Automatic edge connecting and silver brushing equipment for ceramic wafers and process of automatic edge connecting and silver brushing equipment

Abstract

The invention belongs to the technical field of silver brushing and edge connecting on the side face of a piezoelectric ceramic circular wafer, and particularly relates to automatic edge connecting and silver brushing equipment for a ceramic wafer and a process of the automatic edge connecting and silver brushing equipment. Comprising a first linear module arranged at the bottom of a rack, and a jacking module operating vertically is arranged at the driving end of the first linear module; the linear module II is arranged at the top of the rack, a tool module which runs transversely is arranged at the driving end of the linear module II, and the tool module is used for placing and bearing a ceramic wafer; and the silver dipping module is installed at the top of the rack through a portal frame, and the driving end of the silver dipping module is provided with a silver dipping part which operates vertically and is used for conducting edge-connected silver brushing on the ceramic wafer. The problems that manual brushing is needed, and the brushing quality reliability is difficult to guarantee are solved.

Description

Technical Field

[0001] The invention belongs to the technical field of silver-brushing the side edges of piezoelectric ceramic circular wafers, and in particular relates to an automatic silver-brushing device for joining the edges of ceramic wafers and a process thereof. Background Art

[0002] The side of the piezoelectric ceramic circular chip is brushed with silver to connect the edges. Due to the diversity of product shapes, thicknesses and sizes. In the existing chip edge brushing process, only a single chip can be brushed with silver by hand with a brush, and it needs to be dried and brushed with silver many times, resulting in low production efficiency and inconsistent brushing quality. It cannot meet the technical and mass production requirements. In order to solve the bottleneck of the production silver brushing edge connection process and meet the actual use needs of our company, the ceramic chip edge brushing process is studied, and combined with the development of automated equipment to achieve multiple chips at the same time to improve work efficiency and meet production needs. Summary of the invention

[0003] The purpose of the present invention is to overcome the above-mentioned shortcomings of the prior art. The present invention provides a ceramic wafer automatic edge silver brushing device and process to solve the above-mentioned problems that manual brushing is required and the reliability of brushing quality is difficult to ensure.

[0004] In order to solve the above technical problems, the present invention provides a ceramic wafer automatic edge silver brushing device, comprising:

[0005] A linear module 1 is arranged at the bottom of the frame, and a vertically running lifting module is arranged at the driving end of the linear module 1;

[0006] A second linear module is arranged on the top of the frame, and a tooling module running horizontally is arranged at the driving end of the second linear module, and the tooling module is used to place and support ceramic wafers;

[0007] The silver dipping module is installed on the top of the frame through a gantry, and a vertically running silver dipping part is provided at the driving end of the silver dipping module for brushing silver on the edges of the ceramic wafers.

[0008] Preferably, the linear module 1 and the linear module 2 both adopt a linear motor module structure.

[0009] Preferably, the linear module 2 also includes two symmetrically arranged linear slide rails for providing guidance for the operation of the tooling module.

[0010] Preferably, the jacking module comprises: a jacking cylinder, a jacking plate and a jacking rod; the driving end of the jacking cylinder is provided with the jacking plate, and 9 jacking rods are linearly provided on the top of the jacking plate.

[0011] Preferably, the tooling module comprises: a positioning frame and a tooling plate; the tooling plate is assembled and locked on the positioning frame, and the tooling plate is provided with circular holes in a matrix of 9 rows and 9 columns for arranging ceramic wafers.

[0012] Preferably, the positioning frame includes: a rectangular frame, a U-shaped groove, positioning hole one, a clamping slot and positioning hole two; the U-shaped groove is provided on the top of the rectangular frame for pushing and placing the tooling plate from one side, the positioning hole one is symmetrically provided around the top of the groove cavity of the U-shaped groove, the clamping slots are symmetrically provided on both sides of the top of the rectangular frame, each of the clamping slots is provided with two positioning holes two, and the positioning hole one and the positioning hole two are used to lock and fix the tooling plate.

[0013] Preferably, the tooling plate includes: a rectangular plate, a circular hole and a protruding ear; the rectangular plate is provided with the circular holes in a matrix of 9 rows and 9 columns, the two sides of the rectangular plate also include the protruding ears symmetrically arranged, the four corners of the rectangular plate are symmetrically provided with the tooling hole 1 for correspondingly cooperating and locking with the positioning hole 1, and the protruding ear is provided with the tooling hole 2 for correspondingly cooperating and locking with the positioning hole 2.

