A processing device and method for display PCB board

Abstract

The present invention relates to the technical field of PCBA placement machines, and specifically discloses a processing device and a processing method for display PCB boards, including: a main frame and a PCBA placement machine, wherein the PCBA placement machine is arranged at the bottom end of the inner cavity of the main frame; the number of patch components is several, and the several patch components are arranged at the front top of the PCBA placement machine at equal distances along the left and right directions. The device can monitor the downward pressure of the patch claw on the PCB board in real time, ensuring that the downward pressure is always maintained within a safe and reasonable range, thereby avoiding the breakage of the PCB board caused by excessive downward pressure, significantly reducing the risk of material loss and production interruption, and improving the overall stability and production efficiency of the production line. In addition, the present invention can also effectively identify and correct the situation of skewed insertion of components, greatly improving the reliability of circuit connection and the final performance of the product, reducing the product defect rate and rework costs, and bringing significant economic benefits and competitive advantages to the enterprise.

Description

Technical Field

[0001] The present invention relates to the technical field of PCBA placement machines, and in particular to a processing device and a processing method for a display PCB board. Background Art

[0002] In the modern electronic manufacturing industry, the processing of display PCB boards is a key link. Its quality and efficiency directly affect the performance and production cost of the final product. With the continuous growth of demand for electronic products, higher requirements are placed on the accuracy and speed of PCB board processing. Although traditional PCB board processing devices have met production needs to a certain extent, they still have some shortcomings, which are mainly reflected in the following aspects:

[0003] In the process of mounting PCBs, the traditional PCB mounting device lacks effective pressure monitoring and control means, which can easily cause the mounting claws to exert excessive pressure on the PCB, causing the PCB to break or components to be damaged. In addition, the height control during the mounting process is not accurate, which may cause the components to be inserted crookedly or not fully inserted into the holes of the PCB, affecting the reliability of the circuit connection.

[0004] Traditional PCB processing equipment has a low degree of automation and mainly relies on manual operation and simple mechanical structure, which makes it difficult to meet the needs of large-scale and high-efficiency production. Especially in the production mode of multiple varieties and small batches, the efficiency and accuracy of manual operation are difficult to guarantee, and human errors are prone to occur, resulting in production interruptions and increased costs;

[0005] Existing PCB processing devices usually lack real-time monitoring and alarm mechanisms, and are unable to promptly detect and handle abnormalities during the patch process. For example, when the patch claws exert excessive pressure on the PCB, the traditional device cannot stop the patch operation in time, resulting in damage to the PCB; in addition, the traditional device cannot effectively monitor and correct abnormalities in the insertion height and position of components. Summary of the invention

[0006] The purpose of the present invention is to provide a processing device and a processing method for a display PCB board, so as to solve the problems existing in the prior art that the PCB board is easily damaged and the quality of the patch cannot be monitored.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a processing device and a processing method for a display PCB board, comprising: a main frame and a PCBA mounter, the PCBA mounter is arranged at the bottom end of the inner cavity of the main frame; the number of patch components is several, and the several patch components are arranged equidistantly along the left and right directions at the front top of the PCBA mounter; the number of slide rails is two, and the two slide rails are respectively arranged at the front and rear sides of the bottom end of the inner cavity of the main frame; the screw is arranged in the middle of the bottom end of the inner cavity of the main frame; the height monitoring mechanism is arranged at the bottom end of the inner cavity of the main frame; the tray mechanism is screwed to the outer wall of the screw; the number of pull-down plates is two, and the two pull-down plates are respectively arranged at the front and rear sides of the bottom end of the inner cavity of the main frame; the pressure sensor is arranged in the middle of the bottom end of the inner cavity of the main frame, and the pressure sensor is located between the two pull-down plates.

[0008] Preferably, the patch assembly includes: a mounting rod, which is arranged at the front top of the PCBA placement machine; a sleeve, which is slidably adapted to be matched with the bottom end of the outer wall of the mounting rod; a patch claw is arranged at the bottom end of the sleeve; the top end of the electric telescopic rod is arranged at the top end of the inner cavity of the mounting rod, and the bottom end of the electric telescopic rod is arranged at the bottom end of the inner cavity of the sleeve, and the electric telescopic rod and the pressure sensor are electrically connected.

