Semiconductor process equipment and process tail gas separation device thereof

Abstract

The invention provides a process tail gas separation device of semiconductor process equipment, which is used for separating non-gaseous byproducts in process tail gas discharged from a process chamber of the semiconductor process equipment, and the process tail gas separation device comprises: a condensation assembly, which comprises a condenser, and the condenser is used for condensing the process tail gas, and is used for separating the non-gaseous byproducts from the process tail gas; condensing the process tail gas to separate out a non-gaseous by-product; wherein the condenser comprises a condensation cavity for accommodating process tail gas; the scraper assembly is arranged in the condensation cavity and used for scraping off non-gaseous by-products separated on the inner wall face of the condensation cavity after the process tail gas is condensed, the non-gaseous by-products can be prevented from being accumulated on the inner wall face of the condensation cavity, the smoothness of a process tail gas discharging channel is kept, and the use safety of the process tail gas separation device is improved. The maintenance period of the process tail gas separation device is shortened. The invention also provides semiconductor process equipment.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a semiconductor process equipment and a process tail gas separation device thereof. Background Art

[0002] With the rapid development of optical communication technology, the transmission rate of optical communication is getting faster and faster. Photodetector chips are the core chips in optical communication systems. This chip often uses polyimide as the dielectric layer.

[0003] Polyimide films are made of benzene tetracarboxylic acid dianhydride (PMDA) and diamino diphenyl ether (DDE) in a strong polar solvent (water and γ-butyrolactone), which are polycondensed and cast into films and then imidized. Polyimide is widely used in the packaging process of semiconductor technology because of its good temperature resistance, dielectric strength, radiation resistance and adhesion. In the packaging process, after the polyimide liquid is vacuum heated and cured to form a polyimide film, a vertical furnace equipment is usually used to perform a polyimide curing (PIQ) process on the polyimide film. At a temperature greater than 250°C, the polyimide film is heated, and nitrogen is introduced into the chamber to promote uniform heating of the film. At high temperature, the solvent in the polyimide film evaporates, generating water vapor and gaseous γ-butyrolactone, and the polyimide film is cured. After the process is completed, nitrogen, water vapor and gaseous γ-butyrolactone are discharged from the process chamber as process waste gas.

[0004] However, when a separation device is used in the related art to separate gaseous water and oil mist-like γ-butyrolactone, the separated by-products accumulate in the separation device and cannot be discharged in time, resulting in blockage of the exhaust pipe of the process chamber and increased exhaust pressure, causing the device to shut down. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a process exhaust gas separation device for semiconductor process equipment, which is used to solve the technical problem that pipelines are easily blocked during process exhaust gas separation.

[0006] In order to achieve the purpose of the present invention, a process exhaust gas separation device of a semiconductor process equipment is provided, which is used to separate non-gaseous by-products in process waste gas discharged from a process chamber of the semiconductor process equipment; the process exhaust gas separation device comprises: a condensation component, which includes a condenser, and the condenser is used to condense the process exhaust gas so that the non-gaseous by-products are separated out of the process exhaust gas after condensation; wherein the condenser includes a condensation cavity for accommodating the process exhaust gas; a scraper assembly is arranged in the condensation cavity, and the scraper assembly is used to scrape off the non-gaseous by-products separated on the inner wall surface of the condensation cavity after the process exhaust gas is condensed.

[0007] Furthermore, the scraper assembly includes: a rotating member rotatably disposed in the condensation chamber; a first plate body connected to the rotating member, and the first plate body is used to scrape off non-gaseous by-products on the inner wall surface of the condensation chamber when the rotating member rotates.

[0008] Furthermore, the rotating member includes: a tube body, which is arranged in the condensation cavity, and the tube body is provided with a first through hole penetrating its thickness; an end plate, which is connected to one end of the tube body, and the end plate is provided with a second through hole penetrating its thickness; wherein the first plate body portion is arranged on the outer wall surface of the tube body facing the condensation cavity.

[0009] Furthermore, it also includes: a buffer component, connected to the condensation component, the buffer component is provided with an air inlet and an air outlet, the air inlet is used to allow the process exhaust gas to pass through, the air outlet is used to discharge the gaseous by-products separated after the process exhaust gas is condensed, and the buffer component is used to reduce the flow rate of the process exhaust gas introduced from the air inlet; wherein the buffer component includes a buffer pipe arranged in the condensation cavity, a buffer cavity connected to the air inlet is formed in the buffer pipe, and a condensation cavity connected to the air outlet is formed outside the buffer pipe; the condenser is used to condense the process exhaust gas in the condensation cavity, so that the process exhaust gas can be separated into non-gaseous by-products on the inner wall surface of the condensation cavity and the outer wall surface of the buffer pipe; the scraper component is arranged in the condensation cavity, and the scraper component is also used to scrape off the non-gaseous by-products separated on the outer wall surface of the buffer pipe after the process exhaust gas is condensed.

