A dual-channel cooling and heating switching temperature control system for semiconductors

Abstract

The present invention discloses a dual-channel refrigeration and heating switching temperature control system for semiconductors, comprising: a first temperature control system and a second temperature control system; the first temperature control system comprises a first circulating liquid circuit; the second temperature control system comprises a second circulating liquid circuit and a refrigeration circuit; the first circulating liquid circuit comprises a first circulating liquid tank, a first circulating liquid pump, a heater, a first valve, a second valve and a third valve; one end of the third valve is connected to the pipeline between the heater and the first valve, and the other end of the third valve is connected to the pipeline between the second valve and the first circulating liquid tank; the second circulating liquid circuit comprises a second circulating liquid tank, a second circulating liquid pump, a fourth valve, a fifth valve and a sixth valve; one end of the sixth valve is connected to the pipeline between the second circulating liquid pump and the fourth valve, and the other end of the sixth valve is connected to the pipeline between the fifth valve and the second circulating liquid tank. The technical solution of the present invention realizes rapid cold and hot switching and greatly shortens the time required for wafer temperature rise and fall.

Description

Technical Field

[0001] The present invention relates to the technical field of heating and cooling equipment, and in particular to a dual-channel cooling and heating switching temperature control system for semiconductors. Background Art

[0002] With the rapid development of the semiconductor industry, higher requirements are placed on the wafer etching process. During the entire etching reaction process, the wafer on the electrostatic chuck (ESC) in the reaction chamber sometimes needs to be quickly heated and cooled to maintain the etching rate, that is, sometimes it is necessary to quickly heat up from a low temperature to a high temperature, or quickly cool down from a high temperature to a low temperature.

[0003] However, since there is usually a certain distance between the main station and the temperature controller of the etching equipment, and there is a large amount of circulating fluid in the delivery pipeline and the internal pipeline of the etching equipment, during the heating or cooling process, the circulating fluid in the pipeline and the equipment needs to be pre-heated or pre-cooled. This process is often accompanied by a large temperature overcharge, resulting in the inability to timely and quickly compensate the overshoot temperature to the target value, which results in the temperature rise and fall rate required for the wafer etching reaction failing to meet the requirements, thereby affecting the chip yield. Summary of the invention

[0004] The present invention provides a dual-channel cooling and heating switching temperature control system for semiconductors to solve the problems existing in the prior art, realize rapid cooling and heating switching, and greatly shorten the time required for wafer temperature rise and fall.

[0005] In a first aspect, the present invention provides a dual-channel cooling and heating switching temperature control system for semiconductors, comprising: a first temperature control system and a second temperature control system;

[0006] The first temperature control system includes a first circulating liquid circuit; the second temperature control system includes a second circulating liquid circuit and a refrigeration circuit, wherein the refrigeration circuit forms a first heat exchange structure with the second circulating liquid circuit through a first heat exchanger;

[0007] The first circulating liquid loop includes a first circulating liquid tank, a first circulating liquid pump, a heater, a first valve, a second valve and a third valve; the first circulating liquid tank, the first circulating liquid pump, the heater, the first valve, the client system, the second valve and the first circulating liquid tank are sequentially connected by pipelines; one end of the third valve is connected to the pipeline between the heater and the first valve, and the other end of the third valve is connected to the pipeline between the second valve and the first circulating liquid tank;

[0008] The second circulating liquid loop includes a second circulating liquid tank, a second circulating liquid pump, a fourth valve, a fifth valve and a sixth valve; the second circulating liquid tank, the second circulating liquid pump, the fourth valve, the client system, the fifth valve, the first heat exchanger and the second circulating liquid tank are connected in sequence by pipelines; one end of the sixth valve is connected to the pipeline between the second circulating liquid pump and the fourth valve, and the other end of the sixth valve is connected to the pipeline between the fifth valve and the second circulating liquid tank.

[0009] Optionally, the first circulating liquid tank is provided with a first liquid level sensor; the second circulating liquid tank is provided with a second liquid level sensor;

[0010] The first circulating liquid tank and the second circulating liquid tank are connected via a seventh valve and an eighth valve respectively; the level of the seventh valve is higher than the level of the eighth valve.

