High-reliability magnetic device and electronic equipment

Abstract

The invention relates to the technical field of magnetic devices, and discloses a high-reliability magnetic device and electronic equipment.The high-reliability magnetic device comprises a magnetic core body, and a middle column is arranged in the magnetic core body; the mounting base is connected to the end, facing the PCB, of the magnetic core body, an adjusting control body is arranged on the mounting base, one end of the adjusting control body abuts against the PCB, and the mounting base and the PCB form an adjusting control space through the adjusting control body; the winding coil is wound on the middle column, the winding coil extends on one side of the magnetic core main body to form a lead electrode, an adjustable inclination angle is kept between the lead electrode and the bearing surface of the PCB in the adjusting control space, and a first adjustable gap is formed between the end of the lead electrode and a first bonding pad on the bearing surface. The reliability and safety of the magnetic device are improved.

Description

Technical Field

[0001] The present application relates to the technical field of magnetic devices, and in particular to a high-reliability magnetic device and electronic equipment. Background Art

[0002] Magnetic devices play a vital role in electronic devices and are widely used in power transmission, signal processing, energy conversion and other fields. They use the principle of electromagnetic induction to transfer or convert electrical energy into other forms of energy in an efficient manner. They mainly include network transformers, inductors, common-mode chokes, etc. With the continuous development of market demand, the integration of PCB boards is getting higher and higher, the size of the reserved space pads for magnetic devices is getting smaller and smaller, and the weight of magnetic devices is getting heavier.

[0003] In the related technologies, the market has increasingly higher requirements for the reliability of magnetic devices. However, during the welding process of magnetic devices to PCB boards, due to the weight of the devices and the increase in volume of the liquefied tin solder, there is a risk that the tin liquid will overflow from the pad and contact the PIN pins of other devices on the PCB board, causing short circuit failures and PCB board malfunctions. This situation needs to be changed. Summary of the invention

[0004] In view of this, the present application provides a high-reliability magnetic device and an electronic device to improve the safety and reliability of the magnetic device.

[0005] To achieve the above objectives, according to the first aspect, the technical solution adopted is:

[0006] A high-reliability magnetic device, which is connected to a PCB board when used, comprising:

[0007] A magnetic core body, wherein a center column is provided in the magnetic core body;

[0008] A mounting seat connected to one end of the magnetic core body facing the PCB board, the mounting seat is provided with an adjustment control body, one end of the adjustment control body is in contact with the PCB board, and the mounting seat and the PCB board form an adjustment control space through the adjustment control body;

[0009] A winding coil is wound on the central column, and a lead electrode is extended on one side of the magnetic core body. The lead electrode maintains an adjustable inclination angle with the bearing surface of the PCB board in the adjustment control space, and the end of the lead electrode and the first solder pad on the bearing surface have a first adjustable gap.

[0010] The present application is further configured as follows: a patch electrode is embedded on a side of the mounting seat away from the lead electrode, and the patch electrode has a second adjustable gap with a second pad on the bearing surface within the adjustment control space.

[0011] The present application is further configured as follows: a side of the mounting base facing the PCB board has a third adjustable gap with the first pad or the second pad on the bearing surface.

[0012] The present application is further configured as follows: the mounting seat is provided with an auxiliary boss integrally connected to one side of the patch electrode, the magnetic core body abuts against the inner wall of the auxiliary boss, and the patch electrode is designed in an L-shaped or C-shaped structure and is attached to the outer wall of the auxiliary boss.

[0013] The present application is further configured as follows: the height of the adjustment control body in the first direction is the spatial height of the adjustment control space, wherein the first direction is a direction perpendicular to the bearing surface of the PCB board, and the adjustment control body is located on the center line of the magnetic core body in the first direction, and the first solder pad and the second solder pad are arranged on both sides of the adjustment control body on the bearing surface.

[0014] The present application is further configured as follows: the first adjustable gap includes the shortest distance between the end of the lead electrode and the first pad in the first direction, the second adjustable gap includes the shortest distance between the patch electrode and the second pad in the first direction, and the third adjustable gap includes the shortest distance between the mounting base and the first pad or the second pad in the first direction.

[0015] The present application is further configured such that: in the first direction, the first adjustable gap, the second adjustable gap and the third adjustable gap change synchronously with the change of the spatial height of the adjustment control space.