[0010] Furthermore, the scraper assembly also includes: a second plate body portion connected to the rotating member, and the second plate body portion is used to scrape off non-gaseous by-products on the outer wall surface of the buffer pipe when the rotating member rotates.

[0011] Furthermore, the first plate body and the second plate body each include a plurality of scrapers, and the orthographic projection of the scrapers on the rotating member is arranged at a preset angle with the first plane; the preset angle is any angle not equal to 0°; the first plane is perpendicular to the rotation axis of the rotating member.

[0012] Furthermore, multiple scrapers are divided into multiple scraper groups according to different circumferential positions, and the preset angles of multiple scrapers in the multiple scraper groups are the same; the multiple scrapers of any two adjacent scraper groups in the first plate body are staggered along the rotation axis of the rotating member; the multiple scrapers of any two adjacent scraper groups in the second plate body are staggered along the rotation axis of the rotating member.

[0013] Furthermore, the buffer assembly also includes: a mounting plate connected to the inner wall of the buffer pipe, the mounting plate being arranged opposite to the air inlet, and the mounting plate being provided with a through hole extending therethrough for the process exhaust gas to pass through the through hole and enter the buffer pipe into the buffer pipe; a mounting column connected to the mounting plate and arranged in the buffer cavity along the axial direction of the buffer cavity; a plurality of buffer plates connected to the mounting column, the plurality of buffer plates being spaced apart and distributed in the axial direction of the buffer cavity, each buffer plate being arranged to be tilted downward, and two adjacent buffer plates being staggered in the axial direction of the buffer cavity, for changing the flow direction of the process exhaust gas in the buffer cavity to reduce the flow velocity of the process exhaust gas in the buffer cavity.

[0014] Furthermore, it also includes a driving motor whose output shaft is connected to the rotating part through a transmission assembly, and the transmission assembly includes: a transmission shaft, whose two ends are respectively connected to the output shaft and the rotating part, and the transmission shaft is used to transmit the rotational force output by the driving motor to the rotating part to rotate the rotating part; a pair of bearings, which are arranged at intervals on the transmission shaft; an outer sleeve, which forms a accommodating space for accommodating a pair of bearings; and an inner sleeve, which is arranged in the accommodating space and is located between the pair of bearings.

[0015] Furthermore, it also includes: a separation component connected to the condensation component, the separation component includes a separation chamber, and the separation chamber is used to collect the non-gaseous by-products scraped by the scraper component and discharge the non-gaseous by-products.

[0016] Furthermore, the separation component also includes: a cooling component, which is sleeved around the separation cavity and is used to cool the collected non-gaseous by-products and the transmission component, and the transmission component is arranged in the cooling component.

[0017] The present invention further provides a semiconductor process equipment, comprising a process chamber and a process tail gas separation device of the semiconductor process equipment as described above and connected to the exhaust port of the process chamber.

[0018] The present invention has the following beneficial effects:

[0019] The process exhaust gas separation device of the semiconductor process equipment in the present application is provided with a scraper assembly in the condensation chamber. The scraper assembly is used to scrape off the non-gaseous by-products separated on the inner wall surface of the condensation chamber after the process exhaust gas is condensed, such as the greasy γ-butyrolactone by-product. This can prevent the non-gaseous by-products from accumulating on the inner wall surface of the condensation chamber, keep the process exhaust gas discharge channel smooth, and avoid the downtime caused by the by-products clogging the exhaust pipe of the process chamber in the related technology, so as to improve the safety of the use of the process exhaust gas separation device and shorten the maintenance cycle of the process exhaust gas separation device.

[0020] Other objects and features of the present invention will become apparent by reading the specification, claims and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0022] Figure 1 It is a structural schematic diagram of semiconductor process equipment in related art.

[0023] Figure 2 It is a structural schematic diagram of the connection between a process chamber and a process tail gas separation device of a semiconductor process equipment according to an embodiment of the present invention.

[0024] Figure 3 yes Figure 2 View of the middle section AA.

[0025] Figure 4 yes Figure 2 Enlarged view of part B in the middle.

[0026] Figure 5 yes Figure 2 Enlarged view of part C in the middle.

[0027] Figure 6 It is a structural schematic diagram of the connection between the end plate and the transmission shaft in the process tail gas separation device of the semiconductor process equipment according to the embodiment of the present invention.

