Manufacturing method of heat dissipation device suitable for high-power electronic component and electronic equipment

Abstract

The invention discloses a manufacturing method of a heat dissipation device suitable for a high-power electronic component and electronic equipment. The manufacturing method comprises the steps that 1, an upper cover plate, a bottom cavity, a heat dissipation A single piece and a heat dissipation B single piece are prepared; the top face of the upper cover plate is covered with a first solder layer, the upper cover plate is provided with an installation through groove, and the periphery of the top end of the installation through groove is chamfered to form an annular flow guide face. The heat dissipation single sheet A and / or the heat dissipation single sheet B are / is covered with a second solder layer, and the heat dissipation single sheet A and the heat dissipation single sheet B extend downwards at the end parts of the corresponding flow channel wall surfaces to form connecting parts; 2, the heat dissipation A single piece and the heat dissipation B single piece are mutually stacked and inserted into the mounting through groove, the connecting parts are stacked to form a flow channel connector part, and an annular gap is formed between the peripheral face of the flow channel connector part and the annular flow guide face; and 3, vacuum welding is conducted, the first welding flux layer flows into the annular gap along the annular flow guide face after being molten, then sealing welding is formed between the peripheral face of the runner connector part and the annular flow guide face, and the leakage-proof effect is good.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation devices, and in particular to a method for manufacturing a heat dissipation device suitable for high-power electronic components and an electronic device. Background Art

[0002] Heat dissipation devices are widely used in electronic devices. For example, in communication equipment, heat dissipation devices are often used to dissipate heat from chips, power supplies, etc. The heat dissipation device usually includes a heat dissipation substrate and a plurality of heat sinks arranged on the heat dissipation substrate. The heating element is generally attached to the heat dissipation substrate, and the heating element and the heat sink are distributed on two opposite sides of the heat dissipation substrate. There are preset cavities and flow channels in the heat dissipation substrate and the heat sink, and the working fluid medium (also referred to as refrigerant) flows inside. Since the heat sink is welded to the heat dissipation substrate, the problem of leakage of the working fluid medium is prone to occur at the weld. For this reason, technical personnel in the industry are committed to how to improve the problem of leakage of the working fluid medium.

[0003] For example: CN 117222184 A discloses a phase change heat dissipation device and communication equipment, including: a substrate having a first hollow cavity; a plurality of tooth plate arrays, each having a second hollow cavity, the second hollow cavities of the tooth plates being connected through a connection portion located on the outside of the tooth plates; the tooth plates include a first tooth plate and a second tooth plate located at both ends of the tooth plate array in a first extension direction, the bottom of the first tooth plate has a first inlet connected to its second hollow cavity, the bottom of the second tooth plate has a first outlet connected to its second hollow cavity, each tooth plate array is fixedly connected to the substrate through the first inlet and the first outlet, the substrate absorbs the heat of the heating element so that the working fluid undergoes a phase change cycle in the first hollow cavity and the second hollow cavity, so as to dissipate the heat through the tooth plates. Each group of tooth plate array flow channels and the cavity of the substrate have only two docking interfaces to reduce the number of solder joints, reduce leakage, and thereby improve the reliability of the heat dissipation device. However, the butt joint needs to be connected with a connecting pipe, which is then welded to the substrate. The welding operation is troublesome, especially when adding the connecting pipe, which is prone to cold welding and still has the risk of leakage of the working fluid medium.

[0004] Another example: CN 117222183 A discloses a phase-change heat sink and communication equipment, the phase-change heat sink includes a substrate unit and a fin unit, the substrate unit includes a first surface and a second surface, the first surface is used to face the heating element, and the second surface is used to install the fin unit; the fin unit includes a mounting portion abutting the second surface and a heat dissipation portion extending from the mounting portion, the mounting portion is provided with a second opening connected to the refrigerant channel of the heat dissipation portion, and the second surface is provided with a first opening connected to the hollow inner cavity inside the substrate unit; when the mounting portion abuts the second surface, the first opening and the second opening are fixed by welding. It is fixed by welding the two openings of the mounting portion and the substrate unit, the welding area is small, the weld is short, the welding difficulty is reduced, the process yield is improved, and it is not easy to cause refrigerant leakage. In actual welding, it is equivalent to welding and fixing the surfaces of the two openings. Limited by the flatness of the surface, it is difficult to achieve an ideal fit between the two surfaces, resulting in the hidden danger of leakage of the working fluid medium at the welding point in the future, even though the welding and fixing are performed.

