Epoxy construction device and method for bottom surface of wafer plate of clean room

Abstract

The invention provides an epoxy construction device and method for the bottom face of a wafer plate of a clean room, and belongs to the technical field of epoxy construction of the bottom face of the wafer plate. The epoxy construction device and method for the bottom face of the wafer plate of the clean room comprise a formwork frame, a pressing plate, a supporting assembly, an injection assembly, an exhaust assembly and an infrared assembly; the fixing plates are fixed around the waffle plate; the pressing plate is arranged on one side of the template frame and corresponds to the waffle plate in position; the template frame, the pressing plate and the bottom surface of the waffle plate form a sealing structure; the supporting assembly is fixed to the bottom of the formwork frame and used for pushing the pressing plate upwards so that an epoxy curing gap can be formed between the pressing plate and the waffle plate. The pouring assemblies are arranged on the left side and the right side of the formwork frame correspondingly. The problems that in the construction process of the bottom face of a waffle plate, formwork expansion and falling are prone to occurring can be solved.

Description

Technical Field

[0001] The invention belongs to the technical field of epoxy construction on the bottom surface of a waffle plate, and in particular relates to a device and a method for epoxy construction on the bottom surface of a waffle plate in a clean room. Background Art

[0002] With the rapid development of information technology, the construction of electronic factories such as panel factories and IC factories has reached a peak in recent years. Among them, the design and construction of IC (chip / semiconductor industry) factories are more complicated than ordinary processing factories, and the requirements for construction quality are also higher. The most significant difference between chip factories and ordinary factories lies in their core structure-clean rooms. In order to ensure the air cleanliness of large-scale production workshops, chip factories need to establish sophisticated and complex clean air conditioning and ventilation systems. In order to meet this demand, a large number of holes are usually evenly reserved in the workshop floor to form a return air channel to achieve efficient air circulation and filtration. The waffle board floor is an ideal choice to meet this demand. Traditional waffle tubes are made of materials such as SMC and FRP resin, which are used as both templates and as part of the engineering entity.

[0003] However, the existing clean room detachable waffle board bottom surface is prone to bulging and falling defects during the construction process, resulting in unqualified flatness of the overall waffle board bottom surface, which not only affects the aesthetics of the entire building, but also affects the acceptance of the entire building construction. Summary of the invention

[0004] In view of this, the present invention provides an epoxy construction device and method for the bottom surface of a clean room waffle plate, which can solve the problem that the bottom surface of the waffle plate is prone to mold expansion and falling during the construction process.

[0005] The present invention is achieved in that:

[0006] The present invention provides an epoxy construction device for the bottom surface of a clean room waffle plate, wherein the device comprises a template frame, a pressing plate, a support component, a pouring component, an exhaust component and an infrared component, wherein the template frame has the same shape as the waffle plate and is fixed around the waffle plate; the pressing plate is arranged at a side position of the template frame and is arranged corresponding to the position of the waffle plate; the template frame, the pressing plate and the bottom surface of the waffle plate form a sealing structure; the support component is fixed to the bottom of the template frame, and the support component is used to push the pressing plate upward so that an epoxy curing gap is formed between the pressing plate and the waffle plate; the pouring components are arranged on both sides of the template frame, and the pouring components are used to pour epoxy glue between the pressing plate and the waffle plate; the exhaust component is arranged in the pouring component, and the exhaust component is used to evacuate the poured epoxy glue to accelerate its curing speed; the infrared component is arranged on a side of the pressing plate close to the waffle plate, and is used to further reinforce the curing of the epoxy glue.

[0007] The technical effect of the clean room waffle board bottom epoxy construction device provided by the present invention is as follows: the device can enclose a single waffle board of the same area for epoxy glue construction, and the advantages are as follows:

[0008] Uniform glue thickness: The enclosed area is the same, ensuring that the glue layer thickness of each waffle board is consistent, which helps to achieve a uniform surface effect, avoid strength differences caused by uneven thickness, and improve construction quality.

[0009] Improve adhesion: Uniform glue thickness can enhance the adhesion and bonding strength between the epoxy glue and the waffle board, reduce the risk of peeling and falling off, extend the service life, and enhance the stability of the overall structure.

[0010] Reduce bubble generation: Injecting epoxy glue into specific areas of size can reduce air entry, thereby reducing the generation of bubbles and ensuring the smoothness, transparency and density of the epoxy layer.

[0011] Convenient control of construction progress: The enclosed area allows construction workers to better control the amount of glue used and the degree of drying, preventing the glue from curing too slowly.

[0012] Easy to manage and maintain: The enclosed area makes the construction more centralized, easier to manage and monitor, and less susceptible to external interference during the construction process, ensuring a smooth construction process.

[0013] Reduce material waste: The enclosed construction method can maximize the use of epoxy glue, better control the amount of epoxy glue used, reduce excess glue waste, and reduce construction costs; it can also prevent the loss of epoxy glue during the pouring process, ensuring that each waffle board can be fully covered.

[0014] Facilitate subsequent processing: After the construction is completed, the enclosed area can be more conveniently cleaned and processed, ensuring a clean and safe construction site.

[0015] Improved aesthetics: Uniform glue thickness and smooth surface can improve the overall aesthetics, making the floor look more professional and neat.