[0028] Figure 7 yes Figure 6 Side view of.

[0029] Figure 8 yes Figure 6 Top view of the .

[0030] Fig. 9 It is a structural schematic diagram of the connection between a scraper assembly, a transmission assembly and a drive motor of a process tail gas separation device of a semiconductor process equipment according to an embodiment of the present invention.

[0031] Fig.10 yes Fig. 9 Enlarged view of the part D in the middle.

[0032] Description of main component symbols:

[0033] 1. Reaction chamber; 2. Condensation chamber; 3. Separation chamber; 4. Collection chamber; 5. Exhaust valve;

[0034] 110, condenser; 111, condensation cavity; 1121, condensation outer cavity; 1122, first liquid inlet; 1123, first liquid outlet; 121, first condensation flange; 122, second condensation flange;

[0035] 200, scraper assembly; 210, rotating member; 211, tube body; 2111, first through hole;

[0036] 212, end plate; 2121, second through hole; 220, first plate body; 230, second plate body;

[0037] 231, scraper;

[0038] 300, buffer assembly; 310, air inlet; 320, air outlet; 330, buffer pipe;

[0039] 340, mounting plate; 350, mounting column; 360, buffer plate; 370, buffer flange;

[0040] 400, driving motor;

[0041] 500, transmission assembly; 510, transmission shaft; 520, bearing; 530, outer sleeve; 540, inner sleeve;

[0042] 600, separation assembly; 610, separation chamber; 621, cooling outer chamber; 622, second liquid inlet; 623, second liquid outlet; 630, separation flange;

[0043] 700, storage component;

[0044] 20. Process chamber. DETAILED DESCRIPTION

[0045] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0046] Figure 1 It is a structural schematic diagram of semiconductor process equipment in related technology. Figure 1, the semiconductor process equipment of the related technology includes a reaction chamber 1, a condensation chamber 2, a separation chamber 3, a collection chamber 4 and an exhaust valve 5. Among them, the workpiece undergoes a polyimide curing process in the reaction chamber 1. After the process treatment, the reaction chamber 1 discharges high-temperature process waste gas through the exhaust pipe, and the high-temperature process waste gas includes high-temperature nitrogen, water vapor and oil mist-like γ-butyrolactone by-products. The exhaust pipe is connected to the condensation chamber 2 to pass the above-mentioned process waste gas into the condensation chamber 2. The high-temperature nitrogen, water vapor and oil mist-like γ-butyrolactone by-products are separated into medium-temperature gas, water and grease-like γ-butyrolactone by-products respectively under the cooling effect of the condensation chamber 2. The above-separated medium-temperature gas, water and grease-like γ-butyrolactone by-products continue to enter the separation chamber 3. Due to the different densities of various separation products, various separation products can be directed to different recovery systems. For example, water and grease-like γ-butyrolactone by-products flow into the collection chamber 4 through the discharge valve, and the medium-temperature gas and part of the water vapor flow into the plant service system through the exhaust valve 5.

[0047] However, as time goes by, more and more greasy γ-butyrolactone byproducts enter the separation chamber 3, and the decrease in temperature will cause the fluidity of the greasy γ-butyrolactone byproducts to deteriorate. Even if the opening of the exhaust valve 5 is increased, the greasy γ-butyrolactone byproducts in the separation chamber 3 cannot be completely discharged. Eventually, the gas flow cross-section of the separation chamber 3 may become smaller and smaller, thereby blocking the exhaust pipe on the reaction chamber 1 connected to the condensation chamber 2, resulting in an increase in the pressure of the reaction chamber 1 and possible shutdown.

[0048] In order to solve the above technical problems, the present application proposes a process exhaust gas separation device for semiconductor process equipment, which is used to separate non-gaseous by-products in the process exhaust gas discharged from the process chamber of the semiconductor process equipment. The embodiment disclosed in the present application can improve the smoothness of the flow of process exhaust gas in the process exhaust gas separation device of the semiconductor process equipment.

[0049] Figure 2 FIG. 2 is a structural schematic diagram of the connection between the process chamber 20 and the process tail gas separation device of the semiconductor process equipment according to the embodiment of the present invention. Figure 2 The process tail gas separation device includes a condensation component and a scraper component 200.

[0050] The condensation assembly includes a condenser 110. The condenser 110 is used to condense the process tail gas so that the process tail gas can be separated into non-gaseous by-products after condensation. The condenser 110 includes a condensation chamber 111 for accommodating the process tail gas.

