Substrate support and plating device

Abstract

The present invention realizes a substrate holder capable of handling various types of substrates with different power supply positions. The substrate holder (210) includes a base plate and a panel (230) for clamping and holding the substrate together with the base plate. The panel (230) has a central opening (234a) and a frame member (234) surrounding the central opening (234a). The substrate holder (210) includes a contact member (240) having a first bus bar (242) mounted on the frame member (234) in a manner movable relative to the frame member (234), and a power supply contact (243) mounted on the first bus bar (242).

Description

Technical Field

[0001] The present application relates to a substrate support and a plating device. Background Art

[0002] Patent Document 1 discloses an immersion-type plating apparatus as an example of an electrolytic plating apparatus. This plating apparatus holds a substrate (e.g., a semiconductor wafer) with its surface to be plated facing sideways on a substrate holder and immerses it in a plating solution. A voltage is applied between the substrate (cathode) and an anode, thereby depositing a conductive film on the surface of the substrate.

[0003] The substrate holder is usually configured to clamp and hold the substrate through a bottom plate and a panel, so that the plated surface of the substrate is exposed from a central opening formed in the panel. In addition, the substrate holder is configured to have a contact component provided on the panel, and power is supplied to the substrate by making the contact component contact the substrate.

[0004] Patent Document 1: Japanese Patent No. 6335763

[0005] The substrate holder of the plating apparatus disclosed in Patent Document 1 does not take into account various types of substrates having different power supply positions.

[0006] That is, the substrate that becomes the object of plating process has various types, and the specification of power supply position also differs according to substrate. In this case, it is necessary to make a dedicated substrate holder for each substrate with different power supply position, and the structure of plating device becomes complicated because the number of substrate holders increases. Summary of the Invention

[0007] Therefore, one object of the present application is to realize a substrate holder that can handle various types of substrates having different power supply positions.

[0008] According to one embodiment, a substrate holder is disclosed, comprising: a base plate; a faceplate for clamping and holding a substrate together with the base plate, the faceplate having a central opening and a frame member surrounding the central opening; and a contact member having a first bus bar mounted to the frame member in a manner movable relative to the frame member, and a power supply contact mounted to the first bus bar. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a cross-sectional view showing the overall structure of a plating apparatus according to one embodiment.

[0010] Figure 2 This is a schematic perspective view of a substrate holder according to one embodiment.

[0011] Figure 3 This is a schematic cross-sectional view of a locking mechanism of a substrate holder according to one embodiment.

[0012] Figure 4 This is a schematic perspective view of a contact member according to one embodiment.

[0013] Figure 5 It is an enlarged perspective view of a contact member according to one embodiment.

[0014] Figure 6 It is an enlarged perspective view of a contact member according to one embodiment.

[0015] Figure 7 It is an enlarged perspective view of a contact member according to one embodiment.

[0016] Figure 8 It is an enlarged perspective view of a contact member according to one embodiment.

[0017] Figure 9 It is an enlarged perspective view of a contact member according to one embodiment.

[0018] Figure 10 It is an enlarged perspective view of a contact member according to one embodiment.

[0019] Figure 11 This is a schematic perspective view of a position adjustment mechanism according to one embodiment.

[0020] Figure 12 This is a schematic perspective view of a position adjustment mechanism according to one embodiment.

[0021] Figure 13 It is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment.

[0022] Figure 14 It is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment.

[0023] Figure 15 It is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment.

[0024] Figure 16 It is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment.

[0025] Figure 17 It is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment.

[0026] Figure 18 It is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment.

[0027] Figure 19 It is an enlarged perspective view of a contact member according to one embodiment.

[0028] Figure 20 It is a schematic three-dimensional diagram of a contact member and a position adjustment jig according to one embodiment.

[0029] Figure 21 It is a schematic three-dimensional diagram of a contact member and a position adjustment jig according to one embodiment.

[0030] Figure 22 It is a schematic three-dimensional diagram of a contact member and a position adjustment jig according to one embodiment.

[0031] Figure 23 It is a schematic three-dimensional diagram of a contact member and a position adjustment jig according to one embodiment.

[0032] Figure 24 is a flow chart of a substrate mounting method according to an embodiment. DETAILED DESCRIPTION

[0033] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, identical or corresponding components are denoted by the same reference numerals and redundant descriptions are omitted.

