Heating body, atomization device and atomization equipment

Abstract

The invention discloses a heating body, an atomization device and atomization equipment. The heating body comprises a substrate and a heating film, and the heating film is arranged on the substrate; the heating body is provided with a slit penetrating through the substrate and the heating film in the thickness direction of the heating film. According to the heating body, the width of the slit is small, so that the temperature difference of the atomized substrates located at the width center of the slit and the edge of the slit is small, and the atomized substrates can be atomized more uniformly.

Description

Technical Field

[0001] The present application relates to the field of atomization technology, and more specifically, to a heating element, an atomization device and an atomization equipment. Background Art

[0002] At present, the application of atomizing devices is becoming more and more widespread. The atomizing device can heat the atomizing substrate by heating, so that the atomizing substrate is atomized to form an aerosol. In the related art, the atomizing device includes a heating element, and the heating element is provided with circular holes arranged in an array, and these circular holes can convey the atomizing substrate. However, the heating uniformity of this type of heating element still has room for improvement. Summary of the invention

[0003] Embodiments of the present application provide a heating element, an atomizing device, and an atomizing equipment.

[0004] The heating element of the embodiment of the present application includes a substrate and a heating film, wherein the heating film is disposed on the substrate; and a slit penetrating the substrate and the heating film along a thickness direction of the heating film is formed on the heating element.

[0005] In the heating element of the embodiment of the present application, the width of the slit is small, so that the temperature difference of the atomized matrix located at the center of the width of the slit and the edge of the slit is small, and the atomized matrix can be atomized more evenly.

[0006] In certain embodiments, the substrate comprises a glass substrate.

[0007] In some embodiments, the ratio between the length and the width of the slit is greater than 2.

[0008] In certain embodiments, the width of the slit is in the range of 5 μm to 200 μm.

[0009] In certain embodiments, the length of the slit ranges from 10 μm to 4000 μm.

[0010] In some embodiments, the slit is linear or curved.

[0011] In some embodiments, there are multiple slits, and the shapes and / or sizes of the slits are substantially the same.

[0012] In some embodiments, a center line of the slit in a depth direction is substantially a straight line, and an extension direction of the center line is substantially consistent with a thickness direction of the heating element.

[0013] In some embodiments, there are multiple slits, and the multiple slits are linearly arranged along the width direction of the slit.

[0014] In some embodiments, the distance between any two adjacent slits is equal, or the distance between the slits in the middle area of ​​the heating element is smaller than the distance between the slits in other areas of the heating element.

[0015] In certain embodiments, the distance between two adjacent slits ranges from 10 μm to 100 μm.

[0016] In some embodiments, ends of the plurality of slits are arranged flush along the width direction of the slits.

[0017] In some embodiments, the slits are arranged in multiple columns along a first direction of the heating element, and each column of slits includes multiple slits arranged at intervals along a second direction of the heating element, and the first direction is perpendicular to the second direction.

[0018] In some embodiments, in two adjacent columns of the slits, the slits in one column are staggered with the slits in the other column along the first direction.

[0019] In some embodiments, the ends of the slits are semicircular, and in two adjacent columns of the slits, the center of the end of one of the slits in one column and the center of the end of two adjacent slits in the other column form an equilateral triangle.

[0020] In some embodiments, the heating element includes a middle portion and an edge portion connected to the middle portion, the middle portion is provided with the slit, and the edge portion is provided with a through hole, and the cross-sectional circumference of the through hole is smaller than the cross-sectional circumference of the slit.

[0021] The atomizing device according to the embodiment of the present application comprises a housing and a heating element as described in any one of the above embodiments, wherein the heating element is arranged in the housing.

[0022] The atomization device of the embodiment of the present application includes a host and the atomization device described above, and the atomization device is connected to the host.

[0023] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 is a three-dimensional schematic diagram of an atomization device according to an embodiment of the present application;

[0026] Figure 2is a three-dimensional schematic diagram of an atomization device according to an embodiment of the present application;

[0027] Figure 3 yes Figure 2 A schematic cross-sectional view of the atomization device along direction III-III;

[0028] Figure 4 It is a partial three-dimensional schematic diagram of an atomization device according to an embodiment of the present application;

[0029] Figure 5 is a three-dimensional schematic diagram of a heating element according to an embodiment of the present application;

[0030] Figure 6 is a cross-sectional schematic diagram of a heating element according to an embodiment of the present application;

[0031] Figure 7 is a schematic diagram of the arrangement of the slits of the heating element according to the embodiment of the present application;

[0032] Figure 8 yes Figure 7 A partial schematic diagram of the slit;

[0033] Fig. 9 is another schematic diagram of the arrangement of the slits of the heating element according to the embodiment of the present application;

[0034] Fig.10 is another schematic diagram of the arrangement of the slits of the heating element according to the embodiment of the present application;

[0035] Fig.11 yes Fig.10 A partial schematic diagram of the slit;

[0036] Fig.12 is a plan view of a heating element according to an embodiment of the present application;

[0037] Fig.13 It is another plan view schematically showing the heating element according to the embodiment of the present application.

