Method for checking jointed PCB (Printed Circuit Board) and computing equipment

Abstract

The invention relates to the technical field of data processing, and discloses a PCB jointed board inspection method and computing equipment, the PCB jointed board comprises a plurality of PCB single boards, and the method comprises the following steps: obtaining position coordinates of a plurality of feature points on the plurality of PCB single boards and jointed board information of the PCB jointed board; determining position coordinates of at least one target feature point corresponding to a first feature point in the plurality of feature points based on the position coordinates of the plurality of feature points and the jointed board information; based on the position coordinate of the second feature point on the at least one second PCB single board and the position coordinate of the at least one target feature point, determining an inspection result of the PCB jointed board; the at least one second PCB single board is the PCB single board except the first PCB single board in the plurality of PCB single boards, and the inspection result of the PCB jointed board is used for indicating whether the target feature point exists on the second PCB single board or not. According to the method and the device, the efficiency and the accuracy of checking the jointed PCB can be improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of data processing technology, and in particular to a PCB panel inspection method and computing device. Background Art

[0002] Since the size of a printed circuit board (PCB) is usually small and inconvenient to process, processing a single PCB board may result in low processing efficiency. Therefore, multiple PCB boards can be assembled into a whole PCB panel, so that the PCB panel can be processed to save production and processing time and improve production efficiency. In addition, reference points (or Mark points, optical positioning points, etc.) are usually set on the PCB panel so that automated equipment (such as placement machines, optical detection equipment, etc.) can accurately identify the position and direction of the PCB panel through the reference points during production and processing. Therefore, before processing the PCB panel, it is necessary to check the PCB panel to avoid problems such as the inability to process the PCB panel due to errors in the reference points on the PCB panel. Summary of the invention

[0003] The embodiments of the present application provide a PCB panel inspection method and computing device, which can improve the efficiency and accuracy of inspecting feature points of PCB panels.

[0004] In order to achieve the above purpose, the embodiment of the present application adopts the following technical solution:

[0005] In a first aspect, an embodiment of the present application provides a method for inspecting a PCB panel, wherein the PCB panel includes multiple PCB boards, and the method includes: obtaining position coordinates of multiple feature points on the multiple PCB boards and panel information of the PCB panel; wherein the panel information includes a panel method; based on the position coordinates of the multiple feature points and the panel information, determining the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points; wherein the first feature point is any feature point on a first PCB board, and the first PCB board is any PCB board among multiple PCB boards; based on the position coordinates of a second feature point on at least one second PCB board and the position coordinates of at least one target feature point, determining an inspection result of the PCB panel; wherein at least one second PCB board is a PCB board other than the first PCB board among multiple PCB boards, and the inspection result of the PCB panel is used to indicate whether there is a target feature point on the second PCB board.

[0006] Based on this solution, it is possible to realize automated inspection of PCB panels based on the position coordinates of multiple feature points on multiple PCB boards and the panelization method of the PCB panels, thereby avoiding inspection errors caused by manual inspection and improving the efficiency of PCB panel inspection.

[0007] In a possible implementation, the panelization method includes a centrally symmetrical panelization method, which determines the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information, including: determining the centrally symmetrical point of the PCB panel based on the position coordinates of the multiple feature points and the centrally symmetrical panelization method; determining the position coordinates of at least one target feature point that satisfies a centrally symmetrical relationship with the first feature point based on the position coordinates of the first feature point and the centrally symmetrical point.

[0008] Based on this solution, when the panelization method is a centrally symmetrical panelization method, the centrally symmetrical point of the PCB panel can be determined, and based on the position coordinates of the first feature point and the centrally symmetrical point, the position coordinates of at least one target feature point that satisfies a centrally symmetrical relationship with the first feature point can be determined, thereby enabling the inspection of the centrally symmetrical relationship between the feature points on the PCB panel.

[0009] In another possible implementation, the panelization method includes a mirror-symmetric panelization method, which determines the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information, including: determining the mirror symmetry axis of the PCB panel based on the position coordinates of the multiple feature points and the mirror-symmetric panelization method; determining the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point based on the position coordinates of the first feature point and the mirror symmetry axis.

[0010] Based on this solution, when the panelization method is a mirror-symmetric panelization method, the mirror symmetry axis of the PCB panel can be determined, and based on the position coordinates of the first feature point and the mirror symmetry axis, the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point can be determined, thereby enabling the inspection of the mirror symmetry relationship between the feature points on the PCB panel.

[0011] In another possible implementation, the panelization method includes a translation panelization method, and the panelization information also includes the number of multiple PCB boards; based on the position coordinates of multiple feature points and the panelization information, the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points are determined, including: based on the position coordinates of multiple feature points and the translation panelization method, multiple feature points to be checked with the same vertical coordinate or horizontal coordinate on multiple PCB boards are obtained; based on the position coordinates of the multiple feature points to be checked, the number of the multiple feature points to be checked and the number of the multiple PCB boards, a target offset is determined; based on the position coordinates of the first feature point among the multiple feature points to be checked and the target offset, the position coordinates of at least one target feature point corresponding to the first feature point are determined; wherein the first feature point is any feature point to be checked among the multiple feature points to be checked.

[0012] Based on this scheme, when the panelization method is a translation panelization method, it is possible to determine the target offset between each feature point to be checked based on multiple feature points to be checked with the same vertical coordinate or horizontal coordinate on multiple PCB boards, as well as the number of multiple feature points to be checked and the number of multiple PCB boards; and based on the position coordinates of the first feature point among the feature points to be checked and the target offset, determine the position coordinates of at least one target feature point that satisfies a translation relationship with the first feature point, thereby enabling the inspection of the translation relationship between each feature point on the PCB panel.

[0013] In another possible implementation, a target offset is determined based on the position coordinates of multiple feature points to be checked, the number of multiple feature points to be checked, and the number of multiple PCB boards, including: determining the number of translations based on the number of multiple feature points to be checked and the number of multiple PCB boards; determining the translation distance based on the position coordinates of the multiple feature points to be checked; and determining the target offset based on the translation distance and the number of translations.

[0014] Based on this solution, the number of translations can be determined based on the number of multiple feature points to be checked and the number of multiple PCB boards, and the translation distance can be determined based on the position coordinates of the multiple feature points to be checked. Therefore, the target offset between each feature point to be checked can be determined based on the translation distance and the number of translations, so as to realize the inspection of the translation relationship between each feature point on the PCB panel based on the target offset.

[0015] In another possible implementation, based on the position coordinates and target offset of a first feature point among multiple feature points to be checked, the position coordinates of at least one target feature point corresponding to the first feature point are determined, including: based on the position coordinates of the first feature point, the number of translations and the target offset, the position coordinates of at least one target feature point corresponding to the first feature point are determined; wherein the at least one target feature point is a target feature point corresponding to each translation, and the number of the at least one target feature point is equal to the number of translations.

[0016] Based on this solution, when determining the position coordinates of at least one target feature point that satisfies a translation relationship with the first feature point, the position coordinates of the target feature point corresponding to each translation of the first feature point can be determined based on the position coordinates of the first feature point and the target offset.

[0017] In another possible implementation, based on the position coordinates of a first feature point among multiple feature points to be checked and a target offset, the position coordinates of at least one target feature point corresponding to the first feature point are determined, including: traversing multiple feature points to be checked, and determining the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determining the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0018] Based on this solution, when determining the position coordinates of at least one target feature point that satisfies a translation relationship with the first feature point, each feature point to be checked can also be traversed in turn, and based on the sum of the position coordinates of each feature point to be checked and the position coordinates of the target offset, and / or the difference between the position coordinates of each feature point to be checked and the position coordinates of the target offset, the target feature point corresponding to each feature point to be checked can be determined.

[0019] In another possible implementation, the panelization method includes a translation panelization method, which determines the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information, including: obtaining multiple feature points to be checked on multiple PCB boards with the same vertical coordinate or horizontal coordinate based on the position coordinates of the multiple feature points; determining the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards based on the position coordinates of the multiple feature points; if the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards is not exactly the same, determining the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information.

[0020] Based on this solution, when the panelization method is a translation panelization method, the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards can also be determined first, and it can be determined whether the actual offsets are equal. If the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards is not completely the same, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points can be determined based on the position coordinates of the multiple feature points and the panelization information.

[0021] In another possible implementation, the inspection result of the PCB panel is determined based on the position coordinates of a second feature point on at least one second PCB board and the position coordinates of at least one target feature point, including: if there is no second feature point on at least one second PCB board with the same position coordinates as the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point has failed the inspection; if there is a second feature point on at least one second PCB board with position coordinates equal to the position coordinates of the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point and the second feature point have passed the inspection.

[0022] Based on this solution, after determining the position coordinates of at least one target feature point corresponding to the first feature point on the first PCB board, if there is no second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board other than the first PCB board, it can be determined that the first feature point has not passed the inspection; if there is a second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board, it means that the first feature point and the second feature point satisfy a symmetric relationship or a translation relationship, and it can be determined that the first feature point and the second feature point have passed the inspection.

[0023] In a second aspect, an embodiment of the present application further provides a PCB panel inspection device, the device comprising: an acquisition module, configured to acquire the position coordinates of multiple feature points on multiple PCB boards included in the PCB panel and panel information of the PCB panel; wherein the panel information includes a panel method; a first determination module, configured to determine the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panel information; wherein the first feature point is any feature point on a first PCB board, and the first PCB board is any PCB board among multiple PCB boards; a second determination module, configured to determine the inspection result of the PCB panel based on the position coordinates of a second feature point on at least one second PCB board and the position coordinates of at least one target feature point; wherein at least one second PCB board is a PCB board other than the first PCB board among multiple PCB boards, and the inspection result of the PCB panel is used to indicate whether there is a target feature point on the second PCB board.

