Grinding device with dust removal function for wire drawing die machining

Abstract

The invention discloses a grinding device with a dust removal function for wire drawing die machining, and relates to the technical field of grinding. Comprising a shell A, a lifting motor is vertically installed on the shell A, a stirring rod A and a stirring rod B are installed below the lifting motor, a discharging plate A is installed on one side of the stirring rod A, a filtering membrane is installed below the discharging plate A, a rotating disc is installed below the filtering membrane, and a conductor A is installed on the upper layer of the rotating disc; a sliding block A is installed on one side of the conductor A, polishing liquid is arranged on one side of the sliding block A, a heat absorption plate is arranged on the inner layer of the rotating disc, polishing particles are arranged on the lower layer of the rotating disc, the polishing particles on the lower layer of the rotating disc polish a wire drawing die, and a stirring rod A collects chippings generated by polishing. The conductor A cuts magnetic induction lines to generate induction current, the sliding block A is controlled to move by introducing current into the annular spring, and the sliding block A pressurizes the polishing liquid.

Description

Technical Field

[0001] The invention relates to the technical field of grinding, in particular to a grinding device with a dust removal function for wire drawing die processing. Background Art

[0002] When repairing the wire drawing die, it is necessary to first repair the wire drawing die with welding, and then grind the welding position. Generally, a grinding wheel is used to grind the wire drawing die. This treatment method saves time and effort, but it also has certain problems. During the grinding process, dust is scattered, which has an adverse effect on the staff. In addition, the grinding wheel is used for a long time and is not cooled well, resulting in a reduction in the life of the grinding wheel. In addition, the position where the wire drawing die has just been welded is not heated to remove the stress of the wire drawing die. There is an existing wire drawing die finishing device (patent number: CN104551890B), which uses silk thread to Grinding the wire drawing die can solve the problem of low grinding efficiency of the wire drawing die. However, in actual use, iron powder is easily splashed during the grinding of the wire and the wire drawing die, and the wire is not properly cooled during the rotation and grinding process, resulting in a decrease in the life of the wire and a decrease in the grinding effect. Therefore, the current devices used for repairing and grinding wire drawing dies have the following main problems: (1) There is no dust removal function, which brings certain troubles to the staff; (2) The grinding wheel is not properly cooled, which reduces the grinding effect and grinding life of the grinding wheel; (3) The welding position is not subjected to stress relief treatment. Summary of the invention

[0003] The object of the present invention is to provide a grinding device with a dust removal function for wire drawing die processing, so as to solve the problems raised in the above-mentioned background technology.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: comprising a shell A, on which a lifting motor is vertically installed, a stirring rod A and a stirring rod B are installed below the lifting motor, a discharge plate A is installed on one side of the stirring rod A, a filter membrane is installed below the discharge plate A, a rotating disk is installed below the filter membrane, a conductor A is installed on the upper layer of the rotating disk, a sliding block A is installed on one side of the conductor A, a polishing liquid is arranged on one side of the sliding block A, a heat absorbing plate is arranged in the middle layer of the rotating disk, and polishing particles are arranged in the lower layer of the rotating disk. The polishing particles in the lower layer of the rotating disk are used to polish the wire drawing die, the stirring rod A collects debris generated by polishing, the conductor A is used to control the movement of the sliding block A, and the sliding block A pressurizes the polishing liquid.

[0005] A shell B is installed between the lifting motor and the stirring rod A, and a driving motor is vertically installed in the shell B. The rotating disk is installed on the output shaft of the driving motor. A semicircular first chamber is provided on one side of the upper layer of the rotating disk. The polishing liquid is provided in the first chamber. An annular shaft is installed in the first chamber. The sliding block A is slidably installed on one end of the annular shaft. An annular spring is sleeved on the annular shaft. One end of the annular spring is installed on the sliding block A, and the other end of the annular spring is installed on the rotating disk. Both ends of the annular spring are connected to the control system through wires, and both ends of the conductor A are respectively connected to the two ends of the annular spring through wires. Magnets with different magnetic properties are symmetrically installed on the outside of the rotating disk, and the magnets are installed on the shell B.

