Circuit board high-temperature adhesive tape and circuit board adhesive tape composite structure

Abstract

The invention discloses a circuit board high-temperature adhesive tape and a circuit board adhesive tape composite structure. The high-temperature adhesive tape comprises a bearing layer; the adhesive tape layer is bonded with the bearing layer and is suitable for being stripped from the bearing layer so as to be bonded to and cover the sound outlet hole of the circuit board; the cushion block is positioned between the bearing layer and the adhesive tape layer and is bonded with the adhesive tape layer; in a first direction parallel to the unfolding plane of the adhesive tape layer, the first end of the cushion block extends to the edge of the adhesive tape layer, the corresponding second end of the cushion block extends to a first area in the adhesive tape layer, and the first area corresponds to the sound hole of the circuit board; in the second direction perpendicular to the first direction and parallel to the unfolding plane of the adhesive tape layer, the cushion block is provided with a first edge extending from the second end to the first end, and the side face of the first edge is separated from the lower surface of the adhesive tape layer, so that an air passing channel is formed between the first area and the edge of the adhesive tape layer; the air channel is suitable for communicating the sound hole of the circuit board with the outside of the adhesive tape layer. The high-temperature adhesive tape for the circuit board can solve the problem that water vapor is generated at the sound hole when the circuit board passes through a furnace.

Description

Technical Field

[0001] The invention relates to the technical field of adhesive tapes, and in particular to a high-temperature adhesive tape for a circuit board and a composite structure of adhesive tape for a circuit board. Background Art

[0002] When a circuit board with a microphone sound hole is subjected to wave soldering or reflow soldering, a high-temperature tape needs to be pasted to cover the position of the microphone sound hole to prevent the sound hole from being damaged by high temperature during the furnace. However, the current high-temperature tape will completely seal the opening of the sound hole. When the circuit board is passed through the furnace, the high temperature will cause water vapor to be generated at the position of the sound hole. After passing through the furnace, the water vapor will form impurities, affecting the sound output effect of the microphone sound hole. Summary of the invention

[0003] The purpose of the present invention is to overcome the above-mentioned defects or problems existing in the background technology and to provide a circuit board high-temperature tape and a circuit board tape composite structure. The circuit board high-temperature tape can improve the problem of water vapor generated at the sound outlet position when the circuit board passes through the furnace.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] Technical solution 1: A high-temperature tape for a circuit board, which is used to be pasted and covered on the sound outlet of the circuit board, and is characterized in that it includes: a bearing layer; a tape layer, which is bonded to the bearing layer and is suitable for being peeled off from the bearing layer to be pasted and covered on the sound outlet of the circuit board; and a pad, which is located between the bearing layer and the tape layer and is bonded to the tape layer; in a first direction parallel to the unfolding plane of the tape layer, the first end of the pad extends to the edge of the tape layer, and its corresponding second end extends to a first area in the tape layer, and the first area corresponds to the sound outlet of the circuit board; in a second direction perpendicular to the first direction and parallel to the unfolding plane of the tape layer, the pad has a first edge extending from the second end to the first end, and the side of the first edge is separated from the lower surface of the tape layer to form an air passage between the first area and the edge of the tape layer; the air passage is suitable for connecting the sound outlet of the circuit board and the outside of the tape layer.

[0006] Technical solution 2 based on technical solution 1: the area range of the first area is consistent with the area range of the sound outlet hole of the circuit board; the second end of the pad has an overlapping part with the area range of the first area on the projection plane parallel to the first direction and the second direction.

[0007] Technical solution three based on technical solution two: along the second direction, the pad has a second edge corresponding to the first edge, the second edge extends from the second end to the first end, and the side of the second edge is separated from the lower surface of the tape layer to form the air passage between the first area and the edge of the tape layer.

[0008] Technical solution 4 based on technical solution 3: the second end is in an arc shape or a cone shape extending into the first area.

[0009] Technical solution five based on technical solution four: the first edge and the second edge are in a straight line shape extending along the first direction and connected with the second end, and the size of the two connecting points in the second direction is smaller than the size of the sound outlet in the second direction.

[0010] Technical solution six based on technical solution five: the pad is made of polyimide.