[0024] In one possible implementation, the panelization method includes a centrally symmetrical panelization method, and the first determination module is specifically configured to: determine the centrally symmetrical point of the PCB panel based on the position coordinates of multiple feature points and the centrally symmetrical panelization method; determine the position coordinates of at least one target feature point that satisfies a centrally symmetrical relationship with the first feature point based on the position coordinates of the first feature point and the centrally symmetrical point.

[0025] In another possible implementation, the panelization method includes a mirror-symmetric panelization method, and the first determination module is specifically configured to: determine the mirror symmetry axis of the PCB panel based on the position coordinates of multiple feature points and the mirror-symmetric panelization method; determine the position coordinates of at least one target feature point that satisfies a mirror-symmetric relationship with the first feature point based on the position coordinates of the first feature point and the mirror symmetry axis.

[0026] In another possible implementation, the panelization method includes a translation panelization method, and the panelization information also includes the number of multiple PCB boards; the first determination module is specifically configured to: based on the position coordinates of multiple feature points and the translation panelization method, obtain multiple feature points to be checked with the same vertical coordinate or horizontal coordinate on multiple PCB boards; based on the position coordinates of the multiple feature points to be checked, the number of the multiple feature points to be checked and the number of the multiple PCB boards, determine the target offset; based on the position coordinates of the first feature point among the multiple feature points to be checked and the target offset, determine the position coordinates of at least one target feature point corresponding to the first feature point; wherein the first feature point is any feature point to be checked among the multiple feature points to be checked.

[0027] In another possible implementation, the first determination module is further configured to: determine the number of translations based on the number of feature points to be checked and the number of PCB boards; determine the translation distance based on the position coordinates of the feature points to be checked; and determine the target offset based on the translation distance and the number of translations.

[0028] In another possible implementation, the first determination module is specifically configured to: determine the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point, the number of translations and the target offset; wherein the at least one target feature point is the target feature point corresponding to each translation, and the number of at least one target feature point is equal to the number of translations.

[0029] In another possible implementation, the first determination module is specifically configured to: traverse multiple feature points to be checked, and determine the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determine the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0030] In another possible implementation method, the panelization method includes a translation panelization method, and the first determination module is specifically configured as follows: based on the position coordinates of multiple feature points and the translation panelization method, multiple feature points to be checked with the same vertical coordinate or horizontal coordinate on multiple PCB boards are obtained; based on the position coordinates of the multiple feature points to be checked, the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards is determined; if the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards is not exactly the same, then based on the position coordinates of the multiple feature points and the panelization information, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points are determined.

[0031] In another possible implementation, the second determination module is specifically configured as follows: if there is no second feature point on at least one second PCB board whose position coordinates are the same as the position coordinates of the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point has failed the inspection; if there is a second feature point on at least one second PCB board whose position coordinates are equal to the position coordinates of the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point and the second feature point have passed the inspection.

[0032] In a third aspect, an embodiment of the present application further provides a computing device, comprising: a processor and a memory; the processor and the memory are coupled; the memory is used to store program instructions; the processor is used to execute the program instructions to execute any method as described in the first aspect above.

[0033] In a fourth aspect, an embodiment of the present application provides a chip, which is used to execute any method in the first aspect above.

[0034] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, in which computer-executable instructions are stored. When the computer-executable instructions are executed by a computer, a method as described in any one of the first aspects is implemented.

[0035] In a sixth aspect, an embodiment of the present application provides a program product, including a computer program, which implements any method in the first aspect when executed by a processor. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A flowchart of a PCB panel inspection method provided in an embodiment of the present application;

[0037] Figure 2 A schematic diagram of a PCB panel provided in an embodiment of the present application;

[0038] Figure 3A A schematic diagram of a centrosymmetric paneling method provided in an embodiment of the present application;

[0039] Figure 3B A schematic diagram of a mirror-symmetrical paneling method provided in an embodiment of the present application;

[0040] Figure 3C A schematic diagram of a translational paneling method provided in an embodiment of the present application;

[0041] Figure 3D A schematic diagram of a combined paneling method provided in an embodiment of the present application;

[0042] Figure 4 A flowchart for determining the position coordinates of at least one target feature point provided in an embodiment of the present application;

[0043] Figure 5 A schematic diagram of another centrosymmetric paneling method provided in an embodiment of the present application;

[0044] Figure 6 Another flow chart for determining the position coordinates of at least one target feature point provided in an embodiment of the present application;

[0045] Figure 7 A schematic diagram of another mirror-symmetrical paneling method provided in an embodiment of the present application;

[0046] Figure 8 A flowchart for determining the position coordinates of at least one target feature point provided in an embodiment of the present application;

[0047] Fig. 9 A schematic diagram of another translational puzzle provided in an embodiment of the present application;

[0048] Fig.10 A flow chart for determining a target offset provided in an embodiment of the present application;

[0049] Fig.11 A schematic diagram of another translational puzzle provided in an embodiment of the present application;

[0050] Fig.12 A flowchart for determining the position coordinates of at least one target feature point provided in another embodiment of the present application;

[0051] Fig.13 A flowchart for determining the inspection result of a PCB panel provided in an embodiment of the present application;

[0052] Fig.14 A schematic diagram of an interface of a PCB panel inspection system provided in an embodiment of the present application;

[0053] Fig.15 A flowchart of another PCB panel inspection method provided in an embodiment of the present application;

[0054] Fig.16 A schematic diagram of a PCB panel inspection device provided in an embodiment of the present application;

[0055] Fig.17 A schematic diagram of a computing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0056] The technical solution in the embodiment of the present application will be described below in conjunction with the drawings in the embodiment of the present application. In order to facilitate the clear description of the technical solution in the embodiment of the present application, the first, second, etc. descriptions appearing in the embodiment of the present application are only used for illustration and distinction of the description objects, and there is no order, nor does it represent a special limitation on the number of devices in the embodiment of the present application, and cannot constitute any limitation on the embodiment of the present application.

[0057] The embodiments of the present application provide a PCB panel inspection method and computing device, which can inspect the PCB panel according to the position coordinates of multiple feature points on multiple PCB boards and the panelization method of the PCB panel to determine whether there are errors in the positions of each feature point on the PCB panel, thereby improving the efficiency and accuracy of inspecting the feature points of the PCB panel.

[0058] The PCB panel inspection method provided in the embodiment of the present application can be applied to a computing device, which can be a server or a terminal device. In practical applications, a PCB panel inspection system can be deployed on a computing device, so that a user can inspect the PCB panel through the PCB panel inspection system in the computing device to determine whether there are errors in the positions of the feature points on the PCB panel; and the inspection results of the PCB panel can be displayed through the user interface of the PCB panel inspection system to facilitate the user to view the inspection results.

[0059] Figure 1 A flowchart of a PCB panel inspection method provided in an embodiment of the present application. Figure 1 As shown, the method includes steps 110 to 130.

[0060] Step 110, obtaining the position coordinates of multiple feature points on multiple PCB boards included in the PCB panel and the panel information of the PCB panel.

[0061] A PCB panel may include multiple PCB boards, and the embodiment of the present application does not limit the number of PCB boards included in the PCB panel. In some embodiments, the engineering file of the PCB panel to be inspected can be obtained first, and the engineering file usually includes identification information and feature point information corresponding to multiple feature points, as well as identification information and component information corresponding to other components other than the feature points. The multiple identification information in the engineering file can be traversed through the library function preset in the PCB panel inspection system, and the identification information corresponding to the feature point can be filtered out from the multiple identification information, so as to obtain the feature point information corresponding to the feature point in the engineering file based on the identification information corresponding to the feature point.

[0062] For example, the characteristic points on a PCB may include reference points, actual connection points, center points of devices, etc. The reference points are used to realize the positioning of the PCB by the processing equipment during production and processing, and the actual connection points are used to connect the PCB to the frame of the PCB panel or other PCB. Figure 2 A schematic diagram of a PCB panel is shown in FIG. Figure 2 As shown, the PCB panel includes two PCB boards, namely a first PCB board and a second PCB board, feature points A and B on the first PCB board and feature points A' and B' on the second PCB board are respectively connected to the panel border of the PCB panel, feature point C on the first PCB board is connected to the second PCB board, and feature point C' on the second PCB board is connected to the first PCB board, that is, feature points A, A', B, B', C and C' are real connection points; feature points D and E on the first PCB board and feature points D' and E' on the second PCB board are reference points.

[0063] Exemplarily, the feature point information corresponding to the feature point may include information such as the initial position coordinates of the feature point, wherein the initial position coordinates corresponding to the feature point may be the position coordinates of the reference point, the real connection point, or the center point of the device. The feature point information may also include information such as pins and device size. Since each device has a corresponding pin, after obtaining multiple pins corresponding to multiple devices, the multiple pins may be deduplicated, that is, multiple devices may be deduplicated to delete duplicate devices.

[0064] In some embodiments, the panelization information of the PCB panel includes the panelization method of the PCB panel. Among them, the panelization method may include a symmetric panelization method and a panning copy panelization method (Panning Copy Panel). Among them, the symmetric panelization method may include a central symmetry panelization method (Central Symmetry Panel) and a mirror symmetry panelization method (Mirror Symmetry Panel). In this embodiment, the specific form of the panelization method is not limited.

[0065] Exemplarily, the panelization method of the PCB panel can be one panelization method or a combination of multiple panelization methods. For example, the panelization method of the PCB panel can be any one of a mirror symmetric panelization method, a central symmetric panelization method or a translation panelization method, or a combination of at least two of the above three panelization methods.

[0066] refer to Figure 3A The schematic diagram of a central symmetrical paneling method is shown in FIG. Figure 3A As shown, the second PCB board can be obtained by rotating the first PCB board 180° around the central symmetry point O, that is, the first PCB board and the second PCB board satisfy the central symmetry relationship, and the PCB panelization is a central symmetric panelization method.