[0034] <Overall structure of the plating equipment>

[0035] Figure 1 1 is a top view showing the overall structure of the plating apparatus according to this embodiment. The plating apparatus 1000 includes a loading port 100, a conveying robot 110, a loading platform 120, an unloading platform 130, a loader 140, a fixing module 200, a storage module 300, an exchange module 310, a rack cleaning module 320, a pre-wetting module 400, a pre-dip module 500, a pre-dip cleaning module 510, a plating module 600, a plating cleaning module 700, a blowing module 710, a temporary module 720, a cleaning module 800, a conveyor device 900, and a control module 950.

[0036] The load port 100 is a module for loading substrates WF stored in a cassette (not shown), such as a FOUP, into the plating apparatus 1000, or unloading substrates WF from the plating apparatus 1000 to a cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of load ports 100 are arbitrary. The transfer robot 110 is a robot for horizontally transporting substrates WF and is configured to transfer substrates WF between the load port 100 and the loading stage 120.

[0037] The loading station 120 is used to transfer substrates WF before plating between the transfer robot 110 and the loader 140. The unloading station 130 is used to transfer substrates WF after plating between the transfer robot 110 and the loader 140. The loader 140 is a robot for horizontally transporting substrates WF and is configured to transfer substrates WF between the loading station 120, the unloading station 130, the fixing module 200, and the cleaning module 800.

[0038] The fixing module 200 is a module for attaching or removing a substrate WF to or from the substrate holder 210. The storage module 300 is a module for vertically storing the substrate holder 210. The exchange module 310 is a module for temporarily storing substrate holders 210 that need to be replaced or maintained, and is configured to allow the substrate holders 210 to be brought in and out. Substrate holders 210 removed from the exchange module 310 can be maintained within the plating apparatus 1000 or removed and maintained outside the plating apparatus 1000, and a maintained substrate holder 210 or a new substrate holder 210 can be placed in the exchange module 310. The holder cleaning module 320 is a module for cleaning the substrate holder 210.

[0039] The pre-wetting module 400 is a module for wetting the plated surface of a substrate WF prior to plating with a process liquid such as pure water or degassed water, thereby replacing the air within the pattern formed on the substrate surface with the process liquid. The pre-wetting module 400 is configured to perform a pre-wetting process, which replaces the process liquid within the pattern with the plating liquid during plating, thereby facilitating the supply of the plating liquid into the pattern.

[0040] The pre-dip module 500 is configured to perform a pre-dip treatment, which involves etching away a high-resistance oxide film, such as a seed layer, formed on the plated surface of the substrate WF before plating using a treatment solution such as sulfuric acid or hydrochloric acid, thereby cleaning or activating the plating base surface. The pre-dip cleaning module 510 is a module for cleaning the substrate WF that has undergone the pre-dip treatment.

[0041] The plating module 600 is a module for performing a plating process on the substrate WF. The plating cleaning module 700 is a module for cleaning the substrate WF in order to remove the plating liquid and the like remaining on the substrate WF after the plating process. In this embodiment, three plating modules 600 and plating cleaning modules 700 are arranged horizontally, but the number and arrangement of the plating modules 600 and plating cleaning modules 700 are arbitrary. The blowing module 710 is a module for drying the substrate WF after the cleaning process. The temporary module 720 is a module for temporarily storing the substrate holder 210 mounted with the substrate WF in order to transfer the substrate holder 210 mounted with the substrate WF between multiple conveying devices 900. In this embodiment, the number of substrate holders 210 that can be stored in the temporary module 720 is one, but the number is arbitrary.

[0042] The cleaning module 800 is a module used to clean and dry the substrates WF after plating, removing any residual plating solution and the like from the substrate holder 210. In this embodiment, two cleaning modules 800 are arranged horizontally with the loading station 120 and the unloading station 130 interposed between them. However, the number and arrangement of cleaning modules 800 are arbitrary. The transport device 900 is a device used to vertically transport the substrate holder 210 between the multiple modules within the plating apparatus 1000. In this embodiment, three transport devices 900 are arranged in parallel, but the number and arrangement of transport devices 900 are arbitrary.

[0043] The control module 950 is configured to control a plurality of modules of the plating apparatus 1000 , and can be configured by, for example, a general computer or a dedicated computer having an input / output interface with an operator.

[0044] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, substrates WF stored in a cassette are loaded into the load port 100. Next, the transport robot 110 removes the substrates WF from the cassette in the load port 100 and places them on the loading table 120. The loader 140 receives the substrates WF from the loading table 120 and transports them to the fixing module 200.

