Drum-type liquid-cooled phase-change radiator and manufacturing method thereof

Abstract

The present invention discloses a roller-type liquid-cooled phase-change radiator and a manufacturing method thereof, comprising an evaporation-condensation end and a heat dissipation end; the condensation plate is fixedly connected to the lower body to form an evaporation-condensation chamber, and the condensation plate is fixedly connected to the upper body to form a first heat dissipation chamber, and the heat dissipation component comprises at least one fixed bracket, a rotating shaft and at least one heat dissipation plate, and the heat dissipation plate rotates about the central axis of the rotating shaft. The roller-type liquid-cooled phase-change radiator provided by the present invention, by designing a new heat dissipation component, transfers the heat on the chip to the heat dissipation end through the principle of phase change heat absorption and heat release of liquid medium and capillary circuit liquid absorption at the evaporation-condensation end, and drives the flow of the second liquid medium at the heat dissipation end by the rotation of the heat dissipation plate, thereby dissipating the heat on the chip more quickly and efficiently, and greatly improving the heat dissipation power and temperature uniformity performance without increasing the volume of the original radiator.

Description

Technical Field

[0001] The present invention relates to the technical field of radiators, and in particular to a drum-type liquid-cooled phase-change radiator and a manufacturing method thereof. Background Art

[0002] With the development of data centers and artificial intelligence technologies, high computing power such as edge computing, AI, and supercomputing continues to develop. The demand for high computing power has driven the development of mainstream computing chips. The power consumption of computing chips and servers has also increased accordingly. The power density and energy consumption of single-machine data centers are also constantly rising. This puts higher demands on the cooling and heat dissipation systems of servers and chips. Traditional air-cooled radiators can no longer meet the heat dissipation needs of high-computing power and high-density data centers, and liquid cooling has come into being.

[0003] Liquid cooling technology uses liquid instead of air to remove heat generated by servers and other equipment during operation. However, due to the limitations of radiator size, how to continuously increase heat dissipation power without increasing the size of the radiator has become a pressing issue in this field. Summary of the Invention

[0004] In response to the above-mentioned problems, the purpose of the present invention is to provide a roller-type liquid-cooled phase-change radiator and a manufacturing method thereof. By designing a roller-type heat dissipation component at the heat dissipation end, a new liquid-cooled phase-change radiator is designed, so that the heat dissipation power of the liquid-cooled phase-change radiator is higher and the heat dissipation is more uniform.

[0005] To achieve the above object, the present invention provides a drum-type liquid-cooled phase-change radiator, comprising an evaporation and condensation end and a heat dissipation end;

[0006] The evaporation and condensation end includes a condensation plate and a lower body, wherein the condensation plate and the lower body are fixedly connected to form an evaporation and condensation chamber, a first capillary structure is provided on the inner wall of the evaporation and condensation chamber, and a first liquid medium is provided inside the evaporation and condensation chamber;

[0007] The heat dissipation end includes an upper body, a condensation plate and a heat dissipation assembly, wherein the condensation plate and the upper body are fixedly connected to form a first heat dissipation cavity, the upper body is provided with at least one first liquid inlet and at least one first liquid outlet, and the evaporation and condensation cavity are not connected to the first heat dissipation cavity;

[0008] The heat dissipation assembly includes at least one fixed bracket, a rotating shaft and at least one heat dissipation plate. The fixed bracket is fixedly connected between the upper body and the condensing plate. The heat dissipation plate is connected to the fixed bracket through the rotating shaft and rotates along the central axis of the rotating shaft with the fixed bracket.

[0009] Preferably, the heat dissipation plate includes a first heat dissipation plate and a second heat dissipation plate, the first heat dissipation plate is provided with a first protrusion, and the second heat dissipation plate is provided with a second protrusion matching the first protrusion. After the first heat dissipation plate and the second heat dissipation plate are fixedly connected, the first protrusion and the second protrusion form a second heat dissipation cavity that is connected to each other.

[0010] Preferably, a circular rotating frame is provided on the fixed bracket, and a second liquid inlet and a second liquid outlet are provided on the circular rotating frame, and the second liquid inlet and the second liquid outlet are communicated with the second heat dissipation cavity.