[0067] refer to Figure 3B The diagram of a mirror-symmetric paneling method is shown in FIG. Figure 3B As shown, the first PCB board and the second PCB board are symmetrical about the straight line m, that is, the first PCB board and the second PCB board satisfy a mirror symmetry relationship (or an axisymmetric relationship), and the PCB panelization is a mirror symmetric panelization method (or an axisymmetric panelization method).

[0068] refer to Figure 3C A schematic diagram of a translational paneling method is shown in FIG. Figure 3C As shown, a second PCB board can be obtained by translating the first PCB panel, that is, the first PCB board and the second PCB board satisfy a translation relationship, and the PCB panel is a translation panel.

[0069] refer to Figure 3D A schematic diagram of a combined paneling method is shown in FIG. Figure 3D As shown, the first PCB board A and the second PCB board B satisfy a central symmetric relationship, and the first PCB board A' and the second PCB board B' satisfy a central symmetric relationship; and the first PCB board A and the first PCB board A' satisfy a translation relationship, and the first PCB board B and the first PCB board B' satisfy a translation relationship, that is, the PCB panelization is a combination of a central symmetric panelization method and a translational panelization method.

[0070] Exemplarily, the panelization method of the PCB panel can be determined based on the information input by the user, that is, the user can determine the panelization method of the PCB panel based on the engineering files of the PCB panel, and then input the panelization method of the PCB panel into the PCB panel inspection system.

[0071] Step 120: Determine the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panel information.

[0072] In some embodiments, after obtaining the position coordinates and panel information of multiple feature points on multiple PCB boards, a target inspection algorithm can be determined based on the panelization method of the PCB panels, and then a corresponding coordinate model (hereinafter referred to as a target coordinate system) can be established based on the target inspection algorithm. After determining the target coordinate system, multiple feature points can be inspected based on the target inspection algorithm to determine whether there are errors in the positions of the feature points, such as whether the feature points conform to a symmetric relationship, a translation relationship, etc.

[0073] Exemplarily, the target inspection algorithm may include a central symmetry inspection algorithm, a mirror symmetry inspection algorithm, a translation copy inspection algorithm, etc. For example, when the panelization method is a central symmetry panelization method, the central symmetry inspection algorithm may be used; when the panelization method is a mirror symmetry panelization method, the mirror symmetry inspection algorithm may be used; when the panelization method is a translation panelization method, the translation copy inspection algorithm may be used.

[0074] Exemplarily, in the process of checking multiple feature points, the position coordinates of at least one target feature point corresponding to the first feature point on the first PCB board can be determined based on the above target inspection algorithm. Wherein, the PCB panel includes multiple PCB boards, the first PCB board is any PCB board among the multiple PCB boards, and the first feature point is any feature point on the first PCB board; the target feature point and the first feature point satisfy a symmetric relationship or a translation relationship corresponding to the panelization method.

[0075] For example, when inspecting a PCB panel, any feature point (i.e., the first feature point) on any of the multiple PCB panels can be used as a reference feature point. Based on the target inspection algorithm corresponding to the panelization method of the PCB panel, at least one target feature point that satisfies a symmetry relationship or translation relationship with the reference feature point corresponding to the panelization method can be determined.

[0076] Exemplarily, the PCB panel inspection system can determine the corresponding target inspection algorithm in response to the panelization method input by the user, and inspect the characteristic points on the PCB panel based on the target inspection algorithm. Alternatively, the user can also select the corresponding target inspection algorithm in the PCB panel inspection system after determining the panelization method of the PCB panel, so that the PCB panel inspection system responds to the target inspection algorithm input by the user, and inspects the characteristic points on the PCB panel based on the target inspection algorithm.

[0077] Step 130, determining the inspection result of the PCB panel based on the position coordinates of the second feature point on at least one second PCB board and the position coordinates of at least one target feature point.

[0078] In some embodiments, after determining the position coordinates of the at least one target feature point, it is possible to determine whether there is a feature point on at least one second PCB board that is the same as the position coordinates of the at least one target feature point based on the position coordinates of the second feature point on at least one second PCB board and the position coordinates of the at least one target feature point, thereby determining the inspection result of the PCB panel. Exemplarily, if there is no second feature point on at least one second PCB board other than the first PCB board that is equal to the position coordinates of the at least one target feature point, it can be determined that the first feature point has not passed the inspection; if there is a second feature point on at least one second PCB board that is equal to the position coordinates of the at least one target feature point, it can be determined that the first feature point and the second feature point have passed the inspection. Wherein, at least one second PCB board is a PCB board other than the first PCB board among the multiple PCB boards.

[0079] The PCB panel inspection method provided in the embodiment of the present application can automatically inspect the feature points on the PCB panel and determine the inspection result of the PCB panel based on the panelization method of the PCB panel and the position coordinates of multiple feature points on multiple PCB boards in the PCB panel through the PCB panel inspection system. No human intervention is required in this process, thereby improving the inspection efficiency of the PCB panel and improving the accuracy of the PCB panel inspection.

[0080] Figure 4 A flowchart for determining the position coordinates of at least one target feature point is provided in an embodiment of the present application. Figure 4 As shown, when the panelization method is a centrally symmetrical panelization method, the above step 120 includes steps 410 to 420.

[0081] Step 410, based on the position coordinates of multiple feature points and the central symmetric panelization method, determine the central symmetric point of the PCB panel.

[0082] In some embodiments, when the panelization method is a centrally symmetrical panelization method, the centrally symmetrical point of the PCB panel and the position coordinates of the centrally symmetrical point can be determined based on a centrally symmetrical check algorithm, and the centrally symmetrical point can be determined as the origin of the target coordinate system, thereby establishing a target coordinate system based on the origin.

[0083] Exemplarily, the position coordinates of multiple feature points can be used to calculate the midpoint coordinates corresponding to each feature point on the first PCB board and all feature points on the second PCB board, and the midpoint coordinates with the largest number among the multiple midpoint coordinates are determined as the position coordinates of the central symmetric point; or a cluster analysis is performed on the multiple midpoint coordinates, and the densest cluster is selected from the cluster analysis results, and then the average value of the midpoint coordinates in this cluster is determined as the position coordinates of the central symmetric point of the PCB panel. Alternatively, the feature points on the PCB panel may also include points on the border of the PCB board, and the geometric center point of each PCB board can be determined based on the position coordinates of the feature points on the borders of the multiple PCB boards, and the central symmetric point of the PCB panel can be determined based on the geometric center point of each PCB board. It should be noted that the embodiment of the present application does not limit the method for determining the central symmetric point of the PCB panel, and the above is only an exemplary description.

[0084] Step 420: Based on the position coordinates of the first feature point and the central symmetric point, determine the position coordinates of at least one target feature point that satisfies a central symmetric relationship with the first feature point.

[0085] In some embodiments, when the PCB panelization method is a centrosymmetric panelization, it is possible to check whether the feature points on each PCB board conform to the centrosymmetric relationship based on a centrosymmetric checking algorithm.

[0086] Exemplarily, the position coordinates of at least one target feature point that satisfies a central symmetric relationship with the first feature point can be determined based on the position coordinates of the first feature point on the first PCB and the target coordinate system. For example, the position coordinates (x', y') of at least one target feature point that satisfies a central symmetric relationship with the first feature point can be determined according to formula (1):

[0087]

[0088] Where (x0, y0) is the position coordinate of the origin O of the target coordinate system, and (x, y) is the position coordinate of the first feature point. Formula (1) indicates that the distance x0-x′ between the horizontal coordinate x′ of the target feature point and the y axis is equal to the horizontal coordinate x of the first feature point A. A The distance from the y axis is x0-x A , and x' and x Aare opposite to each other; and the distance y0-y′ between the ordinate y′ of the target feature point and the x-axis is equal to the ordinate y of the first feature point A. A The distance from the x-axis is y0-y A , and y' and y A They are opposite numbers.

[0089] refer to Figure 5 The schematic diagram of another central symmetric paneling method is shown in FIG. Figure 5 As shown, the first feature point on the first PCB is taken as feature point A, and the position coordinates of the first feature point A are (x A ,y A ) as an example. Since the PCB paneling method is a central symmetric paneling, the first feature point A(x A ,y A )The position coordinates (x', y') of the target feature point that satisfies the central symmetry relationship.

[0090] Exemplarily, the position coordinates (x', y') of at least one target feature point that satisfies a central symmetric relationship with the first feature point may also be determined according to formula (2):

[0091]

[0092] Where ρ is the distance between the first feature point and the origin O (i.e., the polar diameter), and θ is the angle between the line between the origin O and the first feature point and the x-axis of the target coordinate system (i.e., the polar angle). Formula (2) indicates that the distance between the target feature point and the origin O is equal to the distance between the first feature point and the origin O, both of which are ρ; and the polar angle of the target feature point is π+θ. Figure 5 As shown, the position coordinates (x A ,y A ) is converted into polar coordinates (ρ, θ), and the position coordinates (x', y') of the target feature point are determined based on the polar coordinates (ρ, θ) of the first feature point A.

[0093] Through the above scheme, when the panelization method is a centrally symmetrical panelization method, the centrally symmetrical point of the PCB panel can be determined, and based on the position coordinates of the first feature point and the centrally symmetrical point, the position coordinates of at least one target feature point that satisfies a centrally symmetrical relationship with the first feature point can be determined, thereby enabling the inspection of the centrally symmetrical relationship between the feature points on the PCB panel to be realized.

[0094] Figure 6 Another flow chart for determining the position coordinates of at least one target feature point provided in an embodiment of the present application. Figure 6As shown, when the panelization method is a mirror-symmetrical panelization method, the above step 120 includes steps 610 to 620.