[0016] The present application is further configured as follows: in a second direction perpendicular to the first direction, the value range of the adjustable inclination angle between the lead electrode and the bearing surface includes 0.5°-20°, and the height range of the adjustment control body in the first direction includes 0.1cm-0.3cm.

[0017] The present application is further configured as follows: at least one superimposed adjustment block is provided at one end of the adjustment control body, the superimposed adjustment block connects the adjustment control body and the bearing surface, and each of the superimposed adjustment blocks has the same preset thickness.

[0018] According to the second aspect, the technical solution adopted is:

[0019] An electronic device comprises: a PCB board and a high-reliability magnetic device as described in any one of the above embodiments, wherein the high-reliability magnetic device is connected to the PCB board.

[0020] In summary, compared with the prior art, the present application discloses a high-reliability magnetic device and an electronic device. The high-reliability magnetic device is connected to a PCB board when used, and includes a magnetic core body, a mounting seat and a winding coil. The mounting seat is connected to one end of the magnetic core body facing the PCB board, and the winding coil is wound on the middle column of the magnetic core body, wherein an adjustment control body is provided on the mounting seat, and the mounting seat and the PCB board form an adjustment control space through the adjustment control body, and the winding coil extends with a lead electrode on one side of the magnetic core body, and the lead electrode maintains an adjustable inclination angle with the bearing surface of the PCB board in the adjustment control space, and the end of the lead electrode and the first pad on the bearing surface have a first adjustable gap, that is, through the above-mentioned setting, the relative connection distance between the magnetic device and the PCB board is adjusted by adjusting the control space, and the reliable connection between the lead electrode and the first pad is ensured by the first adjustable gap, thereby improving the reliability and safety of the magnetic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 is a schematic diagram of the three-dimensional structure of a high-reliability magnetic device according to an embodiment of the present application;

[0023] Figure 2 is an assembly structure diagram of a high reliability magnetic device and a PCB board according to an embodiment of the present application;

[0024] Figure 3 is an assembly cross-sectional view of a high-reliability magnetic device and a PCB board according to an embodiment of the present application;

[0025] Figure 4 yes Figure 2 A partial enlarged view of the structure. DETAILED DESCRIPTION

[0026] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.

[0027] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0028] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] In the subsequent description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present application, and have no specific meanings. Therefore, "module", "component" or "unit" can be used in a mixed manner.

[0030] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0031] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments is not intended to limit the priority order of the embodiments.

[0032] As described in the background technology, during the welding process of magnetic devices with PCB boards, due to the weight of the devices and the increased volume of the tin solder after liquefaction, there is a risk that the tin liquid will overflow from the soldering pad and contact the PIN pins of other devices on the PCB board, causing short circuit failures and abnormal functions of the PCB board. Based on this, the present application discloses a high-reliability magnetic device and electronic equipment.

[0033] Please refer to Figures 1 to 4 The high-reliability magnetic device 100 of the present application can be connected to a PCB board 200 when used, and includes a magnetic core body 1, a mounting seat 3 and a winding coil 6.

[0034] In the specific implementation process, a middle column 2 is provided in the magnetic core body 1, a winding coil 6 is wound on the middle column 2, and a mounting seat 3 is connected to one end of the magnetic core body 1 facing the PCB board 200, wherein an adjustment control body 4 is provided on the mounting seat 3, one end of the adjustment control body 4 is in contact with the PCB board 200, the mounting seat 3 forms an adjustment control space 5 with the PCB board 200 through the adjustment control body 4, and the winding coil 6 has a lead electrode 7 extending on one side of the magnetic core body 1, and the lead electrode 7 maintains an adjustable inclination angle a with the bearing surface 8 of the PCB board 200 in the adjustment control space 5, and the end of the lead electrode 7 and the first solder pad 9 on the bearing surface 8 have a first adjustable gap I.

[0035] In this embodiment, an adjustment control space 5 is constructed between the mounting base 3 and the PCB board 200 through the adjustment control body 4. The adjustment control space 5 can be used as a tin expansion space for welding and assembling the high-reliability magnetic device 100 and the PCB board 200, that is, a buffer zone for the solder expansion of the high-reliability magnetic device 100 and the PCB board 200. At the same time, this space in this embodiment also allows a slight deformation of the welding part during thermal expansion and contraction, thereby avoiding cracking or falling off of the solder joint due to stress concentration. In addition, based on the supporting effect of the adjustment control body 4, the high-reliability magnetic device 100 of this embodiment does not need to consider its own weight problem, that is, the compressive effect of the device's own weight on the tin liquid can be avoided, thereby preventing the tin liquid from overflowing from the soldering pad and contacting the PIN feet of other devices on the PCB board during the welding and assembly of the high-reliability magnetic device 100 and the PCB board 200, thereby improving the safety and reliability of the device.