[0016] Easy to inspect quality: Uniform glue thickness facilitates later inspection and evaluation of construction quality to ensure that design and use requirements are met.

[0017] On the basis of the above technical solution, the epoxy construction device for the bottom surface of the clean room waffle plate of the present invention can also be improved as follows:

[0018] The supporting assembly includes a push column, a push plate and a cylinder. The push column includes a plurality of push columns, one end of which is fixedly connected to a side of the pressing plate away from the waffle plate, and the other end is fixedly connected to the push plate; the output shaft of the cylinder is fixed to a side of the push plate away from the push column, and is used to push the push plate to move toward one side of the waffle plate;

[0019] The push column is arranged near the pressing plate and on both sides of the push plate as a trumpet-shaped structure for balancing the force, and the cross-sectional area at the center is smaller than the cross-sectional area at the two sides;

[0020] The plurality of push pins are arranged on the pressing plate in a sinusoidal structure.

[0021] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: multiple push columns can apply uniform pressure to keep the laminate in contact with the epoxy glue flat and ensure the uniform thickness of the glue layer. Multiple push columns can increase the firmness of the laminate and prevent deformation or tilting during the glue pouring process; multiple push columns can make the laminate flatter, making the epoxy glue more uniform during the pouring process and reducing the unevenness of the epoxy glue; the setting of the push column can effectively prevent the laminate from warping or deformation during the curing process of the epoxy glue, thereby improving the quality of the epoxy layer. By providing uniform support, the probability of defects such as bubbles and wrinkles during the construction process is reduced, and the quality of the finished product is improved. The two ends of the push column are trumpet-shaped, and the trumpet-shaped ends can better distribute the pressure evenly to the contact surface, reduce local stress concentration, and thus improve the stability of the structure; the narrower design of the middle part helps to reduce the overall weight of the push column, facilitate the operation of construction personnel, and reduce material costs.

[0022] Further, the push plate includes a top plate, a bottom plate and a flexible layer, the top plate and the flexible layer are fixedly connected to the push column and the output shaft of the cylinder respectively, the flexible layer is arranged between the top plate and the bottom plate, and is used to balance the force transmitted from the cylinder to the bottom plate on the flexible layer, so that the force received by the top plate and transmitted to the pressing plate through the push column is evenly applied on the plane of the pressing plate;

[0023] The thickness of the bottom plate is 1.5-2.5 times the thickness of the top plate.

[0024] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: the flexible layer can effectively distribute the pressure applied from below to the upper structure evenly, avoiding local stress concentration and reducing the risk of structural damage. By transmitting balanced force, fatigue and wear of the structure are reduced, which helps to extend the service life of the entire system. The flexible layer can provide additional support and increase the overall stability of the upper structure, especially when facing uneven loads.

[0025] Furthermore, the pouring assembly includes an epoxy hose and a pouring pump, one end of the epoxy hose is connected to the side wall of the template frame, and the other end is inserted into the bottom of the epoxy storage tank, and the epoxy hose is gradually drawn out of the epoxy storage tank by the pouring pump and poured into the space between the pressing plate and the waffle plate;

[0026] The epoxy hose has a wavy structure and is used to perform multiple collisions on the extracted epoxy to expel bubbles;

[0027] The end position of the epoxy hose connected to the template frame adopts a semi-parabolic structure, and its focal position is located at the center position of the pressing plate and the waffle plate in the vertical direction, so as to reduce the impact of the epoxy hose on the waffle plate and the pressing plate;

[0028] The filling pump is connected to the epoxy glue storage tank and is used to extract epoxy glue from the storage tank and pump it into the epoxy glue hose; the filling pump includes a cavity, a first valve, a second valve, an impact plate and a compression spring, the cavity is arranged in the connecting pipe, the first valve is arranged on a side of the cavity close to the epoxy glue storage tank, the second valve is arranged on a side of the cavity close to the epoxy glue hose, the first valve includes a first valve plate, a first valve cavity and a first valve shaft, the upper end surface of the first valve plate is connected to the first valve shaft, the first valve shaft passes through the first valve cavity and is connected to the impact plate, the first valve cavity is arranged on the side of the cavity The first valve shaft is movably connected to the impact plate bracket, and the impact plate bracket is fixedly connected to the first valve hole in the first valve cavity; the second valve comprises a second valve plate, a second valve cavity and a second valve shaft, the left end face of the second valve plate is connected to the second valve shaft, the right end face of the second valve shaft is connected to the compression spring, the second valve shaft axially moves into the valve sleeve and moves the second valve plate into the second valve cavity, the valve sleeve is fixedly connected to the second valve hole of the second valve cavity, and the first valve hole and the second valve hole are connected to the outside; an accumulator is also provided, and the accumulator is provided between the cavity and the second valve;

[0029] A multi-stage plate is arranged inside the filling pump, which is used to further eliminate bubbles inside the epoxy glue through the collision between the epoxy glue and the multi-stage plate.