[0011] Optionally, the first temperature control system also includes a first water cooling circuit; the water cooling circuit forms a second heat exchange structure with the first circulating liquid circuit through a second heat exchanger; along the flow direction of the circulating liquid, the second heat exchange structure is located in the pipeline before the first circulating liquid tank.

[0012] Optionally, the first heat exchange structure divides the first water cooling circuit into a first cooling water inlet pipeline and a first cooling water outlet pipeline; a cooling water regulating valve is provided on the first cooling water outlet pipeline.

[0013] Optionally, the first circulating liquid loop also includes a first temperature sensor; along the flow direction of the circulating liquid, the first temperature sensor is arranged in the pipeline after the heater.

[0014] Optionally, the second circulating liquid loop also includes a second temperature sensor; along the flow direction of the circulating liquid, the second temperature sensor is arranged in the pipeline after the second circulating liquid pump.

[0015] Optionally, the refrigeration circuit includes a compressor, an oil separator, and a ninth valve; the outlet of the compressor is connected to the inlet of the compressor via the oil separator, the ninth valve, and the first heat exchanger pipeline in sequence.

[0016] Optionally, the second temperature control system also includes a second water cooling circuit; the second water cooling circuit forms a third heat exchange structure with the refrigeration circuit through a third heat exchanger; the third heat exchanger is arranged in a pipeline connection between the oil separator and the ninth valve.

[0017] Optionally, the refrigeration circuit further includes a tenth valve; one end of the tenth valve is connected to the pipeline between the compressor and the third heat exchanger, and the other end of the tenth valve is connected to the pipeline between the ninth valve and the first heat exchanger.

[0018] Optionally, the refrigeration circuit also includes an eleventh valve and a third temperature sensor; one end of the eleventh valve is connected to the inlet pipe of the compressor, and the other end is connected to the pipeline between the third heat exchanger and the ninth valve; the third temperature sensor is arranged in the pipeline between the outlet of the compressor and the oil separator.

[0019] The technical solution of the present invention is that the first temperature control system includes a first circulating liquid loop, the second temperature control system includes a second circulating liquid loop and a refrigeration loop, the refrigeration loop forms a first heat exchange structure with the second circulating liquid loop through a first heat exchanger, and the first circulating liquid loop includes a first circulating liquid tank, a first circulating liquid pump, a heater, a first valve, a second valve and a third valve, the first circulating liquid tank, the first circulating liquid pump, the heater, the first valve, the client system, the second valve and the first circulating liquid tank are connected in sequence through pipelines; one end of the third valve is connected to the pipeline between the heater and the first valve, and the other end of the third valve is connected to the pipeline between the second valve and the first circulating liquid tank, the second circulating liquid loop includes a second circulating liquid tank, a second circulating liquid pump, a fourth valve , the fifth valve and the sixth valve; the second circulating liquid tank, the second circulating liquid pump, the fourth valve, the client system, the fifth valve and the second circulating liquid tank are connected by pipelines in sequence; one end of the sixth valve is connected to the pipeline between the second circulating liquid pump and the fourth valve, and the other end of the sixth valve is connected to the pipeline between the fifth valve and the second circulating liquid tank, so that when the first valve, the second valve and the sixth valve are in an open state, and the third valve, the fourth valve and the sixth valve are in a closed state, the first temperature control system can continuously provide a high temperature for the client system, and when the third valve, the fourth valve and the sixth valve are in an open state, and the first valve, the second valve and the sixth valve are in a closed state, the second temperature control system can continuously provide a low temperature for the client system. In addition, by controlling the working states of the first valve, the second valve, the third valve, the fourth valve, the fifth valve and the sixth valve, the first temperature control system and the second temperature control system can be quickly switched, shortening the time required for the wafer to heat up and cool down, thereby improving the yield of wafer etching.

[0020] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic diagram of a dual-channel cooling and heating switching temperature control system for semiconductors provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0024] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein.