[0009] Preferably, in order to drive the PCB board to move, the tray mechanism includes: a moving plate, the front and rear sides of the bottom end of the moving plate are respectively slidably adapted to be matched with the outer walls of the two slide rails, and the moving plate is screwed to the outer wall of the screw; the number of telescopic rods is four, the outer walls of the four telescopic rods are respectively slidably inserted into the four corners of the top end of the moving plate, and the bottom end of the telescopic rod extends to the bottom of the screw; the second spring is sleeved on the top of the outer wall of the telescopic rod, and the bottom end of the second spring is clamped on the top of the moving plate; the four corners of the top end of the pressure plate are respectively arranged at the bottom ends of the four telescopic rods, and the bottom end of the pressure plate is in contact with the top end of the pressure sensor; the four corners of the bottom end of the tray are respectively arranged at the top ends of the four telescopic rods.

[0010] Preferably, in order to promote contact between the pressure plate and the pressure sensor, the tray mechanism also includes: a connecting rod, two connecting rods, and the two connecting rods are respectively arranged in the middle of the front and rear sides of the pressure plate; the roller is rotatably connected to the bottom end of the outer wall of the connecting rod through a bearing, and the top end of the outer wall of the two rollers is respectively in contact with the midpoint of the outer side of the bottom end of the two pull-down plates.

[0011] Preferably, a laser sensor is provided at the rear side of the bottom end of the inner cavity of the main frame, and a laser receiver is provided at the middle of the rear side of the bottom end of the pressure plate, and the position of the laser sensor corresponds to and matches the position of the laser receiver.

[0012] Preferably, in order to adjust the height of the movable frame and monitor the height of components, the height monitoring mechanism includes: legs, the number of the legs is four, the four legs are respectively arranged at the four corners of the bottom end of the inner cavity of the main frame, and a plurality of slots are opened at equal intervals in the upper and lower directions on the inner middle parts of the legs; the four corners of the movable frame can be slidably adapted to be matched with the outer walls of the four legs, an extrusion groove is opened on the inner side of the inner cavity of the movable frame, an infrared grating sensor is arranged on the rear side of the movable frame, and an infrared grating receiver is arranged on the front side of the movable frame, and the positions of the infrared grating sensor and the infrared grating receiver correspond to each other and match each other; a first spring is embedded in the inner cavity of the extrusion groove, and one end of the first spring is clamped to the inner wall of the extrusion groove; a part of the clamping ball is embedded in the inner cavity of the extrusion groove, and the other part of the clamping ball is adapted to extend into the inner cavity of the corresponding clamping groove, and the other end of the first spring is clamped to the outer wall of the clamping ball.

[0013] Preferably, the outer wall of the leg is provided with scale lines.

[0014] Preferably, the length of the card ball extending into the inner cavity of the card slot is smaller than its radius.

[0015] The present invention provides a processing device and a processing method for a display PCB board, which have the following beneficial effects:

[0016] 1. The present invention places the PCB board on a tray, and the cooperation between the screw rod and the slide rail can be used to drive the tray to move by a moving plate, thereby driving the PCB board to move, and the PCBA placement machine drives the placement claw to move, so that the PCB board can be placed.

[0017] 2. The present invention utilizes the cooperation between the pressure plate and the pressure sensor to monitor the downward pressure applied by the patch claw on the PCB board. If the downward pressure applied is too large, the electric telescopic rod will be activated to drive the patch claw to move upward, thereby preventing the patch claw from damaging the PCB board.

[0018] 3. In the present invention, if the pins of the device are not accurately and completely inserted into the holes of the PCB board, or the components are inserted crookedly, the height of the components will increase. Therefore, the height of the components of the patch can be monitored by the cooperation between the infrared grating receiver and the infrared grating sensor, which can indirectly reflect the quality of the patch.

