controller analyzes the first image information to identify the specific positions of the laser positioning light and the extended end of the busbar. The deviation between the laser positioning light and the extended end of the busbar is calculated to determine the direction and amplitude that need to be adjusted. For example, when the controller analyzes the first image information, it is found that there is a 5 mm deviation between the laser positioning light and the extended end of the busbar, and the deviation direction is to the right. Through image analysis technology, the deviation between the laser positioning light and the extended end of the busbar is accurately calculated, providing a scientific basis for subsequent adjustments. Image analysis technology can reduce the misjudgment that may be caused by human vision and improve the accuracy of positioning.

[0103] Step S104. Control the adjustment module to move the laser positioning module according to the first deviation information, so that the laser positioning light is aligned with the extended end of the bus bar and obtains the second image information collected by the visual collection module.

[0104] Specifically, the adjustment module adjusts the position and angle of the laser positioning module according to the instructions issued by the controller. The visual acquisition module captures the image again to record the alignment of the adjusted laser positioning light with the protruding end of the busbar. For example, the controller sends an instruction to the adjustment module to move it 5 mm to the right to adjust the position of the laser positioning module. After the adjustment is completed, the visual acquisition module captures new image information to confirm whether the laser positioning light is aligned with the protruding end of the busbar. Through fine adjustment of the adjustment module, the laser positioning light is precisely aligned with the protruding end of the busbar. Obtain the adjusted image information to ensure that the adjustment effect meets the requirements and avoid multiple adjustments.

[0105] Step S105: Analyze the second image information to confirm the second deviation information between the laser positioning light and the drilling hole of the back panel glass.

[0106] Specifically, the controller parses the second image information to identify the specific positions of the laser positioning light and the drilling hole of the back glass. The deviation between the laser positioning light and the drilling hole of the back glass is calculated to determine the direction and amplitude that need to be adjusted. For example, when the controller parses the second image information, it is found that there is a 3 mm deviation between the laser positioning light and the drilling hole of the back glass, and the deviation direction is downward. Through secondary positioning, it is ensured that the laser positioning light is aligned not only with the protruding end of the bus bar, but also with the drilling hole of the back glass, thereby improving the accuracy of the assembly. By parsing the image information again, possible cumulative errors are reduced to ensure the accuracy of the final positioning.

[0107] Step S106: Control the adsorption module to move the back panel glass according to the second deviation information, so that the drilling hole of the back panel glass, the laser positioning light and the extended end of the bus bar coincide with each other.

[0108] Specifically, the controller controls the adsorption module to move the back panel glass and adjust its position according to the second deviation information. Ensure that the drilled hole of the back panel glass, the laser positioning light and the extended end of the bus bar are precisely aligned. For example, the controller sends a command to the adsorption module to move it down 3 mm to adjust the position of the back panel glass. After the adjustment is completed, the visual acquisition module captures new image information to confirm whether the three are aligned. By moving the adsorption module, ensure that the drilled hole of the back panel glass is precisely aligned with the extended end of the bus bar to avoid poor electrical connection. One-time precise alignment reduces the possibility of rework and improves production efficiency.

[0109] Step S107: Control the adsorption module to place the back panel glass on the assembly to be assembled, so as to complete the assembly of the back panel glass and the assembly to be assembled.

[0110] Specifically, the controller controls the adsorption module to accurately place the backplane glass on the assembly to be assembled. Ensure that the backplane glass is completely attached to the assembly to complete the assembly operation. If the controller confirms that the laser positioning light, the drilling hole of the backplane glass and the extended end of the busbar coincide, it sends a command to the adsorption module to gently place the backplane glass on the assembly to complete the assembly.

[0111] The precise control of the controller ensures that the back glass is completely attached to the assembly to be assembled, thus improving the quality and reliability of the product. Automated control reduces manual intervention and improves the speed and efficiency of assembly.

[0112] In summary, through the above seven steps, the controller of the laser positioning laminating machine realizes high-precision and high-efficiency alignment and laminating of the back glass and the components to be laminarized. Specifically:

[0113] Steps S101 to S104: The laser positioning module and the adjustment module work together to ensure accurate alignment between the laser positioning light and the extended end of the busbar.

[0114] Steps S105 to S106: Through the coordinated work of the visual acquisition module and the adsorption module, ensure that the drilling hole of the back panel glass is accurately aligned with the laser positioning light and the protruding end of the bus bar.