[0025] Figure 1 This is a schematic diagram of a semiconductor dual-channel cooling and heating switching temperature control system provided by an embodiment of the present invention. This embodiment provides a semiconductor dual-channel cooling and heating switching temperature control system, reference Figure 1As shown, the semiconductor dual-channel cooling and heating switching temperature control system includes: a first temperature control system and a second temperature control system; the first temperature control system includes a first circulating liquid loop; the second temperature control system includes a second circulating liquid loop and a refrigeration loop, wherein the refrigeration loop passes through a first heat exchanger 1 and forms a first heat exchange structure with the second circulating liquid loop. The first circulating liquid loop includes a first circulating liquid tank 2, a first circulating liquid pump 3, a heater 4, a first valve 5, a second valve 6 and a third valve 7; the first circulating liquid tank 2, the first circulating liquid pump 3, the heater 4, the first valve 5, the client system 13, the second valve 6 and the first circulating liquid tank 2 are connected in sequence through pipelines; one end of the third valve 7 is connected to the pipeline between the heater 4 and the first valve 5, and the other end of the third valve 7 is connected to the pipeline between the second valve 6 and the first circulating liquid tank 2; the second circulating liquid loop includes a second circulating liquid tank 8, a second circulating liquid pump 9, a fourth valve 10, a fifth valve 11 and a sixth valve 12; the second circulating liquid tank 8, the second circulating liquid pump 9, the fourth valve 10, the client system 13, the fifth valve 11 and the second circulating liquid tank 8 are connected in sequence through pipelines; one end of the sixth valve 12 is connected to the pipeline between the second circulating liquid pump 9 and the fourth valve 10, and the other end of the sixth valve 12 is connected to the pipeline between the fifth valve 11 and the second circulating liquid tank 8.

[0026] The first temperature control system is used to continuously provide a high temperature for the client system 13. The second temperature control system is used to continuously provide a low temperature for the client system 13.

[0027] The first circulating liquid loop includes a heater 4, which is used to heat the circulating liquid in the first circulating liquid loop. The first circulating liquid tank 2, the first circulating liquid pump 3, the heater 4, the first valve 5, the heat exchanger system 13, the second valve 6 and the first circulating liquid tank 2 are connected in sequence by pipelines. The first circulating liquid pump 3 extracts the circulating liquid in the first circulating liquid tank 2 and delivers it to the heater 4. By controlling the power of the heater 4, the heater 4 raises the circulating liquid to the target temperature, and then delivers it to the heat exchanger system 13 through the first valve 5. After heat exchange in the heat exchanger system 13, it returns to the first circulating liquid tank 2 through the second valve 6 to complete the circulation.

[0028] The first heat exchanger 1 may include a gas-liquid heat exchanger. The refrigeration circuit forms a first heat exchange structure with the second circulating liquid circuit through the first heat exchanger 1, so that the refrigeration circuit can cool the circulating liquid in the second circulating liquid circuit through the first heat exchanger 1.

[0029] The second circulating liquid tank 8, the second circulating liquid pump 9, the fourth valve 10, the heat exchanger system 13, the fifth valve 11, the first heat exchanger 1 and the second circulating liquid tank 8 are connected by pipelines in sequence. The circulating liquid in the second circulating liquid loop is cooled by the first heat exchanger 1, and then sucked and transported by the second circulating liquid pump 9, flows from the second circulating liquid tank 8 into the second circulating pump, and is then transported to the heat exchanger system 13 through the fourth valve 10. After heat exchange in the heat exchanger system 13, it returns to the first heat exchanger 1 through the fifth valve 11, thereby completing the cycle.

[0030] The first valve 5, the second valve 6, the third valve 7, the fourth valve 10, the fifth valve 11 and the sixth valve 12 are used to control the conduction of the corresponding pipelines. In an optional embodiment, the first valve 5, the second valve 6, the third valve 7, the fourth valve 10, the fifth valve 11 and the sixth valve 12 can be, but are not limited to, solenoid valves, so as to realize the remote control of the semiconductor dual-channel cooling and heating switching temperature control system.

