Bearing device and semiconductor processing equipment

Abstract

The invention provides a bearing device and semiconductor processing equipment, the bearing device comprises a fixed part and a rotatable rotating part arranged above the fixed part, the fixed part comprises a first connecting surface, and the rotating part comprises a bearing surface for bearing a wafer and a second connecting surface deviating from the bearing surface. The first connecting surface is attached to the second connecting surface; the fixed part comprises a fixed main body and a cooling channel which is arranged in the fixed main body and used for allowing cooling liquid to flow, and the cooling channel cools the rotating part through heat exchange between the fixed main body and the rotating part. By means of the bearing device, the wafer can rotate in the machining process, meanwhile, the sealing structure is simplified, the sealing effect is improved, and cooling liquid can be effectively prevented from leaking.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a carrier device and semiconductor processing equipment. Background Art

[0002] The wafer carrier is a platform for placing wafers, which includes a three-pin lifting system, a fixing system, a temperature control system, a radio frequency system, a seal, and so on. Among them, the fixing system is the key to ensure that the wafer does not move during the etching process. There are two types of fixing systems here, one is fixed by mechanical structure, and the other is fixed by electrostatic adsorption. When using a mechanical wafer carrier, there are problems such as low edge utilization of the wafer and poor temperature uniformity on the surface of the wafer. The wafer carrier made using the principle of electrostatic adsorption is also called an electrostatic chuck or electrostatic suction cup (Electrostatic Chuck, ESC), and the electrostatic chuck can well solve the various technical problems caused by the wafer carrier with a mechanical structure, so it has a wider range of uses.

[0003] During the wafer processing, the electrostatic chuck is usually rotated to improve the uniformity within the wafer. In addition, the wafer temperature needs to be controlled during the processing to control the etching rate and etching uniformity. The cooling method usually uses coolant and cooling gas as the cooling medium.

[0004] However, since conventional electrostatic chucks need to rotate, the connection between the cooling medium supply source and the electrostatic chuck usually needs to be sealed by a dynamic seal. Therefore, the sealing method used is relatively complex and the cooling liquid in the electrostatic chuck is prone to leakage when the electrostatic chuck rotates. Summary of the invention

[0005] The present invention aims to at least solve the problem that the sealing method used in the prior art is relatively complicated and the cooling liquid in the electrostatic chuck is easy to leak when the electrostatic chuck rotates, and proposes a carrier device and semiconductor processing equipment.

[0006] In order to achieve the purpose of the present invention, a carrying device is provided, the carrying device comprises a fixed component and a rotatable rotating component arranged above the fixed component, the fixed component comprises a first connecting surface, the rotating component comprises a carrying surface for carrying a wafer, and a second connecting surface away from the carrying surface, the first connecting surface and the second connecting surface are arranged in contact with each other;

[0007] The fixed component includes a fixed body and a cooling channel provided in the fixed body for allowing cooling liquid to flow, and the cooling channel cools the rotating component through heat exchange between the fixed body and the rotating component.

[0008] Optionally, the cooling channel is arranged close to the first connecting surface.

[0009] Optionally, a first gas channel having an annular gas outlet is further provided in the fixed body, and the annular gas outlet is provided on the first connecting surface;

[0010] The rotating component includes a rotating body, in which a second gas channel is provided, and the gas outlet of the second gas channel is provided on the bearing surface; the gas inlet of the second gas channel is provided on the second connecting surface and is communicated with the annular gas outlet of the first gas channel, and when the rotating body rotates, the gas inlet of the second gas channel moves along the extension direction of the annular gas outlet to maintain communication with the annular gas outlet.

[0011] Optionally, an annular sealing structure is further included, which includes a ring body arranged around the rotating component and the fixed component, and a sealing cavity is provided between the inner circumference of the ring body and the outer circumference of the fixed body, a sealing liquid is provided in the sealing cavity, the pressure of the sealing cavity is greater than or equal to the gas pressure in the first gas channel, and the liquid level of the sealing liquid is higher than the fitting position of the outer circumference of the first connecting surface and the outer circumference of the second connecting surface.

[0012] Optionally, the sealing liquid includes liquid metal or kerosene.

[0013] Optionally, the first connecting surface includes a first plane and a first inclined surface arranged around the first plane, and a horizontal distance between the first inclined surface and the axis of the fixing body increases from top to bottom;

[0014] The second connecting surface includes a second plane and a second inclined surface arranged around the second plane, and the second plane is in contact with the first plane, and the second inclined surface is in contact with the first inclined surface.

[0015] Optionally, the carrying device further includes a first electrode and / or a heating element, wherein the first electrode is used as an electrostatic adsorption electrode and / or a radio frequency feeding electrode; and the first electrode and / or the heating element is disposed in the fixed body.

[0016] Optionally, the carrying device further comprises a first electrode and / or a heating element, the first electrode being used as an electrostatic adsorption electrode and / or a radio frequency feeding electrode; the first electrode and / or the heating element being arranged in the rotating component;

[0017] The carrying device further comprises an electrical connection assembly, and the first electrode and / or the heating element is electrically connected to a corresponding power source outside the carrying device via the electrical connection assembly.

[0018] Optionally, the electrical connection assembly is fixedly connected to the fixed body, and a portion of the electrical connection assembly extends into the rotating component and has a first contact surface; the first electrode and / or the heating element disposed in the rotating component has a second contact surface;

[0019] The first contact surface is in electrical contact with the second contact surface so as to be rotatable relative to each other.

[0020] Optionally, the electrical connection assembly comprises a conductive rod and a first contact member, wherein the first contact member is rotatably disposed in the rotating component and has the first contact surface;

[0021] The conductive rod is vertically arranged, and the lower end of the conductive rod is fixedly connected to the fixed body, and the conductive rod is used to be electrically connected to the corresponding power supply outside the supporting device; the upper end of the conductive rod extends into the rotating component, and is fixedly connected to the first contact piece, and is electrically conductive.