[0006] The stirring rod A consists of a stirring blade and a stirring shaft. The stirring blade is spiral-shaped and is installed on the stirring shaft. Both ends of the stirring shaft are installed on the shell B through bearings. A discharge plate B is attached to the blade of the stirring blade, and the discharge plate B is connected to the negative pole of the power supply. A first metal wire is provided on the edge of the blade of the stirring blade. Both ends of the first metal wire are connected to the conductor A through a wire, and both ends of the conductor A are connected to the control system through a wire.

[0007] Press the start button on the control panel to start the device. Place the wire drawing die to be polished on the housing A at the lower side of the rotating disk. The lifting motor starts to work. Since the lifting motor and the housing B are threadedly connected, the lifting motor drives the housing B and its internal components to move downward. When the polishing particles on the lower layer of the rotating disk contact the surface of the wire drawing die, the lifting motor stops working. After that, the driving motor drives the active gear and the rotating disk to rotate.

[0008] The grinding particles on the lower layer of the rotating disk grind the surface of the wire drawing die, and the rotating disk synchronously drives the conductor A to rotate. The conductor A rotates in the magnetic field of the magnet. Since the magnets are symmetrically arranged and have different magnetic properties, the conductor A moves in the range of 0° to 90° to cut the magnetic flux lines.

[0009] When conductor A cuts magnetic flux lines within the range of 0° to 90°, an induced current will be generated in conductor A. The induced current is transmitted to the annular spring through the wire, and the annular spring is energized. A magnetic field of mutual attraction is generated between each turn of the annular spring, and the annular spring is compressed under the action of the magnetic field of mutual attraction generated by each turn. Since one end of the annular spring is mounted on the rotating disk and the other end of the annular spring is mounted on the sliding block A, the annular spring pulls the sliding block A to slide a certain distance on the annular shaft, and the sliding block A gradually reduces the volume of the first chamber, and the pressure of the polishing liquid in the first chamber increases. At this time, the control valve connecting the first chamber and the second chamber is opened, and the pressurized polishing liquid enters the second chamber through the first chamber, so that the pressure in the second chamber increases, and the first one-way valve on the first injection port is opened, and the polishing liquid is sprayed from the first injection port on the polishing position of the wire drawing die, which can cool the polishing particles while increasing the polishing effect and reducing dust dispersion. The polishing liquid can be a coolant, a lubricating liquid, a polishing liquid, etc., which can be flexibly set as needed;

[0010] When conductor A cuts the magnetic flux lines within the range of 90° to 180°, the movement direction of conductor A tends to be parallel to the direction of the magnetic flux lines, so the number of magnetic flux lines cut by conductor A is small, that is, the induced current generated by conductor A tends to be zero, which is equivalent to the annular spring being powered off and released. The annular spring pushes the sliding block A in the opposite direction for a certain distance, thereby increasing the volume of the first chamber. At this time, the control valve between the first chamber and the second chamber is connected to the outside air, and the outside air enters the first chamber through the control valve, so that the sliding block A can pressurize the first chamber next time.

[0011] It should be noted that the induced current generated by conductor A cutting the magnetic wire in the range of 180° to 270° is equal in magnitude and opposite in direction to the induced current generated by cutting the magnetic flux lines in the range of 180° to 270°, and almost no induced current is generated in the range of 90° to 180° and in the range of 270° to 360°. Therefore, the order of the induced current in conductor A is positive current, no current, negative current and no current.

[0012] While conductor A cuts the magnetic flux lines within the range of 0° to 90°, the current in conductor A is transmitted to two semiconductors of different materials, so that the forward current flows through the two semiconductors and the heat absorbing plate. Under the Peltier effect, the heat absorbing plate generates heat and is heated. The heat absorbing plate transfers the heat to the grinding particles at the lower layer of the rotating disk. The surface of the wire drawing die is heated by the grinding particles to remove the stress generated during welding and reduce the possibility of cracking and deformation of the wire drawing die in the later stage.

[0013] Afterwards, conductor A generates a negative current in the range of 180° to 270°. The negative current flows through the two semiconductors and the heat absorbing plate. Under the Peltier effect, the direction of the current passing through the heat absorbing plate changes, and the heat absorbing plate changes from the original heat release state to the heat absorption state. The heat absorbing plate absorbs the heat of the grinding particles, so that the temperature of the grinding particles in the lower layer of the rotating disk is reduced during the grinding process, thereby increasing the service life of the grinding particles.