[0030] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: the epoxy hose has a wavy structure, which can produce multiple collisions during the flow of the epoxy glue, increasing the disturbance of the liquid, thereby effectively causing the bubbles to rise and discharge and reducing the residual bubbles. The wavy design can improve the fluidity of the epoxy glue, making the flow of the colloid in the tube smoother, reducing the risk of blockage and improving the extraction efficiency. Under the influence of the wavy structure, the contact time between the epoxy glue and the air increases, which helps to improve the uniformity of the material and ensure the performance consistency of the finished product. The wavy pipe can reduce the resistance caused by excessive viscosity of the epoxy glue during flow, allowing the colloid to pass through the pipe more smoothly and improve work efficiency. Multiple collision processes reduce the risk of gelation and maintain the effectiveness of the epoxy glue.

[0031] Furthermore, a reinforcing tube is provided inside the epoxy hose, and the reinforcing tube is sleeved inside the epoxy hose, and the reinforcing tube and the side wall of the epoxy hose form an exhaust component; the thickness of the exhaust component is small at a position where the curvature of the epoxy hose is large, and large at a position where the curvature of the epoxy hose is small, and is used to increase the curvature of the epoxy hose to increase shear force and turbulence, and enhance the bursting of bubbles in the liquid; a spiral texture is provided on the inner wall of the reinforcing tube, and is used to guide the bubbles to flow along the spiral texture path so that the bubbles are separated from the fluid; and the discharge of bubbles in the epoxy glue is used to accelerate its curing speed.

[0032] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: the exhaust assembly makes the epoxy hose have a greater curvature, which can increase the disturbance and turbulence in the flow of epoxy glue, promote the rising speed of bubbles, and make bubbles easier to be discharged. The increased curvature makes the flow path of epoxy glue in the tube more complicated, thereby improving the mixing of flow and reducing the residual bubbles in the colloid. The wavy curved structure makes the epoxy glue collide multiple times in the tube, which helps bubbles to gather and eventually discharge, reducing the impact of bubbles on the performance of the glue.

[0033] Furthermore, a reinforcing rib is provided on one side of the pressing plate close to the supporting assembly to ensure its strength; a demoulding layer is provided on one side of the pressing plate close to the waffle plate;

[0034] The infrared component includes an infrared lamp group and an isolation layer, the isolation layer is fixed on the side wall of the pressing plate, and the infrared lamp group is fixed between the isolation layer and the inner wall of the pressing plate, and is used to quickly cure the epoxy adhesive by infrared lamps;

[0035] A curing portion is arranged between the isolation layer and the waffle plate.

[0036] The beneficial effects of adopting the above-mentioned improvement scheme are as follows: the infrared lamp group can significantly shorten the curing time of the epoxy adhesive, so that it can reach sufficient strength in a short time and quickly complete construction and production. The energy of the infrared lamp group is concentrated and efficient, and can complete curing in a shorter time, reducing energy consumption. Infrared radiation can evenly penetrate the surface of the epoxy adhesive, so that the curing effect is consistent, avoiding local over-curing or under-curing. The rapid curing process can improve the adhesion between the epoxy adhesive and the substrate, and enhance the strength and durability of the overall structure. During the curing process, the thermal radiation of the infrared lamp group can reduce the generation of bubbles in the colloid and improve the quality and appearance of the finished product.

[0037] Furthermore, a sealing strip is provided at the edge of the template frame, and the sealing strip is an L-shaped structure, which is used to cover the edge of the waffle plate to prevent the epoxy glue from dripping during the curing process;

[0038] A sliding track is arranged at the position where the template frame is connected to the pressing plate, and a scale line is arranged at the edge of the sliding track.

[0039] The beneficial effects of adopting the above improvement scheme are as follows: preventing epoxy glue from dripping can reduce the subsequent repair and cleaning work, save manpower and time, and improve overall production efficiency. The use of sealing strips can keep the bonding area neat and prevent excess glue from flowing out, thereby improving the appearance quality of the final product. Preventing epoxy glue from dripping onto the ground or equipment reduces the risk of slipping or equipment damage and improves the safety of the working environment.

[0040] The present invention provides a method for epoxy coating the bottom surface of a clean room waffle plate, wherein the specific steps include:

[0041] S01: Setting up movable scaffolding;

[0042] S02: Waffle slab beam bottom elevation measurement and line drawing;

[0043] S03: Fully enclosed enclosure on site;

[0044] S04: Chisel out the redundant concrete at the bottom of the waffle slab beam;

[0045] S05: Re-measurement of bottom elevation of waffle slab beam;

[0046] S06: Treatment of fallen stirrups;

[0047] S07: Treatment of floating dust at the bottom of waffle slab beam;

[0048] S08: fixing the template frame at the edge of the waffle plate, and pushing the pressed plate to a specified height through the supporting assembly;

[0049] S09: applying a first layer of epoxy primer at the bottom of the waffle plate beam through the injection assembly;

[0050] S10: After the first layer is fixed, a second layer of epoxy primer is applied to the bottom of the waffle plate beam through the injection assembly;

[0051] S11: after curing, the formwork frame is removed;

[0052] S12: Grind the bottom of the waffle plate;

[0053] S13: enclosure removal;

[0054] S14: Removal of scaffolding in the hall;

[0055] S15: Ground cleaning.

