Position conversion device and substrate processing apparatus including same

Abstract

The invention relates to a posture conversion apparatus and a substrate processing apparatus including the same. The present invention is a posture conversion device for converting the posture of a plurality of substrates, and the device includes the following elements. A reverse chuck holding the plurality of substrates; an opening / closing driving mechanism for driving the inversion chuck in the radial direction of the substrates between an open position for handing over the plurality of substrates with the inversion chuck and a holding position for holding the plurality of substrates with the inversion chuck; a rotation driving mechanism which drives the inversion clamping disc around a horizontal axis in order to convert the posture of the plurality of substrates from a vertical posture to a horizontal posture; and a control unit that operates the opening / closing drive mechanism so that when the plurality of substrates in a vertical posture are held by the inversion chuck and the posture of the plurality of substrates is converted from the vertical posture to the horizontal posture, the control unit operates the rotation drive mechanism such that the processing surfaces of the plurality of substrates face upward.

Description

Technical Field

[0001] The present invention relates to a posture conversion device for performing prescribed processing on substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates such as liquid crystal display or organic EL (Electroluminescence) display devices, glass substrates for masks, and substrates for optical disks, and a substrate processing device equipped with the posture conversion device. Background Art

[0002] In the past, such devices include devices having a batch module, a single-chip module, and a posture conversion module. For example, refer to Japanese Gazette No. 2016-502275. The batch module processes multiple substrates in a unified manner. The single-chip module processes substrates one by one. Generally speaking, compared with the drying process of the batch module, the drying process of the single-chip module affects a smaller space of the processing atmosphere and has higher particle performance. Therefore, it is easier to improve the drying performance of the single-chip module than the batch module. Therefore, for example, sometimes after etching and cleaning are performed in a batch module, drying is performed in a single-chip module.

[0003] In the batch module, the substrates are processed in a vertical position. On the other hand, in the single-wafer module, the substrates are processed in a horizontal position. Therefore, the substrates in a vertical position after the batch module is processed are converted to a horizontal position by the position conversion module before being transferred to the single-wafer module.

[0004] Specifically, the posture conversion module comprises: a chuck having two side surface support portions abutting against two side surfaces of the supporting substrate, and a lower end surface support portion abutting against the lower side of the end surface of the supporting substrate surface orthogonal to the two side surfaces; and a rotation mechanism for rotating the chuck 90 degrees around a horizontal axis toward one side. The rotation mechanism rotates the chuck 90 degrees around a horizontal axis in such a way that the lower end surface support portion is located on the opposite side of the direction in which the robot that transfers the substrate piece by piece to the monolithic module is arranged when viewed from above. After the chuck is rotated by the rotation mechanism, the robot can receive the substrate from the direction in which the lower end surface support portion in the chuck is not arranged.

[0005] However, in the case of the conventional example having such a configuration, there are the following problems.

[0006] That is, in the conventional apparatus, the chuck can only rotate 90 degrees in one direction around the horizontal axis. In this configuration, for example, when the processing surface of the plurality of substrates is facing the robot side in the vertical posture state, it is impossible to switch to a horizontal posture with the processing surface facing upward. In other words, there is a problem that the posture of the plurality of substrates can only be switched when the processing surface of the plurality of substrates is facing the opposite side of the robot side in the vertical posture state.

[0007] In order to increase the processing volume in a batch module, a plurality of substrates constituting a batch and a plurality of substrates constituting another batch are sometimes combined into one batch and processed in batches. In this case, there are two types of combinations of processing surfaces constituting the batches, namely, front alignment (also called face to face) and front and back alignment (also called face to back). In the posture conversion module of the previous example, since it can only rotate in one direction, it is impossible to perform posture conversion normally with the processing surface facing upward for batches with opposite processing surfaces. Summary of the invention

[0008] The present invention has been made in view of the above situation, and an object of the present invention is to provide a posture changing device capable of normally changing the posture regardless of the orientation of the processing surface of the substrate, and a substrate processing device having the same.

[0009] In order to achieve the above object, the present invention adopts the following configuration.

[0010] That is, the present invention provides a posture conversion device for converting the posture of multiple substrates, the device comprising the following elements: a reversal chuck for holding multiple substrates; an opening and closing drive mechanism for driving the reversal chuck in the radial direction of the substrate between an open position for transferring the multiple substrates with the reversal chuck and a holding position for holding the multiple substrates with the reversal chuck; a rotation drive mechanism for driving the reversal chuck around a horizontal axis in order to convert the posture of the multiple substrates from a vertical posture to a horizontal posture; and a control unit for operating the opening and closing drive mechanism to hold the multiple substrates in a vertical posture on the reversal chuck, and then, when converting the posture of the multiple substrates from a vertical posture to a horizontal posture, operating the rotation drive mechanism in such a way that the processing surface of the multiple substrates faces upward.

[0011] According to the present invention, the control unit operates the opening and closing drive mechanism to hold the plurality of substrates in a vertical posture on the inversion chuck. Thereafter, when the control unit changes the posture of the plurality of substrates from the vertical posture to the horizontal posture, the control unit operates the rotation drive mechanism so that the processing surface of the plurality of substrates faces upward. Therefore, regardless of the orientation of the processing surface of the substrate, the posture change can be normally performed so that the processing surface of the plurality of substrates faces upward.

[0012] In addition, the processing surface of the substrate of the present invention refers to the surface that is processed after the posture is converted to a horizontal posture in the posture conversion device. The processing surface is the surface that faces upward when the substrate is placed in a horizontal posture.

[0013] Furthermore, in the present invention, it is preferable that the control unit operates the rotation drive mechanism so as to rotate in one direction or another direction opposite thereto according to the orientation of the processing surface of the plurality of substrates.