[0019] 4. The device can monitor the downward pressure of the patch claw on the PCB board in real time, and immediately trigger an alarm under abnormal circumstances. At the same time, the electric telescopic rod is used to pull the patch claw upward to ensure that the downward pressure is always maintained within a safe and reasonable range, thereby avoiding the breakage of the PCB board caused by excessive downward pressure, significantly reducing the risk of material loss and production interruption, and improving the overall stability and production efficiency of the production line. In addition, the present invention can also effectively identify and correct the situation of skewed insertion of components, greatly improving the reliability of circuit connection and the final performance of the product, reducing product defective rate and rework costs, and bringing significant economic benefits and competitive advantages to the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the structure of the main frame inner cavity;

[0022] Figure 3 It is a schematic diagram of the structure of the patch component;

[0023] Figure 4 This is the main cross-sectional view of the patch main component;

[0024] Figure 5 It is a schematic diagram of the structure of the height monitoring mechanism;

[0025] Figure 6 It is the right side view of the tray mechanism;

[0026] Figure 7 This is an exploded view of the tray mechanism;

[0027] Figure 8 It is a structural schematic diagram of the pull-down plate;

[0028] Fig. 9 It is a structural schematic diagram of the tray mechanism;

[0029] Fig.10 It is a top view of the height monitoring mechanism;

[0030] Fig.11 It is a right side cross-sectional view of the height monitoring mechanism;

[0031] Fig.12 for Figure 4 A magnified image of point A;

[0032] Fig.13 for Figure 7 A magnified view of point B;

[0033] Fig.14 for Figure 7 Enlarged view of point C;

[0034] Fig.15 for Fig. 9 The enlarged view of point D;

[0035] Fig.16 for Fig.11 The enlarged view of point E;

[0036] Fig.17 for Figure 2 The enlarged view of F;

[0037] Fig.18 for Figure 6 Enlarged view of point G.

[0038] In the figure: 1. Main frame; 2. PCBA placement machine; 3. Patch assembly; 301. Mounting rod; 302. Sleeve; 303. Patch claw; 304. Electric telescopic rod; 4. Slide rail; 5. Screw; 6. Height monitoring mechanism; 61. Leg; 62. Slot; 63. Movable frame; 64. Extrusion slot; 65. First spring; 66. Card ball; 67. Infrared grating sensor; 68. Infrared grating receiver; 7. Tray mechanism; 71. Moving plate; 72. Telescopic rod; 73. Second spring; 74. Press plate; 75. Tray; 76. Connecting rod; 77. Roller; 78. Laser receiver; 8. Pull-down plate; 9. Pressure sensor; 10. Laser sensor. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] See also Figure 1-Figure 18The present invention provides a processing device and a processing method for a display PCB board, comprising: a main frame 1, a PCBA mounter 2, a patch assembly 3, a slide rail 4, a screw 5, a height monitoring mechanism 6, a tray mechanism 7, a pull-down plate 8, a pressure sensor 9 and a laser sensor 10. The PCBA mounter 2 is arranged at the bottom end of the inner cavity of the main frame 1. The PCBA mounter 2 is a prior art and will not be described in detail herein. The PCBA mounter 2 is used to drive the patch claw 303 to move, thereby performing a patch operation on the PCB board. The number of patch assemblies 3 is several, and several patch assemblies 3 are arranged at the front top of the PCBA mounter 2 equidistantly in the left and right directions. The patch assembly 3 is used to perform patch operation on the PCB board. The number of slide rails 4 is two, and the two slide rails 4 are respectively arranged at the front and rear sides of the inner cavity bottom end of the main frame 1. The screw 5 is arranged in the middle of the inner cavity bottom end of the main frame 1, and the screw 5 is connected to the external screw 5 and the driving motor. The screw 5 can be driven to rotate, and the rotational force generated by the rotation of the screw 5 can prompt the moving plate 71 to drive the PCB board to move. The height monitoring mechanism 6 is arranged at the bottom end of the inner cavity of the main frame 1, and the height monitoring mechanism 6 is used to monitor the patch height of the components. The tray mechanism 7 is screwed to the outer wall of the screw 5, and the tray mechanism 7 is used to store the PCB board. There are two pull-down plates 8, and the two pull-down plates 8 are respectively arranged on the front and rear sides of the bottom end of the inner cavity of the main frame 1. The pressure sensor 9 is arranged in the middle of the bottom end of the inner cavity of the main frame 1, and the pressure sensor 9 is located between the two pull-down plates 8. The pressure sensor 9 is a prior art and will not be described in detail here. The pressure sensor 9 is used here to monitor the downward pressure applied by the patch claw 303 to the PCB board. The laser sensor 10 is arranged on the rear side of the bottom end of the inner cavity of the main frame 1. The laser sensor 10 is a prior art and will not be described in detail here. The laser sensor 10 and the laser receiver 78 can cooperate to control the stop of the rotation of the screw 5.