[0095] Step 610, based on the position coordinates of the plurality of feature points and the mirror symmetric paneling method, determine the mirror symmetry axis of the PCB panel.

[0096] In some embodiments, when the panelization method is a mirror-symmetric panelization method, the mirror symmetry axis of the PCB panel can be determined based on a mirror symmetry checking algorithm, and the coordinate axes (such as the x-axis and the y-axis) of the target coordinate system can be determined based on the mirror symmetry axis, thereby establishing the target coordinate system based on the coordinate axes.

[0097] Exemplarily, taking horizontal mirror symmetry as an example, the candidate mirror symmetry axes corresponding to each feature point on the first PCB board and all feature points on the second PCB board can be calculated based on the position coordinates of multiple feature points, and the candidate mirror symmetry axes with the largest number of the same among the multiple candidate mirror symmetry axes are determined as the mirror symmetry axes of the PCB panel. Alternatively, the feature points on the PCB panel can also include points on the border of the PCB board, and the geometric center points of each PCB board can be determined based on the position coordinates of the feature points on the borders of multiple PCB boards, and the mirror symmetry axis of the PCB panel can be determined based on the line connecting the geometric center points of each PCB board and the straight line perpendicular to the line. It should be noted that the above method of determining the mirror symmetry axis of the PCB panel is only an example and is not limited to this embodiment.

[0098] Step 620: Based on the position coordinates of the first feature point and the mirror symmetry axis, determine the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point.

[0099] In some embodiments, when the PCB panelization method is mirror-symmetric panelization, it is possible to check whether the feature points on each PCB board conform to the mirror-symmetric relationship based on a mirror-symmetry checking algorithm.

[0100] For example, the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point can be determined based on the position coordinates of the first feature point on the first PCB and the target coordinate system. For example, when the mirror symmetry axis is the y-axis, the position coordinates (x', y') of the target feature point can be determined according to formula (3):

[0101]

[0102] Where x0 is the horizontal coordinate of the origin O of the target coordinate system, and (x, y) is the coordinate of the first feature point. Formula (3) indicates that the distance x0-x′ between the horizontal coordinate x′ of the target feature point and the y-axis is equal to the horizontal coordinate x of the first feature point A. AThe distance from the y axis is x0-x A , and x' and x A are opposite to each other; and the ordinate y' of the target feature point is the same as the ordinate y of the first feature point A A equal.

[0103] refer to Figure 7 The diagram of another mirror-symmetric paneling method is shown in FIG. Figure 7 As shown, the first feature point on the first PCB is taken as feature point A, and the position coordinates of the first feature point A are (x A ,y A ) as an example. Since the panelization method of the PCB panel is mirror symmetric panelization, and the mirror symmetry axis is the y-axis, the position coordinates (x', y') of the target feature point that satisfies the mirror symmetry relationship with the first feature point A about the y-axis can be determined based on the above formula (3).

[0104] For example, when the mirror symmetry axis is the y-axis, the position coordinates (x', y') of the target feature point can also be determined according to formula (4):

[0105]

[0106] Where ρ is the distance between the first feature point A and the origin O, and θ is the angle between OA (i.e., the line between the origin O and the first feature point A) and the x-axis of the target coordinate system. Formula (4) indicates that the distance between the target feature point and the origin O is equal to the distance between the first feature point A and the origin O, both of which are ρ; and the polar angle of the target feature point is π-θ.

[0107] For example, when the mirror symmetry axis is the x-axis, the position coordinates (x', y') of the target feature point can be determined according to formula (5):

[0108]

[0109] When the mirror symmetry axis is the x-axis, the position coordinates (x', y') of the target feature point can also be determined according to formula (6):

[0110]

[0111] Among them, the method of determining the position coordinates of the target feature point when the mirror symmetry axis is the x-axis is the same as the principle of determining the position coordinates of the target feature point when the mirror symmetry axis is the y-axis, and will not be repeated here.

[0112] Through the above scheme, when the panelization method is a mirror-symmetrical panelization method, the mirror symmetry axis of the PCB panel can be determined, and based on the position coordinates of the first feature point and the mirror symmetry axis, the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point can be determined, thereby enabling the inspection of the mirror symmetry relationship between the feature points on the PCB panel.

[0113] In some embodiments, when the panelization method is a translation panelization method, the position coordinates of the origin of the target coordinate system can be arbitrarily selected, and the target coordinate system can be established based on the origin. For example, a point with a position coordinate of (0, 0) in the PCB panel can be used as the origin of the target coordinate system, which is not limited in this embodiment.

[0114] Figure 8 A flowchart for determining the position coordinates of at least one target feature point is provided in an embodiment of the present application. Figure 8 As shown, in the case where the panelization method is a translation panelization method, the above step 120 includes steps 810 to 830.

[0115] Step 810, based on the position coordinates of the multiple feature points and the translation panelization method, obtain multiple feature points to be checked on multiple PCB boards with the same vertical coordinate or horizontal coordinate.

[0116] In some embodiments, when the panelization method of the PCB panels is a translation panelization method, it is possible to check whether the feature points on each PCB board conform to the translation relationship based on the translation replication symmetry check algorithm. The feature points on each PCB board conform to the translation relationship when: the translation distance (hereinafter referred to as the offset) between the feature points at corresponding positions on each adjacent PCB board is equal.

[0117] Exemplarily, in the process of checking whether the feature points on each PCB board conform to the translation relationship, multiple feature points to be checked with the same vertical coordinate or horizontal coordinate on multiple PCB boards can be obtained based on the position coordinates of multiple feature points. For example, when the panelization method of the PCB panels is horizontal translation panelization, multiple feature points to be checked with the same vertical coordinate on multiple PCB boards can be obtained; when the panelization method of the multiple PCB boards is vertical translation panelization, multiple feature points to be checked with the same horizontal coordinate on multiple PCB boards can be obtained.

[0118] refer to Fig. 9 Another schematic diagram of a translational jigsaw puzzle is shown in FIG. Fig. 9As shown, taking the horizontal translation paneling method as an example, the PCB paneling includes four PCB boards, namely PCB board 1, PCB board 2, PCB board 3 and PCB board 4, and multiple feature points to be checked with the same vertical coordinates on PCB board 1, PCB board 2, PCB board 3 and PCB board 4 can be obtained. For example, feature point A1, feature point D1, feature point A2, feature point D2, feature point A3, feature point D3, feature point A4 and feature point D4 can be obtained as a group of feature points to be checked; and feature point B1, feature point B2, feature point B3 and feature point B4 can be obtained as a group of feature points to be checked; and feature point C1, feature point C2, feature point C3 and feature point C4 can be obtained as a group of feature points to be checked.

[0119] Step 820: determining a target offset based on the position coordinates of the plurality of feature points to be checked, the number of the plurality of feature points to be checked, and the number of the plurality of PCB boards.

[0120] In some embodiments, after obtaining multiple feature points to be checked, the target offset can be determined based on the position coordinates of the multiple feature points to be checked, the number of the multiple feature points to be checked, and the number of the multiple PCB boards. The panel information also includes the number of the multiple PCB boards; the target offset is the correct offset between the feature points to be checked at corresponding positions on each adjacent PCB board.

[0121] Step 830 : determining the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point among the plurality of feature points to be checked and the target offset.

[0122] In some embodiments, after determining the target offset, the position coordinates of at least one target feature point corresponding to the first feature point can be determined based on the position coordinates of any feature point to be checked (i.e., the first feature point) among the plurality of feature points to be checked and the target offset. The target feature point and the first feature point satisfy a translation relationship, i.e., the offset between the position coordinates of the target feature point and the position coordinates of the first feature point is N times the target offset, such as 1 times (i.e., the offset between the position coordinates of the target feature point and the position coordinates of the first feature point is equal to the target offset), 2 times, 3 times, etc.

[0123] Through the above scheme, when the panelization method is a translation panelization method, the target offset between each feature point to be checked can be determined based on multiple feature points to be checked with the same vertical coordinate or horizontal coordinate on multiple PCB boards, as well as the number of multiple feature points to be checked and the number of multiple PCB boards; and based on the position coordinates of the first feature point among the feature points to be checked and the target offset, the position coordinates of at least one target feature point that satisfies a translation relationship with the first feature point are determined, thereby enabling the inspection of the translation relationship between each feature point on the PCB panel.

[0124] Fig.10 A flow chart for determining a target offset is provided in an embodiment of the present application. Fig.10 As shown, the above step 820 includes steps 1010 to 1030.

[0125] Step 1010: Determine the number of translations based on the number of feature points to be checked and the number of PCB boards.

[0126] In some embodiments, when the panelization method of the PCB panel is translation panelization, the PCB panel is obtained by translating a single PCB board N times. Therefore, the number of translations of the single PCB board can be determined first, and the total translation distance (hereinafter referred to as translation distance) can be determined based on the position coordinates of multiple feature points to be checked, so as to determine the target offset based on the translation distance and the number of translations.

[0127] Exemplarily, there may be multiple quantitative relationships between the acquired feature points to be checked and the PCB boards. Therefore, the number of translations of the PCB boards can be determined based on the number of multiple feature points to be checked and the number of multiple PCB boards.

[0128] For example, when the number of feature points to be checked is equal to the number of PCB boards, the number of translations is the number of feature points minus 1, that is, the number of PCB boards minus 1. Fig. 9 As shown, the number of feature points C1 to be checked, the number of feature points C2 to be checked, the number of feature points C3 to be checked and the number of feature points C4 to be checked is 4, and the number of PCB boards is 4, that is, the number of feature points to be checked is equal to the number of PCB boards, then the number of translations is the number of feature points - 1 or the number of PCB boards - 1, that is, the number of translations is 3 times.

