Automatically-controlled server split type cooling equipment

Abstract

The invention discloses an automatic control server split type cooling device which comprises a cabinet and a control cabinet, a first collecting pipe and a first flow dividing pipe are arranged in the cabinet, the first collecting pipe is connected with an output pipe, the output pipe is communicated with the interior of a second heat exchange plate, a plurality of first heat exchange plates are arranged in the cabinet, and the first heat exchange plates are connected with a plurality of second heat exchange plates. The surface of the communicating pipe is connected with a circulating pipe, and the surface of the circulating pipe is provided with a heat exchange block and a conveying pump. A controller and a refrigeration compressor are arranged in the control cabinet, a water conveying pipe, a water distribution pipe, a second flow distribution pipe and a backflow pipe are arranged on the two sides of the second heat exchange plate correspondingly, and the water distribution pipe is connected with a plurality of spraying pipes. An electromagnetic three-way valve is arranged at the joint of the return pipe, the first connecting pipe and the third connecting pipe, and a temperature detection mechanism is arranged on the surface of the return pipe. Cooling modes can be flexibly switched according to the temperature in the server mechanism, and the effects of efficient cooling and energy saving are achieved.

Description

Technical Field

[0001] The invention relates to the technical field of cooling, and in particular to an automatically controlled split-type cooling device for a server. Background Art

[0002] A server is a specific IT device that provides computing power and runs software applications in a network environment. It provides computing or application services to other clients in the network. For terminal devices such as personal computers, smart phones, and ATM machines, the server has the ability to respond to service requests, provide services, and guarantee services. Compared with ordinary computers, servers have high-speed CPU computing power, long-term reliable operation capabilities, powerful 1 / O data throughput capabilities, and high scalability. As an electronic device, the internal structure of the server is very complex. The main components of the server are: CPU, memory, chipset, I / O devices, storage, peripherals, voltage regulator, power supply, and cooling system.

[0003] For large server components, there are many server modules installed inside. When running for a long time or performing high-intensity computing, the server generates a lot of heat. If the heat cannot be discharged in time, it will not only affect the normal operation of the server, but also cause damage to the internal accessories of the server. Therefore, the cooling system of the server is an important auxiliary facility during the operation of the server.

[0004] In the prior art, a Chinese patent with announcement number: CN212460500U discloses a server cooling device, including a first box, a power socket, a controller, a compressor, a condenser, a heat sink, a drying filter, a capillary tube, a left evaporator assembly, a right evaporator assembly, a hollow partition, a second box, a fan, a temperature sensor, a sliding door, a heat dissipation hole and a temperature adjustment knob, wherein a power socket is installed outside the first box, a controller is installed by connecting the power socket wire, and a compressor is installed by connecting the controller wire. The advantages of the utility model are: by setting the initial adjustment temperature, it can be adjusted according to the ambient temperature to achieve the best cooling effect; the heat dissipation of the server is monitored in real time by the temperature sensor, so as to avoid overheating and overcooling, so that the server is always in a constant temperature environment; a steam compression refrigeration system is adopted, and the compressor, condenser, capillary tube, evaporator, etc. are connected into a sealed system with PPR pipes to increase the refrigeration area and improve the refrigeration effect; the cost is low and the later maintenance is more convenient.

[0005] In summary, the existing server cooling equipment mostly adopts air cooling or liquid cooling, and the heat dissipation components can be set on the back of the server or outdoors. For the cooling of a single server, the cooling effect can be improved by adding heat dissipation components, but the traditional cooling method has a cooling upper limit after all, and the existing servers mostly adopt a dense layout method. Continuing to use this design method not only takes up a large space, but also the cost far exceeds the budget. At the same time, these devices usually lack effective automatic control mechanisms and cannot automatically adjust the cooling capacity according to the server load and temperature changes, resulting in energy waste or insufficient cooling. Therefore, there is an urgent need to provide a split cooling device with automatic control. Summary of the invention

[0006] The object of the present invention is to provide an automatically controlled server split cooling device to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solution: an automatically controlled server split cooling device, comprising a cabinet and a control cabinet, wherein a plurality of temperature sensing probes are arranged inside the cabinet, wherein a first manifold and a first shunt pipe are arranged inside the cabinet, wherein the first manifold is connected to an output pipe, and the output pipe is connected to the inside of a second heat exchange plate, and the first shunt pipe is connected to an input pipe;