[0036] Furthermore, by designing the lead electrode 7 to maintain an adjustable inclination angle a with the bearing surface 8 of the PCB board 200 in the adjustment control space 5, it is ensured that the contact area between the lead electrode 7 and the first soldering pad 9 is gradually expanded. Then, between the lead electrode 7 and the first soldering pad 9, the tin filling material of the lead electrode 7 can be gradually increased from close to the first soldering pad 9 to far away from the first soldering pad 9, that is, the distribution of the solder is optimized, and the mechanical strength of the welding is improved, thereby improving the welding adhesion between the lead electrode 7 and the first soldering pad 9, avoiding loosening or falling off of the solder joint due to mechanical stress or thermal expansion and contraction, and ensuring that the lead electrode 7 is stably and firmly welded to the first soldering pad 9, thereby improving the safety and reliability of the device.

[0037] Furthermore, the end of the lead electrode 7 and the first soldering pad 9 on the bearing surface 8 have a first adjustable gap I. Then, in conjunction with the tin expansion space of the high-reliability magnetic device 100 and the PCB board 200, the solder can have sufficient room for flow and expansion when the lead electrode 7 and the first soldering pad 9 are soldered, thereby avoiding tin overflow caused by solder expansion during the welding process.

[0038] It should be noted that, since the mounting base 3 carries the magnetic core body 1 and includes the adjustment control body 4, and the winding coil 6 is placed in the magnetic core body 1, the adjustment control space 5 and the first adjustable gap I have a synchronous adjustment relationship. The present embodiment can flexibly adjust the installation height of the magnetic device and the contact method between the high-reliability magnetic device 100 and the PCB board 200 by synchronously adjusting the adjustment control space 5 and the first adjustable gap I, thereby ensuring the optimal contact state between the lead electrode 7 and the first solder pad 9, ensuring that an appropriate amount of solder covers the soldering point and maintains the optimal contact area. This not only optimizes the welding effect, but also prevents excessive flow and overflow of solder, improves the welding strength and connection reliability, and the synchronous adjustment mechanism also improves the adaptability of the magnetic device, so that the high-reliability magnetic device 100 can be used on PCB boards of different thicknesses or specifications without changing the main structure of the magnetic device, thereby providing users with a wider range of choices and simplifying the installation and use process of the product.

[0039] During the specific implementation process, a patch electrode 10 is embedded on the side of the mounting seat 3 away from the lead electrode 7. The patch electrode 10 has a second adjustable gap II with the second solder pad 11 on the bearing surface 8 in the adjustment control space 5, that is, the adjustment control space 5 of this embodiment contains a first adjustable gap I (the gap between the lead electrode 7 and the first solder pad 9) and a second adjustable gap II (the gap between the patch electrode 10 and the second solder pad 11). Specifically, the sizes of the first adjustable gap I and the second adjustable gap II can be adjusted synchronously by adjusting the height of the adjustment control body 4 to ensure the amount of tin between the patch electrode 10 and the second solder pad 11, effectively preventing the solder from overflowing to other components due to liquid expansion during the welding process, avoiding the risk of short circuit, and ensuring the normal function of the PCB board 200. In addition, the coverage area of ​​the solder between the patch electrode 10 and the second solder pad 11 can be adjusted by adjusting the second adjustable gap II, thereby optimizing the welding strength of the patch electrode 10 and improving the reliability of the electrical connection.

[0040] Among them, the design of the first adjustable gap I and the second adjustable gap II can be suitable for PCB layouts of different heights. While providing flexible adjustment space for the welding of the patch electrode 10, it also enhances the welding compatibility and installation convenience of the device, ensuring the high reliability and safety of the magnetic device in different application environments.