[0129] For another example, when the number of feature points to be checked is N times the number of PCB boards (N is a positive integer, and N is greater than 1), the number of translations is the number of PCB boards - 1. Fig. 9As shown, the number of feature points A1 to be checked, feature points D1 to be checked, feature points A2 to be checked, feature points D2 to be checked, feature points A3 to be checked, feature points D3 to be checked, feature points A4 to be checked and feature points D4 to be checked is 8, and the number of PCB boards is 4, that is, the number of feature points to be checked is twice the number of PCB boards, and the number of translations is 3 times.

[0130] For another example, when the number of feature points to be checked is one more than the number of PCB boards, the number of translations is the number of feature points minus 1, which is equal to the number of PCB boards. Fig. 9 As shown, the number of feature points B1 to be checked, B2 to be checked, B3 to be checked, B4 to be checked and B5 to be checked is 5, and the number of PCB boards is 4, that is, the number of feature points to be checked is 1 more than the number of PCB boards, then the number of translations is the number of feature points - 1 or equal to the number of PCB boards, that is, the number of translations is 4.

[0131] For another example, when the number of feature points to be checked is 1 less than the number of PCB boards, the number of translations is the number of feature points minus 1, that is, the number of PCB boards minus 2. Fig.11 In the schematic diagram of another translational panel shown, the number of feature points B2 to be checked, the number of feature points B3 to be checked and the number of feature points B4 to be checked is 3, and the number of PCB boards is 4, that is, the number of feature points to be checked is 1 less than the number of PCB boards, then the number of translations is the number of feature points - 1 or the number of PCB boards - 2, that is, the number of translations is 2 times.

[0132] Step 1020: Determine the translation distance based on the position coordinates of the plurality of feature points to be checked.

[0133] Exemplarily, after determining the number of translations, the translation distance may be determined based on the position coordinates of the feature point to be checked with the smallest abscissa or ordinate value and the position coordinates of the feature point to be checked with the largest abscissa or ordinate value.

[0134] For instance, taking the horizontal translation panelization method as an example, when the number of feature points to be checked is equal to the number of PCB boards, or the number of feature points to be checked is 1 more than the number of PCB boards, or the number of feature points to be checked is 1 less than the number of PCB boards, the translation distance can be determined based on the difference between the position coordinates of the feature point to be checked with the smallest horizontal coordinate value and the position coordinates of the feature point to be checked with the largest horizontal coordinate value.

[0135] like Fig. 9As shown, taking feature points B1 to be checked, feature points B2 to be checked, feature points B3 to be checked, feature points B4 to be checked and feature points B5 to be checked as examples, the translation distance between feature points B1 to be checked and feature points B5 to be checked can be determined based on the difference between the position coordinates of feature points B5 to be checked and the position coordinates of feature points B1 to be checked.

[0136] For another example, when the number of feature points to be checked is N times the number of PCB boards (N is a positive integer, and N is greater than 1), the position coordinates of multiple feature points to be checked can be sorted from small to large, and the translation distance can be determined based on the difference between the position coordinates of the Nth feature point to be checked after sorting and the position coordinates of the last feature point to be checked (i.e., the position coordinates of the feature point to be checked with the largest horizontal coordinate value); the translation distance can also be determined based on the difference between the position coordinates of the Nth to last feature point to be checked after sorting and the position coordinates of the first feature point to be checked (i.e., the position coordinates of the feature point to be checked with the smallest horizontal coordinate value).

[0137] like Fig. 9 As shown, taking feature points A1 to be checked, feature points D1 to be checked, feature points A2 to be checked, feature points D2 to be checked, feature points A3 to be checked, feature points D3 to be checked, feature points A4 to be checked and feature points D4 to be checked as examples, the number of feature points to be checked is twice the number of PCB boards, that is, N=2. After sorting the position coordinates of the above-mentioned feature points to be checked from small to large, it can be determined that the second feature point to be checked is the feature point D1 to be checked, and the last feature point to be checked is the feature point D4 to be checked. Based on the difference between the position coordinates of the feature point D1 to be checked and the position coordinates of the feature point D4 to be checked, the translation distances between the feature points D1 to be checked, the feature points D2 to be checked, the feature points D3 to be checked, and the feature points D4 to be checked can be determined; and, it can be determined that the second to last feature point to be checked is the feature point A4 to be checked, and the first feature point to be checked is the feature point A1 to be checked. Based on the difference between the position coordinates of the feature point A4 to be checked and the position coordinates of the feature point A1 to be checked, the translation distances between the feature points A1 to be checked, the feature points A2 to be checked, the feature points A3 to be checked, and the feature points A4 to be checked can be determined.

[0138] Step 1030: Determine the target offset based on the translation distance and the number of translations.

[0139] For example, after determining the translation distance and the number of translations, the translation distance (including the lateral translation distance L x and longitudinal translation distance L y ) and the number of translations n determine the target offset ΔL x or ΔL y . Wherein, target offset = translation distance / translation times.

[0140] For example, Fig. 9 As shown, the translation distance between the feature point A1 to be checked, the feature point A2 to be checked, the feature point A3 to be checked and the feature point A4 to be checked is L x For example, since the number of translations corresponding to the feature point to be checked is 3, the target offset ΔL corresponding to the feature point to be checked is x =L x / 3.

[0141] Through the above scheme, the number of translations can be determined based on the number of multiple feature points to be checked and the number of multiple PCB boards, and the translation distance can be determined based on the position coordinates of the multiple feature points to be checked, so that the target offset between each feature point to be checked can be determined based on the translation distance and the number of translations, so as to realize the inspection of the translation relationship between each feature point on the PCB panel based on the target offset.

[0142] In some embodiments, the above step 830 includes: determining the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point, the number of translations, and the target offset.

[0143] In some embodiments, the position coordinates of the target feature points corresponding to the first feature point at each translation can be determined based on the position coordinates of the first feature point, the number of translations, and the target offset. That is, at least one target feature point is the target feature point corresponding to each translation, and the number of at least one target feature point is equal to the number of translations.

[0144] For example, in the case of a horizontal translation paneling method, the position coordinates of at least one target feature point corresponding to the first feature point can be determined according to formula (7):

[0145]

[0146] Where, ΔL x is the target offset, n is the number of translations, (x, y) is the position coordinate of the first feature point, (x n ,y n ) are the position coordinates of the target feature points corresponding to each translation.

[0147] like Fig. 9 As shown, the first feature point is the feature point B1 to be checked, and the position coordinates of the first feature point B1 are (x B ,y B ) as an example. The number of translations corresponding to the feature points to be checked B1, B2, B3, B4 and B5 is 4. Based on the position coordinates (x B ,y B) and the target offset ΔLx, the position coordinates of the target feature point corresponding to the first translation can be determined as (x B +ΔLx,y B ), the position coordinates of the target feature point corresponding to the second translation are (x B +2ΔLx,y B ), the position coordinates of the target feature point corresponding to the third translation are (x B +3ΔLx,y B ), the position coordinates of the target feature point corresponding to the fourth translation are (x B +4ΔLx,y B ).

[0148] For example, in the case of longitudinal translation of the panel, the position coordinates of at least one target feature point corresponding to the first feature point can be determined according to formula (8):

[0149]

[0150] Among them, Ly is the target offset, n is the number of translations, (x, y) is the position coordinate of the first feature point, (x n ,y n ) is the position coordinate of the target feature point corresponding to each translation. The principle of determining the position coordinate of at least one target feature point corresponding to the first feature point in the case of the longitudinal translation puzzle method is the same as that of the transverse translation puzzle method, which will not be repeated here.

[0151] Through the above scheme, when determining the position coordinates of at least one target feature point that satisfies a translation relationship with the first feature point, the position coordinates of the target feature point corresponding to each translation of the first feature point can be determined based on the position coordinates of the first feature point and the target offset.

[0152] In some embodiments, the above step 830 includes: traversing multiple feature points to be checked, and determining the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determining the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0153] In some embodiments, after determining the target offset, in addition to determining the position coordinates of the target feature point according to the method in the above embodiment, the position coordinates of the target feature point adjacent to the first feature point can also be determined by traversing multiple feature points to be checked and based on the position coordinates of the first feature point and the target offset. For example, the position coordinates of the target feature point can be determined based on the difference between the position coordinates of the first feature point and the target offset, and / or the position coordinates of the target feature point can be determined based on the sum of the position coordinates of the first feature point and the target offset.

[0154] For example, Fig. 9 As shown, take the feature points B1 to be checked, B2 to be checked, B3 to be checked, B4 to be checked and B5 to be checked as examples. The feature points to be checked can be traversed in sequence, such as based on the position coordinates (x B1 ,y B1 ) and the target offset ΔLx, the position coordinates of the target feature point are determined as (x B1 +ΔLx,y B1 ); then based on the position coordinates (x B2 ,y B2 ) and the target offset ΔLx, the position coordinates of the target feature point are determined as (x B1 -ΔLx,y B2 ), and / or, based on the position coordinates (x B2 ,y B2 ) and the target offset ΔLx, the position coordinates of the target feature point are determined as (x B2 +ΔLx,y B2 ) ... and so on, until all the above-mentioned feature points to be checked are traversed. It can be understood that if the target feature point corresponding to the first feature point B1 is determined, when traversing to the first feature point B2, it is no longer necessary to determine the target feature point based on the difference between the position coordinates of the first feature point B2 and the target offset.

[0155] Through the above scheme, when determining the position coordinates of at least one target feature point that satisfies a translation relationship with the first feature point, each feature point to be checked can also be traversed in turn, and based on the sum of the position coordinates of each feature point to be checked and the position coordinates of the target offset, and / or the difference between the position coordinates of each feature point to be checked and the position coordinates of the target offset, the target feature point corresponding to each feature point to be checked is determined.

