A centrifugal liquid-cooled phase-change radiator

Abstract

The present invention discloses a centrifugal liquid-cooled phase-change radiator, comprising an evaporative condensation end and a heat dissipation end, wherein the condensation plate is fixedly connected to the lower body to form an evaporative condensation chamber, the heat dissipation end comprises an upper body, a condensation plate and at least one heat dissipation mechanism, the condensation plate is fixedly connected to the upper body to form a heat dissipation chamber, the heat dissipation mechanism comprises a rotating bracket, a rotating shaft and at least one heat dissipation tube, and a plurality of guide areas are arranged on the heat dissipation tube. The centrifugal liquid-cooled phase-change radiator provided by the present invention transfers the heat on the chip to the heat dissipation end through the principle of phase change heat absorption and heat release of liquid medium and capillary circuit liquid absorption at the evaporative condensation end, and drives the flow of the second liquid medium at the heat dissipation end by the rotation of the heat dissipation tube, so as to diffuse the heat on the chip more quickly and efficiently, solve the problem of high-power heat dissipation, and improve the temperature uniformity effect while improving the heat dissipation power.

Description

Technical Field

[0001] The invention relates to the technical field of radiators, and in particular to a centrifugal liquid-cooled phase-change radiator. Background Art

[0002] Data centers cover various fields such as global telecommunications, finance, government, and transportation. With the rapid development of AI technology and integrated circuits, the demand for computing power is increasing, and the heat generation and heat flux density of chips are also rising. If the chips are in a high-temperature operating state for a long time, it will seriously affect their performance and service life. Traditional air cooling can no longer meet the heat dissipation needs of server cabinets. Summary of the invention

[0003] In view of the above-mentioned problems, the purpose of the present invention is to provide a centrifugal liquid-cooled phase change radiator, breaking the heat dissipation mode of temperature equalizing plate heating tube plus heat sink, and designing a new heat dissipation mechanism in the liquid-cooled radiator, so that the heat dissipation power of the centrifugal liquid-cooled phase change radiator is higher and the heat dissipation is more uniform.

[0004] To achieve the above object, the present invention provides a centrifugal liquid-cooled phase-change radiator, comprising an evaporation condensation end and a heat dissipation end;

[0005] The evaporation and condensation end comprises a condensation plate, a lower body and a liquid injection port, the condensation plate and the lower body are fixedly connected to form an evaporation and condensation chamber, the liquid injection port is located at one end of the evaporation and condensation chamber, a first capillary structure is provided on the inner wall of the evaporation and condensation chamber, and a first liquid medium is provided inside the evaporation and condensation chamber;

[0006] The heat dissipation end comprises an upper body, a condensation plate and at least one heat dissipation mechanism, the condensation plate is fixedly connected to the upper body to form a heat dissipation cavity, the upper body is provided with at least one liquid inlet and at least one liquid outlet, and the evaporation condensation cavity is not connected to the heat dissipation cavity;

[0007] The heat dissipation mechanism includes a rotating bracket, a rotating shaft and at least one heat dissipation tube, the heat dissipation tube is configured to be a cylindrical tube, the rotating bracket is fixedly connected to the condensation plate through the rotating shaft, the heat dissipation tube is connected to the rotating bracket, and rotates synchronously with the rotating bracket about the central axis of the rotating shaft, the heat dissipation tube is provided with a plurality of guide areas, the guide areas include guide grooves, and the guide areas are distributed circumferentially on the heat dissipation tube.

[0008] Preferably, the guide groove is configured as a waist-shaped hole groove, the upper groove body width of the guide groove is smaller than the lower groove body width of the guide groove, and a grid structure is provided in the guide groove, and the grid structure is one or more grid structures of fish scale holes or crocodile mouth holes.

[0009] Preferably, a first flow guide body and a second flow guide body are provided at the edge of the flow guide groove, and the first flow guide body and the second flow guide body are both configured as straight surfaces or arc surfaces.

[0010] Preferably, the first flow guide body and the second flow guide body are provided with a plurality of first through holes, and the diameter of the upper through holes of two adjacent first through holes is smaller than the diameter of the lower through holes.