[0005] Therefore, it is necessary to study a new technical solution to solve the above problems. Summary of the invention

[0006] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a method for manufacturing a heat dissipation device suitable for high-power electronic components and an electronic device, which assembles an upper cover plate, a bottom cavity, a heat dissipation A single chip, and a heat dissipation B single chip, and then fixes them by welding at one time, thereby achieving good welding effect, and effectively solving the problem of leakage of working fluid medium at the welding points in traditional technology.

[0007] To achieve the above purpose, the present invention adopts the following technical solutions: A method for manufacturing a heat dissipation device suitable for high-power electronic components, comprising: Step 1, prepare an upper cover plate, a bottom cavity, a heat sink A single chip, and a heat sink B single chip; wherein, the top surface of the upper cover plate is covered with a first solder layer, the top surface of the upper cover plate is provided with a mounting groove, the top peripheral edge of the mounting groove is chamfered to form an annular guide surface around the mounting groove; the superimposed side surfaces of the heat sink A single chip and / or the heat sink B single chip are covered with a second solder layer, the superimposed side surfaces of the heat sink A single chip and the heat sink B single chip are provided with matching corresponding flow channel walls, and the heat sink A single chip and the heat sink B single chip extend downward at the ends of the corresponding flow channel walls to form a connecting portion; Step 2, stacking the heat sink A single piece and the heat sink B single piece on each other and inserting them into the installation groove, wherein the connecting parts are stacked to form a flow channel interface part, an annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular guide surface, and the bottom cavity is stacked on the bottom of the upper cover plate; Step 3, performing vacuum welding, the first solder layer on the top surface of the upper cover melts and flows into the annular gap along the annular guide surface, thereby forming a sealed weld between the outer peripheral surface of the flow channel interface and the annular guide surface.

[0008] As a preferred solution, the solder layer is a brazing material layer, and in step 3, a brazing operation is performed.

[0009] As a preferred solution, in step 1, a first capillary filler is also prepared; the first capillary filler is arranged to fill the wall surface of the flow channel; and / or: In the step 1, a second capillary filler is also prepared; the second capillary filler is arranged to fill the bottom cavity.

[0010] As a preferred solution, in step 2, after the heat sink A single chip and the heat sink B single chip are stacked on each other and inserted into the mounting groove, the flow channel interface portion extends out of the bottom of the upper cover plate, and the protruding portion of the flow channel interface portion is pressed and fixed to fix the heat sink A single chip and the heat sink B single chip on the upper cover plate.

[0011] As a preferred embodiment, the connecting portion includes a flow channel enclosing wall and a widened fitting wall respectively connected to both ends of the flow channel enclosing wall, the widened fitting wall includes a first wall portion close to the flow channel enclosing wall and a second wall portion away from the flow channel enclosing wall, the lower end surface of the second wall portion is higher than the lower end surface of the first wall portion, so that the lower end surface of the second wall portion serves as abutment surface, and after the heat sink A single piece and the heat sink B single piece are stacked on each other and inserted into the mounting groove, the abutment surface abuts against the top surface of the upper cover plate.

[0012] As a preferred solution, two groups of riveted protrusions are respectively provided at the two end positions of the bottom of the upper cover plate corresponding to the installation grooves, each group of riveted protrusions includes two riveted protrusions arranged with a left and right interval, and the first wall portion extends downward between the two riveted protrusions, and the two first wall portions of the heat sink A single piece and the heat sink B single piece are pressed and fixed by pressing the riveted protrusions.

[0013] As a preferred solution, after the heat sink A single piece and the heat sink B single piece are fixed to the upper cover plate, the bottom cavity is stacked on the bottom of the upper cover plate, and a third solder layer is provided on the overlapping sides of the bottom cavity and the upper cover plate. In step 3, the bottom cavity and the upper cover plate are welded and fixed.

[0014] As a preferred solution, in step 1, a connecting plate is also prepared, and a plurality of positioning grooves are provided on the connecting plate. The top of the heat sink A single piece and / or the heat sink B single piece has a positioning portion extending upward, and the positioning portion extends into the positioning groove.

[0015] As a preferred solution, the heat sink A sheet is provided with a folding piece which is bent and extended toward the heat sink B sheet, and after the heat sink A sheet and the heat sink B sheet are overlapped, the folding piece extends out of the side of the heat sink B sheet away from the heat sink A sheet, and the extended end of the folding piece contacts and positions with the adjacent heat sink A sheet.