[0156] Fig.12 A flowchart for determining the position coordinates of at least one target feature point is provided in an embodiment of the present application. Fig.12 As shown, in the case where the panelization method is a translation panelization method, the above step 120 includes steps 1210 to 1230.

[0157] Step 1210, based on the position coordinates of the multiple feature points and the translation panelization method, obtain multiple feature points to be checked on multiple PCB boards with the same vertical coordinate or horizontal coordinate.

[0158] In some embodiments, in the process of checking whether the feature points on each PCB board conform to the translation relationship based on the translation replication symmetry checking algorithm, it is also possible to first determine whether the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are the same. If the actual offsets are the same, it means that the feature points to be checked conform to the translation relationship; if the actual offsets are not exactly the same, it means that there are feature points to be checked that do not conform to the translation relationship, and then the above steps 810 to 830 can be performed to further determine the feature points to be checked that do not conform to the translation relationship.

[0159] It can be understood that the implementation method of step 1210 can refer to the relevant description of step 810, which will not be repeated here.

[0160] Step 1220, based on the position coordinates of the plurality of feature points to be checked, determine the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards.

[0161] In some embodiments, the actual offset may be determined based on different quantitative relationships between the feature points to be checked and the PCB board and the position coordinates of multiple feature points to be checked.

[0162] For example, taking the lateral translation panelization method as an example, when the number of feature points to be checked is equal to the number of PCB boards, or the number of feature points to be checked is 1 more than the number of PCB boards, or the number of feature points to be checked is 1 less than the number of PCB boards, the actual offset between the feature points to be checked on any two adjacent PCB boards can be determined based on the position coordinates of multiple feature points to be checked.

[0163] like Fig. 9 As shown, taking the feature points B1 to be checked, B2 to be checked, B3 to be checked, B4 to be checked and B5 to be checked as examples, the actual offset between the feature points B1 to be checked and B2 to be checked, the actual offset between the feature points B2 to be checked and B3 to be checked, the actual offset between the feature points B3 to be checked and B4 to be checked, and the actual offset between the feature points B4 to be checked and B5 to be checked can be determined based on the position coordinates of the above feature points to be checked.

[0164] For another example, when the number of feature points to be checked is N times the number of PCB boards (N is a positive integer, and N is greater than 1), the position coordinates of multiple feature points to be checked can be sorted, and the feature points to be checked at corresponding positions on two adjacent PCB boards can be determined based on the sorting result, so as to determine the actual offset between the two feature points to be checked. For example, the actual offset between the 1st feature point to be checked and the N+1th feature point to be checked, and the actual offset between the N+1th feature point to be checked and the 2N+1th feature point to be checked can be determined.

[0165] like Fig. 9 As shown, taking the feature points A1 to be checked, D1 to be checked, A2 to be checked, D2 to be checked, A3 to be checked, D3 to be checked, A4 to be checked and D4 to be checked as examples, after sorting the position coordinates of the multiple feature points to be checked from small to large, the actual offset between the feature point A1 to be checked and the feature point A2 to be checked, the actual offset between the feature point A2 to be checked and the feature point A3 to be checked, and the actual offset between the feature point A3 to be checked and the feature point A4 to be checked can be determined; and the actual offset between the feature point D1 to be checked and the feature point D2 to be checked, the actual offset between the feature point D2 to be checked and the feature point D3 to be checked, and the actual offset between the feature point D3 to be checked and the feature point D4 to be checked can be determined.

[0166] Step 1230, if the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are not exactly the same, then based on the position coordinates of the multiple feature points and the panel information, determine the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points.

[0167] In some embodiments, if the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are not exactly the same, it means that there are feature points to be checked that do not conform to the translation relationship among the multiple feature points to be checked. Then, the above steps 810 to 830 can be executed to further determine the feature points to be checked that do not conform to the translation relationship.

[0168] Continuing with the above example, if among the feature points B1, B2, B3, B4 and B5, the actual offset between the feature point B3 and the feature point B4 is different from the actual offset between the other feature points to be checked, then the above steps 810 to 830 can be executed to further determine whether the position coordinates of the feature point B3 or the feature point B4 are incorrect.

[0169] In some embodiments, if the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are the same, it means that the feature points to be checked all conform to the translation relationship, and the inspection result of the PCB panel can be determined as that the feature points to be checked have passed the inspection.

[0170] Continuing with the above example, if the actual offsets between feature points B1 to be checked, B2 to be checked, B3 to be checked, B4 to be checked and B5 to be checked are all the same, then it can be determined that the inspection result of the PCB panel is that feature points B1 to be checked, B2 to be checked, B3 to be checked, B4 to be checked and B5 to be checked all pass the inspection.

[0171] Through the above scheme, when the panelization method is a translation panelization method, the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards can be determined first, and it can be judged whether the actual offsets are equal. If the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards is not completely the same, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points can be determined based on the position coordinates of the multiple feature points and the panelization information.

[0172] Fig.13 A flowchart for determining the inspection result of a PCB panel provided in an embodiment of the present application. Fig.13 As shown, the above step 130 includes step 1310 to step 1320.

[0173] Step 1310: If there is no second feature point on at least one second PCB board whose position coordinates are the same as the position coordinates of the target feature point, it is determined that the inspection result of the PCB panel is that the first feature point fails the inspection.

[0174] In some embodiments, if there is no second feature point on at least one second PCB board whose position coordinates are the same as the position coordinates of the target feature point, it means that there is no second feature point on at least one second PCB board that satisfies a symmetric relationship or a translation relationship with the first feature point on the first PCB board, and therefore it can be determined that the first feature point has failed the inspection.

[0175] For example, Figure 5 As shown, in the case where the PCB paneling method is a central symmetrical paneling, the position coordinates (x A ,y A) is taken as an example, if the position coordinates of the target feature point determined by the first PCB board are not equal to (x', y'), it can be determined that the first feature point A has not passed the inspection, and the remaining feature points will continue to be traversed.

[0176] like Figure 7 As shown, in the case where the PCB paneling method is mirror symmetric paneling, the position coordinates (x A ,y A ) is taken as an example, if the position coordinates of the target feature point determined by the first PCB board are not equal to (x', y'), it can be determined that the first feature point A has not passed the inspection, and the remaining feature points will continue to be traversed.

[0177] In the case where the position coordinates of at least one target feature point corresponding to the first feature point are determined based on the position coordinates of the first feature point, the number of translations, and the target offset, as follows: Fig. 9 As shown, based on the position coordinates (x A ,y A ) and the target offset ΔLx determine the position coordinates of the target feature point as (x A +ΔLx,y A ) as an example, if there is no position coordinate (x A +ΔLx,y A ), then it can be determined that the first feature point A1 has not passed the inspection, and the feature point A2 to be inspected continues to be used as the first feature point to determine the position coordinates of at least one target feature point corresponding to the first feature point A2; or, it can be determined that the first feature point A2 corresponding to the number of translations has not passed the inspection.

[0178] In the case where a plurality of feature points to be checked are traversed and the position coordinates of the target feature points adjacent to the first feature point are determined based on the position coordinates of the first feature point and the target offset, as shown in FIG. Fig. 9 As shown, based on the position coordinates (x A1 ,y A1 ) and the target offset ΔLx to determine the position coordinates of the target feature point (x A1 +ΔLx,y A1 ), if there is no second feature point on the PCB board 2 with the same position coordinates as the target feature point, it can be determined that the first feature point A1 has not passed the inspection; based on the position coordinates (x A2 ,y A2) and the target offset ΔLx, the position coordinates of the target feature point are determined as (x A2 +ΔLx,y A2 ), if the position coordinates (x A1 -ΔLx,y A2 ) the same second feature point, then it can be determined that the first feature point A2 has failed the inspection.

[0179] Step 1320: If there is a second feature point on at least one second PCB board whose position coordinates are equal to the position coordinates of the target feature point, it is determined that the inspection result of the PCB panel is that the first feature point and the second feature point pass the inspection.

[0180] In some embodiments, if there is a second feature point on at least one second PCB board whose position coordinates are equal to the position coordinates of the target feature point, it means that there is a second feature point on at least one second PCB board that satisfies a symmetrical relationship or a translation relationship with the first feature point on the first PCB board. Therefore, it can be determined that the first feature point and the corresponding second feature point of the PCB panel have passed the inspection.

[0181] like Figure 5 As shown, in the case where the PCB paneling method is a central symmetrical paneling, the position coordinates (x A ,y A ) is taken as an example, if the position coordinates of the target feature point determined by the method are (x', y'), then if the position coordinates of the second feature point A' on the second PCB are (x A ',y A ') are the same as the position coordinates (x', y') of the target feature point, it can be determined that the first feature point A and the second feature point A' have passed the inspection.

[0182] like Figure 7 As shown, in the case where the PCB paneling method is mirror symmetric paneling, the position coordinates (x A ,y A ) is taken as an example, if the position coordinates of the target feature point determined by the method are (x', y'), then if the position coordinates of the second feature point A' on the second PCB are (x A ',y A ') are the same as the position coordinates (x', y') of the target feature point, it can be determined that the first feature point A and the second feature point A' have passed the inspection.

[0183] In the case where the position coordinates of at least one target feature point corresponding to the first feature point are determined based on the position coordinates of the first feature point, the number of translations, and the target offset, as follows: Fig. 9As shown, based on the position coordinates (x A ,y A ) and the target offset ΔLx determine the position coordinates of the target feature point as (x A +ΔLx,y A ) as an example, if the position coordinates of the second feature point A2 on the PCB board 2 are the same as the position coordinates of the target feature point, then it can be determined that the first feature point A1 and the second feature point A2 have passed the inspection.