[0011] Preferably, the first through hole is provided with a conical cross-section structure, and the aperture of the first through hole decreases as the distance from the rotation axis increases.

[0012] Preferably, when there are more than two heat dissipation tubes, the horizontal height of the upper ends of the outer heat dissipation tubes of two adjacent heat dissipation tubes is lower than the horizontal height of the upper ends of the inner heat dissipation tubes.

[0013] Preferably, the heat dissipation end also includes a second liquid medium and an annular nozzle for spraying the second liquid medium, the second liquid medium is located in the heat dissipation cavity, and a plurality of nozzles for spraying the second liquid medium are arranged on the circumference of the nozzle, the nozzle is located below the upper body and connected between the liquid inlet and the liquid outlet, and the plurality of nozzles are inclined nozzles with the same or different opening angles.

[0014] Preferably, the heat dissipation tube is provided with an interception area, and the interception area is provided with a plurality of second through holes, and the second through holes are evenly distributed on the interception area.

[0015] Preferably, the heat dissipation mechanism further includes at least one reinforcing plate, and the reinforcing plate is connected between the heat dissipation cylinder and the rotating shaft.

[0016] Preferably, the reinforcing plate is provided with a conical cross-section structure, the inner diameter of the upper end of the reinforcing plate is smaller than the inner diameter of the lower end, and a third through hole is provided on the reinforcing plate.

[0017] The beneficial effects of the present invention are as follows: the centrifugal liquid-cooled phase-change radiator provided by the present invention, by designing a new heat dissipation mechanism, transfers the heat on the chip to the heat dissipation end through the principle of phase change heat absorption and heat release of the liquid medium and capillary circuit absorption of liquid at the evaporation and condensation end, and drives the flow of the second liquid medium at the heat dissipation end through the rotation of the heat dissipation tube, so as to diffuse the heat on the chip more quickly and efficiently, solve the problem of high-power heat dissipation, and improve the temperature uniformity effect while increasing the heat dissipation power. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings illustrate exemplary embodiments of the present invention and together with the description serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0019] Figure 1 Schematic diagram of the internal structure of the centrifugal liquid-cooled phase-change radiator in Example 1;

[0020] Figure 2 Schematic diagram of the external structure of the centrifugal liquid-cooled phase-change radiator in Example 1;

[0021] Figure 3 is a schematic structural diagram of the heat dissipation mechanism in Example 1;

[0022] Figure 4 is a top view of the heat dissipation mechanism in Example 1;

[0023] Figure 5 Schematic diagram of the structure of the heat dissipation mechanism in Example 2. DETAILED DESCRIPTION

[0024] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant contents, rather than to limit the present invention. It is also necessary to explain that, for ease of description, only the parts related to the present invention are shown in the accompanying drawings.

[0025] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0026] Example: See Figures 1 to 4 , this embodiment 1 includes:

[0027] A centrifugal liquid-cooled phase-change radiator comprises an evaporation condensation end and a heat dissipation end.

[0028] The evaporation condensation end comprises a condensation plate 1, a lower body 2 and a liquid injection port 11. The condensation plate 1 is fixedly connected with the lower body 2 to form an evaporation condensation chamber 3. The liquid injection port 11 is located at one end of the evaporation condensation chamber 3. A first capillary structure 12 is provided on the inner wall of the evaporation condensation chamber 3. A first liquid medium is provided inside the evaporation condensation chamber 3.

[0029] The heat dissipation end includes an upper body 4, a condensation plate 1 and at least one heat dissipation mechanism. The condensation plate 1 is fixedly connected to the upper body 4 to form a heat dissipation cavity 5. The upper body 4 is provided with at least one liquid inlet 41 and at least one liquid outlet 42. The evaporation condensation cavity 3 and the heat dissipation cavity 5 are not connected to each other. The heat dissipation cavity 5 is filled with a second liquid medium. The second liquid medium can be injected from the liquid inlet 41 and flow out from the liquid outlet 42 to form a circulation in the heat dissipation cavity 5 for heat dissipation.