[0011] Preferably, the heat dissipation plate is arranged in a spiral shape, and a plurality of guide grooves are provided on the heat dissipation plate.

[0012] Preferably, the heat dissipation plate is configured in a plate shape, there are more than two heat dissipation plates, and they are evenly distributed on the rotating shaft, and a plurality of guide grooves are provided on the heat dissipation plate.

[0013] Preferably, a groove is provided at the edge of the opposite surface of the heat sink and the rotating shaft, and an elastic flipper is installed in the groove. The edge of the flipper is parallel to the edge of the heat sink, and the flipper is made of elastic material.

[0014] Preferably, a gap is provided between the rotating shaft and the heat dissipation plate, and a gap is provided between the heat dissipation plate and the inner wall of the first heat dissipation cavity.

[0015] Preferably, a second liquid medium is provided in the first heat dissipation cavity, and a third liquid medium is provided in the second heat dissipation cavity. The first liquid medium is one of water, brine, diethyl ether or acetone, and the second liquid medium is one of water, brine, diethyl ether or acetone, or a mixture thereof with antifreeze.

[0016] The present invention provides a method for manufacturing a drum-type liquid-cooled phase-change radiator, comprising the following steps:

[0017] S1, sintering the first capillary structure, sintering the upper capillary layer and the lower surface of the condensation plate, and sintering the lower capillary layer and the lower body to form the first capillary structure,

[0018] S2, making the evaporation and condensation end, welding the bottom of the condensation plate to the lower body to form a closed evaporation and condensation chamber, and sintering the first capillary structure in step S1 on the inner wall of the evaporation and condensation chamber to obtain the evaporation and condensation end,

[0019] S3, the production of the first heat dissipation cavity, the upper surface of the condensation plate is welded to the upper body to form the first heat dissipation cavity,

[0020] S4, making the heat dissipation end, fixing the fixed bracket between the upper body and the condenser plate, installing the heat dissipation plate on the rotating shaft, connecting the rotating shaft to the fixed bracket, fixing the heat dissipation component in the first heat dissipation cavity to form the heat dissipation end,

[0021] S5, helium side leakage inspection, there is a liquid injection port on the inner wall of the evaporation condensation chamber, helium is injected into the evaporation condensation chamber through the liquid injection port to detect whether there is side leakage, if there is side leakage, the side leakage is handled, if there is no side leakage, the helium inspection is completed.

[0022] S6, injecting the first liquid medium and evacuating the vacuum: injecting the first liquid medium into the evaporation and condensation chamber through the liquid injection port, then evacuating the evaporation and condensation chamber, and welding the liquid injection port to keep the evaporation and condensation chamber sealed.

[0023] Preferably, the method further comprises the following steps:

[0024] S41. Fabrication of a heat sink. The first heat sink and the second heat sink are flat plates. A first protrusion is fabricated on the first heat sink, and a second protrusion is fabricated on the second heat sink. The first protrusion is matched with the second protrusion, and the area outside the first protrusion and the second protrusion is welded to obtain a plate-shaped heat sink. The heat sink is provided with a second heat dissipation cavity consisting of the first protrusion and the second protrusion, and is provided with a second liquid inlet and a second liquid outlet. The heat sink is then connected to a rotating shaft.

[0025] When the heat dissipation plate is arranged in a spiral shape, the heat dissipation plate in S41 is rotated into the spiral shape and then connected to the rotating shaft.

[0026] The beneficial effects of the present invention are as follows: the roller-type liquid-cooled phase-change radiator and the manufacturing method thereof provided by the present invention design a new liquid-cooled phase-change radiator by designing a roller-type heat dissipation component at the heat dissipation end. The heat dissipation component includes at least one fixed bracket, a rotating shaft and a heat dissipation plate. The rotation of the rotating shaft drives the heat dissipation plate to rotate together, thereby driving the second liquid medium in the first heat dissipation cavity to rotate. The continuous rotating flow of the second liquid medium in the first heat dissipation cavity improves the heat dissipation power of the heat dissipation end, and achieves the effect of uniform temperature heat dissipation. Moreover, the closer the second liquid medium is to the heat source position, the higher its temperature. As the heat dissipation plate rotates, the distance of the second liquid medium from the heat source changes continuously, thereby driving the second liquid medium to have a relatively uniform temperature as a whole, improving the uniform temperature performance of the radiator heat dissipation, and greatly improving the heat dissipation power and uniform temperature performance without increasing the volume of the original radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings illustrate exemplary embodiments of the present invention and together with the description serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0028] Figure 1 Schematic diagram of the internal structure of the drum-type liquid-cooled phase-change radiator in Example 1;