[0051] The scraper assembly 200 is disposed in the condensation chamber 111 . The scraper assembly 200 is used to scrape off the non-gaseous by-products separated on the inner wall surface of the condensation chamber 111 after the process tail gas is condensed, so as to prevent the non-gaseous by-products from accumulating on the inner wall surface of the condensation chamber 111 .

[0052] In some embodiments, the condenser 110 further includes a condensation component, which is sleeved around the condensation chamber 111 and is used to cool the process tail gas discharged from the process chamber 20 into the condensation chamber 111, so that the process tail gas is separated into non-gaseous by-products after condensation. When the process tail gas includes high-temperature nitrogen, water vapor and oil mist-like γ-butyrolactone by-products, the condensation component condenses the process tail gas to separate medium-temperature gas, water and oil-like γ-butyrolactone by-products, and the above-mentioned separated products have different densities, which is convenient for further separation and collection.

[0053] Specifically, the condensation component may include an outer condensation cavity 1121, which is sleeved around the condensation cavity 111, and the outer condensation cavity 1121 is provided with a first liquid inlet 1122 and a first liquid outlet 1123. The first liquid inlet 1122 may be connected to a cooling medium source (not shown in the figure) to guide the cooling medium provided by the cooling medium source to the space between the outer condensation cavity 1121 and the condensation cavity 111, and the first liquid outlet 1123 is used for the cooling medium to flow out, so that the cooling medium can maintain fluidity in the space between the outer condensation cavity 1121 and the condensation cavity 111. The cooling medium exchanges heat with the condensation cavity 111, and the condensation cavity 111 can be cooled, thereby cooling the process tail gas in the condensation cavity 111 and condensing it to separate non-gaseous by-products.

[0054] Preferably, see Figure 2 The first liquid inlet 1122 can be located below the first liquid outlet 1123, so that the cooling medium flows into the condensation outer chamber 1121 from the bottom and flows out from the top of the condensation outer chamber 1121. In this way, the cooling medium can flow through the entire space between the condensation outer chamber 1121 and the condensation chamber body 111 to fill the entire space between the condensation outer chamber 1121 and the condensation chamber body 111, thereby improving the condensation effect of the condensation component on the process exhaust gas.

[0055] The process exhaust gas separation device in this embodiment is provided with a scraper assembly 200 in the condensation chamber 111. The scraper assembly 200 is used to scrape off the non-gaseous by-products separated on the inner wall surface of the condensation chamber 111 after the process exhaust gas is condensed, such as the oily γ-butyrolactone by-product. This can prevent the non-gaseous by-products from accumulating on the inner wall surface of the condensation chamber 111, maintain the smoothness of the process exhaust gas discharge channel, improve the safety of the process exhaust gas separation device, and shorten the maintenance period of the process exhaust gas separation device.

[0056] Figure 3 yes Figure 2 View of the middle section AA. Figure 4 yes Figure 2 Enlarged view of part B in the figure. Figure 3 and Figure 4The process tail gas separation device further includes a buffer assembly 300. The buffer assembly 300 is connected to the condensation assembly. The buffer assembly 300 is provided with an air inlet 310 and an air outlet 320. The air inlet 310 is used to introduce the process tail gas, and the air outlet 320 is used to discharge the gaseous by-products separated after the process tail gas is condensed. The buffer assembly 300 is used to reduce the flow rate of the process tail gas introduced from the air inlet 310.

[0057] The buffer assembly 300 includes a buffer pipe 330. The buffer pipe 330 is disposed in the condensation cavity 111 to reduce the installation space of the process tail gas separation device as a whole. The buffer pipe 330 forms a buffer cavity connected to the air inlet 310, and the buffer pipe 330 forms a condensation cavity connected to the air outlet 320.

[0058] It can be understood that the buffer pipe 330 is disposed in the condensation cavity 111, and the buffer pipe 330 is used to separate the condensation cavity 111 into a connected buffer cavity and a condensation cavity. Therefore, the condensation cavity 111 includes a condensation cavity and a buffer cavity.

[0059] The condenser 110 is used to condense the process tail gas in the condensation chamber so that the process tail gas passing through the buffer chamber flows from bottom to top in the condensation chamber at a lower flow rate. The non-gaseous by-products separated after the process tail gas is condensed may adhere to the inner wall surface of the condensation chamber 111 and the outer wall surface of the buffer pipe 330. The scraper assembly 200 is arranged in the condensation chamber. In addition to being used to scrape off the non-gaseous by-products separated on the inner wall surface of the condensation chamber 111, the scraper assembly 200 can also be used to scrape off the non-gaseous by-products separated on the outer wall surface of the buffer pipe 330 after the process tail gas is condensed.

