A low profile connector cable assembly and assembly method thereof

Abstract

The present invention provides a low-profile connector cable assembly and an assembly method thereof, belonging to the technical field of electrical connectors. The cable assembly comprises an insulating mounting seat, an A-side high-speed terminal wafer and a B-side high-speed terminal wafer installed in the insulating mounting seat, the A-side high-speed terminal wafer and the B-side high-speed terminal wafer being arranged relatively to each other; the A-side high-speed terminal wafer and the B-side high-speed terminal wafer both comprise a wafer and a high-speed terminal fixedly arranged on the wafer; the wafers in the A-side high-speed terminal wafer and the B-side high-speed terminal wafer both comprise an L-shaped connecting portion, and the L-shaped connecting portions are mutually clamped together to form a U-shaped structure; the present invention can effectively solve the technical problems in the prior art that the size of the overall assembly is too large and the cable needs to be bent at the tail welding wire position, thereby ensuring the high-speed transmission performance of the overall cable.

Description

Technical Field

[0001] The present invention relates to the technical field of connectors, and in particular to a low-profile connector cable assembly and an assembly method thereof. Background Art

[0002] A cable connector is an electrical connector used for data transmission between different electronic devices. Chip technology connects all interface modules (including control modules) to a matrix backplane, and can communicate between multiple modules at the same time through direct chip-to-chip forwarding. It is characterized by high access efficiency, suitable for simultaneous multi-point access, easy to provide very high bandwidth, and convenient performance expansion, and is not easily restricted by CPU bus and memory technology. Existing chips are generally set on server motherboards, which have limited space and are inconvenient to install and maintain chips.

[0003] The invention patent with publication number: CN115347425A (hereinafter referred to as: prior art 1) discloses a cable connector, including: a connector body, a circuit board, a chip, a first signal cable and a first signal external cable; the connector body includes a plastic body and a first signal terminal, the plastic body is provided with a first socket, and the first signal terminal is installed in the first socket; the circuit board is fixed on the plastic body, the chip is installed on the circuit board, and the first signal external cable is connected to the circuit board; one end of the first signal cable is electrically connected to the first signal terminal, and the other end is connected to the circuit board and connected to the chip, and the chip is connected to the first signal external cable. The invention installs the chip on the circuit board of the connector, which is more convenient for installation and maintenance, and the chip can be used to control and configure the function of the signal, which can achieve multi-performance expansion and improve access efficiency.

[0004] The size of the tail wire plastic seal structure of prior art 1 is higher than the outer surface of the PCB, which makes the overall component size larger and the installation size adaptability is poor. Its internal structure is that the terminal welding wire position is straight out, and the cable is bent after welding and then plastic-wrapped. The cable welding point needs to be stripped, and the consistency of the stripped wire thickness and bending is difficult to ensure, which ultimately leads to unstable impedance and shielding structure at the bending point. Summary of the invention

[0005] The purpose of the present invention is to provide a low-profile connector cable assembly and an assembly method thereof, which can effectively solve the technical problems in the prior art that the overall assembly size is too large and the cable needs to be bent at the tail welding wire position, thereby ensuring the high-speed transmission performance of the overall cable.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0007] A low-profile connector cable assembly, the cable assembly comprising an insulating mounting seat, an A-side high-speed terminal wafer sheet and a B-side high-speed terminal wafer sheet installed in the insulating mounting seat, the A-side high-speed terminal wafer sheet and the B-side high-speed terminal wafer sheet being arranged opposite to each other;

[0008] Wherein, the A-side high-speed terminal wafer and the B-side high-speed terminal wafer both include a wafer and a high-speed terminal fixedly arranged on the wafer;

[0009] The wafers in the A-side high-speed terminal wafer and the B-side high-speed terminal wafer both include L-shaped connecting parts, and the L-shaped connecting parts are mutually clamped together to form a U-shaped structure;