[0029] Figure 2 Schematic diagram of the external structure of the drum-type liquid-cooled phase-change radiator in Example 1;

[0030] Figure 3 for Figure 1 A partial enlarged schematic diagram in the middle;

[0031] Figure 4 This is a schematic diagram of the structure of the heat dissipation plate in the plate-shaped state in Example 1;

[0032] Figure 5 for Figure 4 Schematic cross-section in the middle BB direction;

[0033] Figure 6 A schematic diagram of a drum-type liquid-cooled phase-change radiator manufacturing method in Example 1;

[0034] Figure 7 Schematic diagram of the internal structure of the drum-type liquid-cooled phase-change radiator in Example 2. DETAILED DESCRIPTION

[0035] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the relevant content and are not intended to limit the present invention. It should also be noted that, for ease of description, only portions relevant to the present invention are shown in the accompanying drawings.

[0036] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0037] Example 1: Please refer to Figures 1 to 6 , this embodiment 1 includes:

[0038] A drum-type liquid-cooled phase-change radiator, comprising an evaporation-condensation end and a heat dissipation end;

[0039] The evaporation and condensation end includes a condensation plate 1 and a lower body 2. The condensation plate 1 and the lower body 2 are fixedly connected to form an evaporation and condensation chamber 3. A first capillary structure 12 is provided on the inner wall of the evaporation and condensation chamber 3. A first liquid medium (not shown in the figure) is provided inside the evaporation and condensation chamber 3.

[0040] The heat dissipation end includes an upper body 4, a condensation plate 1 and a heat dissipation assembly. The condensation plate 1 and the upper body 4 are fixedly connected to form a first heat dissipation cavity 5. The upper body 4 is provided with at least one first liquid inlet 41 and at least one first liquid outlet 42. The evaporation and condensation cavity 3 and the first heat dissipation cavity 5 are not connected to each other.

[0041] The heat dissipation assembly includes at least one fixed bracket 61, a rotating shaft 62 and a heat dissipation plate 7. The fixed bracket 61 is fixedly connected between the upper body 4 and the condensing plate 1. The heat dissipation plate 7 is connected to the fixed bracket 61 through the rotating shaft 62, and rotates synchronously with the fixed bracket 61 with the central axis of the rotating shaft 62. The first heat dissipation cavity 5 is filled with a second liquid medium, which can be injected from the first liquid inlet 41 and flow out from the first liquid outlet 42, forming a circulation in the first heat dissipation cavity 5 for heat dissipation. The heat dissipation assembly also includes a drive motor 63 connected to the rotating shaft 62.

[0042] Specifically in this embodiment 1, the heat dissipation component is located inside the first heat dissipation cavity 5, the condensation plate 1 and the lower body 2 are fixedly connected to form an evaporation-condensation cavity 3, the interior of the evaporation-condensation cavity 3 is provided with a first liquid medium, the lower body 2 is in contact with the chip 200 (heat source) below, the condensation plate 1 and the upper body 4 are fixedly connected to form the first heat dissipation cavity 5, the evaporation-condensation cavity 3 and the first heat dissipation cavity 5 are not connected to each other, the interior of the evaporation-condensation cavity 3 is vacuumed, there is no requirement for the internal pressure of the first heat dissipation cavity 5, and normal air pressure is sufficient. The fixed bracket 61 is located on the condensation plate 1 and is located inside the first heat dissipation cavity 5.