[0014] The processing surfaces of the plurality of substrates in a vertical posture face one direction or the other direction. Therefore, the control unit can face the processing surfaces of the plurality of substrates upward by operating the rotation drive mechanism in a manner that the processing surfaces are rotated by a predetermined angle to the opposite side of one direction, that is, the other direction, or to the opposite side of the other direction, that is, the one direction, according to the direction of the processing surfaces.

[0015] Furthermore, in the present invention, it is preferable that the control unit operates the rotation drive mechanism so as to rotate the substrates in only one direction according to the orientation of the processing surfaces of the plurality of substrates.

[0016] The processing surfaces of the plurality of substrates in a vertical posture face one direction or the other direction. Therefore, the control unit can make the processing surfaces of the plurality of substrates face upward by operating the rotation drive mechanism so as to rotate it only in one direction or the other direction. Since it can only rotate in one direction, the rotation control of the control unit can be easily performed.

[0017] Furthermore, in the present invention, it is preferred that the inverted chuck holds only two side surfaces of the plurality of substrates in a direction perpendicular to a direction in which the plurality of substrates are transferred.

[0018] When the posture of the plurality of substrates is changed from a vertical posture to a horizontal posture, the chuck will not interfere even if it is rotated in any direction and reversed during transportation. Thus, the subsequent transfer operation can be smoothly performed.

[0019] Furthermore, in the present invention, it is preferred that the control unit operates the rotation drive mechanism based on a process recipe that specifies how to process the plurality of substrates.

[0020] Since the control unit operates the rotation drive mechanism based on the process recipe, the rotation drive mechanism can be appropriately operated for each of the plurality of substrates.

[0021] Furthermore, in the present invention, it is preferred that the control unit operates the rotation drive mechanism according to a combination of processing surfaces in which directions the processing surfaces are directed in batches formed by combining a plurality of substrates with other plurality of substrates in the process recipe.

[0022] The control unit operates the rotation drive mechanism according to the combination of the processing surfaces in the process recipe. Therefore, the control unit knows the orientation of the processing surfaces of the plurality of substrates, and can appropriately operate the rotation drive mechanism for each of the plurality of substrates.

[0023] In addition, the present invention provides a substrate processing device for processing substrates, the device comprising the following elements: a batch processing unit for uniformly processing a plurality of substrates in a vertical posture; a single-wafer processing unit for processing a single substrate in a horizontal posture; a posture conversion unit for converting the plurality of substrates processed by the batch processing unit from a vertical posture to a horizontal posture; a first conveying unit for conveying the plurality of substrates processed by the batch processing unit to the posture conversion unit; a second conveying unit for conveying the plurality of substrates set to a horizontal posture by the posture conversion unit to the single-wafer processing unit; the posture conversion unit comprising: an inverting chuck for holding the plurality of substrates; an opening and closing drive mechanism for moving between the inverting chuck and the second conveying unit; The inversion chuck is driven in the radial direction of the substrate between an open position for transferring the multiple substrates and a holding position for holding the multiple substrates by the inversion chuck; and a rotation drive mechanism drives the inversion chuck around a horizontal axis in order to change the posture of the multiple substrates from a vertical posture to a horizontal posture; and the substrate processing device includes a control unit, which operates the opening and closing drive mechanism after processing the multiple substrates in the batch processing unit and before transporting the multiple substrates to the single-wafer processing unit, so that the multiple substrates in the vertical posture are held on the inversion chuck, and then operates the rotation drive mechanism in a manner that the processing surface of the multiple substrates faces upward when the posture of the multiple substrates is changed from a vertical posture to a horizontal posture.

[0024] According to the present invention, after processing a plurality of substrates in a batch processing section and before transporting the plurality of substrates to a single-wafer processing section, the control section operates the opening and closing drive mechanism so that the plurality of substrates in a vertical posture are held on the inversion chuck. Thereafter, when the control section converts the posture of the plurality of substrates from a vertical posture to a horizontal posture, the control section operates the rotation drive mechanism so that the processing surface of the plurality of substrates faces upward. Therefore, regardless of the orientation of the processing surface of the substrate, the posture conversion can be performed normally so that the processing surface of the plurality of substrates faces upward. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] For the purpose of illustrating the invention, there are shown in the drawings several forms which are presently preferred, it being understood, however, that the invention is not limited to the precise arrangements and instrumentalities shown.

[0026] Figure 1 It is a plan view showing the overall structure of a substrate processing apparatus according to an embodiment.

[0027] Figure 2 yes Figure 1 AA arrow section view.

[0028] Figure 3A , Figure 3B It is a schematic diagram used to explain the combination of processing surfaces that constitute a batch.

[0029] Figure 4A , Figure 4B It is a schematic diagram used to explain the combination of processing surfaces that constitute a batch.

[0030] Figure 5 It is a top view showing the structure of 25 chucks and a reverse chuck.

[0031] Figure 6 This is a front view of a state where the inverted chuck is set to the open position.

[0032] Figure 7 This is a front view of a state where the inverted chuck is set in the holding position.

[0033] Figure 8 The structure of the posture conversion groove is shown, and it is a front view showing a state where the substrate is held in a vertical posture.

[0034] Fig. 9 The figure shows the structure of the posture conversion groove and is a front view showing a state where the substrate is held in a horizontal posture.

[0035] Fig.10 It is a block diagram representing a control system.

[0036] FIG. 11A to FIG. 11D This is a schematic diagram showing an example of posture conversion in batches for front alignment.