[0045] The fixing module 200 mounts the substrate WF on the substrate holder 210. The transport device 900 transports the substrate holder 210 with the substrate WF mounted thereon to the pre-wetting module 400. The pre-wetting module 400 performs a pre-wetting process on the substrate WF. The transport device 900 transports the substrate holder 210 with the pre-wetting substrate WF mounted thereon to the pre-preg module 500. The pre-preg module 500 performs a pre-preg process on the substrate WF. The transport device 900 transports the substrate holder 210 with the pre-preg substrate WF mounted thereon to the pre-preg cleaning module 510. The pre-preg cleaning module 510 cleans the substrate WF. The transport device 900 transports the substrate holder 210 with the cleaned substrate WF mounted thereon to the plating module 600. The plating module 600 performs a plating process on the substrate WF.

[0046] The transport device 900 transports the substrate holder 210, carrying the plated substrate WF, to the plating cleaning module 700. The plating cleaning module 700 cleans the substrate WF and the substrate holder 210. The transport device 900 transports the substrate holder 210, carrying the cleaned substrate WF, to the blower module 710. The blower module 710 dries the substrate WF. The transport device 900 transports the substrate holder 210, carrying the dried substrate WF, to the temporary module 720. Another transport device 900 transports the substrate holder 210 from the temporary module 720 to the fixing module 200. The fixing module 200 removes the substrate WF from the substrate holder 210.

[0047] The loader 140 transports the plated substrates WF, removed from the substrate holder 210, to the cleaning module 800. The cleaning module 800 performs cleaning and drying on the substrates WF. The loader 140 places the cleaned and dried substrates WF on the unloading station 130. The transport robot 110 receives the substrates WF from the unloading station 130 and transports them to a cassette at the load port 100. Finally, the cassette containing the substrates WF is unloaded from the load port 100.

[0048] In the fixing module 200, the substrate holder 210 from which the substrate WF is removed is loaded with the next substrate WF or returned to the storage module 300 by the conveying device 900. The substrate holder 210 not holding the substrate WF is cleaned by the holder cleaning module 320 as needed.

[0049] Figure 2 FIG. 1 is a schematic perspective view of a substrate support according to an embodiment. Figure 2As shown, the substrate holder 210 includes a base plate 220 and a panel 230 for clamping and holding the substrate together with the base plate 220. The panel 230 has a central opening 234a and a frame member 234 surrounding the central opening 234a. The central opening 234a is formed in a rectangular shape. While this embodiment shows an example in which the central opening 234a is formed in a rectangular shape, the embodiment is not limited thereto and may alternatively have a circular shape, for example.

[0050] In addition, this embodiment shows an example in which a central opening is formed in the base plate 220, but this is for plating both sides of the substrate. Therefore, when plating only one side of the substrate, the central opening can be omitted from the base plate 220. Furthermore, for ease of explanation, the following figures illustrate the panel 230 positioned at the bottom and the base plate 220 positioned at the top. However, when processing the substrate holder 210 in the fixed module 200, the base plate 220 is positioned at the bottom and the panel 230 is positioned at the top.

[0051] The substrate holder 210 includes an inner sealing member 250, which is mounted on the frame member 234 so as to surround the central opening 234a; and an outer sealing member 260, which is mounted on the frame member 234 so as to surround the outer side of the inner sealing member 250 and be spaced apart from the inner sealing member 250. The substrate holder 210 also includes a pair of contact members 240, which are mounted on the frame member 234, with the rectangular central opening 234a between them. The contact members 240 are positioned between the inner sealing member 250 and the outer sealing member 260. This seals the contact members 240 and the ends of the substrate from the plating solution when the substrate holder 210 is immersed in the plating solution. While this embodiment shows an example in which a pair of contact members 240 are mounted on the frame member 234, with the rectangular central opening 234a between them, this is not limiting. Alternatively, the contact members 240 may be mounted on all four sides of the frame member 234, surrounding the rectangular central opening 234a.

[0052] like Figure 2 As shown, the substrate holder 210 has a plurality of locking mechanisms 270 for locking or unlocking the bottom plate 220 and the panel 230. The plurality of locking mechanisms 270 are provided along the periphery of the bottom plate 220 and the panel 230.