[0022] Optionally, a mounting recess is provided on the lower surface of the first electrode and / or the heating element, a second contact member is provided in the mounting recess, the second contact member is annular, an outer peripheral surface of the second contact member is detachably connected to an inner peripheral surface of the mounting recess, and an upper surface of the second contact member serves as the second contact surface;

[0023] The first contact piece is located in the mounting recess, and the lower surface of the first contact piece serves as the first contact surface and is in electrical contact with the upper surface of the second contact piece so as to be relatively rotatable;

[0024] The upper end of the conductive rod passes through the annular hole of the second contact piece and extends into the mounting recess, and is fixedly connected to the first contact piece.

[0025] Optionally, the carrying device further comprises a driving assembly, and the driving assembly is used to drive the rotating component to rotate around its rotation center;

[0026] The driving assembly comprises a driving shaft and a rotation driving source, one end of the driving shaft passes through the fixed body and is connected to the center position of the rotating component, and the other end of the driving shaft is connected to the rotation driving source; the rotation driving source is used to drive the rotating component to rotate through the driving shaft;

[0027] The conductive rod and the first contact member are both eccentrically arranged relative to the driving shaft.

[0028] Optionally, the rotating component includes a rotating body, and the material of the first electrode and / or the heating element includes a magnetic conductive material; or includes a magnetic material and a conductive material; or a magnetic material layer is provided at the bottom of the rotating body; and the fixed body is made of a non-magnetic material;

[0029] The supporting device also includes a driving assembly, which is used to drive the rotating component to rotate around its rotation center; the driving assembly includes a magnetic driving component arranged below the fixed body, and a rotation driving source for driving the magnetic driving component to rotate, and the magnetic driving component is used to drive the rotating component to rotate through magnetic force when rotating.

[0030] Optionally, the carrying device further comprises a driving assembly, and the driving assembly is used to drive the rotating component to rotate around its rotation center;

[0031] The driving assembly includes a driving shaft and a rotation driving source, one end of the driving shaft passes through the fixed body and at least one of the first electrode and the heating element arranged in the fixed body, and is connected to the center position of the rotating component, and the other end of the driving shaft is connected to the rotation driving source; the rotation driving source is used to drive the rotating component to rotate through the driving shaft.

[0032] Optionally, the carrying device further comprises an ejector pin system, wherein the ejector pin system comprises at least three ejector pins and a lifting assembly;

[0033] The fixed body includes a plurality of first through holes arranged vertically, the rotating component includes a rotating body, and the rotating body is provided with a plurality of second through holes penetrating the rotating body in a vertical direction, the plurality of second through holes are arranged in a one-to-one correspondence with the plurality of first through holes, and after the rotating component stops rotating, the first through holes are connected with the second through holes, the positions of the ejector pins are arranged in a one-to-one correspondence with the first through holes, and the lifting assembly is used to drive the ejector pins to pass through the first through holes and the second through holes in sequence, so that the top ends of the ejector pins can pass through the bearing surface.

[0034] Optionally, a distance sensor is disposed below one of the first through holes, and an orthographic projection of the distance sensor on a radial cross section of the first through hole is located inside the first through hole and does not overlap with an orthographic projection of a corresponding ejector pin on a radial cross section of the first through hole;

[0035] The distance sensor is used to detect whether the positions of the first through hole and the second through hole corresponding thereto correspond to each other.

[0036] As another technical solution, the present invention also provides a semiconductor processing equipment, including a carrying device arranged in a process chamber, wherein the carrying device adopts the above-mentioned carrying device provided by the present invention; the fixed component in the carrying device is fixed by a cantilever with one end fixed to the inner wall of the process chamber.

[0037] The present invention has the following beneficial effects:

[0038] The carrier device provided by the present invention can drive the wafer to rotate during the processing through a rotatable rotating component arranged above the fixed component, so as to achieve the effect of enhancing the uniformity of wafer processing. At the same time, by making the first connecting surface of the fixed component and the second connecting surface of the rotating component fit together, and providing a cooling channel for the flow of cooling liquid in the fixed body, the heat exchange between the fixed body and the rotating component can be utilized, so that the cooling liquid in the cooling channel can indirectly absorb the heat generated during the wafer processing, so that the overall temperature of the wafer during the processing is relatively balanced, thereby achieving a better processing effect. Moreover, by arranging the cooling channel in a non-rotating fixed body and being relatively independent of the rotating component, a static sealing structure can be used to seal the cooling channel and the cooling liquid supply device. Compared with the traditional dynamic sealing structure, the static sealing structure is simpler, so that the manufacturing and processing process of the sealing part are also simpler, which can reduce the cost of production and maintenance. At the same time, the static seal eliminates the relative movement of components in the sealing area, so that a better sealing effect can be achieved than the dynamic seal, and the problem of cooling liquid leakage can be effectively avoided. Therefore, the supporting device provided by the present invention can not only rotate the wafer during the processing and improve the process effect, but also simplify the sealing structure, effectively prevent the leakage of the cooling liquid, and improve the stability and reliability of the equipment operation.

[0039] The semiconductor processing equipment provided by the present invention, with the aid of the above-mentioned bearing device provided by the present invention, can rotate the wafer during the processing process, while simplifying the sealing structure, improving the sealing effect and effectively preventing the leakage of the cooling liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the cross-sectional structure of the carrying device and the cooling channel used in the present invention;

[0041] Figure 2 It is a schematic cross-sectional structure diagram of the first gas channel and the second gas channel in the carrier device used in the present invention;

[0042] Figure 3 A top view of a first gas channel used in the present invention;

[0043] Figure 4It is a partial enlarged view of the cross section of the sealing cavity used in the present invention;

[0044] Figure 5 This is a schematic cross-sectional structural diagram of a first electrode used in the present invention being arranged on a fixed component;

[0045] Figure 6 This is a cross-sectional structural schematic diagram of a first electrode and a heating element used in the present invention being simultaneously arranged on a fixed component;

[0046] Figure 7 A cross-sectional view of a structure of an embodiment in which the first electrode or the heating element used in the present invention is arranged on the fixed component and the rotating component is driven by the driving shaft;

[0047] Figure 8 It is a cross-sectional structural schematic diagram of a heating element used in the present invention being arranged on a rotating component and an electrical connection assembly;

[0048] Fig. 9 It is a cross-sectional structural schematic diagram of the first electrode and the heating element used in the present invention being simultaneously arranged on the rotating component and the electrical connection assembly;

[0049] Fig.10 A cross-sectional view of a structure of an embodiment of the present invention in which a first electrode or a heating element is disposed on a rotating component;

[0050] Fig.11 This is a cross-sectional view of a part of the structure in which the heating element used in the present invention is arranged on the rotating component and the rotating component is driven by the magnetic driving element.