[0037] FIG. 12A to FIG. 12D 1 is a schematic diagram showing an example of posture conversion in batches for front alignment.

[0038] FIG. 13A to FIG. 13D It is a schematic diagram showing another example of posture transition.

[0039] Fig.14 It is a block diagram showing a modified example of the control system. DETAILED DESCRIPTION

[0040] Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings.

[0041] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0042] Figure 1 It is a plan view showing the overall structure of a substrate processing apparatus according to an embodiment. Figure 2 yes Figure 1 AA arrow section view.

[0043] <1. Overall composition>

[0044] The substrate processing device 1 processes a substrate W. The substrate processing device 1 performs, for example, a chemical solution process, a cleaning process, a drying process, etc. on the substrate W. The substrate processing device 1 adopts a processing method that combines a batch method and a single-wafer method (a so-called hybrid method). The batch method processes a plurality of substrates W in a vertical posture. The single-wafer method processes a single substrate W in a horizontal posture.

[0045] The substrate processing apparatus 1 includes a batch processing apparatus 3 and a single wafer processing apparatus 5. In this embodiment, the single wafer processing apparatus 5 is disposed adjacent to the batch processing apparatus 3. The batch processing apparatus 3 and the single wafer processing apparatus 5 are disposed apart from each other. The batch processing apparatus 3 and the single wafer processing apparatus 5 are connected by a bridge 7.

[0046] <2. Batch Processing Device>

[0047] The batch processing apparatus 3 simultaneously processes a plurality of substrates W. The batch processing apparatus 3 includes a loading block 9 , a stocker block 11 , a transfer block 13 , a posture conversion block 15 , and a processing block 17 .

[0048] In this specification, for convenience, the direction in which the loading block 9, the stacker block 11, the transfer block 13 and the processing block 17 are arranged is referred to as the "front-to-back direction X". The front-to-back direction X is horizontal. The direction from the stacker block 11 toward the loading block 9 in the front-to-back direction X is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction orthogonal to the front-to-back direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, back, right, left, top and bottom are appropriately indicated.

[0049] <3.Move in block>

[0050] The loading block 9 includes an input section 19. The input section 19 is arranged at the front X of the batch processing device 3. The carrier C stores multiple (for example, 25) substrates W in a horizontal posture at fixed intervals in the vertical direction Z. The carrier C separates the surfaces of the substrates W from each other to form a plurality of grooves (not shown) for accommodating the substrates W one by one. As the carrier C, there is, for example, FOPU (Front Opening Unified Pod). FOPU is a closed container. The carrier C may also be an open container of any type. The input section 19 includes, for example, two mounting tables 21 for mounting the carriers C. The two mounting tables 21 are, for example, arranged along the width direction Y. The input section 19 is also called a loading port.

[0051] <4. Stacker block>

[0052] The stocker block 11 is disposed adjacent to the rear X of the loading block 9 . The stocker block 11 includes a conveyance storage section ACB. The conveyance storage section ACB includes a conveyance mechanism 23 and a bracket 25 .

[0053] The transport mechanism 23 transports the carrier C. The transport and storage section ACB includes a plurality of trays 25. The trays 25 include a tray that only temporarily mounts the carrier C and a tray that mounts the carrier C for transfer with the first transport mechanism HTR. The transport and storage section ACB takes in the carrier C that stores the unprocessed substrate W from the input section 19 and places it on the tray 25. The transport and storage section ACB transports and places the carrier C on the transfer tray 25 according to a schedule that specifies the processing sequence. The transport and storage section ACB transports and places the empty carrier C placed on the transfer tray 25 on the stage 21. The transport and storage section ACB moves the empty carrier C placed on the tray 25 to the stage 21 according to the vacancy status of the stage 21. The empty carrier C is transported to the single-wafer processing section 5. The substrates W are transported to an empty carrier C of the single-wafer processing section 5 , and are stored in the carrier C before being processed, for example. Then, the processed substrates W are stored in the single-wafer processing section 5 .

[0054] <5. Transfer block>

[0055] The transfer block 13 is disposed adjacent to the rear X of the stocker block 11. The transfer block 13 includes a transfer mechanism CTC. The transfer mechanism CTC includes a first transport mechanism HTR, a conversion mechanism HVC, a push rod PH, and a second transport mechanism WTR.

[0056] The first transport mechanism HTR is arranged at the right side Y in the rear X of the transport storage section ACB. The first transport mechanism HTR transports a plurality of substrates W at once. In other words, the first transport mechanism HTR has a plurality of hands (not shown). One hand supports one substrate W. The first transport mechanism HTR may also transport only one substrate W. The first transport mechanism HTR collectively takes out a plurality of substrates W (for example, 25 substrates) from the carrier C of the transfer tray 25 placed in the transport storage section ACB, and directly transports them to the conversion mechanism HVC in a horizontal posture. At this time, the conversion mechanism HVC converts the posture of the substrate W from a horizontal posture to a vertical posture.

[0057] On the left side Y of the first transport mechanism HTR, a conversion mechanism HVC and a push rod PH are arranged in sequence. The conversion mechanism HVC delivers a plurality of substrates W to the push rod PH. After receiving a plurality of substrates W from the conversion mechanism HVC, the push rod PH moves to the second transport mechanism WTR in the width direction Y. At this time, the conversion mechanism HVC and the push rod PH assemble or release batches. The push rod PH delivers a plurality of substrates W to the second transport mechanism WTR.

