A semiconductor chemical mechanical automatic polishing device

Abstract

The present invention relates to the technical field of chemical mechanical polishing, in particular to a semiconductor chemical mechanical automatic polishing device, which includes a polishing table disposed within a CMP device. The polishing table includes a polishing belt, and the polishing belt is arranged in a closed-loop equilateral triangle layout. The top surface of the polishing belt is horizontally arranged, and a first roller is sleeved within each of the three corners of the polishing belt. This chemical mechanical polishing device uses a polishing table with an equilateral triangle appearance. The equilateral triangle conveyor belt structure layout of its polishing belt replaces the traditional flat circular polishing pad. The other two sides of the polishing belt can be cleaned synchronously during the polishing process, greatly reducing the water consumption and significantly shortening the cleaning time. It can promptly provide a clean polishing surface for the polishing table, eliminating the traditional waiting time for rinsing. It can also quickly and safely remove the residues on the surface of the wafer, bringing a powerful working efficiency that is not available with the traditional horizontally laid single polishing pad for the polishing and cleaning of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of chemical mechanical polishing, and in particular to a semiconductor chemical mechanical automatic polishing device. Background Art

[0002] The chemical mechanical rough grinding equipment for wafers generally consists of the following parts: a robotic arm that picks up and drives the wafer to rotate and grind on the polishing pad, a platform that supports the polishing pad, a spraying device that provides the abrasive, and a cleaning device that cleans the polishing pad and the wafer.

[0003] The grinding process of the wafer needs to be carried out multiple times, gradually transitioning from rough grinding to fine grinding. The components ground from the wafer during the grinding process will become impurities and fill the gaps of the polishing pad, reducing the rough grinding efficiency. Therefore, the cleaning work between different grinding stages is very important. The cleaning method is generally to rinse or perform a mild grinding action on the wafer while rinsing, so as to remove the tiny impurity particles adhered to the wafer while cleaning the polishing pad. However, in fact, due to the physical properties of the thin and brittle wafer and the porous polishing pad, the rinsing effect of the existing chemical mechanical grinding equipment is not ideal, often requiring a long rinsing time and consuming a large amount of water resources. Therefore, in order to shorten the cleaning duration in the wafer grinding process of the existing chemical mechanical grinding equipment, improve production efficiency, and reduce water consumption, making the equipment more energy-saving and environmentally friendly, a semiconductor chemical mechanical automatic polishing device is proposed. Summary of the Invention

[0004] In view of the problems of the long rinsing time and large water consumption of the existing chemical mechanical grinding equipment in the above or the prior art, the present invention is proposed.

[0005] Therefore, the object of the present invention is to provide a semiconductor chemical mechanical automatic polishing device.

[0006] To solve the above technical problems, the present invention provides the following technical solution: A semiconductor chemical mechanical automatic polishing device, including a polishing table disposed in a CMP device, the polishing table includes a polishing belt, the polishing belt is arranged in a closed-loop equilateral triangle layout, the top surface of the polishing belt is horizontally arranged, and a first roller is sleeved inside each of the three corners of the polishing belt. The two sides of the polishing belt are respectively provided with equilateral triangle-shaped frames in a matching manner. The first rollers are parallel to each other, and both ends of the first rollers are rotatably connected to the corners of the frame. A second roller is arranged at the bottom of the polishing belt, and the second roller and the adjacent first roller clamp the polishing belt in parallel. Both ends of the second roller are provided with brackets, the top of the brackets is slidably connected to the bottom of its adjacent frame, and the sliding directions of the two brackets are arranged obliquely upward in opposite directions. The two brackets are symmetrically arranged with respect to the second roller. Belts are arranged on the side edges of the two frames at the diagonal positions, the belts are parallel to the side edges of the frames where they are located. The bottom ends of the two belts are respectively wound around both ends of the rotating shaft of the lowest first roller, and the top ends of the two belts are wound around the rotating shafts of the corresponding higher-position first rollers. A carriage is slidably connected between the two frames, the two carriages are distributed on both sides of the frame, and the sliding path of the carriage is parallel to its adjacent belt. The carriage is fixedly connected to the belt, and a flushing nozzle and a drying nozzle are respectively clamped by the two carriages.