[0016] An electronic device, comprising: Heating elements and heat sinks; The heat dissipation device is manufactured by using a manufacturing method for a heat dissipation device suitable for high-power electronic components as described in any of the above items.

[0017] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical scheme that the main feature of the present invention is that the upper cover plate, the bottom cavity, the heat dissipation A single chip and the heat dissipation B single chip are assembled and fixed by welding at one time, and the first solder layer on the top surface of the upper cover is melted and flows into the annular gap along the annular guide surface, thereby forming a sealed weld between the outer peripheral surface of the flow channel interface and the annular guide surface. The welding effect is good, and the problem of leakage of the working fluid medium at the welding point in the traditional technology is effectively solved. In addition, the manufacturing process is simple and the manufacturing yield is good.

[0018] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a step diagram of a method for manufacturing a heat dissipation device suitable for high-power electronic components according to an embodiment of the present invention; Figure 2 is an exploded view of a heat sink A chip and a heat sink B chip according to an embodiment of the present invention; Figure 3 is an assembly diagram of the heat dissipation A single chip and the heat dissipation B single chip after being superimposed according to an embodiment of the present invention; Figure 4 It is a partial structural diagram of a group of heat sinks arranged on a heat dissipation base according to an embodiment of the present invention; Figure 5A It is a partial structural diagram of the flow channel interface part and the upper cover plate after being assembled according to the embodiment of the present invention (before welding); Figure 5B It is a partial structural diagram of the flow channel interface part and the upper cover plate after being assembled (after welding) according to an embodiment of the present invention; Figure 6 It is a partial three-dimensional diagram of the heat dissipation A single chip and the heat dissipation B single chip after being arranged on the upper cover plate according to the embodiment of the present invention (illustrating the bottom structure of the upper cover plate); Figure 7 It is an exploded view showing a first capillary filler disposed between a heat sink A single chip and a heat sink B single chip according to another embodiment of the present invention; Figure 8 yes Figure 7 A cross-sectional view of the heat sink of the illustrated embodiment; Fig. 9 is an exploded view of another embodiment of the present invention in which a second capillary filler is disposed in the bottom cavity; Fig.10 is an assembly diagram of another embodiment of the present invention in which a second capillary filler is disposed in the bottom cavity; Fig.11 A three-dimensional diagram showing a heat dissipation device with a connecting plate disposed on top of a heat sink; Fig.12 yes Fig.11 An exploded view of the heat sink shown; Fig.13 An exploded view of another heat dissipation device with folded tabs on the heat sink is shown. DETAILED DESCRIPTION

[0020] Please refer to Figures 1 to 13 As shown, it shows the specific structure of various embodiments of the present invention.

[0021] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "up", "down", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0022] A method for manufacturing a heat dissipation device suitable for high-power electronic components, comprising: Step 1, prepare an upper cover plate 1, a bottom cavity 2, a plurality of heat dissipation A single chips 3, and a plurality of heat dissipation B single chips 4; Among them, the upper cover plate 1 is a composite material with a solder layer, such as an aluminum-based brazing composite material, and therefore, a first solder layer C1 is covered on its top surface. The top surface of the upper cover plate 1 is provided with a plurality of mounting grooves 101 arranged at left and right intervals, which means that the mounting grooves 101 pass through the top and bottom surfaces of the upper cover plate 1, and the top peripheral edge of the mounting groove 101 is chamfered to form an annular guide surface 102 surrounding the mounting groove 101.

[0023] The bottom cavity 2 is provided with a cavity 201, and a plurality of convex columns 202 are arranged in the cavity 201 at intervals to separate the cavity 201 into a plurality of zigzag flow channels. The top periphery of the bottom cavity 2 is provided with mounting columns 203 protruding upward. Correspondingly, the periphery of the upper cover 1 is provided with mounting holes 103, and the mounting columns 203 extend into the corresponding mounting holes 103 to form mutual assembly positioning of the upper cover 1 and the bottom cavity 2. Furthermore, mounting columns 203 can also be provided in the cavity 201, and mounting holes 103 are correspondingly provided on the upper cover 1 to improve the assembly stability of the upper cover 1 and the bottom cavity 2. In the subsequent welding process, the mounting column 203 is welded and fixed to the mounting hole 103. Specifically, the outer circumference of the mounting column 203 and the inner circumference of the mounting hole 103, as well as the top surface of the upper cover plate 1, and even the top edge of the bottom cavity 2 and the bottom surface of the upper cover plate 1, the outer circumference of the mounting column 203, and the inner circumference of the mounting hole 103 are all welded and sealed as an integral whole.