[0058] The transfer mechanism CTC, for example, combines a plurality of substrates W constituting a batch taken out from a certain carrier C with a plurality of substrates W constituting another batch taken out from another carrier C as a batch. This is the assembly of batches. The batch is composed of twice the number of substrates W of one batch. The batch is arranged so that each substrate W of another batch is adjacent to each substrate W of one batch. That is, each substrate W of one batch is arranged as an odd number, and each substrate W of another batch is arranged as an even number. Usually, the interval between the plurality of substrates W taken out from the carrier C is the same as that of the carrier C. It is called the full pitch. In a batch, for example, the interval between the plurality of substrates W becomes half of the full pitch. It is called the half pitch. The batch is combined with one batch as described above, and there are two types of front alignment (also called face-to-face) and front-back alignment (also called face-to-back) according to the combination method. The combination method of the batch is determined by the action of the push rod PH. In the following description, a plurality of substrates W are referred to as a batch. However, when a description specific to a batch is required, the plurality of substrates W are referred to as a batch lot.

[0059] Here, reference Figure 3A , Figure 3B and Figure 4A , Figure 4B . Figure 3A , Figure 3B and Figure 4A , Figure 4B This is a schematic diagram used to illustrate the combination of processing surfaces that make up a batch. Figure 3A , Figure 3B and Figure 4A middle, Figure 4B In order to facilitate understanding of the present invention, each batch is composed of three substrates W.

[0060] The transfer mechanism CTC is as follows Figure 3A , Figure 3B and Figure 4A , Figure 4B As shown, the assembly is done in batches.

[0061] (1) Front alignment (face to face)

[0062] like Figure 3A As shown, by combining a batch of LT1 with another batch of LT2, Figure 3BThe front-side alignment FTF shown is a batch BL1. In detail, after each substrate W of batch LT1 is converted into a vertical posture by the conversion mechanism HVC, for example, the processing surface is immediately directed to the left Y. For example, batch LT1 is rotated 180 degrees around the vertical axis by the push rod PH. As a result, the processing surface of batch LT1 faces the right Y. The processing surface of each substrate W of batch LT2 faces the opposite side of the processing surface of batch LT1, that is, the left Y. White triangles are marked on the processing surface of each substrate W of batch LT1. Black triangles are marked on the processing surface of each substrate W of batch LT2. The so-called processing surface here refers to the surface that is processed after the posture is converted into a horizontal posture in the posture conversion block 15. The processing surface is the surface facing upward when the substrate W is placed. The processing surface is sometimes referred to as the main surface, the front surface, and the back surface.

[0063] In addition, the order in which the batch LT1 and the batch LT2 are carried into the transfer mechanism CTC may be replaced. Figure 3B In the process, the odd-numbered ones arranged in the batch BL1 can be set as the batch LT1.

[0064] (2) Front and back alignment (face to back)

[0065] like Figure 4A As shown, by combining a batch of LT1 with another batch of LT2, Figure 4B The batch BL2 of the front-to-back FTB is shown. Specifically, each substrate W of the batch LT1 and the batch LT2, for example, has a processing surface facing the left Y. When the batches are assembled by the front-to-back FTB, only a linear movement of half the pitch in the width direction Y is performed, and the push rod PH is not rotated.

[0066] The second transport mechanism WTR is arranged on the left side Y of the transfer mechanism CTC. The second transport mechanism WTR is configured to be movable throughout the transfer block 13 and the processing block 17. The second transport mechanism WTR is configured to be movable in the front-rear direction X. The second transport mechanism WTR includes a pair of hands 27 for transporting the batch. The pair of hands 27 includes, for example, a rotation axis facing the width direction Y. The pair of hands 27 swings around the rotation axis. The pair of hands 27 clamps the side end surfaces of the plurality of substrates W constituting the batch in the front-rear direction X. The plurality of substrates W constituting the batch are transferred between the second transport mechanism WTR and the transfer mechanism CTC. The second transport mechanism WTR transfers the plurality of unprocessed substrates W constituting the batch to the processing block 17. The plurality of substrates W processed by the processing block 17 are transferred between the second transport mechanism WTR and the posture conversion block 15.

[0067] Here, the processing block 17 will be described before the posture conversion block 15 .

[0068] <6. Processing Block>

[0069] refer to Figure 1 and Figure 2 . The processing block 17, for example, includes a batch processing unit BPU. For example, the batch processing unit BPU includes 6 processing units. Specifically, the batch processing unit BPU includes a 1st batch processing unit BPU1, a 2nd batch processing unit BPU2, a 3rd batch processing unit BPU3, a 4th batch processing unit BPU4, a 5th batch processing unit BPU5, and a 6th batch processing unit BPU6. In addition, the number of the batch processing units BPU is not limited to 6. In other words, the batch processing units BPU may be less than 6, or may be 7 or more.

[0070] The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are arranged in a row in the front-to-back direction X. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 each have a processing tank BB and a lift LF. The processing tank BB stores a processing liquid. The processing liquid is pure water or a chemical liquid. The chemical liquid is, for example, an organic solvent or an etching liquid. An example of an organic solvent is IPA (isopropyl alcohol). An example of an etching liquid is a phosphoric acid solution.

[0071] The lift LF moves up and down between the processing position inside the processing tank BB, that is, the processing position, and the delivery position above the liquid surface of the processing tank BB. At the delivery position, the lift LF delivers a plurality of substrates W to the second transport mechanism WTR. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are established in correspondence, for example, in pairs. Specifically, the first batch processing unit BPU1 and the second batch processing unit BPU2 form a pair, the third batch processing unit BPU3 and the fourth batch processing unit BPU4 form a pair, and the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6 form a pair. A pair, for example, shares the tasks of liquid treatment and cleaning treatment. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 can, for example, collectively process a maximum of 50 substrates W. In other words, the first batch processing unit BPU1 to the sixth batch processing unit BPU6 can, for example, collectively process a maximum of one batch.