[0008] A plurality of first heat exchange plates are arranged inside the cabinet, and both ends of the plurality of first heat exchange plates are respectively connected with connecting pipes, the connecting pipes are connected with circulation pipes, and the circulation pipes are respectively connected with heat exchange blocks and delivery pumps;

[0009] The control cabinet is provided with a controller and a refrigeration compressor, the refrigeration compressor is connected with a first connecting pipe and a second connecting pipe, the second connecting pipe is connected with a third connecting pipe, and the third connecting pipe is connected with an input pipe;

[0010] A water delivery pipe, a water distribution pipe, a second flow distribution pipe and a return pipe are respectively arranged on both sides of the second heat exchange plate, the output pipe is connected to the second flow distribution pipe, and the second flow distribution pipe is connected to the second heat exchange plate and the return pipe, and the water distribution pipe is connected to a plurality of spray pipes;

[0011] An electromagnetic three-way valve is arranged at the connection between the return pipe, the first connecting pipe and the third connecting pipe, and a temperature detection mechanism is arranged on the surface of the return pipe.

[0012] Preferably, the first confluence pipe and the first diversion pipe are both connected to the interior of the first heat exchange plate and the interior of the circulation pipe through a connecting pipe, and the circulation pipe is connected to the interior of the first heat exchange plate;

[0013] A first fan is disposed on the surface of the first heat exchange plate.

[0014] Preferably, the plurality of temperature sensing probes match the positions of the plurality of first heat exchange plates;

[0015] A first solenoid valve is installed on the surface of the connecting pipe.

[0016] Preferably, a second solenoid valve and a first one-way valve are installed on the surfaces of the output pipe and the input pipe.

[0017] Preferably, a plurality of fourth solenoid valves are arranged on the surface of the second shunt pipe, and the fourth solenoid valves are located between the connection between the output pipe and the second shunt pipe.

[0018] Preferably, a plurality of second fans are arranged below the second heat exchange plate, and the spray pipe is located between the second fans and the second heat exchange plate.

[0019] Preferably, the water pipe is connected to a water storage tank, and a water pump is provided between the water pipe and the water storage tank.

[0020] Preferably, a second connecting pipe is connected between the refrigeration compressor and the third connecting pipe, and a second one-way valve is provided on the surface of the second connecting pipe.

[0021] Preferably, a third solenoid valve is provided at the connection between the water delivery pipe and the water distribution pipe.

[0022] Preferably, the controller is a PLC controller.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The present invention achieves the effect of improving heat dissipation efficiency and independence of the heat dissipation mechanism from the cabinet by setting a second heat exchange plate. The second heat exchange plate can be installed in an outdoor environment, realizing the effect of separation of the heat dissipation mechanism from the server, which not only avoids the heat emitted by the second heat dissipation plate from affecting the temperature of the space where the server is located and reduces the problem of large space occupied by the heat dissipation mechanism in the computer room, but also increases the heat exchange area, thereby effectively improving the cooling effect of the server;

[0025] 2. The present invention monitors the temperature in different cabinets in real time through the controller, thereby achieving the effect of reasonably allocating cooling modes for different servers. The controller automatically adjusts the cooling mode and mobilizes the corresponding cooling mechanism to cool the server. The controller has the ability to automatically adjust the cooling mode and can select the appropriate cooling mode according to the server operation conditions, which is beneficial to energy saving of the cooling equipment and ensuring the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the internal structure of the cabinet in the present invention;

[0027] Figure 2 It is a schematic diagram of the explosion structure of the cabinet in the present invention;

[0028] Figure 3 This is a schematic diagram of the appearance structure of the first heat exchange plate in the present invention;

[0029] Figure 4 For the present invention Figure 3 The enlarged structural diagram at A in the middle;

[0030] Figure 5 It is a schematic diagram of the cooling mechanism pipeline connection structure in the present invention;

[0031] Figure 6 It is a schematic diagram of the top view of the structure of the second heat exchange plate in the present invention;

[0032] Figure 7 It is a schematic diagram of the explosion structure of the second heat exchange plate in the present invention.