[0024] The heat sink A single chip 3 and / or the heat sink B single chip 4 are also composite layer materials with solder layers, such as aluminum-based brazing composite layer materials. Therefore, a second solder layer is covered on the overlapping sides thereof. Preferably, the overlapping sides of the heat sink A single chip 3 and the heat sink B single chip 4 are both covered with a second solder layer. Compared with the case where only the overlapping sides of the heat sink A single chip 3 or the heat sink B single chip 4 are covered with a second solder layer, welding is easier and the welding effect is better. Moreover, the heat sink A single chip 3 and the heat sink B single chip 4 can adopt the same structural design (for example, a symmetrical structure), and the heat sink single chips can be designed and produced in a unified manner, which is conducive to mass production, better control of production quality and reduction of production costs. The overlapping side surfaces of the heat sink A single chip 3 and the heat sink B single chip 4 are provided with (for example, recessed) matching flow channel walls 341. In this embodiment, the overlapping side surfaces of the heat sink A single chip 3 and the heat sink B single chip 4 are both recessed with flow channel walls 341, or only one overlapping side surface may be recessed with flow channel wall 341, while the other overlapping side surface is a flat surface, which is equivalent to the flow channel wall 341 on the other overlapping side surface being a flat surface, and the heat sink A single chip 3 and the heat sink B single chip 4 extend downward at the ends of the corresponding flow channel walls 341 to form a connecting portion 342; the second solder layer can be on the entire overlapping side surface, or cover the area on the overlapping side surface except the flow channel wall 341, or at least meet the requirement that the heat sink A single chip 3 and the heat sink B single chip 4 can form a closed flow channel 348 after being stacked and welded.

[0025] Step 2, stacking the heat sink A single chip 3 and the heat sink B single chip 4 on each other and inserting them into the installation groove 101, wherein the connecting portion 342 of the heat sink A single chip 3 and the heat sink B single chip 4 is stacked to form a flow channel interface portion 347, the flow channel interface portion 347 forms a closed ring, and an annular gap is formed between the outer peripheral surface of the flow channel interface portion 347 and the annular guide surface 102, such as Figure 5A As shown, it is equivalent to an annular gap surrounding the outer periphery of the outer circumference of the flow channel interface portion 347, the overlapping side surfaces of the heat sink A single chip 3 and the heat sink B single chip 4 are in contact, and one heat sink A single chip 3 and one heat sink B single chip 4 are overlapped to form a group of heat sinks 200, and their flow channel walls 341 match to form a flow channel, and their connecting portions 342 also match accordingly, and two groups of connecting portions 342 are formed at the lower end of a group of heat sinks 200, corresponding to the fluid inlet and fluid outlet of the group of heat sinks 200; and, the bottom cavity 2 is stacked on the bottom of the upper cover plate 1; the upper cover plate 1 and the bottom cavity 2 constitute a heat dissipation base 100.

[0026] Step 3, placing the assembled product into a vacuum welding furnace for welding operation, usually performing a vacuum welding operation, the first solder layer C1 on the top surface of the upper cover plate 1 melts and flows into the annular gap along the annular guide surface 102, forming a full circle of solder D in the annular gap, and then forming a sealed weld between the outer peripheral surface of the flow channel interface part 347 and the annular guide surface 102, solving the problem of leakage of the working fluid medium, such as Figure 5B shown.

[0027] Furthermore, the solder layer is a brazing material layer. In step 3, a brazing operation is performed, and the assembled product is placed in a vacuum brazing furnace for brazing, and a finished product is brazed in one step.

[0028] like Figure 7 and Figure 8 As shown, in the step 1, a first capillary filler 6 is also prepared; the first capillary filler 6 is filled and arranged corresponding to the flow channel wall surface 341, so that the flow channel is filled with the first capillary filler 6.

[0029] like Fig. 9 and Fig.10 As shown, in step 1, a second capillary filler 7, such as a capillary mesh, is also prepared; the second capillary filler 7 is filled and arranged corresponding to the bottom cavity 2, so that the cavity formed by the stacking of the upper cover plate 1 and the bottom cavity 2 is filled with the capillary mesh.