[0072] Each processing tank BB is supplied with a processing liquid from below. In each processing tank BB, the processing liquid is discharged beyond the upper edge. Each processing tank BB immerses a plurality of substrates W placed on the lifter LF in the processing liquid. Each lifter LF abuts against the lower edge of the substrate W and holds it. Each lifter LF delivers a plurality of substrates W to the second transport mechanism WTR.

[0073] <7. Posture Transition Block>

[0074] like Figure 2 As shown, the posture conversion block 15 includes 25 chucks TFC, a standby tank 31, and a posture conversion tank 33. In the standby tank 31 and the posture conversion tank 33, the liquid surface is not shown in the drawings to facilitate the viewing of each structure.

[0075] The standby tank 31 includes a processing tank BB0 and an elevator LF0. The processing tank BB0 has the same structure as the processing tank BB included in the first batch processing unit BPU1 to the sixth batch processing unit BPU6. The elevator LF0 moves up and down between the interior of the processing tank BB0, that is, the standby position, and a junction position above the liquid level of the processing tank BB0. The standby tank BB0 stores a processing liquid. The processing liquid is, for example, pure water. At the standby position, the substrate W placed on the elevator LF0 is completely immersed in the processing liquid.

[0076] Here, reference Figure 5 . Figure 5 It is a top view showing the structure of 25 chucks and a reverse chuck.

[0077] The 25-piece chuck TFC as a whole moves horizontally only in the width direction Y. The 25-piece chuck TFC does not move up and down in the vertical direction Z. The 25-piece chuck TFC does not move horizontally in the front-back direction X. However, the 25-piece substrate TFC opens and closes the hand 35 throughout the holding position PC and the passing position PT. In the holding position PC, the 25-piece chuck TFC holds a plurality of substrates W. In the passing position PT, the 25-piece chuck TFC does not hold a plurality of substrates W. In other words, the passing position PT allows the lifter LF0 holding a plurality of substrates W to move between the handover position and the standby position. For example, the 25-piece chuck TFC moves in the width direction Y throughout three positions, namely, the first handover position P1, the second handover position P2, and the third handover position P3.

[0078] The 25-piece chuck TFC has a stopper 37. The stopper 37 is provided on the inner side of the hand 35. The stopper 37 is formed in the width direction Y at intervals of the full pitch. The positions of the first delivery position P1 and the second delivery position P2 in the width direction Y differ by a distance equivalent to half the pitch. The third delivery position P3 is a position for delivering the plurality of substrates W to the posture conversion groove 33. The 25-piece chuck TFC receives only one batch from the elevator LF0 at the first delivery position P1. Specifically, only the odd-numbered plurality of substrates W constituting the other batch of the two batches constituting the batch batch are received. The 25-piece chuck TFC receives only one batch from the elevator LF0 at the second delivery position P2. Specifically, only the even-numbered plurality of substrates W constituting the other batch of the two batches constituting the batch batch are received.

[0079] For example, odd-numbered substrates W correspond to lot LT2 in the example of Fig. 3. Even-numbered substrates W correspond to lot LT1 in the example of Fig. 3. For example, odd-numbered substrates W correspond to lot LT1 in the example of Fig. 4. Even-numbered substrates W correspond to lot LT2 in the example of Fig. 4.

[0080] Here, further reference Figure 6 to Figure 9 . Figure 6 This is a front view of a state where the inverted chuck is set to the open position. Figure 7 This is a front view of a state where the inverted chuck is set in the holding position. Figure 8 The structure of the posture conversion groove is shown, and it is a front view showing a state where the substrate is held in a vertical posture. Fig. 9 The figure shows the structure of the posture conversion groove and is a front view showing a state where the substrate is held in a horizontal posture.

[0081] like Figure 8 and Fig. 9 As shown, the posture conversion tank 33 includes a dipping tank DB and a posture conversion portion 41 .

[0082] First, the main part is described. The posture conversion tank 33 is in the immersion tank DB, and the postures of multiple substrates W are uniformly converted by the inverting chuck 43. Specifically, the inverting chuck 43 converts the multiple substrates W from a vertical posture to a horizontal posture. The inverting chuck 43, for example, converts the postures of half of the substrates W constituting a batch. The inverting chuck 43, for example, converts the postures of 25 substrates W. The inverting chuck 43 is arranged opposite to each other in the radial direction of the substrate W, and clamps the peripheral portion of the substrate W. The immersion tank DB stores the processing liquid. The processing liquid is, for example, pure water.

[0083] like Figure 6 and Figure 7 As shown in FIG. 1 , the inverting chuck 43 includes a pair of chuck members 45. When the chuck members 45 receive or hold the substrate W in a vertical posture, the length in the vertical direction Z is shorter than the radius of the substrate W. Figure 5 As shown, the length in the width direction Y of the chuck member 45 when receiving or holding the substrate W in the vertical posture is slightly longer than the length in the arrangement direction of the plurality of substrates W in the batch.

[0084] like Figure 6 and Figure 7 As shown, each chuck member 45 has a groove portion 47 on the facing surface. The groove portion 47 has an arc shape when viewed from the width direction Y in the vertical posture of receiving or holding the substrate W in the vertical posture. The arc shape of the groove portion 47 is a shape along the outer edge of the substrate W.

[0085] The pair of chuck members 45 extends over the first interval WD1 and the second interval WD2, and moves in the front-to-back direction X. The pair of chuck members 45 can change the distance between the opposing groove portions 47. The first interval WD1 is an interval for transferring substrates between the 25-piece chuck TFC and the bridge portion 7. The second interval WD2 is an interval narrower than the first interval WD1 in the front-to-back direction X, and is used to clamp a plurality of substrates W.