[0053] Figure 3 FIG. 2 is a schematic cross-sectional view of a locking mechanism 270 of a substrate holder according to an embodiment. Figure 3As shown, the bottom plate 220 has a first locking opening 220a formed outside the outer sealing member 260. Meanwhile, the panel 230 has a second locking opening 230a formed outside the outer sealing member 260 and corresponding to the first locking opening 220a. The locking mechanism 270 includes a bracket plate 222 disposed in the first locking opening 220a and a bracket hook 224 protruding toward the panel 230 through the first locking opening 220a. Furthermore, the locking mechanism 270 includes a retainer plate 236 disposed in the second locking opening 230a and a retainer hook 238 protruding toward the bottom plate 220 through the second locking opening 230a.

[0054] The bracket hook 224 is configured to be rotatable around the shaft 224a. The locking mechanism 270 is configured so that when the bracket hook 224 is located at the position shown by the solid line, the bracket hook 224 engages with the clamp hook 238, thereby locking the base plate 220 and the panel 230. On the other hand, the locking mechanism 270 is configured so that when the bracket hook 224 is rotated and located at the position shown by the dotted line, the engagement between the bracket hook 224 and the clamp hook 238 is released, thereby releasing the lock between the base plate 220 and the panel 230. In addition, Figure 2 , an example is shown in which a plurality of locking mechanisms 270 are provided along the periphery of the bottom plate 220 and the panel 230, but the present invention is not limited thereto. Figure 4 and Figure 4 In the following description, illustration of the locking mechanism 270 is omitted for convenience of explanation.

[0055] Figures 4 to 7 This is a schematic perspective view of a contact member according to one embodiment. Figure 4 The entire contact component 240 is shown, Figures 5 to 7 A portion of the contact member 240 is shown in an enlarged manner. A pair of contact members 240 are provided on the frame member 234 with the central opening 234a interposed therebetween. However, since both of the contact members 240 have the same structure, only one will be described.

[0056] like Figures 4 to 7 As shown, contact member 240 includes a first bus bar 242 extending along frame member 234 and mounted to frame member 234 so as to be movable relative to frame member 234, and a power supply contact 243 mounted to first bus bar 242. More specifically, contact member 240 includes a second bus bar 244 extending along frame member 234 and fixed to frame member 234. First bus bar 242 is mounted on second bus bar 244 so as to be movable relative to second bus bar 244.

[0057] The base end of power supply contact 243 is fixed to first bus bar 242, and the front end of power supply contact 243 protrudes toward central opening 234a. Second bus bar 244 is connected to a power source (not shown). Power is supplied from the power source to power supply contact 243 via second bus bar 244 and first bus bar 242. Power supply contact 243 is configured to supply power to the substrate by contacting the front end of power supply contact 243 with the substrate.

[0058] The first bus bar 242 is attached to the second bus bar 244 so as to be movable in a first direction toward and away from the central opening 234a. The second bus bar 244 has guide members 245 disposed at both ends of the first bus bar 242 in the direction in which it extends. The guide members 245 are members for restricting the movement of the first bus bar 242 in the first direction.

[0059] like Figure 5 As shown, the first bus bar 242 has holding holes 242a formed at both ends of the extending direction of the first bus bar 242. The holding holes 242a are cutouts for holding the first bus bar 242 when the first bus bar 242 is moved using a position adjustment mechanism and / or a jig described later.

[0060] like Figure 6 and Figure 7 As shown, first bus bar 242 has an elongated hole 246 that is longer in the first direction than in the direction in which first bus bar 242 extends. A plurality of elongated holes 246 are provided along the direction in which first bus bar 242 extends. Meanwhile, second bus bar 244 has a first restricting member 247 disposed at a position corresponding to elongated hole 246. First restricting member 247 is a member for restricting movement of first bus bar 242 in the first direction.

[0061] Specifically, the first restricting member 247 has a proximal end 247a, which contacts the edge of the elongated hole 246 after the first bus bar 242 moves away from the central opening 234a. Furthermore, the first restricting member 247 has a distal end 247b, which contacts the edge of the elongated hole 246 after the first bus bar 242 moves toward the central opening 234a. In this embodiment, the first restricting member 247 is a bolt fixed to the surface of the second bus bar 244 facing the first bus bar 242. The portion of the bolt shaft closest to the central opening 234a is the proximal end 247a, and the portion of the bolt shaft farthest from the central opening 234a is the distal end 247b.

[0062] Second bus bar 244 includes compression coil spring 248 for pressing first bus bar 242 toward second bus bar 244. Compression coil spring 248 is disposed between the head of a bolt serving as first restricting member 247 and first bus bar 242. Since first restricting member 247 is fixed to second bus bar 244, compression coil spring 248 biases first bus bar 242 toward second bus bar 244.