[0033] In the figure:

[0034] 100, cabinet; 110, first heat exchange plate; 111, first fan; 112, circulation pipe; 113, heat exchange block; 114, delivery pump; 115, connecting pipe; 116, first solenoid valve; 120, first manifold; 121, output pipe; 122, first check valve; 130, first shunt pipe; 131, input pipe; 140, second solenoid valve;

[0035] 200, control cabinet; 210, controller; 220, refrigeration compressor; 221, first connecting pipe; 222, second connecting pipe; 223, third connecting pipe; 224, second one-way valve;

[0036] 300, second heat exchange plate; 310, water storage tank; 311, water pump; 312, water pipe; 313, water distribution pipe; 314, third solenoid valve; 315, spray pipe; 320, second distribution pipe; 321, fourth solenoid valve; 330, return pipe; 331, temperature detection mechanism; 340, electromagnetic three-way valve; 350, second fan. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] See also Figures 1 to 7 , the present invention provides the following four embodiments:

[0039] An automatically controlled split-type cooling device for a server includes a cabinet 100 and a control cabinet 200.

[0040] See also Figures 1 to 4 A first manifold 120 and a first diverter 130 are provided inside the cabinet 100. The first manifold 120 is connected to an output pipe 121, and the output pipe 121 is communicated with the inside of the second heat exchange plate 300. The first diverter 130 is connected to an input pipe 131. A second solenoid valve 140 and a first one-way valve 122 are installed on the surfaces of the output pipe 121 and the input pipe 131.

[0041] A plurality of first heat exchange plates 110 are arranged inside the cabinet 100, and both ends of the plurality of first heat exchange plates 110 are respectively connected with connecting pipes 115, and a first solenoid valve 116 is installed on the surface of the connecting pipes 115. A circulation pipe 112 is connected to the surface of the circulating pipe 112, and a heat exchange block 113 and a delivery pump 114 are respectively arranged on the surface of the circulating pipe 112.

[0042] Multiple server modules can be arranged in the cabinet 100, and multiple temperature sensing probes are arranged inside the cabinet 100, and the multiple temperature sensing probes match the positions of the multiple first heat exchange plates 110; the temperature of the space where the server modules are located can be monitored in real time. When the server module is installed, the heat exchange block 113 can be bonded to the core chip of the server and the chip with high heat generation, and thermal grease is applied between the bonding surfaces to achieve heat transfer between the chip and the heat exchange block 113.

[0043] The first confluence pipe 120 and the first diversion pipe 130 are both connected to the interior of the first heat exchange plate 110 and the interior of the circulation pipe 112 through the connecting pipe 115, and the circulation pipe 112 is connected to the interior of the first heat exchange plate 110;

[0044] The first fan 111 is disposed on the surface of the first heat exchange plate 110. The second solenoid valve 140 and the first check valve 122 are installed on the surfaces of the output pipe 121 and the input pipe 131.

[0045] See also Figures 5 to 7 A controller 210 and a refrigeration compressor 220 are provided inside the control cabinet 200. The refrigeration compressor 220 is connected to a first connecting pipe 221 and a second connecting pipe 222. The second connecting pipe 222 is connected to a third connecting pipe 223. The third connecting pipe 223 is connected to the input pipe 131.

[0046] A water supply pipe 312, a water distribution pipe 313, a second diversion pipe 320 and a return pipe 330 are respectively arranged on both sides of the second heat exchange plate 300, the output pipe 121 is connected to the second diversion pipe 320, and the second diversion pipe 320 is connected to the second heat exchange plate 300 and the return pipe 330, the water distribution pipe 313 is connected to a plurality of spray pipes 315, and a third solenoid valve 314 is arranged at the connection between the water supply pipe 312 and the water distribution pipe 313.

[0047] A plurality of second fans 350 are disposed below the second heat exchange plate 300, and the spray pipe 315 is located between the second fans 350 and the second heat exchange plate 300. The water pipe 312 is connected to the water storage tank 310, and a water pump 311 is disposed between the water pipe 312 and the water storage tank 310.

[0048] An electromagnetic three-way valve 340 is provided at the connection between the return pipe 330 , the first connecting pipe 221 and the third connecting pipe 223 , and a temperature detection mechanism 331 is provided on the surface of the return pipe 330 .

[0049] A plurality of fourth solenoid valves 321 are disposed on the surface of the second shunt pipe 320 , and the fourth solenoid valves 321 are located between the connection between the output pipe 121 and the second shunt pipe 320 .