[0030] The heat dissipation mechanism includes a rotating bracket 61, a rotating shaft 62 and at least one heat dissipation tube 7. The heat dissipation tube is configured to be a cylindrical tube. The rotating bracket 61 is fixedly connected to the condensation plate 1 through the rotating shaft 62. The heat dissipation tube 7 is connected to the rotating bracket 61 and rotates synchronously with the central axis of the rotating shaft 62 along with the rotating bracket 61. The heat dissipation mechanism also includes a driving motor 63 connected to the rotating shaft 62. A plurality of guide areas are provided on the heat dissipation tube 7. The guide areas are circumferentially distributed on the heat dissipation tube 7. The guide areas include guide grooves 8. Of course, the number of heat dissipation mechanisms is adjusted according to actual needs.

[0031] Specifically in this embodiment 1, the heat dissipation mechanism is located inside the heat dissipation cavity 5, the condensation plate 1 and the lower body 2 are fixedly connected to form an evaporation condensation cavity 3, the interior of the evaporation condensation cavity 3 is provided with a first liquid medium, the lower body 2 is in contact with the chip 200 (heat source) at the bottom, the condensation plate 1 and the upper body 4 are fixedly connected to form the heat dissipation cavity 5, the evaporation condensation cavity 3 and the heat dissipation cavity 5 are not connected to each other, the interior of the evaporation condensation cavity 3 is evacuated, there is no requirement for the internal pressure of the heat dissipation cavity 5, and normal air pressure is sufficient, and the rotating bracket 61 is located on the condensation plate 1 and inside the heat dissipation cavity 5.

[0032] In the non-working state, the first liquid medium (not shown in the figure) is in liquid state and is mainly located in the first capillary structure 12. The inside of the evaporation and condensation chamber 3 is evacuated. Due to technical limitations, it can only be evacuated as much as possible at this stage, and it is impossible to achieve an absolute vacuum state. When the pressure in the evaporation and condensation chamber 3 is within 0.06, it is considered to be in a vacuum state, which meets the requirements of the radiator. In the working state, since the pressure in the evaporation and condensation chamber 3 is relatively low, the very low temperature will cause the first liquid medium in the evaporation and condensation chamber 3 to undergo a phase change, from liquid to gas. In this embodiment 1, water is selected as the first liquid medium. During the phase change process of water becoming water vapor, the heat of the chip 200 is absorbed. The water vapor flows upward in the evaporation and condensation chamber 3, and the heat on the chip 200 is also conducted and diffused upward. When the water vapor contacts the lower surface of the condensation plate 1 upward, the heat is conducted to the upper heat dissipation end through the condensation plate 1. A heat dissipation mechanism is provided on the upper surface of the condensation plate 1, and a second liquid medium is provided in the heat dissipation chamber 5. , the heat dissipation mechanism and the second liquid medium dissipate heat together, thereby quickly diffusing the heat, reducing the temperature in the heat dissipation chamber 5, thereby reducing the temperature of the condensation plate 1. At this time, the water vapor in contact with the condensation plate 1 releases heat and turns into liquid water, which flows back to the lower body 2 through the first capillary structure 12 again, encounters the chip 200 with a high temperature again, and turns into water vapor again, and the cycle repeats, continuously diffusing the heat of the chip 200 to reduce the temperature of the chip 200. By combining the evaporation condensation chamber 3 with the heat dissipation chamber 5, the evaporation condensation chamber 3 and the heat dissipation chamber 5 are combined, and the heat on the chip 200 is transferred to the heat dissipation end through the evaporation condensation chamber 3, and the heat is diffused through the first heat dissipation chamber 5 and the second liquid medium. The rotation of the heat dissipation component drives and accelerates the flow of the second liquid medium, thereby diffusing the heat more efficiently. By dissipating the heat together through the heat dissipation mechanism and the second liquid medium, the heat dissipation power is significantly improved, and the heat dissipation is more efficient, faster and more uniform.