[0011] In addition, the present invention also provides Technical Solution 7: a circuit board tape composite structure, wherein the circuit board has a sound outlet hole, and wherein the structure further comprises a tape layer and a pad block in the high-temperature tape for the circuit board as described in any one of Technical Solutions 1 to 6; the tape layer and the pad block are pasted and covered on the sound outlet hole of the circuit board, and the second end of the pad block partially overlaps with the sound outlet hole, so as to connect the sound outlet hole and the outside of the tape layer through the air passage.

[0012] It can be seen from the above description of the present invention that, compared with the prior art, the present invention has the following beneficial effects:

[0013] Technical solution 1 provides a high-temperature tape for a circuit board, which includes a bearing layer, a tape layer and a pad. The bearing layer can use a release film to protect the tape layer and the pad. The tape layer is bonded to the bearing layer and can be peeled off from the bearing layer for use. When in use, the tape layer can be used to stick to cover the sound outlet of the circuit board; the pad is located between the bearing layer and the tape layer and is bonded to the tape layer, so that the bearing layer can move onto the circuit board with the tape layer, and the two ends of the pad in the first direction are distributed at the edge of the tape layer and the first area corresponding to the sound outlet, so that in the second direction, the first edge side of the pad is separated from the lower surface of the tape layer to form an air passage; when the circuit board generates water vapor at the sound outlet position due to passing through the furnace, the water vapor can be quickly discharged through the air passage to avoid water vapor accumulating at the sound outlet to form impurities and affect the sound effect. At the same time, because the air passage is very narrow, external solder and the like are not easy to enter the sound outlet; in addition, after the circuit board passes through the furnace, the high-temperature tape can be easily peeled off from the circuit board, and the pad is taken away at the same time, without affecting the normal use of the circuit board.

[0014] In technical solution two, the range of the first area is consistent with the range of the sound hole of the circuit board, and the second end of the pad overlaps with the first area on a specific projection plane, ensuring that the pad can better cover the area corresponding to the sound hole, thereby making the connection between the air passage and the sound hole more effective and more conducive to the discharge of water vapor, further enhancing the ability to prevent water vapor accumulation from affecting the sound effect, while also ensuring effective coverage and protection of the sound hole by the tape layer.

[0015] In technical solution three, along the second direction, the pad is provided with a second edge corresponding to the first edge, and the side surface of the second edge is separated from the lower surface of the tape layer to form an air passage, thereby increasing the path and area of ​​the air passage.

[0016] In technical solution four, the second end of the pad is in an arc or cone shape extending into the first area. This shape design is conducive to guiding water vapor to flow into the air passage, reducing the possibility of water vapor accumulation near the pad, optimizing the water vapor discharge path, and further enhancing the protection of the sound outlet from the influence of water vapor, ensuring a stable sound effect.

[0017] In technical solution five, the first edge and the second edge are designed to be straight lines and connected to the second end, and the size of the connection is smaller than the size of the sound hole, ensuring that the side of the second end will not block the air outlet of the sound hole, ensuring smooth communication between the sound hole and the air passage.

[0018] In technical solution six, the pad is made of polyimide material, which has good high temperature resistance and other properties. When the circuit board undergoes high temperature processes such as wave soldering or reflow soldering, the pad can maintain structural stability and will not be deformed or damaged due to high temperature, thereby ensuring the stable existence of the air passage.

[0019] Technical Solution Seven provides a circuit board tape composite structure, which includes a specific tape layer and a pad. The tape layer carries the pad to cover the sound hole, and the second end of the pad partially overlaps with the sound hole, utilizing the design of the pad and the air passage in the above-mentioned tape. In actual circuit board applications, effective coverage and protection of the sound hole is achieved. At the same time, through the reasonable overlap of the pad and the sound hole and the connectivity of the air passage, it is ensured that water vapor can be discharged smoothly during the circuit board furnace process, avoiding water vapor accumulation that affects the sound effect of the microphone sound hole, so that the circuit board can still maintain good sound performance after passing through a high-temperature process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 An exploded diagram of the structure of the high-temperature adhesive tape for a circuit board according to an embodiment of the present invention;

[0022] Figure 2 It is a schematic diagram of a roll of a high-temperature adhesive tape for a circuit board according to an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of a circuit board tape composite structure according to an embodiment of the present invention;

[0024] Figure 4 for Figure 3 A magnified view of part A;

[0025] Figure 5 It is a side view of a circuit board tape composite structure involved in an embodiment of the present invention.