[0030] like Figure 1 , Figure 2 , Figure 4 and Figure 6As shown, in the step 2, after the heat sink A single chip 3 and the heat sink B single chip 4 are stacked on each other and inserted into the mounting groove 101, the flow channel interface portion 347 extends downward from the bottom of the upper cover plate 1, and the protruding portion of the flow channel interface portion 347 is pressed and fixed to fix the heat sink A single chip 3 and the heat sink B single chip 4 on the upper cover plate 1. The connecting portion 342 includes a flow channel enclosure wall 343 and a widened fitting wall 344 respectively connected to the front and rear ends of the flow channel enclosure wall 343, the widened fitting wall 344 includes a first wall portion 345 close to the flow channel enclosure wall 343 and a second wall portion 346 away from the flow channel enclosure wall 343, the lower end surface of the second wall portion 346 is higher than the lower end surface of the first wall portion 345, so that the lower end surface of the second wall portion 346 serves as abutment surface, after the heat sink A single chip 3 and the heat sink B single chip 4 are stacked on each other and inserted into the installation groove 101, the abutment surface abuts against the top surface of the upper cover plate 1, on the one hand, it plays an assembly positioning role and limits the insertion depth, on the other hand, in the subsequent welding process, the first solder layer C1 on the top surface of the upper cover plate 1 is welded and fixed with the abutment surface, thereby strengthening the stability of the combination of the entire group of heat sinks 200 and the upper cover plate 1. Two groups of riveted protrusions are respectively arranged at the front and rear ends of the bottom of the upper cover plate 1 corresponding to the mounting groove 101, and each group of riveted protrusions includes two riveted protrusions 104 arranged at a left and right interval. The first wall portion 345 extends downward between the two riveted protrusions 104, and the two first wall portions 345 of the heat sink A single chip 3 and the heat sink B single chip 4 are pressed and fixed by pressing the two riveted protrusions 104. In actual operation, the two riveted protrusions 104 can be pressed in both directions, or one riveted protrusion 104 can be squeezed toward the other riveted protrusion 104, so as to press the two first wall portions 345 of the heat sink A single chip 3 and the heat sink B single chip 4 between the two riveted protrusions 104, so as to fix the group of heat sinks 200.

[0031] Preferably, after the heat sink A single chip 3 and the heat sink B single chip 4 are fixed to the upper cover plate 1, the bottom cavity 2 is stacked on the bottom of the upper cover plate 1, and a third solder layer is provided on the overlapping sides of the bottom cavity 2 and the upper cover plate 1. In step 3, the bottom cavity 2 and the upper cover plate 1 are welded and fixed. The third solder layer is usually a solder layer, so that in step 3, the upper cover plate 1, the bottom cavity 2, a plurality of heat sink A single chips 3, and a plurality of heat sink B single chips 4 are brazed at one time to achieve welding and fixing of all accessories.

[0032] like Fig.11 and Fig.12As shown, in the step 1, a connecting plate 5 is also prepared, and a plurality of positioning grooves 501 are arranged on the connecting plate 5. The top of the heat sink A single chip 3 and / or the heat sink B single chip 4 has a positioning portion 349 extending upward, and the positioning portion 349 extends into the positioning groove 501. The upper cover plate 1 and the bottom cavity 2 constitute a heat sink base 100. Usually, the connecting plate 5 and the heat sink base 100 are arranged in parallel up and down, which is equivalent to positioning the upper and lower ends of several groups of heat sinks 200.

[0033] like Fig.13 As shown, the heat sink A single sheet 3 is provided with a folding piece 301 which is bent and extended toward the heat sink B single sheet 4, and after the heat sink A single sheet 3 and the heat sink B single sheet 4 are overlapped, the folding piece 301 extends out of the side of the heat sink B single sheet 4 away from the heat sink A single sheet 3, and the extended end of the folding piece 301 contacts and is positioned with the adjacent heat sink A single sheet 3.

