Connector and electronic equipment

Abstract

The embodiment of the invention discloses a connector and electronic equipment, relates to the technical field of communication, and solves the problem of large insertion loss of a transmission line. The connector of the present application includes a connector terminal including a transmission line. The transmission line comprises a base material layer and a first protection layer. Wherein the first protective layer is arranged on the outer surface of the base material layer. The conductivity of the first protective layer is larger than that of the base material layer and larger than 30% iacs. The conductivity of the first protective layer is high, and the electromagnetic transmission efficiency is high. Therefore, when a high-frequency signal (such as a signal of more than 1 GHz) is transmitted, the electric signal in the transmission line is influenced by the skin effect. When the electromagnetic transmission frequency is high, the skin depth is shallow, and more energy is transmitted in the first protective layer. The resistance of the first protective layer is small, and the transmission efficiency can be effectively improved. Furthermore, the electrical loss in the signal transmission process is reduced, and the insertion loss is reduced.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a connector and an electronic device. Background Art

[0002] As the speed of communication equipment systems increases, the requirements for connector signal integrity (SI) performance indicators become increasingly stringent.

[0003] In existing high-speed transmission links, transmission lines generally use copper alloy as the base material, and the surface electroplated nickel layer is used as the protective layer, and the thickness of the nickel layer is relatively large. When transmitting high-frequency signals, affected by the skin effect, the high-frequency signals are basically transmitted in the nickel layer, resulting in large electrical losses. Since the nickel element is magnetic, it will further increase the high-frequency insertion loss. As a result, the signal insertion loss of the connector connected by this transmission line is large and cannot meet the SI performance indicators. Summary of the invention

[0004] The embodiments of the present application provide a connector and an electronic device, which solve the problem that the existing transmission lines have large insertion loss and cannot meet SI performance indicators.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a connector, including a connector terminal, and the connector terminal includes a transmission line. The transmission line includes a substrate layer and a first protective layer. The substrate layer can be made of a conductive material, such as copper, copper alloy or other conductive non-metallic materials. The first protective layer is arranged on the outer surface of the substrate layer. The conductivity of the first protective layer is greater than the conductivity of the substrate layer, and the conductivity of the first protective layer is greater than 30% IACS (international annealed copper standard).

[0007] Compared with the prior art, a first protective layer with a conductivity greater than that of the substrate layer and greater than 30% iacs is provided on the outer surface of the substrate layer in the transmission line of the connector of the embodiment of the present application. The conductivity of the first protective layer is relatively high, and the electromagnetic transmission efficiency is relatively high. Therefore, when transmitting high-frequency signals (such as signals above 1 GHz), the electrical signals in the transmission line will be affected by the skin effect. When the electromagnetic transmission frequency is high, the skin depth is shallow, and more energy is transmitted in the first protective layer. The resistance of the first protective layer is small, which can effectively improve the transmission efficiency. In addition, the electrical loss during signal transmission is reduced, and the insertion loss is reduced.

[0008] Based on the structure of the above transmission line, in some embodiments of the present application, the above first protective layer is a copper layer. The copper layer has a very low resistivity, a fast conductivity, and a high efficiency in transmitting electrical signals, which can effectively reduce electrical losses during signal transmission and reduce insertion loss. In addition, copper is non-magnetic, and when transmitting low-frequency signals (such as signals within 10 GHz), there will be no abnormal increase in low-frequency band losses.

[0009] In some embodiments of the present application, the first protective layer is a graphene layer. The graphene layer has the advantages of high strength, good toughness, bendability, and extremely high conductivity, and the efficiency of electrical signal transmission is very high. The electrical loss and insertion loss during signal transmission are very small. In addition, the graphene layer is non-magnetic, so when transmitting low-frequency signals (such as signals within 10 GHz), there will be no abnormal increase in low-frequency band loss.

[0010] Furthermore, in some embodiments of the present application, the thickness of the first protective layer is in the range of 0.2 μm-10 μm, which can ensure that more energy is transmitted in the first protective layer with lower cost.