[0063] like Figure 7 As shown, first bus bar 242 has a protrusion 242b formed on a surface facing second bus bar 244, extending in the first direction. Compression coil spring 248 presses first bus bar 242 toward second bus bar 244, causing protrusion 242b to contact second bus bar 244. This ensures electrical continuity between first bus bar 242 and second bus bar 244. Furthermore, since first restricting member 247 and compression coil spring 248 are conductive components, electrical continuity between first bus bar 242 and second bus bar 244 is ensured via first restricting member 247 and compression coil spring 248. Furthermore, since protrusion 242b extends in the first direction, it does not hinder movement of first bus bar 242 in the first direction.

[0064] In the above description, an example is shown in which the compression coil spring 248 is used to press the first bus bar 242 toward the second bus bar 244 to ensure electrical conduction between the first bus bar 242 and the second bus bar 244 , but the present invention is not limited thereto. Figures 8 to 10 It is an enlarged perspective view of a contact member according to one embodiment.

[0065] like Figures 8 to 10 As shown, the second bus bar 244 may include a disc spring 249 instead of the compression coil spring 248. The disc spring 249 is arranged between the first bus bar 242 and the second bus bar 244 in the area where the first limiting member 247 is arranged. The disc spring 249 urges the first bus bar 242 away from the second bus bar 244. As a result, the disc spring 249 presses the first bus bar 242 against the head of the bolt serving as the first limiting member 247.

[0066] The disc spring 249 is a conductive component that ensures electrical continuity between the first bus bar 242 and the second bus bar 244. Furthermore, the first restricting member 247 is also a conductive component that ensures electrical continuity between the first bus bar 242 and the second bus bar 244. Furthermore, the contact surface of the disc spring 249 with the first bus bar 242 extends in the first direction, so the disc spring 249 does not hinder movement of the first bus bar 242 in the first direction.

[0067] Figure 11 and Figure 12 1 is a schematic three-dimensional diagram of a position adjustment mechanism of an embodiment. The plating device 1000 includes a position adjustment mechanism 290, which is configured to adjust the position of the first bus bar 242 relative to the panel 230. The position adjustment mechanism 290 is arranged on the fixed module 200. The position adjustment mechanism 290 includes: an arm 292, which is used to hold the first bus bar 242; a first driving component 298, which is used to move the arm 292 in a first direction; and a second driving component 296, which is used to move the arm 292 in a second direction (vertical direction) that is orthogonal to the extension direction of the first bus bar 242 and the first direction. The first driving component 298 and the second driving component 296 can be implemented by, for example, a well-known mechanism such as a motor or a cylinder. Figure 11 The arm 292 is not holding the first bus bar 242. Figure 12 The arm 292 is shown holding the first bus bar 242 .

[0068] Figures 13 to 18 It is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. Figure 19 1 is an enlarged perspective view of a contact member of an embodiment. Figure 13 As shown, the second bus bar 244 has a second limiting member 241. The second limiting member 241 is a member for limiting the movement of the first bus bar 242 in the first direction.

[0069] Specifically, the second limiting member 241 includes a proximal limiting member 241a which is in a state where the proximal end 247a of the first limiting member 247 contacts the edge of the long hole 246 ( Figure 17 ) to restrict the movement of the first bus bar 242 in the direction close to the central opening 234a. In addition, the second limiting member 241 has a distal limiting member 241b, which is in a state where the distal end 247b of the first limiting member 247 contacts the edge of the long hole 246 ( Figure 15 ), the movement of the first bus bar 242 in a direction away from the central opening 234a is restricted.

[0070] The proximal and distal restricting members 241a and 241b are formed of leaf springs. Normally, when no external force is applied, the proximal and distal restricting members 241a and 241b are located within the first-directional movement path of the first bus bar 242, contacting the first bus bar 242 to restrict movement. On the other hand, when an external force is applied and the proximal and distal restricting members 241a and 241b are pressed toward the second bus bar 244, they deviate from the first-directional movement path of the first bus bar 242, releasing the restriction on the movement of the first bus bar 242.

[0071] The arm 292 includes a proximal pressing member 293 for pressing the proximal restricting member 241a to release the restriction on the movement of the first bus bar 242. Furthermore, the arm 292 includes a distal pressing member 294 for pressing the distal restricting member 241b to release the restriction on the movement of the first bus bar 242. Furthermore, the arm 292 includes a gripping portion 295 that fits into the gripping hole 242a of the first bus bar 242.