[0086] The inverting chuck 43 holds only the two side surfaces of the substrate W in the direction perpendicular to the direction of transferring the substrate W. Therefore, when the posture of the plurality of substrates W is changed from the vertical posture to the horizontal posture, the inverting chuck 43 will not interfere with the transfer in any direction. Therefore, the subsequent transfer operation can be smoothly performed.

[0087] The posture conversion tank 33 includes a lifting mechanism 61 , a driving mechanism 63 , and a rotating mechanism 65 .

[0088] The lifting mechanism 61 lifts and lowers the inversion chuck 43. The driving mechanism 63 opens and closes the inversion chuck 43. The rotating mechanism 65 rotates the inversion chuck 43.

[0089] The lifting mechanism 61 is arranged outside the dipping tank DB. When viewed from above, the lifting mechanism 61 is arranged along the outer side surfaces of the four sides of the dipping tank DB, that is, the two sides of the side walls arranged in the front-rear direction X. Figure 8 As shown, the lifting mechanism 61 raises and lowers the inverted chuck 43 to the receiving height HP1, the clamping height HP2, the locking height HP3, and the immersion height HP4. The receiving height HP1 is a height for the inverted chuck 43 to receive the substrate W in a vertical posture. The clamping height HP2 is a height for the inverted chuck 43 to clamp the substrate W in a vertical posture. The locking height HP3 is a height for locking the substrate W in a vertical posture clamped by the inverted chuck 43. The immersion height HP4 is a height for immersing the substrate W in a vertical posture locked by the inverted chuck 43 in the processing liquid in the immersion tank DB.

[0090] The lifting mechanism 61 includes a base member 61a and a lifting motor 61b. The base member 61a is fixed to the bottom of the posture conversion groove 33. The lifting motor 61b lifts the upper part of the base member 61a in the vertical direction Z. The lifting motor 61b may be constituted by an actuator such as a multi-stage cylinder.

[0091] The driving mechanism 63 is mounted on the upper part of the lifting mechanism 61. The driving mechanism 63 includes a cylinder 63a, a movable piece 63b and a cantilever arm 63c. The actuating axis of the cylinder 63a is oriented in the front-rear direction X. The cantilever arm 63c is in an inverted L shape. The horizontal portion of the cantilever arm 63c is mounted on the upper part of the base member 61a. The cantilever arm 63c is mounted so as to be horizontally movable in the front-rear direction X. The driving mechanism 63 moves the cantilever arm 63c in the front-rear direction X by actuating the cylinder 63a. The driving mechanism 63 drives the reversing chuck 43 by actuating the cylinder 63a. In detail, the driving mechanism 63 moves the chuck member 45 over the first interval WD1 and the second interval WD2.

[0092] When the air cylinder 63a is not in operation, the operating shaft contracts. When the air cylinder 63a is in operation, the operating shaft extends. That is, when the air cylinder 63a is not in operation, the reverse chuck 43 is set to the first distance WD1. When the air cylinder 63a is in operation, the reverse chuck 43 is set to the second distance WD2.

[0093] The rotating mechanism 65 includes a rotating shaft 65a and a motor 65b.

[0094] One end of the rotating shaft 65a is connected to the outer side surface of the chuck member 45. The motor 65b is built into the lower part of the cantilever arm 63c. The motor 65b is arranged in the front-to-back direction X. The rotating shaft 65a is installed on the cantilever arm 63c via a sealing member not shown. Therefore, the pure water stored in the immersion tank DB does not invade the cantilever arm 63c. The motor 65b rotates the rotating shaft 65a around the axis AX1. When the motor 65b is driven, the reversal chuck 43 is driven to rotate around the axis AX1. When the reversal chuck 43 is rotated by the motor 65b, it can rotate clockwise and counterclockwise around the axis AX1 when viewed from the front X. The details of the rotation control of the reversal chuck 43 by the motor 65b are described below.

[0095] The posture conversion unit 41 constructed as described above can change the posture of the substrate W in the same manner as the transfer mechanism CTC. However, the posture conversion unit 41 rotates the surface of the substrate W around the axis AX1 in the horizontal direction. The transfer mechanism CTC changes the posture by combining the conversion mechanism HVC and the push rod PH. Therefore, the posture conversion unit 41 can be miniaturized compared to the transfer mechanism CTC.

[0096] Here, back to Figure 1 and Figure 2 .

[0097] <8. Bridge Construction Department>

[0098] The bridge portion 7 connects the batch processing apparatus 3 and the single-wafer processing apparatus 5. The bridge portion 7 is connected only to the batch processing apparatus 3 and the single-wafer processing apparatus 5. The bridge portion 7 includes a bridge robot BR. The bridge robot BR is configured to be movable only in the width direction Y. The bridge robot BR does not rise or fall in the vertical direction Z. The bridge robot BR includes a hand 71. The hand 71 is configured to be rotatable in a horizontal plane including the front-rear direction X and the width direction Y. The hand 71 is configured to be retractable in the horizontal direction. The bridge robot BR moves the hand 71 forward and backward to receive a substrate set in a horizontal posture from the posture conversion block 15. The bridge robot BR delivers the substrate set in a horizontal posture to the single-wafer processing apparatus 5.

[0099] <9. Single-chip processing device>

[0100] The single-wafer processing device 5 includes a carrying block 81 , a transfer block 83 , and a processing block 85 .

