Die cutting product bottom layer material strip stripping method

Abstract

The invention relates to a stripping method for a bottom-layer material strap of a die-cut product, the die-cut product comprises a bottom-layer material strap film, an adhesive layer arranged on the bottom-layer material strap film and a top-layer film layer arranged on the adhesive layer, the corner of the adhesive layer is located at the front end of the conveying direction of the die-cut product, and the stripping method comprises the steps that the die-cut product is conveyed to pass through a stripping platform; the front end of the stripping platform is of an acute angle structure, and a bottom layer material belt film is pulled down along the acute angle structure. The corner of the adhesive layer is a plane parallel to the front side edge of the acute angle structure. Compared with the prior art, the corner of the adhesive layer is designed to be of the plane structure parallel to the front side edge of the acute angle structure, so that the stripping area of the initial stripping position is increased, the binding force between the adhesive layer and the top film layer is increased, the binding force difference between the bottom material belt film and the adhesive layer is increased, and the stripping effect is guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of die-cutting processing and relates to a method for peeling off a bottom material strip of a die-cut product. Background Art

[0002] like Figure 1 A die-cut product shown includes a bottom material strip film 1, a plurality of adhesive layers 2 arranged in an array on the bottom material strip film 1, and a top film layer 3 arranged on the adhesive layer 2, wherein the corner of the adhesive layer 2 is located at the front end of the conveying direction of the die-cut product. The product needs to peel off the adhesive layer 2 and the top film layer 3 from the bottom material strip film 1. The common peeling method is completed by a peeling platform, and the front end of the peeling platform 4 is an acute angle structure. For most die-cut products, the bottom material strip film 1 can be pulled down along the acute angle structure to complete the peeling work. However, since the front end corner of the adhesive layer 2 is usually rounded, the discharge position is a sharp point discharge or close to a sharp point discharge, and the peeling area is small, which can be defaulted to a point area. Therefore, the bonding force between the adhesive layer 2 and the top film layer 3 cannot produce a relatively large difference with the bonding force between the bottom material strip film 1 and the adhesive layer 2, resulting in the phenomenon that the double-sided tape follows the material strip film, that is, it cannot be guaranteed that the bottom material strip film 1 can be peeled off smoothly, which leads to poor throwing. Summary of the invention

[0003] The purpose of the present invention is to provide a method for peeling off the bottom material strip of a die-cut product.

[0004] The purpose of the present invention can be achieved by the following technical solutions:

[0005] A method for peeling off a bottom material strip of a die-cut product, wherein the die-cut product comprises a bottom material strip film, an adhesive layer arranged on the bottom material strip film, and a top film layer arranged on the adhesive layer, wherein the corner of the adhesive layer is located at the front end of the conveying direction of the die-cut product.

[0006] The stripping method includes: conveying the die-cut product through a stripping platform, the front end of which is an acute-angle structure, and pulling down the bottom material strip film along the acute-angle structure; wherein the corner of the adhesive layer is a plane parallel to the front edge of the acute-angle structure.

[0007] Furthermore, the adhesive layer is a double-sided adhesive layer.

[0008] Furthermore, the top film layer is a handle film layer.

[0009] Furthermore, the handle film layer extends out of the adhesive layer.

[0010] Furthermore, the release force gram weight of the top film layer is greater than the release force gram weight of the bottom material strip film.

[0011] Furthermore, the release force of the top film layer is 5 times greater than the release force of the bottom material strip film.

[0012] Furthermore, the acute angle structure is at an angle of 30 to 60 degrees.

[0013] Furthermore, the acute angle structure is at an angle of 40 to 50 degrees.

[0014] Furthermore, the acute angle structure is at an angle of 45°.

[0015] Furthermore, a plurality of adhesive layers and a plurality of top film layers are arranged in an array on the bottom material tape film.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention designs the corner of the adhesive layer to be a planar structure parallel to the front edge of the acute angle structure, thereby increasing the peeling area at the starting point of peeling, increasing the bonding force between the adhesive layer and the top film layer, and the bonding force difference between the bottom material film and the adhesive layer, thereby ensuring the peeling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figures 1 to 3 It is a structural schematic diagram of a die-cut product;

[0019] Figure 4 It is a conventional stripping method for the bottom layer of die-cut products;

[0020] Figure 5 Schematic diagram of the improved structure of the adhesive layer in the embodiment;

[0021] Description of the markings in the figure:

[0022] 1- bottom material strip film, 2- adhesive layer, 3- top film layer, 4- peeling platform. DETAILED DESCRIPTION

[0023] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. The following embodiments are implemented based on the above technical solution of the present invention, and provide detailed implementation methods and specific operation processes, but the protection scope of the present invention is not limited to the following embodiments.

