Display panel and preparation method thereof

Abstract

The invention discloses a display panel and a preparation method thereof. The display panel comprises a substrate; the first wiring layer is arranged on one side of the substrate; the second wiring layer is arranged on one side, deviating from the first wiring layer, of the substrate; the side wiring is electrically connected with the first wiring layer and the second wiring layer; the packaging layer is located on the side, away from the substrate, of the side edge wire, and the orthographic projection of the packaging layer on the substrate covers the orthographic projection of the side edge wire on the substrate; wherein the encapsulation layer at least comprises an organic sub-layer and an inorganic sub-layer. Through the structure, the packaging effect can be improved, so that the reliability of the display panel is improved, and the service life of the display panel is prolonged.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a method for preparing the same. Background Art

[0002] Micro-Light Emitting Diode (Micro-LED) display panel has the advantages of organic light-emitting diode display panel (Organic Light Emitting Diode, OLED) such as lightness, flexibility, drop resistance, foldability, long life, ultra-low power consumption, high response speed, high transparency, etc. It is regarded as the next generation of new display technology with the most development potential and is very in line with future development trends.

[0003] However, the inventors of this application have discovered that Micro-LEDs currently still have problems such as easy packaging failure and short lifespan. Summary of the invention

[0004] The main technical problem solved by the present application is to provide a display panel and a preparation method thereof, which can improve the packaging effect.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a display panel, the display panel comprising: a substrate; a first routing layer, arranged on one side of the substrate; a second routing layer, arranged on the side of the substrate away from the first routing layer; a side routing, electrically connecting the first routing layer and the second routing layer; an encapsulation layer, located on the side of the side routing away from the substrate, and the orthographic projection of the encapsulation layer on the substrate covers the orthographic projection of the side routing on the substrate; wherein the encapsulation layer comprises at least an organic sublayer and an inorganic sublayer.

[0006] The inorganic sublayer is located on a side of the organic sublayer facing away from the substrate; preferably, the orthographic projection of the inorganic sublayer on the substrate covers the orthographic projection of the organic sublayer on the substrate.

[0007] Wherein, a surface of the inorganic sublayer facing away from the substrate is smoothly connected to the side wall.

[0008] Wherein, the thickness of the organic sublayer is greater than the thickness of the inorganic sublayer; preferably, the thickness of the organic sublayer is greater than or equal to 0.5 micrometers, and / or the thickness of the inorganic sublayer is greater than or equal to 0.1 micrometers.

[0009] Wherein, the display panel further comprises: a flat layer located on a side of the first wiring layer away from the substrate; and a pad located on a side of the flat layer away from the substrate.

[0010] Wherein, the display panel is a Mirco-Led display panel; preferably, the material of the inorganic sublayer includes at least one of an organic-siloxane hybrid and a silicon film; preferably, the material of the organic sublayer includes at least one of an epoxy resin and an acrylic resin.

[0011] In order to solve the above technical problem, another technical solution adopted in the present application is: to provide an electronic device, including the above display panel.

[0012] To solve the above technical problems, another technical solution adopted in the present application is: to provide a method for preparing a display panel applied in any embodiment, the method comprising: forming a first routing layer on one side of a substrate; forming a second routing layer on a side of the substrate away from the first routing layer; forming a side routing electrically connecting the first routing layer and the second routing layer; forming an encapsulation layer on a side of the side routing away from the substrate, wherein the orthographic projection of the encapsulation layer on the substrate covers the orthographic projection of the side routing on the substrate, and the encapsulation layer comprises at least an organic sublayer and an inorganic sublayer.

[0013] Wherein, the step of forming a packaging layer on the side of the side wiring away from the substrate includes: spraying liquid inorganic material using a spraying process to form the inorganic sub-layer.

[0014] Wherein, the step of forming an encapsulation layer on the side of the side wiring away from the substrate includes: spraying liquid organic material using a spraying process to form the organic sublayer.

[0015] The beneficial effect of the present application is: different from the prior art, the present application sets the encapsulation layer to include at least an organic sublayer and an inorganic sublayer. The organic sublayer has the advantage of good adhesion performance, and the inorganic sublayer has the advantages of oxidation resistance and moisture resistance. Therefore, with the cooperation of the organic sublayer and the inorganic sublayer, the stability of the encapsulation layer can be improved, and the interference of external factors on the side wiring, such as water, oxygen, electromagnetic waves, static electricity, etc., can be effectively prevented, and the stability and reliability of the side wiring can be guaranteed, thereby improving the reliability of the display panel and extending the service life of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] in:

[0018] Figure 1It is a schematic structural diagram of an embodiment of a display panel of the present application;

[0019] Figure 2 It is a schematic diagram of a process of an embodiment of a method for preparing a display panel of the present application;

[0020] Figure 3 It corresponds to Figure 2 Diagram of the preparation process. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] See also Figure 1 , Figure 1 It is a structural schematic diagram of an embodiment of a display panel of the present application. In one embodiment of the present application, the display panel 100 includes a substrate 110, a first wiring layer 120, a second wiring layer 130, side wiring 140 and a packaging layer 150.