[0051] Fig.12 A cross-sectional view of a structure of an embodiment in which the first electrode and the heating element used in the present invention are arranged on a rotating component and the rotating component is driven by a magnetic driving element;

[0052] Fig.13 for Fig.11 as well as Fig.12 A schematic diagram of the cross-sectional structure of the connection between the central electric connection assembly and the heating element;

[0053] Fig.14 for Fig.13 Exploded diagram of

[0054] Fig.15 for Figure 8-10 A schematic diagram of the cross-sectional structure of the connection between the central electric connection assembly and the heating element;

[0055] Fig.16 for Fig.15 Exploded diagram of

[0056] Fig.17 A schematic structural diagram of an embodiment of the ejector system used in the present invention;

[0057] Fig.18 It is a schematic diagram of the top view of the ejector system;

[0058] Fig.19 A schematic cross-sectional view of an embodiment of a semiconductor processing device used in the present invention

[0059] Fig. 20 This is a schematic cross-sectional structure diagram of another embodiment of the semiconductor processing equipment used in the present invention.

[0060] Reference numerals

[0061] 10-fixed component, 11-fixed body, 12-cooling channel, 13-first gas channel,

[0062] 131-annular gas outlet, 132-inlet channel, 14-first through hole, 15-thrust needle, 16-first plane, 17-first inclined surface, 20-rotating component, 21-rotating body, 21a-annular protrusion, 22-second gas channel, 221-sub-channel, 222-uniform flow channel, 223-connecting channel, 23-second through hole, 24-second plane, 25-second inclined surface, 31-first electrode, 32-heating element, 32 1-first contact piece, 33-electrical connection component, 331-second contact piece, 332-conductive rod, 34-magnetic driving component, 35-driving shaft, 40-annular sealing structure, 41-ring body, 42-sealing liquid, 50-process chamber, 51-air inlet, 60-upper electrode device, 70-matching device, 71-RF source, 80-rotation driving source, 90-vacuum system, 100-cooling gas supply device, 110-lifting component,

[0063] 120 - cooling liquid supply device, 130 - driving power supply, 140 - heating element power supply, 150 - electrostatic adsorption power supply. DETAILED DESCRIPTION

[0064] In order to enable those skilled in the art to better understand the technical solution of the present invention, the carrier device and semiconductor processing equipment provided by the present invention are described in detail below with reference to the accompanying drawings.

[0065] See also Figure 1 The bearing device provided in the embodiment of the present invention comprises a fixed component 10 and a rotatable rotating component 20 arranged above the fixed component 10. The fixed component 10 comprises a first connecting surface, namely Figure 1 The fixed component 10 has an upward surface, and the rotating component 20 includes a bearing surface (i.e. Figure 1 The upward surface of the rotating member 20 in the middle), and the second connecting surface away from the bearing surface (i.e. Figure 1The first connection surface is arranged in abutment with the second connection surface. The fixed component 10 includes a fixed body 11 and a cooling channel 12 arranged in the fixed body 11 for cooling liquid to flow. The cooling channel 12 cools the rotating component 20 through heat exchange between the fixed body 11 and the rotating component 20. Figure 1 The figure only schematically shows the position of the cooling channel 12, but does not represent the actual shape and structure.

[0066] The load-bearing device provided by the embodiment of the present invention is as follows: Figure 1 As shown, by the rotatable rotating component 20 arranged above the fixed component 10, the wafer can be driven to rotate during the processing to achieve the effect of enhancing the uniformity of wafer processing. At the same time, by making the first connecting surface of the fixed component 10 and the second connecting surface of the rotating component 20 fit together, and providing a cooling channel 12 for cooling liquid to flow in the fixed body 11, the heat exchange between the fixed body 11 and the rotating component 20 can be utilized, so that the cooling liquid in the cooling channel 12 can absorb the heat generated during the wafer processing, so that the overall temperature of the wafer is more balanced during the processing, thereby achieving a better processing effect, and by arranging the cooling channel 12 in the non-rotating fixed body 11 and being relatively independent of the rotating component 20, a static sealing structure can be adopted between the cooling channel 12 and the cooling liquid supply device. Compared with the traditional dynamic sealing structure, the static sealing structure is simpler, so that the manufacturing and processing process of the sealing part are simpler, and the production and maintenance costs can be reduced. At the same time, the static seal eliminates the relative movement of the components in the sealing area, so that a better sealing effect can be achieved than the dynamic seal, and the problem of cooling liquid leakage can be effectively avoided. Therefore, the supporting device provided by the embodiment of the present invention can not only rotate the wafer during the processing and improve the process effect, but also simplify the sealing structure, effectively prevent the leakage of the cooling liquid, and improve the stability and reliability of the equipment operation.

[0067] Among them, in order to improve the cooling efficiency and enable the fixed body 11 to more effectively control the temperature of the rotating component 20, by setting the cooling channel 12 close to the above-mentioned first connecting surface, the heat conduction distance between the coolant in the cooling channel 12 and the rotating component 20 can be shortened, and the heat exchange efficiency can be improved, so that the carrier device can better control the temperature of the wafer to improve the etching rate and etching uniformity. The so-called close proximity means that the cooling channel 12 is set as close to the first connecting surface as possible under the premise of ensuring the sealing effect and the relative isolation of the cooling channel 12 from the outside of the fixed body 11. The cooling channel 12 may include a plurality of channels, and the plurality of channels are evenly distributed relative to the first connecting surface. The structure and layout are not limited, so as to achieve the effect of improving the heat exchange efficiency and uniformity.