[0031] Specifically, when the temperature of the heat exchanger system 13 needs to be raised, the third valve 7, the fourth valve 10 and the fifth valve 11 can be closed, and the first valve 5, the second valve 6 and the sixth valve 12 can be opened, so that the high-temperature circulating liquid in the first circulating liquid loop enters the heat exchanger system 13 for heat exchange. At this time, since the fourth valve 10 and the fifth valve 11 are in a closed state and the sixth valve 12 is in an open state, the low-temperature circulating liquid in the second circulating liquid loop returns to the first heat exchanger 1 through the sixth valve 12, and does not enter the heat exchanger system 13. On the contrary, when the temperature of the heat exchanger system 13 needs to be lowered, the first valve 5, the second valve 6 and the sixth valve 12 can be closed, and the third valve 7, the fourth valve 10 and the fifth valve 11 can be opened, so that the low-temperature circulating liquid in the second circulating liquid loop enters the heat exchanger system 13 for heat exchange. At this time, since the first valve 5 and the second valve 6 are in a closed state and the third valve 7 is in an open state, the high-temperature circulating liquid in the first circulating liquid loop returns to the first circulating liquid tank 2 through the third valve 7, and does not enter the heat exchanger system 13. In this way, rapid hot and cold switching can be achieved.

[0032] In an optional embodiment, the level of the first circulating liquid tank 2 is higher than the level of the first circulating liquid pump 3, so that the circulating liquid in the first circulation loop can rely on its own gravity for self-supply, thereby improving the circulating liquid supply power.

[0033] In an optional embodiment, the level of the second circulating liquid tank 8 is higher than the level of the second circulating liquid pump 9, so that the circulating liquid in the second circulation loop can rely on its own gravity for self-supply, thereby improving the circulating liquid supply power.

[0034] In this embodiment, the first temperature control system includes a first circulating liquid loop, the second temperature control system includes a second circulating liquid loop and a refrigeration loop, the refrigeration loop forms a first heat exchange structure with the second circulating liquid loop through the first heat exchanger, and the first circulating liquid loop includes a first circulating liquid tank, a first circulating liquid pump, a heater, a first valve, a second valve and a third valve, the first circulating liquid tank, the first circulating liquid pump, the heater, the first valve, the client system, the second valve and the first circulating liquid tank are connected in sequence through pipelines; one end of the third valve is connected to the pipeline between the heater and the first valve, and the other end of the third valve is connected to the pipeline between the second valve and the first circulating liquid tank, the second circulating liquid loop includes the second circulating liquid tank, the second circulating liquid pump, the fourth valve, the first circulating liquid tank, the second circulating liquid pump, the fourth valve, the third valve, the fourth valve, the fifth ... The fifth valve and the sixth valve; the second circulating liquid tank, the second circulating liquid pump, the fourth valve, the client system, the fifth valve and the second circulating liquid tank are connected by pipelines in sequence; one end of the sixth valve is connected to the pipeline between the second circulating liquid pump and the fourth valve, and the other end of the sixth valve is connected to the pipeline between the fifth valve and the second circulating liquid tank, so that when the first valve, the second valve and the sixth valve are in an open state, and the third valve, the fourth valve and the sixth valve are in a closed state, the first temperature control system can continuously provide a high temperature for the client system, and when the third valve, the fourth valve and the sixth valve are in an open state, and the first valve, the second valve and the sixth valve are in a closed state, the second temperature control system can continuously provide a low temperature for the client system. In addition, by controlling the working states of the first valve, the second valve, the third valve, the fourth valve, the fifth valve and the sixth valve, the first temperature control system and the second temperature control system can be quickly switched, shortening the time required for the wafer to heat up and cool down, thereby improving the yield of wafer etching.

[0035] It is understandable that when the system switches between hot and cold for a long time, or the number of hot and cold switching is too many, there is a problem that the circulating fluid retained in the pipeline cannot return to the circulating fluid tank. In the long run, this will cause the liquid levels of the circulating fluid in the first circulating fluid tank 2 and the second circulating fluid tank 8 to be unequal, resulting in insufficient circulating fluid in one of the circulating fluid tanks and the inability to circulate.

[0036] Optional, continue to refer to Figure 1 As shown, the first circulating liquid tank 2 is provided with a first liquid level sensor 14; the second circulating liquid tank 8 is provided with a second liquid level sensor 15; the first circulating liquid tank 2 and the second circulating liquid tank 8 are connected respectively via a seventh valve 16 and an eighth valve 17; the level of the seventh valve 16 is higher than the level of the eighth valve 17.