[0033] In this embodiment 1, the heat source uses the chip 200, and of course, other heat sources can also be used according to actual needs. The chip 200 is placed on the lower surface of the lower body 2. During the operation of the integrated circuit, the chip 200 generates a large amount of heat, the temperature rises, the evaporation and condensation chamber 3 is in a sealed state, and is not connected to the heat dissipation chamber 5, which ensures that the pressure of the evaporation and condensation chamber 3 is relatively small, and the heat dissipation chamber 5 is under natural pressure, and the pressure requirement is not high.

[0034] The second liquid medium (not marked in the figure) is located in the heat dissipation cavity 5, and dissipates heat together with the heat dissipation mechanism. The driving motor 63 drives the heat dissipation tube 7 to rotate. During the rotation of the heat dissipation tube 7, the second liquid medium in the heat dissipation cavity 5 will be driven to flow, thereby accelerating the temperature reduction of the second liquid medium in the heat dissipation cavity 5. The heat dissipation tube 7 is provided with a plurality of guide areas and interception areas. In this embodiment 1, the guide areas on each heat dissipation tube 7 are set to 4, and the number can be adjusted according to actual needs. The guide area includes a guide groove 8, and the non-guide area of ​​the heat dissipation tube 7 is the interception area. During the rotation of the second liquid medium, the guide area and the interception area guide and divert the second liquid medium, that is, the guide area guides the second liquid medium, and the interception area intercepts (divides) the second liquid medium. During the rotation, part of the second liquid medium will pass through the guide area, and continue to rotate forward under the action of centrifugal force and gravity to form a laminar flow. The remaining second liquid medium moves to the heat dissipation tube 7 and will be intercepted by the interception area, forming turbulence inside the heat dissipation tube 7. The guide area includes a guide groove 8, and the guide grooves 8 are distributed circumferentially on the heat dissipation tube 7. The guide grooves 8 divert the second liquid medium in the heat dissipation tube 7. During the rotation of the heat dissipation tube 7, under the action of centrifugal force , part of the second liquid medium passes through the guide groove 8 and rotates with the heat dissipation tube 7 to form a laminar rapid flow, and the remaining part of the second liquid medium is blocked in the interception area on the heat dissipation tube 7. As the heat dissipation tube 7 rotates, it hits the heat dissipation tube 7 back and forth to form turbulence. Turbulence has radial pulsation. The greater the degree of turbulence, the greater the radial pulsation. The greater the flow rate, the more violent the radial movement of the second liquid medium, and the more intense the collision between the particles of the second liquid medium, resulting in faster energy exchange and smaller heat transfer resistance. Since the second liquid medium is guided and intercepted (diverted), its flow trajectory and flow velocity are accelerated, and the temperature difference of the second liquid medium increases. The increase in temperature difference also accelerates the flow of heat and accelerates the temperature reduction. Therefore, the heat dissipation power is better.

[0035] In short, the radiator in this embodiment 1 transfers the heat on the chip 200 to the heat dissipation end through the principle of phase change heat absorption and heat release of the liquid medium and capillary circuit absorption of liquid at the evaporation and condensation end. At the heat dissipation end, the rotation of the heat dissipation tube 7 drives the second liquid medium in the heat dissipation cavity 5 to flow, thereby diffusing the heat on the chip 200 more quickly and efficiently, solving the problem of high-power heat dissipation, and improving the temperature uniformity effect while increasing the heat dissipation power.

[0036] The guide groove 8 is configured as a waist-shaped hole groove, the upper groove width of the guide groove 8 is smaller than the lower groove width of the guide groove 8, and a grid structure 81 is provided in the guide groove 8, and the grid structure 81 is one or more grid structures of fish scale holes or crocodile mouth holes. The temperature in the heat dissipation cavity 5 increases from top to bottom, therefore, the upper groove width of the guide groove 8 is smaller than the lower groove width of the guide groove 8, and the grid structure 81 allows the liquid passing through the guide groove 8 to flow in layers. Under the dual effects of centrifugal force and gravity, the second liquid medium passing through the guide groove 8 flows outward, and the relatively low-temperature liquid around the upper part sinks to replenish. Compared with the grid-free structure 81, the grid flow allows the flow medium to separate first and then merge, disrupting the original flow trajectory, which is beneficial to improving the heat dissipation power. At the same time, the grid structure 81 also enhances the strength of the guide groove 8 to withstand pressure and improves the service life of the guide groove 8.