[0060] See also Figure 2 The scraper assembly 200 includes a rotating member 210 and a first plate body 220. The rotating member 210 is rotatably disposed in the condensation chamber 111. The first plate body 220 is connected to the rotating member 210. The first plate body 220 is used to scrape off non-gaseous byproducts on the inner wall surface of the condensation chamber 111 when the rotating member 210 rotates.

[0061] The scraper assembly 200 further includes a second plate body 230. The second plate body 230 is connected to the rotating member 210, and is used to scrape off non-gaseous byproducts on the outer wall of the buffer pipe 330 when the rotating member 210 rotates.

[0062] In some embodiments, the first plate body 220 and the second plate body 230 are both connected to the rotating member 210. When the condensing component condenses the process tail gas in the condensation chamber, the process tail gas may separate non-gaseous by-products on the inner wall surface of the condensation chamber 111 and the outer wall surface of the buffer pipe 330. Therefore, the first plate body 220 can scrape off the non-gaseous by-products on the inner wall surface of the condensation chamber 111 when the rotating member 210 rotates, and the second plate body can scrape off the non-gaseous by-products on the outer wall surface of the buffer pipe 330 when the rotating member 210 rotates.

[0063] In some embodiments, the process tail gas separation device further includes a storage component 700, which is fixedly connected to the gas outlet 320 through a pipeline, and the storage component 700 is used to collect the separated gaseous by-products.

[0064] See also Figure 2 The rotating member 210 includes a tube body 211 and an end plate 212. The tube body 211 is disposed in the condensation chamber 111. The tube body 211 is provided with a first through hole 2111 penetrating the thickness thereof. The end plate 212 is connected to one end of the tube body 211. The end plate 212 is provided with a second through hole 2121 penetrating the thickness thereof.

[0065] The first plate portion 220 is disposed on the outer wall surface of the tube 211 facing the condensation chamber 111 , so that the first plate portion 220 can scrape off non-gaseous byproducts on the inner wall surface of the condensation chamber 111 when the tube 211 rotates.

[0066] Specifically, the second plate portion 230 is disposed on the inner wall surface of the tube body 211 facing the buffer pipe 330 , so that the second plate portion 230 can scrape off the non-gaseous byproducts on the outer wall surface of the buffer pipe 330 when the tube body 211 rotates.

[0067] See also Figure 2 The first through hole 2111 provided on the tube body 211 is used to allow part of the process exhaust gas flowing from the buffer cavity into the tube body 211 to flow out of the tube body 211 through the first through hole 2111, so as to divert the process exhaust gas after deceleration.

[0068] The second through holes 2121 provided on the end plate 212 are used to allow the non-gaseous by-products scraped off by the second plate body 230 to enter the separation chamber 610 of the separation assembly 600 through the second through holes 2121 .

[0069] Specifically, the tube body 211 is provided with 16 first through holes 2111 evenly distributed along the circumferential direction, and the end plate 212 is provided with 6 second through holes 2121 evenly distributed along the circumferential direction.

[0070] Figure 6 It is a structural schematic diagram of the connection between the end plate 212 and the transmission shaft 510 in the process tail gas separation device of the semiconductor process equipment according to the embodiment of the present invention. Figure 7 yes Figure 6 Side view of the . Figure 6 and Figure 7 , the transmission shaft 510 is connected to the end plate 212 of the scraper assembly 200. The first plate body 220 and the second plate body 230 each include a plurality of scrapers 231. The orthographic projection of the scraper 231 on the rotating member 210 is arranged at a preset angle with the first plane. The preset angle is any angle not equal to 0°, and the first plane is perpendicular to the rotation axis of the rotating member 210 so as to be able to scrape non-gaseous byproducts. For example, the preset angle can be 30°, or 40°, or 50°, or 60°, or 120°.

[0071] In some embodiments, the plurality of scrapers 231 are divided into a plurality of scraper groups 231 according to different circumferential positions, and the preset angles of the plurality of scrapers 231 in the plurality of scraper groups 231 are the same. The plurality of scrapers 231 in any two adjacent scraper groups 231 in the first plate body 220 are staggered along the rotation axis of the rotating member, so that the non-gaseous by-products on the inner wall of the condensation chamber 111 can be avoided from being missed when the first plate body 220 rotates. The plurality of scrapers 231 in any two adjacent scraper groups 231 in the second plate body 230 are staggered along the rotation axis of the rotating member, so that the non-gaseous by-products on the outer wall of the buffer pipe 330 can be avoided from being missed when the second plate body 230 rotates.