[0026] Description of main reference numerals:

[0027] Circuit board 1; sound outlet 2; bearing layer 3; tape layer 4; pad 5; first end 6; second end 7; first area 8; first edge 9; air passage 10; second edge 11. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are preferred embodiments of the present invention and should not be regarded as excluding other embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] In the claims, description and the above-mentioned drawings of the present invention, unless otherwise clearly defined, the use of terms such as "first", "second" or "third" etc. are for distinguishing different objects rather than for describing a specific order.

[0030] In the claims, specification and the above-mentioned drawings of the present invention, unless otherwise explicitly defined, directional words, such as the terms "center", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inside", "outside", "up", "down", "front", "back", "left", "right", "clockwise", "counterclockwise", etc., indicating directions or positional relationships are based on the directions and positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the specific protection scope of the present invention.

[0031] In the claims, specification and the above drawings of the present invention, unless otherwise clearly defined, if the term "fixed connection" or "fixed connection" is used, it should be understood in a broad sense, that is, any connection method without a displacement relationship and relative rotation relationship between the two, that is to say, including non-detachable fixed connection, detachable fixed connection, integrated connection and fixed connection through other devices or elements.

[0032] In the claims, description and drawings of the present invention, if the terms "include", "have" and their variations are used, they are intended to mean "including but not limited to".

[0033] The embodiment of the present invention relates to a circuit board high temperature tape, which is used to stick and cover the sound outlet 2 of the circuit board 1. In addition, the embodiment of the present invention also relates to a circuit board high temperature tape composite structure, which adopts the above-mentioned circuit board high temperature tape.

[0034] Among them, in the above-mentioned circuit board high temperature tape and circuit board high temperature tape composite structure, the circuit board 1 referred to is a circuit board 1 applied to a microphone, that is, a circuit board 1 with sound receiving and sound emitting functions. On the circuit board 1, a sound outlet 2 for sound emission is provided. The sound outlet 2 is a blind hole, which has a hole edge only on one side of the circuit board 1, and penetrates a certain depth into the circuit board 1 and does not penetrate to the surface of the other side of the circuit board 1. When the circuit board 1 is passed through the furnace for soldering, it is necessary to stick a high temperature tape on the position of the sound outlet 2 of the circuit board 1 to avoid the sound outlet 2 from being damaged by high temperature and to prevent solder and the like from entering the sound outlet 2. However, after the current high temperature tape is pasted and covered on the sound outlet 2 of the circuit board 1, the water vapor generated during the furnace will condense into moisture or impurities after cooling, affecting the sound effect of the microphone.

[0035] Reference Figure 1 The circuit board high temperature tape comprises a bearing layer 3, a tape layer 4 and a pad 5. The tape layer 4 is bonded to the bearing layer 3 and is suitable for being peeled off from the bearing layer 3 to be pasted and covered on the sound outlet 2 of the circuit board 1; the pad 5 is located between the bearing layer 3 and the tape layer 4 and is bonded to the tape layer 4.

[0036] Among them, the bearing layer 3 is a release film, which is used as a bearing platform for the tape layer 4 and the pad 5 during the production, manufacturing process and use of the high-temperature tape to prevent the adhesive material on the lower surface of the tape layer 4 from becoming ineffective or contaminated with debris. The tape layer 4 is bonded to the upper surface of the bearing layer 3. The tape layer 4 is made of a material that can withstand high temperatures and has an adhesive material on its lower surface so that the tape layer 4 can be bonded to the bearing layer 3 or the circuit board 1. In addition, the tape layer 4 is designed to have a specific shape so that the tape layer 4 can adapt to a specific area of ​​the circuit board 1 where the sound outlet 2 is set. In this embodiment, the portion of the tape layer 4 used to bond to the circuit board 1 can be roughly regarded as a rectangular shape, and a first area 8 is set in the middle position of the rectangular shape, and the first area 8 corresponds to the sound outlet 2 on the circuit board 1. Of course, the first area 8 may not be specifically shown in the tape layer 4, and its specific position is anchored by the sound outlet 2 on the circuit board 1. Moreover, the area range of the first area 8 is consistent with the area range of the sound outlet hole 2 of the circuit board 1. For example, when the upper edge of the sound outlet hole 2 is circular, the area range of the first area 8 is a circle with the same size.

