Preparation method of high-condensation LED light source

Abstract

The invention relates to the technical field of LED light sources, and discloses a preparation method of a high-condensation LED light source, which comprises the following preparation steps: 1) providing a substrate, arranging a light-emitting area in the substrate, arranging an inner box dam in the light-emitting area, and forming a middle area by surrounding of the inner box dam; (2) a light-emitting chip is arranged on the middle area, and an inner ring area is arranged between the light-emitting chip and the inner side wall of the middle area; 3) arranging a fluorescent glue layer; (4) a light-transmitting glue layer is arranged, the lower portion of the light-transmitting glue layer is embedded into the light-emitting area, and the light-transmitting glue layer and the substrate form an integrated structure; the upper part of the light-transmitting glue layer extends to the upper part of the substrate to form an upper section; the lower portion of the light-transmitting glue layer is embedded in the light-emitting area, the light-transmitting glue layer and the substrate can form a more stable overall structure, the lower portion of the light-transmitting glue layer is limited by the circumferential direction of the light-emitting area, the light-transmitting glue layer is prevented from flowing towards the periphery excessively, the upper section of the light-transmitting glue layer can be kept to form a higher arch shape, the light irradiation range is limited, and the light emitting efficiency is improved. And the high-condensation irradiation effect is realized.

Description

Technical Field

[0001] The invention patent relates to the technical field of LED light sources, and specifically, to a method for preparing a high-concentration LED light source. Background Art

[0002] With the development of LED technology, LED light sources are now more and more widely used in daily life and in various industries. LED light sources have the advantages of small size, long life, high efficiency, etc. They can be used continuously for up to 100,000 hours. LED light sources have become the mainstream in the field of lighting.

[0003] In the prior art, an LED light source includes a substrate having a recessed light-emitting area, a light-emitting chip disposed on the light-emitting area, and a fluorescent adhesive layer covering the light-emitting area. Light emitted by the light-emitting chip passes through the fluorescent adhesive layer and irradiates outward. However, current LED light sources have the defect of insufficient light concentration and are difficult to meet the needs of high-concentration lighting. Summary of the invention

[0004] The purpose of the present invention is to provide a method for preparing a high-concentration LED light source, aiming to solve the problem of insufficient light concentration of the LED light source in the prior art.

[0005] The present invention is implemented in this way: a method for preparing a high-concentration LED light source comprises the following preparation steps:

[0006] 1) Providing a substrate, wherein a concave light-emitting area is provided in the substrate, wherein an inner dam is provided in the light-emitting area, wherein the inner dam surrounds and forms a middle area; wherein the outer periphery of the light-emitting area has an outer reflective side wall, wherein the outer reflective side wall surrounds the outer periphery of the light-emitting area;

[0007] 2) A light-emitting chip is arranged on the middle area, an inner ring area is provided between the light-emitting chip and the inner side wall of the middle area, and the inner ring area is arranged around the periphery of the light-emitting chip; the periphery of the light-emitting chip has a peripheral light-emitting surface;

[0008] 3) A fluorescent glue layer is provided in the middle area, the fluorescent glue layer fills the inner ring area and covers the light-emitting chip;

[0009] 4) A light-transmitting adhesive layer is arranged on the substrate, the lower part of which is embedded in the light-emitting area, covering the fluorescent adhesive layer and the inner dam, forming an integrated structure with the substrate; the upper part of the light-transmitting adhesive layer extends to the top of the substrate, forming an upper section.

[0010] Furthermore, in the preparation step 1), the outer periphery of the inner dam extends to the outer reflective side wall and is connected to the outer reflective side wall to form a whole; in the preparation step 4), the lower part of the fluorescent glue layer covers the top of the inner dam.

[0011] Furthermore, in the preparation step 1), there is an outer ring area between the outer periphery of the inner dam and the outer reflective side wall, and the outer ring area is arranged around the outer periphery of the inner dam; in the preparation step 4), the lower part of the light-transmitting adhesive layer is embedded in the outer ring area.

[0012] Furthermore, in the preparation step 1), the top of the inner dam is lower than the top of the light-emitting area, the inner side of the inner dam has an inner reflective side wall facing the light-emitting chip, and the inner reflective side wall is arranged around the outer periphery of the light-emitting chip; along the inner dam from bottom to top, the inner reflective side wall is arranged obliquely away from the light-emitting chip; the inner reflective side wall reflects the light emitted from the outer peripheral light-emitting surface so that the light is irradiated outward away from the light-emitting area.

