Circuit arrangement with protected electrical components and production method

Abstract

The invention relates to a circuit arrangement (1) having at least one electrical component (13) which is suitably protected for subsequent processing loads, having a carrier layer (10) with an integrated conductor circuit (11), which carrier layer has a surface (12) on which the at least one electrical component (13) is fastened and is in contact with the conductor circuit (11), at least one protective body (20) for protecting the at least one electrical component (13) is arranged on a surface (12) of the carrier layer (10) adjacent to the at least one component (13) and is fastened to the carrier layer (10), the at least one protective body (20) being designed to absorb and / or divert forces acting on the at least one component (13) by deformation of the carrier layer (10), and / or absorbing and / or diverting forces acting on the at least one structural element (13) by the material moving parallel to the surface.

Description

[0001] The invention relates to a circuit arrangement having at least one electrical component which is suitably protected against subsequent processing loads and to a method for producing such a circuit arrangement or a method for producing an assembly having such a circuit arrangement.

[0002] In the prior art, electrical circuits, ie carriers provided with electrical components, which can be rigid or flexible printed circuit boards as well as conductor films, are usually further processed, wherein the electrical circuits can be damaged during processing.

[0003] For example, circuits with flexible carrier layers are usually deformed conventionally so that the circuit or its carrier layer reaches a new shape. However, this may cause components arranged on the carrier layer to become detached, lose or even damage their electrical contact with the conductor circuit integrated into the carrier layer.

[0004] Furthermore, in many circuits it is provided that the surface of the carrier layer is coated, for example by injection molding, after the components have been installed. In this case, material can flow along the surface, which can tear apart the components and thus separate from their fastening and their electrical contact with the carrier layer or the conductor circuits integrated therein. Furthermore, such material is usually very hot during processing, so that the components can be subjected to thermal stress and can be damaged even if the components have not been separated from their fastening to the carrier layer.

[0005] Even when the circuit is conventionally deformed or overmolded during further processing, it can be damaged in the event of improper handling.

[0006] In order to overcome these problems, it has been provided in the prior art to adapt the processing parameters to the resulting load limits during further processing, ie during the deformation of the carrier layer or during the encapsulation, but this leads to corresponding restrictions for further processing.

[0007] Furthermore, structural elements with small end faces or small dimensions are sometimes selected and arranged on a carrier layer so that the structural elements are subjected to as little stress as possible during further processing. However, this leads to severe design restrictions when creating the circuit layout. Summary of the invention

[0008] The object of the present invention is therefore to overcome the above-mentioned disadvantages and to provide a circuit arrangement whose electrical components are protected for further processing of the circuit arrangement from forces or loads occurring during further processing, so that the components or the circuit arrangement are not damaged during further processing.

[0009] This object is achieved by the combination of features according to claim 1 and claim 13 .

[0010] Therefore, according to the invention, a circuit arrangement is proposed, which has at least one electrical component that is appropriately protected for subsequent processing loads. The at least one electrical component or the plurality of electrical components can be different active or passive electrical components, such as resistors, ICs, LEDs, MOSFETs, etc. The circuit arrangement has a carrier layer with an integrated conductor track, in particular printed or produced by etching technology, wherein the carrier layer has a surface on which the at least one electrical component is fixed and in contact with the conductor track. In order to protect the at least one electrical component, at least one protective body is arranged on the surface of the carrier layer adjacent to the at least one component and is fixed to the carrier layer. The at least one protective body is configured to absorb and / or deflect forces acting on at least one or corresponding components by deformation of the carrier layer. If the circuit arrangement or its carrier layer for producing the component is deformed three-dimensionally, for example, a force acting orthogonally to the surface can occur on the at least one component, by which the electrical component can be separated from the carrier layer or the conductor track on one side. Here, the protective body can be formed to reinforce the carrier layer in the region of the at least one component, so that the force is absorbed by the protective body and the at least one component does not separate from the surface. Additionally or alternatively, the protective body can be constructed to absorb and / or deflect forces acting on at least one or corresponding structural element by a material moving parallel to the surface and acting in particular parallel to the surface, or generally to absorb and / or deflect shear forces. In particular, when the circuit device or the surface of the circuit device is to be coated in a subsequent processing step or further processing of the circuit device, the surface is usually coated in an injection molding method and in particular in an in-mold injection molding method using a plastic, which is sprayed or injected as a flowable material parallel to the surface. The material can be liquid, powdery or pourable. Regardless of the exact type or exact state of the material, when the material hits at least one structural element, a force acting parallel to the surface or a shear force is generated, by which the corresponding loaded structural element can be separated from the surface. In order to prevent this, the protective body is constructed to intercept the force and conduct the material or force so that the material or force no longer acts on the structural element.