[0101] <10.Moving out the block>

[0102] The unloading block 81 includes an unloading portion 87. The unloading portion 87 is disposed in front of the single-wafer processing device 5 X. The carrier C is placed on the unloading portion 87. The unloading block 81 includes, for example, four unloading portions 87. The four unloading portions 87 are disposed along the width direction Y. The unloading portion 87 is also called a load port.

[0103] <11.Transfer Block>

[0104] The carrier block 83 is provided with a carrier robot IR. The carrier robot IR is provided with, for example, a multi-joint arm 89 and a hand 91. The carrier robot IR does not move in the width direction Y and the front-rear direction X. The carrier robot IR bends the multi-joint arm 89 to move the hand 91. The carrier robot IR raises and lowers the hand 91 in the vertical direction Z. The carrier robot IR can receive each cassette C placed on the four carry-out sections 87. The carrier robot IR carries a substrate W with its hand 91. The carrier robot IR carries a substrate W from the processing block 85 to the carry-out section 87.

[0105] <12. Processing Block>

[0106] The processing block 85 includes four towers TW1 to TW4 and a central robot CR.

[0107] The tower TW1 is arranged at the rear X of the carrier block 83. The tower TW1 is arranged adjacent to the carrier block 83. The processing chambers MPC are stacked in the vertical direction Z in the tower TW1. The tower TW1 includes, for example, three processing chambers MPC. The processing chambers MPC process substrates W one by one. The processing chambers MPC dry the substrates W, for example.

[0108] The tower TW2 is arranged at the rear X of the tower TW1. The tower TW2 is arranged adjacent to the tower TW1. The tower TW2 has the same structure as the tower TW1. That is, three processing chambers MPC are stacked in the vertical direction Z and are provided in the tower TW2.

[0109] The tower TW3 is arranged on the left side Y of the tower TW2. The tower TW3 is arranged on the left side Y of the tower TW2 via the central robot CR. The tower TW3 is also configured similarly to the towers TW1 and TW2. That is, three processing chambers MPC are stacked in the vertical direction Z in the tower TW3.

[0110] The tower TW4 is partially different from the towers TW1 to TW3. That is, the tower TW4 has processing chambers MPC at the bottom and the top in the vertical direction Z. The tower TW4 has a delivery portion 93 at the center in the vertical direction Z. The delivery portion 93 is provided with a substrate W. The delivery portion 93 has lifting pins 93a. The lifting pins 93a are raised and lowered when receiving the substrate W from the bridge robot BR. The delivery portion 93 carries a substrate W from the bridge robot BR. The delivery portion 93 receives a substrate W carried by the center robot CR.

[0111] The central robot CR is configured to be movable in the front-rear direction X. The central robot CR has a hand 95. The hand 95 is raised and lowered in the vertical direction Z. The hand 95 is configured to be able to rotate in a plane including the front-rear direction X and the width direction Y. The hand 95 moves in a manner that allows it to receive the processing chambers MPC and the delivery portion 93 of the towers TW1 to TW4. In other words, the central robot CR can freely move the hand 95 in the vertical direction Z, the front-rear direction X, and the width direction Y. The central robot CR delivers the processed substrate W to the carrier robot 83.

[0112] <13.Control system>

[0113] Here, reference Fig.10 . Fig.10 It is a block diagram representing a control system.

[0114] The substrate processing apparatus 1 includes a control unit 101. The control unit 101 includes a CPU (Central Processing Unit) or a memory. The control unit 101 is composed of an electronic circuit. The control unit 101 operates the above-mentioned components according to a pre-stored program. The control unit 101 is connected to an operation unit 103. The operation unit 103 is, for example, Figure 1 As shown, it is installed in front X of the batch processing device 3. The operating unit 103 is composed of, for example, a keyboard or an indicating device and a display unit, or a touch display panel. The operating unit 103 is operated by an operator of the substrate processing device 1. The operator operates the operating unit 103, for example, to specify a desired process recipe for each batch. The operator operates the operating unit 103, for example, to specify a desired combination of processing surfaces for the batches. As described above, the combination of processing surfaces includes front alignment (also called face-to-face) and front and back alignment (also called face-to-back).

[0115] The control unit 101 is connected to a process recipe storage unit 105. The process recipe storage unit 105 is composed of a memory. The process recipe storage unit 105 stores a process recipe that specifies how to process each batch. The process recipe can also be edited by an operator via the operation unit 103. The combination of the processing surfaces related to the batches is established in correspondence with the process recipe, for example. That is, if the process recipe is specified for each batch by the operation unit 103, then for the batches in which the batches are combined, the front alignment and the front and back alignment are specified.

[0116] In addition, in the configuration where the substrate processing apparatus 1 is connected to a network in a factory, there is a case where the combination of processing surfaces related to each batch is pre-specified by a host computer not shown. The host computer not shown can manage not only the substrate processing apparatus 1 but also all the apparatuses in the factory or the clean room. In addition, there is a case where the process recipe is pre-specified for each batch by the host computer.

[0117] The control unit 101 operates the rotation mechanism 65 of the posture conversion block 15 according to the process recipe constituting the batch, that is, the combination of the processing surfaces related to the batch. The details will be described later.

[0118] <14.Action Description>

[0119] refer to Figure 1 and Figure 2 , an example of processing by the substrate processing apparatus 1 is described.

[0120] First, the overall processing flow will be described.