[0014] Preferably, the silver dipping module comprises: a descending cylinder, a silver dipping trough plate and a sponge block; the driving end of the descending cylinder is provided with the silver dipping trough plate for storing silver paste; the 9 output hole ends of the silver dipping trough plate are provided with the sponge blocks, and the sponge blocks correspond to the edge connection areas of 9 ceramic chips.

[0015] The present invention also provides a ceramic wafer automatic edge-joining silver brushing process, using the ceramic wafer automatic edge-joining silver brushing device as described above, comprising the following steps:

[0016] Step 1: Arrange the ceramic wafer and place it on the tooling plate, with the positive electrode facing upward, and rotate to adjust the position of the wafer edge;

[0017] Step 2: Place the tooling plate carrying the ceramic wafer into the positioning frame and lock it, press the start button, and the equipment will operate according to the preset program;

[0018] Step 3: Control the linear module 2 to run until the 9 ceramic wafers arranged on one side run under the 9 sponge blocks;

[0019] Step 4: Control the linear module to run until the 9 ejector pins run under the 9 ceramic wafers;

[0020] Step 5: Synchronously control the lifting cylinder to move upward and the descending cylinder to move downward, and lift the nine ceramic wafers upward through the nine ejector rods until they are pressed against the bottom of the nine sponge blocks moving downward, thereby completing the silver brushing process for the edges of the nine ceramic wafers in a row;

[0021] Step 6: Repeat steps 3 to 5 above to complete the edge silvering process of 81 ceramic wafers in 9 rows and 9 columns. The equipment is reset, the buzzer sounds to remind and the machine stops.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The improved automatic edge-joining and silver-brushing equipment of the present invention can replace the silver-brushing tooling plate and the positioning frame switch according to the size of the product. The silver-brushing tooling plate is customized for use with the size of the ceramic wafers. A single tooling plate can arrange 81 wafers in 9 rows and 9 columns, totaling 81 wafers. Moreover, the equipment of the present invention has programmable and automatic positioning, which can meet the requirements of silver-brushing the side edges of round piezoelectric ceramics, thereby automatically realizing the simultaneous operation of multiple wafers, improving work efficiency and brushing quality, and meeting production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 The present invention provides a structural diagram of a ceramic wafer automatic edge-joining silver brushing device.

[0025] Figure 2 It is a schematic diagram of the tooling plate provided by the present invention.

[0026] Figure 3 It is a schematic diagram of a positioning frame provided by the present invention.

[0027] Figure 4 It is a schematic diagram of the jacking plate provided by the present invention.

[0028] Figure 5 It is a schematic diagram of the silver dipping part provided by the present invention.

[0029] In the figure: 1-frame, 2-linear module 1, 3-lifting module, 31-lifting plate, 32-lifting rod, 4-linear module 2, 5-tooling module, 51-positioning frame, 511-rectangular frame, 512-U-shaped groove, 513-positioning hole 1, 514-card slot, 515-positioning hole 2, 52-tooling plate, 521-rectangular plate, 522-round hole, 523-raised ear, 6-silver dipping module, 7-gantry, 8-silver dipping part, 81-silver dipping slot plate, 82-sponge block. DETAILED DESCRIPTION

[0030] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the accompanying drawings are in very simplified form and in non-precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0031] like Figures 1 to 5 As shown, an embodiment of the present invention provides a ceramic wafer automatic edge silver brushing device, comprising:

[0032] The linear module 1 2 is arranged at the bottom of the frame 1, and the driving end of the linear module 1 2 is provided with a vertically running jacking module 3;

[0033] The second linear module 4 is arranged on the top of the frame 1. The driving end of the second linear module 4 is provided with a tooling module 5 running horizontally. The tooling module 5 is used to place and support ceramic wafers.

[0034] The silver dipping module 6 is installed on the top of the frame 1 through the gantry 7, and the driving end of the silver dipping module 6 is provided with a vertically running silver dipping part 8 for brushing the edges of the ceramic wafers with silver.

[0035] The linear module 1 2 and the linear module 2 4 both adopt a linear motor module structure.

[0036] The linear module 2 4 also includes two symmetrically arranged linear guide rails for providing guidance for the operation of the tooling module 5 .

[0037] The jacking module 3 comprises: a jacking cylinder, a jacking plate 31 and a jacking rod 32 ; the driving end of the jacking cylinder is provided with a jacking plate 31 , and the top of the jacking plate 31 is linearly provided with 9 jacking rods 32 .

[0038] The tooling module 5 comprises: a positioning frame 51 and a tooling plate 52 ; the tooling plate 52 is assembled and locked on the positioning frame 51 , and the tooling plate 52 is provided with circular holes 522 in a matrix of 9 rows and 9 columns for arranging ceramic wafers.