[0050] A second connecting pipe 222 is connected between the refrigeration compressor 220 and the third connecting pipe 223 , and a second one-way valve 224 is disposed on the surface of the second connecting pipe 222 .

[0051] The controller 210 is a PLC controller.

[0052] Embodiment 1:

[0053] When the server module corresponding to the first heat exchange plate 110 is in a low-frequency operation mode, the server module generates less heat, and when the temperature is below 15°C, the first solenoid valves 116 at both ends of the first heat exchange plate 110 are closed, and the first heat exchange plate 110 is separated from the external second heat exchange plate 300. The heat generated by the server module is discharged from the cabinet 100 only through the first fan 111 on the surface of the first heat exchange plate 110. At this time, the cooling mode is an energy-saving mode.

[0054] Embodiment 2:

[0055] When the temperature of the server module rises to the range of 20-30°C, the first solenoid valve 116 remains closed, and the delivery pump 114 on the surface of the circulation pipe 112 starts to operate, driving the cooling medium circulating in the circulation pipe 112 and the first heat exchange plate 110, so that the cooling medium circulates inside the first heat exchange plate 110, the circulation pipe 112 and the heat exchange block 113. After passing through the heat exchange block 113, the cooling medium absorbs the heat of the heat exchange block 113 and flows back to the first heat exchange plate 110. The cooling medium disperses the heat to the fins in the first heat exchange plate 110, cooperates with the airflow generated by the operation of the first fan 111, and discharges the heat from the first heat exchange plate 110 through the heat transfer generated by the contact between the air and the fins, thereby achieving overall cooling of the internal chips of the server module and the space where the server module is located. At this time, the cooling mode is a low-frequency mode.

[0056] Embodiment three:

[0057] When the temperature of the server module rises to 35-60°C, the low-frequency mode is adjusted to the load mode, and the first solenoid valves 116 at both ends of the first heat exchange plate 110 are opened to connect the cooling medium in the first heat exchange plate 110 and the circulation pipe 112 with the second heat exchange plate 300. The cooling medium in the first heat exchange plate 110 and the circulation pipe 112 that absorbs heat is transmitted to the second shunt pipe 320 through the output pipe 121. The second shunt pipe 320 injects the cooling medium into the second heat exchange plate 300. The cooling medium contacts the fins in the second heat exchange plate 300 and conducts the heat to the fins in the second heat exchange plate 300. In conjunction with the operation of the second fan 350, the operation of the second fan 350 generates airflow passing through the fins to dissipate the heat on the fins. The cooling medium is then dissipated, thereby reducing the temperature of the cooling medium circulating in the second heat exchange plate 300. The cooling medium after cooling flows back to the return pipe 330. The electromagnetic three-way valve 340 keeps the return pipe 330 connected with the third connecting pipe 223. The temperature detection mechanism 331 detects the temperature of the cooling medium in the return pipe 330. If the temperature of the return cooling medium is greater than 30°C, the controller 210 controls the third electromagnetic valve 314 to open, and the spray pipe 315 sprays water mist, which acts on the lower part of the second heat exchange plate 300. In conjunction with the airflow generated by the second fan 350, the water mist contacts the surface of the fins in the second heat exchange plate 300, increasing the heat exchange efficiency between the fins and the air, achieving a better heat exchange effect, and further reducing the temperature of the cooling medium. At the same time, if the cooling medium is not fully circulated in the second heat exchange plate 300, the fourth electromagnetic valve 321 can be opened, and the output pipe 121 can be added to the pipeline for conveying the cooling medium in the second heat exchange plate 300, thereby increasing the heat exchange area and increasing the cooling efficiency of the cooling medium.

[0058] The cooled cooling medium flows back to the first branch pipe 130 through the third connecting pipe 223 and the input pipe 131, and flows back to the first heat exchange plate 110 and the circulation pipe 112 through the connecting pipe 115, forming a circulating flow of the cooling medium.

[0059] Embodiment 4:

[0060] When the temperature of the server module rises above 65°C, the load mode is adjusted to the overclocking mode, the third solenoid valve 314 is closed, and the solenoid three-way valve 340 keeps the return pipe 330 connected to the first connecting pipe 221, and the cooling medium passing through the second heat exchange plate 300 is input into the refrigeration compressor 220, and the cooling medium is further cooled by the refrigeration compressor 220 and transmitted to the input pipe 131 through the second connecting pipe 222 and the third connecting pipe 223, so as to realize the circulation of the cooling medium.