[0011] It is understandable that the above-mentioned transmission line is used in different environments and has different physical requirements. For example, in outdoor scenarios, the transmission line in the connector is usually required to have good corrosion resistance. If the material used to make the above-mentioned first protective layer does not have corrosion resistance, it is necessary to provide a protective layer with corrosion resistance on the outer surface of the first protective layer. Therefore, in some embodiments of the present application, the above-mentioned transmission line also includes a second protective layer, and the second protective layer is provided on the surface of the first protective layer away from the substrate layer. The second protective layer can form protection for the first protective layer and the substrate layer.

[0012] Furthermore, in some embodiments, the second protective layer includes any one or more of gold, silver, cobalt, tungsten, and nickel. That is, the second protective layer may be made of gold, silver, cobalt, tungsten, or nickel. Alternatively, the second protective layer may also be an alloy material including one or more of gold, silver, cobalt, tungsten, and nickel, such as a cobalt-tungsten (Co-W) alloy, a nickel-tungsten (Ni-W) alloy, or a nickel-phosphorus (Ni-P) alloy. All of the above materials have good corrosion resistance.

[0013] It should be noted that the thickness of the second protective layer should be smaller than that of the first protective layer to ensure that more energy in the electrical signal is transmitted in the first protective layer.

[0014] In some embodiments of the present application, the thickness of the second protective layer is in the range of 0.2 μm-10 μm, which can ensure reliable protection of the first protective layer and the substrate layer inside the transmission line at a low cost. For example, the thickness of the first protective layer is 0.5 μm, and the thickness of the second protective layer is 0.2 μm.

[0015] In addition, the first protective layer can be disposed on the substrate layer by electroplating, chemical plating, magnetron sputtering, deposition, etc. And the second protective layer can also be disposed on the first protective layer by electroplating, chemical plating, magnetron sputtering, deposition, etc. This application does not limit this.

[0016] In some embodiments of the present application, the connector terminal further includes a circuit board, and the circuit board includes a substrate and the transmission line. The transmission line is arranged on the substrate. Thus, the connector of the embodiment of the present application can be a connector using a circuit board as a conductive connection structure. In addition, the transmission line can also be a conductive sheet or a pin. Therefore, the connector in the embodiment of the present application can be a backplane connector or a cable connector, and the present application does not limit this.

[0017] In addition to the connector terminals, the connector may also include a housing, and the connector terminals are arranged on the housing. In addition, in some embodiments of the present application, the connector may also include a connecting wire, and the connecting wire is electrically connected to the connector terminals. The connecting wire is located outside the housing. Thus, it is convenient to connect electronic devices at a longer distance.

[0018] In a second aspect, an embodiment of the present application provides an electronic device. The electronic device includes a mainboard and the connector described in the above embodiment. The mainboard may be a circuit board. Since the connector in the electronic device of the embodiment of the present application has the same structure as the connector described in the above embodiment, both can solve the same technical problems and obtain the same technical effects, and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to illustrate the technical solution of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0020] Figure 1 This is a three-dimensional schematic diagram of an electronic device in an embodiment of the present application being a switch;

[0021] Figure 2 This is a schematic diagram of the assembly structure of a mainboard and a connector in an electronic device according to an embodiment of the present application;

[0022] Figure 3 The connector of the embodiment of the present application is a three-dimensional structural schematic diagram of a backplane connector;

[0023] Figure 4It is a cross-sectional schematic diagram of a transmission line with a rectangular cross section in a connector according to an embodiment of the present application;

[0024] Figure 5 The connector of the embodiment of the present application is a schematic diagram of a three-dimensional structure of a cable connector;

[0025] Figure 6 It is a cross-sectional schematic diagram of a transmission line with a circular cross-section in a connector according to an embodiment of the present application;

[0026] Figure 7 It is a three-dimensional schematic diagram of a connector with a circuit board according to an embodiment of the present application;

[0027] Figure 8 This is a cross-sectional schematic diagram of a circuit board in a connector according to an embodiment of the present application;

[0028] Figure 9a It is a cross-sectional schematic diagram of a metal trace having a first protective layer disposed on the upper surface of a substrate layer in a circuit board according to an embodiment of the present application;

[0029] Figure 9b It is a cross-sectional schematic diagram of a metal trace having a first protective layer disposed on the lower surface of a substrate layer in a circuit board according to an embodiment of the present application;