[0041] Preferably, the side of the mounting seat 3 facing the PCB board 200 and the first pad 9 or the second pad 11 on the bearing surface 8 have a third adjustable gap III. Through the design of the third adjustable gap III, the mounting seat 3 can not only control the distance between the lead electrode 7 and the first pad 9 (first adjustable gap I) and the patch electrode 10 and the second pad 11 (second adjustable gap II) by adjusting the control body 4, but also control the isolation state between the mounting seat 3 and the bearing surface 8, reduce the electromagnetic interference path between the device and the PCB board, and ensure the air gap provided between the mounting seat 3 and the PCB board 200, which helps to reduce heat conduction caused by direct contact and reduce thermal stress at the soldering point. At the same time, this gap can serve as a buffer zone to absorb the heat caused by temperature. The deformation caused by fluctuations or mechanical vibrations improves the durability of the device in the working environment, and due to the physical isolation space provided by the third adjustable gap III, the excess solder during the welding process is not easy to flow and gather between the mounting base 3 and the PCB board 200, thereby avoiding the hidden danger of short circuit caused by solder overflow, further reducing the risk of electrical failure caused by excessive solder, and enhancing the safety of the device. In addition, the existence of the third adjustable gap III enables the mounting base 3 and the PCB board 200 to maintain a certain degree of independence, which helps to avoid stress transfer caused by rigid contact between the mounting base 3 and the PCB board 200, thereby reducing the risk of device displacement or loosening due to micro-deformation due to external force, thereby improving the mechanical stability of the entire magnetic device.

[0042] In one embodiment, the mounting base 3 has a patch electrode 10 on one side integrally connected to an auxiliary boss 12 , the magnetic core body 1 abuts against the inner wall of the auxiliary boss 12 , and the patch electrode 10 is designed in an L-shaped or C-shaped structure and fits on the outer wall of the auxiliary boss 12 .

[0043] The auxiliary boss 12 provides additional support for the core body 1, making the connection between the core body 1 and the mounting seat 3 more stable, thereby enhancing the installation stability of the entire device on the PCB board 200, and the L-shaped or C-shaped structure of the patch electrode 10 can better fit on the outer wall of the auxiliary boss 12, increasing the contact area of ​​the patch electrode 10 in the physical structure, thereby enhancing the mechanical adhesion and electrical connection reliability between the electrode and the mounting seat 3, and the L-shaped or C-shaped design of the patch electrode 10 enables it to have a larger contact and welding area when soldered with the second pad 11. , and the patch electrode 10 is attached to the outer wall of the auxiliary boss 12, which can effectively prevent the electrode from warping or shifting due to changes in welding temperature, reduce the risk of damage caused by uneven force on the welding point, and thus extend the service life of the device. At the same time, the L-shaped or C-shaped patch electrode 10 structure helps to control the electromagnetic distribution of the electrode, thereby reducing the adverse effects of parasitic inductance or parasitic capacitance. The close fitting design of the auxiliary boss 12 and the patch electrode 10 helps to stabilize the electric field distribution, so that the magnetic device can exhibit better electromagnetic performance in high-frequency applications and reduce signal interference.

[0044] It can be understood that the working surface of the PCB board 200 facing the high-reliability magnetic device 100 is the bearing surface 8 of the PCB board 200, and the bearing surface 8 has a first solder pad 9 and a second solder pad 11 corresponding to the lead electrode 7 and the patch electrode 10 to facilitate the electrical connection between the high-reliability magnetic device 100 and the PCB board 200, and, in this embodiment, the bearing surface 8, the first solder pad 9 and the second solder pad 11 can all be designed to be parallel to the plane of the mounting base 3 or the magnetic core body 1.

[0045] It should be noted that this application constructs the XYZ spatial coordinates. Figure 1 For example, the X-axis direction can be regarded as the first direction, the Z-axis direction can be regarded as the second direction, and the Y-axis direction can be regarded as the third direction. The first direction can also be regarded as the direction perpendicular to the bearing surface 8 of the PCB board 200, the second direction can also be regarded as the left-right extension direction of the high-reliability magnetic device 100, and the third direction can also be regarded as the front-back extension direction of the high-reliability magnetic device 100. Of course, this embodiment is not limited to this. XYZ can also be any other directions perpendicular to each other in space in actual needs, which will not be repeated here.

[0046] In one embodiment, the height of the adjustment control body 4 in the first direction is the spatial height H of the adjustment control space 5, and the adjustment control body 4 is located on the center line of the magnetic core body 1 in the first direction, and the first solder pad 9 and the second solder pad 11 are arranged on both sides of the adjustment control body 4 on the bearing surface 8.