[0010] A first extension portion is provided on the wafer of the A-side high-speed terminal wafer, the first extension portion and the upper end surface of the wafer form a first step surface, and the upper end of the high-speed terminal of the A-side high-speed terminal wafer is located on the first step surface; a second extension portion is provided on the side surface of the wafer in the B-side high-speed terminal wafer, the second extension portion and the side surface of the wafer form a second step surface, the upper end of the high-speed terminal in the B-side high-speed terminal wafer is located at the second step surface, the height of the first step surface is higher than the height of the second step surface, the high-speed terminals located on the first step surface and the second step surface are connected with wires, and the wires are led out from a direction parallel to the first step surface and the second step surface.

[0011] Furthermore, in a preferred implementation case, a card block and a card slot are respectively provided on one side of the wafers of the A-side high-speed terminal wafer and the B-side high-speed terminal wafer close to each other, and the card block and the card slot are used to achieve card fixing.

[0012] Furthermore, in a preferred implementation case, the high-speed terminal and the wire are connected together by welding.

[0013] Furthermore, in a preferred implementation case, the cable assembly also includes a wire-wrapped plastic package, which is used to plastic-package the A-side high-speed terminal wafer and the B-side high-speed terminal wafer on the insulating mounting seat.

[0014] Furthermore, in a preferred implementation case, a wedge-shaped groove is provided on the side of the insulating mounting seat, and after the wire-wrapped plastic-encapsulated body is encapsulated on the insulating mounting seat, the wedge-shaped structure formed on the wire-wrapped plastic-encapsulated body fits with the wedge-shaped groove.

[0015] Furthermore, in a preferred implementation case, a side hanging platform is provided on one side of the wafer of the A-side high-speed terminal wafer and the B-side high-speed terminal wafer close to the insulating mounting seat, and a hanging hole corresponding to the side hanging platform is provided on the insulating mounting seat.

[0016] Furthermore, in a preferred embodiment, the cable assembly also includes an inner shielding plate and several outer shielding plates, the inner shielding plate includes a U-shaped body and several contact springs and shielding plates arranged on both sides of the U-shaped body; the U-shaped body is located in the U-shaped structure, the contact springs correspond one by one to the ground PINs of the high-speed terminals in the A-side high-speed terminal wafer and the B-side high-speed terminal wafer and contact each other, and the shielding plate is used to cooperate with the insulating mounting seat for installation; the outer shielding plate is installed on the insulating mounting seat, and the springs on the outer shielding plate contact the ground PINs of the high-speed terminals in the A-side high-speed terminal wafer and the B-side high-speed terminal wafer.

[0017] Furthermore, in a preferred implementation case, the outer shielding sheet includes a vertical portion and the spring sheets arranged on both sides of the vertical portion, an installation groove is arranged on the insulating mounting seat, the vertical portion is inserted into the installation groove, a supporting boss is arranged in the installation groove, and the outer shielding sheet contacts the supporting boss.

[0018] Furthermore, in a preferred implementation case, a notch is provided on the A-side high-speed terminal wafer and the B-side high-speed terminal wafer, and the notch corresponds to the ground PIN of the high-speed terminal in the A-side high-speed terminal wafer and the B-side high-speed terminal wafer.

[0019] In addition, the present invention also discloses a method for assembling a low-profile connector cable assembly, and the method is used to assemble the low-profile connector cable assembly described above;

[0020] The specific steps are as follows:

[0021] Install the A-side high-speed terminal wafer and the B-side high-speed terminal wafer together;

[0022] The wires are welded to the high-speed terminals in the A-side high-speed terminal wafer and the B-side high-speed terminal wafer, so that the wires are dislocated in height and are led out in parallel from the first step surface and the second step surface; and the wire-wrapped plastic package is encapsulated on the insulating mounting seat.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The present invention provides a first step surface and a second step surface on a wafer, and makes the height of the first step surface higher than the height of the second step surface. The high-speed terminals on the first step surface and the second step surface are connected with wires, and the wires are led out in a direction parallel to the first step surface and the second step surface, thereby effectively reducing the structural size of the tail wire plastic package; at the same time, the tail welding wire position does not need to be bent, thereby ensuring the impedance of the cable welding position and the stability of the shielding structure, thereby ensuring the high-speed transmission performance of the entire cable, and improving the transmission rate, so that the transmission rate reaches 64 GT / s. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0027] Figure 2 It is a schematic diagram of the internal structure coordination relationship of the present invention.