[0056] On the basis of the above technical solution, the epoxy construction method for the bottom surface of a clean room waffle plate of the present invention can also be improved as follows:

[0057] Furthermore, the specific steps of applying epoxy primer at the bottom of the waffle plate beam include:

[0058] The first step is to push the pressing plate to a specified height and then let it stand;

[0059] The second step is to inject epoxy primer between the waffle plate and the pressing plate through the epoxy hose;

[0060] The third step is to irradiate the epoxy primer with the infrared lamp group to accelerate its curing.

[0061] Furthermore, the specific steps of measuring the bottom elevation of the waffle plate beam and marking the line include:

[0062] The first step is to use a laser rangefinder to accurately measure the height of each key point at the bottom of the waffle slab beam;

[0063] The second step is to draw the corresponding elevation line on the bottom of the beam according to the measured data;

[0064] The third step is to repeatedly check and verify the elevation line;

[0065] The specific steps of repeatedly checking and verifying the elevation line include:

[0066] The first step is to use a level to measure the height of the key points at the bottom of the beam again;

[0067] The second step is to compare the retested data with the initial measured data to analyze whether there are significant differences.

[0068] Compared with the prior art, the epoxy construction device and method for the bottom surface of the waffle plate in a clean room provided by the present invention have the following beneficial effects: effectively solving the problems of mold expansion and falling of the bottom surface of the detachable waffle plate in the clean room during the construction process, not only improving the flatness and aesthetics of the bottom surface of the waffle plate, but also improving the quality and efficiency of the construction, reducing the construction cost, and ensuring the smooth acceptance of the entire construction; through precise measurement and line drawing, as well as the mixing and repair of epoxy mortar, it is ensured that the elevation and surface quality of the bottom of the waffle plate beam meet the design requirements, and the aesthetics and overall quality of the building are improved; through fully enclosed enclosure and regular maintenance and inspection, the impact of construction on the surrounding environment is reduced, and the service life of the bottom surface of the waffle plate is extended; by re-measuring the elevation of the bottom of the waffle plate beam, it is ensured that the height control during the construction process meets the requirements, avoiding quality problems caused by height errors, and improving construction accuracy and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0070] Figure 1 It is a cross-sectional view of an epoxy construction device for the bottom surface of a clean room waffle plate;

[0071] Figure 2 It is a flow chart of a method for epoxy construction on the bottom surface of a clean room waffle board;

[0072] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0073] 10. Formwork frame; 20. Pressing plate; 30. Support assembly; 31. Push column; 32. Push plate; 321. Top plate; 322. Bottom plate; 323. Flexible layer; 33. Cylinder; 40. Filling assembly; 41. Epoxy hose; 50. Exhaust assembly; 60. Infrared assembly; 61. Infrared lamp assembly; 62. Isolation layer. DETAILED DESCRIPTION

[0074] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0075] like Figure 11 is a schematic diagram of a structure of an epoxy construction device for the bottom surface of a clean room waffle board provided by the present invention. In this structure, it includes a template frame 10, a pressing plate 20, a support assembly 30, a pouring assembly 40, an exhaust assembly 50 and an infrared assembly 60. The template frame 10 has the same shape as the waffle board and is fixed around the waffle board; the pressing plate 20 is arranged at one side of the template frame 10 and corresponds to the position of the waffle board; the template frame 10, the pressing plate 20 and the bottom surface of the waffle board form a sealing structure; a support assembly 30 is fixed to the bottom of the template frame 10. The support assembly 30 is used to push the pressing plate 20 upward so that an epoxy curing gap is formed between the pressing plate 20 and the waffle plate; the left and right sides of the template frame 10 are provided with filling assemblies 40, and the filling assemblies 40 are used to fill epoxy glue between the pressing plate 20 and the waffle plate; the filling assembly 40 is provided with an exhaust assembly 50, and the exhaust assembly 50 is used to evacuate the injected epoxy glue to accelerate its curing speed; the side of the pressing plate 20 close to the waffle plate is provided with an infrared assembly 60, which is used to further reinforce the curing of the epoxy glue.

[0076] Among them, in the above technical solution, the support assembly 30 includes a push column 31, a push plate 32 and a cylinder 33. The push column 31 includes a plurality of push columns, one end of which is fixedly connected to the side of the pressing plate 20 away from the waffle plate, and the other end is fixedly connected to the push plate 32; the output shaft of the cylinder 33 is fixed to the side of the push plate 32 away from the push column 31, and is used to push the push plate 32 to move toward one side of the waffle plate;

[0077] The push column 31 is arranged near the pressing plate 20 and both sides of the push plate 32 as a trumpet-shaped structure for balancing the force, and the cross-sectional area at the center position is smaller than the cross-sectional area at the two sides;

[0078] The plurality of push pins 31 are arranged on the pressing plate 20 in a sinusoidal structure.

[0079] Further, in the above technical solution, the push plate 32 includes a top plate 321, a bottom plate 322 and a flexible layer 323. The top plate 321 and the flexible layer 323 are fixedly connected to the push column 31 and the output shaft of the cylinder 33 respectively. The flexible layer 323 is arranged between the top plate 321 and the bottom plate 322, and is used to balance the force transmitted from the cylinder 33 to the bottom plate 322 on the flexible layer 323, so that the force received by the top plate 321 and transmitted to the pressing plate 20 through the push column 31 is evenly applied on the plane of the pressing plate 20;

[0080] The thickness of the bottom plate 322 is 1.5-2.5 times the thickness of the top plate 321 .