[0030] Fig.9c It is a cross-sectional schematic diagram of a metal trace having a first protective layer disposed on the upper surface and the lower surface of a substrate layer in a circuit board according to an embodiment of the present application;

[0031] Fig.10 This is a schematic cross-sectional view of a transmission line having a rectangular cross-section and a second protective layer according to an embodiment of the present application;

[0032] Fig.11 This is a schematic cross-sectional view of a transmission line having a circular cross-section and a second protective layer according to an embodiment of the present application;

[0033] Fig.12a It is a cross-sectional schematic diagram of a metal trace having a second protective layer disposed on the upper surface of a first protective layer in a circuit board according to an embodiment of the present application;

[0034] Figure 12b It is a cross-sectional schematic diagram of a metal trace having a second protective layer disposed on the lower surface of a first protective layer in a circuit board according to an embodiment of the present application;

[0035] Fig.12c It is a cross-sectional schematic diagram of a metal trace having a second protective layer disposed on the upper surface and the lower surface of the first protective layer in a circuit board according to an embodiment of the present application;

[0036] Fig.13 It is a schematic diagram of the three-dimensional structure of a connector with a connecting line according to an embodiment of the present application.

[0037] Figure Number:

[0038] 1000-switch; 100-motherboard; 200-connector; 10-housing; 20-connector terminal; 1-transmission line; 1a-conductive sheet; 1b-pin; 1c-metal trace; 11-substrate layer; 12, 12a, 12b-first protective layer; 13, 13a, 13b-second protective layer; 2-circuit board; 21-base; 30-connecting line. DETAILED DESCRIPTION

[0039] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0040] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0041] In addition, in the present application, directional terms such as "up", "down", "left", "right", "horizontal" and "vertical" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0042] In this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can refer to the connection of mechanical structure or physical structure. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be directly connected or indirectly connected through an intermediate medium. It can also be understood as the physical contact and electrical conduction of components, and it can also be understood as the form in which different components in the circuit structure are connected through physical lines such as PCB copper foil or wires that can transmit electrical signals.

[0043] The present application provides an electronic device, which may include various devices such as routers, switches, bridges, servers, supercomputers, etc. The present application embodiment does not impose any special restrictions on the specific form of the above electronic device. Figure 1 The switch 1000 shown in FIG. Figure 2 As shown, the switch 1000 includes a mainboard 100 and a connector 200. The mainboard 100 is a printed circuit board. The connector 200 can be installed on the mainboard 100 to connect the mainboard 100 with other circuit boards or electronic devices.

[0044] As the transmission rate of the communication system continues to increase, the connector 200 of the switch 1000 needs to transmit a large number of high-frequency signals. If the transmission line in the connector 200 adopts a structure of a substrate layer plus a nickel layer, the nickel layer is arranged on the outer surface of the substrate layer. Affected by the skin effect, when the transmission line transmits a high-frequency signal, the high-frequency signal is basically transmitted in the nickel layer, and the electrical loss is large. In addition, since nickel is magnetic, it will further increase the high-frequency insertion loss. As a result, the signal insertion loss of the transmission line is large, and the performance index of signal integrity cannot be met.

[0045] Therefore, in order to solve the above problems, the embodiment of the present application provides a connector 200 with an improved structure to reduce high-frequency insertion loss and meet the performance indicators of signal integrity.

[0046] Figure 3 This is a specific embodiment of the connector 200 of the present application. Figure 3 The connector 200 includes a housing 10 and a connector terminal 20, and the connector terminal 20 is disposed on the housing 10. The housing 10 is made of insulating material. The connector terminal 20 includes a transmission line 1, and the number of the transmission lines 1 can be multiple, which is not limited in this application. Figure 4 As shown, the transmission line 1 includes a substrate layer 11 and a first protective layer 12. The substrate layer 11 can be made of a conductive material, such as copper, copper alloy, or other conductive metal or non-metal materials. The first protective layer 12 is disposed on the outer surface of the substrate layer 11. The conductivity of the first protective layer 12 is greater than the conductivity of the substrate layer 11 and is greater than 30% iacs. The international annealed copper standard is used to characterize the conductivity of metals or alloys (with reference to standard annealed pure copper). The conductivity of standard annealed pure copper is 100% iacs, which is 5.80E+7 (1 / Ω·m) or 58m / Ω·mm 2 .