[0011] Therefore, the core idea of ​​the present invention is to place a protective body on the carrier layer so that the electrical components or the connection between the components and the carrier layer are protected by the protective body from damage in subsequent processing steps.

[0012] In particular, the surface of the carrier layer should be coated in a subsequent processing method, for example in an in-mold method, for which purpose a hot, liquid plastic or a flowable or pourable material is injected parallel to the surface into a mold in which the circuit arrangement is arranged. The material could tear components arranged on the carrier layer off the carrier layer or separate them or damage the electrical connection areas of the components.

[0013] The protective body is therefore arranged in particular in front of the structural element, so that the protective body absorbs forces which are otherwise exerted by the material on the structural element before these forces can act on the structural element.

[0014] Since electrical components are usually connected only via their electrical contacts on the carrier layer, in an advantageous variant at least one component has a connection region at which the component is contacted with the conductor track and which is in particular completely covered and / or reinforced by the shielding body.

[0015] A defined flow direction can be determined on the surface of the carrier layer, in particular along which the material can or should flow or move parallel to the surface in a subsequent processing step. The flow direction determines the main load-bearing side on at least one structural element, wherein the main load-bearing side of the respective structural element corresponds in particular to an end side of the structural element which points opposite to the flow direction or, if no shielding body is provided, against which the material strikes when flowing in the flow direction. The shielding body is preferably designed to guide the material flowing in the flow direction to a predetermined flow path along which no forces are exerted on the respective structural element by the flow.

[0016] According to an advantageous variant, the shielding body is arranged upstream of the main load side opposite to the flow direction and is designed to guide the material around at least one or the corresponding structural element and in particular away from the structural element.

[0017] Alternatively, it can be provided that the protective body is not arranged in front of the corresponding structural element, i.e. is not arranged at a distance therefrom, but is adjacent to the main load-bearing side of the corresponding structural element, wherein the protective body covers the structural element only on the main load-bearing side and is again designed to guide material to at least one or around the corresponding structural element and in particular to guide the material away from the structural element.

[0018] Furthermore, it can also be provided as an alternative that the shielding body covers the structural element not only on the main load-bearing side, but also at least partially on the main load-bearing side and at least on a further side, and is designed to guide material around at least one or the corresponding structural element and in particular away from the structural element. According to this variant, it can also be provided that the shielding body covers at least one or the corresponding structural element on five sides, so that the structural element together with the carrier layer can be completely surrounded by the shielding body.

[0019] With regard to the flow direction defined on the surface, in particular for further processing or subsequent processing steps, and the main load-bearing side of the structural element determined thereby, advantageous variants provide that the shield can be designed in a ramp-shaped and / or wedge-shaped and / or plow-shaped manner and / or can be curved concavely and widen from a tapering tip or edge to a bottom facing the main load-bearing side. Accordingly, the tip or edge can be located upstream and the bottom can be located downstream in the flow direction.

[0020] Furthermore, with respect to the flow direction and the main load side determined thereby, the shield can have at least one guide surface pointing opposite to the flow direction and preferably two guide surfaces converging at a tip or edge, the guide surfaces being distinguishable surfaces and / or free of flow obstacles and / or optimized in terms of flow technology, so that material flowing in the flow direction is guided along the guide surfaces and turbulence is in particular transformed into laminar flow, or at least the turbulent portion can be reduced.

[0021] According to a variant, a plurality of structural elements, namely at least two structural elements, are arranged on the carrier layer and contacted with the conductor track. The structural elements are divided into a first group of structural elements and a second group of structural elements, wherein the material first reaches the structural elements of the first group and the corresponding upstream group in the flow direction and only then reaches the structural elements of the second group and the corresponding downstream group. It can be provided that shielding bodies are arranged only adjacent to the structural elements of the first group, which shielding bodies are designed to reduce the flow rate of the material. As a result, due to the material moving parallel to the surface, smaller forces act on the structural elements of the second group, so that shielding bodies can be omitted on them.