[0023] The first routing layer 120 is arranged on one side of the substrate 110, and the second routing layer 130 is arranged on the side of the substrate 110 away from the first routing layer 120, that is, the first routing layer 120 and the second routing layer 130 are located on both sides of the substrate 110, and at the same time, the side routing 140 electrically connects the first routing layer 120 and the second routing layer 130, so that signal transmission between the first routing layer 120 and the second routing layer 130 can be achieved through the side routing 140, and the encapsulation layer 150 is located on the side of the side routing 140 away from the substrate 110, and the orthographic projection of the encapsulation layer 150 on the substrate 110 covers the orthographic projection of the side routing 140 on the substrate 110, that is, the encapsulation layer 150 covers the side routing 140. The encapsulation layer 150 covers the side wiring 140 to effectively protect the side wiring 140 and prevent the side wiring 140 from being exposed to the air and damaged by external factors, such as temperature and humidity, thereby increasing the service life of the display panel 100 .

[0024] The encapsulation layer 150 at least includes an organic sublayer 151 and an inorganic sublayer 152. The material of the organic sublayer 151 is an organic material, and the material of the inorganic sublayer 152 is an inorganic material. The organic sublayer 151 and the inorganic sublayer 152 can play different roles. Specifically, the organic sublayer 151 has good adhesion performance, and the adhesion performance between the organic sublayer 151 and other materials is good. In addition, the organic sublayer 151 has good impact resistance, which can not only improve the strength and stability of the encapsulation layer 150, but also effectively enhance the impact resistance of the side wiring 140. The inorganic sublayer 152 has oxidation resistance and moisture resistance, and can play a role in moisture and oxidation resistance, thereby improving the life and stability of electronic devices. The inorganic sublayer 152 and the organic sublayer 151 in the encapsulation layer 150 can both play an electrical insulation role to prevent damage caused by short circuits and other situations between electronic components.

[0025] In the prior art, the encapsulation layer 150 usually only includes an organic sublayer 151, which has the defect of being easily degraded by factors such as oxidation, humidity, and ultraviolet rays. It can be seen from the above content that the encapsulation layer 150 in the present application includes both an organic sublayer 151 and an inorganic sublayer 152, which not only improves the sealing of the encapsulation layer 150 and effectively isolates the external environment from the side wiring 140, but also can help the side wiring 140 enhance impact resistance and protect the side wiring 140 from mechanical damage.

[0026] Continue reading Figure 1 In one embodiment, the inorganic sublayer 152 is located on the side of the organic sublayer 151 away from the substrate 110, that is, the organic sublayer 151 is located between the substrate 110 and the inorganic sublayer 152. Generally, the physical properties of the inorganic sublayer 152 are usually harder and more wear-resistant than those of the organic sublayer 151. Therefore, the inorganic sublayer 152 is arranged on the side of the organic sublayer 151 away from the substrate 110, which can improve the structural strength and stability of the encapsulation layer 150, increase the vibration resistance and deformation resistance of the display panel 100 during use, and effectively protect the side wiring 140 of the display panel 100.

[0027] Of course, in other embodiments, the organic sublayer 151 may also be located on the side of the inorganic sublayer 152 facing away from the substrate 110 , that is, the inorganic sublayer 152 is located between the substrate 110 and the organic sublayer 151 .

[0028] Continue reading Figure 1 The orthographic projection of the inorganic sublayer 152 on the substrate 110 covers the orthographic projection of the organic sublayer 151 on the substrate 110, that is, the inorganic sublayer 152 in the encapsulation layer 150 completely covers the organic sublayer 151, wherein the organic sublayer 151 completely covers the side traces 140, thereby increasing the stability and balance of the encapsulation layer 150 and reducing the occurrence of problems such as deformation and cracking of the encapsulation layer 150.

[0029] Of course, in other implementations, the inorganic sub-layer 152 may only cover part of the organic sub-layer 151 , that is, part of the organic sub-layer 151 is exposed.

[0030] In other embodiments, when the organic sublayer 151 is located on the side of the inorganic sublayer 152 away from the substrate 110, the orthographic projection of the organic sublayer 151 on the substrate 110 can cover the orthographic projection of the inorganic sublayer 152 on the substrate 110, and the stability and balance of the encapsulation layer 150 can be increased, and the occurrence of problems such as deformation and cracking of the encapsulation layer 150 can be reduced. Of course, the organic sublayer 151 can also only cover part of the inorganic sublayer 152.