[0072] Figure 8 yes Figure 6 See also Figure 8 The first plate body 220 includes two groups of scrapers 231, and the two groups of scrapers 231 are located on the same diameter of the tube body 211. Similarly, the second plate body 230 also includes two groups of scrapers 231, and the two groups of scrapers 231 are also located on the same diameter of the tube body 211.

[0073] See also Figure 4 The buffer assembly 300 further includes a mounting plate 340 , a mounting column 350 and a plurality of buffer plates 360 .

[0074] The mounting plate 340 is connected to the inner wall of the buffer pipe 330. The mounting plate 340 is arranged opposite to the air inlet 310, and the mounting plate 340 is provided with a through hole therethrough for the process tail gas to enter the buffer pipe 330 through the through hole.

[0075] The mounting post 350 is connected to the mounting plate 340 and is disposed in the buffer cavity along the axial direction of the buffer cavity.

[0076] A plurality of buffer plates 360 are connected to the mounting column 350. The plurality of buffer plates 360 are spaced apart in the axial direction of the buffer chamber, each buffer plate 360 ​​is tilted downward, and two adjacent buffer plates 360 are staggered in the axial direction of the buffer chamber, so as to change the flow direction of the process exhaust gas in the buffer chamber to reduce the flow rate of the process exhaust gas in the buffer chamber.

[0077] In some embodiments, the mounting plate 340 is fixedly connected to the inner wall of the buffer pipe 330. A plurality of buffer plates 360 are threadedly connected to the mounting posts 350 for easy adjustment.

[0078] Preferably, the mounting column 350 is installed concentrically with the buffer pipe 330 .

[0079] Fig. 9 It is a structural schematic diagram of the connection between the scraper assembly 200, the transmission assembly 500 and the drive motor 400 of the process tail gas separation device of the semiconductor process equipment according to the embodiment of the present invention. Fig.10 yes Fig. 9 The enlarged view of the part D in the figure. Fig. 9 and Fig.10 The process tail gas separation device further includes a driving motor 400. The output shaft of the driving motor 400 is connected to the rotating member 210 through a transmission assembly 500. The transmission assembly 500 includes a transmission shaft 510, a pair of bearings 520, an outer sleeve 530 and an inner sleeve 540.

[0080] The two ends of the transmission shaft 510 are respectively connected to the output shaft of the drive motor 400 and the rotating member 210, and the transmission shaft 510 is used to transmit the rotational force output by the drive motor 400 to the rotating member 210, so as to rotate the rotating member 210. A pair of bearings 520 are arranged at intervals on the transmission shaft 510 to provide steel support force to the transmission shaft 510, reduce the friction force when the transmission shaft 510 rotates, and also to ensure that the transmission shaft 510, the output shaft of the drive motor 400, the buffer channel and the cooling cavity are coaxial.

[0081] The outer sleeve 530 forms an accommodation space for accommodating a pair of bearings 520 to ensure that the pair of bearings 520 are reliably positioned in the axial direction of the transmission shaft 510. The inner sleeve 540 is disposed in the accommodation space and is located between the pair of bearings 520. The inner sleeve 540 is concentrically disposed with the outer sleeve 530 and is used to support the upper bearing of the pair of bearings 520 for easy installation.

[0082] Specifically, the outer sleeve 530 is fixedly connected to the cooling cavity.

[0083] Figure 5 yes Figure 2 The enlarged view of the part C in the figure. Figure 5 The process tail gas separation device further includes a separation assembly 600. The separation assembly 600 is connected to the condensation assembly, and the separation assembly 600 includes a separation chamber 610. The non-gaseous by-products fall into the separation chamber 610 under the influence of their own gravity. The separation chamber 610 is also used to collect the non-gaseous by-products scraped by the scraper assembly 200 and discharge the non-gaseous by-products.

[0084] The present embodiment adopts modular design for the process tail gas separation device, which includes a condensation component, a scraper component 200, a buffer component 300, a transmission component 500, a separation component 600 and a storage component 700. The modular design facilitates the installation and removal of each component module and improves the convenience of maintenance.

[0085] In some embodiments, the condensation assembly further includes a first condensation flange 121 and a second condensation flange 122 arranged in a vertical direction. The buffer assembly 300 includes a buffer flange 370 provided with an air inlet 310 and an air outlet 320. The separation assembly 600 includes a separation flange 630. Among them, the buffer flange 370 is located above the first condensation flange 121, and the buffer flange 370 is connected to the first condensation flange 121 by fasteners, and a sealing ring can also be provided at the connection to improve the sealing. The second condensation flange 122 is located above the separation flange 630, and the second condensation flange 122 is connected to the separation flange 630 by fasteners, and a sealing ring can also be provided at the connection to improve the sealing. Among them, the exhaust port of the process chamber 20 is welded to the buffer flange 370 of the process separation device. The above arrangement can ensure the sealing of the process tail gas separation device and avoid leakage of the process tail gas.