[0038] Main markings:

[0039] Atomizing device 1000, host 200, atomizing device 100, shell 10, liquid storage chamber 11, side wall 111, atomizing core 20, mounting seat 21, lower liquid channel 211, mist outlet channel 213, heating element 22, base 221, heating film 222, slit 223, central axis 224, center line 225, middle part 226, edge part 227, through hole 228, first sealing member 30, base 40, second sealing member 50, pole 60. DETAILED DESCRIPTION

[0040] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0041] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and examples of materials provided in the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0043] See also Figure 1 The embodiment of the present application discloses an atomizing device 1000, which is a device that forms an atomizing matrix into an aerosol by heating or the like. The atomizing device 1000 includes a host 200 and an atomizing device 100. The atomizing device 100 is connected to the host 200. The host 200 can provide electrical energy for the atomizing device 100. It should be noted that the atomizing matrix used in the embodiment of the present application can be a liquid that forms an aerosol. In addition, the atomizing matrix can also be a medical atomizing agent or other types of atomizing matrix. The embodiment of the present application does not limit the specific type of the atomizing matrix. The user can inhale the atomized aerosol by oral inhalation or nasal inhalation.

[0044] The atomized matrix in the embodiment of the present application may be a high viscosity atomized matrix, and the viscosity of the atomized matrix may be greater than 10000 cps at room temperature (25° C.) In the embodiment of the present application, the viscosity determination method is: GBT 17473.5-1998 Thick Film Microelectronics Technology Precious Metal Paste Test Method Viscosity Determination.

[0045] See also Figure 2-Figure 3 The atomizer device 100 of the embodiment of the present application includes a housing 10 and an atomizer core 20, and the atomizer core 20 is installed in the housing 10. Specifically, the housing 10 is also a basic component of the atomizer device 100, and the housing 10 can carry other parts of the atomizer device 100. The housing 10 is formed with a liquid storage chamber 11, and the atomizer substrate is accommodated in the liquid storage chamber 11. The atomizer core 20 is a component for forming the atomizer substrate into an aerosol. The atomizer core 20 can atomize the atomizer substrate to form smoke by heating.

[0046] See also Figure 3-Figure 4 In some embodiments, the atomizer core 20 includes a mounting seat 21 and a heating element 22, and the heating element 22 is disposed on the mounting seat 21. Specifically, the mounting seat 21 is a component for fixing the heating element 22, and the mounting seat 21 has the functions of supporting the heating element 22 and blocking the liquid storage chamber 11. The heating element 22 is a component for generating heat and atomizing the atomization matrix.

[0047] like Figure 4 As shown, the mounting base 21 is provided with a lower liquid channel 211 and a mist outlet channel 213. The lower liquid channel 211 is a channel for the atomized matrix to flow from the liquid storage chamber 11 to the heating element 22. Under the action of gravity, air pressure and other forces, the atomized matrix enters the lower liquid channel 211 from one end of the lower liquid channel 211 and flows to the heating element 22 from the other end of the lower liquid channel 211.

[0048] The mist outlet channel 213 is a channel for conducting smoke such as aerosol formed by the heating element 22 heating the atomizing matrix to the outside of the mounting seat 21 . In other words, the aerosol formed by the atomizing matrix can flow to the outside of the mounting seat 21 through the mist outlet channel 213 .

[0049] The mist outlet channel 213 and the lower liquid channel 211 are arranged crosswise and isolated, for example, the lower liquid channel 211 is arranged on the first side of the mounting seat 21, and the mist outlet channel 213 is arranged on the second side of the mounting seat 21, and the first side and the second side are perpendicular. Figure 4 As shown in the orientation, the lower liquid channel 211 is arranged on the left and right sides of the mounting seat 21, and the mist outlet channel 213 is arranged on the front and back sides of the mounting seat 21.