[0047] Therefore, compared to the transmission line 1 using nickel as the first protective layer 12, the outer surface of the substrate layer 11 in the transmission line 1 of the embodiment of the present application is provided with a first protective layer 12 having a conductivity greater than that of the substrate layer 11 and greater than 30% iacs. The conductivity of the first protective layer 12 is relatively high, and the electromagnetic transmission efficiency is relatively high. Therefore, when transmitting high-frequency signals (such as signals above 1 GHz), the electrical signals in the transmission line 1 will be affected by the skin effect. When the electromagnetic transmission frequency is high, the skin depth is shallow, and more energy is transmitted in the first protective layer 12. The first protective layer 12 has a small resistance, can effectively transmit electrical signals, and has a high transmission efficiency. Furthermore, the electrical loss during signal transmission is reduced, the insertion loss is reduced, and a benefit of 17.2% to 20.86% can be brought about.

[0048] The transmission line 1 can have a variety of structural forms, and the corresponding transmission line 1 form is selected according to the type of the connector 200. In some embodiments of the present application, the connector 200 is as follows: Figure 3 The transmission line 1 in the connector terminal 20 is a conductive sheet 1a. The cross section of the conductive sheet 1a can be as follows: Figure 4 That is, refer to Figure 4 The substrate layer 11 of the conductive sheet 1a is a rectangular sheet, and the first protective layer 12 can cover the entire outer surface of the substrate layer 11. The cross section of the first protective layer 12 is in the shape of a Chinese umbilical cord.

[0049] In some other embodiments of the present application, the connector 200 is a cable connector. Figure 5 As shown, the connector terminal 20 includes a transmission line 1 having a plurality of pins 1b. Figure 6 As shown, the cross section of the transmission line 1 can be circular. That is, the cross section of the substrate layer 11 of the transmission line 1 is circular, and the first protective layer 12 of the transmission line 1 can cover the entire outer surface of the substrate layer 11, and the cross section of the first protective layer 12 is circular.

[0050] In some other embodiments of the present application, the connector 200 may also be a high-speed connector having a circuit board. Figure 7 and Figure 8 As shown, the connector terminal 20 further includes a circuit board 2, the circuit board 2 includes a substrate and the transmission line 1, and the transmission line 1 is a metal trace 1c in the circuit board 2. The transmission line 1 can be formed on a substrate 21. For a multi-layer circuit board, the substrate 21 can be an insulating layer located at a lower layer or an upper layer of the metal trace 1c.

[0051] It should be noted that the metal trace 1c can be located on the surface of the circuit board 2 or inside the circuit board 2, and this application does not limit this. Figure 9a As shown, the first protective layer 12 is disposed on the upper surface of the substrate layer 11. Alternatively, as Figure 9b As shown, the first protective layer 12 is disposed on the lower surface of the substrate layer 11. Alternatively, as Fig.9c As shown, the metal trace 1c includes a first protective layer 12a and a first protective layer 12b, that is, two layers of first protective layers 12. The first protective layer 12a is arranged on the upper surface of the substrate layer 11, and the first protective layer 12b is arranged on the lower surface of the substrate layer 11, which has a better protective effect.

[0052] In addition, the first protective layer 12 can be disposed on the substrate layer 11 by electroplating, chemical plating, magnetron sputtering, deposition, etc., and the present application does not limit this. Moreover, the first protective layer 12 can be made of a variety of materials, and the present application does not limit this. It only needs to meet the above-mentioned requirements of conductivity greater than 30% iacs and non-magnetic.

[0053] Based on the above, in some embodiments of the present application, the first protective layer 12 is a copper layer. Copper has a very low resistivity and a fast conductivity, which makes the transmission efficiency of electrical signals high, and can reduce the electrical loss and insertion loss during signal transmission. In addition, copper is non-magnetic, and when transmitting low-frequency signals (such as signals within 10 GHz), there will be no abnormal increase in low-frequency band loss.