[0081] Furthermore, in the above technical solution, the injection assembly 40 includes an epoxy hose 41 and an injection pump. One end of the epoxy hose 41 is connected to the side wall of the template frame 10, and the other end is inserted into the bottom of the epoxy storage tank. The epoxy glue in the epoxy storage tank is gradually extracted by the injection pump and injected into the space between the press plate 20 and the waffle plate.

[0082] The epoxy hose 41 is a wave-shaped structure, which is used to perform multiple collisions on the extracted epoxy glue to discharge bubbles;

[0083] The end position of the epoxy hose 41 connected to the template frame 10 adopts a semi-parabolic structure, and its focal position is located at the center position of the pressing plate 20 and the waffle plate in the vertical direction, so as to reduce the impact of the epoxy glue on the waffle plate and the pressing plate 20;

[0084] The filling pump is connected to the epoxy glue storage tank and is used to extract epoxy glue from the storage tank and pump it into the epoxy glue hose; the filling pump includes a cavity, a first valve, a second valve, an impact plate and a compression spring, the cavity is arranged in the connecting pipe, the first valve is arranged on a side of the cavity close to the epoxy glue storage tank, the second valve is arranged on a side of the cavity close to the epoxy glue hose, the first valve includes a first valve plate, a first valve cavity and a first valve shaft, the upper end surface of the first valve plate is connected to the first valve shaft, the first valve shaft passes through the first valve cavity and is connected to the impact plate, the first valve cavity is arranged on the side of the cavity The first valve shaft is movably connected to the impact plate bracket, and the impact plate bracket is fixedly connected to the first valve hole in the first valve cavity; the second valve comprises a second valve plate, a second valve cavity and a second valve shaft, the left end face of the second valve plate is connected to the second valve shaft, the right end face of the second valve shaft is connected to the compression spring, the second valve shaft axially moves into the valve sleeve and moves the second valve plate into the second valve cavity, the valve sleeve is fixedly connected to the second valve hole of the second valve cavity, and the first valve hole and the second valve hole are connected to the outside; an accumulator is also provided, and the accumulator is provided between the cavity and the second valve;

[0085] A multi-stage plate is arranged inside the filling pump, which is used to further eliminate bubbles inside the epoxy glue through the collision between the epoxy glue and the multi-stage plate.

[0086] Furthermore, in the above technical solution, a reinforcing tube is provided inside the epoxy hose 41, and the reinforcing tube is sleeved inside the epoxy hose 41, and the reinforcing tube and the side wall of the epoxy hose 41 form an exhaust component 50; the thickness of the exhaust component 50 is small at the position where the curvature of the epoxy hose 41 is large, and is large at the position where the curvature of the epoxy hose 41 is small, and is used to increase the curvature of the epoxy hose 41 to increase shear force and turbulence, and enhance the bursting of bubbles in the liquid; a spiral texture is provided on the inner wall of the reinforcing tube to guide the bubbles to flow along the spiral texture path so that the bubbles are separated from the fluid; and the bubbles in the epoxy glue are discharged to accelerate its curing speed.

[0087] Furthermore, in the above technical solution, a reinforcing rib is provided on one side of the pressing plate 20 close to the supporting assembly 30 to ensure its strength; a demoulding layer is provided on one side of the pressing plate 20 close to the waffle plate;

[0088] The infrared component 60 includes an infrared lamp group 61 and an isolation layer 62. The isolation layer 62 is fixed on the side wall of the pressing plate 20. The infrared lamp group 61 is fixed between the isolation layer 62 and the inner wall of the pressing plate 20, and is used to quickly cure the epoxy adhesive by infrared lamps.

[0089] A curing portion is provided between the isolation layer 62 and the waffle plate.

[0090] The isolation layer 62 is made of polyurethane, which has good transparency and mechanical properties and is easy to separate from epoxy glue. It also has good infrared transmittance.

[0091] Further, in the above technical solution, a sealing strip is provided at the edge of the template frame 10, and the sealing strip is an L-shaped structure, which is used to cover the edge of the waffle board to prevent the epoxy glue from dripping during the curing process;

[0092] A sliding track is provided at the position where the template frame 10 is connected to the pressing plate 20, and a scale line is provided at the edge of the sliding track.

[0093] When in use, a template frame is set up at the edge of the corresponding waffle plate that needs to be injected with glue, and the waffle plate at the construction site is isolated from the waffle plates at other locations. The cylinder 33 is started to drive the push plate 32 to drive the push column 31 to move in the vertical direction, and the pressing plate 20 on the top of the push column 31 slides into the template frame 10 through the sliding track; in the process of the push plate 32 driving the push column 31 to move upward, the flexible layer 323 balances the uneven force on the bottom plate 322 so that the force transmitted upward by the push column 31 is the same at all positions; when the pressing plate 20 is pushed to a suitable position, epoxy glue is poured between the template frame 10 and the pressing plate 20 through the epoxy hose 41. When the epoxy glue flows in the epoxy hose 41, it continuously collides with the wavy inner wall of the epoxy hose 41, and the collision causes the bubbles in the epoxy glue to be continuously discharged. Turn on the infrared lamp group 61, and the infrared light emitted by the infrared lamp group 61 shines on the injected epoxy glue through the isolation layer 62 to solidify the epoxy glue.