[0061] Working principle: In actual operation, multiple server modules can be arranged in the cabinet 100, and a temperature sensor probe corresponding to the position of the server module and the first heat exchange plate 110 is arranged in the cabinet 100, which can monitor the temperature of the space where the server module is located in real time. When the server module is installed, the heat exchange block 113 can be bonded to the core chip of the server and the chip with high heat generation, and thermal grease is applied between the bonding surfaces to achieve heat transfer between the chip and the heat exchange block 113.

[0062] When the server module corresponding to the first heat exchange plate 110 is in a low-frequency operation mode, the server module generates less heat, and when the temperature is below 15°C, the first solenoid valves 116 at both ends of the first heat exchange plate 110 are closed, and the first heat exchange plate 110 is separated from the external second heat exchange plate 300. The heat generated by the server module is discharged from the cabinet 100 only through the first fan 111 on the surface of the first heat exchange plate 110. At this time, the cooling mode is an energy-saving mode.

[0063] When the temperature of the server module rises to the range of 20-30°C, the first solenoid valve 116 remains closed, and the delivery pump 114 on the surface of the circulation pipe 112 starts to operate, driving the cooling medium circulating in the circulation pipe 112 and the first heat exchange plate 110, so that the cooling medium circulates inside the first heat exchange plate 110, the circulation pipe 112 and the heat exchange block 113. After passing through the heat exchange block 113, the cooling medium absorbs the heat of the heat exchange block 113 and flows back to the first heat exchange plate 110. The cooling medium disperses the heat to the fins in the first heat exchange plate 110, cooperates with the airflow generated by the operation of the first fan 111, and discharges the heat from the first heat exchange plate 110 through the heat transfer generated by the contact between the air and the fins, thereby achieving overall cooling of the internal chips of the server module and the space where the server module is located. At this time, the cooling mode is a low-frequency mode.

[0064] When the temperature of the server module rises to 35-60°C, the low-frequency mode is adjusted to the load mode, and the first solenoid valves 116 at both ends of the first heat exchange plate 110 are opened to connect the cooling medium in the first heat exchange plate 110 and the circulation pipe 112 with the second heat exchange plate 300. The cooling medium in the first heat exchange plate 110 and the circulation pipe 112 that absorbs heat is transmitted to the second shunt pipe 320 through the output pipe 121. The second shunt pipe 320 injects the cooling medium into the second heat exchange plate 300. The cooling medium contacts the fins in the second heat exchange plate 300 and conducts the heat to the fins in the second heat exchange plate 300. In conjunction with the operation of the second fan 350, the operation of the second fan 350 generates airflow passing through the fins to dissipate the heat on the fins. The cooling medium is then dissipated, thereby reducing the temperature of the cooling medium circulating in the second heat exchange plate 300. The cooling medium after cooling flows back to the return pipe 330. The electromagnetic three-way valve 340 keeps the return pipe 330 connected with the third connecting pipe 223. The temperature detection mechanism 331 detects the temperature of the cooling medium in the return pipe 330. If the temperature of the return cooling medium is greater than 30°C, the controller 210 controls the third electromagnetic valve 314 to open, and the spray pipe 315 sprays water mist, which acts on the lower part of the second heat exchange plate 300. In conjunction with the airflow generated by the second fan 350, the water mist contacts the surface of the fins in the second heat exchange plate 300, increasing the heat exchange efficiency between the fins and the air, achieving a better heat exchange effect, and further reducing the temperature of the cooling medium. At the same time, if the cooling medium is not fully circulated in the second heat exchange plate 300, the fourth electromagnetic valve 321 can be opened, and the output pipe 121 can be added to the pipeline for conveying the cooling medium in the second heat exchange plate 300, thereby increasing the heat exchange area and increasing the cooling efficiency of the cooling medium.

[0065] The cooled cooling medium flows back to the first branch pipe 130 through the third connecting pipe 223 and the input pipe 131, and flows back to the first heat exchange plate 110 and the circulation pipe 112 through the connecting pipe 115, forming a circulating flow of the cooling medium.