[0037] The first liquid level sensor 14 is used to collect the liquid level of the circulating liquid in the first circulating liquid tank 2; the second liquid level sensor 15 is used to collect the liquid level of the circulating liquid in the second circulating liquid tank 8. The seventh valve 16 connects the first circulating liquid tank 2 and the second circulating liquid tank 8, and the eighth valve 17 connects the first circulating liquid tank 2 and the second circulating liquid tank 8, and the level of the seventh valve 16 is higher than the level of the eighth valve 17. The seventh valve 16 and / or the eighth valve 17 can be, but are not limited to, solenoid valves.

[0038] Specifically, the first liquid level sensor 14 collects the liquid level of the circulating liquid in the first circulating liquid tank 2 in real time, and the second liquid level sensor 15 collects the liquid level of the circulating liquid in the second circulating liquid tank 8 in real time. When the absolute difference between the liquid level of the circulating liquid in the first circulating liquid tank 2 and the liquid level of the circulating liquid in the second circulating liquid tank 8 is less than the set liquid level difference, wherein the set liquid level difference is determined according to the characteristics of the first temperature control system and the second temperature control system, it indicates that the liquid levels of the circulating liquids in the two circulating liquid tanks are relatively balanced. At this time, the seventh valve 16 and the eighth valve 17 can be controlled to close. When the absolute difference between the liquid level of the circulating liquid in the first circulating liquid tank 2 and the liquid level of the circulating liquid in the second circulating liquid tank 8 is greater than the set liquid level difference, it indicates that the liquid levels of the circulating liquids in the two circulating liquid tanks are not equal, and there is a problem that the circulating liquid in one of the circulating liquid tanks is insufficient and cannot circulate. At this time, the seventh valve 16 and the eighth valve 17 can be controlled to open, so that the liquid level and pressure of the circulating liquid in the first circulating liquid tank 2 and the second circulating liquid tank 8 are quickly balanced, thereby ensuring the normal operation of the first temperature control system and the second temperature control system.

[0039] Optional, continue to refer to Figure 1 As shown, the first temperature control system also includes a first water cooling circuit, which forms a second heat exchange structure with the first circulating liquid circuit through a second heat exchanger 18. Along the flow direction of the circulating liquid, the second heat exchange structure is located in the pipeline before the first circulating liquid tank.

[0040] The second heat exchanger 18 may be a heat-to-heat heat exchanger.

[0041] It is understandable that when the heater 4 heats the circulating liquid in the first circulating liquid loop to the target temperature, the heater 4 stops heating, but the residual heat of the heater 4 will continue to increase the temperature of the circulating liquid, resulting in the problem of temperature overshoot. By allowing the water cooling loop to pass through the second heat exchanger 18 and the first circulating liquid loop to form a second heat exchange structure, the water cooling loop can cool the circulating liquid in the first circulating liquid loop through the second heat exchanger 18, effectively solving the problem of temperature overshoot of a single heat source, avoiding the problem of insufficient regulation stability of a single heat source, and improving the stability of high-temperature temperature control of the system. In addition, in the process of reducing the system temperature from high temperature to normal temperature, the circulating liquid is cooled by the water cooling loop and the second heat exchanger 18, thereby increasing the cooling speed.

[0042] Optional, continue to refer to Figure 1 As shown, the first heat exchange structure divides the first water cooling circuit into a first cooling water inlet pipeline and a first cooling water outlet pipeline; a cooling water regulating valve 19 is provided on the first cooling water outlet pipeline, so that the flow rate of the cooling water in the first water cooling circuit can be adjusted by controlling the opening of the cooling water regulating valve 19, thereby adjusting the temperature of the circulating liquid returned to the first circulating liquid tank 2.

[0043] Optional, continue to refer to Figure 1 As shown, the first circulating liquid loop also includes a first temperature sensor 20 ; along the flow direction of the circulating liquid, the first temperature sensor 20 is arranged in the pipeline after the heater 4 .

[0044] The first temperature sensor 20 is used to detect the temperature of the circulating fluid heated by the heater 4. The first temperature sensor 20 may be, but is not limited to, a thermal resistance type temperature sensor, so that the acquired temperature of the circulating fluid is more accurate.