[0013] Furthermore, in the preparation step 1), the outer reflective side wall is arranged obliquely away from the light-emitting chip along the bottom-up direction of the substrate; the outer reflective side wall reflects the light emitted from the peripheral light-emitting surface so that the light is irradiated outward away from the light-emitting area.

[0014] Furthermore, in the preparation step 3), the top of the fluorescent glue layer has an inner top surface, and the inner top surface is arched upward in an arc shape.

[0015] Furthermore, in the preparation step 4), the top of the upper portion has an external top surface, the external top surface is arched upward in an arc shape, and the curvature of the internal top surface is greater than the curvature of the external top surface.

[0016] Furthermore, in the preparation step 3), after the fluorescent glue layer is arranged on the middle area, the middle part of the inner top surface is recessed downward to form a downward recessed embedded groove, and the diameter of the embedded groove gradually decreases along the depth direction of the embedded groove; in the preparation step 4), the lower part of the light-transmitting glue layer is embedded and filled in the embedded groove to form a whole with the fluorescent glue layer.

[0017] Furthermore, in the preparation step 1), a peripheral dam is provided on the substrate, the peripheral dam is arranged around the circumference of the light-emitting area, the inner side of the peripheral dam has an inward side wall, the inward side wall is formed with an upwardly arranged annular step, a plurality of the annular steps are arranged at intervals along the height direction of the inward side wall, and the annular steps are arranged around the circumference of the peripheral dam;

[0018] The peripheral dam is provided with a plurality of reinforcement holes, which are arranged around the circumference of the peripheral dam; the inner section of the reinforcement hole penetrates the inner side wall to form an inner opening, the outer end of the reinforcement hole is formed in the peripheral dam, and along the direction from the inner end to the outer end of the reinforcement hole, the reinforcement hole is arranged to clean downward;

[0019] The peripheral dam has a plurality of overflow holes arranged longitudinally, and the plurality of overflow holes are arranged around the circumference of the peripheral dam; the bottom of the overflow hole is connected to the outer end of the reinforcement hole, and the top of the overflow hole passes through the top of the peripheral dam to form a top opening; the top of the peripheral dam is provided with a top groove, and the top groove is arranged around the circumference of the peripheral dam, and the top opening is formed at the bottom of the top groove;

[0020] In the preparation step 4), when the light-transmitting adhesive layer is arranged in the light-emitting area, the light-transmitting adhesive layer covers the annular step and enters the reinforcement hole through the inner opening to fill the reinforcement hole and the overflow hole. The light-transmitting adhesive layer overflows into the top groove through the top opening to form a top ring segment filled in the top groove; the outer dam and the top ring segment are respectively abutted against the outer periphery of the upper segment.

[0021] Furthermore, in the preparation step 4), a plurality of the top ring segments are formed in the top groove, and the plurality of the top ring segments are arranged around the circumference of the peripheral dam at intervals, and the plurality of the top ring segments are respectively abutted against the outer circumference of the upper segment and are integrated with the upper segment.

[0022] Compared with the prior art, the method for preparing the high-concentration LED light source provided by the present invention forms a middle area in the light-emitting area by arranging an inner dam, and a light-emitting chip is arranged in the middle area to form an inner ring area. The inner ring area is filled by arranging a fluorescent glue layer and the light-emitting chip is covered. Then, a light-transmitting glue layer is arranged on the substrate, and the lower part of the light-transmitting glue layer is embedded in the light-emitting area to form an integrated structure with the substrate, and the upper section is extended upwardly; the light emitted by the light-emitting chip is irradiated outward through the fluorescent glue layer and the light-transmitting glue layer to meet the required lighting requirements;

[0023] Secondly, the lower part of the light-transmitting adhesive layer is embedded in the light-emitting area, and can form a more stable overall structure with the substrate. The lower part of the light-transmitting adhesive layer is circumferentially restricted by the light-emitting area, which limits the excessive flow of the light-transmitting adhesive layer toward the periphery. The upper section of the light-transmitting adhesive layer can be kept in a higher arch shape to limit the range of light irradiation and achieve a high-concentration irradiation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the process of preparing a high-concentration LED light source provided by the present invention.