[0014] At the same time, the debris and dust generated by grinding are transported upward through the stirring rod A, the active gear drives the driven gear to rotate, the driven gear drives the stirring shaft to rotate, the stirring shaft drives the stirring blade to rotate, and the stirring blade gradually transports the debris and dust upward in an oblique manner. When the dust and debris contact the discharge plate B on the stirring blade, the discharge plate B is connected to the negative pole of the power supply, and the discharge plate B makes the debris negatively charged. Since the diameter of the outer side of the stirring blade gradually increases from bottom to top, the centrifugal force received by the debris on the discharge plate B gradually increases. At the same time, the conductor A transmits the induced current to the first metal wire through the wire, and the first metal wire is energized. Since the first metal wire It is arranged along the outer edge of the stirring blade, so the first metal wire is spiral, and the number of spiral turns of the stirring blade gradually becomes denser from bottom to top, so the number of turns of the first metal wire gradually becomes denser from bottom to top, therefore, the magnetic field generated between each turn of the first metal wire gradually increases from bottom to top, and the magnetic fields generated between each turn of the first metal wire attract each other. In summary, the debris is driven by the stirring blade to be thrown obliquely upward, and the centrifugal force of the debris moving upward gradually increases, and the magnetic field of the first metal wire attracts the debris to move upward, so the debris will move upward quickly under the joint action of centrifugal force and magnetic field attraction, so as to achieve the purpose of rapid dust removal.

[0015] When the stirring blades transport the debris to the top, the stirring blades throw the debris diagonally upward on both sides. The debris thrown to the left by the stirring blades will be repelled by the negative electric field generated by the discharge plate A, causing the debris on the left to move to the right under the action of the repulsive force and be attracted by the positive electric field of the stirring rod B. Since there are two sets of left and right stirring blades, the debris will gather on the lower side of the stirring rod B, and the gathered debris can be taken out through the first material taking port.

[0016] A driven gear is installed on the upper side of the stirring shaft, a driving gear is meshed on the outer side of the driven gear, and the driving gear is installed on the output shaft of the driving motor. The outer diameter of the stirring blade gradually increases from bottom to top, and the number of spiral turns of the stirring blade gradually becomes denser from bottom to top.

[0017] A second chamber is arranged in the middle layer of the rotating disk, and the second chamber is connected with the first chamber through a pipeline and a control valve. The heat absorbing plate is arranged at the lower side of the second chamber. The heat absorbing plate is arranged in multiple groups, and semiconductors of two different materials are arranged on the heat absorbing plate. The semiconductors of the two different materials are both connected to conductor A.

[0018] A first jet port is disposed on the lower side of the rotating disk. A plurality of first jet ports are evenly disposed on the rotating disk. A first one-way valve is installed in each of the first jet ports. The grinding particles are disposed between two adjacent first jet ports.

[0019] The discharge plate A is connected to the negative pole of the power supply. The housing B is provided with a first material taking port, which is communicated with the lower side of the stirring rod B.

[0020] An insulating sleeve is arranged outside the annular spring, and the stirring rod B is connected to the positive pole of the power supply.

[0021] A threaded structure is provided at one end of the output shaft of the lifting motor, the housing B is threadedly connected to the output shaft of the lifting motor, guide shafts are installed on both sides of the housing B, and the guide shafts are slidably connected to the housing A.

[0022] A control panel is installed on the shell A, a control system is arranged inside the control panel, a start button, a stop button and an emergency stop button are arranged on the control panel, a support column is arranged on the lower side of the shell A, a first filling port is arranged on the shell B, the first filling port is connected with the first chamber through a pipeline, and an air outlet is opened on the upper side of the shell B.

[0023] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0024] 1. Automatically spray polishing liquid for better polishing effect. The annular spring pulls the sliding block A to slide a certain distance on the annular shaft. The sliding block A gradually reduces the volume of the first chamber, and the polishing liquid pressure in the first chamber increases. At this time, the control valve connecting the first chamber and the second chamber is opened, and the pressurized polishing liquid enters the second chamber through the first chamber. The polishing liquid is sprayed from the first injection port on the polishing position of the wire drawing die, which can cool the polishing particles while increasing the polishing effect and reducing dust dispersion. The polishing liquid can be a coolant, lubricant, polishing liquid, etc., which can be flexibly set as needed, and the pressurized polishing liquid treatment method does not require an external power supply connection, saving energy.