[0041] As a preferred solution, further, the patch assembly 3 includes: a mounting rod 301, a sleeve 302, a patch claw 303 and an electric telescopic rod 304. The mounting rod 301 is arranged at the front top of the PCBA patch machine 2, and the sleeve 302 can be slidably adapted to be matched with the bottom end of the outer wall of the mounting rod 301. The patch claw 303 is arranged at the bottom end of the sleeve 302. The patch claw 303 is a prior art and will not be described in detail here. The patch claw 303 is used here to grab components and perform patch on the PCB board. The top end of the electric telescopic rod 304 is arranged at the top end of the inner cavity of the mounting rod 301, and the bottom end of the electric telescopic rod 304 is arranged at the bottom end of the inner cavity of the sleeve 302. The electric telescopic rod 304 and the pressure sensor 9 are electrically connected. The electric telescopic rod 304 is a prior art and will not be described in detail here. The electric telescopic rod 304 is used here to pull the patch claw 303 to move.

[0042] As a preferred solution, further, the tray mechanism 7 includes: a moving plate 71, a telescopic rod 72, a second spring 73, a pressure plate 74, a tray 75, a connecting rod 76, a roller 77 and a laser receiver 78. The front and rear sides of the bottom end of the moving plate 71 are slidably adapted to be matched with the outer walls of the two slide rails 4, the moving plate 71 is screwed to the outer wall of the screw 5, the number of the telescopic rods 72 is four, the outer walls of the four telescopic rods 72 are slidably inserted into the top four corners of the moving plate 71, the bottom end of the telescopic rod 72 extends to the bottom of the screw 5, the second spring 73 is sleeved on the top of the outer wall of the telescopic rod 72, the bottom end of the second spring 73 is clamped on the top of the moving plate 71, the second spring 73 is a rotation spring, which undergoes elastic deformation after being squeezed or stretched by external force, and returns to its initial state after the external force is removed. The second spring 73 is used here to push the tray 75 upward, and the top four corners of the pressure plate 74 are respectively arranged on the four telescopic rods 7 2, the bottom end of the pressure plate 74 is in contact with the top end of the pressure sensor 9, the four corners of the bottom end of the tray 75 are respectively arranged at the top ends of the four telescopic rods 72, the tray 75 is used to store the PCB board, the number of connecting rods 76 is two, and the two connecting rods 76 are respectively arranged in the middle of the front and rear sides of the pressure plate 74, the roller 77 is rotatably sleeved on the bottom end of the outer wall of the connecting rod 76 through a bearing, and the top ends of the outer walls of the two rollers 77 are respectively in contact with the midpoints of the outer sides of the bottom ends of the two pull-down plates 8, and the cooperation between the rollers 77 and the pull-down plates 8 can pull the pressure plate 74 to move up and down along the outer shape of the pull-down plates 8, and the laser receiver 78 is arranged in the middle of the rear side of the bottom end of the pressure plate 74, and the position of the laser sensor 10 corresponds to and matches the position of the laser receiver 78. The laser receiver 78 is a prior art and will not be described in detail here. The laser receiver 78 and the laser sensor 10 are used to control the rotation and stop of the screw 5.

[0043] As a preferred solution, further, the height monitoring mechanism 6 includes: a leg 61, a slot 62, a movable frame 63, an extrusion groove 64, a first spring 65, a card ball 66, an infrared grating sensor 67 and an infrared grating receiver 68. The number of the legs 61 is four, and the four legs 61 are respectively arranged at the four corners of the bottom end of the inner cavity of the main frame 1. A plurality of slots 62 are equidistantly provided in the middle inner side of the legs 61 along the up and down directions. The legs 61 can be used to support the movable frame 63. The outer wall of the legs 61 is provided with scale lines, and the height of the movable frame 63 can be read according to the scale lines. The four corners of the movable frame 63 can be slidably matched to the outer walls of the four legs 61, respectively. An extrusion groove 64 is provided on the inner side of the inner cavity of the movable frame 63. An infrared grating sensor 67 is provided on the rear side of the movable frame 63, and an infrared grating receiver 68 is provided on the front side of the movable frame 63. The positions of the infrared grating sensor 67 and the infrared grating receiver 68 correspond to each other and match each other. 67 and infrared grating receiver 68 are both prior art and will not be elaborated here. The cooperation between the infrared grating sensor 67 and the infrared grating receiver 68 can be used to monitor the patch height of the components. The first spring 65 is embedded in the inner cavity of the extrusion groove 64, and one end of the first spring 65 is clamped on the inner wall of the extrusion groove 64. The first spring 65 is a rotation spring, which undergoes elastic deformation after being squeezed or stretched by external force, and returns to its initial state after the external force is removed. The first spring 65 is used here to push the card ball 66 into the inner cavity of the card slot 62. A part of the card ball 66 is embedded in the inner cavity of the extrusion groove 64, and the other part of the card ball 66 is adapted to extend into the inner cavity of the corresponding card slot 62. The other end of the first spring 65 is clamped on the outer wall of the card ball 66. The cooperation between the card ball 66 and the card slot 62 can be used to fix the height of the movable frame 63. The length of the card ball 66 extending into the inner cavity of the card slot 62 is less than its radius, so as to ensure that the movable frame 63 can move up and down.