[0115] Step S107: The final sheet-closing operation is completed by accurately releasing the adsorption module.

[0116] These steps not only improve the accuracy and efficiency of assembly, but also reduce the possibility of human errors and rework, significantly improving the quality and production efficiency of BIPV products.

[0117] In some embodiments, the analysis of the first image information to confirm the first deviation information between the laser positioning light and the protruding end of the bus bar of the assembly to be assembled includes: performing target detection on the first image information to obtain the protruding end center point information corresponding to the bus bar protruding end and the spot center point information corresponding to the laser positioning light; calculating the first deviation information corresponding to the protruding end center point information and the spot center point information; the first deviation information includes horizontal deviation, vertical deviation and angular deviation.

[0118] By making the laser positioning assembly machine accurately analyze the first image information, the coordinates of the center point of the busbar extension and the laser positioning light are obtained, and the horizontal deviation, vertical deviation and angle deviation are calculated. The generated control instructions are used to control the fine-tuning module to make precise adjustments to ensure the precise alignment of the busbar extension and the laser positioning light. It not only improves the positioning accuracy and automation level, but also adapts to complex working environments, significantly improving production efficiency and product quality.

[0119] Exemplarily, the performing target detection on the first image information to obtain the extension end center point information corresponding to the bus bar extension end and the spot center point information corresponding to the laser positioning light includes: extracting the edge information of the bus bar extension end in the first image information according to a preset edge detection algorithm; performing contour recognition on the first image information according to a preset contour corresponding to the bus bar extension end to obtain the contour information corresponding to the bus bar extension end; calculating the extension end center point information according to the edge information and the contour information; extracting a high-brightness area with a brightness greater than a preset brightness in the first image, the high-brightness area being the spot area corresponding to the laser positioning light; and calculating the spot center point information according to the spot area.

[0120] If the Canny edge detection algorithm is used, the edge information of the extension end of the busbar is extracted in the first image. Assume that the edge detection algorithm identifies the four corner points of the extension end of the busbar. According to the preset outline of the extension end of the busbar (assuming it is a rectangle), the first image is contour recognized to obtain the complete outline information of the extension end of the busbar. According to the extracted edge information and outline information, the coordinates of the center point of the extension end of the busbar are calculated. Assume that the calculation result is (x1, y1) = (500, 400). If the brightness threshold is set to 200, the high brightness areas with brightness greater than 200 are extracted in the first image. These areas are the spot areas corresponding to the laser positioning light. According to the geometric center of the spot area, the coordinates of the center point of the spot are calculated. Assume that the calculation result is (x2, y2) = (550, 420). It can be calculated that the angle deviation is approximately 21.8°.

[0121] The edge of the busbar extension can be accurately identified by the preset edge detection algorithm, reducing positioning errors. Contour recognition based on the preset contour further improves the accuracy of the center point position of the busbar extension. By setting the brightness threshold, the center point position of the laser spot can be accurately identified to ensure the accuracy of laser positioning.

[0122] In some embodiments, controlling the adjustment module to move the laser positioning module according to the first deviation information includes: parsing the first image information to obtain the adjustment module center point position information corresponding to the laser positioning light; generating control information according to the adjustment module center point position information and the first deviation information, so as to control the adjustment module to move the laser positioning module until the laser positioning light is aligned with the protruding end of the bus bar according to the control information.

[0123] By parsing the first image information, the center point position of the laser positioning module on the adjustment module is identified (for example, the position of the laser spot in the image captured by the visual acquisition module). Control information is generated based on the center point position information of the adjustment module and the first deviation information: In combination with the center point position information of the adjustment module and the first deviation information (including horizontal deviation, vertical deviation and angular deviation) calculated previously, an instruction for controlling the movement of the adjustment module is generated. The position of the laser positioning module is adjusted according to the control information: The controller sends an instruction to the adjustment module based on the generated control information, causing it to move the laser positioning module until the laser positioning light is aligned with the protruding end of the bus bar.