[0072] Figure 15 The figure shows the first bus bar 242 in a position closest to the central opening 234a. In this state, the edge of the elongated hole 246 of the first bus bar 242 contacts the distal end 247b of the first limiting member 247, thereby restricting the movement of the first bus bar 242 in a direction closer to the central opening 234a. Meanwhile, in this state, no external force is applied to the distal limiting member 241b of the second limiting member 241. The distal limiting member 241b exists in the first direction of movement of the first bus bar 242, thus restricting the movement of the first bus bar 242 away from the central opening 234a. As a result, the first bus bar 242 is fixed in a position closest to the central opening 234a.

[0073] Figure 16 The figure shows arm 292 gripping first bus bar 242. In this state, distal pressing member 294 of arm 292 presses distal restricting member 241b, thereby releasing the restriction on movement of first bus bar 242 away from central opening 234a. Furthermore, gripping portion 295 of arm 292 engages gripping hole 242a of first bus bar 242. This allows first driving member 298 of position adjustment mechanism 290 to move first bus bar 242 away from central opening 234a.

[0074] Figure 17The figure shows the first bus bar 242 moved to the position farthest from the central opening 234a. In this state, the edge of the elongated hole 246 of the first bus bar 242 contacts the proximal end 247a of the first limiting member 247, thereby limiting the movement of the first bus bar 242 away from the central opening 234a. Meanwhile, in this state, no external force is applied to the proximal limiting member 241a of the second limiting member 241. The proximal limiting member 241a exists in the first direction of movement of the first bus bar 242, thus limiting the movement of the first bus bar 242 toward the central opening 234a. As a result, the first bus bar 242 is fixed at the position farthest from the central opening 234a.

[0075] As described above, according to this embodiment, the first bus bar 242 and the power supply contact 243 can be moved relative to the second bus bar 244 (frame member 234) and fixed at multiple positions, thereby realizing the substrate holder 210 that can handle various types of substrates with different power supply positions.

[0076] In the above description, an example in which the first bus bar 242 is moved using the position adjustment mechanism 290 is shown, but the present invention is not limited to this. Figures 20 to 23 It is a schematic three-dimensional diagram of a contact member and a position adjustment jig according to one embodiment.

[0077] The position adjustment jig 280 includes: a jig body 281, which extends along the first bus bar 242; a jig proximal pressing component 285, which is provided at the end of the jig body 281 in the extension direction; and a jig distal pressing component 284, which is provided at the end of the jig body 281 in the extension direction. The jig proximal pressing component 285 has the same function as the above-mentioned proximal pressing component 293. That is, the jig proximal pressing component 285 is a component for pressing the proximal limiting component 241a to release the restriction on the movement of the first bus bar 242. In addition, the jig distal pressing component 284 has the same function as the above-mentioned distal pressing component 294. That is, the jig distal pressing component 284 is a component for pressing the distal limiting component 241b to release the restriction on the movement of the first bus bar 242.

[0078] like Figure 20 and Figure 21 As shown, the position adjustment jig 280 includes a first claw member 282, which is arranged on the opposite side of the central opening 234a of the jig body 281. Figure 22 As shown, the position adjustment jig 280 includes a second claw member 283 , which is disposed on the central opening 234 a side of the jig body 281 .

[0079] Figure 20A state before the first claw member 282 is fitted into the gap between the first bus bar 242 and the second bus bar 244 is shown. Figure 21 A state is shown in which the first claw member 282 is fitted into the gap between the first bus bar 242 and the second bus bar 244 . Figure 22 A state is shown in which the second claw member 283 is fitted into the gap between the first bus bar 242 and the second bus bar 244 .

[0080] like Figure 23 As shown, the first claw member 282 and the second claw member 283 are configured so that when they are inserted into the gap between the first bus bar 242 and the second bus bar 244, the first bus bar 242 is slightly lifted from the second bus bar 244. In other words, the position adjustment jig 280 of this embodiment assumes that the first bus bar 242 is urged toward the second bus bar 244 by the compression coil spring 248 described above. Figure 23 As shown, the first bus bar 242 is slightly lifted from the second bus bar 244 by the first claw member 282 and the second claw member 283, thereby enabling smooth movement of the first bus bar 242 relative to the second bus bar 244. Furthermore, the first claw member 282 and the second claw member 283 may not be provided. In particular, when a disc spring 249 is used instead of the compression coil spring 248, the first claw member 282 and the second claw member 283 may not be provided.