[0037] In addition, in a first direction parallel to the unfolding plane of the tape layer 4, the first end 6 of the cushion block 5 extends to the edge of the tape layer 4, and the corresponding second end 7 extends to the first area 8 in the tape layer 4, and the first area 8 corresponds to the sound outlet 2 of the circuit board 1; in a second direction perpendicular to the first direction and parallel to the unfolding plane of the tape layer 4, the cushion block 5 has a first edge 9 extending from the second end 7 to the first end 6, and the side of the first edge 9 is separated from the lower surface of the tape layer 4, so as to form an air passage 10 between the first area 8 and the edge of the tape layer 4; the air passage 10 is suitable for connecting the sound outlet 2 of the circuit board 1 and the outside of the tape layer 4. In addition, along the second direction, the cushion block 5 has a second edge 11 corresponding to the first edge 9, the second edge 11 extends from the second end 7 to the first end 6, and the side of the second edge 11 is separated from the lower surface of the tape layer 4, so as to form the air passage 10 between the first area 8 and the edge of the tape layer 4.

[0038] Furthermore, along the second direction, the cushion block 5 has a second edge 11 corresponding to the first edge 9, the second edge 11 extends from the second end 7 to the first end 6, and the side surface of the second edge 11 is separated from the lower surface of the tape layer 4, so as to form the air passage 10 between the first region 8 and the edge of the tape layer 4. The second end 7 of the cushion block 5 has an overlapping portion with the area range of the first region 8 on the projection plane parallel to the first direction and the second direction.

[0039] Meanwhile, the second end 7 is in an arc shape or a cone shape extending into the first area 8. The first edge 9 and the second edge 11 are in a straight line shape extending along the first direction and connected with the second end 7, and the size of the two connecting parts in the second direction is smaller than the size of the sound outlet 2 in the second direction.

[0040] Specifically, it is necessary to first explain the above-mentioned orientation. Figure 4 , which shows the specific directions of the first direction and the second direction. The first direction refers to a direction on the plane where the unfolding direction of the tape layer 4 is located, and a second direction is defined corresponding to the first direction, which is also located on the unfolding plane of the tape layer 4, and the second direction is perpendicular to the first direction.

[0041] In addition, refer to Figure 1 and Figure 4 The pad 5 is in the shape of a flat strip, and its thickness can be adjusted according to the specific situation. The material is preferably polyimide. This material has good high temperature resistance and other properties, so that the pad 5 can maintain a stable structure when the circuit board 1 undergoes high temperature processes such as wave soldering or reflow soldering, and will not be deformed or damaged due to high temperature, thereby ensuring the stable existence of the gas passage 10.

[0042] In this embodiment, the extension direction of the pad 5 is the first direction, and the pad 5 is respectively formed with a first end 6 and a second end 7 in the first direction, the first end 6 extends to a side edge of the tape layer 4 in the first direction, and the second end 7 extends to a first area 8 defined on the tape layer 4. In this embodiment, the first end 6 of the pad 5 is a straight line shape corresponding to the edge of the tape layer 4, and the side of the first end 6 is flush with the edge of the tape layer 4; the second end 7 of the pad 5 is an arc shape, and the two ends of the arc are smoothly connected with the ends of the first edge 9 and the second edge 11. In addition, the second end 7 of the pad 5 extends into the first area 8, Figure 4 The portion corresponding to the sound hole 2 on the circuit board 1 is the portion of the first area 8 on the tape layer 4 in the high-temperature tape of the circuit board. The portion of the second end 7 of the pad 5 that extends does not exceed the center of the circle of the first area 8, that is, the portion of the pad 5 that overlaps with the area range of the first area 8 on the preset projection surface only occupies a small portion of the area range of the first area 8. The range of the first area 8 is consistent with the range of the sound hole 2 of the circuit board 1, and the second end 7 of the pad 5 overlaps with the first area 8 on the specific projection surface, which ensures that the pad 5 can better cover the area corresponding to the sound hole 2, thereby making the connection between the air passage 10 and the sound hole 2 more effective, more conducive to the discharge of water vapor, and further improving the ability to prevent water vapor accumulation from affecting the sound effect, while also ensuring the effective coverage and protection of the tape layer 4 on the sound hole 2.