[0044] The working principle includes the following steps:

[0045] When the movable plate 71 moves to the bottom of the pull-down plate 8, the roller 77 drives the pressing plate 74 to move downward through the pull-down connecting rod 76, and then the pressing plate 74 drives the tray 75 to move through the telescopic rod 72, and squeezes the second spring 73 to cause elastic deformation, until the movable plate 71 moves to the position corresponding to the laser receiver 78 and the laser sensor 10, and then turns off the driving motor to stop the movement of the movable plate 71. At this time, the roller 77 moves to the bottom center of the pull-down plate 8, and the bottom end of the pressing plate 74 contacts the top of the pressure sensor 9.

[0046] Step 2: Use the PCBA placement machine 2 to drive the installation rod 301 and the patch claw 303 to move, so as to use the patch claw 303 to place patches on the PCB board. When an abnormality occurs and the downward pressure exerted by the patch claw 303 on the PCB board increases, the tray 75 drives the pressing plate 74 to press down the pressure sensor 9 through the telescopic rod 72. When the downward pressure value detected by the pressure sensor 9 is too large, the electric telescopic rod 304 is started, and the sleeve 302 and the patch claw 303 are driven to move upward by the electric telescopic rod 304 to prevent the patch claw 303 from continuing to press down the PCB board, and an alarm is issued to the main controller.

[0047] Step 3: According to the type of patch, the movable frame 63 is slid up and down along the outer wall of the leg 61, and then the card ball 66 is squeezed by the card slot 62 to move into the inner cavity of the squeeze slot 64, and the first spring 65 is squeezed to elastically deform until the card ball 66 completely moves out of the inner cavity of the card slot 62, and then the movable frame 63 can be slid up and down along the outer wall of the leg 61, and the movable frame 63 is moved to a suitable position according to the scale line on the outer wall of the leg 61, and the card ball 66 is pushed to move to the inner cavity of the card slot 62 corresponding to its current position under the elastic force of the first spring 65, and then the movable frame 63 is positioned, and when the patch claw 303 is used to patch the PCB board, the infrared grating sensor 67 and the infrared grating receiver 68 are used to monitor the height of the patch. When the patch is not completely inserted into the hole of the PCB board, and the component is inserted crookedly, the height of the component will be higher than the standard height of the component, and then the bad situation is monitored by the cooperation between the infrared grating sensor 67 and the infrared grating receiver 68, and an alarm is issued to the main controller;

[0048] Step 4. When the patch is completed, continue to start the drive motor to drive the screw 5 to rotate, thereby prompting the movable plate 71 to move to the next station. At the same time, under the elastic force of the second spring 73, the tray 75 can be pushed to drive the pressure plate 74 to move upward, thereby preventing the pressure plate 74 from rubbing against the pressure sensor 9.

[0049] In summary, the device can monitor the downward pressure of the patch claw 303 on the PCB board in real time, and immediately trigger an alarm under abnormal circumstances. At the same time, the electric telescopic rod 304 is used to pull the patch claw 303 upward to ensure that the downward pressure is always maintained within a safe and reasonable range, thereby avoiding the breakage of the PCB board caused by excessive downward pressure, significantly reducing the risk of material loss and production interruption, and improving the overall stability and production efficiency of the production line. In addition, the present invention can also effectively identify and correct the situation of skewed insertion of components, greatly improving the reliability of circuit connection and the final performance of the product, reducing product defective rate and rework costs, and bringing significant economic benefits and competitive advantages to the enterprise.