[0043] In the non-working state, the first liquid medium (not marked in the figure) is in liquid state and is mainly located in the first capillary structure 12. The inside of the evaporation and condensation chamber 3 is evacuated. Due to technical limitations, it can only be evacuated as much as possible at this stage, and it is impossible to achieve an absolute vacuum state. When the pressure in the evaporation and condensation chamber 3 is within 0.06, it is considered to be in a vacuum state, which meets the requirements of the radiator. In the working state, due to the low pressure in the evaporation and condensation chamber 3, the very low temperature will cause the first liquid medium in the evaporation and condensation chamber 3 to undergo a phase change, from liquid to gas. In this embodiment, water is selected as the first liquid medium. During the phase change process of water becoming water vapor, it absorbs the heat of the chip 200. The water vapor flows upward in the evaporation and condensation chamber 3, and the heat on the chip 200 is also conducted and diffused upward. When the water vapor contacts the lower surface of the condensation plate 1 upward, the heat is conducted to the heat dissipation end above through the condensation plate 1. The upper surface of the condensation plate 1 is provided with a heat dissipation component. , a second liquid medium is provided in the first heat dissipation cavity 5, and the heat dissipation component and the second liquid medium jointly dissipate heat, thereby quickly diffusing the heat, reducing the temperature in the first heat dissipation cavity 5, thereby reducing the temperature of the condensation plate 1. At this time, the water vapor in contact with the condensation plate 1 releases heat and turns into liquid water, which flows back to the lower body 2 through the first capillary structure 12, and encounters the high-temperature chip 200 again, and turns into water vapor again, and the cycle repeats, continuously diffusing the heat of the chip 200 and reducing the temperature of the chip 200. By combining the evaporation and condensation cavity 3 and the first heat dissipation cavity 5, the heat on the chip 200 is transferred to the heat dissipation end through the evaporation and condensation cavity 3, and the heat is diffused through the first heat dissipation cavity 5 and the second liquid medium. The rotation of the heat dissipation component drives and accelerates the flow of the second liquid medium, thereby diffusing the heat more efficiently, significantly improving the heat dissipation power, and making the heat dissipation more efficient, faster and more uniform.

[0044] In this embodiment, the heat source is chip 200, but other heat sources are also possible depending on actual needs. Chip 200 is placed on the lower surface of lower body 2. During operation of the integrated circuit, chip 200 generates a large amount of heat, causing the temperature to rise. The evaporation-condensation chamber 3 is sealed and isolated from the first heat dissipation chamber 5. This ensures that the pressure in the evaporation-condensation chamber 3 is relatively low, while the first heat dissipation chamber 5 can be maintained at a natural pressure, thus requiring a low pressure.

[0045] The second liquid medium (not marked in the figure) is located in the first heat dissipation cavity 5 and dissipates heat together with the heat dissipation component. The driving motor 63 drives the heat dissipation plate 7 to rotate. The heat dissipation plate 7 is arranged in a spiral shape, and the rotating shaft 62 is placed horizontally. The spiral heat dissipation plate 7 also rotates along the horizontal axis. During the rotation of the heat dissipation plate 7, the second liquid medium in the first heat dissipation cavity 5 will be driven to rotate and flow. The closer the second liquid medium is to the chip 200, the higher its temperature. As the heat dissipation plate 7 rotates, the distance between the second liquid medium and the chip 200 continues to change, thereby driving the overall temperature of the second liquid medium to be relatively uniform. While continuously accelerating the temperature drop of the second liquid medium in the first heat dissipation cavity 5, it also improves the temperature uniformity of the heat dissipation of the heat dissipation cavity, and the heat dissipation efficiency is higher.

[0046] The heat dissipation plate 7 includes a first heat dissipation plate 71 and a second heat dissipation plate 72. The first heat dissipation plate 71 is provided with a first protrusion 73, and the second heat dissipation plate 72 is provided with a second protrusion 74 that cooperates with the first protrusion 73. After the first heat dissipation plate 71 and the second heat dissipation plate 72 are fixedly connected, the first protrusion 73 and the second protrusion 74 form a second heat dissipation cavity 8 that is connected. The second heat dissipation cavity 8 can be air, or it can be filled with cooling liquid or gas as needed. The space of the second heat dissipation cavity 8 can separate adjacent second liquid media, which is conducive to reducing the temperature of the second liquid medium.