[0045] Specifically, when the first temperature control system provides a high temperature for the client system 13, if the temperature detected by the first temperature sensor 20 is greater than the set temperature, where the set temperature is the temperature of the circulating fluid required by the client system 13, it indicates that the current temperature of the circulating fluid is too high, and the temperature of the circulating fluid can be reduced by reducing the power of the heater 4 and / or increasing the opening of the cooling water regulating valve 19 to meet the needs of the client system 13. On the contrary, if the temperature detected by the first temperature sensor 20 is less than the set temperature, it indicates that the current temperature of the circulating fluid is too low, and the temperature of the circulating fluid can be increased by increasing the power of the heater 4 and / or reducing the opening of the cooling water regulating valve 19 to meet the needs of the client system 13. In an optional embodiment, when adjusting the power of the heater 4 or the opening of the cooling water regulating valve 19 according to the temperature detected by the first temperature sensor 20, a PID adjustment method can be adopted, the temperature control object is the set temperature, the feedback temperature is the temperature detected by the first temperature sensor 20, the power of the heater 4 is positively heated, and the opening of the cooling water regulating valve 19 is reversely controlled, so as to further improve the temperature control stability of the first temperature control system.

[0046] Optional, continue to refer to Figure 1 As shown, the refrigeration circuit includes a compressor 21, an oil separator 22, and a ninth valve 23, and the outlet of the compressor 21 is connected to the inlet of the compressor 21 through the oil separator 22, the ninth valve 23 and the first heat exchanger 1 pipeline in sequence.

[0047] The ninth valve 23 may be, but is not limited to, an electronic expansion valve.

[0048] In an optional embodiment, the refrigeration circuit further includes a drying filter 24. The drying filter 24 is arranged in the pipeline between the oil separator 22 and the ninth valve 23.

[0049] Specifically, the high-temperature and high-pressure refrigerant vapor discharged from the compressor 21 passes through the oil separator 22 to separate the refrigeration oil in the refrigerant vapor, and the separated refrigeration oil returns to the chamber of the compressor 21 to form a motor protection oil film. The refrigerant vapor coming out of the oil separator 22 is dried and filtered by the drying filter 24, and then throttled and reduced in pressure by the ninth valve 23 to produce a low-temperature and low-pressure gas-liquid mixed refrigerant, which then enters the first heat exchanger 1 to exchange heat with the second circulating liquid circuit to cool the circulating liquid in the second circulating liquid circuit to a specified temperature. Finally, after the refrigerant comes out of the first heat exchanger 1, it is sucked into the compressor 21 to replicate the cold Carnot cycle.

[0050] Optional, continue to refer to Figure 1 As shown, the second circulating liquid loop also includes a second temperature sensor 25 ; along the flow direction of the circulating liquid, the second temperature sensor 25 is arranged in the pipeline after the second circulating liquid pump 9 .

[0051] The second temperature sensor 25 is used to detect the temperature of the circulating liquid flowing out of the second circulating liquid tank 8. The second temperature sensor 25 may be, but is not limited to, a thermal resistance type temperature sensor.

[0052] Optional, continue to refer to Figure 1 As shown, the second temperature control system also includes a second water cooling circuit, which forms a third heat exchange structure with the refrigeration circuit through a third heat exchanger 26. The third heat exchanger 26 is arranged in the pipeline between the oil separator 22 and the ninth valve 23, so that the high-temperature and high-pressure refrigerant vapor coming out of the oil separator 22 first passes through the third heat exchanger 26 for condensation and heat exchange, so that the refrigerant is condensed into a high-pressure liquid refrigerant, and then dried and filtered through the drying filter 24.

[0053] Optional, continue to refer to Figure 1 As shown, the refrigeration circuit also includes a tenth valve 27; one end of the tenth valve 27 is connected to the pipeline between the compressor 21 and the third heat exchanger 26, and the other end is connected to the pipeline between the ninth valve 23 and the first heat exchanger 1.

[0054] The tenth valve 27 may be, but is not limited to, an electronic expansion valve. By connecting one end of the tenth valve 27 to the pipeline between the compressor 21 and the third heat exchanger 26, and the other end to the pipeline between the ninth valve 23 and the first heat exchanger 1, the high-temperature and high-pressure refrigerant vapor discharged from the compressor 21 can bypass the pipeline before the first heat exchanger 1 through the tenth valve 27 before entering the third heat exchanger 26, thereby providing a certain amount of heat for the low-temperature and low-pressure refrigerant before entering the first heat exchanger 1, thereby achieving the purpose of controlling and raising the evaporation temperature.