[0124] Assume that there is a chip assembly to be assembled and a back glass, and the laser positioning light emitted by the laser positioning module is irradiated on the extended end of the busbar of the chip assembly to be assembled. The specific steps are as follows:

[0125] By accurately generating control information based on deviation information, the adjustment module can accurately move the laser positioning module to ensure that the laser positioning light is aligned with the extended end of the busbar. Automated control reduces human intervention and improves the accuracy of alignment. Based on the fast feedback mechanism of image analysis and deviation calculation, the adjustment module can quickly adjust the position of the laser positioning module, reducing the time for multiple adjustments. After each adjustment, the visual acquisition module captures new image information to verify the adjustment effect in real time to ensure the accuracy of alignment. The entire process is automatically completed by the controller, reducing manual operation and improving the automation level of the production process. Through automated control, human errors and operation time are reduced, and production efficiency is improved. Even under complex lighting conditions, the center point position of the laser spot can be accurately identified through image analysis technology to adapt to different working environments. The adjustment module can be adjusted in horizontal, vertical and angular directions to adapt to different deviation conditions, which improves the flexibility and adaptability of the system. Through accurate deviation calculation and rapid adjustment, the success rate of one-time alignment of the laser positioning light and the extended end of the busbar is improved, the possibility of rework is reduced, and the production quality is improved.

[0126] In summary, this embodiment uses image analysis and deviation calculation to accurately control the adjustment module to move the laser positioning module to ensure accurate alignment of the laser positioning light with the extended end of the busbar. This not only improves the accuracy and efficiency of alignment, but also enhances the level of automation, adapts to the diverse production environment requirements, and significantly improves the quality and production efficiency of BIPV products.

[0127] In some embodiments, controlling the adsorption module to move the back panel glass according to the second deviation information includes: parsing the second deviation information to obtain the drilling center coordinates corresponding to the drilling hole of the back panel glass and the light spot center coordinates corresponding to the laser positioning light; generating second control information according to the drilling center coordinates and the light spot center coordinates; controlling the adsorption module to move the back panel glass according to the second control information so that the drilling hole of the back panel glass, the laser positioning light and the extended end of the bus bar coincide with each other.

[0128] Through multi-step image analysis and deviation calculation, each step of adjustment is ensured to be accurate and correct, reducing the possibility of misjudgment. The combination of edge detection and contour recognition technology provides high-precision busbar center coordinates to ensure the accuracy of the final alignment. The automation system can quickly respond to deviation information, generate control instructions and adjust the position of the backplane glass, reducing adjustment time. After each adjustment, the visual acquisition module captures new image information and provides real-time feedback to ensure the accuracy of the final alignment. The entire process is automatically completed by the control system, reducing manual operations and improving the automation level of the production process.

[0129] In summary, this embodiment adjusts the position of the back glass by analyzing the second image information, calculating the deviation information, and generating control information to ensure that the drilling hole of the back glass, the laser positioning light, and the extended end of the busbar are accurately aligned. This not only improves the accuracy and efficiency of alignment, but also enhances the level of automation, adapts to complex working environments, and significantly improves the quality and production efficiency of BIPV products.

[0130] Exemplarily, the generating of the second control information according to the drilling center coordinates and the light spot center coordinates includes: parsing the second image information to obtain the busbar position information corresponding to the extended end of the busbar; obtaining the busbar center coordinates according to the busbar position information; generating the second control information according to the busbar center coordinates, the drilling center coordinates and the light spot center coordinates; the second control information includes horizontal control information, vertical control information and angle control information; the expressions of the horizontal control information, the vertical control information and the angle control information include

[0131] ;

[0132] ;

[0133] ;

[0134] in, is the horizontal control information, is the vertical control information, is the angle control information, ( , ) is the coordinate of the drilling center, ( , ) is the center coordinate of the busbar, ( , ) are the center coordinates of the light spot.

[0135] In some embodiments, the laser positioning laminating machine also includes a support frame and a fine-adjustment module, and the component to be combined is placed on the support frame through the fine-adjustment module; the control of the adsorption module to place the back panel glass on the component to be combined includes: obtaining the third image information collected by the visual acquisition module; parsing the third image information to obtain the overlap information corresponding to the back panel glass and the component to be combined; generating fine-adjustment information according to the overlap information, so as to control the fine-adjustment module to fine-tune the position of the component to be combined according to the fine-adjustment information; after the fine-tuning is completed, controlling the adsorption module to place the back panel glass on the component to be combined, so as to eliminate the overlap between the component to be combined and the back panel glass after lamination.