[0047] A circular rotating frame 64 is provided on the fixed bracket 61, and a second liquid inlet 43 and a second liquid outlet 44 are provided on the circular rotating frame 64. The second liquid inlet 43 and the second liquid outlet 44 are communicated with the second heat dissipation cavity 8. During the rotation of the heat dissipation plate 7, the circular rotating frame 64 rotates synchronously with the heat dissipation plate 7, thereby ensuring that the second liquid inlet 43, the second liquid outlet 44 and the second heat dissipation cavity 8 are in an internally communicated state. When the chip 200 needs to be cooled rapidly or the heat dissipation power requirement is higher, a lower temperature liquid is injected into the second heat dissipation cavity 8, and the second liquid inlet 43, the second liquid outlet 44 and the second heat dissipation cavity 8 can form a heat dissipation cycle. Through the flow of lower temperature liquid, the temperature in the second heat dissipation cavity 8 can be reduced more quickly and efficiently.

[0048] In this embodiment 1, the heat sink 7 is arranged in a spiral shape, and a plurality of guide grooves 65 are provided on the heat sink 7. The guide grooves 65 are waist-shaped slots or through holes. The guide grooves 65 are arranged in an area other than the second heat sink cavity 8 and cannot destroy the sealing performance of the second heat sink cavity 8. During the rotation of the heat sink 7, the second liquid medium in the first heat sink cavity 5 will be driven to flow. The guide grooves 65 can separate the flowing second liquid medium, so that the flow trajectory and flow speed of the second liquid medium are different, and the temperature difference of the second liquid medium increases. The increase in temperature difference also accelerates the flow of heat, accelerates the temperature reduction, and the heat dissipation power is better.

[0049] A groove is provided at the edge of the opposite surface of the heat sink 7 and the rotating shaft 62, and an elastic fin 75 is installed in the groove. The edge of the fin 75 is parallel to the edge of the heat sink 7. The fin 75 is made of elastic material, and the elastic material is pressed from rubber or plastic. The fin 75 increases the force of the second liquid medium during rotation, increases the flow trajectory of the second liquid medium, and thus improves the heat dissipation power. A plurality of gaps 76 are provided at the edge of the fin 75. Similarly, the gap 76 can further increase the flow trajectory of the second liquid medium and improve the overall heat dissipation power of the radiator.

[0050] In short, the radiator in this embodiment transfers the heat on the chip 200 to the heat dissipation end through the principle of phase change of liquid medium absorbing and releasing heat and capillary circuit absorption of liquid at the evaporation and condensation end. At the heat dissipation end, the rotation of the heat dissipation plate 7 drives the second liquid medium in the first heat dissipation cavity 5 to flow, thereby diffusing the heat on the chip 200 more quickly and efficiently, solving the problem of high-power heat dissipation, and improving the temperature uniformity effect while increasing the heat dissipation power.

[0051] There are two fixing brackets 61, which are fixedly connected to the inner wall of the first heat dissipation cavity 5 respectively. The heat dissipation plate 7 is connected between the fixing brackets 61, and the rotating shaft 62 is located between the fixing brackets 61. The heat dissipation component structure is more solid and durable.

[0052] A gap is provided between the rotating shaft 62 and the heat dissipation plate 7, and a gap is provided between the heat dissipation plate 7 and the inner wall of the first heat dissipation cavity 5. The heat dissipation plate 7 is connected to the fixed bracket 61 or the rotating shaft 62. In this embodiment, the heat dissipation plate 7 is connected to the rotating shaft 62 and rotates synchronously with the fixed bracket 61 with the central axis of the rotating shaft 62. The setting of the above-mentioned gap facilitates the flow of the second liquid medium.

[0053] A second liquid medium is provided in the first heat dissipation cavity 5, and a third liquid medium is provided in the second heat dissipation cavity 8. The first liquid medium is one of water, brine, diethyl ether or acetone, and the second liquid medium is one of water, brine, diethyl ether or acetone, or a mixture thereof with an antifreeze agent. The third liquid medium can be selected from one or more of the above.

[0054] The evaporation and condensation end also includes a plurality of support columns 9, the two ends of the support columns 9 are respectively fixedly connected to the condensation plate 1 and the lower body 2, and a second capillary structure is provided on the outer wall of the support column 9. The support column 9 is configured to be a cylindrical, prismatic or pyramidal structure. The second capillary structure is communicated with the first capillary structure 12 at the connection. During the upward flow of water vapor in the evaporation and condensation chamber 3, the pressure in the evaporation and condensation chamber 3 increases. The support column 9 can strengthen the strength inside the lower body 2 to prevent the condensation plate 1 and the lower body 2 from deformation or damage. The second capillary structure is communicated with the first capillary structure 12 at the connection. The second capillary structure can increase the retention volume of the first liquid medium in the evaporation and condensation chamber 3, and at the same time, increase the reflux volume of the first liquid medium per unit time, thereby improving the heat dissipation power of the radiator.