[0047] Based on the arrangement design that the adjustment control body 4 is located on the midline of the magnetic core body 1 in the first direction, it supports the entire magnetic device in the center, thereby ensuring the installation stability of the device on the PCB board 200, and can effectively balance the weight distribution of the device to prevent poor welding problems caused by the center of gravity offset, and the first pad 9 and the second pad 11 are respectively located on both sides of the adjustment control body 4, so as to form an appropriate first adjustable gap I and a second adjustable gap II in the adjustment control space 5, ensuring that the lead electrode 7 and the patch electrode 10 can obtain an ideal welding amount and contact area during welding. Then, by adjusting the height of the adjustment control body 4 in the first direction, that is, adjusting the spatial height H of the control space 5, the first adjustable gap I, the second adjustable gap II and the third adjustable gap III can be adjusted synchronously, that is, in the first direction, the first adjustable gap I, the second adjustable gap II and the third adjustable gap III change synchronously with the change of the spatial height H of the adjustment control space 5, thereby more accurately controlling the welding state and adhesion between the electrode and the pad, avoiding problems such as tin liquid overflow or poor contact, and eliminating the risk of PCB function triggered by short circuit caused by tin overflow from the source.

[0048] Preferably, the first adjustable gap I includes the shortest distance between the end of the lead electrode 7 and the first solder pad 9 in the first direction, the second adjustable gap II includes the shortest distance between the patch electrode 10 and the second solder pad 11 in the first direction, and the third adjustable gap III includes the shortest distance between the mounting base 3 and the first solder pad 9 or the second solder pad 11 in the first direction.

[0049] In the specific implementation process, the numerical range of the adjustable inclination angle a between the lead electrode 7 and the bearing surface 8 in the second direction includes 0.5°-20°. Then the design of the adjustable inclination angle a allows the contact angle between the lead electrode 7 and the first pad 9 to be flexibly adjusted. By optimizing the contact angle, the fluidity and distribution of the tin liquid during welding can be improved, ensuring the uniform coating of the tin solder on the pad, reducing welding defects caused by excessive or insufficient local tin liquid, optimizing the distribution of solder, and improving the mechanical strength of welding, thereby improving the welding adhesion between the lead electrode 7 and the first pad 9, avoiding loosening or falling off of the solder joint due to mechanical stress or thermal expansion and contraction, and ensuring that the lead electrode 7 is stably and firmly welded on the first pad 9, thereby improving the safety and reliability of the device, and the ability to adjust the inclination angle enables the magnetic device to adapt to the requirements of different welding processes and equipment. Under different welding conditions, the adjustment of the adjustable inclination angle a can achieve the best welding effect and improve the consistency and reliability of welding quality.

[0050] In one embodiment, the value range of the adjustable inclination angle a between the lead electrode 7 and the bearing surface 8 in the second direction is 5°.

[0051] In one embodiment, the value range of the adjustable inclination angle a between the lead electrode 7 and the bearing surface 8 in the second direction is 13°.

[0052] In the specific implementation process, the height range of the adjustment control body 4 in the first direction includes 0.1cm-0.3cm, and this height range is the variation range of the spatial height H of the adjustment control space 5. Through this design, the high-reliability magnetic device 100 can adapt to different PCB height difference layouts and welding requirements, and the height range of the adjustment control body 4 in the first direction determines the spatial height H of the adjustment control space 5, which affects the flow and diffusion of the tin liquid during the welding process. Within the range of 0.1cm-0.3cm, sufficient expansion space can be provided for the tin solder, thereby avoiding overflow and short circuit caused by the increase in the volume of the tin liquid during the welding process.

[0053] In one embodiment, the height range of the adjustment control body 4 in the first direction is 0.2 cm.

[0054] In one embodiment, at least one superimposed adjustment block 13 is provided at one end of the adjustment control body 4, and the superimposed adjustment block 13 connects the adjustment control body 4 and the bearing surface 8 of the PCB board 200, and each superimposed adjustment block 13 has the same preset thickness, that is, the superimposed adjustment block 13 allows the user to flexibly adjust the total height of the adjustment control body 4 according to actual needs, and then by increasing or decreasing the number of superimposed adjustment blocks 13, the spatial height H of the adjustment space 5 can be accurately controlled, that is, the sizes of the first adjustable gap I, the second adjustable gap II and the third adjustable gap III can be synchronously controlled, and each superimposed adjustment block 13 has the same preset thickness, ensuring the consistency between the blocks during the adjustment process.