[0025] 2. Rapid dust removal reduces the adverse effects of debris on workers. The discharge plate B makes the debris negatively charged. Since the diameter of the outer side of the stirring blade gradually increases from bottom to top, the centrifugal force received by the debris on the discharge plate B gradually increases. At the same time, the conductor A transmits the induced current to the first metal wire through the wire. The first metal wire is energized. Since the first metal wire is arranged along the outer edge of the stirring blade, the first metal wire is spiral-shaped, and the number of spiral turns of the stirring blade gradually increases from bottom to top. Therefore, the number of turns of the first metal wire gradually increases from bottom to top. Therefore, the magnetic field generated between each turn of the first metal wire gradually increases from bottom to top, and the first metal wire The magnetic fields generated between each turn of the wire attract each other, and the debris is driven by the stirring blade to be thrown diagonally upward, and the centrifugal force of the debris moving upward gradually increases, and the magnetic field of the first metal wire attracts the debris to move upward. Therefore, under the joint action of centrifugal force and magnetic field attraction, the debris will move upward quickly, thereby achieving the purpose of rapid dust removal. Compared with traditional negative pressure adsorption, the above treatment method flexibly uses the airflow and centrifugal force of the stirring blade for dust removal and the attraction of the magnetic field for dust removal. It can be flexibly adopted according to actual occasions. Using both methods at the same time can achieve better dust removal effect.

[0026] 3. The grinding particles are heated and cooled periodically to eliminate welding stress and increase the service life of the grinding particles. The current in conductor A is transmitted to two semiconductors of different materials, so that the positive current flows through the two semiconductors and the heat absorbing plate. Under the Peltier effect, the heat absorbing plate generates heat and is heated. The heat absorbing plate transfers the heat to the grinding particles on the lower layer of the rotating disk, and heats the surface of the wire drawing die through the grinding particles to remove the stress generated during welding and reduce the possibility of cracking and deformation of the wire drawing die in the later stage; the negative current flows through the two semiconductors and the heat absorbing plate. Under the Peltier effect, due to the change in the direction of the current passing through the heat absorbing plate, the heat absorbing plate changes from the original heat release state to the heat absorption state, and the heat absorbing plate absorbs the heat of the grinding particles, so that the temperature of the grinding particles on the lower layer of the rotating disk is reduced during the grinding process, thereby increasing the service life of the grinding particles. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 is a schematic diagram of the internal structure of the housing B;

[0030] Figure 3 yes Figure 2 A schematic diagram of the structure of the full cross-section view at the AA position in the middle;

[0031] Figure 4 This is a bottom view of the rotating disk in 2;

[0032] Figure 5 yes Figure 3 A partial enlarged view of the middle B area;

[0033] Figure 6 It is a schematic diagram of the structure of stirring rod A.