[0025] Figure 2 It is a schematic diagram of the main view of the high-concentration LED light source provided by the present invention;

[0026] Figure 3 It is a partial front view schematic diagram of the high-concentration LED light source provided by the present invention. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0028] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0029] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0030] Reference Figure 1-3 The figure shows a preferred embodiment of the present invention.

[0031] A method for preparing a high-concentration LED light source includes the following steps:

[0032] 1) Provide a substrate 100, wherein a recessed light-emitting area is provided in the substrate 100, and an inner dam 400 is provided in the light-emitting area, and the inner dam 400 surrounds and forms a middle area; the outer periphery of the light-emitting area has an outer reflective side wall 102, and the outer reflective side wall 102 surrounds the outer periphery of the light-emitting area;

[0033] 2) A light emitting chip 300 is arranged on the middle area, an inner ring area 103 is provided between the light emitting chip 300 and the inner side wall of the middle area, and the inner ring area 103 is arranged around the periphery of the light emitting chip 300; the periphery of the light emitting chip 300 has a peripheral light emitting surface;

[0034] 3) A fluorescent glue layer 500 is provided in the middle area, the fluorescent glue layer 500 fills the inner ring area 103 and covers the light emitting chip 300;

[0035] 4) A light-transmitting adhesive layer 200 is disposed on the substrate 100, and the lower portion of the light-transmitting adhesive layer 200 is embedded in the light-emitting area, covering the fluorescent adhesive layer 500 and the inner dam 400, forming an integral structure with the substrate 100; the upper portion of the light-transmitting adhesive layer 200 extends to the top of the substrate 100, forming an upper section.

[0036] The above-provided method for preparing a high-concentration LED light source forms a middle area in the light-emitting area by arranging an inner dam 400, and a light-emitting chip 300 is disposed in the middle area to form an inner ring area 103. The inner ring area 103 is filled by arranging a fluorescent glue layer 500, and the light-emitting chip 300 is covered. Then, a translucent glue layer 200 is arranged on the substrate 100, and the lower part of the translucent glue layer 200 is embedded in the light-emitting area to form an integral structure with the substrate 100, and the upper section is extended upward. The light emitted by the light-emitting chip 300 is irradiated outward through the fluorescent glue layer 500 and the translucent glue layer 200 to meet the required lighting requirements.

[0037] Secondly, the lower part of the light-transmitting adhesive layer 200 is embedded in the light-emitting area, and can form a more stable overall structure with the substrate 100. The lower part of the light-transmitting adhesive layer 200 is circumferentially restricted by the light-emitting area, which limits the excessive flow of the light-transmitting adhesive layer 200 toward the periphery, and can maintain the upper section of the light-transmitting adhesive layer 200 to form a higher arch shape to limit the light irradiation range and achieve a high-concentration irradiation effect.

[0038] In the preparation step 1), the outer periphery of the inner dam 400 extends to the outer reflective side wall 102, and is connected to the outer reflective side wall 102 to form a whole; in the preparation step 4), the lower part of the fluorescent glue layer 500 covers the top of the inner dam 400. In this way, the formation of the inner dam 400 is facilitated, and the inner dam 400 is connected to the outer reflective side wall 102, which can make the overall structure of the inner dam 400 and the substrate 100 more stable.

[0039] Alternatively, as another embodiment, in the preparation step 1), there is an outer ring region 101 between the outer periphery of the inner dam 400 and the outer reflective side wall 102, and the outer ring region 101 is arranged around the outer periphery of the inner dam 400; in the preparation step 4), the lower part of the light-transmitting adhesive layer 200 is embedded in the outer ring region 101. In this way, by arranging the inner dam 400 in the light-emitting area, an inner ring region 103 and an outer ring region 101 are formed, the fluorescent adhesive layer 500 fills the inner ring region 103, and the lower part of the light-transmitting adhesive layer 200 is embedded in the outer ring region 101.

[0040] In this embodiment, in the preparation step 1), the top of the inner dam 400 is lower than the top of the light-emitting area, the inner side of the inner dam 400 has an inner reflective side wall 401 facing the light-emitting chip 300, and the inner reflective side wall 401 is arranged around the outer periphery of the light-emitting chip 300; along the inner dam 400 from bottom to top, the inner reflective side wall 401 is arranged obliquely away from the light-emitting chip 300; the inner reflective side wall 401 reflects the light emitted from the outer peripheral light-emitting surface so that the light is irradiated outward away from the light-emitting area.