[0055] Specifically, when the second temperature control system provides a low temperature for the client system 13, if the temperature detected by the second temperature sensor 25 is greater than the set temperature, where the set temperature is the temperature of the circulating fluid required by the client system 13, it indicates that the current temperature of the circulating fluid is too high. At this time, the temperature of the circulating fluid can be reduced by reducing the opening of the ninth valve 23 and / or increasing the opening of the tenth valve 27 to meet the needs of the client system 13. On the contrary, if the temperature detected by the second temperature sensor 25 is less than the set temperature, it indicates that the current temperature of the circulating fluid is too low. At this time, the temperature of the circulating fluid can be increased by increasing the opening of the ninth valve 23 and / or reducing the opening of the tenth valve 27 to meet the needs of the client system 13. In an optional embodiment, when adjusting the opening of the ninth valve 23 and the tenth valve 27 according to the temperature detected by the second temperature sensor 25, a PID adjustment method can be adopted, the temperature control object is the set temperature, the feedback temperature is the temperature detected by the second temperature sensor 25, the opening of the ninth valve 23 is positively cooled, and the opening of the tenth valve 27 is positively heated, so as to improve the temperature control stability of the second temperature control system.

[0056] Optional, continue to refer to Figure 1 As shown, the refrigeration circuit also includes an eleventh valve 28 and a third temperature sensor 29; one end of the eleventh valve 28 is connected to the inlet pipe of the compressor 21, and the other end is connected to the pipeline between the third heat exchanger 26 and the ninth valve 23; the third temperature sensor 29 is arranged in the pipeline between the outlet of the compressor 21 and the oil separator 22.

[0057] The eleventh valve 28 can be, but is not limited to, an electronic expansion valve. By connecting one end of the eleventh valve 28 to the inlet pipe of the compressor 21 and the other end to the pipeline between the third heat exchanger 26 and the ninth valve 23, when the second temperature control system is running for a long time, a small amount of high-pressure liquid refrigerant after drying and filtering by the drying filter 24 can be sprayed into the high-pressure chamber of the compressor 21 through the eleventh valve 28, so as to achieve the purpose of cooling the motor of the compressor 21, so as to reduce the heating of the motor of the compressor 21, which is beneficial to improve the supercooling degree of the refrigeration circuit, thereby increasing the economy of the second temperature control system.

[0058] The third temperature sensor 29 is used to detect the temperature of the refrigerant at the outlet of the compressor 21. The third temperature sensor 29 may be, but is not limited to, a thermal resistance type temperature sensor.

[0059] Specifically, when the second temperature control system provides a low temperature for the client system 13, if the temperature detected by the third temperature sensor 29 is greater than the set exhaust temperature, where the set exhaust temperature is the set exhaust temperature of the compressor 21, it indicates that the current exhaust temperature of the compressor 21 is too high. At this time, the exhaust temperature of the compressor 21 can be reduced by increasing the opening of the eleventh valve 28 to protect the motor of the compressor 21. On the contrary, if the temperature detected by the third temperature sensor 29 is less than the set exhaust temperature, it indicates that the current exhaust temperature of the compressor 21 is too low. At this time, the exhaust temperature of the compressor 21 can be increased by reducing the opening of the eleventh valve 28 to achieve the target refrigeration effect. In an optional embodiment, when adjusting the opening of the eleventh valve 28 according to the temperature detected by the third temperature sensor 29, a PID adjustment method can be adopted, the temperature control object is the set exhaust temperature, the feedback temperature is the temperature detected by the third temperature sensor 29, and the opening of the eleventh valve 28 is reversely cooled. Control.