[0094] like Figure 2 FIG. 1 is a flow chart of a method for epoxy construction of the bottom surface of a clean room waffle plate provided by the present invention. In this process, the specific steps include:

[0095] S01: Setting up movable scaffolding;

[0096] S02: Waffle slab beam bottom elevation measurement and line drawing;

[0097] S03: Fully enclosed enclosure on site;

[0098] S04: Chisel out the redundant concrete at the bottom of the waffle slab beam;

[0099] S05: Re-measurement of bottom elevation of waffle slab beam;

[0100] S06: Treatment of fallen stirrups;

[0101] S07: Treatment of floating dust at the bottom of waffle slab beam;

[0102] S08: Fix the template frame 10 at the edge of the waffle plate, and push the pressing plate 20 to a specified height through the supporting assembly 30;

[0103] S09: Applying a first layer of epoxy primer at the bottom of the waffle plate beam by pouring the assembly 40;

[0104] S10: After the first layer is fixed, a second layer of epoxy primer is applied to the bottom of the waffle plate beam by pouring the assembly 40;

[0105] S11: after curing, the formwork frame 10 is removed;

[0106] S12: Grind the bottom of the waffle plate;

[0107] S13: enclosure removal;

[0108] S14: Removal of scaffolding in the hall;

[0109] S15: Ground cleaning.

[0110] Furthermore, in the above technical solution, the specific steps of applying epoxy primer at the bottom of the waffle plate beam include:

[0111] The first step is to push the pressing plate 20 to a specified height and then let it stand;

[0112] The second step is to inject epoxy primer between the waffle plate and the pressing plate 20 through the epoxy hose 41;

[0113] The third step is to irradiate the epoxy primer with the infrared lamp group 61 to accelerate its curing.

[0114] Furthermore, in the above technical solution, the specific steps of measuring the bottom elevation of the waffle plate beam and marking the line include:

[0115] The first step is to use a laser rangefinder to accurately measure the height of each key point at the bottom of the waffle slab beam;

[0116] The second step is to draw the corresponding elevation line on the bottom of the beam according to the measured data;

[0117] The third step is to repeatedly check and verify the elevation line;

[0118] The specific steps for repeated inspection and verification of the elevation line include:

[0119] The first step is to use a level to measure the height of the key points at the bottom of the beam again;

[0120] The second step is to compare the retested data with the initial measured data to analyze whether there are significant differences.

[0121] The preparation steps of epoxy mortar are:

[0122] Prepare the required epoxy resin, curing agent and filler according to the construction requirements and the proportion requirements of epoxy mortar, and ensure that the quality of these materials meets the standard requirements;

[0123] In accordance with the prescribed proportion and sequence, epoxy resin, curing agent and filler are placed in a mixer and mixed to form epoxy mortar. Pay attention to controlling the mixing time and mixing speed to ensure the uniformity and stability of the epoxy mortar.

[0124] The specific steps for measuring and marking the bottom elevation of the S02 slab beam include:

[0125] S021: Use professional measuring tools, such as laser rangefinders or levels, to accurately measure the height of each key point at the bottom of the waffle plate beam. These key points are usually selected at different positions at the bottom of the beam to ensure the comprehensiveness and accuracy of the measurement data;

[0126] S022: Based on the measured data, the corresponding elevation lines are drawn on the bottom of the beam. These elevation lines are usually marked with eye-catching colors so that construction workers can clearly see and follow them. At the same time, in order to ensure the accuracy of the elevation, the elevation lines need to be repeatedly checked and verified;

[0127] S023: During the elevation measurement and line drawing process, attention should also be paid to the maintenance and calibration of the measuring tools to ensure their measurement accuracy and stability.

[0128] The specific method for re-measurement of the bottom elevation of the Huafu slab beam in the fifth step is as follows:

[0129] S1: Use the same measuring tools as used in the preliminary measurement, such as a laser rangefinder or a level, to measure the height of the key points at the bottom of the beam again. These key points should correspond to the points selected in the preliminary measurement to ensure the continuity and comparability of the measurement;

[0130] S2: Compare the re-measured data with the preliminary measured data to analyze whether there is a significant difference. If the difference is within the allowable error range, it means that the height control during the construction process meets the requirements. If the difference exceeds the error range, it is necessary to find the cause in time and make corresponding adjustments and processing;

[0131] S3: Record the re-measurement results and archive them together with the initial measurement data for reference and comparison during subsequent construction.

[0132] The specific steps for re-measurement of the bottom elevation of S05 waffle slab beam are as follows:

[0133] S051: Use the same measuring tools as used in the initial measurement, such as a laser rangefinder or a level, to measure the height of key points on the bottom of the beam again. These key points should correspond to the points selected in the initial measurement to ensure the continuity and comparability of the measurement;

[0134] S052: Compare the re-measured data with the preliminary measured data to analyze whether there is a significant difference. If the difference is within the allowable error range, it means that the height control during the construction process meets the requirements. If the difference exceeds the error range, it is necessary to find the cause in time and make corresponding adjustments and processing;

[0135] S053: Record the re-measurement results and archive them together with the initial measurement data for reference and comparison during subsequent construction.