[0050] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A processing device for display PCB board, characterized in that: include: Main frame (1); A PCBA placement machine (2), wherein the PCBA placement machine (2) is arranged at the bottom end of the inner cavity of the main frame (1); SMD components (3), the number of the SMD components (3) being a plurality, and the plurality of SMD components (3) being arranged at equal distances in the left-right direction on the front top of the PCBA SMD machine (2); Slide rails (4), the number of the slide rails (4) being two, and the two slide rails (4) being respectively arranged at the front and rear sides of the bottom end of the inner cavity of the main frame (1); A screw rod (5), wherein the screw rod (5) is arranged at the middle of the bottom end of the inner cavity of the main frame (1); A height monitoring mechanism (6), wherein the height monitoring mechanism (6) is arranged at the bottom end of the inner cavity of the main frame (1); A tray mechanism (7), wherein the tray mechanism (7) is screwed to the outer wall of the screw rod (5); A pull-down plate (8), wherein the number of the pull-down plates (8) is two, and the two pull-down plates (8) are respectively arranged at the front and rear sides of the bottom end of the inner cavity of the main frame (1); A pressure sensor (9), the pressure sensor (9) being arranged in the middle of the bottom end of the inner cavity of the main frame (1), and the pressure sensor (9) being located between the two pull-down plates (8); The patch component (3) comprises: A mounting rod (301), wherein the mounting rod (301) is arranged on the top of the front side of the PCBA placement machine (2); A sleeve (302), wherein the sleeve (302) is slidably adapted to be matched with the bottom end of the outer wall of the mounting rod (301); A patch claw (303), the patch claw (303) being arranged at the bottom end of the sleeve (302); An electric telescopic rod (304), wherein the top end of the electric telescopic rod (304) is arranged at the top end of the inner cavity of the mounting rod (301), the bottom end of the electric telescopic rod (304) is arranged at the bottom end of the inner cavity of the sleeve (302), and the electric telescopic rod (304) and the pressure sensor (9) are electrically connected; The tray mechanism (7) comprises: A movable plate (71), wherein the front and rear sides of the bottom end of the movable plate (71) are respectively slidably adapted to be matched with the outer walls of the two slide rails (4), and the movable plate (71) is screwed to the outer wall of the screw rod (5); Telescopic rods (72), the number of the telescopic rods (72) being four, the outer walls of the four telescopic rods (72) being slidably plugged into the four corners of the top end of the movable plate (71), and the bottom ends of the telescopic rods (72) extending to below the screw rod (5); a second spring (73), the second spring (73) being sleeved on the top of the outer wall of the telescopic rod (72), and the bottom end of the second spring (73) being clamped on the top of the movable plate (71); A pressure plate (74), wherein the four corners of the top end of the pressure plate (74) are respectively arranged at the bottom ends of the four telescopic rods (72), and the bottom end of the pressure plate (74) is in contact with the top end of the pressure sensor (9); A tray (75), wherein four corners of the bottom end of the tray (75) are respectively arranged on the top ends of four telescopic rods (72); Connecting rods (76), the number of the connecting rods (76) being two, and the two connecting rods (76) being respectively arranged at the middle of the front and rear sides of the pressing plate (74); Rollers (77), the rollers (77) being rotatably sleeved on the bottom end of the outer wall of the connecting rod (76) via bearings, the top ends of the outer walls of the two rollers (77) respectively contacting the outer midpoints of the bottom ends of the two pull-down plates (8); The height monitoring mechanism (6) comprises: Support legs (61), the number of the support legs (61) being four, the four support legs (61) being respectively arranged at four corners of the bottom end of the inner cavity of the main frame (1), and a plurality of slots (62) being equidistantly provided in the middle of the inner side of the support legs (61) along the vertical direction; A movable frame (63), wherein the four corners of the movable frame (63) are respectively slidably adapted to be matched with the outer walls of the four legs (61), an extrusion groove (64) is provided on the inner side of the inner cavity of the movable frame (63), an infrared grating sensor (67) is provided on the rear side of the movable frame (63), and an infrared grating receiver (68) is provided on the front side of the movable frame (63), and the positions of the infrared grating sensor (67) and the infrared grating receiver (68) correspond to each other and match each other; a first spring (65), the first spring (65) being embedded in the inner cavity of the extrusion groove (64), and one end of the first spring (65) being clamped on the inner wall of the extrusion groove (64); A locking ball (66), a portion of which is embedded in the inner cavity of the extrusion groove (64), and another portion of which is adapted to extend into the inner cavity of the corresponding locking groove (62), and the other end of the first spring (65) is locked to the outer wall of the locking ball (66).