[0031] Continue reading Figure 1 In one embodiment, the surface 180 of the inorganic sublayer 152 facing away from the substrate 110 is smoothly connected to the sidewall 190. This arrangement can make the package cover the components more tightly, prevent external dust, moisture or other impurities from entering the package layer 150, thereby protecting the display panel 100 from damage. In addition, this arrangement can also reduce surface defects and impurities in the package layer 150, reduce the leakage current caused by electron drift caused by the uneven electric field generated by the surface defects and impurities on the surface 180 of the inorganic sublayer 152, thereby reducing the leakage current of the package layer 150 and improving the efficiency of the electronic devices in the display panel 100.

[0032] Of course, in other embodiments, the surface of the inorganic sub-layer 152 facing away from the substrate 110 may also be connected to the side wall 190 at a right angle.

[0033] In one embodiment, the thickness of the organic sublayer 151 is greater than the thickness of the inorganic sublayer 152. The organic sublayer 151 has a certain degree of flexibility, and the inorganic sublayer 152 has good insulation. This configuration can improve the electrical insulation performance of the encapsulation layer 150 on the basis of the organic sublayer 151 protecting the side wiring 140.

[0034] Of course, in other embodiments, the thickness of the organic sub-layer 151 may also be smaller than the thickness of the inorganic sub-layer 152 .

[0035] In one embodiment, the thickness of the organic sublayer 151 is greater than or equal to 0.5 micrometers. For example, the thickness of the organic sublayer 151 may be 0.5 micrometers, 0.6 micrometers, or 0.7 micrometers.

[0036] In one embodiment, the thickness of the inorganic sub-layer 152 is greater than or equal to 0.1 micrometers. For example, the thickness of the inorganic sub-layer 152 may be 0.1 micrometers, 0.2 micrometers, or 0.3 micrometers.

[0037] It should be noted that the present application does not impose any restrictions on the thickness of the organic sub-layer 151 and the thickness of the inorganic sub-layer 152 , and they can be adjusted according to actual conditions.

[0038] Continue reading Figure 1 In one embodiment, the display panel 100 further includes a flat layer 160 and a pad 170. The flat layer 160 is located on the side of the first wiring layer 120 away from the substrate 110, and the pad 170 is located on the side of the flat layer 160 away from the substrate 110, that is, the flat layer 160 is located between the substrate 110 and the pad 170. The flat layer 160 can play a flattening role to ensure the flatness of the display panel, wherein the material of the flat layer 160 is mainly inorganic material, which may include at least one of aluminum nitride (AlN) and aluminum oxide (Al2O3). The pad 170 can bond the device. In an application scenario, the pad 170 is electrically connected to the first wiring layer 120, and the signal transmission between the first wiring layer 120 and other devices can be realized.

[0039] The display panel 100 is a Micro-Led display panel, but of course the display panel 100 may also be other types of display panels, which are not limited here.

[0040] In one embodiment, the material of the inorganic sub-layer 152 includes at least one of organic-siloxane hybrid (SOG) and silicon film.

[0041] In one embodiment, the material of the organic sublayer 151 includes at least one of polyimide, polyetherimide, polyaniline, and acrylic resin. It should be noted that when there are multiple organic sublayers 151 and multiple inorganic sublayers 152, different organic sublayers 151 can use the same or different organic materials, and different inorganic sublayers 152 can use the same or different inorganic materials.

[0042] In the encapsulation layer, the number of the organic sub-layer 151 and the inorganic sub-layer 152 can be one or more, and the present application does not limit the number of the organic sub-layer 151 and the inorganic sub-layer 152 .

[0043] The present application is further described below from the perspective of the preparation method. Figure 1 , Figure 2 as well as Figure 3 , Figure 2 1 is a schematic diagram of a process of an embodiment of a method for manufacturing a display panel of the present application. Figure 3 For the corresponding Figure 2 The preparation process diagram of the present invention comprises:

[0044] S101: forming a first wiring layer 120 on one side of a substrate 110;

[0045] S102: forming a second wiring layer 130 on a side of the substrate 110 away from the first wiring layer 120;

[0046] S103: forming a side wiring 140 electrically connecting the first wiring layer 120 and the second wiring layer 130;

[0047] S104 : forming an encapsulation layer 150 on the side of the side routing 140 away from the substrate 110 , wherein the orthographic projection of the encapsulation layer 150 on the substrate 110 covers the orthographic projection of the side routing 140 on the substrate 110 , and the encapsulation layer 150 at least includes an organic sublayer 151 and an inorganic sublayer 152 .

[0048] In one embodiment, the step of forming the encapsulation layer 150 on the side of the side wiring 140 facing away from the substrate 110 includes: spraying liquid inorganic material using a spraying process to form an inorganic sub-layer 152 .