[0007] As a preferred embodiment of the semiconductor chemical mechanical automatic polishing device of the present invention, wherein: The tops of the two frames are fixedly connected with a flat plate, and the edge of the flat plate is fitted with the top of the frame. The flat plate is horizontally attached to the inner side of the top surface of the polishing belt.

[0008] As a preferred embodiment of the semiconductor chemical mechanical automatic polishing device of the present invention, wherein: The first roller rotates freely with its rotating shaft, and the second roller is fixedly sleeved with its rotating shaft. Both between the rotating shaft of the first roller and the frame and between the rotating shaft of the second roller and the bracket are connected by bearings. Both ends of the belt are provided with belt pulleys connected to the rotating shaft of the first roller, and the belt pulley is fixedly sleeved with the rotating shaft of the first roller.

[0009] As a preferred embodiment of the semiconductor chemical mechanical automatic polishing device of the present invention, wherein: The positions of the rotating shaft of the first roller, the frame, and the bearing therebetween are relatively fixed. The rotating shaft of the second roller is slidably inserted into its corresponding bearing. Covers are arranged on the sides of the two brackets away from each other, and nuts are arranged on the sides of the covers away from the brackets. The nuts are threadedly fastened to the rotating shaft of the second roller.

[0010] As a preferred embodiment of the semiconductor chemical mechanical automatic polishing device of the present invention, wherein: The top of the bracket is integrally provided with a slider, and the bottom of the frame is provided with a dovetail chute. The slider is slidably connected to the dovetail chute in a matching manner.

[0011] As a preferred embodiment of the semiconductor chemical mechanical automatic polishing device of the present invention, the following is provided: At the bottom of the side of the frame away from the abrasive belt, a mounting seat is fixedly connected, and the side shape of the mounting seat is in the shape of an "F". On the side of the mounting seat away from the frame, two motors are arranged with a height difference. The output shaft of the motor at the higher position is coaxially connected to the rotating shaft of the adjacent roller one, and the output shaft of the motor at the lower position is connected to the rotating shaft of the adjacent roller two.

[0012] As a preferred embodiment of the semiconductor chemical mechanical automatic polishing device of the present invention, the following is provided: The rotating shaft of the roller one is connected to the motor output shaft through a rigid coupling, and the rotating shaft of the roller two is connected to the motor output shaft through a flexible coupling.

[0013] As a preferred embodiment of the semiconductor chemical mechanical automatic polishing device of the present invention, the following is provided: Slide rails are slidably connected to both ends of the carriage. The slide rails are fixedly connected to the edges of the adjacent frame, and two contact positions are provided between the end of the carriage and the slide rail. When one of the two carriages is at the upper dead center of the stroke, the other carriage is at the lower dead center of the stroke.

[0014] As a preferred embodiment of the semiconductor chemical mechanical automatic polishing device of the present invention, the following is provided: An equilateral triangle inner frame is arranged inside the frame, and the three corners of the inner frame are respectively fixedly connected to the midpoint positions of the three sides of the frame. A cross beam is also fixedly connected between the two inner frames.

[0015] As a preferred embodiment of the semiconductor chemical mechanical automatic polishing device of the present invention, the following is provided: At both ends of an inner wall of the inner frame, conduits are hinged. The two ends of the conduit are in a trumpet shape, and the connecting pipes of the flushing nozzle and the air drying nozzle are respectively sleeved on the two conduits. The flushing nozzle and the air drying nozzle are both perpendicular to the belt wall of the adjacent abrasive belt.

[0016] The beneficial effects of the semiconductor chemical mechanical automatic polishing device of the present invention: This chemical mechanical grinding equipment adopts a grinding table with an equilateral triangle appearance. Its abrasive belt with an equilateral triangle conveyor belt structure layout replaces the traditional flat circular grinding pad. In addition to realizing conventional grinding operations, the other two sides of the abrasive belt can be cleaned synchronously during the grinding process. And the flexible nozzle arrangement and the flushing method of reciprocating back and forth on the back not only greatly reduce the water consumption, but also greatly shorten the cleaning time, providing a clean grinding surface for the grinding table in a timely manner, eliminating the traditional waiting time for flushing. Moreover, the abrasive belt runs continuously in the same direction and cooperates with the flushing operation, and can quickly and safely remove the residues on the surface of the wafer, bringing a powerful working efficiency that the traditional horizontal laying of a single grinding pad does not have for the grinding and cleaning of the wafer. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0018] Figure 1 This is a schematic diagram of the overall structure of a semiconductor chemical mechanical automatic polishing device.