[0039] The positioning frame 51 includes: a rectangular frame 511, a U-shaped groove 512, a positioning hole 1 513, a clamping groove 514 and a positioning hole 2 515; a U-shaped groove 512 is provided on the top of the rectangular frame 511 for pushing and placing the tooling plate 52 from one side, and positioning holes 1 513 are symmetrically provided around the top of the groove cavity of the U-shaped groove 512, and clamping grooves 514 are symmetrically provided on both sides of the top of the rectangular frame 511, and each clamping groove 514 is provided with two positioning holes 2 515, and the positioning hole 1 513 and the positioning hole 2 515 are used to lock and fix the tooling plate 52.

[0040] The tooling plate 52 includes: a rectangular plate 521, a circular hole 522 and a protruding ear 523; the rectangular plate 521 is provided with a matrix of 9 rows and 9 columns of circular holes 522, and the two sides of the rectangular plate 521 also include symmetrically arranged protruding ears 523, and the four corners of the rectangular plate 521 are symmetrically provided with tooling hole 1, which is used to correspond to and lock with the positioning hole 1 513, and the protruding ear 523 is provided with tooling hole 2, which is used to correspond to and lock with the positioning hole 2 515.

[0041] The silver dipping module 6 includes: a descending cylinder, a silver dipping slot plate 81 and a sponge block 82; the driving end of the descending cylinder is provided with a silver dipping slot plate 81 for storing silver paste; the 9 output hole ends of the silver dipping slot plate 81 are provided with sponge blocks 82, and the sponge blocks 82 correspond to the edge connection areas of 9 ceramic chips.

[0042] The embodiment of the present invention further provides a ceramic wafer automatic edge bonding silver brushing process, using the ceramic wafer automatic edge bonding silver brushing device as described above, including the following steps:

[0043] Step 1: Arrange the ceramic wafer and place it on the tooling plate 52, with the positive electrode facing upward, and rotate to adjust the position of the wafer edge;

[0044] Step 2: Place the tooling plate 52 carrying the ceramic wafer into the positioning frame 51 and lock it, press the start button, and the equipment will operate according to the preset program;

[0045] Step 3: Control the linear module 2 to run until the 9 ceramic wafers arranged on one side run under the 9 sponge blocks 82;

[0046] Step 4: Control the linear module 1 to run until the nine ejector pins 32 run under the nine ceramic wafers;

[0047] Step 5: Synchronously control the lifting cylinder to move upward and the descending cylinder to move downward, and lift the nine ceramic wafers upward through the nine ejector rods 32 until they are pressed and abutted against the bottoms of the nine sponge blocks 82 moving downward, thereby completing the silver brushing process for the edges of the nine ceramic wafers in a row;

[0048] Step 6: Repeat steps 3 to 5 above to complete the edge silvering process of 81 ceramic wafers in 9 rows and 9 columns. The equipment is reset, the buzzer sounds to remind and the machine stops.

[0049] The embodiment of the present invention also includes the following instructions for use:

[0050] First of all, the sizes of various ceramic chips correspond to different sizes of edge connection requirements, so it is necessary to cut the sponge block 82 of the same size to correspond to the size of the chip edge connection. Secondly, the silver paste needs to be mixed with a diluent to maintain a certain fluidity, and the volatilization of the diluent will harden the silver-dipping sponge. Therefore, the silver paste used for the edge connection of various products is different. Test and replace the corresponding density sponge in advance to ensure that the silver paste has a certain fluidity and permeability during continuous silver dipping work, and prevent the silver-dipping sponge from drying and hardening, thereby affecting the appearance and performance requirements of silver dipping. Arrange the ceramic chips and put them into the tooling plate 52, with the positive side facing up, and rotate to adjust the chip edge connection position. Put it into the positioning frame 51 together with the tooling plate 52, press the start button, and the equipment will operate according to the preset program. When the equipment is reset, the buzzer will sound. Complete the ceramic chip edge connection process and repeat the above operation. The operator should pay attention to the timely replenishment of the silver paste in the silver dipping tank during the operation of the equipment, and replace the silver-dipping sponge in time when it dries and hardens.

[0051] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A ceramic wafer automatic edge silver brushing device, characterized in that: include: A linear module (2) is arranged at the bottom of the frame (1), and a vertically running lifting module (3) is provided at the driving end of the linear module (2); A second linear module (4) is arranged on the top of the frame (1), and a tooling module (5) running horizontally is arranged at the driving end of the second linear module (4), and the tooling module (5) is used for placing and supporting ceramic wafers; The silver dipping module (6) is installed on the top of the frame (1) through a gantry (7), and a vertically running silver dipping part (8) is provided at the driving end of the silver dipping module (6) for brushing silver on the edges of ceramic wafers.