[0049] Specifically, the inorganic sublayer 152 can be prepared quickly and easily using a spraying process. The operation is simple, and a thin film can be formed on the surface of different materials and objects. When the inorganic sublayer 152 is formed by the spraying process, there is no technical problem of alignment, and no additional limiting film is required. Compared with traditional packaging methods, the equipment and material costs required to prepare the inorganic sublayer 152 by spraying are relatively low. And because there is no need to use a limiting film, the inorganic sublayer 152 formed by the spraying process has a smooth and gentle slope structure and no undercut compared to the inorganic sublayer 152 formed by the yellow light process.

[0050] The liquid material may include at least one of whisker aluminum oxide (Al2O3) sol, aluminum nitride (AlN) sol, silicon oxide (SiO2) sol, zirconium oxide (ZrO2), and aluminum oxide (Al2O3).

[0051] Of course, in other implementations, the inorganic sub-layer 152 may also be prepared by other processes such as chemical vapor deposition (CVD), physical vapor deposition (PVD), and sol-gel.

[0052] In one embodiment, the step of forming the encapsulation layer 150 on the side of the side wiring 140 facing away from the substrate 110 includes: spraying liquid organic material using a spraying process to form an organic sublayer 151 .

[0053] Specifically, during the spraying process, the liquid organic material is pressurized and sprayed to form an atomized form, and then sprayed onto the desired surface to form a tightly covered film. The properties of the organic sublayer 151 depend on the material used, and can have different flexibility, strength, durability, and chemical stability.

[0054] The liquid material may include at least one of polylinolenic anhydride (PMA), a thermosetting organic resin, a polymer (such as polyethylene terephthalate), and polyetherketone (PEEK).

[0055] Of course, in other implementations, the organic sub-layer 151 may also be prepared by other processes such as coating UV photosensitive resin, melting drop method, polymer film method, solution method, etc.

[0056] In addition, the present application also protects an electronic device, which includes the display panel 100 in any one of the above embodiments. The specific structure of the display panel 100 can be found in the above content and will not be described again here.

[0057] The electronic device may be any device such as a mobile phone, a computer, a television, etc., and is not limited here.

[0058] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; A first wiring layer is arranged on one side of the substrate; A second wiring layer is arranged on a side of the substrate away from the first wiring layer; A side routing line electrically connecting the first routing layer and the second routing layer; An encapsulation layer is located on a side of the side trace away from the substrate, and an orthographic projection of the encapsulation layer on the substrate covers an orthographic projection of the side trace on the substrate; Wherein, the encapsulation layer at least includes an organic sublayer and an inorganic sublayer.

2. The display panel according to claim 1, characterized in that: The inorganic sublayer is located on a side of the organic sublayer away from the substrate; Preferably, the orthographic projection of the inorganic sub-layer on the substrate covers the orthographic projection of the organic sub-layer on the substrate.

3. The display panel according to claim 1, characterized in that: The surface of the inorganic sublayer facing away from the substrate is smoothly connected to the side wall.

4. The display panel according to claim 1, characterized in that: The thickness of the organic sublayer is greater than the thickness of the inorganic sublayer; Preferably, the thickness of the organic sublayer is greater than or equal to 0.5 micrometer, and / or the thickness of the inorganic sublayer is greater than or equal to 0.1 micrometer.

5. The display panel according to claim 1, characterized in that: The display panel further comprises: A flat layer, located on a side of the first wiring layer away from the substrate; The pad is located on a side of the flat layer away from the substrate.

6. The display panel according to claim 1, characterized in that: The display panel is a Mirco-Led display panel; Preferably, the material of the inorganic sublayer includes at least one of an organo-siloxane hybrid and a silicon thin film; Preferably, the material of the organic sublayer includes at least one of epoxy resin and acrylic resin.

7. An electronic device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 6.

8. A method for preparing a display panel, characterized in that: The method comprises: forming a first wiring layer on one side of the substrate; forming a second wiring layer on a side of the substrate away from the first wiring layer; Forming a side routing line electrically connecting the first routing layer and the second routing layer; An encapsulation layer is formed on the side of the side routing away from the substrate, wherein the orthographic projection of the encapsulation layer on the substrate covers the orthographic projection of the side routing on the substrate, and the encapsulation layer includes at least an organic sublayer and an inorganic sublayer.

9. The method according to claim 8, characterized in that The step of forming a packaging layer on the side of the side wiring facing away from the substrate comprises: The liquid inorganic material is sprayed by a spraying process to form the inorganic sub-layer.

10. The method according to claim 8, characterized in that The step of forming a packaging layer on the side of the side wiring facing away from the substrate comprises: The liquid organic material is sprayed by a spraying process to form the organic sublayer.

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