[0068] Furthermore, if Figure 2 and Figure 3 As shown, in the cooling channel 12 ( Figure 2 On the basis of the embodiment of the present invention, a first gas channel 13 having an annular air outlet 131 is further provided in the fixed body 11, and the annular air outlet 131 is provided on the first connecting surface; the rotating component 20 includes a rotating body 21, and a second gas channel 22 is provided in the rotating body 21, and the air outlet of the second gas channel 22 is provided on the bearing surface; the air inlet of the second gas channel 22 is provided on the second connecting surface, and is communicated with the annular air outlet 131 of the first gas channel 13, and when the rotating body 21 rotates, the air inlet of the second gas channel 22 moves along the extension direction of the annular air outlet 131 to maintain communication with the annular air outlet 131. Specifically, in order to keep the second gas channel 22 in communication with the first gas channel 13 while rotating with the rotating body 21, the annular air outlet 131 provided in the first gas channel 13 is used, so that the air inlet of the second gas channel 22 can be able to maintain communication with the annular air outlet 131 when the rotating body 21 rotates. The cooling gas can be delivered to the bearing surface of the rotating component 20 through the connected first gas channel 13 and the second gas channel 22, so that the cooling gas can be filled in the gap between the bearing surface and the wafer on the bearing surface, which can not only achieve the effect of cooling the wafer itself, but also serve as a heat-conducting medium to enhance the heat exchange effect between the wafer and the rotating component 20. It should be noted that since the wafer plasma processing process is in a vacuum environment, and the vacuum cannot conduct heat, and it is impossible for the wafer and the bearing surface to achieve theoretical flatness and complete fit, there are still some small gaps between the two, and the above-mentioned cooling gas is filled in these small gaps.

[0069] Optional, such as Figure 2 and Figure 3 As shown, the second gas channel 22 includes a plurality of sub-channels 221, a uniform flow channel 222 and a plurality of connecting channels 223. The gas outlets of the plurality of sub-channels 221 are all located on the bearing surface of the rotating component 20, and the gas inlets of the plurality of sub-channels 221 are all connected to the uniform flow channel 222; the gas outlets of the plurality of connecting channels 223 are all connected to the uniform flow channel 222, and the gas inlets of the plurality of connecting channels 223 are all connected to the annular gas outlet 131. Further optionally, the gas inlets of the plurality of connecting channels 223 are evenly arranged relative to the annular gas outlet 131. In addition, optionally, as Figure 2As shown, the first gas channel 13 includes an annular groove formed on the first connection surface and serving as an annular gas outlet 131, and a plurality of gas inlet channels 132, one end of the gas inlet channel 132 is connected to the annular groove, and the other end is located on the surface of the fixed body 11 away from the first connection surface, and is used to connect to the gas source. Optionally, the plurality of gas inlet channels 132 are evenly distributed along the circumference of the annular gas outlet 131 to ensure that the gas distribution in the annular gas outlet 131 is more even.

[0070] The rotating body 21 can rotate relative to the fixed body 11, and the docking position of the first gas channel 13 and the second gas channel 22 is also located on the two connecting surfaces where the rotating body 21 and the fixed body 11 are in contact. In order to avoid the problem that the cooling gas may leak here, a sealing ring, a round-shaped sealing structure or the like can be used to seal the two connecting surfaces where the rotating body 21 and the fixed body 11 are in contact. As an optional embodiment, the sealing structure for sealing the two connecting surfaces where the rotating body 21 and the fixed body 11 are in contact is specifically as follows: Figure 4 As shown, the bearing device also includes an annular sealing structure 40, which includes an annular body arranged around the rotating body 21 and the fixed body 11, and a sealing cavity is provided between the inner circumference of the annular body and the outer circumference of the fixed body 11. The sealing cavity is annular, and a sealing liquid 42 is arranged inside it. The pressure of the sealing cavity is greater than or equal to the gas pressure in the first gas channel, and the liquid level H1 of the sealing liquid 42 is higher than the height H2 of the fitting position of the outer periphery of the first connecting surface and the outer periphery of the second connecting surface. Among them, the sealing cavity can be relatively isolated from the external vacuum environment by conventional sealing methods, and by making the pressure in the sealing cavity greater than or equal to the gas pressure in the first gas channel 13, gas leakage can be prevented. The sealing liquid 42 can be a liquid substance with poor volatility, such as liquid metal or kerosene, etc. The liquid metal can be metallic mercury, but because metallic mercury has a certain toxicity, metallic gallium and its compounds or alloys can also be used.

[0071] In addition, due to the precision of processing, an extremely small gap will inevitably be generated between the first connecting surface and the second connecting surface. In order to prevent the sealing liquid 42 from flowing back along the small gap between the first connecting surface and the second connecting surface, Figure 4As shown, the first connection surface includes a first plane 16 and a first inclined surface 17 arranged around the first plane 16, and the horizontal distance between the first inclined surface 17 and the axis of the fixed body 11 increases from top to bottom; the second connection surface includes a second plane 24 and a second inclined surface 25 arranged around the second plane 24, and the second plane 24 is in contact with the first plane 16, and the second inclined surface 25 is in contact with the first inclined surface 17. By providing the above-mentioned first inclined surface 17 and second inclined surface 25, the rotating body 21 can form an annular protrusion 21a protruding downward relative to the first plane 16 (and the second plane 24) around the fixed body 11, and the lower end height of the annular protrusion 21a is the above-mentioned height H2. Since the height H2 is lower than the liquid level H1 of the sealing liquid 42, the annular protrusion 21a can not only prevent the gas between the second plane 24 and the first plane 16 located inside it from leaking out, but also prevent the sealing liquid 42 located outside it from flowing back.