[0037] The first guide body 82 and the second guide body 83 are provided at the edge of the guide groove 8. The first guide body 82 and the second guide body 83 are both set to be straight surfaces or arc surfaces. In the present embodiment 1, the first guide body 82 is provided on the inner wall of the heat dissipation tube 7, and the second guide body 83 is provided on the outer wall of the heat dissipation tube 7. The first guide body 82 and the second guide body 83 are located at the edge of the guide groove 8. The first function is to enhance the strength of the edge of the guide groove 8. The second liquid medium continuously impacts the guide groove 8, which will cause the guide groove 8 to be damaged. Therefore, the edge of the long side thereof is The guide body is provided to enhance the strength of the edge of the guide groove 8. The second and more important function is: the volume of the first guide body 82 and the second guide body 83 protrudes from the inner wall and the outer wall of the heat dissipation tube 7. When the second liquid medium impacts, a greater resistance force is formed, so that the movement trajectory of the intercepted second liquid medium changes, and the movement speed of the second liquid medium after interception is increased, thereby improving the heat dissipation power. The first guide body 82 and the second guide body 83 are provided with a plurality of first through holes 84, and the diameter of the upper through holes of two adjacent first through holes 84 is less than The diameter of the through hole at the lower end, that is, the aperture of the first through hole 84, increases from top to bottom. The existence of the first through hole 84 causes a part of the second liquid medium that impacts the first guide body 82 and the second guide body 83 to pass through the first through hole 84 to form a laminar flow and continue to rotate, and a part of it is intercepted and hits the first guide body 82 and the second guide body 83 back and forth to form turbulence. The greater the degree of turbulence, the greater the radial pulsation, the more severe the radial movement of the second liquid medium, the more intense the collision between the particles of the second liquid medium, the faster the energy exchange, and the smaller the heat transfer resistance. , the better the heat dissipation efficiency is, and because the second liquid medium is divided, its flow trajectory and speed are different, the temperature difference of the second liquid medium increases, the increase in temperature difference also accelerates the flow of heat and accelerates the temperature reduction. The aperture of the first through hole 84 increases from top to bottom, so that the volume of the second liquid medium water flow passing through the first through hole 84 also increases from top to bottom. Under the dual effects of centrifugal force and gravity, the second liquid medium passing through flows outward, and the relatively low-temperature liquid around it sinks under the action of gravity to supplement, thereby improving the heat dissipation efficiency.

[0038] The first through hole 84 is provided with a conical cross-sectional structure, and the aperture of the first through hole 84 decreases as the distance from the rotation axis 62 increases. The center line of the first through hole 84 is parallel to the center line of the guide groove 8, and the aperture of the first through hole 84 decreases as the distance from the rotation axis 62 increases. On the same heat dissipation tube 7, the aperture of the first through hole 84 on the inner wall of the heat dissipation tube 7 is larger than the aperture of the first through hole 84 on its outer wall. When the second liquid medium passes through the first through hole 84, the aperture becomes smaller and smaller, so that the second liquid medium passing through forms a spray water column. The speed of the spray water column is higher than the liquid flow rate passing through the guide groove 8. The liquid flows after interception and the liquid sinks under the action of gravity. Multiple flow trajectories and flow rates coexist, so that the second liquid medium rotates back and forth and stirs between the rotation center and the edge of the heat dissipation tube 7 to exchange heat, and the heat exchange is more efficient and uniform.