[0136] Specifically, the principle of the present invention is: first, by setting up movable scaffolding and carrying out full-closed enclosure on site, the safety and environmental protection of the construction process are ensured; then, by accurately measuring the elevation and marking the bottom of the waffle plate beam, as well as chiseling out redundant concrete and processing the stirrups falling from the bottom of the beam, the problems of bulging and falling are solved, and the flatness and aesthetics of the bottom surface of the waffle plate are improved; then, the ground of the waffle plate is fixed-point constructed using a construction device to ensure that the epoxy glue is laid flat; in the entire working principle, each link is interconnected and coordinated with each other to form a complete construction system; through precise measurement and re-measurement, it is ensured that the height control during the construction process meets the requirements; by chiseling out redundant concrete and processing the stirrups falling from the bottom of the beam, the problems of bulging and falling are solved; by removing the template, repairing defects and grinding, the flatness and aesthetics of the bottom surface of the waffle plate are improved; these improvement measures not only improve the quality and efficiency of the construction, but also reduce the construction cost and ensure the smooth acceptance of the entire construction.

[0137] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A clean room waffle board bottom surface epoxy construction device, characterized in that: The invention comprises a template frame (10), a pressing plate (20), a support assembly (30), a pouring assembly (40), an exhaust assembly (50) and an infrared assembly (60); the template frame (10) has the same shape as a waffle plate and is fixed on the four sides of the waffle plate; the pressing plate (20) is arranged at a side position of the template frame (10) and is arranged corresponding to the position of the waffle plate; the template frame (10), the pressing plate (20) and the bottom surface of the waffle plate form a sealing structure; the support assembly (30) is fixed to the bottom of the template frame (10), and the support assembly (30) is used to push the pressing plate (20) upwards. The plate (20) is arranged so that an epoxy curing gap is formed between the pressing plate (20) and the waffle plate; the filling components (40) are arranged on both the left and right sides of the template frame (10), and the filling components (40) are used to fill the epoxy glue between the pressing plate (20) and the waffle plate; the filling component (40) is arranged in the filling component (40), and the exhaust component (50) is used to evacuate the injected epoxy glue to accelerate its curing speed; the infrared component (60) is arranged on the side of the pressing plate (20) close to the waffle plate, and is used to further strengthen the curing of the epoxy glue.

2. The clean room waffle plate bottom epoxy construction device according to claim 1, characterized in that: The support assembly (30) comprises a push column (31), a push plate (32) and a cylinder (33); the push column (31) comprises a plurality of push columns, one end of which is fixedly connected to a side of the pressing plate (20) away from the waffle plate, and the other end of which is fixedly connected to the push plate (32); the output shaft of the cylinder (33) is fixed to a side of the push plate (32) away from the push column (31), and is used to push the push plate (32) to move toward one side of the waffle plate; The push column (31) is arranged in a trumpet-shaped structure near the pressing plate (20) and both sides of the push plate (32) for balancing the force, and the cross-sectional area at the center position is smaller than the cross-sectional area at the two sides; The plurality of push pins (31) are arranged on the pressing plate (20) in a sinusoidal structure.

3. The clean room waffle plate bottom epoxy construction device according to claim 2, characterized in that: The pushing plate (32) comprises a top plate (321), a bottom plate (322) and a flexible layer (323); the top plate (321) and the flexible layer (323) are respectively fixedly connected to the pushing column (31) and the output shaft of the cylinder (33); the flexible layer (323) is arranged between the top plate (321) and the bottom plate (322) and is used to balance the force transmitted from the cylinder (33) to the bottom plate (322) on the flexible layer (323), so that the force received by the top plate (321) and transmitted to the pressing plate (20) through the pushing column (31) is evenly applied on the plane of the pressing plate (20); The thickness of the bottom plate (322) is 1.5-2.5 times the thickness of the top plate (321).