[0081] Next, the substrate mounting method will be described. Figure 24 FIG. 1 is a flow chart of a substrate mounting method according to an embodiment. The substrate mounting method first stores the substrate holder 210 in the fixing module 200 (step S101). The substrate holder 210 is arranged in the fixing module 200 with the base plate 220 at the bottom and the panel 230 at the top.

[0082] Next, the substrate mounting method unlocks the substrate holder 210 using the locking mechanism 270 (step S102). Next, the substrate mounting method lifts the panel 230 upward (step S103). Next, the substrate mounting method inserts the arm 292 of the position adjustment mechanism 290 between the base plate 220 and the panel 230 (step S104).

[0083] Next, the substrate mounting method uses the arm 292 to grasp the first bus bar 242 and move the first bus bar 242 (step S105). For example, step S105 moves the first bus bar 242 to a position closest to the central opening 234a or a position furthest from the central opening 234a, depending on the specifications of the power supply position of the substrate WF. Next, the substrate mounting method retracts the arm 292 from between the base plate 220 and the face plate 230 (step S106).

[0084] Next, the substrate mounting method places the substrate WF on the upper surface of the base plate 220 (step S107 ) Next, the substrate mounting method lowers the face plate 230 and sandwiches the substrate WF between the base plate 220 and the face plate 230 (step S108 ).

[0085] Next, the substrate mounting method locks the substrate holder 210 using the locking mechanism 270 (step S109 ). As a result, the substrate WF is clamped by the substrate holder 210 . Next, the substrate mounting method unloads the substrate holder 210 from the fixing module 200 (step S110 ).

[0086] According to the substrate mounting method of this embodiment, the first bus bar 242 and the power supply contact 243 can be moved relative to the second bus bar 244 (frame member 234 ) and fixed at multiple positions, thereby being compatible with various types of substrates having different power supply positions.

[0087] While several embodiments of the present invention have been described above, the embodiments of the invention described above are intended to facilitate understanding of the present invention and do not limit the present invention. Of course, the present invention can be modified and improved without departing from its main purpose, and the present invention includes equivalents thereof. Furthermore, any combination or omission of the various constituent elements described in the claims and the specification may be performed within the scope of at least a portion of the above-mentioned problems or within the scope of at least a portion of the effects.

[0088] As an embodiment, the present application discloses a substrate holder, which includes: a base plate; a panel for clamping and holding the substrate together with the base plate, the panel having a central opening and a frame member surrounding the central opening; and a contact member having a first bus bar mounted on the frame member in a manner capable of movement relative to the frame member, and a power supply contact mounted on the first bus bar.

[0089] In addition, the present application discloses, as an embodiment, a substrate holder, wherein the central opening is formed into a rectangle, and the contact members are installed in a pair on the frame member across the rectangular central opening, or are installed on four sides of the frame member in a manner surrounding the rectangular central opening.

[0090] In addition, the present application discloses, as one embodiment, a substrate holder, wherein the contact member further includes a second bus bar fixed to the frame member, and the first bus bar is mounted to the second bus bar in a manner movable relative to the second bus bar.

[0091] In addition, the present application discloses, as an embodiment, a substrate bracket, wherein the first bus bar is configured to be movable in a first direction toward and away from the central opening, and the second bus bar has a guide component, which is arranged at both ends of the extension direction of the first bus bar and is used to limit the movement direction of the first bus bar in the first direction.

[0092] In addition, the present application discloses, as an embodiment, a substrate bracket, wherein the first bus bar has a long hole that is longer in the first direction than the extension direction of the first bus bar, and the second bus bar has a first limiting component, which is arranged at a position corresponding to the long hole and has: a proximal end, which contacts the edge of the long hole after the first bus bar moves in a direction away from the central opening; and a distal end, which contacts the edge of the long hole after the first bus bar moves in a direction close to the central opening.

[0093] In addition, the present application discloses, as an embodiment, a substrate bracket, wherein the second bus bar has a second limiting component, and the second limiting component has: a proximal limiting component, which limits the movement of the first bus bar toward the direction approaching the above-mentioned central opening when the proximal end of the above-mentioned first limiting component is in contact with the edge of the above-mentioned long hole; and a distal limiting component, which limits the movement of the first bus bar toward the direction away from the above-mentioned central opening when the distal end of the above-mentioned first limiting component is in contact with the edge of the above-mentioned long hole.