[0034] In the figure: 1. control panel; 11. shell A; 12. support column; 13. guide shaft; 14. wire drawing die; 2. lifting motor; 21. shell B; 22. stirring rod A; 221. stirring blade; 222. stirring shaft; 223. discharge plate B; 224. first metal wire; 23. discharge plate A; 24. filter membrane; 25. drive motor; 26. stirring rod B; 27. driving gear; 28. driven gear; 3. rotating disk; 31. conductor A; 32. sliding block A; 33. polishing liquid; 34. heat absorbing plate; 341. semiconductor; 35. first chamber; 36. annular shaft; 37. annular spring; 38. magnet; 39. second chamber; 391. first injection port. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] See also Figure 1-Figure 6The present invention provides a technical solution: comprising a shell A11, a lifting motor 2 is vertically installed on the shell A11, a stirring rod A22 and a stirring rod B26 are installed below the lifting motor 2, a discharge plate A23 is installed on one side of the stirring rod A22, a filter membrane 24 is installed below the discharge plate A23, a rotating disk 3 is installed below the filter membrane 24, a conductor A31 is installed on the upper layer of the rotating disk 3, a sliding block A32 is installed on one side of the conductor A31, a polishing liquid 33 is arranged on one side of the sliding block A32, a heat absorbing plate 34 is arranged in the middle layer of the rotating disk 3, polishing particles are arranged on the lower layer of the rotating disk 3, the polishing particles on the lower layer of the rotating disk 3 polish the wire drawing die 14, the stirring rod A22 collects the debris generated by the polishing, the conductor A31 is used to control the movement of the sliding block A32, and the sliding block A32 is used to The polishing liquid 33 is pressurized, and a control panel 1 is installed on the shell A11. A control system is arranged inside the control panel 1. A start button, a stop button and an emergency stop button are arranged on the control panel 1. A support column 12 is arranged on the lower side of the shell A11, and a first filling port is arranged on the shell B21. The first filling port is connected with the first chamber 35 through a pipeline. A threaded structure is arranged at one end of the output shaft of the lifting motor 2. The shell B21 is threadedly connected with the output shaft of the lifting motor 2. Guide shafts 13 are installed on both sides of the shell B21. The guide shafts 13 are slidably connected with the shell A11. The stirring rod B26 is connected with the positive pole of the power supply. A first material extraction port is arranged on the shell B21. The first material extraction port is connected with the lower side of the stirring rod B26. The discharge plate A23 is connected with the negative pole of the power supply, and an air outlet is opened on the upper side of the shell B25.

[0037] A housing B21 is installed between the lifting motor 2 and the stirring rod A22, a driving motor 25 is vertically installed in the housing B21, the rotating disk 3 is installed on the output shaft of the driving motor 25, a semicircular first chamber 35 is arranged on one side of the upper layer of the rotating disk 3, the polishing liquid 33 is arranged in the first chamber 35, an annular shaft 36 is installed in the first chamber 35, a sliding block A32 is slidably installed on one end of the annular shaft 36, an annular spring 37 is sleeved on the annular shaft 36, one end of the annular spring 37 is installed on the sliding block A32, and the other end of the annular spring 37 is installed on the rotating disk 3, both ends of the annular spring 37 are connected to the control system through wires, both ends of the conductor A31 are connected to the two ends of the annular spring 37 through wires, and the outer side of the rotating disk 3 Magnets 38 with different magnetic properties are symmetrically installed and installed on the shell B21. An insulating sleeve is provided on the outer side of the annular spring 37. A first injection port 391 is provided on the lower side of the rotating disk 3. A plurality of first injection ports 391 are evenly arranged on the rotating disk 3. A first one-way valve is installed in each first injection port 391. The grinding particles are arranged between two adjacent first injection ports 391. A second chamber 39 is provided in the middle layer of the rotating disk 3. The second chamber 39 is connected to the first chamber 35 through a pipeline and a control valve. A heat absorbing plate 34 is provided on the lower side of the second chamber 39. A plurality of heat absorbing plates 34 are provided. Two semiconductors 341 of different materials are provided on the heat absorbing plate 34. The two semiconductors 341 of different materials are both connected to the conductor A31.

[0038] The stirring rod A22 is composed of a stirring blade 221 and a stirring shaft 222. The stirring blade 221 is spiral-shaped and is installed on the stirring shaft 222. Both ends of the stirring shaft 222 are installed on the housing B21 through bearings. A discharge plate B223 is attached to the blade of the stirring blade 221, and the discharge plate B223 is connected to the negative pole of the power supply. A first metal wire 224 is provided on the blade edge of the stirring blade 221. Both ends of the first metal wire 224 are connected to the conductor A31 through a wire, and both ends of the conductor A31 are connected to the control system through a wire. A driven gear 28 is installed on the upper side of the stirring shaft 222, and a driving gear 27 is meshed on the outer side of the driven gear 28. The driving gear 27 is installed on the output shaft of the driving motor 25. The outer diameter of the stirring blade 221 gradually increases from bottom to top, and the number of spiral turns of the stirring blade 221 gradually becomes denser from bottom to top.