[0086] See also Figure 5 The separation assembly 600 further includes a cooling component. The cooling component is sleeved around the separation chamber 610 and is used to cool the collected non-gaseous byproducts and the transmission assembly 500. The transmission assembly 500 is disposed in the cooling component.

[0087] In some embodiments, the cooling component may include a cooling outer cavity 621, which is sleeved around the separation cavity 610, and the cooling outer cavity 621 is provided with a second liquid inlet 622 and a second liquid outlet 623. The second liquid inlet 622 may be connected to a cooling medium source (not shown in the figure, and may be the same or different from the cooling medium source of the first liquid inlet 1122), and is used to guide the cooling medium provided by the cooling medium source to the space between the cooling outer cavity 621 and the separation cavity 610, and the second liquid outlet 623 is used to allow the cooling medium in the cooling outer cavity 621 to flow out, so that the cooling medium can circulate in the space between the cooling outer cavity 621 and the separation cavity 610, and the cooling medium exchanges heat with the separation cavity 610 in the cooling outer cavity 621, so as to cool the separation cavity 610 and a pair of bearings 520 of the transmission assembly 500, and further reduce the temperature of the non-gaseous byproducts and the bearings 520 in the separation cavity 610.

[0088] Preferably, see Figure 5The second liquid inlet 622 can be located below the second liquid outlet 623, so that the cooling medium flows into the cooling outer cavity 621 from the bottom and flows out from the top of the cooling outer cavity 621. In this way, the cooling medium can flow through the entire space between the cooling outer cavity 621 and the separation cavity 610 to fill the entire space between the cooling outer cavity 621 and the separation cavity 610, thereby improving the cooling effect of the cooling component.

[0089] In some embodiments, the separation chamber 610 is connected to a drain pipe, which runs through the cooling outer chamber 621 in a downwardly inclined manner and is fixedly connected to the bottom of the separation chamber 610 to drain non-gaseous by-products. An electric drain valve can be provided on the drain pipe to achieve automatic control, and can be opened in the idle state of the process tail gas separation device to discharge non-gaseous by-products, thereby reducing labor costs and shortening maintenance cycles.

[0090] It can be understood that the process tail gas entering the process tail gas separation device through the air inlet 310 first enters the buffer chamber, and then flows to the condensation chamber after the high-temperature flow rate is reduced, so as to ensure the high fluidity of the process tail gas in the buffer chamber. The process tail gas contacts the inner wall surface of the condensation chamber 111 and the outer wall surface of the buffer pipe 330 in the condensation chamber and then condenses, accelerating the separation of non-gaseous by-products and gaseous by-products, which are separated under the influence of the scraper assembly 200 and gravity, and finally the gaseous by-products leave the process tail gas separation device through the air outlet 320, and the non-gaseous by-products further enter the separation chamber 610, and then leave the process tail gas separation device through the discharge pipe.

[0091] See also Figure 2 The semiconductor process equipment is used for performing a polyimide curing process. The semiconductor process equipment comprises a process chamber 20 and a process tail gas separation device of any of the above embodiments. The exhaust port of the process chamber 20 is connected to the process tail gas separation device.

[0092] The process chamber 20 is a place for providing a certain process temperature and introducing a certain proportion of process gas to perform a polyimide curing process on the workpiece.

[0093] In some embodiments, the process chamber 20 can be connected to the condensation chamber 111 of the process tail gas separation device through an exhaust pipe to provide the process tail gas after the polyimide curing process to the condensation chamber 2. It can be understood that the process tail gas at least includes high-temperature nitrogen, water vapor and oil mist-like γ-butyrolactone byproduct.

[0094] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0095] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0096] In the description of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0097] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0098] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A process tail gas separation device for semiconductor process equipment, used for separating non-gaseous byproducts in the process tail gas discharged from the process chamber of the semiconductor process equipment, characterized in that: The process tail gas separation device comprises: A condensation component, comprising a condenser, wherein the condenser is used to condense the process tail gas so as to separate the non-gaseous by-products after condensing the process tail gas; wherein the condenser comprises a condensation cavity for accommodating the process tail gas; A scraper assembly is disposed in the condensation chamber, and is used to scrape off the non-gaseous by-products separated from the inner wall of the condensation chamber after the process tail gas is condensed.

2. The process tail gas separation device according to claim 1, characterized in that: The scraper assembly comprises: A rotating member is rotatably disposed in the condensing chamber; The first plate body is connected to the rotating member, and is used to scrape off the non-gaseous by-products on the inner wall surface of the condensation chamber when the rotating member rotates.