[0055] The radiator is provided with a first liquid inlet 41 and a first liquid outlet 42, and a driving device and a connecting pipe are provided outside the first heat dissipation cavity 5. The first liquid inlet 41 and the first liquid outlet 42 are connected to the driving device and the connecting pipe outside the heat dissipation end. Driven by the driving device, the second liquid medium circulates in the first heat dissipation cavity 5 and the connecting pipe, contacts with the second liquid medium through the heat dissipation component, and diffuses the heat on the chip 200 to the heat dissipation end in the evaporation and condensation cavity 3 through the principle of phase change of the first liquid medium and capillary loop liquid absorption. At the heat dissipation end, the heat dissipation is combined through the heat dissipation component and the circulation of the second liquid medium, and the flow rate of the second liquid medium can be set to achieve rapid heat dissipation and high-power heat dissipation, thereby greatly improving the heat dissipation power of the radiator.

[0056] The manufacturing method of the drum-type liquid-cooled phase-change radiator of this embodiment 1 comprises the following steps:

[0057] S1, sintering the first capillary structure 12, sintering the upper capillary layer and the lower surface of the condensation plate 1, and sintering the lower capillary layer and the lower body 2 to form the first capillary structure 12,

[0058] S2, the production of the evaporation and condensation end, the lower surface of the condensation plate 1 is welded to the lower body 2 to form a closed evaporation and condensation chamber 3, the inner wall of the evaporation and condensation chamber 3 is sintered with the first capillary structure 12 in step S1, and the evaporation and condensation end is obtained.

[0059] S3, the first heat dissipation cavity 5 is made by welding the upper surface of the condensation plate 1 to the upper body 4 to form the first heat dissipation cavity 5.

[0060] S4, the production of the heat dissipation end, the fixed bracket 61 is fixedly connected between the upper body 4 and the condenser plate 1, the heat dissipation plate 7 is installed on the rotating shaft 62, the rotating shaft 62 is connected to the fixed bracket 61, and the heat dissipation component is fixed in the first heat dissipation cavity 5 to form the heat dissipation end,

[0061] S5, helium side leakage inspection, there is a liquid injection port on the inner wall of the evaporation condensation chamber 3, helium is injected into the evaporation condensation chamber 3 through the liquid injection port to detect whether there is side leakage, if there is side leakage, the side leakage is processed, if there is no side leakage, the helium inspection is completed,

[0062] S6, injecting the first liquid medium and evacuating the vacuum: injecting the first liquid medium into the evaporation and condensation chamber 3 through the liquid injection port, and then evacuating the evaporation and condensation chamber 3, welding the liquid injection port to keep the evaporation and condensation chamber 3 sealed.

[0063] S41. Production of the heat sink 7. The first heat sink 71 and the second heat sink 72 are flat plates. A first protrusion 73 is made on the first heat sink 71, and a second protrusion 74 is made on the second heat sink 72. The first protrusion 73 is matched with the second protrusion 74, and the area outside the first protrusion 73 and the second protrusion 74 is welded to obtain a plate-shaped heat sink. The heat sink is provided with a second heat dissipation cavity 8 consisting of the first protrusion 73 and the second protrusion 74, and is provided with a second liquid inlet 43 and a second liquid outlet 44. When the heat sink 7 is set into a spiral shape, the heat sink in S41 is rotated into a spiral shape, and then the heat sink is connected to the rotating shaft 62.