[0022] At least one shield can be formed from a thermoplastic, wherein it can be in particular polyamide (PA) or polycarbonate (PC). In this case, the melting temperature of the plastic is preferably higher than the melting temperature of the material, so that the shield remains dimensionally stable and is not damaged when a material heated to its melting temperature flows around the shield. Additionally or alternatively, it can be provided that the melting temperature of the plastic is lower than the melting temperature of the structural element and / or the housing of the structural element, so that when the shield is constructed on the support layer or adjacent to the structural element, neither the structural element nor the housing of the structural element is damaged. It is also applicable that the melting temperature of the plastic is preferably lower than the melting temperature of the solder or adhesive, by which the structural element is contacted with the conductor path or fixed to the support layer. Also additionally or alternatively, the melting temperature of the plastic can be lower than the melting temperature of the support layer, so that the support layer is not damaged. However, it can also be provided as an alternative that the melting temperature of the plastic is equal to the melting temperature of the support layer, so that they can fuse to each other and be connected in a material-locking manner. In addition, it is further preferred to select a plastic that has an adhesive property by which the protective body adheres to the carrier layer and / or the structural element with a predetermined adhesive force or at least until a predetermined limiting force is reached.

[0023] In order to better connect the at least one protective body, it can also be provided that the carrier layer is provided with a through hole for the at least one protective body, and the corresponding protective body extends through the through hole.

[0024] The shield can also fulfill further functions in addition to its primary protective function. For this purpose, at least one shield can be translucent and / or transparent and can also be designed to form a light conductor and / or a scattering surface, i.e. to form an optical diffuser for light emitted, in particular, by at least one structural element or by one of the structural elements. Additionally or alternatively, at least one shield, i.e. the other shield, can be opaque and / or light-proof and can also be designed to form a light barrier for shielding an area on the surface of the carrier layer, in particular from light propagating parallel to the surface.

[0025] In addition to mechanical loads, the shield can also protect the at least one electrical component from thermal loads. To this end, the at least one shield can be pressure-resistant, temperature-resistant and heat-conducting, wherein the at least one shield is preferably temperature-resistant at least to a temperature that corresponds to the temperature of the material moving parallel to the surface. In this variant, the at least one shield is also designed to absorb and / or dissipate thermal loads acting on the at least one component due to heating of the carrier layer or the at least one component. For example, the heat can be dissipated via a surface of the shield that is enlarged relative to the component, wherein the shield can also form an additional heat sink for this purpose.

[0026] The carrier layer can be, in particular, a rigid printed circuit board or a flexible printed circuit board or a conductor film, which is also correspondingly flexible.

[0027] Although the protective body can be designed as a layer covering the entire surface, it is preferably provided that at least one protective body is designed or arranged in each case locally limited on the surface of the carrier layer and is moreover in particular each assigned to exactly one structural element.

[0028] If a through hole is provided in the carrier layer, the protective body can extend through the through hole so and thus be fixed on the carrier layer in a form-fitting manner. However, it is advantageous that the protective body is alternatively or additionally and independently of the through hole, materially connected to the carrier layer, or is pasted on the carrier layer.

[0029] Another aspect of the present invention relates to a method for manufacturing a circuit device according to the present invention. According to the method, at least one electrical structural element is arranged on a carrier layer having an integrated conductor circuit, fixed on the carrier layer and in contact with the conductor circuit. Subsequently, at least one protective body for protecting at least one electrical structural element is arranged on the surface of the carrier layer adjacent to the at least one structural element, and the protective body is fixed on the carrier layer. Here, the protective body can be directly constructed on the surface and connected to it, for example, by an injection molding method or a rapid prototyping method and in particular by an FDM method, or constructed separately from the carrier layer and then arranged on it and connected to it. The protective body is constructed here to absorb and / or deflect forces acting on at least one structural element through deformation of the carrier layer. Alternatively or additionally, the protective body is constructed to absorb and / or deflect forces acting on at least one structural element through material moving parallel to the surface.

[0030] An advantageous variant of the method provides that the carrier layer is then deformed three-dimensionally and brought into a predetermined shape and fixed therein. Additionally or alternatively, a defined flow direction can be determined on the surface, along which the material is then guided parallel to the surface, whereby the entire surface is coated and, for example, a protective layer and / or a layer for level compensation can be provided on the surface of the carrier layer.