[0019] Figure 2 This is a schematic diagram of the grinding table structure of a semiconductor chemical mechanical automatic polishing device.

[0020] Figure 3 for Figure 2 Schematic diagram of the structure after cutting the grinding belt.

[0021] Figure 4 for Figure 3 Exploded view of the local structure after the grinding belt is removed.

[0022] Figure 5 for Figure 4 A magnified view of the structure at center.

[0023] Figure 6 for Figure 4 A magnified view of the structure at point B.

[0024] Figure 7 for Figure 3 Cross-sectional view of local structure.

[0025] Figure 8 for Figure 7 Enlarged view of the structure at C in the middle.

[0026] Figure 9 for Figure 7 Enlarged view of the structure at D in the middle.

[0027] Figure 10 The present invention is a cross-sectional view of the assembly structure between the nozzle and the slide of a semiconductor chemical mechanical automatic polishing device.

[0028] Figure 11 for Figure 2 Enlarged view of the structure at E in the middle.

[0029] Figure 12 for Figure 11 Structural section of .

[0030] Figure 13 for Figure 11 Structural breakdown diagram.

[0031] Figure 14Schematic diagram of the gap adjustment structure between the second roller and the first roller of the semiconductor chemical mechanical automatic polishing device.

[0032] In the figure: 100, CMP equipment; 200, grinding table; 201, grinding belt; 202, first roller; 203, frame; 204, second roller; 205, bracket; 206, belt; 207, pulley; 208, carriage; 209, flushing nozzle; 210, air drying nozzle; 211, flat plate; 212, cover plate; 213, nut; 214, slide rail; 215, inner frame; 216, cross beam; 217, conduit; 203a, dovetail chute; 205a, slider; 300, motor; 301, mounting seat. Specific implementation mode

[0033] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the specific implementation mode of the present invention will be described in detail below with reference to the accompanying drawings of the specification.

[0034] Example, referring to Figures 1 to 14 , which is the first embodiment of the present invention. This embodiment provides a semiconductor chemical mechanical automatic polishing device. Through the cyclic cleaning pretreatment of the grinding belt 201, it quickly provides clean grinding conditions for the next-stage chemical mechanical grinding, and quickly and safely cleans the wafer after grinding, such as Figure 1 shown, which includes a grinding table 200 arranged in the CMP equipment 100, as Figure 2 and Figure 3 shown, the grinding table 200 includes a grinding belt 201. The grinding belt 201 is arranged in a closed-loop equilateral triangle layout. The top surface of the grinding belt 201 is horizontally arranged, and the first rollers 202 are sleeved in all three corners of the grinding belt 201. The two sides of the grinding belt 201 are respectively provided with frames 203 in the shape of equilateral triangles. The first rollers 202 are parallel to each other, and the two ends of the first rollers 202 are rotatably connected to the corners of the frame 203; as Figure 2 and Figure 11 shown, a second roller 204 is arranged at the bottom end of the grinding belt 201, and the second roller 204 and the adjacent first roller 202 clamp the grinding belt 201 in parallel, as Figure 12 and Figure 13 shown, brackets 205 are arranged at both ends of the second roller 204. The top ends of the brackets 205 are slidably connected to the bottom ends of the adjacent frames 203, and the sliding directions of the two brackets 205 are arranged in an inclined upward direction towards each other. The two brackets 205 are symmetrically arranged with respect to the second roller 204; as Figure 7 shown, belts 206 are arranged on the side edges of the two frames 203 at the diagonal positions. The belts 206 are parallel to the side edges of the frames 203 where they are located, as Figure 8 and Figure 9As shown, the bottom ends of the two belts 206 are respectively wound around both ends of the rotating shaft of the lowest-position roller 202, and the top ends of the two belts 206 are wound around the rotating shafts of the corresponding high-position rollers 202. A carriage 208 is slidably connected between the two frames 203. The two carriages 208 are distributed on both sides of the frame 203, and the sliding path of the carriage 208 is parallel to its adjacent belt 206. The carriage 208 is fixedly connected to the belt 206. As Figure 10 shown, a flushing nozzle 209 and a drying nozzle 210 are respectively clamped on the two carriages 208. The flushing nozzle 209 and the drying nozzle 210 are both perpendicular to the belt wall of the adjacent abrasive belt 201.