[0060] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A dual-channel cooling and heating switching temperature control system for semiconductors, characterized in that: include: a first temperature control system and a second temperature control system; The first temperature control system includes a first circulating liquid circuit; the second temperature control system includes a second circulating liquid circuit and a refrigeration circuit, wherein the refrigeration circuit forms a first heat exchange structure with the second circulating liquid circuit through a first heat exchanger; The first circulating liquid loop includes a first circulating liquid tank, a first circulating liquid pump, a heater, a first valve, a second valve and a third valve; the first circulating liquid tank, the first circulating liquid pump, the heater, the first valve, the client system, the second valve and the first circulating liquid tank are sequentially connected by pipelines; one end of the third valve is connected to the pipeline between the heater and the first valve, and the other end of the third valve is connected to the pipeline between the second valve and the first circulating liquid tank; The second circulating liquid loop includes a second circulating liquid tank, a second circulating liquid pump, a fourth valve, a fifth valve and a sixth valve; the second circulating liquid tank, the second circulating liquid pump, the fourth valve, the client system, the fifth valve, the first heat exchanger and the second circulating liquid tank are sequentially connected by pipelines; one end of the sixth valve is connected to the pipeline between the second circulating liquid pump and the fourth valve, and the other end of the sixth valve is connected to the pipeline between the fifth valve and the second circulating liquid tank; When the client system needs to be heated up, the third valve, the fourth valve and the fifth valve are controlled to be closed, and the first valve, the second valve and the sixth valve are controlled to be opened; when the client system needs to be cooled down, the first valve, the second valve and the sixth valve are controlled to be closed, and the third valve, the fourth valve and the fifth valve are controlled to be opened.

2. The semiconductor dual-channel cooling and heating switching temperature control system according to claim 1 is characterized in that: The first circulating liquid tank is provided with a first liquid level sensor; the second circulating liquid tank is provided with a second liquid level sensor; The first circulating liquid tank and the second circulating liquid tank are connected via a seventh valve and an eighth valve respectively; the level of the seventh valve is higher than the level of the eighth valve.

3. The semiconductor dual-channel cooling and heating switching temperature control system according to claim 1 is characterized in that: The first temperature control system also includes a first water cooling circuit; the first water cooling circuit forms a second heat exchange structure with the first circulating liquid circuit through a second heat exchanger; along the flow direction of the circulating liquid, the second heat exchange structure is located in the pipeline before the first circulating liquid tank.

4. The semiconductor dual-channel cooling and heating switching temperature control system according to claim 3 is characterized in that: The second heat exchange structure divides the first water cooling circuit into a first cooling water inlet pipeline and a first cooling water outlet pipeline; a cooling water regulating valve is arranged on the first cooling water outlet pipeline.

5. The semiconductor dual-channel cooling and heating switching temperature control system according to claim 1, characterized in that: The first circulating liquid loop also includes a first temperature sensor; along the flow direction of the circulating liquid, the first temperature sensor is arranged in the pipeline after the heater.

6. The semiconductor dual-channel cooling and heating switching temperature control system according to claim 1, characterized in that: The second circulating liquid loop also includes a second temperature sensor; along the flow direction of the circulating liquid, the second temperature sensor is arranged in the pipeline after the second circulating liquid pump.

7. The semiconductor dual-channel cooling and heating switching temperature control system according to claim 1, characterized in that: The refrigeration circuit includes a compressor, an oil separator, and a ninth valve; the outlet of the compressor is connected to the inlet of the compressor through the oil separator, the ninth valve, and the first heat exchanger pipeline in sequence.

8. The semiconductor dual-channel cooling and heating switching temperature control system according to claim 7, characterized in that: The second temperature control system also includes a second water cooling circuit; the second water cooling circuit forms a third heat exchange structure with the refrigeration circuit through a third heat exchanger; the third heat exchanger is arranged in a pipeline connection between the oil separator and the ninth valve.

9. The semiconductor dual-channel cooling and heating switching temperature control system according to claim 8, characterized in that: The refrigeration circuit also includes a tenth valve; one end of the tenth valve is connected to the pipeline between the compressor and the third heat exchanger, and the other end of the tenth valve is connected to the pipeline between the ninth valve and the first heat exchanger.

10. The semiconductor dual-channel cooling and heating switching temperature control system according to claim 8, characterized in that: The refrigeration circuit also includes an eleventh valve and a third temperature sensor; one end of the eleventh valve is connected to the inlet pipe of the compressor, and the other end is connected to the pipeline between the third heat exchanger and the ninth valve; the third temperature sensor is arranged in the pipeline between the outlet of the compressor and the oil separator.

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