[0031] The features disclosed above can be combined in any desired manner, as long as this is technically feasible and they do not contradict each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Further advantageous embodiments of the invention are indicated in the dependent claims or are described in detail below together with the description of preferred embodiments of the invention with the aid of the drawings.

[0033] Figure 1a , 1b A circuit arrangement with a first variant of a protective body is shown in two views;

[0034] Figure 2a ,2b A circuit arrangement with a second variant of a protective body is shown in two views;

[0035] Figure 3a , 3b A circuit arrangement with a third variant of a protective body is shown in two views;

[0036] Figure 4a , 4b A circuit arrangement with a fourth variant of a protective body is shown in two views;

[0037] Figure 5a , 5b A circuit arrangement with a fifth variant of a protective body is shown in two views;

[0038] Figure 6a , 6b A circuit arrangement with a sixth variant of a protective body is shown in two views.

[0039] These drawings are exemplary schematic diagrams. Similar reference numerals in the drawings represent the same functional features and / or structural features. DETAILED DESCRIPTION

[0040] Figures 1a to 5b A circuit arrangement 1 is shown in each case in detail, wherein: Figure 1a , 2a , 3a, 4a and 5a show the circuit arrangement in side view, Figure 1b , 2b , 3b, 4b and 5b show the circuit arrangement in a top view.

[0041] Each circuit arrangement 1 has a carrier layer 10 , for example a conductor film, with conductor tracks 11 . On the surface 12 of the carrier layer 10 , a structural element 13 is shown in each case, which contacts the conductor tracks 11 at two connection regions 14 .

[0042] In subsequent further processing of the circuit arrangement 1 , it can be provided that material flows parallel to the surface 12 in a flow direction X along the surface 12 , which material can damage the components 13 or detach the components 13 from the carrier layer 13 or the conductor tracks 11 .

[0043] In order to prevent such damage to the structural element 13, Figures 1a to 5b In the variants, a protective body 20 is provided which widens from an upstream tip 21 or edge 22 to a downstream bottom 23 and is designed to deflect material flowing in the flow direction X and to absorb forces that otherwise act on the main load-bearing side 15 of the structural element 13 .

[0044] In accordance with Figure 1a and Figure 1b In the case of a variant, the protective body 20 is designed as a wedge arranged in front of the structural element 13, which has a guide surface 24 arranged as an inclined surface, along which material can be guided so that it does not act head-on on the main load-bearing side 15 of the structural element 13.

[0045] Although the wedge-shaped protective body 20 can also be merely adhered or glued to the surface 12 or the carrier layer 10, according to the illustrated variant, two through holes 16 are formed in the carrier layer 10, and the protective body 20 extends into or through these through holes using corresponding bolts in order to resist forces acting on the protective body 20 in the flow direction X.

[0046] according to Figures 2a to 5b In a variant of the present invention, the protective body 20 has two sections, wherein the protective body 20 is similar to the protective body 20 according to the embodiment of the present invention in the first section. Figure 1a and Figure 1b 21 or edge 22 in the flow direction and at least partially surrounds the structural element 13 in a second section.

[0047] Here, when necessary, according to Figures 1a to 5b The first section of the variant can be combined with Figures 2a to 5b The second section combination of the variant scheme.

[0048] exist Figure 2a and Figure 2b In the embodiment, the protective body 20 opens in its first section in a wedge-shaped and simultaneously ramp-shaped manner from the tip 21 to the bottom 23, wherein the protective body forms two or three guide surfaces 24 in the first section, which act in a plow-like manner on the material moving in the flow direction X on the surface 12 and deflect the material laterally and via the structural element 13.

[0049] according to Figure 2a , 2b A variation of Figures 3a to 5b In a variant of the present invention, the second section of the protective body 20 at least partially surrounds the structural element 13 and in particular surrounds at least one connecting section 14 of the structural element 13, thereby reinforcing the at least one connecting section. By reinforcing at least one connecting section 14 or all connecting sections 14, the structural element 13 or the circuit arrangement 1 is additionally protected from forces acting orthogonally to the surface 12, which may occur, for example, when the carrier layer 10 is deformed. This conventional deformation, that is, the transition from an initially flat shape to a three-dimensional shape and the fixing of the carrier layer 10 therein, can also be provided conventionally in a subsequent processing or treatment step in order to integrate the circuit arrangement 1 into a structural component.