[0028] Figure 3 It is a schematic diagram of the connection relationship between the A-side high-speed terminal wafer and the B-side high-speed terminal wafer of the present invention.

[0029] Figure 4 For the present invention Figure 3 main view.

[0030] Figure 5 It is a schematic diagram of the installation relationship between the outer shielding sheet and the insulating mounting seat of the present invention.

[0031] Figure 6 It is a schematic diagram of the connection relationship between the cable and the wafer of the present invention.

[0032] Figure 7 For the present invention Figure 6 main view.

[0033] Figure 8 It is a schematic diagram of the overall structure of the outer shielding sheet of the present invention.

[0034] Fig. 9 It is a schematic diagram of the overall structure of the insulating mounting seat of the present invention.

[0035] Fig.10 It is a schematic diagram of the overall structure of the inner shielding sheet of the present invention.

[0036] Fig.11This is a diagram of the insertion loss simulation results of the present invention.

[0037] Fig.12 This is a diagram of the return loss simulation results of the present invention.

[0038] Fig.13 This is a diagram of the near-end crosstalk simulation results of the present invention.

[0039] Fig.14 This is a diagram of the far-end crosstalk simulation results of the present invention.

[0040] Reference numerals:

[0041] 101 insulating mounting seat, 102 A-side high-speed terminal wafer sheet, 103 B-side high-speed terminal wafer sheet, 104 wafer sheet, 105 high-speed terminal, 106 L-shaped connecting portion, 107 first extension portion, 108 first step surface, 109 second extension portion, 110 second step surface, 111 card block, 112 card slot, 113 tin bar positioning slot, 114 wire-wrapped plastic package, 115 wedge-shaped slot, 116 wedge-shaped structure , 117 side hanging platform, 118 hanging hole, 119 inner shielding plate, 120 U-shaped body, 121 contact spring sheet, 122 shielding plate, 123 outer shielding plate, 124 vertical portion, 125 spring sheet, 126 mounting groove, 127 supporting boss, 128 concave structure, 129 protruding structure, 130 wire, 131 low-speed fisheye terminal A, 132 low-speed fisheye terminal B, 133 supporting structure, 134 make way area, 135 chamfer. DETAILED DESCRIPTION

[0042] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0043] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0045] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0046] In the embodiments of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0047] The disclosure below provides many different embodiments or examples to implement different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the present invention. In addition, the embodiments of the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0048] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0049] See also Figure 1-Figure 10 , this embodiment discloses a low-profile connector cable assembly, the cable assembly includes an insulating mounting seat 101, an A-side high-speed terminal wafer piece 102 and a B-side high-speed terminal wafer piece 103 installed in the insulating mounting seat 101, and the A-side high-speed terminal wafer piece 102 and the B-side high-speed terminal wafer piece 103 are arranged opposite to each other;

[0050] The A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103 both include a wafer 104 and a high-speed terminal 105 fixedly disposed on the wafer 104;

[0051] The wafer 104 in the A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103 both include an L-shaped connecting portion 106, and the L-shaped connecting portions 106 are mutually clamped together to form a U-shaped structure;