[0054] In some other embodiments of the present application, the first protective layer 12 is a graphene layer. The graphene layer has the advantages of high strength, good toughness, flexibility, and extremely high conductivity. The transmission efficiency of electrical signals in the graphene layer is very high, and the electrical loss and insertion loss during signal transmission are very small. In addition, graphene is not magnetic, and when transmitting low-frequency signals (such as signals within 10 GHz), there will be no abnormal increase in low-frequency band loss.

[0055] It should be noted that the physical and chemical properties of the transmission line 1 are different depending on the environment in which the transmission line 1 is used. For applications in a non-corrosive environment, only the first protective layer 12 can be provided on the substrate layer 11. For applications in a corrosive environment, the first protective layer 12 can be made of a material with corrosion resistance, or a surface of the first protective layer 12 away from the substrate layer 11 (i.e., the outer surface of the first protective layer 12) can be provided. Fig.10 and Fig.11 The second protective layer 13 shown. The second protective layer 13 can protect the substrate layer 11 and the first protective layer 12 to improve the corrosion resistance of the transmission line 1.

[0056] Therefore, in some embodiments of the present application, the second protective layer 13 includes any one or more of gold, silver, cobalt, tungsten, and nickel. That is, the material of the second protective layer 13 can be gold, silver, cobalt, tungsten, or nickel. Alternatively, the material of the second protective layer 13 can also be an alloy material containing one or more of gold, silver, cobalt, tungsten, and nickel, such as cobalt-tungsten (Co-W) alloy, nickel-tungsten (Ni-W) alloy, or nickel-phosphorus (Ni-P) alloy. All of the above materials have good corrosion resistance, ensuring that the transmission line 1 has good stability.

[0057] In addition, the second protective layer 13 can also be disposed on the first protective layer 12 in various ways, such as electroplating, chemical plating, magnetron sputtering, deposition, etc., which is not limited in the present application.

[0058] It should be noted that the thickness of the second protective layer 13 should be smaller than that of the first protective layer 12 to ensure that more energy in the electrical signal is transmitted in the first protective layer 12 and less energy is transmitted in the second protective layer 13 .

[0059] Furthermore, for the embodiment in which the transmission line 1 is a metal wiring 1c, the second protection layer 13 in the embodiment of the present application can be disposed on the upper surface, the lower surface, or the upper surface and the lower surface of the first protection layer 12, and the present application does not limit this. Fig.12a As shown, the first protective layer 12 can be disposed on the upper surface of the substrate layer 11, and the second protective layer 13 can be disposed on the upper surface of the first protective layer 12. Alternatively, as shown in Figure 12b As shown, the first protective layer 12 can be disposed on the lower surface of the substrate layer 11, and the second protective layer 13 can be disposed on the lower surface of the first protective layer 12. Alternatively, as Fig.12c As shown, the metal trace 1c includes a first protective layer 12a, a first protective layer 12b, a second protective layer 13a and a second protective layer 13b, that is, two layers of first protective layers 12 and two layers of second protective layers 13. The first protective layer 12a is arranged on the upper surface of the substrate layer 11, and the first protective layer 12b is also arranged on the lower surface of the substrate layer 11. The second protective layer 13a is arranged on the upper surface of the first protective layer 12a, and the second protective layer 13b is arranged on the lower surface of the first protective layer 12b.

[0060] Therefore, for the transmission line 1 provided with the first protective layer 12, in order to ensure that the energy of the electrical signal can be mainly transmitted through the first protective layer 12, the first protective layer 12 needs to have a certain thickness. Therefore, in some embodiments of the present application, the thickness T1 of the first protective layer 12 is in the range of 0.2 μm-10 μm, which can ensure that the first protective layer 12 can effectively transmit electrical signals at a low cost.

[0061] Accordingly, in some embodiments of the present application, the thickness T2 of the second protective layer 13 is in the range of 0.2 μm to 10 μm, which can ensure good corrosion resistance while having low cost.

[0062] The connector 200 includes the connector body including the circuit board 2 and the housing 10. In some embodiments of the present application, the connector 200 may also include: Fig.13 The connecting wire 30 shown is electrically connected to the connector terminal 20. Thus, it is convenient to connect electronic devices at a longer distance.

[0063] In addition, in order to illustrate the practical application effect of the above-mentioned connector 200, a specific example is described below.