[0039] The working principle of the present invention is as follows: the start button on the control panel 1 is pressed, the device starts, the wire drawing die 14 to be polished is placed on the housing A11 at the lower side of the rotating disk 3, and the lifting motor 2 starts to work. Since the lifting motor 2 and the housing B21 are threadedly connected, the lifting motor 2 drives the housing B21 and its internal components to move downward. When the polishing particles on the lower layer of the rotating disk 3 contact the surface of the wire drawing die 14, the lifting motor 2 stops working, and then the driving motor 25 drives the driving gear 27 and the rotating disk 3 to rotate;

[0040] The grinding particles on the lower layer of the rotating disk 3 grind the surface of the wire drawing die 14, and the rotating disk 3 synchronously drives the conductor A31 to rotate. The conductor A31 rotates in the magnetic field of the magnet 38. Since the magnets 38 are symmetrically arranged and have different magnetic properties, the conductor A31 moves in the range of 0° to 90° to cut the magnetic flux lines.

[0041] When the conductor A31 cuts the magnetic flux lines within the range of 0° to 90°, an induced current will be generated in the conductor A31. The induced current is transmitted to the annular spring 37 through the wire, and the annular spring 37 is energized. A magnetic field of mutual attraction is generated between each turn of the annular spring 37. The annular spring 37 is compressed under the action of the magnetic field of mutual attraction generated by each turn. Since one end of the annular spring 37 is mounted on the rotating disk 3 and the other end of the annular spring 37 is mounted on the sliding block A32, the annular spring 37 pulls the sliding block A32 to slide a certain distance on the annular shaft 36, and the sliding block A32 makes the first chamber The volume of the first chamber 35 gradually decreases, and the pressure of the polishing liquid 33 in the first chamber 35 increases. At this time, the control valve connecting the first chamber 35 and the second chamber 39 is opened, and the pressurized polishing liquid 33 enters the second chamber 39 through the first chamber 35, so that the pressure in the second chamber 39 increases, and the first one-way valve on the first injection port 391 is opened, and the polishing liquid 33 is sprayed from the first injection port 391 on the polishing position of the wire drawing die 14, which can cool the polishing particles while increasing the polishing effect and reducing dust dispersion. The polishing liquid 33 can be a coolant, a lubricant, a polishing liquid, etc., which can be flexibly set as needed;

[0042] When the conductor A31 cuts the magnetic flux lines within the range of 90° to 180°, the movement direction of the conductor A31 tends to be parallel to the direction of the magnetic flux lines, so the number of magnetic flux lines cut by the conductor A31 is small, that is, the induced current generated by the conductor A31 tends to be zero, which is equivalent to the annular spring 37 being powered off and released. The annular spring 37 pushes the sliding block A32 in the opposite direction for a certain distance, so that the volume of the first chamber 35 becomes larger. At this time, the control valve between the first chamber 35 and the second chamber 39 is connected to the outside air, and the outside air enters the first chamber 35 through the control valve, so that the sliding block A32 can pressurize the first chamber 35 next time.

[0043] It should be noted that the induced current generated by the conductor A31 cutting the magnetic wire in the range of 180° to 270° is equal in magnitude and opposite in direction to the induced current generated by cutting the magnetic wire in the range of 180° to 270°, and almost no induced current is generated in the range of 90° to 180° and in the range of 270° to 360°. Therefore, the order of the induced current in the conductor A31 is positive current, no current, negative current and no current.

[0044] While the conductor A31 cuts the magnetic flux lines within the range of 0° to 90°, the current in the conductor A31 is transmitted to the semiconductors 341 of two different materials, so that the forward current flows through the two semiconductors 341 and the heat absorbing plate 34. Under the Peltier effect, the heat absorbing plate 34 generates heat and is heated. The heat absorbing plate 34 transfers the heat to the grinding particles on the lower layer of the rotating disk 3. The surface of the wire drawing die 14 is heated by the grinding particles to remove the stress generated during welding, thereby reducing the possibility of cracking and deformation of the wire drawing die 14 in the later stage.

[0045] Afterwards, the conductor A31 generates a negative current in the range of 180° to 270°, and the negative current flows through the two semiconductors 341 and the heat absorbing plate 34. Under the Peltier effect, since the direction of the current passed into the heat absorbing plate 34 changes, the heat absorbing plate 34 changes from the original heat release state to the heat absorption state. The heat absorbing plate 34 absorbs the heat of the grinding particles, so that the temperature of the grinding particles in the lower layer of the rotating disk 3 is reduced during the grinding process, thereby increasing the service life of the grinding particles.