[0034] The folding pieces 301 can be arranged at the edge positions such as the front side, the back side and the top of the heat dissipation A single piece 3, so that the heat dissipation A single piece 3 can be clamped and positioned on the periphery of the heat dissipation B single piece 4, which is beneficial to the stacking stability of the two. The heat dissipation single piece after stacking has good integrity. The folding pieces 301 can also be set in the middle area of ​​the plate of the heat dissipation A single piece 3 except the edge (the middle area referred to here is not the completely centered position in an absolute sense, but actually refers to the internal area surrounded by the edge). These folding pieces 301 are bent from the hollow parts 302 on the heat dissipation A piece, and correspondingly, hollow parts opposite to them and with the same or basically the same shape are also formed on the heat dissipation B single piece 4. Of course, the heat dissipation B single piece 4 usually does not need to retain the folding pieces 301 cut and bent at the hollow parts like the heat dissipation A piece. The hollow parts of the heat dissipation B single piece 4 are mainly used for the folding pieces 301 of the heat dissipation A piece of the heat dissipation 200 in its own group to pass through, so as to play a avoidance role. In actual production, if the heat sink B single sheet 4 also retains the folded pieces 301 cut and bent at the hollowed-out part like the heat sink A sheet, it can also be realized that the folded pieces 301 of the heat sink A sheet and the heat sink B sheet can be stacked. Since one or more folded pieces 301 can be set in the middle area, these folded pieces 301 play a good role in the mutual positioning of adjacent groups of heat sinks 200 in the left and right directions, strengthen the structural correlation between each group of heat sinks 200, and each group of heat sinks 200 is not easy to shake, so that the overall structural strength is better, and the folded pieces 301 can also play a role in strengthening the heat conduction between each group of heat sinks 200. Fig.13The multiple folding pieces 301 in the middle area are arranged in multiple rows along the upper and lower spacings, and each row includes multiple folding pieces 301 arranged along the front and rear spacings. The arrangement of the multiple folding pieces 301 makes the contact positioning force points between each group of heat sinks 200 dispersed evenly. After welding, the contact positioning points will be welded and fixed, so that all heat sinks 200 form a heat sink module with good strength and not easy to deform. Fig.11 and Fig.12 The heat dissipation device shown saves the step of assembling the top connecting plate, is more convenient to assemble, and has better structural stability.

[0035] In addition, regarding the heat sink A single chip 3 and the heat sink B single chip 4, preferably, they are both composite layer materials with solder layers, which can be single-sided with solder layers or double-sided with solder layers. For the case of single-sided with solder layers, the solder layer is located on the overlapping side. In this way, it is ensured that within the same group of heat sinks, the folding piece 301 of the heat sink A single chip 3 and the heat sink B single chip 4 form contact positioning during assembly and are welded and fixed during welding.

[0036] Regarding the upper cover plate 1, it is at least a composite layer material with a solder layer, that is, the top surface is covered with a solder layer, or it can be a solder layer on both sides, and the bottom surface is also covered with a solder layer, that is, the aforementioned third solder layer is set on the bottom surface, and the third solder layer can also be set on the top surface of the bottom cavity 2.

[0037] Preferably, the same solder layer is provided in the same heat dissipation device to ensure the vacuum welding effect. The heat dissipation A single chip 3, the heat dissipation B single chip 4, the upper cover plate 1, the bottom cavity 2 and the connecting plate are all metal substrates, such as aluminum substrates, and some are made of aluminum alloy, copper, copper alloy, copper-aluminum composite materials, etc.

[0038] Also, an electronic device, such as a communication device, is provided, which includes a heating element and a heat dissipation device. Usually, the bottom of the bottom cavity 2 of the heat dissipation device is attached to the heating element, and the heat dissipation device is made using a manufacturing method for a heat dissipation device suitable for high-power electronic components as described above.

[0039] The design focus of the present invention is that it is mainly achieved by assembling the upper cover plate 1, the bottom cavity 2, the heat dissipation A single chip 3, and the heat dissipation B single chip 4, and then welding them once, and utilizing the first solder layer C1 on the top surface of the upper cover to melt and flow into the annular gap along the annular guide surface 102, thereby forming a sealed weld between the outer peripheral surface of the flow channel interface part 347 and the annular guide surface 102, and the welding effect is good, which effectively solves the problem of the working fluid medium leakage at the welding point in the traditional technology, and its manufacturing process is simple and the manufacturing yield is good.