4. The clean room waffle plate bottom epoxy construction device according to claim 3, characterized in that: The injection assembly (40) comprises an epoxy hose (41) and an injection pump, one end of the epoxy hose (41) is connected to the side wall of the template frame (10), and the other end is inserted into the bottom of the epoxy storage tank, and the epoxy hose is gradually extracted from the epoxy storage tank by the injection pump and injected into the space between the pressing plate (20) and the waffle plate; The epoxy hose (41) is a wave-shaped structure, and is used to perform multiple collisions on the extracted epoxy to expel bubbles; The end portion of the epoxy hose (41) that is connected to the template frame (10) adopts a semi-parabolic structure, and its focal position is located at the center of the pressing plate (20) and the waffle plate in a vertical direction, so as to reduce the impact of the epoxy hose on the waffle plate and the pressing plate (20); The filling pump is connected to the epoxy glue storage tank and is used to extract epoxy glue from the storage tank and pump it into the epoxy glue hose; the filling pump includes a cavity, a first valve, a second valve, an impact plate and a compression spring, the cavity is arranged in the connecting pipe, the first valve is arranged on a side of the cavity close to the epoxy glue storage tank, the second valve is arranged on a side of the cavity close to the epoxy glue hose, the first valve includes a first valve plate, a first valve cavity and a first valve shaft, the upper end surface of the first valve plate is connected to the first valve shaft, the first valve shaft passes through the first valve cavity and is connected to the impact plate, the first valve cavity is arranged on the side of the cavity The first valve shaft is movably connected to the impact plate bracket, and the impact plate bracket is fixedly connected to the first valve hole in the first valve cavity; the second valve comprises a second valve plate, a second valve cavity and a second valve shaft, the left end face of the second valve plate is connected to the second valve shaft, the right end face of the second valve shaft is connected to the compression spring, the second valve shaft axially moves into the valve sleeve and moves the second valve plate into the second valve cavity, the valve sleeve is fixedly connected to the second valve hole of the second valve cavity, and the first valve hole and the second valve hole are connected to the outside; an accumulator is also provided, and the accumulator is provided between the cavity and the second valve; A multi-stage plate is arranged inside the filling pump, which is used to further eliminate bubbles inside the epoxy glue through the collision between the epoxy glue and the multi-stage plate.

5. The clean room waffle plate bottom epoxy construction device according to claim 4, characterized in that: A reinforcing tube is provided inside the epoxy hose (41), and the reinforcing tube is sleeved inside the epoxy hose (41), and the reinforcing tube and the side wall of the epoxy hose (41) form an exhaust assembly (50); the thickness of the exhaust assembly (50) is small at a location where the curvature of the epoxy hose (41) is large, and large at a location where the curvature of the epoxy hose (41) is small, and is used to increase the curvature of the epoxy hose (41), thereby increasing shear force and turbulence, and enhancing bubble bursting in the liquid; a spiral texture is provided on the inner wall of the reinforcing tube, and is used to guide bubbles to flow along the spiral texture path so that the bubbles are separated from the fluid; and the exhaust of bubbles in the epoxy glue is used to accelerate its curing speed.

6. The device for epoxy coating the bottom surface of a clean room waffle plate according to claim 5, characterized in that: A reinforcing rib is provided on one side of the pressing plate (20) close to the supporting assembly (30) to ensure its strength; a demoulding layer is provided on one side of the pressing plate (20) close to the waffle plate; The infrared component (60) comprises an infrared lamp group (61) and an isolation layer (62); the isolation layer (62) is fixed on the side wall of the pressing plate (20); the infrared lamp group (61) is fixed between the isolation layer (62) and the inner wall of the pressing plate (20), and is used to quickly cure the epoxy adhesive by means of infrared lamps; A curing portion is arranged between the isolation layer (62) and the waffle plate.

7. The clean room waffle plate bottom epoxy construction device according to claim 6, characterized in that: A sealing strip is provided at the edge of the template frame (10), the sealing strip being an L-shaped structure and used for covering the edge of the waffle plate to prevent the epoxy glue from dripping during the curing process; A sliding track is provided at the position where the template frame (10) is connected to the pressing plate (20), and a scale line is provided at the edge of the sliding track.

8. A method for epoxy construction of the bottom surface of a clean room waffle board, characterized in that: The specific steps include: S01: Setting up movable scaffolding; S02: Waffle slab beam bottom elevation measurement and line drawing; S03: Fully enclosed enclosure on site; S04: Chisel out the redundant concrete at the bottom of the waffle slab beam; S05: Re-measurement of bottom elevation of waffle slab beam; S06: Treatment of fallen stirrups; S07: Treatment of floating dust at the bottom of waffle slab beam; S08: fixing the template frame (10) at the edge of the waffle plate, and pushing the pressing plate (20) to a specified height through the supporting assembly (30); S09: applying a first layer of epoxy primer at the bottom of the waffle plate beam through the injection assembly (40); S10: After the first layer is fixed, a second layer of epoxy primer is applied to the bottom of the waffle plate beam through the pouring assembly (40); S11: after curing, the formwork frame (10) is removed; S12: Grind the bottom of the waffle plate; S13: enclosure removal; S14: Removal of scaffolding in the hall; S15: Ground cleaning.

9. A clean room waffle board bottom epoxy construction method according to claim 8, characterized in that: The specific steps for applying epoxy primer at the bottom of the waffle slab beam include: The first step is to push the pressing plate (20) to a specified height and then let it stand; The second step is to inject epoxy primer between the waffle plate and the pressing plate (20) through the epoxy hose (41); The third step is to irradiate the epoxy primer with the infrared lamp group (61) to accelerate its curing.

10. A clean room waffle board bottom epoxy construction method according to claim 9, characterized in that: The specific steps of measuring the bottom elevation of the waffle plate beam and marking the line include: The first step is to use a laser rangefinder to accurately measure the height of each key point at the bottom of the waffle slab beam; The second step is to draw the corresponding elevation line on the bottom of the beam according to the measured data; The third step is to repeatedly check and verify the elevation line; The specific steps of repeatedly checking and verifying the elevation line include: The first step is to use a level to measure the height of the key points at the bottom of the beam again; The second step is to compare the retested data with the initial measured data to analyze whether there are significant differences.

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