[0050] It can be understood that the mounting base 21 and the heating element 22 are both installed in the housing 10 .

[0051] See also Figure 5 and Figure 6 In some embodiments, the heating element 22 includes a substrate 221 and a heating film 222 disposed on the substrate 221. The heating element 22 is formed with a slit 223 penetrating the substrate 221 and the heating film 222 along a thickness direction of the heating film 222.

[0052] In this way, the width of the slit 223 is small, so that the temperature difference of the atomized substrate located at the width center of the slit 223 and the edge of the slit 223 is small, and the atomized substrate can be atomized more uniformly.

[0053] Specifically, the substrate 221 can be used as a carrier of the heating film 222. The substrate 221 can be made of glass, dense ceramics and other materials, or in other words, the substrate 221 can include a glass substrate 221 and a ceramic substrate 221. The present application does not further limit the specific material of the substrate 221.

[0054] When the substrate 221 is made of glass, the substrate 221 has insulation properties to prevent the heating element 22 from heating as a whole and atomizing all the atomizing substrates in the liquid storage chamber 11. In addition, the glass substrate 221 has low material cost and is easy to shape, which can reduce the manufacturing cost of the heating element 22. The substrate 221 can be in the shape of a square sheet, an ellipse, etc. When the substrate 221 is in the shape of a square sheet, the length and width of the substrate 221 can be 6 mm*3 mm respectively.

[0055] The heating film 222 is used to convert electrical energy into thermal energy. The heating film 222 can be made of conductive and easily heat-generating materials such as metals and alloys. For example, the material of the heating film 222 can be gold, silver, platinum, palladium, palladium-copper alloy, gold-silver-platinum alloy, gold-silver alloy, titanium-zirconium alloy, palladium-silver alloy, gold-platinum alloy, stainless steel, etc. The heating film 222 can be arranged on the surface of the substrate 221 by printing, electroplating, laminating, sputtering, etc. The slit 223 can be manufactured by laser processing, etching, etc.

[0056] The cross section mentioned in this application refers to a plane perpendicular to the thickness of the heating element 22, and the cross-sectional area is the area enclosed by the outline of the object or feature in the cross section.

[0057] See also Figure 7 and Figure 8 In some embodiments, the ratio (L / W) between the length L and the width W of the slit 223 is greater than 2. For example, the length-to-width ratio of the slit 223 is 3, 10, 50, 100, 200, etc. In this way, the length L of the slit 223 is much greater than the width W. Among the slit 223 and the circular hole with the same cross-sectional area, the circumference of the slit 223 is longer, so that the atomized matrix can be more easily transported through the slit 223 to the surface of the heating film 222.

[0058] It should be noted that the length L of the slit 223 is the maximum dimension of the slit 223 when the slit 223 is in an extended state, and the width W of the slit 223 is the dimension in a direction perpendicular to the central axis 224 of the slit 223 .

[0059] Please combine Figure 8In some embodiments, the width of the slit 223 ranges from 5 μm to 200 μm. For example, the width of the slit 223 can range from 5 μm to 150 μm, 5 μm to 50 μm, 30 μm to 100 μm, or 50 μm to 80 μm. For another example, the width W of the slit 223 can be 5 μm, 15 μm, 50 μm, 100 μm, 150 μm, 200 μm, or the like.

[0060] When the width W of the slit 223 is less than 5 μm, the slit 223 is difficult to form, the heating element 22 is difficult to manufacture, and the atomized matrix is ​​difficult to pass through the slit 223; when the width W of the slit 223 is greater than 200 μm, the width of the slit 223 is relatively large, which easily causes uneven temperatures at the center and edge of the slit 223. Therefore, when the width W of the slit 223 is between 5 μm and 200 μm, the slit 223 is not only easy to manufacture, but also can reduce the temperature difference of the atomized matrix located at the center and edge of the slit, so that the atomized matrix can be atomized more evenly.

[0061] It should be noted that, in the same slit 223 , the width of the slit 223 can be set to be equal everywhere, or the slit 223 can be set to be unequal in width.

[0062] See also Figure 7 and Figure 8 In some embodiments, the length of the slit 223 ranges from 10 μm to 4000 μm. For example, the length of the slit 223 can range from 10 μm to 4000 μm, 500 μm to 3500 μm, 800 μm to 3000 μm, 1000 μm to 2000 μm, or 1200 μm to 1500 μm. For another example, the length L of the slit 223 can be 10 μm, 200 μm, 500 μm, 1000 μm, 2000 μm, 3000 μm, 4000 μm, etc.