[0050] exist Figure 3a and 3b In the embodiment, a wedge-shaped shape is selected for the first section of the protective body 20 so that material moving in the flow direction X is deflected laterally. Furthermore, the structural element 13 and the connecting section 14 of the structural element 13 are completely enveloped by the second section of the protective body 13 .

[0051] according to Figure 4a and 4b A variant of also provides a wedge-shaped shape for the first section of the protective body 20 , wherein a concave curvature similar to that of a snow plough is additionally provided, thereby enabling an advantageous guidance of the material along the guide surface 24 .

[0052] Furthermore, it is provided that the structural element 13 has no second section of the protective body 20 upwards, and that the protective body covers the structural element 13 only orthogonally to the surface 12 and parallel to the flow direction X, so that material flowing along the flow direction X does not reach the structural element 13, but the structural element can emit light orthogonally to the surface 12, for example.

[0053] In addition, the second section can also be optimized in terms of flow and load technology, such as Figure 5a and Figure 5b According to this variant, the shield 20 is designed in its first and second sections in a knife-edge-shaped or wedge-shaped and ramp-shaped manner, wherein the second section can particularly advantageously support the forces acting on the guide surface 14 of the first section. In this case, the coupling section 14 is simultaneously covered and thus protected from damage.

[0054] Figure 6a and 6b A further variant of the circuit arrangement 1 is shown, wherein the integration of functions in the shield 20 is to be shown according to this variant. Figure 6a A side view is also shown, and Figure 6b A top view is shown. Figure 6a and 6b The shield 20 of FIG. 1 has three sections 31, 32, 33, wherein the first section 31 is arranged upstream, the second section 32 is arranged downstream, and the third section 33 is arranged between the first section 31 and the second section 33. The first section 31 is similar to Figure 1a and Figure 1bThe shield 20 in the embodiment of the present invention is designed in a wedge-shaped manner, wherein in the present case it is added that the first section is made of a light-impermeable and light-barrier material or plastic. The same applies to the second section 32, wherein the shield 20 in this region is formed in a mirror-image manner to the first section 32, so that the shield 20 in this region thus tapers from a wide base 34 to a narrow edge 35. Thus, a flow-technically advantageous overall shape of the shield 20 is produced with the central third section 33. However, in contrast to the first and second sections 31, 32, the third section 33 does not form a light barrier, but rather a light conductor, through which the light L emitted by the structural element 13 can be transmitted.

[0055] Before or after the injection of the material X parallel to the surface 12 of the carrier layer 10, the cover layer 40 can also be arranged above the protective body 20, i.e. on the side facing away from the surface 12, so that the circuit arrangement 1 can form a component together with the cover layer 40 and the material injected between the second cover layer 40 and the carrier layer 10 in the flow direction X. For a better overview, the cover layer 40 with the light escape opening 41 adjacent to the third section 33 of the protective body 20 is Figure 6b exists but is not shown.

[0056] Even when based on Figures 1a to 6b While only one structural element 13 is shown in the respectively illustrated fragments, the entire circuit arrangement 1 may also include a plurality of structural elements 13 and corresponding protective bodies 20 , wherein the shape of the protective bodies 20 of the circuit arrangement 1 may also be different, so that each protective body 20 can be adapted to the flow conditions existing on the corresponding structural element 13 .

[0057] *****

Claims

1. A circuit arrangement (1) having at least one electrical component (13) which is suitably protected against subsequent processing loads The circuit arrangement comprises a carrier layer (10) with an integrated conductor track (11), the carrier layer having a surface (12) to which at least one electrical component (13) is attached and in contact with the conductor track (11). It is characterized in that At least one protective body (20) is arranged on the surface (12) of the carrier layer (10) adjacent to at least one structural element (13) for protecting at least one electrical structural element (13), and the protective body is fixed on the carrier layer (10). Therein, at least one protective body (20) is configured to: Absorbing and / or deflecting forces acting on at least one structural element (13) through deformation of the carrier layer (10) and / or absorbing and / or deflecting forces acting on at least one structural element (13) via the material moving parallel to the surface.

2. The circuit arrangement according to claim 1, in, At least one structural element (13) has a connection region (14) at which the structural element is in contact with the conductor track (11) and which is covered and / or reinforced by a shield (20).