[0035] Specifically, as Figure 4 and Figure 5 shown, a flat plate 211 is fixedly connected to the top ends of the two frames 203, and the edge of the flat plate 211 is fitted with the top ends of the frames 203. As Figure 3 shown, the flat plate 211 is horizontally attached to the inner side of the top surface of the abrasive belt 201. As Figure 13 shown, the rotating shaft of the roller 202 and the frame 203, and the rotating shaft of the roller 204 and the bracket 205 are both connected by bearings. A slider 205a is integrally provided at the top end of the bracket 205, and a dovetail chute 203a is provided at the bottom end of the frame 203. The slider 205a is slidably connected to the dovetail chute 203a. As Figure 11 shown, belt wheels 207 are provided at both ends of the belt 206 and are connected to the rotating shaft of the roller 202, and the belt wheels 207 are fixedly sleeved on the rotating shaft of the roller 202. The roller 202 rotates freely with respect to its rotating shaft. The rotating shaft of the roller 202, the frame 203, and the bearing therebetween are relatively fixed in position. The rotating shaft of the roller 204 is slidably inserted into its corresponding bearing. Cover plates 212 are provided on the sides of the two brackets 205 away from each other, and nuts 213 are provided on the sides of the cover plates 212 away from the brackets 205. The nuts 213 are threadedly fastened to the rotating shaft of the roller 204.

[0036] As Figure 11 and Figure 13 shown, a mounting seat 301 is fixedly connected to the bottom of the side of the frame 203 away from the abrasive belt 201, and the side shape of the mounting seat 301 is in the shape of an F. Two motors 300 are provided on the side of the mounting seat 301 away from the frame 203 with a high-low potential difference. The output shaft of the motor 300 at the high position is coaxially connected to the rotating shaft of its adjacent roller 202, and the output shaft of the motor 300 at the low position is connected to the rotating shaft of its adjacent roller 204. The rotating shaft of the roller 202 and the output shaft of the motor 300 are connected by a rigid coupling, and the rotating shaft of the roller 204 and the output shaft of the motor 300 are connected by a flexible coupling.

[0037] As Figure 8 andFigure 9 As shown, both ends of the slide 208 are slidably connected to the slide rails 214, and the slide rails 214 are fixedly connected to the edges of the adjacent frame 203, and two contact positions are set between the ends of the slide 208 and the slide rails 214. When one of the two slides 208 is at the upper dead point of the stroke, the other slide 208 is at the lower dead point of the stroke, as shown in FIG. Figure 3 As shown, an equilateral triangle inner frame 215 is provided in the frame 203, and the triangles of the inner frame 215 are fixedly connected to the midpoints of the three sides of the frame 203, and a crossbeam 216 is fixedly connected between the two inner frames 215. Figure 6 As shown, both ends of an inner wall of the inner frame 215 are hinged with conduits 217, both ends of the conduit 217 are trumpet-shaped, and the two conduits 217 are respectively connected to the connecting pipes of the flushing nozzle 209 and the air-drying nozzle 210.

[0038] The working principle and advantages of the device are further explained in combination with the prior art: the grinding tables 200 of the currently used chemical mechanical grinding equipment have a significant commonality, that is, the table tops of their grinding tables 200 are usually circular, and the circular grinding pads are laid flat on the grinding table 200 for use, and the grinding pads, especially the coarse grinding pads, have a large number of tiny pores, which determine the grinding accuracy of the grinding pads and can absorb and hold abrasives. The tiny pores after grinding are easily filled with impurity particles ground out, resulting in changes in the surface roughness of the grinding pads, resulting in reduced work efficiency of the re-grinding, and other problems. Moreover, since the working surface is vertically facing upward, the efficiency of cleaning the grinding pads by traditional rinsing methods is very low, thereby consuming a large amount of water.