[0136] The assembly to be combined is placed on the support frame through the fine-adjustment module. The superimposed image of the assembly to be combined and the back glass is captured by the visual acquisition module to generate the third image information. The edge information of the back glass and the assembly to be combined is extracted: the edges of the back glass and the assembly to be combined are extracted using a preset edge detection algorithm (such as Canny edge detection, Sobel operator, etc.). The third image information is contour recognized according to a preset contour (such as a rectangle, a circle, etc.) to obtain the complete contour information of the back glass and the assembly to be combined. According to the extracted edge information and contour information, the overlap difference information between the back glass and the assembly to be combined is calculated. The overlap difference information includes horizontal overlap difference, vertical overlap difference and angular overlap difference. The deviation between the center point of the back glass and the assembly to be combined in the horizontal direction, the deviation between the center point of the back glass and the assembly to be combined in the vertical direction, and the angular deviation between the center point of the back glass and the assembly to be combined are calculated. According to the generated fine-adjustment information, the fine-adjustment module is controlled to fine-tune the assembly to be combined placed on the support frame to eliminate the overlap difference after the combination. After the fine-tuning is completed, the adsorption module is controlled to place the back panel glass on the assembly to be assembled, ensuring that the overlap between the back panel glass and the assembly to be assembled is minimized after the assembly. Through the above embodiments and technical contents, the laser positioning assembly machine can accurately analyze the third image information, obtain the overlap information between the back panel glass and the assembly to be assembled, and generate fine-tuning information to control the fine-tuning module to fine-tune the position. This not only improves the accuracy and automation level of assembly, but also adapts to complex working environments, significantly improving production efficiency and product quality.

[0137] See also Figure 3 As shown, Figure 3 : is a schematic diagram of the structure of the laser positioning device 200 provided in an embodiment of the present application. The laser positioning device 200 is used to perform the steps of the laser positioning method shown in the above embodiments. The laser positioning device 200 can be a single server or a server cluster, or the laser positioning device 200 can be a terminal, which can be a handheld terminal, a laptop computer, a wearable device or a robot, etc.

[0138] like Figure 3 As shown, the laser positioning device 200 includes:

[0139] The light emitting module 201 is used to control the laser positioning module to emit laser positioning light when the adsorption module is controlled to adsorb the back panel glass;

[0140] A first acquisition module 202, used to acquire first image information acquired by a visual acquisition module;

[0141] An information analysis module 203, used to analyze the first image information and confirm first deviation information between the laser positioning light and the extended end of the bus bar;

[0142] A second acquisition module 204 is used to control the adjustment module to move the laser positioning module according to the first deviation information, so that the laser positioning light is aligned with the extended end of the busbar of the assembly to be assembled and obtain the second image information collected by the visual acquisition module;

[0143] A deviation analysis module 205 is used to analyze the second image information and confirm second deviation information between the laser positioning light and the drilling hole of the back plate glass;

[0144] A control movement module 206, configured to control the adsorption module to move the back plate glass according to the second deviation information, so that the drilling hole of the back plate glass, the laser positioning light and the extended end of the bus bar coincide with each other;

[0145] The lamination completion module 207 is used to control the adsorption module to place the back panel glass on the assembly to be laminated, so as to complete the lamination of the back panel glass and the assembly to be laminated.

[0146] It should be noted that technical personnel in the relevant field can clearly understand that, for the convenience and conciseness of description, the specific working process of the laser positioning device and each module described above can refer to the corresponding process in the laser positioning method embodiments described in the above embodiments, and will not be repeated here.

[0147] The above laser positioning method can be implemented in the form of a computer program. Figure 3 Run on the device shown.

[0148] See also Figure 4 , Figure 4 : is a schematic block diagram of the structure of a controller provided in an embodiment of the present application. The controller includes a processor, a memory and a network interface connected via a device bus, wherein the memory may include a storage medium and an internal memory.

[0149] The storage medium can store an operating device and a computer program. The computer program includes program instructions, and when the program instructions are executed, the processor can execute any laser positioning method.

[0150] The processor is used to provide computing and control capabilities and support the operation of the entire controller.

[0151] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor, the processor can execute any laser positioning method.