2. The automatic edge-joining silver brushing device for ceramic wafers as claimed in claim 1, characterized in that: The linear module one (2) and the linear module two (4) both adopt a linear motor module structure.

3. The automatic edge-joining silver brushing device for ceramic wafers as claimed in claim 2, characterized in that: The second linear module (4) also includes two symmetrically arranged linear slide rails for providing guidance for the operation of the tooling module (5).

4. The automatic edge-joining silver brushing device for ceramic wafers as claimed in claim 1, characterized in that: The jacking module (3) comprises: a jacking cylinder, a jacking plate (31) and a jacking rod (32); the driving end of the jacking cylinder is provided with the jacking plate (31), and nine jacking rods (32) are linearly provided on the top of the jacking plate (31).

5. The automatic edge-joining silver brushing device for ceramic wafers as claimed in claim 1, characterized in that: The tooling module (5) comprises: a positioning frame (51) and a tooling plate (52); the tooling plate (52) is assembled and locked on the positioning frame (51), and the tooling plate (52) is provided with circular holes (522) in a matrix of 9 rows and 9 columns for arranging ceramic wafers.

6. The automatic edge-joining silver brushing device for ceramic wafers as claimed in claim 5, characterized in that: The positioning frame (51) comprises: a rectangular frame (511), a U-shaped groove (512), a first positioning hole (513), a clamping groove (514) and a second positioning hole (515); the top of the rectangular frame (511) is provided with the U-shaped groove (512) for pushing and placing the tooling plate (52) from one side; the first positioning holes (513) are symmetrically provided around the top of the groove cavity of the U-shaped groove (512); the clamping grooves (514) are symmetrically provided on both sides of the top of the rectangular frame (511); each clamping groove (514) is provided with two second positioning holes (515); the first positioning hole (513) and the second positioning hole (515) are used for locking and fixing the tooling plate (52).

7. The automatic edge-joining silver brushing device for ceramic wafers as claimed in claim 5, characterized in that: The tooling plate (52) comprises: a rectangular plate (521), a circular hole (522) and a protruding ear (523); the rectangular plate (521) is provided with the circular holes (522) in a matrix of 9 rows and 9 columns; the two sides of the rectangular plate (521) also include the protruding ears (523) symmetrically arranged; the four corners of the rectangular plate (521) are symmetrically provided with the tooling hole 1 for correspondingly cooperating and locking with the positioning hole 1 (513); the protruding ear (523) is provided with the tooling hole 2 for correspondingly cooperating and locking with the positioning hole 2 (515).

8. The automatic edge-bonding silver brushing device for ceramic wafers as claimed in claim 1, characterized in that: The silver dipping module (6) comprises: a descending cylinder, a silver dipping slot plate (81) and a sponge block (82); the driving end of the descending cylinder is provided with the silver dipping slot plate (81) for storing silver paste; the nine output hole ends of the silver dipping slot plate (81) are provided with the sponge blocks (82), and the sponge blocks (82) correspond to the edge connection areas of nine ceramic wafers.

9. A ceramic wafer automatic edge-joining silver brushing process, using a ceramic wafer automatic edge-joining silver brushing device as claimed in any one of claims 1 to 8, characterized in that: The steps include: Step 1: Arrange the ceramic wafers and place them on the tooling plate (52), with the positive electrode facing upward, and rotate to adjust the position of the wafer edge; Step 2: Place the tooling plate (52) carrying the ceramic wafer into the positioning frame (51) and lock it, press the start button, and the equipment will operate according to the preset program; Step 3: Control the linear module 2 to run until the 9 ceramic wafers arranged on one side run under the 9 sponge blocks (82); Step 4: Control the linear module 1 to run until the nine ejector pins (32) run under the nine ceramic wafers; Step 5: synchronously controlling the lifting cylinder to move upward and the descending cylinder to move downward, and lifting the nine ceramic wafers upward through the nine push rods (32) until they are pressed and abutted against the bottoms of the nine sponge blocks (82) moving downward, thereby completing the silver brushing process for the edges of the nine ceramic wafers in a row; Step 6: Repeat steps 3 to 5 above to complete the edge silvering process of 81 ceramic wafers in 9 rows and 9 columns. The equipment is reset, the buzzer sounds to remind and the machine stops.

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