[0040] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A method for manufacturing a heat dissipation device suitable for high-power electronic components, characterized in that: Included are: Step 1, prepare an upper cover plate, a bottom cavity, a heat sink A single chip, and a heat sink B single chip; wherein, the top surface of the upper cover plate is covered with a first solder layer, the top surface of the upper cover plate is provided with a mounting groove, the top peripheral edge of the mounting groove is chamfered to form an annular guide surface around the mounting groove; the superimposed side surfaces of the heat sink A single chip and / or the heat sink B single chip are covered with a second solder layer, the superimposed side surfaces of the heat sink A single chip and the heat sink B single chip are provided with matching corresponding flow channel walls, and the heat sink A single chip and the heat sink B single chip extend downward at the ends of the corresponding flow channel walls to form a connecting portion; Step 2, stacking the heat sink A single piece and the heat sink B single piece on each other and inserting them into the installation groove, wherein the connecting parts are stacked to form a flow channel interface part, an annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular guide surface, and the bottom cavity is stacked on the bottom of the upper cover plate; Step 3, performing vacuum welding, the first solder layer on the top surface of the upper cover melts and flows into the annular gap along the annular guide surface, thereby forming a sealed weld between the outer peripheral surface of the flow channel interface and the annular guide surface.

2. The method for manufacturing a heat dissipation device suitable for high-power electronic components according to claim 1, characterized in that: The solder layer is a brazing material layer, and in step 3, a brazing operation is performed.

3. The method for manufacturing a heat dissipation device suitable for high-power electronic components according to claim 1, characterized in that: In the step 1, a first capillary filler is also prepared; the first capillary filler is arranged to fill the wall of the flow channel; and / or: In the step 1, a second capillary filler is also prepared; the second capillary filler is arranged to fill the bottom cavity.

4. The method for manufacturing a heat dissipation device suitable for high-power electronic components according to claim 1, characterized in that: In the step 2, after the heat sink A single chip and the heat sink B single chip are stacked on each other and inserted into the mounting groove, the flow channel interface portion extends out of the bottom of the upper cover plate, and the extended portion of the flow channel interface portion is pressed and fixed to fix the heat sink A single chip and the heat sink B single chip on the upper cover plate.

5. The method for manufacturing a heat dissipation device suitable for high-power electronic components according to claim 4, characterized in that: The connecting portion includes a flow channel enclosing wall and a widened fitting wall respectively connected to both ends of the flow channel enclosing wall, the widened fitting wall includes a first wall portion close to the flow channel enclosing wall and a second wall portion away from the flow channel enclosing wall, the lower end surface of the second wall portion is higher than the lower end surface of the first wall portion, so that the lower end surface of the second wall portion serves as abutment surface, and after the heat sink A single chip and the heat sink B single chip are stacked on each other and inserted into the installation groove, the abutment surface abuts against the top surface of the upper cover plate.

6. The method for manufacturing a heat dissipation device suitable for high-power electronic components according to claim 5, characterized in that: Two groups of riveted protrusions are respectively arranged at the two end positions of the mounting groove corresponding to the bottom of the upper cover plate, each group of riveted protrusions includes two riveted protrusions arranged at a left and right interval, and the first wall body portion extends downward between the two riveted protrusions, and the two first wall body portions of the heat sink A single chip and the heat sink B single chip are pressed and fixed by pressing the riveted protrusions.

7. The method for manufacturing a heat dissipation device suitable for high-power electronic components according to claim 4, characterized in that: After the heat sink A single chip and the heat sink B single chip are fixed to the upper cover plate, the bottom cavity is stacked on the bottom of the upper cover plate, and a third solder layer is provided on the overlapping sides of the bottom cavity and the upper cover plate. In step 3, the bottom cavity and the upper cover plate are welded and fixed.

8. The method for manufacturing a heat dissipation device suitable for high-power electronic components according to claim 1, characterized in that: In step 1, a connecting plate is also prepared, on which a plurality of positioning grooves are provided. The top of the heat sink A sheet and / or the heat sink B sheet has a positioning portion extending upward, and the positioning portion extends into the positioning groove.

9. The method for manufacturing a heat dissipation device suitable for high-power electronic components according to claim 1, characterized in that: The heat sink A single sheet is provided with a folding piece that bends and extends toward the heat sink B single sheet, and after the heat sink A single sheet and the heat sink B single sheet are overlapped, the folding piece extends out of the side of the heat sink B single sheet away from the heat sink A single sheet, and the extended end of the folding piece contacts and positions with the adjacent heat sink A single sheet.

10. An electronic device, characterized in that: Included are: Heating elements and heat sinks; The heat dissipation device is manufactured by the manufacturing method of a heat dissipation device suitable for high-power electronic components according to any one of claims 1 to 9.

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