[0052] A first extension portion 107 is provided on the wafer 104 of the A-side high-speed terminal wafer 102, and the first extension portion 107 and the upper end surface of the wafer 104 form a first step surface 108, and the upper end of the high-speed terminal 105 of the A-side high-speed terminal wafer 102 is located on the first step surface 108; a second extension portion 109 is provided on the side surface of the wafer in the B-side high-speed terminal wafer 103, and the second extension portion 109 and the side surface of the wafer form a second step surface 110, and the upper end of the high-speed terminal 105 in the B-side high-speed terminal wafer 103 is located at the second step surface 110, and the height of the first step surface 108 is higher than the height of the second step surface 110, and the high-speed terminal 105 located on the first step surface 108 and the second step surface 110 is connected to the wire 130, and the wire 130 is led out from a direction parallel to the first step surface 108 and the second step surface 110.

[0053] The present invention provides a first step surface 108 and a second step surface 110 on a wafer 104, and makes the height of the first step surface 108 higher than the height of the second step surface 110. The high-speed terminal 105 located on the first step surface 108 and the second step surface 110 is connected with a wire 130, and the wire 130 is led out from a direction parallel to the first step surface 108 and the second step surface 110, thereby effectively reducing the structural size of the tail wire plastic package; at the same time, the tail welding wire position does not need to be bent, thereby ensuring the impedance of the cable welding position and the stability of the shielding structure, thereby ensuring the high-speed transmission performance of the entire cable, and improving the transmission rate, so that the transmission rate reaches 64 GT / s.

[0054] Furthermore, in actual use, the upper ends of the high-speed terminals 105 in the A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103 are bent at right angles so that the formed bent portions are located on the first step surface 108 and the second step surface 110 to ensure horizontal cable outlet.

[0055] More importantly, in the present application, the height of the first step surface 108 is higher than the height of the second step surface 110 , so that the cables can be staggered to facilitate the lead-out of the cables and avoid the increase of thickness due to bending.

[0056] Furthermore, a clamping block 111 and a clamping slot 112 are respectively provided on the side where the wafer 104 of the A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103 are close to each other, and clamping and fixing are achieved through the clamping block 111 and the clamping slot 112 .

[0057] The wafers 104 can be locked together by the provided locking block 111 and the locking slot 112 . The locking block 111 and the locking slot 112 are circular structures or dovetail structures.

[0058] The engagement of the block 111 and the slot 112 can provide a certain relative fixing force between the wafers 104, provide fixing force for the assembly of the two wafers 104 and the inner shielding sheet 119 before installation, and also ensure the mechanical balance of the contacts on both sides of the finished product.

[0059] Furthermore, in actual use, the insulating mounting seat 101 is also provided with a tin bar positioning groove 113, which is convenient for fixing the tin bar during automatic wire welding and increases the manufacturability of the wire welding.

[0060] Furthermore, the high-speed terminal 105 and the wire 130 are connected together by welding.

[0061] This embodiment can modify the curved wire-out method in the prior art into a straight wire-out method and a stepped wiring method, thereby greatly reducing the overall thickness.

[0062] Among them, in some preferred implementation cases, the cable assembly also includes a wire-wrapped plastic package 114, and the wire-wrapped plastic package 114 is used to plastic-package the A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103 on the insulating mounting seat 101.

[0063] Furthermore, a wedge-shaped groove 115 is provided on the side of the insulating mounting seat 101. After the wire-wrapped plastic package is encapsulated on the insulating mounting seat 101, the wedge-shaped structure 116 formed on the wire-wrapped plastic package fits with the wedge-shaped groove 115, which ensures the fixation of the contact and the cable retention force when in cooperation.

[0064] Furthermore, in some preferred implementation cases, the wafer 104 in the A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103 is provided with a side hanging platform 117 on the side close to the insulating mounting seat 101, and the insulating mounting seat 101 is provided with a hanging hole 118 corresponding to the side hanging platform 117. The provided hanging hole 118 and the side hanging platform 117 can improve the fastening effect between the wafer 104 and the insulating mounting seat 101, and achieve the purpose of double reinforcement under the action of the wedge structure 116 and the wedge groove 115.