[0152] The network interface is used for network communication, such as sending assigned tasks, etc. Those skilled in the art will appreciate that Figure 4The structure shown in the figure is only a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the terminal to which the scheme of the present application is applied. The specific controller may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0153] It should be understood that the processor may be a central processing unit (CPU), and the processor may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0154] In one embodiment, the processor is used to run a computer program stored in the memory to implement the following steps:

[0155] When controlling the adsorption module to adsorb the back panel glass, controlling the laser positioning module to emit laser positioning light;

[0156] Acquire first image information acquired by a visual acquisition module;

[0157] Analyze the first image information to confirm first deviation information between the laser positioning light and the extended end of the busbar of the assembly to be assembled;

[0158] Controlling the adjustment module to move the laser positioning module according to the first deviation information so that the laser positioning light is aligned with the extended end of the bus bar and obtaining the second image information collected by the visual collection module;

[0159] Analyze the second image information to confirm second deviation information between the laser positioning light and the drilling hole of the back plate glass;

[0160] Controlling the adsorption module to move the back glass according to the second deviation information so that the drilling hole of the back glass, the laser positioning light and the extended end of the bus bar coincide with each other;

[0161] The adsorption module is controlled to place the back panel glass on the assembly to be assembled, so as to complete the assembly of the back panel glass and the assembly to be assembled.

[0162] In some embodiments, the analysis of the first image information to confirm the first deviation information between the laser positioning light and the protruding end of the bus bar of the assembly to be assembled includes: performing target detection on the first image information to obtain the protruding end center point information corresponding to the bus bar protruding end and the spot center point information corresponding to the laser positioning light; calculating the first deviation information corresponding to the protruding end center point information and the spot center point information; the first deviation information includes horizontal deviation, vertical deviation and angular deviation.

[0163] Exemplarily, the performing target detection on the first image information to obtain the extension end center point information corresponding to the bus bar extension end and the spot center point information corresponding to the laser positioning light includes: extracting the edge information of the bus bar extension end in the first image information according to a preset edge detection algorithm; performing contour recognition on the first image information according to a preset contour corresponding to the bus bar extension end to obtain the contour information corresponding to the bus bar extension end; calculating the extension end center point information according to the edge information and the contour information; extracting a high-brightness area with a brightness greater than a preset brightness in the first image, the high-brightness area being the spot area corresponding to the laser positioning light; and calculating the spot center point information according to the spot area.

[0164] In some embodiments, controlling the adjustment module to move the laser positioning module according to the first deviation information includes: parsing the first image information to obtain the adjustment module center point position information corresponding to the laser positioning light; generating control information according to the adjustment module center point position information and the first deviation information, so as to control the adjustment module to move the laser positioning module until the laser positioning light is aligned with the protruding end of the bus bar according to the control information.

[0165] In some embodiments, controlling the adsorption module to move the back panel glass according to the second deviation information includes: parsing the second deviation information to obtain the drilling center coordinates corresponding to the drilling hole of the back panel glass and the light spot center coordinates corresponding to the laser positioning light; generating second control information according to the drilling center coordinates and the light spot center coordinates; controlling the adsorption module to move the back panel glass according to the second control information so that the drilling hole of the back panel glass, the laser positioning light and the extended end of the bus bar coincide with each other.

[0166] Exemplarily, the generating of the second control information according to the drilling center coordinates and the light spot center coordinates includes: parsing the second image information to obtain the busbar position information corresponding to the extended end of the busbar; obtaining the busbar center coordinates according to the busbar position information; generating the second control information according to the busbar center coordinates, the drilling center coordinates and the light spot center coordinates; the second control information includes horizontal control information, vertical control information and angle control information; the expressions of the horizontal control information, the vertical control information and the angle control information include

[0167] ;

[0168] ;

[0169] ;

[0170] in, is the horizontal control information, is the vertical control information, is the angle control information, ( , ) is the coordinate of the drilling center, ( , ) is the center coordinate of the busbar, ( , ) are the center coordinates of the light spot.

[0171] In some embodiments, the laser positioning laminating machine also includes a support frame and a fine-adjustment module, and the component to be combined is placed on the support frame through the fine-adjustment module; the control of the adsorption module to place the back panel glass on the component to be combined includes: obtaining the third image information collected by the visual acquisition module; parsing the third image information to obtain the overlap information corresponding to the back panel glass and the component to be combined; generating fine-adjustment information according to the overlap information, so as to control the fine-adjustment module to fine-tune the position of the component to be combined according to the fine-adjustment information; after the fine-tuning is completed, controlling the adsorption module to place the back panel glass on the component to be combined, so as to eliminate the overlap between the component to be combined and the back panel glass after lamination.

[0172] The present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the processor implements the steps of the laser positioning method described in the first aspect above.

[0173] The computer-readable storage medium may be an internal storage unit of the controller described in the foregoing embodiment, such as a hard disk or memory of the controller. The computer-readable storage medium may also be an external storage device of the controller, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc., equipped on the controller.