[0039] When there are more than two heat dissipation tubes 7, the horizontal height of the upper end of the outer heat dissipation tube 7 of two adjacent heat dissipation tubes 7 is lower than the horizontal height of the upper end of the inner heat dissipation tube 7. Specifically, in this embodiment 1, there are three heat dissipation tubes 7, which are the first heat dissipation tube 71, the second heat dissipation tube 72 and the third heat dissipation tube 73 from the inside to the outside. The three heat dissipation tubes are increasingly far away from the rotating shaft 62. The height of the first heat dissipation tube 71 is greater than the height of the second heat dissipation tube 72, and the height of the second heat dissipation tube 72 is greater than the height of the third heat dissipation tube 73. This layout makes the volume of the second liquid medium passing through the guide groove 8 at the bottom significantly larger than the volume of the liquid passing through the top. In other words, the flow velocity and flow volume at the bottom are higher than the flow velocity and flow volume at the top. Since the chip 200 is located below the lower body 2, the closer the position is to the chip 200, the higher its temperature is relatively, that is, in the heat dissipation cavity 5, the temperature at the bottom is higher than the temperature at the top. The design of the upper end height of the three heat dissipation tubes 7 makes the liquid flow velocity at the bottom higher than the top. For the drive motor 63 of the same power, the heat dissipation power is higher.

[0040] The heat dissipation end also includes a second liquid medium and an annular nozzle 9 for spraying the second liquid medium. The second liquid medium is located in the heat dissipation cavity 5. A plurality of nozzles 91 for spraying the second liquid medium are arranged on the circumferential side of the nozzle 9. The nozzle 9 is located below the upper body 4 and connected between the liquid inlet 41 and the liquid outlet 42. The plurality of nozzles 91 are inclined nozzles with the same or different opening angles. The nozzles 91 can spray out the second liquid medium. The second liquid medium sinks under the action of gravity and mixes with the rotating second liquid medium to increase the heat dissipation power in the heat dissipation cavity 5.

[0041] The heat dissipation tube 7 is provided with an interception area, and the non-conducting area is the interception area. A plurality of second through holes 74 are provided on the interception area, and the second through holes 74 are evenly distributed on the interception area. In the interception area, the second through holes 74 can allow the second liquid medium to pass through, so that the second liquid medium is diverted in the interception area. Similarly, the liquid is diverted and intercepted again in the interception area. The more intense the collision between the particles of the second liquid medium, the faster the energy exchange, the smaller the heat transfer resistance, and the better the heat dissipation power. In addition, multiple diversions and interceptions accelerate the differences in flow trajectories and speeds, accelerate the flow of heat, accelerate the temperature reduction, and improve the heat dissipation power.

[0042] The heat dissipation mechanism also includes at least one reinforcing plate 10, which is connected between the heat dissipation tube 7 and the rotating shaft 62. The reinforcing plate 10 is provided with a conical cross-section structure, and the inner diameter of the upper end of the reinforcing plate 10 is smaller than the inner diameter of the lower end. The reinforcing plate 10 is provided with a third through hole 75. The reinforcing plate 10 mainly plays the role of reinforcing the strength of the heat dissipation tube 7. During the rotation process, the second liquid medium continuously passes through and impacts the heat dissipation tube 7, which will cause the heat dissipation tube 7 to break. The reinforcing plate 10 is connected between the heat dissipation tubes 7 to enhance the strength of the heat dissipation tube 7 and make it less likely to break. At the same time, the third through hole 75 can reduce the overall weight, and more importantly, it can allow the second liquid medium to pass through, thereby improving the overall heat dissipation power of the radiator.

[0043] The radiator is provided with a liquid inlet 41 and a liquid outlet 42, and a driving device and a connecting pipe are provided outside the heat dissipation cavity 5. The liquid inlet 41 and the liquid outlet 42 are connected to the driving device and the connecting pipe outside the heat dissipation end. Driven by the driving device, the second liquid medium circulates in the heat dissipation cavity 5 and the connecting pipe, contacts with the second liquid medium through the heat dissipation mechanism, and diffuses the heat on the chip 200 to the heat dissipation end through the principle of phase change of the first liquid medium and capillary circuit absorption in the evaporation condensation cavity 3. At the heat dissipation end, the heat dissipation is combined through the heat dissipation mechanism and the second liquid medium circulation, and the flow speed of the second liquid medium can be set to achieve rapid heat dissipation and high-power heat dissipation, thereby greatly improving the heat dissipation power of the radiator.