[0066] When the temperature of the server module rises above 65°C, the load mode is adjusted to the overclocking mode, the third solenoid valve 314 is closed, and the solenoid three-way valve 340 keeps the return pipe 330 connected to the first connecting pipe 221, and the cooling medium passing through the second heat exchange plate 300 is input into the refrigeration compressor 220, and the cooling medium is further cooled by the refrigeration compressor 220 and transmitted to the input pipe 131 through the second connecting pipe 222 and the third connecting pipe 223, so as to realize the circulation of the cooling medium.

[0067] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An automated controlled server split cooling device, characterized in that: The invention comprises a cabinet (100) and a control cabinet (200), wherein a plurality of temperature sensing probes are arranged inside the cabinet (100), a first manifold (120) and a first shunt pipe (130) are arranged inside the cabinet (100), the first manifold (120) is connected to an output pipe (121), and the output pipe (121) is connected to the inside of a second heat exchange plate (300), and the first shunt pipe (130) is connected to an input pipe (131); A plurality of first heat exchange plates (110) are arranged inside the cabinet (100), two ends of the plurality of first heat exchange plates (110) are respectively connected to connecting pipes (115), the connecting pipes (115) are connected to circulation pipes (112), and the circulation pipes (112) are respectively connected to heat exchange blocks (113) and delivery pumps (114); The control cabinet (200) is provided with a controller (210) and a refrigeration compressor (220), the refrigeration compressor (220) is connected to a first connecting pipe (221) and a second connecting pipe (222), the second connecting pipe (222) is connected to a third connecting pipe (223), and the third connecting pipe (223) is connected to an input pipe (131); A water delivery pipe (312), a water distribution pipe (313), a second flow distribution pipe (320) and a return pipe (330) are respectively arranged on both sides of the second heat exchange plate (300); the output pipe (121) is connected to the second flow distribution pipe (320), and the second flow distribution pipe (320) is connected to the second heat exchange plate (300) and the return pipe (330); and the water distribution pipe (313) is connected to a plurality of spray pipes (315); An electromagnetic three-way valve (340) is provided at the connection between the return pipe (330), the first connecting pipe (221) and the third connecting pipe (223), and a temperature detection mechanism (331) is provided on the surface of the return pipe (330).

2. The automatic controlled server split cooling device according to claim 1 is characterized in that: The first confluence pipe (120) and the first diversion pipe (130) are both connected to the interior of the first heat exchange plate (110) and the interior of the circulation pipe (112) through the connecting pipe (115), and the circulation pipe (112) is connected to the interior of the first heat exchange plate (110); A first fan (111) is disposed on the surface of the first heat exchange plate (110).

3. The automatic controlled server split cooling device according to claim 1 or 2, characterized in that: A plurality of temperature sensing probes match the positions of the plurality of first heat exchange plates (110); A first solenoid valve (116) is installed on the surface of the connecting pipe (115).

4. The automatic controlled server split cooling device according to claim 1 is characterized in that: A second solenoid valve (140) and a first one-way valve (122) are installed on the surfaces of the output pipe (121) and the input pipe (131).

5. The automatic controlled server split cooling device according to claim 1 is characterized in that: A plurality of fourth solenoid valves (321) are arranged on the surface of the second shunt pipe (320), and the fourth solenoid valves (321) are located between the connection point between the output pipe (121) and the second shunt pipe (320).

6. The automatic controlled server split cooling device according to claim 1, characterized in that: A plurality of second fans (350) are arranged below the second heat exchange plate (300), and the spray pipe (315) is located between the second fans (350) and the second heat exchange plate (300).

7. The automatic controlled server split cooling device according to claim 1, characterized in that: The water delivery pipe (312) is connected to the water storage tank (310), and a water pump (311) is provided between the water delivery pipe (312) and the water storage tank (310).

8. The automatic controlled server split cooling device according to claim 1, characterized in that: A second connecting pipe (222) is connected between the refrigeration compressor (220) and the third connecting pipe (223), and a second one-way valve (224) is provided on the surface of the second connecting pipe (222).

9. The automatic controlled server split cooling device according to claim 1, characterized in that: A third solenoid valve (314) is provided at the connection between the water delivery pipe (312) and the water distribution pipe (313).

10. The automatic controlled server split cooling device according to claim 1, characterized in that: The controller (210) is a PLC controller.

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