[0174] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A laser positioning method, characterized in that: A controller applied to a laser positioning laminating machine, the laser positioning laminating machine further comprising a plurality of adsorption modules, a plurality of support modules, a laser positioning module, an adjustment module and a visual acquisition module, wherein the plurality of adsorption modules are used to cooperatively place a back panel glass on a component to be laminated, so as to complete the laminating of the back panel glass and the component to be laminated; at least one of the support modules is arranged on one of the adsorption modules; the laser positioning module is movably arranged in the support module, and is used to emit a laser positioning light; the adjustment module is arranged on the support module and is connected to the laser positioning module, and is used to adjust the position and angle of the laser positioning module; the visual acquisition module faces the back panel glass and the component to be laminated, and is used to collect laminating image information, and the laminating image information at least includes the back panel glass, the component to be laminated and the laser positioning light; the controller is electrically connected to the adsorption module, the laser positioning module, the adjustment module and the visual acquisition module; the method comprises: When controlling the adsorption module to adsorb the back panel glass, controlling the laser positioning module to emit laser positioning light; Acquire first image information acquired by a visual acquisition module; Analyze the first image information to confirm first deviation information between the laser positioning light and the extended end of the busbar of the assembly to be assembled; Controlling the adjustment module to move the laser positioning module according to the first deviation information so that the laser positioning light is aligned with the extended end of the bus bar and obtaining the second image information collected by the visual collection module; Analyze the second image information to confirm second deviation information between the laser positioning light and the drilling hole of the back plate glass; Controlling the adsorption module to move the back panel glass according to the second deviation information includes: parsing the second deviation information, obtaining the drilling center coordinates corresponding to the drilling hole of the back panel glass and the light spot center coordinates corresponding to the laser positioning light; generating second control information according to the drilling center coordinates and the light spot center coordinates, including: parsing the second image information, obtaining the bus bar position information corresponding to the extended end of the bus bar; obtaining the bus bar center coordinates according to the bus bar position information; generating second control information according to the bus bar center coordinates, the drilling center coordinates and the light spot center coordinates; the second control information includes horizontal control information, vertical control information and angle control information; the expressions of the horizontal control information, the vertical control information and the angle control information include: ； ； ； in, For horizontal control information, For vertical control information, is the angle control information, ( , ) is the coordinate of the drilling center, ( , ) is the center coordinate of the busbar, ( , ) is the center coordinate of the light spot; according to the second control information, the adsorption module is controlled to move the back plate glass so that the drilling hole of the back plate glass, the laser positioning light and the extended end of the bus bar coincide with each other; so that the drilling hole of the back plate glass, the laser positioning light and the extended end of the bus bar coincide with each other; The adsorption module is controlled to place the back panel glass on the assembly to be assembled, so as to complete the assembly of the back panel glass and the assembly to be assembled.

2. The method according to claim 1, characterized in that The analyzing the first image information to confirm the first deviation information between the laser positioning light and the extended end of the busbar of the assembly to be assembled includes: Performing target detection on the first image information to obtain the center point information of the extended end corresponding to the extended end of the bus bar and the center point information of the spot corresponding to the laser positioning light; Calculate the first deviation information corresponding to the center point information of the extended end and the center point information of the spot; the first deviation information includes horizontal deviation, vertical deviation and angle deviation.

3. The method according to claim 2, characterized in that The performing target detection on the first image information to obtain the extension end center point information corresponding to the extension end of the bus bar and the spot center point information corresponding to the laser positioning light includes: Extracting edge information of the extended end of the bus bar from the first image information according to a preset edge detection algorithm; Performing contour recognition on the first image information according to a preset contour corresponding to the extended end of the bus bar to obtain contour information corresponding to the extended end of the bus bar; Calculate the center point information of the extended end according to the edge information and the contour information; Extracting a high brightness area with a brightness greater than a preset brightness from the first image, wherein the high brightness area is a spot area corresponding to the laser positioning light; The spot center point information is calculated according to the spot area.

4. The method according to claim 1, characterized in that: The step of controlling the adjustment module to move the laser positioning module according to the first deviation information includes: Analyze the first image information to obtain the center point position information of the adjustment module corresponding to the laser positioning light; Control information is generated according to the center point position information of the adjustment module and the first deviation information, so as to control the adjustment module to move the laser positioning module until the laser positioning light is aligned with the extended end of the bus bar according to the control information.