[0064] Of course, considering the convenience of transportation and storage of the radiator, the radiator can also include a connecting joint 100. The connecting joint 100 is used in conjunction with the first liquid inlet 41 and the first liquid outlet 42. When the radiator is transported or stored, the drive device and the connecting pipe can be independently retracted and extended, and do not need to be fixedly connected to the heat dissipation end. At this time, in order to dustproof the first heat dissipation cavity 5, the connecting joint 100 is connected to the first liquid inlet 41 and the first liquid outlet 42, so that the first heat dissipation cavity 5 is in a sealed state. Moreover, according to actual heat dissipation requirements, when the heat dissipation requirements can be met without using the connecting pipe, the connecting pipe can also be omitted, and the first heat dissipation cavity 5 can be kept in a sealed state by the connecting joint 100. Of course, during the transportation and storage of the radiator, the second liquid medium can also be stored independently. Before the radiator is used, the second liquid medium can be injected into the first heat dissipation cavity 5 through the first liquid inlet 41. Tap water can also be used as the second liquid medium. Therefore, the radiator does not need to be injected with the second liquid medium during the production process or transportation process, and can be injected before use.

[0065] Example 2, please refer to Figure 7 The difference between it and the present embodiment 1 is that in the embodiment 1, the heat dissipation plate 7 is arranged in a spiral shape, while in the present embodiment 2, the heat dissipation plate 7 is arranged in a plate shape. There are more than 2 heat dissipation plates 7, while there are 4 heat dissipation plates 7 in the present embodiment 2, and they are evenly distributed on the rotating shaft 62. A plurality of guide grooves 65 are provided on the heat dissipation plate 7. Its working principle is similar to that of the embodiment 1 and will not be repeated here.

[0066] The radiator in this embodiment is a new liquid-cooled phase change radiator designed by designing a roller-type heat dissipation component at the heat dissipation end. The heat dissipation component includes at least one fixed bracket, a rotating shaft and a heat dissipation plate. The rotation of the rotating shaft drives the heat dissipation plate to rotate together, thereby driving the second liquid medium in the first heat dissipation chamber to rotate. The continuous rotation flow of the second liquid medium in the first heat dissipation chamber improves the heat dissipation power of the heat dissipation end and achieves the effect of uniform temperature heat dissipation. Moreover, the closer the second liquid medium is to the heat source, the higher its temperature. As the heat dissipation plate rotates, the distance between the second liquid medium and the heat source changes continuously, thereby driving the overall temperature of the second liquid medium to be relatively uniform, improving the uniform temperature performance of the radiator heat dissipation, and greatly improving the heat dissipation power and uniform temperature performance without increasing the volume of the original radiator.

[0067] To sum up, the radiator provided by the present invention designs a new heat dissipation component, and transfers the heat on the chip to the heat dissipation end through the principle of phase change heat absorption and heat release of the liquid medium and capillary circuit liquid absorption at the evaporation and condensation end. At the heat dissipation end, the rotation of the heat dissipation plate drives the flow of the second liquid medium, and the heat on the chip is diffused more quickly and efficiently, solving the problem of high-power heat dissipation, improving the heat dissipation power, and improving the temperature uniformity effect.

[0068] It should be understood by those skilled in the art that the above embodiments are merely for the purpose of illustrating the present invention clearly, and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications may be made based on the above invention, and these changes or modifications are still within the scope of the present invention.

Claims

1. A drum-type liquid-cooled phase-change radiator, characterized in that: Including evaporation condensation end and heat dissipation end; The evaporation and condensation end includes a condensation plate and a lower body, wherein the condensation plate and the lower body are fixedly connected to form an evaporation and condensation chamber, a first capillary structure is provided on the inner wall of the evaporation and condensation chamber, and a first liquid medium is provided inside the evaporation and condensation chamber; The heat dissipation end includes an upper body, a condensation plate and a heat dissipation assembly, wherein the condensation plate and the upper body are fixedly connected to form a first heat dissipation cavity, the upper body is provided with at least one first liquid inlet and at least one first liquid outlet, and the evaporation and condensation cavity are not connected to the first heat dissipation cavity; The heat dissipation assembly includes at least one fixed bracket, a rotating shaft, and at least one heat dissipation plate. The fixed bracket is fixedly connected between the upper body and the condenser plate. The heat dissipation plate is connected to the fixed bracket via the rotating shaft and rotates along with the fixed bracket about the central axis of the rotating shaft. The heat dissipation plate includes a first heat dissipation plate and a second heat dissipation plate. The first heat dissipation plate is provided with a first protrusion, and the second heat dissipation plate is provided with a second protrusion that matches the first protrusion. After the first heat dissipation plate and the second heat dissipation plate are fixedly connected, a second heat dissipation cavity that is communicated with the inside of the first protrusion and the second protrusion is formed.