[0184] In the case where a plurality of feature points to be checked are traversed and the position coordinates of the target feature points adjacent to the first feature point are determined based on the position coordinates of the first feature point and the target offset, as shown in FIG. Fig. 9 As shown, based on the position coordinates (x A1 ,y A1 ) and the target offset ΔLx to determine the position coordinates of the target feature point (x A1 +ΔLx,y A1 ), if the position coordinates of the second feature point A2 on the PCB board 2 are the same as the position coordinates of the target feature point, then it can be determined that the first feature point A1 and the second feature point A2 have passed the inspection.

[0185] Through the above scheme, after determining the position coordinates of at least one target feature point corresponding to the first feature point on the first PCB board, if there is no second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board other than the first PCB board, it can be determined that the first feature point has not passed the inspection; if there is a second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board, it means that the first feature point and the second feature point satisfy a symmetric relationship or a translation relationship, and it can be determined that the first feature point and the second feature point have passed the inspection.

[0186] In some embodiments, in addition to checking the position coordinates of the feature point, if the feature point is the center point of the device, the device size corresponding to the feature point can also be checked. For example, after determining the first feature point and the second feature point that satisfy the symmetry relationship or translation relationship, it can be determined whether the device sizes corresponding to the first feature point and the second feature point are the same, thereby further determining the inspection result.

[0187] Fig.14 This is a schematic diagram of an interface of a PCB panel inspection system provided in an embodiment of the present application. Fig.14As shown, the PCB panel inspection system 1400 can inspect multiple feature points on the PCB panel based on the steps shown in the above embodiment to obtain inspection results; and can display the PCB panel and the inspection results of the PCB panel through the display interface 14.

[0188] For example, the user can input an instruction to execute the inspection through a button in the display interface 14, so that the PCB panel inspection system 1400 responds to the instruction and inspects the multiple feature points on the acquired PCB panel. After the inspection result of the PCB panel is determined, the feature points that failed the inspection and the feature points that passed the inspection in the inspection result can be displayed separately through the display interface 14.

[0189] Furthermore, the user can adjust the positions of multiple feature points on the PCB panel through the display interface 14. After the position coordinates of the feature points are changed, the user can still directly input an instruction to perform the inspection through the button in the display interface 14, so that the PCB panel inspection system 1400 responds to the instruction and inspects the multiple feature points based on the adjusted position coordinates of the multiple feature points.

[0190] Exemplarily, when a user clicks on a feature point in the inspection result, the PCB panel inspection system 1400 can respond to the user's click operation and locate the feature point in the PCB panel, so that the user can view the position of the feature point in the PCB panel and adjust the position of the feature point; similarly, when a user clicks on a corresponding feature point in the PCB panel, the PCB panel inspection system 100 can respond to the user's click operation and locate the feature point in the inspection result, so that the user can view the inspection result of the feature point.

[0191] Through the above scheme, the characteristic point inspection of the PCB panel is performed through the computer software system, and the inspection result is displayed through a visual interface, which can facilitate the user to operate and view the inspection result, thereby further improving the inspection efficiency of the PCB panel.

[0192] Fig.15 A flowchart of another PCB panel inspection method provided in an embodiment of the present application. Fig.15 As shown, the method includes steps 1501 to 1510.

[0193] Step 1501, obtaining the position coordinates of multiple feature points on multiple PCB boards included in the PCB panel and the panel information of the PCB panel.

[0194] It can be understood that the implementation method of step 1501 can refer to the relevant description of step 110, which will not be repeated here.

[0195] Step 1502, if the panelization method of the PCB panel is a centrosymmetric panelization method, then based on the centrosymmetric panelization method and the position coordinates of the first feature point, determine the position coordinates of at least one target feature point that satisfies a centrosymmetric relationship with the first feature point.

[0196] It can be understood that the implementation of step 1502 can refer to the relevant description of step 410 and step 420, which will not be repeated here.

[0197] Step 1503, if the panelization method of the PCB panel is a mirror-symmetric panelization method, then based on the mirror-symmetric panelization method and the position coordinates of the first feature point, determine the position coordinates of at least one target feature point that satisfies a mirror-symmetric relationship with the first feature point.

[0198] It can be understood that the implementation of step 1503 can refer to the relevant description of step 410 and step 420, which will not be repeated here.

[0199] Step 1504, if the PCB paneling method is a translation paneling method, multiple feature points to be checked with the same vertical coordinate or horizontal coordinate on multiple PCB boards are obtained, and the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards is determined.

[0200] It can be understood that the implementation method of step 1504 can refer to the relevant description of step 1210 and step 1220, which will not be repeated here.

[0201] Step 1505, determining whether the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are exactly the same.

[0202] Exemplarily, if the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are not exactly the same, step 1506 is executed; if the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are the same, step 1510 is executed.

[0203] Step 1506, if the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are not exactly the same, then the target offset is determined based on the position coordinates of the multiple feature points to be checked, the number of the multiple feature points to be checked and the number of the multiple PCB boards.

[0204] It can be understood that the implementation method of step 1506 can refer to the relevant description of step 820, which will not be repeated here.

[0205] Step 1507: Determine the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point, the number of translations, and the target offset.

[0206] It can be understood that the implementation method of step 1507 can refer to the relevant description of step 830, which will not be repeated here.

[0207] Step 1508, traverse multiple feature points to be checked, and determine the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determine the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0208] It can be understood that the implementation method of step 1508 can refer to the relevant description of step 830, which will not be repeated here.

[0209] Step 1509, determining the inspection result of the PCB panel based on the position coordinates of the second feature point on at least one second PCB board and the position coordinates of at least one target feature point.

[0210] It can be understood that the implementation method of step 1509 can refer to the relevant description of step 140, which will not be repeated here.

[0211] Step 1510: If the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are the same, it is determined that the inspection result of the PCB panel is that each feature point to be checked passes the inspection.

[0212] It can be understood that the implementation method of step 1510 can refer to the relevant description of step 1150, which will not be repeated here.

[0213] By applying the technical solution of the present application, it is possible to determine the position coordinates of at least one target feature point that satisfies a symmetric relationship or a translation relationship with any feature point (i.e., a first feature point) on any PCB board (i.e., a first PCB board) based on the panelization method of the PCB panel and the position coordinates of multiple feature points on multiple PCB boards in the PCB panel. And based on the position coordinates of a second feature point on at least one second PCB board and the position coordinates of at least one target feature point, the inspection result of the PCB panel is determined. The present application can realize the automated inspection of feature points on PCB panels without manual intervention, thereby improving the inspection efficiency of PCB panels and the accuracy of the inspection of PCB panels; and the present application can be applicable to a variety of panelization methods and a combination of a variety of panelization methods, thereby further improving the inspection efficiency of PCB panels.

[0214] In addition, the technical solution of the present application can also be applied to other scenarios such as image feature analysis, 3D modeling applications, and PCB design. For example, in image feature analysis, the distribution of feature points in the image can be analyzed to check whether the feature points satisfy a symmetric relationship or a translation relationship; in 3D modeling applications, feature points such as the geometric center and centroid of the 3D model can be calculated, and based on these feature points, the rotation, translation replication, axis / plane symmetry, etc. of the 3D model can be checked; in PCB design, it can be checked whether the layout of components on the PCB is symmetrical, whether the wiring is symmetrical about a certain axis or center line, and whether the distribution of pads and holes is symmetrical.

[0215] refer to Fig.16 As shown, corresponding to the embodiment of the above-mentioned PCB panel inspection method, the present application also provides an embodiment of a PCB panel inspection device. The PCB panel inspection device 1600 includes an acquisition module 1610, a first determination module 1620 and a second determination module 1630.

[0216] The acquisition module 1610 is configured to acquire the position coordinates of multiple feature points on multiple PCB boards included in the PCB panel and the panel information of the PCB panel.

[0217] The panelization information includes the panelization method.

[0218] The first determination module 1620 is configured to determine the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the mosaic information.

[0219] The first characteristic point is any characteristic point on the first PCB board, and the first PCB board is any PCB board among multiple PCB boards.

[0220] The second determination module 1630 is configured to determine the inspection result of the PCB panel based on the position coordinates of the second feature point on at least one second PCB board and the position coordinates of at least one target feature point.

[0221] Among them, at least one second PCB board is a PCB board other than the first PCB board among the multiple PCB boards, and the inspection result of the PCB panel is used to indicate whether there is a target feature point on the second PCB board.

[0222] In some embodiments, the panelization method includes a centrally symmetrical panelization method, and the first determination module 1620 is specifically configured to: determine the centrally symmetrical point of the PCB panel based on the position coordinates of multiple feature points and the centrally symmetrical panelization method; determine the position coordinates of at least one target feature point that satisfies a centrally symmetrical relationship with the first feature point based on the position coordinates of the first feature point and the centrally symmetrical point.

[0223] In some embodiments, the panelization method includes a mirror-symmetric panelization method, and the first determination module 1620 is specifically configured to: determine the mirror symmetry axis of the PCB panel based on the position coordinates of multiple feature points and the mirror-symmetric panelization method; determine the position coordinates of at least one target feature point that satisfies a mirror-symmetric relationship with the first feature point based on the position coordinates of the first feature point and the mirror symmetry axis.

[0224] In some embodiments, the panelization method includes a translation panelization method, and the panelization information also includes the number of multiple PCB boards; the first determination module 1620 is specifically configured to: based on the position coordinates of multiple feature points and the translation panelization method, obtain multiple feature points to be checked on multiple PCB boards with the same vertical coordinate or horizontal coordinate; based on the position coordinates of the multiple feature points to be checked, the number of the multiple feature points to be checked and the number of the multiple PCB boards, determine the target offset; based on the position coordinates of the first feature point among the multiple feature points to be checked and the target offset, determine the position coordinates of at least one target feature point corresponding to the first feature point; wherein the first feature point is any feature point to be checked among the multiple feature points to be checked.