5. The method according to claim 1, characterized in that The laser positioning wafer assembly machine further comprises a support frame and a micro-adjustment module, and the wafer assembly to be assembled is placed on the support frame via the micro-adjustment module; The step of controlling the adsorption module to place the back panel glass on the assembly to be assembled comprises: Acquire third image information acquired by the visual acquisition module; Analyze the third image information to obtain the overlap difference information corresponding to the back panel glass and the assembly to be assembled; Generating fine-adjustment information according to the overlap difference information, so as to control the fine-adjustment module to fine-adjust the position of the assembly to be assembled according to the fine-adjustment information; After the fine adjustment is completed, the adsorption module is controlled to place the back panel glass on the assembly to be combined, so as to eliminate the overlap difference between the assembly to be combined and the back panel glass after the combination.

6. The method according to claim 1, characterized in that The laser positioning laminating machine also includes: The cover body is arranged on the outside of the adsorption module, the support module, the laser positioning module, the adjustment module and the controller, so that the laser positioning laminating machine can complete the laminating of the back panel glass and the assembly to be laminarized in a darkroom environment.

7. A laser positioning device, characterized in that: A controller for a laser positioning laminating machine; the laser positioning laminating machine further comprises a plurality of adsorption modules, a plurality of support modules, a laser positioning module, an adjustment module and a visual acquisition module, wherein the plurality of adsorption modules are used to cooperatively place the back panel glass on the assembly to be laminated, so as to complete the laminating of the back panel glass and the assembly to be laminated; at least one of the support modules is arranged on one of the adsorption modules; the laser positioning module is movably arranged in the support module, and is used to emit laser positioning light; the adjustment module is arranged on the support module and is connected to the laser positioning module, and is used to adjust the position and angle of the laser positioning module; the visual acquisition module faces the back panel glass and the assembly to be laminated, and is used to collect laminating image information, and the laminating image information at least comprises the back panel glass, the assembly to be laminated and the laser positioning light; the controller is electrically connected to the adsorption module, the laser positioning module, the adjustment module and the visual acquisition module; the device comprises: The light emitting module is used to control the laser positioning module to emit laser positioning light when the adsorption module is controlled to adsorb the back panel glass; A first acquisition module, used to acquire first image information acquired by the visual acquisition module; An information analysis module, used for analyzing the first image information and confirming first deviation information between the laser positioning light and the extended end of the busbar; A second acquisition module, configured to control the adjustment module to move the laser positioning module according to the first deviation information, so that the laser positioning light is aligned with the extended end of the busbar of the assembly to be assembled and acquire the second image information acquired by the visual acquisition module; a deviation analysis module, used for analyzing the second image information to confirm second deviation information between the laser positioning light and the drilling hole of the back plate glass; A control movement module, used for controlling the adsorption module to move the back plate glass according to the second deviation information, including: parsing the second deviation information, obtaining the drilling center coordinates corresponding to the drilling hole of the back plate glass and the light spot center coordinates corresponding to the laser positioning light; generating second control information according to the drilling center coordinates and the light spot center coordinates, including: parsing the second image information, obtaining the bus bar position information corresponding to the extended end of the bus bar; obtaining the bus bar center coordinates according to the bus bar position information; generating second control information according to the bus bar center coordinates, the drilling center coordinates and the light spot center coordinates; the second control information includes horizontal control information, vertical control information and angle control information; the expressions of the horizontal control information, the vertical control information and the angle control information include: ； ； ； in, For horizontal control information, For vertical control information, is the angle control information, ( , ) is the coordinate of the drilling center, ( , ) is the center coordinate of the busbar, ( , ) is the center coordinate of the light spot; according to the second control information, the adsorption module is controlled to move the back plate glass so that the drilling hole of the back plate glass, the laser positioning light and the extended end of the bus bar coincide with each other; so that the drilling hole of the back plate glass, the laser positioning light and the extended end of the bus bar coincide with each other; The lamination completion module is used to control the adsorption module to place the back panel glass on the assembly to be laminated, so as to complete the lamination of the back panel glass and the assembly to be laminated.

8. A controller, characterized in that: The controller comprises a memory and a processor, wherein the memory is used to store a computer program, and the processor is used to execute the computer program and implement the method according to any one of claims 1 to 6 when executing the computer program.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, which, when executed by a processor, enables the processor to implement the method according to any one of claims 1 to 6.

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