[0044] Of course, considering the convenience of transportation and storage of the radiator, the radiator can also include a connecting joint 100, which is used in conjunction with the liquid inlet 41 and the liquid outlet 42. When the radiator is transported or stored, the drive device and the connecting pipe can be independently retracted and released, and do not need to be fixedly connected to the heat dissipation end. At this time, in order to dustproof the heat dissipation cavity 5, the connecting joint 100 is connected to the liquid inlet 41 and the liquid outlet 42, so that the heat dissipation cavity 5 is in a sealed state. In addition, according to actual heat dissipation requirements, when the heat dissipation requirements can be met without using the connecting pipe, the connecting pipe can also be not used, and the heat dissipation cavity 5 is ensured to be in a sealed state by the connecting joint 100. Of course, during the transportation and storage of the radiator, the second liquid medium can also be stored independently. Before the radiator is used, the second liquid medium can be injected into the heat dissipation cavity 5 through the liquid inlet 41. The second liquid medium can also use tap water. Therefore, the radiator does not need to be injected with the second liquid medium during the production process and transportation process, and can be injected before use.

[0045] Example 2, please refer to Figure 5 The difference from Example 1 is that the reinforcing plate 10 is a sheet metal structure, which is connected between the heat dissipation tube 7 and the rotating shaft 62 like Example 1. When there are multiple heat dissipation tubes 7, there can be multiple reinforcing plates 10, which are also connected between the heat dissipation tubes. The radiator in Example 2 has the same principle as that in Example 1 and will not be repeated here.

[0046] The heat sink in this embodiment (1) designs a new liquid-cooled phase-change heat sink by designing multiple heat dissipation mechanisms at the heat dissipation end. The heat dissipation mechanisms include a rotating bracket, a rotating shaft, and at least one heat dissipation tube. The rotation of the rotating shaft drives the heat dissipation tube to rotate together, thereby driving the second liquid medium in the heat dissipation chamber to rotate. The continuous rotation and flow of the second liquid medium in the heat dissipation chamber improves the heat dissipation power of the heat dissipation end. (2) Design multiple guide areas and interception areas on the heat dissipation tube. The second liquid medium is guided out through the guide area and flows with the rotation of the rotating shaft. Part of the second liquid medium is intercepted on the heat dissipation tube through the interception area. Since the rotating liquid is subjected to The flow of the second liquid medium in the heat dissipation tube is blocked and continuously impacted to form turbulence inside the heat dissipation tube, thereby accelerating the heat dissipation of the second liquid medium, and finally realizing the heat dissipation of the heat dissipation cavity. (3) A guide groove is arranged in the guide groove, and the upper groove width of the guide groove is smaller than the lower groove width of the guide groove, and the upper end horizontal height of the outer heat dissipation tube of two adjacent heat dissipation tubes is lower than the upper end horizontal height of the inner heat dissipation tube. This structural arrangement makes the flow speed of the second liquid medium with higher temperature at the bottom of the heat dissipation cavity greater than the flow speed of the second liquid medium with lower temperature at the top. Since the bottom temperature itself is higher than the top temperature, the flow speed of the bottom liquid is changed, thereby reducing the temperature difference between the bottom and the top, thereby achieving a uniform temperature effect.

[0047] To summarize, the radiator provided by the present invention designs a new heat dissipation mechanism, and transfers the heat on the chip to the heat dissipation end through the principle of phase change heat absorption and heat release of the liquid medium and capillary circuit liquid absorption at the evaporation and condensation end. At the heat dissipation end, the rotation of the heat dissipation tube drives the flow of the second liquid medium, so that the heat on the chip is diffused more quickly and efficiently, solving the problem of high-power heat dissipation, improving the heat dissipation power and improving the temperature uniformity effect.