[0055] Preferably, in order to facilitate the fixed connection between the stacking adjustment blocks 13, adjacent stacking adjustment blocks 13 can be fixedly connected by threads.

[0056] An embodiment of the present application also provides an electronic device, which may include a PCB board 200 and the high-reliability magnetic device 100 of the above embodiments. For other working principles and processes of the electronic device of this embodiment, please refer to the description of the high-reliability magnetic device in the above embodiment of the present invention, which will not be repeated here.

[0057] The above is a detailed introduction to the high reliability magnetic device and electronic device provided by the present application. The principle and implementation method of the present application are described in detail using specific examples. It should be noted that in the present application, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0058] The above are only preferred embodiments of the present application, and the patent scope of the present application is not limited thereto. The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of this application, or directly or indirectly used in other related technical fields, as long as there is no contradiction in the combination of these technical features, are equally included in the patent protection scope of the present application.

Claims

1. A high reliability magnetic device, which is connected to a PCB board when used, characterized in that: include: A magnetic core body, wherein a center column is provided in the magnetic core body; A mounting seat connected to one end of the magnetic core body facing the PCB board, the mounting seat is provided with an adjustment control body, one end of the adjustment control body is in contact with the PCB board, and the mounting seat and the PCB board form an adjustment control space through the adjustment control body; A winding coil is wound on the central column, and a lead electrode is extended on one side of the magnetic core body. The lead electrode maintains an adjustable inclination angle with the bearing surface of the PCB board in the adjustment control space, and the end of the lead electrode and the first solder pad on the bearing surface have a first adjustable gap.

2. The high reliability magnetic device according to claim 1, characterized in that: A patch electrode is embedded on a side of the mounting seat away from the lead electrode, and a second adjustable gap is formed between the patch electrode and the second pad on the bearing surface in the adjustment control space.

3. The high reliability magnetic device according to claim 2, characterized in that: A third adjustable gap is formed between the side of the mounting base facing the PCB board and the first pad or the second pad on the bearing surface.

4. The high reliability magnetic device according to claim 2, characterized in that: The mounting seat is provided with an auxiliary boss integrally connected to one side of the patch electrode, the magnetic core body abuts against the inner wall of the auxiliary boss, and the patch electrode is designed in an L-shaped or C-shaped structure and affixed to the outer wall of the auxiliary boss.

5. The high reliability magnetic device according to claim 3, characterized in that: The height of the adjustment control body in the first direction is the spatial height of the adjustment control space, wherein the first direction is a direction perpendicular to the bearing surface of the PCB board, and the adjustment control body is located on the center line of the magnetic core body in the first direction, and the first soldering pad and the second soldering pad are arranged on both sides of the adjustment control body on the bearing surface.

6. The high reliability magnetic device according to claim 5, characterized in that: The first adjustable gap includes the shortest distance between the end of the lead electrode and the first pad in the first direction, the second adjustable gap includes the shortest distance between the patch electrode and the second pad in the first direction, and the third adjustable gap includes the shortest distance between the mounting base and the first pad or the second pad in the first direction.

7. The high reliability magnetic device according to claim 6, characterized in that: In the first direction, the first adjustable gap, the second adjustable gap, and the third adjustable gap change synchronously with the change of the spatial height of the adjustment control space.

8. The high reliability magnetic device according to claim 5, characterized in that: In a second direction perpendicular to the first direction, the value range of the adjustable inclination angle between the lead electrode and the bearing surface includes 0.5°-20°, and the height range of the adjustment control body in the first direction includes 0.1 cm-0.3 cm.

9. The high reliability magnetic device according to claim 1, characterized in that: At least one superimposed adjustment block is disposed at one end of the adjustment control body, and the superimposed adjustment block connects the adjustment control body and the bearing surface, and each of the superimposed adjustment blocks has the same preset thickness.

10. An electronic device, characterized in that: include: A PCB board and a high-reliability magnetic device as claimed in any one of claims 1 to 9, wherein the high-reliability magnetic device is connected to the PCB board.

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