[0072] As an optional implementation, Figures 5 to 7 As shown, the carrying device also includes a first electrode 31, which is used as an electrostatic adsorption electrode and / or a radio frequency feeding electrode; the first electrode 31 is arranged in the fixed body 11; and / or, the carrying device also includes a heating element 32, which is arranged in the fixed body 11. Among them, the first electrode 31 can be used as an electrostatic adsorption electrode or a radio frequency feeding electrode alone, and in addition, the first electrode 31 can also be used as an electrostatic adsorption electrode and a radio frequency feeding electrode at the same time. The electrostatic adsorption electrode is used to fix the wafer on the carrying surface by electrostatic adsorption, and the radio frequency feeding electrode is used to generate a radio frequency bias that can attract plasma to move toward the surface of the wafer during the process, so that the plasma processes the wafer fixed on the carrying surface. The heating element is used to heat the fixed body and then indirectly heat the wafer to achieve temperature control of the wafer. There can be multiple heating elements, and they are respectively arranged in multiple different partitions in the fixed body to achieve more accurate temperature control. By arranging the first electrode 31 and the heating element 32 in the fixed body 11, the power supply line can pass through the fixed component 10 and extend outside the fixed body 11. Figure 5 The figure shows the case where only the first electrode 31 is included. Figure 6 The case where both the first electrode 31 and the heating element 32 are included is shown. Figure 7 Shown in Figure 6 On the basis of, the distribution of the cooling channel 12, the first gas channel 13 and the second gas channel 22.

[0073] As another optional implementation, Figure 8-Figure 16As shown, the first electrode 31 and / or the heating element 32 may also be disposed in the rotating component 20. In this case, the carrying device further comprises an electrical connection assembly 33, through which the first electrode 31 and / or the heating element 32 are electrically connected to a corresponding power source outside the carrying device, i.e., the electrical connection assembly 33 is configured to be able to keep the first electrode 31 and / or the heating element 32 electrically connected to a corresponding power source outside the carrying device during the rotation of the rotating component 20. It is easy to understand that if both the first electrode 31 and the heating element 32 are disposed in the rotating component 20, there are two electrical connection assemblies 33, and the first electrode 31 and the heating element 32 are electrically connected to a corresponding power source outside the carrying device through two electrical connection assemblies 33, respectively.

[0074] There can be various structures of the electrical connection component 33 for realizing this function. For example, the electrical connection component 33 is fixedly connected to the fixed body 11, and a part of the electrical connection component 33 extends into the rotating body 21 and has a first contact surface; the first electrode 31 and / or the heating element 32 arranged in the rotating body 21 have a second contact surface, and the second contact surface is in relative rotational electrical contact with the above-mentioned first contact surface. Thus, the electrical connection component 33 can be electrically connected to the corresponding external power source through the power supply line arranged in the fixed body 11, and at the same time, the above-mentioned first contact surface of the electrical connection component 33 can maintain relatively rotational electrical contact with the second contact surface of the first electrode 31 and / or the heating element 32 during the continuous rotation of the rotating body 21, so that the first electrode 31 and / or the heating element 32 can be kept electrically connected to the corresponding external power source during the rotation of the rotating component 20.

[0075] Specifically, Fig.15 and Fig.16 As shown, the electrical connection assembly 33 includes, for example, a conductive rod 332 and a first contact member 331, wherein the first contact member 331 is rotatably disposed in the rotating body 21 and has the above-mentioned first contact surface (i.e. Fig.15 The conductive rod 332 is vertically arranged, and the lower end of the conductive rod 332 is fixedly connected to the fixed body 11, and the conductive rod 332 is used to be electrically connected to the corresponding power supply outside the carrier device; the upper end of the conductive rod 332 extends into the rotating body 21, and is fixedly connected to the first contact member 331, and is electrically conductive. Thus, the conductive rod 332 can be electrically connected to the corresponding external power supply through the power supply line arranged in the fixed body 11, and the first contact surface of the first contact member 331 can maintain relatively rotatable electrical contact with the second contact surface of the first electrode 31 and / or the heating member 32 during the continuous rotation of the rotating body 21, so that the first electrode 31 and / or the heating member 32 can be kept electrically connected to the corresponding external power supply during the rotation of the rotating component 20.

[0076] Furthermore, if Figure 13 to Figure 14 As shown, taking the example that the heating element 32 is electrically connected to the corresponding external power source through the above-mentioned electrical connection assembly 33, the lower surface of the heating element 32 is provided with a mounting recess 32a, and the mounting recess 32a is provided with a second contact 321, the second contact 321 is annular, and the outer circumference of the second contact 321 is detachably connected to the inner circumference of the mounting recess 32a, for example, the outer circumference of the second contact 321 and the inner circumference of the mounting recess 32a are respectively provided with matching external threads and internal threads, and the second contact 321 can be screwed into or out of the mounting recess 32a through the external threads. Of course, in actual applications, other detachable structures such as a snap-on structure or a plug-in structure can also be provided between the outer circumference of the second contact 321 and the inner circumference of the mounting recess 32a, and the embodiment of the present invention has no special restrictions on this. The upper surface of the second contact member 321 is used as the above-mentioned second contact surface; the first contact member 331 is located in the mounting recess 32a, and the lower surface of the first contact member 331 is used as the above-mentioned first contact surface, and is in electrical contact with the upper surface of the second contact member 321 in a relatively rotatable manner; the upper end of the conductive rod 332 passes through the annular hole of the second contact member 321 and extends into the mounting recess 32a, and is fixedly connected with the first contact member 331. Through the above arrangement, while ensuring that the first contact member 331 is in electrical contact with the second contact member 321, the second contact member 331 is also used to restrict the first contact member 321 in the mounting recess 32a, and at the same time, the movement of the heating member 32 in the vertical direction can be restricted, thereby further restricting the movement of the rotating component 20 in the vertical direction, and improving the movement stability of the rotating component 20.

[0077] Figures 11 to 14 An electrical connection assembly 33 is shown, which can be applied to a rotating body 21 that is not connected to a drive shaft 35. For example, the rotating body 21 is driven by magnetic force, and there is no need to set a drive shaft 35. In this case, the relative positions of the first contact member 331 and the conductive rod 332 in the electrical connection assembly 33 and the rotating body 21 do not need to consider the problem of avoiding the drive shaft 35. Preferably, the first contact member 331 and the conductive rod 332 are approximately located at the center of the rotating body 21.