[0094] In addition, the present application discloses, as one embodiment, a plating device, comprising: the substrate holder described in any one of the above items; and a position adjustment mechanism configured to adjust the position of the first bus bar relative to the panel.

[0095] In addition, the present application discloses, as an embodiment, a plating device, wherein the above-mentioned position adjustment mechanism includes: an arm for holding the above-mentioned first bus bar; a first driving component for moving the above-mentioned arm in a first direction close to and away from the above-mentioned central opening; and a second driving component for moving the above-mentioned arm in a second direction orthogonal to the extension direction of the above-mentioned first bus bar and the above-mentioned first direction.

[0096] In addition, the present application discloses, as an embodiment, a plating device, wherein the arm includes: a proximal pressing component for pressing the proximal limiting component to release the restriction on the movement of the first bus bar; and a distal pressing component for pressing the distal limiting component to release the restriction on the movement of the first bus bar.

[0097] Description of Reference Numerals

[0098] 200…Fixed module; 210…Base plate holder; 220…Base plate; 230…Panel; 234…Frame member; 234a…Central opening; 240…Contact member; 241…Second limiting member; 241a…Proximal limiting member; 241b…Remote limiting member; 242…First bus bar; 242a…Holding hole; 243…Power supply contact; 244…Second bus bar; 245…Guide member; 246…Long Hole; 247…first limiting component; 247a…proximal end; 247b…distal end; 250…inner sealing component; 260…outer sealing component; 270…locking mechanism; 290…position adjustment mechanism; 292…arm; 293…proximal pressing component; 294…distal pressing component; 295…holding portion; 296…second driving component; 298…first driving component; 1000…plating device; WF…substrate.

Claims

1. A substrate support, characterized in that: include: base plate; a panel, the panel being used to clamp and hold the substrate together with the bottom plate, the panel having a central opening and a frame member surrounding the central opening; as well as A contact member includes a first bus bar mounted to the frame member so as to be movable relative to the frame member, and a power supply contact mounted to the first bus bar.

2. The substrate holder according to claim 1, wherein The central opening is formed into a rectangular shape, The contact members are mounted in pair on the frame member across the rectangular central opening, or are mounted on four sides of the frame member so as to surround the rectangular central opening.

3. The substrate support according to claim 2, wherein: The contact member further includes a second bus bar fixed to the frame member, The first bus bar is mounted to the second bus bar so as to be movable relative to the second bus bar.

4. The substrate support according to claim 3, wherein: The first bus bar is configured to be movable in a first direction toward and away from the central opening. The second bus bar has guide components, which are arranged at both ends of the first bus bar in the extending direction and are used to limit the movement direction of the first bus bar in the first direction.

5. The substrate support according to claim 4, wherein: The first bus bar has an elongated hole that is longer in the first direction than in the extending direction of the first bus bar. The second bus bar has a first limiting component, which is arranged at a position corresponding to the long hole and has: a proximal end, which contacts the edge of the long hole after the first bus bar moves in a direction away from the central opening; and a distal end, which contacts the edge of the long hole after the first bus bar moves in a direction close to the central opening.

6. The substrate support according to claim 5, wherein: The second bus bar has a second limiting component, which includes: a proximal limiting component, which limits the movement of the first bus bar toward the direction approaching the central opening when the proximal end of the first limiting component is in contact with the edge of the long hole; and a distal limiting component, which limits the movement of the first bus bar toward the direction away from the central opening when the distal end of the first limiting component is in contact with the edge of the long hole.

7. A plating device, characterized in that: include: The substrate holder according to any one of claims 1 to 6; and A position adjustment mechanism is configured to adjust a position of the first bus bar relative to the panel.

8. The plating device according to claim 7, characterized in that The position adjustment mechanism includes: an arm for holding the first bus bar; a first driving component for moving the arm in a first direction closer to and away from the central opening; and a second driving component for moving the arm in a second direction orthogonal to the extension direction of the first bus bar and the first direction.

9. A plating device, characterized in that: include: The substrate support according to claim 6; and a position adjustment mechanism configured to adjust the position of the first bus bar relative to the panel, The position adjustment mechanism includes an arm for holding the first bus bar; a first driving component for moving the arm in a first direction toward and away from the central opening; and a second driving component for moving the arm in a second direction orthogonal to the first direction and the extending direction of the first bus bar. The arm includes a proximal pressing component for pressing the proximal restricting component to release the restriction on movement of the first bus bar, and a distal pressing component for pressing the distal restricting component to release the restriction on movement of the first bus bar.

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