[0225] In some embodiments, the first determination module 1620 is further configured to: determine the number of translations based on the number of feature points to be checked and the number of PCB boards; determine the translation distance based on the position coordinates of the feature points to be checked; and determine the target offset based on the translation distance and the number of translations.

[0226] In some embodiments, the first determination module 1620 is specifically configured to: determine the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point, the number of translations and the target offset; wherein the at least one target feature point is the target feature point corresponding to each translation, and the number of at least one target feature point is equal to the number of translations.

[0227] In some embodiments, the first determination module 1620 is specifically configured to: traverse multiple feature points to be checked, and determine the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determine the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0228] In some embodiments, the panelization method includes a translation panelization method, and the first determination module 1620 is specifically configured as follows: based on the position coordinates of multiple feature points and the translation panelization method, multiple feature points to be checked with the same vertical coordinate or horizontal coordinate on multiple PCB boards are obtained; based on the position coordinates of the multiple feature points to be checked, the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards is determined; if the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards is not exactly the same, then based on the position coordinates of the multiple feature points and the panelization information, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points are determined.

[0229] In some embodiments, the second determination module 1630 is specifically configured as follows: if there is no second feature point on at least one second PCB board whose position coordinates are the same as the position coordinates of the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point has failed the inspection; if there is a second feature point on at least one second PCB board whose position coordinates are equal to the position coordinates of the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point and the second feature point have passed the inspection.

[0230] Fig.17 A schematic diagram of a computing device provided for some embodiments of the present application. In some embodiments, the computing device may include a server, a terminal, and other devices; the computing device includes one or more processors and a memory. The memory is configured to store one or more programs. When the one or more programs are executed by the one or more processors, the one or more processors implement the PCB panel inspection method in the above embodiment.

[0231] like Fig.17 As shown, the computing device 1700 includes: a processor (processor) 1701 and a memory 1702. Exemplarily, the computing device 1700 may also include: a communication interface (Communications Interface) 1703 and a communication bus 1704.

[0232] The processor 1701, the memory 1702 and the communication interface 1703 communicate with each other via the communication bus 1704. The communication interface 1703 is used to communicate with other devices such as client or other server network elements.

[0233] In some embodiments, the processor 1701 is used to execute the program 1705, and specifically can execute the relevant steps in the above-mentioned PCB panel inspection method embodiment. Specifically, the program 1705 can include a program code, and the program code includes computer executable instructions.

[0234] Exemplarily, the processor 1701 may be a central processing unit (CPU), or an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement some embodiments of the present application. The computing device 1700 may include one or more processors, which may be processors of the same type, such as one or more CPUs, or processors of different types, such as one or more CPUs and one or more ASICs.

[0235] In some embodiments, the memory 1702 is used to store the program 1705. The memory 1702 may include a high-speed RAM memory, and may also include a non-volatile memory (NVM), such as at least one disk memory.

[0236] Program 1705 can be specifically called by processor 1701 to enable computing device 1700 to execute the PCB panel inspection method operation.

[0237] Some embodiments of the present application provide a computer-readable storage medium, which stores at least one executable instruction. When the executable instruction is executed on a computing device 1700, the computing device 1700 executes the PCB panel inspection method in the above embodiment.

[0238] The executable instructions can be specifically used to enable the computing device 1700 to execute the PCB panel inspection method operation.

[0239] For example, the computer readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a compact disc (CD-ROM), a magnetic tape, a floppy disk, an optical data storage device, and the like.

[0240] The beneficial effects that can be achieved by the readable storage medium provided in some embodiments of the present application can be referred to the beneficial effects of the corresponding PCB panel inspection method provided above, and will not be repeated here.

[0241] It should be noted that, in the application, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0242] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0243] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as an ordered list of executable instructions for implementing logical functions, which can be embodied in any computer-readable medium for use by an instruction execution system, apparatus or device (such as a computer-based system, a system including a processor or other system that can fetch instructions from an instruction execution system, apparatus or device and execute instructions), or used in combination with these instruction execution systems, apparatuses or devices.

[0244] For the purposes of this specification, a "computer-readable medium" can be any apparatus that can contain, store, communicate, propagate, or transport the program for use by an instruction execution system, apparatus, or device or in conjunction with such instruction execution system, apparatus, or device.

[0245] More specific examples (a non-exhaustive list) of computer-readable media include the following: an electrical connection having one or more wires (electronic device), a portable computer disk case (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), a fiber optic device, and a portable compact disk read-only memory (CDROM).

[0246] In addition, the computer readable medium can even be a paper or other suitable medium on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other medium, and then editing, interpreting or processing in other suitable ways as necessary, and then storing it in the computer memory. It should be understood that various parts of the present application can be implemented in hardware, software, firmware or a combination thereof.

[0247] In the above embodiments, multiple steps or methods may be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it may be implemented by any one of the following technologies known in the art or a combination thereof: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0248] The implementation methods described above are only specific implementation methods of the present application and are not intended to limit the scope of protection of the present application. Any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solution of the present application should be included in the scope of protection of the present application.

Claims

1. A method for inspecting PCB panels, characterized in that: The PCB panel comprises a plurality of PCB boards, and the method comprises: Acquire the position coordinates of multiple feature points on the multiple PCB boards and the panelization information of the PCB panels; wherein the panelization information includes the panelization method; Based on the position coordinates of the multiple feature points and the panel information, determine the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points; wherein the first feature point is any feature point on a first PCB board, and the first PCB board is any PCB board among the multiple PCB boards; Based on the position coordinates of a second feature point on at least one second PCB board and the position coordinates of the at least one target feature point, the inspection result of the PCB panel is determined; wherein, the at least one second PCB board is a PCB board other than the first PCB board among the multiple PCB boards, and the inspection result of the PCB panel is used to indicate whether the target feature point exists on the second PCB board.

2. The method according to claim 1, characterized in that The panelization method includes a central symmetric panelization method, and determining the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information includes: Determine the central symmetric point of the PCB panel based on the position coordinates of the multiple feature points and the central symmetric panelization method; Based on the position coordinates of the first feature point and the central symmetric point, the position coordinates of at least one target feature point that satisfies a central symmetric relationship with the first feature point are determined.

3. The method according to claim 1, characterized in that The panelization method includes a mirror symmetric panelization method, and determining the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information includes: Determine the mirror symmetry axis of the PCB panel based on the position coordinates of the multiple feature points and the mirror symmetric paneling method; Based on the position coordinates of the first feature point and the mirror symmetry axis, the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point are determined.

4. The method according to claim 1, characterized in that The panelization method includes a translation panelization method, and the panelization information also includes the number of the plurality of PCB boards; the determining, based on the position coordinates of the plurality of feature points and the panelization information, the position coordinates of at least one target feature point corresponding to the first feature point among the plurality of feature points includes: Based on the position coordinates of the multiple feature points and the translation panelization method, a plurality of feature points to be checked having the same ordinate or abscissa on the multiple PCB boards are obtained; Determine a target offset based on the position coordinates of the plurality of feature points to be checked, the number of the plurality of feature points to be checked, and the number of the plurality of PCB boards; Based on the position coordinates of the first feature point among the multiple feature points to be checked and the target offset, the position coordinates of at least one target feature point corresponding to the first feature point are determined; wherein the first feature point is any one of the multiple feature points to be checked.

5. The method according to claim 4, characterized in that The determining of the target offset based on the position coordinates of the plurality of feature points to be checked, the number of the plurality of feature points to be checked and the number of the plurality of PCB boards comprises: Determine the number of translations based on the number of the plurality of feature points to be checked and the number of the plurality of PCB boards; Determining a translation distance based on the position coordinates of the plurality of feature points to be checked; The target offset is determined based on the translation distance and the number of translations.

6. The method according to claim 5, characterized in that The determining, based on the position coordinates of the first feature point among the plurality of feature points to be checked and the target offset, the position coordinates of at least one target feature point corresponding to the first feature point comprises: Based on the position coordinates of the first feature point, the number of translations and the target offset, the position coordinates of at least one target feature point corresponding to the first feature point are determined; wherein the at least one target feature point is the target feature point corresponding to each translation, and the number of the at least one target feature point is equal to the number of translations.

7. The method according to claim 5, characterized in that The determining, based on the position coordinates of the first feature point among the plurality of feature points to be checked and the target offset, the position coordinates of at least one target feature point corresponding to the first feature point comprises: Traverse the multiple feature points to be checked, and determine the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determine the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

8. The method according to claim 1, characterized in that The panelization method includes a translation panelization method, and determining the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information includes: Based on the position coordinates of the multiple feature points and the translation panelization method, a plurality of feature points to be checked having the same ordinate or abscissa on the multiple PCB boards are obtained; Based on the position coordinates of the plurality of feature points to be checked, determining the actual offset between the feature points to be checked at corresponding positions on any two adjacent PCB boards; If the actual offsets between the feature points to be checked at corresponding positions on any two adjacent PCB boards are not exactly the same, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points are determined based on the position coordinates of the multiple feature points and the panel information.

9. The method according to any one of claims 1 to 8, characterized in that The step of determining the inspection result of the PCB panel based on the position coordinates of the second feature point on at least one second PCB board and the position coordinates of the at least one target feature point comprises: If there is no second feature point on at least one of the second PCB boards whose position coordinates are the same as the position coordinates of the target feature point, determining that the inspection result of the PCB panel is that the first feature point fails the inspection; If there is a second feature point on at least one of the second PCB boards with position coordinates equal to the position coordinates of the target feature point, it is determined that the inspection result of the PCB panel is that the first feature point and the second feature point pass the inspection.

10. A computing device, characterized in that: include: one or more processors; and A memory configured to: store one or more programs; Wherein, when the one or more programs are executed by the one or more processors, the one or more processors implement the PCB panel inspection method according to any one of claims 1-9.

Images