[0064] Example 1

[0065] The connector 200 in this example includes a housing 10 and a connector terminal 20 disposed on the housing 10. The connector terminal 20 includes a transmission line 1, and the transmission line 1 includes a substrate layer 11, and a first protective layer 12 and a second protective layer 13 stacked on the outer surface of the substrate layer 11. Among them, the substrate layer 11 is made of a copper alloy material. The first protective layer 12 is made of pure copper material. The thickness T1 of the first protective layer 12 is 0.5μm. The first protective layer 12 is disposed on the outer surface of the substrate layer 11 by a deposition process. The second protective layer 13 is made of a cobalt-tungsten (Co-W) alloy material, and the thickness T2 of the second protective layer 13 is 0.2μm.

[0066] According to experimental detection and software simulation, at a transmission rate of 10 GHZ, the dielectric loss of the connector 200 of this example does not increase abnormally. Moreover, at a transmission rate of 28 GHZ, the electrical loss of the connector 200 using a nickel layer with a thickness of 1.27 μm as a protective layer is 2.728 db, while the electrical loss of the connector 200 of this example is 2.246 db. Compared with the two, the electrical loss of the connector 200 of this application is reduced by 0.482 db, which can bring a benefit of 17.67%.

[0067] Example 2

[0068] The connector 200 in this example includes a housing 10 and a connector terminal 20 disposed on the housing 10. The connector terminal 20 includes a transmission line 1, and the transmission line 1 includes a substrate layer 11, and a first protective layer 12 and a second protective layer 13 stacked on the outer surface of the substrate layer 11. Among them, the substrate layer 11 is made of copper alloy material. The first protective layer 12 is made of graphene material and is disposed on the substrate layer 11 through an electroplating process. The thickness T1 of the first protective layer 12 is 0.5μm. The second protective layer 13 is made of cobalt-tungsten alloy material. The thickness T2 of the second protective layer 13 is 0.2μm.

[0069] According to experimental detection and software simulation, at a transmission rate of 10 GHZ, the dielectric loss of the connector 200 of this example does not increase abnormally. Moreover, at a transmission rate of 28 GHZ, the electrical loss of the connector 200 of this example is 2.159 db. Compared with the connector 200 using a nickel layer with a thickness of 1.27 μm as a protective layer, the electrical loss of the connector 200 of the embodiment of the present application is reduced by 0.569 db, which can bring a benefit of 20.86%.

[0070] The specific implementation methods of this application are described in detail, but the protection scope of this application is not limited thereto. Any person skilled in the art who is familiar with this technical field can easily think of changes or substitutions within the technical scope disclosed in this application, which should be included in the protection scope of this application. Therefore, the protection scope of this application should be based on the protection scope of the claims.

Claims

1. A connector, characterized in that: A method for manufacturing a transmission line comprising a connector terminal, the connector terminal comprising a transmission line comprising: substrate layer; A first protective layer, wherein the first protective layer is arranged on the outer surface of the substrate layer; the conductivity of the first protective layer is greater than the conductivity of the substrate layer and is greater than 30% iacs.

2. The connector according to claim 1, characterized in that: The first protective layer is a copper layer or a graphene layer.

3. The connector according to claim 1 or 2, characterized in that: The thickness of the first protective layer ranges from 0.2 μm to 10 μm.

4. The connector according to any one of claims 1 to 3, characterized in that: The transmission line further comprises: A second protective layer is disposed on a surface of the first protective layer away from the substrate layer.

5. The connector according to claim 4, characterized in that: The second protective layer is made of any one or more of gold, silver, cobalt, tungsten and nickel.

6. The connector according to claim 4 or 5, characterized in that: The thickness of the second protective layer is smaller than that of the first protective layer.

7. The connector according to any one of claims 4 to 6, characterized in that: The thickness of the second protective layer ranges from 0.2 μm to 10 μm.

8. The connector according to any one of claims 1 to 7, characterized in that: The connector terminal also includes: A circuit board comprises a substrate and the transmission line, wherein the transmission line is arranged on the substrate.

9. The connector according to any one of claims 1 to 8, characterized in that: The connector further comprises: A connecting wire is electrically connected to the connector terminal.

10. An electronic device, characterized in that: It comprises a main board and the connector according to any one of claims 1 to 9, wherein the main board is electrically connected to the connector.

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