[0065] Furthermore, in this embodiment, the cable assembly also includes an inner shielding plate 119 and several outer shielding plates 123, the inner shielding plate 119 includes a U-shaped body 120 and several contact springs 121 and shielding plates 122 arranged on both sides of the U-shaped body 120; the U-shaped body 120 is located in the U-shaped structure, the contact springs 121 correspond one by one to the ground PINs of the high-speed terminal 105 in the A-side high-speed terminal wafer plate 102 and the B-side high-speed terminal wafer plate 103 and contact each other, and the shielding plate 122 is used for installation in conjunction with the insulating mounting seat 101; the outer shielding plate 123 is installed on the insulating mounting seat 101, and the springs 125 on the outer shielding plate 123 contact the ground PINs of the high-speed terminal 105 in the A-side high-speed terminal wafer plate 102 and the B-side high-speed terminal wafer plate 103.

[0066] In this embodiment, the shielding sheet 122 is mainly used to shield electromagnetic waves. For better installation and positioning, the shielding sheet 122 and the insulating mounting seat 101 are matched with each other.

[0067] The U-shaped body 120 can be matched with the support structure 133 on the insulating mounting seat 101 to fix the inner shielding sheet 119, and the shielding sheet 122 is matched with the mounting structure on the insulating mounting seat 101 to effectively shield the electromagnetic waves emitted from the inner side of the connector differential pair.

[0068] Among them, the outer shielding plate 123 includes a vertical portion 124 and the elastic pieces 125 arranged on both sides of the vertical portion 124, and a mounting groove 126 is arranged on the insulating mounting seat 101. The vertical portion 124 is inserted into the mounting groove 126, and a supporting boss 127 is arranged in the mounting groove 126. The outer shielding plate 123 contacts the supporting boss 127.

[0069] The vertical portion 124 and the spring pieces 125 on both sides make the overall structure of the outer shielding sheet 123 a T-shaped structure. The vertical portion 124 is inserted into the mounting groove 126 to fix the outer shielding sheet 123. When the wafer sheet 104 is installed, the compressed spring piece 125 is in elastic contact with the ground PIN straight surface section in the wafer sheet 104. The support boss 127 provides an effective spring arm length for elastic deformation, thereby ensuring the reliability of elastic deformation and the reliability of contact.

[0070] It should be noted that, in actual use, the support boss 127 is a rib disposed on the insulating mounting seat 101. At the same time, the signal differential pair is disposed below the vertical portion 124, which plays a good shielding role for the electromagnetic waves scattered outside the signal differential pair connector.

[0071] Furthermore, in actual use, the support boss 127 is vertically arranged and located in the mounting groove 126 , and the support boss 127 is in close contact with the vertical portion 124 .

[0072] Furthermore, in some preferred embodiments, the upper portion of the mounting groove 126 has a clearance area 134 , and the clearance area 134 corresponds to the spring piece 125 .

[0073] Furthermore, in actual use, the position where the wafer 104 and the insulating mounting seat 101 meet is provided with mutually staggered concave structures 128 and protruding structures 129 .

[0074] Furthermore, the wafer 104 of the A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103 is provided with a notch, and the notch corresponds to the ground PIN of the high-speed terminal 105 in the A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103 .

[0075] In actual use, a plurality of low-speed fisheye terminals A131 and low-speed fisheye terminals B132 are also installed on the edge mounting seat.

[0076] Furthermore, in actual use, the insulating mounting seat 101 is provided with a chamfer 135 for matching with the first chamfer of the PCIe board, which can ensure that no interference occurs during the plugging and unplugging process. At the same time, it can also effectively increase the strength of the insulating mounting seat 101 at the position to ensure the overall strength of the product.