[0048] It should be understood by those skilled in the art that the above embodiments are only for the purpose of clearly illustrating the present invention, and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications may be made based on the above invention, and these changes or modifications are still within the scope of the present invention.

Claims

1. A centrifugal liquid-cooled phase-change radiator, characterized in that: Including evaporation condensation end and heat dissipation end; The evaporation and condensation end comprises a condensation plate, a lower body and a liquid injection port, the condensation plate and the lower body are fixedly connected to form an evaporation and condensation chamber, the liquid injection port is located at one end of the evaporation and condensation chamber, a first capillary structure is provided on the inner wall of the evaporation and condensation chamber, and a first liquid medium is provided inside the evaporation and condensation chamber; The heat dissipation end comprises an upper body, a condensation plate and at least one heat dissipation mechanism, the condensation plate is fixedly connected to the upper body to form a heat dissipation cavity, the upper body is provided with at least one liquid inlet and at least one liquid outlet, and the evaporation condensation cavity is not connected to the heat dissipation cavity; The heat dissipation mechanism comprises a rotating bracket, a rotating shaft and at least one heat dissipation tube, wherein the heat dissipation tube is arranged in a cylindrical tube shape, the rotating bracket is fixedly connected to the condensation plate through the rotating shaft, the heat dissipation tube is connected to the rotating bracket, and rotates synchronously with the rotating bracket about the central axis of the rotating shaft, and the heat dissipation tube is provided with a plurality of guide areas, the guide areas comprise guide grooves, and the guide areas are circumferentially distributed on the heat dissipation tube; The guide groove is configured as a waist-shaped hole groove, the upper groove body width of the guide groove is smaller than the lower groove body width of the guide groove, and a grid structure is provided in the guide groove, and the grid structure is one or more grid structures of fish scale holes or crocodile mouth holes.

2. The centrifugal liquid-cooled phase-change radiator according to claim 1, characterized in that: A first flow guiding body and a second flow guiding body are provided at the edge of the flow guiding groove, and the first flow guiding body and the second flow guiding body are both configured as straight surfaces or arc surfaces.

3. The centrifugal liquid-cooled phase-change radiator according to claim 2, characterized in that: The first flow guide body and the second flow guide body are provided with a plurality of first through holes, and among two first through holes adjacent to each other in the vertical direction, the diameter of the upper first through hole is smaller than the diameter of the lower first through hole.

4. The centrifugal liquid-cooled phase-change radiator according to claim 3, characterized in that: The first through hole is provided with a conical cross-section structure, and the aperture of the first through hole decreases as the distance between the first through hole and the rotation axis increases.

5. The centrifugal liquid-cooled phase-change radiator according to claim 1, characterized in that: When there are more than two heat dissipation tubes, the upper ends of the outer heat dissipation tubes of two adjacent heat dissipation tubes have a lower level than the upper ends of the inner heat dissipation tubes.

6. The centrifugal liquid-cooled phase-change radiator according to claim 1, characterized in that: The heat dissipation end also includes a second liquid medium and an annular nozzle for spraying the second liquid medium. The second liquid medium is located in the heat dissipation cavity. A plurality of nozzles for spraying the second liquid medium are arranged on the circumference of the nozzle. The nozzle is located below the upper body and connected between the liquid inlet and the liquid outlet. The plurality of nozzles are inclined nozzles with the same or different opening angles.

7. The centrifugal liquid-cooled phase-change radiator according to claim 1, characterized in that: The heat dissipation tube is provided with an interception area, and the interception area is provided with a plurality of second through holes, and the second through holes are evenly distributed on the interception area.

8. The centrifugal liquid-cooled phase-change radiator according to claim 1, characterized in that: The heat dissipation mechanism further includes at least one reinforcing plate, and the reinforcing plate is connected between the heat dissipation cylinder and the rotating shaft.

9. The centrifugal liquid-cooled phase-change radiator according to claim 8, characterized in that: The reinforcing plate is provided with a conical cross-section structure, the inner diameter of the upper end of the reinforcing plate is smaller than the inner diameter of the lower end, and a third through hole is provided on the reinforcing plate.

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