[0041] The light emitted from the peripheral light-emitting surface of the light-emitting chip 300 passes through the fluorescent glue layer 500 and irradiates the inner reflective side wall 401. Then, the light is reflected by the inner reflective side wall 401 and irradiates outward away from the light-emitting area, thus greatly improving the light efficiency of the LED light source.

[0042] In this embodiment, in the preparation step 1), the outer reflective side wall 102 is arranged obliquely away from the light-emitting chip 300 along the bottom-up direction of the substrate 100; the outer reflective side wall 102 reflects the light emitted from the peripheral light-emitting surface so that the light is radiated outward away from the light-emitting area.

[0043] By arranging the outer reflective side wall 102, it can also reflect the light emitted from the peripheral light-emitting surface. First, it is reflected by the inner reflective side wall 401. Some of the light that is not reflected by the inner reflective side wall 401 is irradiated outwardly on the outer reflective side wall 102. Then, through the reflection of the outer reflective side wall 102, the light emitting efficiency of the LED light source is greatly improved.

[0044] In this embodiment, in the preparation step 3), the top of the fluorescent glue layer 500 has an internal top surface 501, and the internal top surface 501 is arched upward to form an arc surface. In this way, the light emitted by the light-emitting chip 300, when passing through the fluorescent glue layer 500 to irradiate outward, can first be focused by the focusing effect of the fluorescent glue layer 500, and then, when passing through the transparent glue layer 200, the light can be focused for the second time, so that the high-concentration irradiation of the LED light source can be achieved.

[0045] In this embodiment, in the preparation step 4), the top of the upper part has an outer top surface 201, and the outer top surface 201 is arched upward in an arc shape, and the curvature of the inner top surface 501 is greater than the curvature of the outer top surface 201. Firstly, through the focusing effect of the inner top surface 501 and the outer top surface 201, a high focusing effect of light irradiation can be achieved; secondly, because the inner top surface 501 is arched upward, the contact area between the inner top surface 501 and the light-transmitting adhesive layer 200 is increased, so that the upper section of the light-transmitting adhesive layer 200 can be arched higher upward, which can limit the overflow flow of the upper section toward the periphery.

[0046] In this embodiment, in the preparation step 3), after the fluorescent glue layer 500 is arranged on the middle area, the middle part of the internal top surface 501 is recessed downward to form a downward recessed embedded groove 502, and the diameter of the embedded groove 502 gradually decreases along the depth direction of the embedded groove 502; in the preparation step 4), the lower part of the light-transmitting glue layer 200 is embedded in the embedded groove 502 to form a whole with the fluorescent glue layer 500.

[0047] By forming an embedded groove 502 in the middle of the fluorescent adhesive layer 500, in the process of arranging the light-transmitting adhesive layer 200, the lower part of the light-transmitting adhesive layer 200 will be embedded in the embedded groove 502, so that the connection between the lower part of the light-transmitting adhesive layer 200 and the fluorescent adhesive layer 500 is more stable and combined into one. In addition, the light-transmitting adhesive layer 200 can cooperate with the substrate 100 to better support the light-transmitting adhesive layer 200, so that the upper section of the light-transmitting adhesive layer 200 can form a larger arch upward to achieve the demand for high light concentration.

[0048] In this embodiment, in the preparation step 1), a peripheral dam 600 is provided on the substrate 100, and the peripheral dam 600 is arranged around the circumference of the light-emitting area. The inner side of the peripheral dam 600 has an inner side wall, and an annular step 603 arranged upward is formed on the inner side wall. The plurality of annular steps 603 are arranged at intervals along the height direction of the inner side wall, and the annular steps 603 are arranged around the circumference of the peripheral dam 600.

[0049] A plurality of reinforcement holes 602 are provided in the peripheral dam 600, and the plurality of reinforcement holes 602 are arranged around the circumference of the peripheral dam 600; the inner section of the reinforcement hole 602 penetrates the inner side wall to form an inner opening, and the outer end of the reinforcement hole 602 is formed in the peripheral dam 600, and along the direction from the inner end to the outer end of the reinforcement hole 602, the reinforcement hole 602 is arranged to be cleaned downward;