2. A processing device for display PCB board according to claim 1, characterized in that: A laser sensor (10) is arranged at the rear side of the bottom end of the inner cavity of the main frame (1), and a laser receiver (78) is arranged at the middle of the rear side of the bottom end of the pressure plate (74), and the position of the laser sensor (10) corresponds to and matches the position of the laser receiver (78).

3. A processing device for display PCB board according to claim 2, characterized in that: The outer wall of the supporting leg (61) is provided with scale lines.

4. A processing device for display PCB board according to claim 3, characterized in that: The length of the locking ball (66) extending into the inner cavity of the locking groove (62) is less than its radius.

5. A method for processing a display PCB board, which is applied to a processing device for a display PCB board as claimed in claim 4, specifically comprising the following steps: Step 1: When in use, the left and right ends of the screw rod (5) and the slide rail (4) are respectively connected to the screw rod (5) and the slide rail (4) of the previous station, and the drive motor for driving the screw rod (5) to rotate is connected. The PCB board to be patched is placed on the tray (75), and the drive motor is used to drive the screw rod (5) to rotate so that the initial moving plate (71) moves along the slide rail (4). When the moving plate (71) moves to the point where the roller (77) contacts the bottom end of the pull-down plate (8), the pull-down plate (8) can be used to cause the roller (77) to pass through the lower pull-down plate (8). Pull the connecting rod (76) to drive the pressure plate (74) to move downward, and then use the pressure plate (74) to drive the tray (75) to move through the telescopic rod (72), and squeeze the second spring (73) to cause elastic deformation, until the movable plate (71) moves to the position corresponding to the laser receiver (78) and the laser sensor (10), turn off the drive motor, and stop the movement of the movable plate (71). At this time, the roller (77) moves to the bottom center of the pull-down plate (8), and the bottom end of the pressure plate (74) contacts the top end of the pressure sensor (9); Step 2: Using the PCBA placement machine (2) to drive the installation rod (301) and the patch claw (303) to move, so as to use the patch claw (303) to place patches on the PCB board. When an abnormality occurs and the downward pressure applied by the patch claw (303) to the PCB board increases, the tray (75) drives the pressure plate (74) to press down the pressure sensor (9) through the telescopic rod (72). When the downward pressure value detected by the pressure sensor (9) is too large, the electric telescopic rod (304) is started, and the sleeve (302) and the patch claw (303) are driven to move upward by the electric telescopic rod (304) to prevent the patch claw (303) from continuing to press down the PCB board, and an alarm is sent to the main controller. Step 3: Slide the movable frame (63) up and down along the outer wall of the leg (61) according to the type of patch, and then use the card slot (62) to squeeze the card ball (66) to move it into the inner cavity of the extrusion slot (64), and squeeze the first spring (65) to elastically deform until the card ball (66) completely moves out of the inner cavity of the card slot (62), and then slide the movable frame (63) up and down along the outer wall of the leg (61), and move the movable frame (63) to a suitable position according to the scale line on the outer wall of the leg (61), and push the card ball (66) to move to the desired position under the elastic force of the first spring (65). The movable frame (63) is positioned in the inner cavity of the card slot (62) corresponding to its position, and the patch claw (303) is used to patch the PCB board, and the height of the patch is monitored by the infrared grating sensor (67) and the infrared grating receiver (68). When the patch is not completely inserted into the hole of the PCB board, and the component is inserted crookedly, the height of the component will be higher than the standard height of the component, and the bad situation is monitored by the cooperation between the infrared grating sensor (67) and the infrared grating receiver (68), and an alarm is sent to the main controller; Step 4: After the patching is completed, the drive motor is started to drive the screw (5) to rotate, thereby prompting the movable plate (71) to move to the next station. At the same time, under the elastic force of the second spring (73), the tray (75) can be pushed to drive the pressure plate (74) to move upward, thereby preventing the pressure plate (74) from rubbing against the pressure sensor (9).

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