[0077] SI simulation is performed on the low-profile connector cable assembly disclosed in the embodiment, and the simulation results are as follows:

[0078] Insertion loss results are as follows: Fig.11 As shown in the figure, the insertion loss maintains a 50% margin within the insertion loss specification range of PCIE GEN6, providing sufficient transmission margin for high-speed links. Figure 5 The size of the outer shielding sheet 123 and the position of the contact at the bend are designed to change the energy distribution at the bend and weaken the resonant amplitude of the terminal at a high frequency. At the same time, the inflection point position of the terminal bend will also be optimized to the amplitude of the insertion loss at a high frequency, ensuring that the transmission system can stably transmit at high speed without being affected.

[0079] exist Fig.11 In the figure, IL represents the insertion loss, and diff1-7 represents the insertion loss of the two rows of terminal channels.

[0080] The return loss results are as follows: Fig.12 As shown, the size design of this structure ensures that its impedance is controlled within ±5Ω of 85 ohms, achieving good impedance matching in the 85Ω ecosystem of the PCIE transmission protocol, making the return loss margin large enough to reduce the reflection of the transmission energy.

[0081] exist Fig.12 In the figure, RL represents the return loss, diff1-7 represents the return loss of the two rows of terminal channels, and iRL is the cumulative return loss value in the time domain.

[0082] The near-end and far-end crosstalk results are as follows: Fig.13 and Fig.14 As shown, in Fig.13 In the figure, NEXT is near-end crosstalk, where channel 2 is the victim line and channels 5, 6, and 7 are the attack lines. Fig.14 In the figure, FEXT is far-end crosstalk, channel 2 is the victim line, and channels 8 and 10 are the attack lines.

[0083] In this application Figure 11-14 In the figure, the horizontal axis Frequency represents frequency in GHZ (Hertz); the vertical axis Magnitude represents amplitude in dB (decibel).

[0084] like Fig.10 The inner shielding sheet 119 is designed to be U-shaped in order to better isolate the two rows of signal terminals. At the same time, the larger the vertical area of ​​the inner shielding sheet 119, the better the near-end crosstalk. However, its size design needs to consider the impact of the inner shielding sheet 119 on the insertion loss, rather than simply extending the inner shielding sheet 119. Therefore, the size of the inner shielding sheet 119 structure improves the near-end and far-end crosstalk, giving it a margin of more than 50%, ensuring that when multiple differential pairs work, they can work without interfering with each other.

[0085] In addition, the present invention also discloses a method for assembling a low-profile connector cable assembly, and the method is used for assembling the low-profile connector cable assembly described above;

[0086] The specific steps are as follows:

[0087] Install the inner shielding sheet 119 on the insulating mounting seat 101;

[0088] Clamp the A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103 together;

[0089] Install the inner shielding sheet 119 in the U-shaped structure, and then install the A-side high-speed terminal wafer sheet 102 and the B-side high-speed terminal wafer sheet 103 that are clamped together on the insulating mounting seat 101;

[0090] The wire 130 is welded to the high-speed terminal 105 in the A-side high-speed terminal wafer 102 and the B-side high-speed terminal wafer 103, so that the wire 130 is dislocated in height and is led out from the first step surface 108 and the second step surface 110 in parallel;

[0091] The wire-wrapped plastic package is encapsulated on the insulating mounting seat 101 .