[0039] The present invention provides a semiconductor chemical mechanical automatic polishing device, wherein a grinding table 200 is mainly provided. The grinding table 200 is similar to a conveyor belt structure, and adopts a grinding belt 201 instead of a conventional circular grinding pad. The running route of the grinding belt 201 is an equilateral triangle, and the top surface is arranged horizontally, so that the triangular top surface of the grinding belt 201 can be used for conventional grinding operations, and the other two side surfaces of the grinding belt 201 can be cleaned synchronously during the grinding process. Different from the conventional chemical mechanical polishing pad, which washes toward the grinding surface, the washing direction of the present invention is to wash the grinding belt 201. 1. The back side of the grinding surface is rinsed, which can remove impurities in the grinding belt 201 more quickly and thoroughly, so the cleaning time will be greatly shortened. A further benefit of shortening the cleaning time is that the grinding table 200 has prepared a clean grinding surface for use before the ongoing grinding operation is completed. In addition, for the residue on the surface of the wafer after grinding, the grinding belt 201 can be continuously moved in one direction, and the residue on the surface of the wafer can be wiped off with the clean side of the grinding belt 201. This brings powerful work efficiency to the grinding and cleaning of the wafer that is not available in the traditional horizontally laid single grinding pad.

[0040] To achieve the above-mentioned target functions, the present invention also has the following technical details:

[0041] First, for the driving methods of the grinding belt 201 and the cleaning structure of the chemical mechanical polishing equipment, as Figure 11 shown, the roller 202 of the device can rotate freely relative to its rotating shaft, and the rotating shafts of the roller 202 and the roller 204 are connected by bearings and can rotate freely relative to the frame 203 or the bracket 205. Therefore, when the polishing table 200 drives the roller 204 to rotate through the motor 300, the roller 204 drives the grinding belt 201 to run in a way that squeezes the roller 202 to clamp the grinding belt 201. At the same time, the belt 206 connected to the rotating shaft of the roller 202 and the cleaning function-related components such as the carriage 208 connected to the belt 206 are not affected by the operation of the grinding belt 201, and the two operate independently of each other;

[0042] When another motor 300 drives the rotation of the rotating shaft of the roller 202, the rotating shaft of the roller 202 will drive the pulley 207 and the belt 206 to run. The two belts 206 are arranged at a V-shaped angle. As Figure 7 shown, the running directions of the two sides of the two belts 206 that are close to each other or the two sides of the two belts 206 that are far from each other are opposite. Therefore, when one side (or the side far from each other) of the two belts 206 that are close to each other is connected to the carriage 208, one carriage 208 will rise and the other carriage 208 will fall. The advantages of such a motion layout are, first, the carriage 208 and the nozzles on the carriage 208 always run close to the inner wall of the grinding belt 201 at a stable distance, bringing a stable flushing or air-drying effect; second, the lifting directions of the two carriages 208 are opposite, which can cancel out the gravity effect on each other, reducing the difficulty of transmission and driving, manifested as lower energy consumption of the motor 300;

[0043] Second, for the polishing table 200 of the chemical mechanical polishing equipment, the gap adjustment between the roller 204 and the roller 202 is very important. The gap between the roller 204 and the roller 202 needs to be adjusted to achieve two purposes. One is to squeeze and roll to drive the operation of the grinding belt 201, and the other is to locally squeeze the grinding belt 201 so that the grinding belt 201 is squeezed to temporarily compact the internal pores and squeeze out the residual water after flushing, thereby greatly reducing the difficulty of air-drying in the subsequent stage. When continuously running the grinding belt 201 to wipe off the attachments on the surface of the wafer, it also plays a role in quickly squeezing and discharging dirt in cooperation with water flushing (applicable when using a grinding belt 201 made of a soft and flexible grinding material), as Figure 14As shown in the figure, on the brackets 205 at both ends of the rotating shafts of the second roller 204, an inclined slider 205a is integrally provided. The included angle between the two sliders 205a is in an inverted V shape. When the nut 213 is tightened relative to the rotating shaft, the nut 213 will squeeze the bracket 205 towards the second roller 204 through the cover plate 212 (since the nut 213 is small in volume, to avoid direct extrusion of the bearing side by the nut 213 causing damage). The distance between the two brackets 205 decreases, which will cause the two sliders 205a to slide and rise along the dovetail chute 203a at the bottom of the frame 203, and at the same time drive the bracket 205 and the second roller 204 to rise. Continuously reduce the distance between the two brackets 205 until the second roller 204 rises to contact the abrasive belt 201 and is squeezed to an appropriate pressure, and then fix the adjusted position by the anti-loosening method of tightening with the double nut 213;