[0063] When the length L of the slit 223 is less than 10 μm, the liquid-carrying capacity of the heating element 22 may be insufficient, and the atomized matrix is ​​difficult to be transported to the atomizing surface of the heating element 22; when the length L of the slit 223 is greater than 4000 μm, the required size of the heating element 22 is large, which easily leads to a large overall volume of the atomizing device 100, which is not conducive to the miniaturization of the atomizing device 100. Therefore, when the length L of the slit 223 is between 10 μm and 4000 μm, the liquid-carrying capacity of the heating element 22 is strong, and the size of the heating element 22 can be made appropriate, which is conducive to the miniaturization of the atomizing device 100.

[0064] In some embodiments, the slit 223 is linear or curved. Figure 7In the example shown, the slits 223 are linear, and the linear slits 223 make the pattern on the surface of the heating film 222 regular, so that the atomized liquid flowing to the surface of the heating film 222 is more uniform, which is beneficial to improve the uniformity of the atomization of the heating element 22. Fig. 9 In the example shown, the slit 223 is curved, and the curved slit 223 can adjust the resistance of the heating film 222 and optimize the current path, so that the heating film 222 generates heat more evenly, thereby improving the uniformity of atomization of the heating element 22 .

[0065] Please combine Figure 8 The straight line or curved line of the slit 223 is defined by the central axis 224 of the slit 223. If the central axis 224 of the slit 223 is a straight line, the slit 223 is a straight line. If the central axis 224 of the slit 223 is a curve, the slit 223 is a curve. The curve can be a wavy line, an arc, etc., and the present application does not limit the specific shape of the curve.

[0066] In some embodiments, there are multiple slits 223, and the shapes and / or sizes of the slits 223 are substantially the same. For example, the shapes of any two slits 223 are substantially the same; for another example, the sizes of any two slits 223 are substantially the same; for another example, the shapes and sizes of any two slits 223 are the same. In this way, the arrangement structure of the multiple slits 223 is more consistent, so that the atomized liquid flowing to the surface of the heating film 222 is more uniform, which is conducive to improving the uniformity of the atomization of the heating element 22.

[0067] like Figure 7 In the example of FIG. 1 , all the slits 223 are linear and have the same length, width and other dimensions. Fig. 9 In the example, all the slits 223 are curved and have the same length, width and other dimensions.

[0068] Of course, in some embodiments, the shapes of any two slits 223 may be different. For example, some slits 223 are straight and some slits 223 are curved. In some embodiments, the sizes of any two slits 223 may be different. For example, some slits 223 are longer and some slits 223 are shorter.

[0069] See also Figure 6 In some embodiments, the center line 225 in the depth direction of the slit 223 is substantially straight, and the extension direction of the center line 225 is substantially consistent with the thickness direction of the heating element 22. In this way, the transport path of the atomized liquid is shorter, and it is easier to pass through the slit 223 to reach the surface of the heating film 222 and be atomized.

[0070] Of course, in other embodiments, the extension direction of the center line 225 can be inclined with respect to the thickness direction of the heating element 22 .

[0071] like Figure 7 and Figure 8 As shown, in some embodiments, the number of slits 223 is multiple, and the multiple slits 223 are arranged linearly along the width direction of the slits 223. In this way, the multiple slits 223 are arranged regularly, so that the atomized liquid flowing to the surface of the heating film 222 is more uniform, which is conducive to improving the uniformity of atomization of the heating element 22. The number of slits 223 can be determined according to the width and spacing of each slit 223 and the overall size of the heating element 22. The present application does not limit the specific number of slits 223. Of course, in other embodiments, the multiple slits 223 can also be arranged in irregular shapes.

[0072] See also Figure 7-Figure 9 In some embodiments, the distance between any two adjacent slits 223 is equal. In this way, the amount of atomized matrix at each position of the heating film 222 can be substantially the same, which is beneficial to improving the uniformity of atomization of the heating element 22. Of course, in other embodiments, the distance between any two adjacent slits 223 may not be equal.

[0073] In some embodiments, the distance between the slits 223 in the middle area of ​​the heating element 22 is smaller than the distance between the slits 223 in other areas of the heating element 22. In this way, the atomization capacity of different areas of the heating element 22 can be matched with the slits 223 with different spacings, so that the atomization of the heating element 22 is more uniform.