3. The process tail gas separation device according to claim 2, characterized in that: The rotating member comprises: A tube body is disposed in the condensation cavity, and the tube body is provided with a first through hole penetrating the thickness of the tube body; an end plate connected to one end of the tube body, the end plate being provided with a second through hole penetrating through the thickness thereof; Wherein, the first plate portion is arranged on the outer wall surface of the tube body facing the condensation cavity.

4. The process tail gas separation device according to claim 2, characterized in that: Also includes: a buffer component connected to the condensation component, the buffer component being provided with an air inlet and an air outlet, the air inlet being used to introduce the process tail gas, the air outlet being used to discharge the gaseous by-products separated after the process tail gas is condensed, and the buffer component being used to reduce the flow rate of the process tail gas introduced from the air inlet; Wherein, the buffer assembly includes a buffer pipe arranged in the condensation cavity, a buffer cavity communicating with the air inlet is formed inside the buffer pipe, and a condensation cavity communicating with the air outlet is formed outside the buffer pipe; The condenser is used to condense the process tail gas in the condensation chamber so that the process tail gas is separated into non-gaseous by-products on the inner wall surface of the condensation chamber and the outer wall surface of the buffer pipe; The scraper assembly is arranged in the condensation chamber, and the scraper assembly is also used to scrape off the non-gaseous by-products separated on the outer wall surface of the buffer pipe after the process tail gas is condensed.

5. The process tail gas separation device according to claim 4, characterized in that: The scraper assembly also includes: The second plate body is connected to the rotating member, and the second plate body is used to scrape off the non-gaseous by-products on the outer wall surface of the buffer pipe when the rotating member rotates.

6. The process tail gas separation device according to claim 5, characterized in that: The first plate body and the second plate body both include a plurality of scrapers, and the orthographic projections of the scrapers on the rotating member form a preset angle with the first plane; the preset angle is any angle not equal to 0°, and the first plane is perpendicular to the rotation axis of the rotating member.

7. The process tail gas separation device according to claim 6, characterized in that: The plurality of scrapers are divided into a plurality of scraper groups according to different circumferential positions, and the plurality of scrapers in the plurality of scraper groups have the same preset angle; The plurality of scrapers of any two adjacent scraper groups in the first plate body are staggeredly arranged along the rotation axis of the rotating member; The plurality of scrapers of any two adjacent scraper groups of the second plate body are staggeredly arranged along the rotation axis of the rotating member.

8. The process tail gas separation device according to claim 4, characterized in that: The buffer assembly also includes: A mounting plate connected to the inner wall of the buffer pipe, the mounting plate being arranged opposite to the air inlet, and the mounting plate being provided with a through hole penetrating therethrough so that the process tail gas can pass through the through hole and enter the buffer pipe; A mounting column connected to the mounting plate and disposed in the buffer cavity along the axial direction of the buffer cavity; A plurality of buffer plates are connected to the mounting column, and the plurality of buffer plates are spaced apart and distributed in the axial direction of the buffer cavity. Each of the buffer plates is tilted downward, and two adjacent buffer plates are staggered in the axial direction of the buffer cavity, so as to change the flow direction of the process exhaust gas in the buffer cavity to reduce the flow velocity of the process exhaust gas in the buffer cavity.

9. The process tail gas separation device according to claim 2, characterized in that: It also includes a drive motor whose output shaft is connected to the rotating member through a transmission assembly, and the transmission assembly includes: A transmission shaft, two ends of which are respectively connected to the output shaft and the rotating member, and the transmission shaft is used to transmit the rotational force output by the driving motor to the rotating member to rotate the rotating member; a pair of bearings, spaced apart and arranged on the transmission shaft; An outer sleeve, forming a receiving space for receiving the two bearings; The inner sleeve is arranged in the accommodating space and located between the two bearings.

10. The process tail gas separation device according to claim 9, characterized in that: Also includes: A separation component is connected to the condensation component, and the separation component includes a separation chamber, and the separation chamber is used to collect the non-gaseous by-products scraped by the scraper assembly and discharge the non-gaseous by-products.

11. The process tail gas separation device according to claim 10, characterized in that: The separation assembly further comprises: A cooling component is sleeved around the separation chamber and is used to cool the collected non-gaseous by-products and the transmission component, and the transmission component is arranged in the cooling component.

12. A semiconductor process equipment, characterized in that: A process tail gas separation device for semiconductor process equipment according to any one of claims 1 to 11, comprising a process chamber and the device being connected to an exhaust port of the process chamber.

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