[0044] Since the sliding directions of the slider 205a and the dovetail chute 203a are determined, and the socketing direction of the bracket 205 and the roller shaft of the second roller 204 is unique, when the machining and assembly accuracy of the components meet the requirements (the parallelism between the first roller 202 and the second roller 204), the actions of the two sliders 205a must be synchronized to achieve the lifting adjustment of the roller, avoiding the non-parallelism between the first roller 202 and the second roller 204 caused by the difference in the adjusted positions at both ends, and avoiding the uneven pressure on the abrasive belt 201 between the second roller 204 and the first roller 202;

[0045] It should be noted that since the position of the motor 300 is fixed relative to the frame 203, and the height of the second roller 204 is adjustable, a flexible coupling should be used to connect between the output shaft of the second roller 204 and its corresponding motor 300.

[0046] Thirdly, the grinding table 200 of this chemical mechanical polishing equipment has a frame structure composed of two equilateral triangle frames 203, a square flat plate 211, and a cross beam 216. Among them, a small equilateral triangle inner frame 215 is also connected inside the frame 203. The inner frame 215 divides the area enclosed by the frame 203 into four equilateral triangles, greatly increasing the structural strength of the frame 203. The platform and the cross beam 216 are responsible for the horizontal connection between the two frames 203, and the side width of the platform is greater than the width of the cross beam 216. Therefore, a shape close to a frustum of a pyramid is constructed among the platform, the cross beam 216, the frame 203, and the inner frame 215, making the overall structure of the grinding table 200 have high rigidity and stability;

[0047] Fourthly, Figure 7 Taking the air drying nozzle 210 as an example, the clamping and assembling structure between the air drying nozzle 210 and the carriage 208 is shown. The flushing nozzle 209 is assembled in the same way. Within the allowable installation space of the carriage 208, the number of the air drying nozzles 210 and the flushing nozzles 209 can be increased or decreased as needed, and the spacing between the nozzles can be adjusted flexibly;

[0048] Figure 6 The duct 217 with a flared opening is shown. The duct 217 can be deflected within a small range and is used to thread air pipes or water pipes during the movement of the nozzle head along with the carriage 208, so as to achieve the purpose of bundling and reducing scratches.

[0049] In summary, for this chemical mechanical polishing equipment, a polishing table 200 with an equilateral triangle appearance is adopted. The conveyor belt structure layout of the equilateral triangle of its polishing belt 201 replaces the traditional flat circular polishing pad. In addition to performing conventional polishing operations, the other two sides of the polishing belt 201 can be cleaned synchronously during the polishing process. Moreover, the flexible nozzle head arrangement and the back-and-forth flushing method not only greatly reduce the water consumption, but also significantly shorten the cleaning time, providing a clean polishing surface for the polishing table 200 in a timely manner, eliminating the traditional waiting time for flushing. Furthermore, the continuous running of the polishing belt 201 in one direction and its cooperation with the flushing operation can quickly and safely remove the residues on the surface of the wafer, bringing a powerful working efficiency that the traditional horizontally laid single polishing pad does not have for the polishing and cleaning of the wafer.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to be limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. A semiconductor chemical mechanical automatic polishing device, characterized in that: The invention comprises a grinding table (200) arranged in a CMP device (100), wherein the grinding table (200) comprises a grinding belt (201), wherein the grinding belt (201) is arranged in a closed-loop equilateral triangle, wherein the top surface of the grinding belt (201) is arranged horizontally, and a roller (202) is sleeved in three corners of the grinding belt (201), and both sides of the grinding belt (201) are matched with a frame (203) in the form of an equilateral triangle, wherein the rollers (202) are parallel to each other, and the two ends of the roller (202) are rotatably connected to the corners of the frame (203); A second roller (204) is arranged at the bottom end of the grinding belt (201), and the second roller (204) and the adjacent first roller (202) are parallel to clamp the grinding belt (201), and brackets (205) are arranged at both ends of the second roller (204), and the top of the bracket (205) is slidably connected to the bottom of the adjacent frame (203), and the sliding directions of the two brackets (205) are arranged in opposite oblique upward directions, and the two brackets (205) are symmetrically arranged with respect to the second roller (204); Belts (206) are arranged on the diagonally opposite sides of the two frames (203); the belts (206) are parallel to the sides of the frames (203) where they are located; the bottom ends of the two belts (206) are respectively connected to the two ends of the rotating shaft of the lowest roller (202); the top ends of the two belts (206) are connected to the rotating shaft of the high roller (202) corresponding to their positions; a slide (208) is slidably connected between the two frames (203); the two slides (208) are distributed on both sides of the frames (203); and the sliding path of the slide (208) is parallel to the adjacent belt (206); the slide (208) is fixedly connected to the belt (206); and the two slides (208) are respectively connected to a flushing nozzle (209) and an air-drying nozzle (210).