[0074] See also Figure 8 In some embodiments, the distance between two adjacent slits 223 ranges from 10 μm to 100 μm. For example, the distance between two adjacent slits 223 ranges from 10 μm to 100 μm, 10 μm to 90 μm, 20 μm to 80 μm, 30 μm to 75 μm, 50 μm to 60 μm, etc. For another example, the distance D between two adjacent slits 223 can be 10 μm, 15 μm, 50 μm, 80 μm, 100 μm, etc.

[0075] When the distance D is less than 10 μm, the adjacent slits 223 are easily connected to each other, making it difficult to manufacture the heating element 22; when the distance D is greater than 100 μm, the distance between two adjacent slits 223 is too large, which easily makes it difficult to transport the atomized matrix to various positions of the heating film 22, thereby reducing the atomization uniformity of the heating element 22. In this way, when the distance D is between 10 μm and 100 μm, not only is the heating element 22 easy to manufacture, but the atomization uniformity of the heating element 22 can also be improved.

[0076] The distance D between two adjacent slits 223 is the distance between the width centers of the two adjacent slits 223 , or the distance between the corresponding edges of the two adjacent slits 223 .

[0077] See also Figure 7 and Fig. 9 In some embodiments, the ends of the plurality of slits 223 are arranged flush along the width direction of the slits 223. In this way, the plurality of slits 223 are arranged regularly, so that the atomized liquid flowing to the surface of the heating film 222 is more uniform, which is conducive to improving the uniformity of atomization of the heating element 22, thereby reducing the possibility of dry burning of the heating element 22. Of course, in other embodiments, the ends of the plurality of slits 223 can also be arranged unevenly along the width direction of the slits 223.

[0078] See also Fig.10 In some embodiments, the slits 223 are arranged in multiple columns along the first direction x of the heating element 22 , and each column of the slits 223 includes multiple slits 223 arranged at intervals along the second direction y of the heating element 22 , and the first direction x is perpendicular to the second direction y.

[0079] In this way, the slits 223 are arranged in multiple rows and columns, which can avoid the length of a single slit 223 being too long and difficult to process, so that the consistency of each slit 223 can be improved, so that the liquid delivery capacity of each position of the heating element 22 is basically the same, and the resistance of the heating film 222 can be adjusted, the current path can be optimized, and the heating film 222 can heat more evenly, thereby improving the atomization uniformity of the heating element 22. Fig.10 In the example, the slits 223 may be arranged in 12 columns, and the number of rows formed by the arrangement of the slits 223 is greater than the number of columns.

[0080] See also Fig.10 and Fig.11 In some embodiments, in two adjacent rows of slits 223, the slits 223 in one row of slits 223 are staggered with the slits 223 in the other row of slits 223 along the first direction x. In this way, the probability of the ends of the slits 223 penetrating each other can be reduced, and the production yield of the heating element 22 can be improved. In addition, such an arrangement can also make the atomized matrix delivered to the surface of the heating film 222 more evenly distributed, which is conducive to improving the uniformity of the atomization of the heating element 22.

[0081] See also Fig.10 and Fig.11In some embodiments, the ends of the slits 223 are semicircular, and in two adjacent rows of slits 223, the end center of one slit 223 in one row of slits 223 and the end centers of two adjacent slits 223 in the other row of slits 223 form an equilateral triangle. In this way, the distances between adjacent slits 223 are roughly equal, and the atomization matrix is ​​evenly distributed on the surface of the heating film 222, thereby improving the uniformity of atomization of the heating element 22 and reducing the probability of dry burning at a certain position of the heating film 222.

[0082] See also Fig.12 and Fig.13 In some embodiments, the heating element 22 includes a middle portion 226 and an edge portion 227 connected to the middle portion 226, the middle portion 226 is provided with a slit 223, and the edge portion 227 is provided with a through hole 228, and the cross-sectional perimeter of the through hole 228 is smaller than the cross-sectional perimeter of the slit 223. In this way, the middle portion 226 is provided with a slit 223, and the edge portion 227 is provided with a through hole 228, so that more atomized substrates can pass through the middle portion 226 and be atomized, thereby improving the atomization uniformity of the heating element 22 and reducing the probability of dry burning of the heating element 22.