[0078] The method of using magnetic force to drive the rotating body 21 can be specifically as follows: Fig.11 and Fig.12As shown, the rotating component 20 includes a rotating body 21, and the material of the first electrode 31 and / or the heating element 32 includes a magnetic conductive material, such as iron, nickel, cobalt, etc., which can be attracted by the magnetic field generated by a magnet or an electromagnet; or, the material of the first electrode 31 and / or the heating element 32 includes a magnetic material and a conductive material, the magnetic material is, for example, iron, nickel, cobalt, etc., which can be attracted by the magnetic field generated by a magnet or an electromagnet, and the conductive material is, for example, aluminum. The magnetic material and the conductive material can be arranged in layers or mixed, as long as the first electrode 31 and / or the heating element 32 can be attracted by the magnetic field generated by the magnet or the electromagnet and can be conductive, and the embodiment of the present invention has no limitation on this. The fixed body 11 is made of non-magnetic material. In another optional embodiment, the material of the first electrode 31 and / or the heating element 32 can also be made of conductive material, and a magnetic material layer is arranged at the bottom of the rotating body 21, and the magnetic material layer can be attracted by the magnetic field generated by the magnet or the electromagnet. On this basis, the bearing device further includes a driving assembly, which is used to drive the rotating body 21 to rotate around its rotation center; the driving assembly includes a magnetic driving member 34 disposed below the fixed body 11, and a rotation driving source for driving the magnetic driving member 34 to rotate, and the magnetic driving member 34 is used to drive the rotating body 21 to rotate through the mutual attraction between the magnetic field generated by itself and the first electrode 31 and / or the heating member 32 (or the above-mentioned magnetic material layer) during rotation. The magnetic driving member 34 is, for example, a magnet or an electromagnet composed of a coil.

[0079] Figures 8 to 10 as well as Fig.15 and Fig.16 Another electrical connection assembly 33 is shown, which can be applied to the rotating body 21 connected to the driving shaft 35. In this case, the relative positions of the first contact member 331 and the conductive rod 332 in the electrical connection assembly 33 and the rotating body 21 do not need to avoid the driving shaft 35, so as to ensure that the power supply of the first electrode 31 and / or the heating member 32 does not affect the rotation drive of the rotating body 21. The rotating body 21 and the electrical connection assembly 33 are described in detail below in conjunction with a specific driving method.

[0080] Specifically, Figures 5 to 10As shown, the bearing device also includes a driving assembly, which is used to drive the rotating component 20 (i.e., the rotating body 21) to rotate around its rotation center; the driving assembly includes a driving shaft 35 and a rotation driving source, one end of the driving shaft 35 passes through the fixed body 11 and is connected to the center position of the rotating body 21, and the other end of the driving shaft 35 is connected to the rotation driving source; the rotation driving source is used to drive the rotating component 20 to rotate through the driving shaft 35; the conductive rod 332 and the first contact member 331 are both eccentrically arranged relative to the driving shaft 35. By adopting the driving mode that the rotating component 20 is driven to rotate by the driving shaft 35, the structure is simple, and the rotating driving source can limit the horizontal or longitudinal movement of the rotating component 20 while providing driving force through the driving shaft 35. The rotation driving source can be a rotating motor or the like.

[0081] In addition, if Fig.17 and Fig.18 As shown, the bearing device also includes an ejector system, which includes at least three ejector pins 15 and a lifting assembly 110; the fixed body 11 includes a plurality of first through holes 14 arranged vertically; the rotating body 21 is provided with a plurality of second through holes 23 penetrating the rotating body 21 in a vertical direction, and the plurality of second through holes 23 are arranged one-to-one with the plurality of first through holes 14, and after the rotating component 20 stops rotating, the first through holes 14 are connected with the second through holes 23, and the positions of the ejector pins 15 are arranged one-to-one with the first through holes 14, and the lifting assembly 110 is used to drive each ejector pin 15 to rise and fall, and pass through the first through holes 14 and the second through holes 23 in sequence during the rising and falling, so that the top of the ejector pin 15 can be higher or lower than the bearing surface. Fig.18 As shown, multiple second through holes 23 can be evenly distributed along the circumference of the carrying surface, and multiple ejector pins 15 have the same height and can be driven synchronously, so that the ejector pin system can apply uniform supporting force to the wafer and lift the wafer horizontally to prevent the wafer from sliding off the carrying surface during the lifting process.

[0082] The driving assembly for driving the rotating body 21 may be configured to drive the rotating body 21 to rotate to a position where the first through hole 14 and the second through hole 23 are connected after the rotating body 21 stops rotating; or, the driving assembly for driving the rotating body 21 may be configured to directly reach a position where the first through hole 14 and the second through hole 23 are connected when the rotating body 21 stops rotating. There are many ways to achieve the rotation of the rotating body 21 to a position where the first through hole 14 and the second through hole 23 are connected. For example, a distance sensor is provided below one of the first through holes 14. When the rotating body 21 is located at a position where the first through hole 14 and the corresponding second through hole 23 are connected, the orthographic projection of the distance sensor on the radial section of the first through hole 14 is located in the first through hole 14, and does not overlap with the orthographic projection of the corresponding ejector pin 15 on the radial section of the first through hole 14. The distance sensor is used to detect whether the positions of the first through hole 14 and the corresponding second through hole 23 correspond. By making the orthographic projections of the distance sensor and the corresponding ejector pin 15 on the radial section of the first through hole 14 not overlap, when the positions of the first through hole 14 and the second through hole 23 correspond, the detection signal emitted by the distance sensor can pass through the gap between the ejector pin 15 and the first through hole 14, and when the positions of the first through hole 14 and the second through hole 23 do not correspond, the detection signal emitted by the distance sensor will be blocked, so that the distance sensor can detect whether the positions of the first through hole 14 and the second through hole 23 correspond. The above distance sensor is, for example, an infrared sensor, a laser sensor, and the like.