2. The drum-type liquid-cooled phase-change radiator according to claim 1, characterized in that: A circular rotating frame is provided on the fixed bracket. A second liquid inlet and a second liquid outlet are provided on the circular rotating frame. The second liquid inlet and the second liquid outlet are communicated with the second heat dissipation cavity.

3. The drum-type liquid-cooled phase-change radiator according to claim 1, characterized in that: The heat dissipation plate is arranged in a spiral shape, and a plurality of guide grooves are provided on the heat dissipation plate.

4. The drum-type liquid-cooled phase-change radiator according to claim 1, characterized in that: The heat dissipation plate is configured in a plate shape. There are more than two heat dissipation plates, which are evenly distributed on the rotating shaft. A plurality of guide grooves are provided on the heat dissipation plate.

5. The drum-type liquid-cooled phase-change radiator according to claim 1, characterized in that: A groove is provided at the edge of the opposite surface of the heat dissipation plate and the rotating shaft. The groove is equipped with an elastic flipper. The edge of the flipper is parallel to the edge of the heat dissipation plate and is made of elastic material.

6. The drum-type liquid-cooled phase-change radiator according to claim 1, characterized in that: A gap is provided between the rotating shaft and the heat dissipation plate, and a gap is provided between the heat dissipation plate and the inner wall of the first heat dissipation cavity.

7. The drum-type liquid-cooled phase-change radiator according to claim 1, characterized in that: A second liquid medium is provided in the first heat dissipation cavity, and a third liquid medium is provided in the second heat dissipation cavity. The first liquid medium is one of water, brine, diethyl ether or acetone, and the second liquid medium is one of water, brine, diethyl ether or acetone, or a mixture thereof with antifreeze.

8. A method for manufacturing a drum-type liquid-cooled phase-change radiator, characterized in that: The following steps are involved: S1, sintering the first capillary structure, sintering the upper capillary layer and the lower surface of the condensation plate, and sintering the lower capillary layer and the lower body to form the first capillary structure, S2, making the evaporation and condensation end, welding the bottom of the condensation plate to the lower body to form a closed evaporation and condensation chamber, and sintering the first capillary structure in step S1 on the inner wall of the evaporation and condensation chamber to obtain the evaporation and condensation end, S3, the production of the first heat dissipation cavity, the upper surface of the condensation plate is welded to the upper body to form the first heat dissipation cavity, S4, making the heat dissipation end, fixing the fixed bracket between the upper body and the condenser plate, installing the heat dissipation plate on the rotating shaft, connecting the rotating shaft to the fixed bracket, fixing the heat dissipation component in the first heat dissipation cavity to form the heat dissipation end, S5, helium side leakage inspection, there is a liquid injection port on the inner wall of the evaporation condensation chamber, helium is injected into the evaporation condensation chamber through the liquid injection port to detect whether there is side leakage, if there is side leakage, the side leakage is handled, if there is no side leakage, the helium inspection is completed. S6, injecting the first liquid medium and vacuuming, injecting the first liquid medium into the evaporation and condensation chamber through the liquid injection port, and then vacuuming the evaporation and condensation chamber, welding the liquid injection port to keep the evaporation and condensation chamber sealed, The production of the heat dissipation end further comprises the following steps: S41. Fabrication of a heat sink. The first heat sink and the second heat sink are flat plates. A first protrusion is fabricated on the first heat sink, and a second protrusion is fabricated on the second heat sink. The first protrusion is matched with the second protrusion, and the area outside the first protrusion and the second protrusion is welded to obtain a plate-shaped heat sink. The heat sink is provided with a second heat dissipation cavity consisting of the first protrusion and the second protrusion, and is provided with a second liquid inlet and a second liquid outlet. The heat sink is then connected to a rotating shaft. When the heat sink is set in a spiral shape, the heat sink in S41 is rotated into a spiral shape and then connected to the rotating shaft. The radiator is a drum-type liquid-cooled phase-change radiator according to any one of claims 1 to 7.

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