2. The semiconductor chemical mechanical automatic polishing device according to claim 1, characterized in that: A flat plate (211) is fixedly connected to the top of the two frames (203), and the edge of the flat plate (211) is embedded with the top of the frame (203), and the flat plate (211) is horizontally attached to the inner side of the top surface of the grinding belt (201).

3. The semiconductor chemical mechanical automatic polishing device according to claim 2, characterized in that: The roller one (202) and its rotating shaft are freely rotatable, and the roller two (204) and its rotating shaft are fixedly sleeved, and the rotating shaft of the roller one (202) and the frame (203), and the rotating shaft of the roller two (204) and the bracket (205) are all connected via bearings, and pulleys (207) are provided at both ends of the belt (206) to be connected to the rotating shaft of the roller one (202), and the pulleys (207) are fixedly sleeved to the rotating shaft of the roller one (202).

4. The semiconductor chemical mechanical automatic polishing device according to claim 3, characterized in that: The positions of the rotating shaft of the first roller (202), the frame (203) and the bearing therebetween are relatively fixed; the rotating shaft of the second roller (204) is slidably plugged into the corresponding bearing; a cover plate (212) is provided on the side away from each other of the two brackets (205); and a nut (213) is provided on the side away from the bracket (205); the nut (213) is threadedly fastened to the rotating shaft of the second roller (204).

5. The semiconductor chemical mechanical automatic polishing device according to claim 4, characterized in that: The top end of the bracket (205) is integrally provided with a slider (205a), and the bottom end of the frame (203) is provided with a dovetail slide groove (203a), and the slider (205a) is matched and slidably connected with the dovetail slide groove (203a).

6. The semiconductor chemical mechanical automatic polishing device according to claim 5, characterized in that: A mounting seat (301) is fixedly connected to the bottom of a side of the frame (203) away from the grinding belt (201), and the side shape of the mounting seat (301) is F-shaped. Two motors (300) are arranged at a height difference on the side of the mounting seat (301) away from the frame (203), the output shaft of the motor (300) located at the higher position is coaxially connected to the rotating shaft of the adjacent roller one (202), and the output shaft of the motor (300) located at the lower position is connected to the rotating shaft of the adjacent roller two (204).

7. The semiconductor chemical mechanical automatic polishing device according to claim 6, characterized in that: The rotating shaft of the first roller (202) is connected to the output shaft of the motor (300) via a rigid coupling, and the rotating shaft of the second roller (204) is connected to the output shaft of the motor (300) via a flexible coupling.

8. The semiconductor chemical mechanical automatic polishing device according to claim 1, characterized in that: Both ends of the slide (208) are slidably connected to slide rails (214), the slide rails (214) are fixedly connected to the edges of the adjacent frames (203), and two contact positions are arranged between the ends of the slide (208) and the slide rails (214), and when one of the two slides (208) is at the upper dead point of the travel, the other slide (208) is at the lower dead point of the travel.

9. The semiconductor chemical mechanical automatic polishing device according to claim 8, characterized in that: An equilateral triangle inner frame (215) is arranged inside the frame (203), and the triangles of the inner frame (215) are respectively fixedly connected to the midpoints of the three sides of the frame (203), and a crossbeam (216) is also fixedly connected between the two inner frames (215).

10. The semiconductor chemical mechanical automatic polishing device according to claim 9, characterized in that: Both ends of an inner wall of the inner frame (215) are hinged with a conduit (217), the two ends of the conduit (217) are trumpet-shaped, and the two conduits (217) are respectively connected to the connecting pipes of the flushing nozzle (209) and the air-drying nozzle (210), and the flushing nozzle (209) and the air-drying nozzle (210) are both perpendicular to the belt wall of the adjacent grinding belt (201).

Images