[0083] In summary, the carrying device provided by the embodiment of the present invention can drive the wafer to rotate during the processing through a rotatable rotating component arranged above the fixed component, so as to achieve the effect of enhancing the uniformity of wafer processing. At the same time, by making the first connecting surface of the fixed component and the second connecting surface of the rotating component fit together, and providing a cooling channel for the flow of cooling liquid in the fixed body, the heat exchange between the fixed body and the rotating component can be utilized, so that the cooling liquid in the cooling channel can indirectly absorb the heat generated during the wafer processing process, so that the overall temperature of the wafer during the processing is more balanced, thereby achieving a better processing effect, and by arranging the cooling channel in a non-rotating fixed body and being relatively independent of the rotating component, a static sealing structure can be used to seal the cooling channel and the cooling liquid supply device. Compared with the traditional dynamic sealing structure, the static sealing structure is simpler, which makes the manufacturing and processing process of the sealing part simpler, and can reduce the cost of production and maintenance. At the same time, the static seal eliminates the relative movement of components in the sealing area, so that a better sealing effect can be achieved than a dynamic seal, and the problem of cooling liquid leakage can be effectively avoided. Therefore, the supporting device provided by the present invention can not only rotate the wafer during the processing and improve the process effect, but also simplify the sealing structure, effectively prevent the leakage of the cooling liquid, and improve the stability and reliability of the equipment operation.

[0084] As another technical solution, an embodiment of the present invention further provides a semiconductor processing device, such as Fig.19 and Fig. 20 As shown, the semiconductor processing equipment includes a process chamber 50 and a carrier device disposed in the process chamber 50, and the carrier device adopts the above-mentioned carrier device provided by the embodiment of the present invention. In addition, the fixing component 10 in the carrier device is fixed to the inner wall of the process chamber 50 by a cantilever 52 (its position is as shown in FIG. Fig.19 and Fig. 20 The dotted box in the figure does not represent the actual shape and structure).

[0085] The semiconductor processing equipment provided by the embodiment of the present invention, with the help of the above-mentioned carrying device provided by the embodiment of the present invention, can rotate the wafer during the processing process, while simplifying the sealing structure, improving the sealing effect and effectively preventing the leakage of the cooling liquid.

[0086] In some optional embodiments, at least one air inlet 51 is provided at the top of the process chamber 50, and the at least one air inlet 51 is used to introduce process gas into the process chamber 50; and, a radio frequency coil 60 is provided above the top wall and in the side wall of the process chamber 50, and the radio frequency coil 60 is electrically connected to a radio frequency power supply 71 through a matcher 70, and is used to excite the process gas in the process chamber 50 to form plasma. It should be noted that the radio frequency coil 60 in the side wall of the process chamber 50 is arranged around the circumference of the process chamber 50, and it can be used together with the radio frequency coil 60 arranged above the top wall of the process chamber 50 to achieve a better excitation effect.

[0087] In some optional embodiments, in order to ensure better processing uniformity of the wafers, the carrier device may be disposed at the center of the process chamber 50 to make the processing more uniform.

[0088] Fig.19 and Fig. 20 Two different implementations of the carrying device are respectively adopted. Specifically, Fig.19 Adopted Figures 8 to 10 as well as Fig.15 and Fig.16 The rotating body shown is connected to the bearing device of the drive shaft; Fig. 20 Adopted Figures 11 to 14 The rotating body is shown without the carrier device connected to the drive shaft.

[0089] In some optional embodiments, such as Fig.19 and Fig. 20 As shown, taking the first electrode 31 and the heating element 32 in the carrier device disposed in the rotating component 20 as an example, the first electrode 31 and the heating element 32 are both electrically connected to respective external power sources through the electrical connection assembly 33, wherein the first electrode 31 simultaneously serves as an electrostatic adsorption electrode and an RF feeding electrode, and is electrically connected to an external electrostatic adsorption power source 150 (DC power source), and is electrically connected to an RF power source 71 through an external matching device 70. The wires of the first electrode 31 and the heating element 32 can be led out to the side wall of the process chamber 50 through the cantilever 52, and extend through the side wall to the outside of the process chamber 50 to be electrically connected to the corresponding power source.

[0090] In some optional embodiments, such as Fig.19 and Fig. 20 As shown, the driving component in the supporting device, whose rotating driving source 80 is arranged in the cantilever 52, is a motor, for example. The power supply wire of the motor can be led out to the side wall of the process chamber 50 through the cantilever 52, and extend through the side wall to the outside of the process chamber 50 to be electrically connected to the driving power supply 130.

[0091] In addition, the cooling channel 12 and the first gas channel 13 in the fixed component 10 can be led out to the side wall of the process chamber 50 through the pipeline arranged in the cantilever 52, and extend through the side wall to the outside of the process chamber 50, and are respectively connected to the cooling gas supply device 100 and the cooling liquid supply device 120.

[0092] In some optional embodiments, such as Fig.19 and Fig. 20 As shown, an exhaust port is provided at the bottom of the process chamber 50, and the exhaust port can also be connected to the vacuum pumping system 90. The vacuum pumping system 90 extracts the gas in the process chamber 50 through the exhaust port, so that the process chamber 50 is in a vacuum state.

[0093] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A carrying device, characterized in that: The carrying device includes a fixed component and a rotatable rotating component arranged above the fixed component, the fixed component includes a first connecting surface, the rotating component includes a carrying surface for carrying the wafer, and a second connecting surface away from the carrying surface, the first connecting surface and the second connecting surface are arranged in contact with each other; The fixed component includes a fixed body and a cooling channel provided in the fixed body for allowing cooling liquid to flow, and the cooling channel cools the rotating component through heat exchange between the fixed body and the rotating component.

2. The carrying device according to claim 1, characterized in that: The cooling channel is arranged close to the first connecting surface.

3. The carrying device according to claim 1, characterized in that: The fixed body is also provided with a first gas channel having an annular gas outlet, and the annular gas outlet is provided on the first connecting surface; The rotating component includes a rotating body, in which a second gas channel is provided, and the gas outlet of the second gas channel is provided on the bearing surface; the gas inlet of the second gas channel is provided on the second connecting surface and is communicated with the annular gas outlet of the first gas channel, and when the rotating body rotates, the gas inlet of the second gas channel moves along the extension direction of the annular gas outlet to maintain communication with the annular gas outlet.