[0046] At the same time, the debris and dust generated by grinding are transported upward through the stirring rod A22, the driving gear 27 drives the driven gear 28 to rotate, the driven gear 28 drives the stirring shaft 222 to rotate, the stirring shaft 222 drives the stirring blade 221 to rotate, and the stirring blade 221 gradually transports the debris and dust upward in an oblique manner. When the dust and debris contact the discharge plate B223 on the stirring blade 221, the discharge plate B223 is connected to the negative pole of the power supply, and the discharge plate B223 makes the debris negatively charged. Since the diameter of the outer side of the stirring blade 221 gradually increases from bottom to top, the centrifugal force received by the debris on the discharge plate B223 gradually increases. At the same time, the conductor A31 transmits the induced current to the first metal wire 224 through the wire, and the first metal wire 224 is When power is turned on, since the first metal wire 224 is arranged along the outer edge of the stirring blade 221, the first metal wire 224 is spiral-shaped, and the number of spiral turns of the stirring blade 221 gradually becomes denser from bottom to top, so the number of turns of the first metal wire 224 gradually becomes denser from bottom to top, and therefore, the magnetic field generated between each turn of the first metal wire 224 gradually increases from bottom to top, and the magnetic fields generated between each turn of the first metal wire 224 attract each other. In summary, the debris is driven by the stirring blade 221 to be thrown obliquely upward, and the centrifugal force of the debris moving upward gradually increases, and the magnetic field of the first metal wire 224 attracts the debris to move upward, so the debris will move upward quickly under the joint action of the centrifugal force and the attraction of the magnetic field, so as to achieve the purpose of rapid dust removal.

[0047] When the stirring blade 221 transports the debris to the top, the stirring blade 221 throws the debris diagonally upward on both sides. The debris thrown to the left by the stirring blade 221 will be repelled by the negative electric field generated by the discharge plate A23, causing the debris on the left to move to the right under the action of the repulsive force and be attracted by the positive electric field of the stirring rod B26. Since two groups of left and right stirring blades 221 are provided, the debris will gather on the lower side of the stirring rod B26, and the gathered debris can be taken out through the first material taking port, and the air moving upward is discharged through the air outlet on the upper side of the outer shell B25.

[0048] When the induced current generated by the conductor A31 is small or the conductor A31 fails, the control system will energize the first metal wire 224, the semiconductor 341 and the annular spring 37 to ensure stable operation of the grinding device. The degree of contraction of the annular spring 37 is determined by the magnitude of the current passed through it. Therefore, the control system adjusts the magnitude of the current passed through the annular spring 37 to change the moving distance of the sliding block A32, and further adjust the size of the compressed volume of the first chamber 35 to achieve the purpose of adjusting the pressure of the grinding fluid 33.

[0049] By pressing the stop button on the control panel 1, the device is powered off and the collected debris is taken out through the first material taking port for further processing.

[0050] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0051] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A grinding device with dust removal function for wire drawing die processing, characterized in that: The invention comprises a housing A (11), a lifting motor (2) is vertically mounted on the housing A (11), a stirring rod A (22) and a stirring rod B (26) are mounted below the lifting motor (2), a discharge plate A (23) is mounted on one side of the stirring rod A (22), a filter membrane (24) is mounted below the discharge plate A (23), a rotating disk (3) is mounted below the filter membrane (24), a conductor A (31) is mounted on the upper layer of the rotating disk (3), and a conductor A (31) is mounted on one side of the conductor A (31). A sliding block A (32) is provided, a polishing liquid (33) is arranged on one side of the sliding block A (32), a heat absorbing plate (34) is arranged in the middle layer of the rotating disk (3), a polishing particle is arranged in the lower layer of the rotating disk (3), the polishing particle in the lower layer of the rotating disk (3) is used to polish the wire drawing die (14), the stirring rod A (22) is used to collect the debris generated by the polishing, the conductor A (31) is used to control the movement of the sliding block A (32), and the sliding block A (32) pressurizes the polishing liquid (33).