[0043] In another embodiment, the shape of the second end 7 can be set to be a cone, that is, a triangle with a pointed tip, the pointed part of which extends into the first area 8, and has an overlapped portion with the first area 8 on the preset projection surface, and these overlapped portions also occupy a smaller portion in the area range of the first area 8. The second end 7 of the cushion block 5 is in an arc shape or a cone shape extending into the first area 8. This shape design is conducive to guiding water vapor to flow toward the air passage 10, reducing the possibility of water vapor accumulation near the cushion block 5, optimizing the path of water vapor discharge, and further enhancing the protection of the sound outlet 2 from the influence of water vapor, ensuring a stable sound effect.

[0044] Reference Figure 4 In the second direction, the cushion block 5 is formed with a first edge 9 and a second edge 11. The first edge 9 and the second edge 11 are both straight lines, and the same end of the first edge 9 and the second edge 11 in the first direction is connected to the two ends of the second end 7 of the cushion block 5, and the same end of the first edge 9 and the second edge 11 on the other side of the first direction is connected to the two ends of the first end 6 of the cushion block 5. In addition, the distance between the two ends of the second end 7 of the cushion block 5 in the second direction is smaller than the size of the first area 8 in the second direction, ensuring that the side of the second end 7 will not block the air outlet of the sound outlet 2, ensuring smooth communication between the sound outlet 2 and the air passage 10.

[0045] Reference Figure 5 It is easy to know that, since the pad 5 has a certain thickness, and the tape layer 4 is tensionedly bonded to the upper surface of the pad 5, the tape layer 4 is separated from the first edge 9 and the second edge 11 of the pad 5. This defines two air passages 10 through the pad 5 and the tape layer 4. The air passage 10 is connected to the first area 8 through the second end 7 of the pad 5 at one end in the first direction, and is connected to the outside of the tape layer 4 through the first end 6 of the pad 5 at the other end in the first direction. In addition, the size of the air passage 10 is related to the thickness of the pad 5. By increasing the number of air passages 10, the overall path and area of ​​the air passage 10 are increased, and the water vapor at the position of the sound outlet 2 is more easily discharged from the position of the air passage 10.

[0046] Reference Figure 2 During the manufacturing process, the shape of the tape layer 4 can be cut on the release film by a cutting device; at the same time, the pad 5 can be pre-cut into a required shape, and during the cutting process, the pad 5 is fixed between the tape layer 4 and another release film serving as the carrier layer 3.

[0047] The above-mentioned high-temperature tape for circuit boards includes a bearing layer 3, a tape layer 4 and a pad 5. The bearing layer 3 can use a release film to protect the tape layer 4 and the pad 5. The tape layer 4 is bonded to the bearing layer 3 and can be peeled off from the bearing layer 3 for use. When in use, the tape layer 4 can be used to stick to cover the sound outlet hole 2 of the circuit board 1; the pad 5 is located between the bearing layer 3 and the tape layer 4 and is bonded to the tape layer 4, so that the bearing layer 3 can move to the circuit board 1 with the tape layer 4, and the two ends of the pad 5 in the first direction are distributed at the edge of the tape layer 4 and the first area 8 corresponding to the sound outlet hole 2, so that In the second direction, an air passage 10 is formed by separating the side surface of the first edge 9 of the pad 5 from the lower surface of the tape layer 4; when the circuit board 1 generates water vapor at the position of the sound outlet 2 due to passing through the furnace, the water vapor can be quickly discharged through the air passage 10 to prevent the water vapor from accumulating at the sound outlet 2 to form impurities that affect the sound effect. At the same time, since the air passage 10 is very narrow, it is not easy for external solder to enter the sound outlet 2; in addition, after the circuit board 1 passes through the furnace, the high-temperature tape can be easily peeled off from the circuit board 1, and the pad 5 can be taken away at the same time, which will not affect the normal use of the circuit board 1.

[0048] In addition, an embodiment of the present invention also relates to a high-temperature tape composite structure for a circuit board, wherein the circuit board 1 has a sound outlet hole 2, and also includes a tape layer 4 and a pad block 5 in the above-mentioned high-temperature tape for the circuit board; the tape layer 4 carries the pad block 5 and is pasted and covered on the sound outlet hole 2 of the circuit board 1, and the second end 7 of the pad block 5 partially overlaps with the sound outlet hole 2, so as to connect the sound outlet hole 2 and the outside of the tape layer 4 through the air passage 10.