4. The carrying device according to any one of claims 1 to 3, characterized in that: It also includes an annular sealing structure, which includes an annular body arranged around the rotating component and the fixed component, and a sealing cavity is provided between the inner circumference of the annular body and the outer circumference of the fixed body, and a sealing liquid is provided in the sealing cavity. The pressure of the sealing cavity is greater than or equal to the gas pressure in the first gas channel, and the liquid level of the sealing liquid is higher than the fitting position of the outer circumference of the first connecting surface and the outer circumference of the second connecting surface.

5. The carrying device according to claim 4, characterized in that: The sealing liquid includes liquid metal or kerosene.

6. The carrying device according to claim 4, characterized in that: The first connecting surface includes a first plane and a first inclined surface arranged around the first plane, and the horizontal distance between the first inclined surface and the axis of the fixing body increases from top to bottom; The second connecting surface includes a second plane and a second inclined surface arranged around the second plane, and the second plane is in contact with the first plane, and the second inclined surface is in contact with the first inclined surface.

7. The carrying device according to claim 1, characterized in that: The carrying device further comprises a first electrode and / or a heating element, wherein the first electrode is used as an electrostatic adsorption electrode and / or a radio frequency feeding electrode; the first electrode and / or the heating element is arranged in the fixed body.

8. The carrying device according to claim 1, characterized in that: The carrying device further comprises a first electrode and / or a heating element, wherein the first electrode is used as an electrostatic adsorption electrode and / or a radio frequency feeding electrode; the first electrode and / or the heating element is arranged in the rotating component; The carrying device further comprises an electrical connection assembly, and the first electrode and / or the heating element is electrically connected to a corresponding power source outside the carrying device via the electrical connection assembly.

9. The carrying device according to claim 8, characterized in that: The electrical connection assembly is fixedly connected to the fixed body, and a portion of the electrical connection assembly extends into the rotating component and has a first contact surface; the first electrode and / or the heating element disposed in the rotating component has a second contact surface; The first contact surface is in electrical contact with the second contact surface so as to be rotatable relative to each other.

10. The carrying device according to claim 9, characterized in that: The electrical connection assembly comprises a conductive rod and a first contact member, wherein the first contact member is rotatably disposed in the rotating component and has the first contact surface; The conductive rod is vertically arranged, and the lower end of the conductive rod is fixedly connected to the fixed body, and the conductive rod is used to be electrically connected to the corresponding power supply outside the supporting device; the upper end of the conductive rod extends into the rotating component, and is fixedly connected to the first contact piece, and is electrically conductive.

11. The carrying device according to claim 10, characterized in that: A mounting recess is provided on the lower surface of the first electrode and / or the heating element, a second contact member is provided in the mounting recess, the second contact member is annular, an outer peripheral surface of the second contact member is detachably connected to an inner peripheral surface of the mounting recess, and an upper surface of the second contact member serves as the second contact surface; The first contact piece is located in the mounting recess, and the lower surface of the first contact piece serves as the first contact surface and is in electrical contact with the upper surface of the second contact piece so as to be relatively rotatable; The upper end of the conductive rod passes through the annular hole of the second contact piece and extends into the mounting recess, and is fixedly connected to the first contact piece.

12. The carrying device according to claim 11, characterized in that: The bearing device further comprises a driving assembly, and the driving assembly is used to drive the rotating component to rotate around its rotation center; The driving assembly comprises a driving shaft and a rotation driving source, one end of the driving shaft passes through the fixed body and is connected to the center position of the rotating component, and the other end of the driving shaft is connected to the rotation driving source; the rotation driving source is used to drive the rotating component to rotate through the driving shaft; The conductive rod and the first contact member are both eccentrically arranged relative to the driving shaft.

13. The carrying device according to any one of claims 8 to 11, characterized in that: The rotating component includes a rotating body, and the material of the first electrode and / or the heating element includes a magnetic conductive material; or includes a magnetic material and a conductive material; or a magnetic material layer is provided at the bottom of the rotating body; the fixed body is made of a non-magnetic material; The supporting device also includes a driving assembly, which is used to drive the rotating component to rotate around its rotation center; the driving assembly includes a magnetic driving component arranged below the fixed body, and a rotation driving source for driving the magnetic driving component to rotate, and the magnetic driving component is used to drive the rotating component to rotate through magnetic force when rotating.

14. The carrying device according to claim 7, characterized in that: The bearing device further comprises a driving assembly, and the driving assembly is used to drive the rotating component to rotate around its rotation center; The driving assembly includes a driving shaft and a rotation driving source, one end of the driving shaft passes through the fixed body and at least one of the first electrode and the heating element arranged in the fixed body, and is connected to the center position of the rotating component, and the other end of the driving shaft is connected to the rotation driving source; the rotation driving source is used to drive the rotating component to rotate through the driving shaft.

15. The carrying device according to claim 1, characterized in that: The carrying device further comprises an ejector pin system, wherein the ejector pin system comprises at least three ejector pins and a lifting assembly; The fixed body includes a plurality of first through holes arranged vertically, the rotating component includes a rotating body, and the rotating body is provided with a plurality of second through holes penetrating the rotating body in a vertical direction, the plurality of second through holes are arranged in a one-to-one correspondence with the plurality of first through holes, and after the rotating component stops rotating, the first through holes are connected with the second through holes, the positions of the ejector pins are arranged in a one-to-one correspondence with the first through holes, and the lifting assembly is used to drive the ejector pins to pass through the first through holes and the second through holes in sequence, so that the top ends of the ejector pins can pass through the bearing surface.

16. The carrying device according to claim 15, characterized in that: A distance sensor is disposed below one of the first through holes, and an orthographic projection of the distance sensor on a radial cross section of the first through hole is located inside the first through hole and does not overlap with an orthographic projection of a corresponding ejector pin on a radial cross section of the first through hole; The distance sensor is used to detect whether the positions of the first through hole and the second through hole corresponding thereto correspond to each other.

17. A semiconductor processing equipment, characterized in that: It includes a process chamber and a carrying device arranged in the process chamber, the carrying device adopts the carrying device described in any one of claims 1 to 16; the fixed component in the carrying device is fixed by a cantilever with one end fixed to the inner wall of the process chamber.

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