2. A grinding device with dust removal function for wire drawing die processing according to claim 1, characterized in that: A housing B (21) is installed between the lifting motor (2) and the stirring rod A (22), a driving motor (25) is vertically installed in the housing B (21), the rotating disk (3) is installed on the output shaft of the driving motor (25), a semicircular first chamber (35) is provided on one side of the upper layer of the rotating disk (3), the polishing liquid (33) is provided in the first chamber (35), an annular shaft (36) is installed in the first chamber (35), and the sliding block A (32) is slidably installed on the annular shaft (36). The annular shaft (36) is provided with an annular spring (37), one end of the annular spring (37) is mounted on the sliding block A (32), and the other end of the annular spring (37) is mounted on the rotating disk (3), both ends of the annular spring (37) are connected to the control system through wires, and both ends of the conductor A (31) are respectively connected to the two ends of the annular spring (37) through wires, and magnets (38) with different magnetic properties are symmetrically mounted on the outer side of the rotating disk (3), and the magnets (38) are mounted on the housing B (21).

3. A grinding device with dust removal function for wire drawing die processing according to claim 2, characterized in that: The stirring rod A (22) is composed of a stirring blade (221) and a stirring shaft (222); the stirring blade (221) is spiral-shaped; the stirring blade (221) is mounted on the stirring shaft (222); both ends of the stirring shaft (222) are mounted on the housing B (21) through bearings; a discharge plate B (223) is attached to the blade of the stirring blade (221); the discharge plate B (223) is connected to the negative electrode of the power supply; a first metal wire (224) is arranged on the blade edge of the stirring blade (221); both ends of the first metal wire (224) are connected to the conductor A (31) through a wire; and both ends of the conductor A (31) are connected to a control system through a wire.

4. The grinding device with dust removal function for wire drawing die processing according to claim 3 is characterized in that: A driven gear (28) is installed on the upper side of the stirring shaft (222), a driving gear (27) is meshed on the outer side of the driven gear (28), and the driving gear (27) is installed on the output shaft of the driving motor (25). The outer diameter of the stirring blade (221) gradually increases from bottom to top, and the number of spiral turns of the stirring blade (221) gradually increases from bottom to top.

5. The grinding device with dust removal function for wire drawing die processing according to claim 4, characterized in that: The middle layer of the rotating disk (3) is provided with a second chamber (39), the second chamber (39) is connected with the first chamber (35) through a pipeline and a control valve, the heat absorbing plate (34) is provided at the lower side of the second chamber (39), the heat absorbing plate (34) is provided with a plurality of groups, two semiconductors (341) of different materials are provided on the heat absorbing plate (34), and the two semiconductors (341) of different materials are both connected to the conductor A (31).

6. The grinding device with dust removal function for wire drawing die processing according to claim 5, characterized in that: A first jet port (391) is arranged at the lower side of the rotating disk (3), a plurality of the first jet ports (391) are evenly arranged on the rotating disk (3), a first one-way valve is installed in each of the first jet ports (391), and the grinding particles are arranged between two adjacent first jet ports (391).

7. A grinding device with dust removal function for wire drawing die processing according to claim 6, characterized in that: The discharge plate A (23) is connected to the negative pole of the power supply, and the housing B (21) is provided with a first material taking port, which is connected to the lower side of the stirring rod B (26).

8. The grinding device with dust removal function for wire drawing die processing according to claim 7, characterized in that: An insulating sleeve is arranged outside the annular spring (37), and the stirring rod B (26) is connected to the positive electrode of the power supply.

9. A grinding device with dust removal function for wire drawing die processing according to claim 8, characterized in that: A threaded structure is provided at one end of the output shaft of the lifting motor (2); the housing B (21) is threadedly connected to the output shaft of the lifting motor (2); guide shafts (13) are installed on both sides of the housing B (21); and the guide shafts (13) are slidably connected to the housing A (11).

10. The grinding device with dust removal function for wire drawing die processing according to claim 9, characterized in that: A control panel (1) is installed on the shell A (11), a control system is arranged inside the control panel (1), a start button, a stop button and an emergency stop button are arranged on the control panel (1), a support column (12) is arranged on the lower side of the shell A (11), a first filling port is arranged on the shell B (21), the first filling port is connected to the first chamber (35) through a pipeline, and an air outlet is opened on the upper side of the shell B (25).

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