[0083] Specifically, the number of the slits 223 located in the middle part 226 can be multiple. For the specific features of the slits 223, please refer to the specific description of the above embodiments, which will not be repeated here. The through hole 228 can be a circular hole. The number of through holes 228 is multiple, and the multiple through holes 228 can be regularly distributed or irregularly distributed. The size of the through hole 228 can be specifically set according to requirements, as long as the through hole 228 can smoothly discharge liquid when negative pressure is formed on one side of the heating membrane 222, and can lock liquid when the air pressure on one side of the heating membrane 222 is normal.

[0084] In some embodiments, the thickness of the heating element 22 ranges from 0.4 mm to 1 mm. When the thickness of the heating element 22 is less than 0.4 mm, the strength of the heating element 22 may be insufficient and the depth of the slit 223 may be insufficient, resulting in insufficient liquid locking ability of the heating element 22 and leakage and other undesirable phenomena; when the thickness of the heating element 22 is greater than 1 mm, the depth of the slit 223 may be too deep, making it difficult for the atomized matrix to pass smoothly through the heating element 22 and be atomized, and the heating element 22 is too thick, which is not conducive to the manufacturing and processing of the slit 223. Therefore, when the thickness of the heating element 22 is within the above size range, the heating element 22 has good liquid conduction and liquid locking properties and is easy to manufacture.

[0085] Please refer again Figure 3 and Figure 4In some embodiments, the atomizing device 100 may further include a first seal 30, a base 40, a second seal 50 and a pole 60. The first seal 30 seals the gap between the mounting seat 21 and the side wall of the liquid storage chamber 11. The base 40 is inserted into the housing 10, and the second seal 50 seals the gap between the base 40 and the side wall of the liquid storage chamber 11. The pole 60 is mounted on the base 40 and contacts the heating film 222 of the heating element 22. The pole 60 can transmit the electric energy of the host 200 to the heating element 22 to make the heating element 22 generate heat.

[0086] In the description of the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0087] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0088] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A heating element, characterized in that: include: substrate; A heating film, wherein the heating film is arranged on the substrate; The heating element is formed with a slit penetrating the substrate and the heating film in a thickness direction of the heating film.

2. The heating element according to claim 1, characterized in that: The substrate includes a glass substrate.

3. The heating element according to claim 1, characterized in that: The ratio between the length and the width of the slit is greater than 2.

4. The heating element according to claim 1, characterized in that The width of the slit is in the range of 5 μm to 200 μm.

5. The heating element according to claim 1, characterized in that: The length of the slit ranges from 10 μm to 4000 μm.

6. The heating element according to claim 1, characterized in that: The slit is in a straight line or a curved line.

7. The heating element according to claim 1, characterized in that: There are multiple slits, and the shapes and / or sizes of the slits are substantially the same.

8. The heating element according to claim 1, characterized in that The center line of the slit in the depth direction is substantially a straight line, and the extension direction of the center line is substantially consistent with the thickness direction of the heating element.

9. The heating element according to claim 1, characterized in that: There are a plurality of slits, and the plurality of slits are linearly arranged along the width direction of the slits.

10. The heating element according to claim 9, characterized in that: The distance between any two adjacent slits is equal, or the distance between the slits in the middle area of ​​the heating element is smaller than the distance between the slits in other areas of the heating element.

11. The heating element according to claim 9, characterized in that The distance between two adjacent slits ranges from 10 μm to 100 μm.

12. The heating element according to claim 9, characterized in that: The ends of the plurality of slits are arranged flush along the width direction of the slits.

13. The heating element according to claim 1, characterized in that: The slits are arranged in a plurality of columns along a first direction of the heating element, and each column of slits includes a plurality of slits arranged at intervals along a second direction of the heating element, and the first direction is perpendicular to the second direction.

14. The heating element according to claim 13, characterized in that: In two adjacent columns of the slits, the slits in one column and the slits in the other column are staggered along the first direction.

15. The heating element according to claim 14, characterized in that: The ends of the slits are semicircular, and in two adjacent rows of the slits, the center of the end of one of the slits in one row and the center of the ends of two adjacent slits in the other row form an equilateral triangle.

16. The heating element according to claim 1, characterized in that The heating element comprises a middle portion and an edge portion connected to the middle portion, the middle portion is provided with the slit, the edge portion is provided with a through hole, and the cross-sectional perimeter of the through hole is smaller than the cross-sectional perimeter of the slit.

17. An atomizing device, characterized in that: include: shell; and The heating element according to any one of claims 1 to 16, wherein the heating element is arranged in the outer shell.

18. An atomization device, characterized in that: include: Host; and The atomizing device according to claim 17, wherein the atomizing device is connected to the host.

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