[0049] When using, refer to Figure 3 and Figure 4 , peel off the tape layer 4 together with the pad 5 from the bearing layer 3, align with the sound hole 2 on the circuit board 1, and stick the tape layer 4 tightly to cover the accurate position. At this time, the second end 7 of the pad 5 will cover a part of the sound hole 2, and connect the sound hole 2 with the two air passages 10. When the circuit board 1 is passed through the furnace, the water vapor at the position of the sound hole 2 can be discharged to the outside through the air passage 10, and at the same time, it is difficult for external materials such as solder to enter the position of the sound hole 2 through the air passage 10. In the actual application of the circuit board 1, effective coverage and protection of the sound hole 2 is achieved. At the same time, through the reasonable overlap of the pad 5 and the sound hole 2 and the connection of the air passage 10, it is ensured that the water vapor can be discharged smoothly during the process of the circuit board 1 passing through the furnace, avoiding the accumulation of water vapor to affect the sound effect of the microphone sound hole 2, so that the circuit board 1 can still maintain good sound performance after passing through the high-temperature process.

[0050] The description of the above specification and embodiments is used to explain the protection scope of the present invention, but does not constitute a limitation on the protection scope of the present invention. Through the enlightenment of the present invention or the above embodiments, ordinary technicians in this field can obtain modifications, equivalent substitutions or other improvements to the embodiments of the present invention or part of the technical features thereof through logical analysis, reasoning or limited experiments, which should be included in the protection scope of the present invention.

Claims

1. A circuit board high temperature adhesive tape, used for pasting and covering the sound outlet (2) of the circuit board (1), characterized in that it comprises: A bearing layer (3); an adhesive tape layer (4) which is bonded to the carrier layer (3) and is suitable for being peeled off from the carrier layer (3) to be adhered to and cover the sound outlet hole (2) of the circuit board (1); and A cushion block (5), which is located between the bearing layer (3) and the adhesive tape layer (4) and is bonded to the adhesive tape layer (4); In a first direction parallel to the unfolding plane of the tape layer (4), the first end (6) of the cushion block (5) extends to the edge of the tape layer (4), and the corresponding second end (7) extends to a first area (8) in the tape layer (4), and the first area (8) corresponds to the sound outlet (2) of the circuit board (1); in a second direction perpendicular to the first direction and parallel to the unfolding plane of the tape layer (4), the cushion block (5) has a first edge (9) extending from the second end (7) to the first end (6), and the side surface of the first edge (9) is separated from the lower surface of the tape layer (4) to form an air passage (10) between the first area (8) and the edge of the tape layer (4); the air passage (10) is suitable for connecting the sound outlet (2) of the circuit board (1) and the outside of the tape layer (4).

2. A high temperature adhesive tape for circuit boards as claimed in claim 1, characterized in that: The area range of the first area (8) is consistent with the area range of the sound outlet hole (2) of the circuit board (1); the second end (7) of the cushion block (5) has an overlapping portion with the area range of the first area (8) on a projection plane parallel to the first direction and the second direction.

3. A high temperature adhesive tape for circuit boards as claimed in claim 2, characterized in that: Along the second direction, the cushion block (5) has a second edge (11) corresponding to the first edge (9), the second edge (11) extends from the second end (7) to the first end (6), and the side surface of the second edge (11) is separated from the lower surface of the tape layer (4) to form the air passage (10) between the first area (8) and the edge of the tape layer (4).

4. A high temperature adhesive tape for circuit boards as claimed in claim 3, characterized in that: The second end (7) is in an arc shape or a cone shape extending into the first area (8).

5. A high temperature adhesive tape for circuit boards as claimed in claim 4, characterized in that: The first edge (9) and the second edge (11) are in the form of straight lines extending in the first direction and connected to the second end (7), and the dimensions of the two connecting points in the second direction are smaller than the dimensions of the sound outlet hole (2) in the second direction.

6. A high temperature adhesive tape for circuit boards as claimed in claim 5, characterized in that: The cushion block (5) is made of polyimide.

7. A circuit board tape composite structure, wherein the circuit board (1) has a sound outlet hole (2), characterized in that: It also includes a tape layer (4) and a pad (5) in the high-temperature tape for circuit boards as described in any one of claims 1 to 6; the tape layer (4) carrying the pad (5) is pasted and covered on the sound outlet (2) of the circuit board (1), and the second end (7) of the pad (5) partially overlaps with the sound outlet (2), so as to connect the sound outlet (2) and the outside of the tape layer (4) through the air passage (10).

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