[0050] The peripheral dam 600 has a plurality of overflow holes 601 arranged longitudinally, and the plurality of overflow holes 601 are arranged around the circumference of the peripheral dam 600; the bottom of the overflow hole 601 is connected to the outer end of the reinforcement hole 602, and the top of the overflow hole 601 passes through the top of the peripheral dam 600 to form a top opening; a top groove is provided on the top of the peripheral dam 600, and the top groove is arranged around the circumference of the peripheral dam 600, and the top opening is formed at the bottom of the top groove;

[0051] In preparation step 4), when the light-transmitting adhesive layer 200 is arranged in the light-emitting area, the light-transmitting adhesive layer 200 covers the annular step 603, and enters the reinforcement hole 602 through the inner opening, filling the reinforcement hole 602 and the overflow hole 601, and the light-transmitting adhesive layer 200 overflows into the top groove through the top opening, forming a top ring segment 700 filled in the top groove; the outer dam 600 and the top ring segment 700 are respectively abutted against the outer periphery of the upper segment.

[0052] By forming a plurality of annular steps 603, the light-transmitting adhesive layer 200 abuts against the plurality of annular steps 603, and the peripheral dam 600 can be used to better limit the circumferential direction and provide circumferential support for the light-transmitting adhesive layer 200. The light-transmitting adhesive layer 200 is embedded in the reinforcement hole 602, and overflows into the overflow hole 601, and overflows into the top groove through the top opening of the overflow hole 601, forming a top ring segment 700. In this way, the light-transmitting adhesive layer 200 is integrated with the peripheral dam 600 by multiple methods such as penetrating the interior and abutting, so that the peripheral dam 600 can better support and limit the light-transmitting adhesive layer 200 in the circumferential direction.

[0053] In addition, by forming a top ring segment 700 in the top groove and using the top ring segment 700 to abut against the outer periphery of the light-transmitting adhesive layer 200 , the light-transmitting adhesive layer 200 can be further abutted against the outer periphery and formed integrally with the light-transmitting adhesive layer 200 .

[0054] In this embodiment, in the preparation step 4), a plurality of top ring segments 700 are formed in the top groove, and the plurality of top ring segments 700 are arranged around the circumference of the outer dam 600 at intervals, and the plurality of top ring segments 700 are respectively abutted against the outer periphery of the upper segment to form a whole with the upper segment.

[0055] In this way, by forming a plurality of top ring segments 700 and arranging them at intervals along the outer circumference of the upper segment, abutting against the outer circumference of the upper segment at multiple positions, the top ring segments can be integrated with the upper segment and the circumferential flow of the upper segment can be further restricted.

[0056] In this embodiment, in the preparation step 4), during the process of arranging the light-transmitting adhesive layer 200, adhesive is first dispensed in the light-emitting area to form a lower section, which covers the fluorescent adhesive layer 500 and the inner dam, and the middle part of the lower section is recessed downward to form a transition groove, and a plurality of recessed positions are formed at the bottom of the transition groove.

[0057] Then, glue is dispensed on the lower section to form the above-mentioned upper section. The bottom of the upper section is embedded in the transition groove and in multiple recessed positions. In this way, under the limitation of the transition groove, the height of the upper section after glue dispensing can be better arched to achieve a further focusing effect.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for preparing a high-concentration LED light source, characterized in that: The method comprises the following preparation steps: 1) Providing a substrate, wherein a concave light-emitting area is provided in the substrate, wherein an inner dam is provided in the light-emitting area, wherein the inner dam surrounds and forms a middle area; wherein the outer periphery of the light-emitting area has an outer reflective side wall, wherein the outer reflective side wall surrounds the outer periphery of the light-emitting area; 2) A light-emitting chip is arranged on the middle area, an inner ring area is provided between the light-emitting chip and the inner side wall of the middle area, and the inner ring area is arranged around the periphery of the light-emitting chip; the periphery of the light-emitting chip has a peripheral light-emitting surface; 3) A fluorescent glue layer is provided in the middle area, the fluorescent glue layer fills the inner ring area and covers the light-emitting chip; 4) A light-transmitting adhesive layer is arranged on the substrate, the lower part of which is embedded in the light-emitting area, covering the fluorescent adhesive layer and the inner dam, forming an integrated structure with the substrate; the upper part of the light-transmitting adhesive layer extends to the top of the substrate, forming an upper section.

2. The method for preparing a high-concentration LED light source according to claim 1, characterized in that: In the preparation step 1), the outer periphery of the inner dam extends to the outer reflective side wall and is connected to the outer reflective side wall to form a whole; in the preparation step 4), the lower part of the fluorescent glue layer covers the top of the inner dam.