3. The circuit arrangement according to claim 1 or 2, in, A defined flow direction (X) is determined on the surface (12), along which the material can be guided parallel to the surface (12), and by which a main load-bearing side (15) is determined on at least one structural element (13), wherein the shielding body (20) is arranged in front of the main load side (15) opposite to the flow direction and is designed to guide the material around at least one structural element (13), or wherein the shield (20) is coupled to the main load-bearing side (15), covers the structural element (13) only on the main load-bearing side (15) and is configured to guide material to at least one structural element (13), Or wherein the shield (20) is coupled to the main load-bearing side (15), at least partially covers the structural element (13) on the main load-bearing side (15) and at least on another side, and is configured to guide material around at least one structural element (13).

4. The circuit arrangement according to claim 1, in, A defined flow direction (X) is determined on the surface (12), along which the material can be guided parallel to the surface (12), and by which a main load-bearing side (15) on at least one structural element (13) is determined, The protective body (20) is designed in a ramp-shaped and / or wedge-shaped and / or plow-shaped manner and / or is concavely curved and widens from a tapering tip (21) or edge (22) to a bottom (23) facing the main load-bearing side (15).

5. The circuit arrangement according to claim 1, in, A defined flow direction (X) is determined on the surface (12), along which the material can be guided parallel to the surface (12), and by which a main load-bearing side (15) on at least one structural element (13) is determined. The protective body (20) has at least one guide surface (24) pointing opposite to the flow direction (X), the guide surface being a distinguishable surface and / or having no flow obstacles and / or being optimized in terms of flow technology so that material flowing along the flow direction (X) is guided along the guide surface.

6. The circuit arrangement according to claim 1, in, At least one shield (20) is formed of thermoplastic, The melting temperature of the thermoplastic is higher than the melting temperature of the material, and / or the melting temperature of the thermoplastic is lower than the melting temperature of the structural element (13) and / or the housing of the structural element (13), and / or the melting temperature of the thermoplastic is lower than the melting temperature of the carrier layer (10), or the melting temperature of the thermoplastic is equal to the melting temperature of the carrier layer (10), And / or the adhesiveness of the thermoplastic is selected such that the protective body (20) adheres to the carrier layer (10) and / or the structural element (13) at least until a predetermined limiting force is reached.

7. The circuit arrangement according to claim 1, in, The carrier layer (10) is provided with a through hole (16) for at least one protective body (20), and the corresponding protective body (20) extends through the through hole.

8. The circuit arrangement according to claim 1, in, At least one shield (20) is translucent and / or transparent and is designed to form a light guide and / or a scattering surface for light (L) emitted, in particular, by at least one structural element (13). And / or at least one protective body (20) is opaque and / or light-proof and is configured to form a light barrier for shielding an area on the surface (12) of the carrier layer (10), in particular from light propagating parallel to the surface (12).

9. The circuit arrangement according to claim 1, in, The at least one protective body (20) is pressure-resistant, temperature-resistant and heat-conductive, The invention is designed to absorb and / or dissipate a thermal load acting on at least one structural element (13) due to heating of the carrier layer (10) or at least one structural element (13).

10. The circuit arrangement according to claim 1, in, The carrier layer (10) is a rigid circuit board or a flexible circuit board or a conductor film.

11. The circuit arrangement according to claim 1, in, The at least one protective body (20) is respectively configured locally and limitedly on the surface (12) of the carrier layer (10).

12. The circuit arrangement according to claim 1, in, The at least one protective body (20) is connected to the carrier layer (10) in a material-locking manner.

13. A method for producing a circuit arrangement according to any one of the preceding claims, in, At least one electrical component (13) is arranged on a carrier layer (10) having an integrated conductor circuit (11), is fixed to the carrier layer (10) and is in contact with the conductor circuit (11), At least one protective body (20) for protecting at least one electrical structural element (13) is arranged on a surface (12) of a carrier layer (10) adjacent to at least one structural element (13), and the protective body is fixed on the carrier layer (10), and the protective body is configured to absorb and / or deflect a force acting on the at least one structural element (13) through deformation of the carrier layer (10). And / or absorb and / or deflect forces acting on at least one structural element (13) via a material moving parallel to the surface (12).

14. The method according to the preceding claim, in, The carrier layer (10) is then deformed three-dimensionally and formed into a predetermined shape and fixed therein. And / or wherein a defined flow direction (X) is determined on the surface (12), the material then being guided along the flow direction parallel to the surface (12). *****

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