[0092] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0093] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A low profile connector cable assembly, characterized in that: The cable assembly includes an insulating mounting seat, an A-side high-speed terminal wafer sheet and a B-side high-speed terminal wafer sheet installed in the insulating mounting seat, and the A-side high-speed terminal wafer sheet and the B-side high-speed terminal wafer sheet are arranged opposite to each other; Wherein, the A-side high-speed terminal wafer and the B-side high-speed terminal wafer both include a wafer and a high-speed terminal fixedly arranged on the wafer; The wafers in the A-side high-speed terminal wafer and the B-side high-speed terminal wafer both include L-shaped connecting parts, and the L-shaped connecting parts are mutually clamped together to form a U-shaped structure; A first extension portion is provided on the wafer of the A-side high-speed terminal wafer, the first extension portion and the upper end surface of the wafer form a first step surface, and the upper end of the high-speed terminal of the A-side high-speed terminal wafer is located on the first step surface; a second extension portion is provided on the side surface of the wafer in the B-side high-speed terminal wafer, the second extension portion and the side surface of the wafer form a second step surface, the upper end of the high-speed terminal in the B-side high-speed terminal wafer is located at the second step surface, the height of the first step surface is higher than the height of the second step surface, the high-speed terminals located on the first step surface and the second step surface are connected to wires, and the wires are led out in a direction parallel to the first step surface and the second step surface; The cable assembly also includes an inner shielding sheet and several outer shielding sheets, the inner shielding sheet includes a U-shaped body and several contact springs and shielding sheets arranged on both sides of the U-shaped body; the U-shaped body is located in the U-shaped structure, the contact springs correspond to the ground PINs of the high-speed terminals in the A-side high-speed terminal wafer sheet and the B-side high-speed terminal wafer sheet and contact each other, and the shielding sheet is used to be installed in conjunction with the insulating mounting seat; the outer shielding sheet is installed on the insulating mounting seat, and the springs on the outer shielding sheet contact the ground PINs of the high-speed terminals in the A-side high-speed terminal wafer sheet and the B-side high-speed terminal wafer sheet.

2. A low profile connector cable assembly according to claim 1, characterized in that: A clamping block and a clamping slot are respectively arranged on the sides of the wafers of the A-side high-speed terminal wafer and the B-side high-speed terminal wafer that are close to each other, and clamping and fixing are achieved through the clamping block and the clamping slot.

3. The low profile connector cable assembly according to claim 1, characterized in that: The high-speed terminal and the wire are connected together by welding.

4. The low profile connector cable assembly according to claim 1, characterized in that: The cable assembly also includes a wire-wrapped plastic package body, which is used to plastic-package the A-side high-speed terminal wafer and the B-side high-speed terminal wafer on the insulating mounting seat.

5. The low profile connector cable assembly according to claim 4, characterized in that: A wedge-shaped groove is arranged on the side of the insulating mounting seat. After the wire-wrapped plastic-sealed body is packaged on the insulating mounting seat, the wedge-shaped structure formed on the wire-wrapped plastic-sealed body fits with the wedge-shaped groove.

6. A low profile connector cable assembly according to claim 5, characterized in that: A side hanging platform is arranged on one side of the wafer sheet of the A-side high-speed terminal wafer sheet and the B-side high-speed terminal wafer sheet close to the insulating mounting seat, and a hanging hole corresponding to the side hanging platform is arranged on the insulating mounting seat.

7. The low profile connector cable assembly according to claim 1, characterized in that: The outer shielding sheet comprises a vertical portion and the spring sheets arranged on both sides of the vertical portion. The insulating mounting seat is provided with a mounting groove, the vertical portion is inserted into the mounting groove, a supporting boss is arranged in the mounting groove, and the outer shielding sheet contacts the supporting boss.

8. The low profile connector cable assembly according to claim 1, characterized in that: Notches are arranged on the wafers of the A-side high-speed terminal wafer and the B-side high-speed terminal wafer, and the notches correspond to the ground pins of the high-speed terminals in the A-side high-speed terminal wafer and the B-side high-speed terminal wafer.

9. A method for assembling a low profile connector cable assembly, characterized in that: The assembly method is used to implement the assembly of the low-profile connector cable assembly described in claim 4; The specific steps are as follows: Install the A-side high-speed terminal wafer and the B-side high-speed terminal wafer together; Weld the wires to the high-speed terminals in the A-side high-speed terminal wafer and the B-side high-speed terminal wafer, so that the wires are dislocated in height and are led out in parallel from the first step surface and the second step surface; The wire-wrapped plastic package is encapsulated on an insulating mounting base.

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