[0024] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0025] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0026] Example:

[0027] A method for peeling a bottom material strip of a die-cut product, wherein the die-cut product comprises a bottom material strip film 1, an adhesive layer 2 arranged on the bottom material strip film 1, and a top film layer 3 arranged on the adhesive layer 2, wherein the corner of the adhesive layer 2 is located at the front end of the conveying direction of the die-cut product. The peeling method comprises: conveying the die-cut product through a peeling platform 4, the front end of the peeling platform 4 is an acute angle structure, and pulling down the bottom material strip film 1 along the acute angle structure; wherein the corner of the adhesive layer 2 is a plane parallel to the front side edge of the acute angle structure.

[0028] In some specific embodiments, the adhesive layer 2 is a double-sided adhesive layer. The top film layer 3 is a handle film layer. The handle film layer extends out of the adhesive layer 2.

[0029] In some specific embodiments, to ensure that the bottom material strip film 1 is peeled off smoothly, the release weight of the top film layer 3 is greater than the release weight of the bottom material strip film 1. Preferably, the release weight of the top film layer 3 is greater than 5 times the release weight of the bottom material strip film 1.

[0030] In some specific embodiments, in order to ensure the peeling force effect, the acute angle structure is 30-60°, preferably 40-50°, and more preferably 45°.

[0031] In some specific embodiments, a plurality of adhesive layers 2 and a plurality of top film layers 3 are arranged in an array on the bottom material strip film 1 to simultaneously peel off a plurality of products and improve production efficiency.

[0032] The above description of the embodiments is to facilitate the understanding and use of the invention by those skilled in the art. It is obvious that those skilled in the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the present invention is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the present invention should be within the scope of protection of the present invention.

Claims

1. A method for peeling off a bottom material strip of a die-cut product, wherein the die-cut product comprises a bottom material strip film (1), an adhesive layer (2) arranged on the bottom material strip film (1), and a top film layer (3) arranged on the adhesive layer (2), wherein the corner of the adhesive layer (2) is located at the front end of the conveying direction of the die-cut product, characterized in that: The peeling method comprises: conveying the die-cut product through a peeling platform (4), the front end of the peeling platform (4) being an acute-angle structure, and pulling down the bottom material strip film (1) along the acute-angle structure; wherein the corner of the adhesive layer (2) is a plane parallel to the front edge of the acute-angle structure.

2. A method for peeling off the bottom material strip of a die-cut product according to claim 1, characterized in that: The adhesive layer (2) is a double-sided adhesive layer.

3. A method for peeling off the bottom material strip of a die-cut product according to claim 1, characterized in that: The top film layer (3) is a handle film layer.

4. A method for peeling off the bottom material strip of a die-cut product according to claim 1, characterized in that: The handle film layer extends out of the adhesive layer (2).

5. A method for peeling off the bottom material strip of a die-cut product according to claim 1, characterized in that: The release force gram weight of the top film layer (3) is greater than the release force gram weight of the bottom material strip film (1).

6. A method for peeling off the bottom material strip of a die-cut product according to claim 5, characterized in that: The release force of the top film layer (3) is 5 times greater than the release force of the bottom material strip film (1).

7. A method for peeling off the bottom material strip of a die-cut product according to claim 1, characterized in that: The acute angle structure is at an angle of 30 to 60 degrees.

8. A method for peeling off the bottom material strip of a die-cut product according to claim 7, characterized in that: The acute angle structure is at an angle of 40 to 50 degrees.

9. A method for peeling off the bottom material strip of a die-cut product according to claim 8, characterized in that: The acute angle structure is at an angle of 45°.

10. A method for peeling off the bottom material strip of a die-cut product according to claim 1, characterized in that: A plurality of adhesive layers (2) and a plurality of top film layers (3) are arranged in an array on the bottom material strip film (1).

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