3. The method for preparing a high-concentration LED light source according to claim 1, characterized in that: In the preparation step 1), an outer ring area is provided between the outer periphery of the inner dam and the outer reflective side wall, and the outer ring area is arranged around the outer periphery of the inner dam; in the preparation step 4), the lower part of the light-transmitting adhesive layer is embedded in the outer ring area.

4. The method for preparing a high-concentration LED light source according to any one of claims 1 to 3, characterized in that: In the preparation step 1), the top of the inner dam is lower than the top of the light-emitting area, the inner side of the inner dam has an inner reflective side wall facing the light-emitting chip, and the inner reflective side wall is arranged around the outer periphery of the light-emitting chip; along the inner dam from bottom to top, the inner reflective side wall is arranged obliquely away from the light-emitting chip; the inner reflective side wall reflects the light emitted from the outer peripheral light-emitting surface so that the light is irradiated outward away from the light-emitting area.

5. The method for preparing a high-concentration LED light source according to any one of claims 1 to 3, characterized in that: In the preparation step 1), the outer reflective side wall is arranged obliquely away from the light-emitting chip along the bottom-up direction of the substrate; the outer reflective side wall reflects the light emitted from the peripheral light-emitting surface so that the light is directed away from the light-emitting area and irradiated outward.

6. The method for preparing a high-concentration LED light source according to any one of claims 1 to 3, characterized in that: In the preparation step 3), the top of the fluorescent glue layer has an inner top surface, and the inner top surface is arched upward to form a curved surface.

7. The method for preparing a high-concentration LED light source according to claim 6, characterized in that: In the preparation step 4), the top of the upper portion has an external top surface, the external top surface is arched upward in an arc shape, and the curvature of the internal top surface is greater than the curvature of the external top surface.

8. The method for preparing a high-concentration LED light source according to claim 7, characterized in that: In the preparation step 3), after the fluorescent glue layer is arranged on the middle area, the middle part of the inner top surface is recessed downward to form a downward recessed embedded groove, and the diameter of the embedded groove gradually decreases along the depth direction of the embedded groove; in the preparation step 4), the lower part of the light-transmitting glue layer is embedded and filled in the embedded groove to form a whole with the fluorescent glue layer.

9. The method for preparing a high-concentration LED light source according to any one of claims 1 to 3, characterized in that: In the preparation step 1), a peripheral dam is provided on the substrate, the peripheral dam is arranged around the circumference of the light-emitting area, the inner side of the peripheral dam has an inward side wall, the inward side wall is formed with an upwardly arranged annular step, a plurality of the annular steps are arranged at intervals along the height direction of the inward side wall, and the annular steps are arranged around the circumference of the peripheral dam; The peripheral dam is provided with a plurality of reinforcement holes, which are arranged around the circumference of the peripheral dam; the inner section of the reinforcement hole penetrates the inner side wall to form an inner opening, the outer end of the reinforcement hole is formed in the peripheral dam, and along the direction from the inner end to the outer end of the reinforcement hole, the reinforcement hole is arranged to clean downward; The peripheral dam has a plurality of overflow holes arranged longitudinally, and the plurality of overflow holes are arranged around the circumference of the peripheral dam; the bottom of the overflow hole is connected to the outer end of the reinforcement hole, and the top of the overflow hole passes through the top of the peripheral dam to form a top opening; the top of the peripheral dam is provided with a top groove, and the top groove is arranged around the circumference of the peripheral dam, and the top opening is formed at the bottom of the top groove; In the preparation step 4), when the light-transmitting adhesive layer is arranged in the light-emitting area, the light-transmitting adhesive layer covers the annular step and enters the reinforcement hole through the inner opening to fill the reinforcement hole and the overflow hole. The light-transmitting adhesive layer overflows into the top groove through the top opening to form a top ring segment filled in the top groove; the outer dam and the top ring segment are respectively abutted against the outer periphery of the upper segment.

10. The method for preparing a high-concentration LED light source according to claim 9, characterized in that: In the preparation step 4), a plurality of the top ring segments are formed in the top groove, and the plurality of the top ring segments are arranged around the circumference of the outer dam at intervals, and the plurality of the top ring segments are respectively abutted against the outer circumference of the upper segment to form a whole with the upper segment.

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