[0121] <15. Batch processing>

[0122] A carrier C containing a plurality of unprocessed substrates W is placed on the input section 19. At this time, for example, the operator can operate the operation section 103 as needed to specify a process recipe for a batch of carriers C. Here, the process recipe has been specified for the carriers C, and the combination of processing surfaces related to the batches is further specified. That is, the process recipe is associated with the carriers C constituting the batch, and the combination of processing surfaces related to the batches is associated with the process recipe. In other words, the combination of the batches is associated with the process recipe. The process recipe or the combination of processing surfaces related to the batches is referenced by the control section 101. The control section 101 refers to the process recipe storage section 105 and operates each section based on the corresponding process recipe. In particular, the control section 101 operates the posture conversion section 41 of the posture conversion block 15 based on the combination of batches corresponding to the process recipe. The details are described below. The rotation mechanism 65 of the posture conversion block 15 is operated according to the orientation of the processing surface of the substrates W constituting the batch.

[0123] The carrier C is transported to the stocker block 11 by the transport mechanism 23. Two groups of multiple substrates W are assembled as batches by the first transport mechanism HTR and the transfer mechanism CTC. The multiple substrates W constituting the batch are transported to the processing block 17 by the second transport mechanism WTR. In the processing block 17, for example, a phosphoric acid etching process is performed by the second batch processing unit BPU2. Thereafter, the multiple substrates W constituting the batch are subjected to a pure water cleaning process by the first batch processing unit BPU1. Next, the multiple substrates W constituting the batch are transported to the posture conversion block 15 by the second transport mechanism WTR. In the posture conversion block 15, only one batch of the batch is transported to the posture conversion tank 33. In the posture conversion tank 33, only one batch of the batch converts the multiple substrates W in a vertical posture into a horizontal posture in the liquid. Thereafter, the multiple substrates W constituting one batch of the batch are sequentially transported one by one to the single-wafer processing device 5. Thereafter, another batch in the batch lot is similarly subjected to posture conversion and then conveyed to the single-wafer processing device 5 .

[0124] <16. Single chip processing>

[0125] After being converted into a horizontal posture, a substrate W is transported to the single-wafer processing device 5 by the bridge robot BR. Specifically, a substrate W is placed on the delivery portion 93. The substrate W placed on the delivery portion 93 is received by the central robot CR. The central robot CR carries a substrate W, for example, into the processing chamber MPC of the tower TW1. In the processing chamber MPC, for example, the substrate W is subjected to a drying process. Specifically, for example, the substrate W is rotated and pure water is supplied. Thereafter, IPA is supplied to the substrate W to replace the pure water of the substrate W with IPA. Thereafter, the substrate W is rotated at a high speed and dried. In addition, it is preferred that a drying process is performed in other processing chambers MPC by supercritical fluid carbon dioxide as needed. The substrate W is subjected to a finishing drying process by the supercritical fluid drying process. Thus, although the substrate W is completely dried, the collapse of the pattern formed on the substrate W is suppressed.

[0126] The dried substrate W is carried out to the carrying-out section 87 via the center robot CR and the carrier robot IR. The carrier robot IR stores the substrate W in the carrier C placed in the carrying-out section 87. Next, the substrates W constituting the same batch to be processed are stored in the same carrier C.

[0127] <17. Posture Transition Processing>

[0128] The above is a rough processing flow of the substrate processing apparatus 1. Next, posture transition will be described.

[0129] The plurality of substrates W constituting the batch batch that has finished the batch processing are delivered to the lifter LF0 of the standby tank 31 by the second transport mechanism WTR. The lifter LF0 moves the plurality of substrates W constituting the batch batch to the inside of the standby tank 31, that is, to the standby position. In this state, since the plurality of substrates W constituting the batch batch are on standby, drying can be prevented. In other words, the pattern etc. formed on the substrate W after the batch processing can be prevented from collapsing.

[0130] The 25-piece chuck TFC is located at the second delivery position P2, for example. The 25-piece chuck TFC opens the hand 35. That is, the 25-piece chuck TFC sets the hand 35 to the passing position PT (reference Figure 5 ). The lifter LF0 is raised to a handover position above the liquid level of the standby tank BB0. At this time, since the 25-piece chuck TFC sets the hand 35 to the passing position PT, multiple substrates W can pass between the 25-piece substrate TFC and rise. At the same time, the posture conversion unit 41 of the posture conversion tank 33 causes the reverse chuck 43 to rise to the receiving height HP1 (reference Figure 8 ).

[0131] The 25-piece chuck TFC stops the hand 35. That is, the 25-piece chuck TFC sets the hand 35 to the holding position PC (reference Figure 5 ). In the above state, the lift LF0 is lowered to the standby position. Thus, among the multiple substrates W of the batches placed on the lift LF0, only the multiple substrates W of even numbers constituting one batch are placed on the 25-piece chuck TFC. Among the multiple substrates W of the batches placed on the lift LF0, the multiple substrates W of odd numbers constituting another batch are lowered together with the lift LF0 into the standby tank BB0. Thus, the hand 35 of the 25-piece chuck TFC is set to the first handover position PT1, and can standby in a state of preventing drying until the odd-numbered substrates W are moved to the posture conversion tank 33. Therefore, pattern collapse caused by drying of the multiple substrates W constituting another batch can also be prevented.

[0132] like Figure 5 As shown, the 25-piece chuck TFC allows the hand 35 to move in and out in the right direction Y until the third handover position P3. Figure 8 As shown, since the inverted chuck 43 is located at the receiving height HP1, no interference with the substrate W occurs.

[0133] The reverse chuck 43 is set to the first interval WD1 (reference Figure 6 ). In the above state, the reverse chuck 43 is lowered toward the multiple substrates W placed on the 25-piece chuck TFC. Specifically, Figure 8 As shown in FIG. 1 , the inversion chuck 43 is lowered to the chuck height HP2 .

[0134] The reverse chuck 43 is set to the second width WD2 (reference Figure 7 ). Thus, the substrate W accommodated in the inverted chuck 43 is clamped. Figure 8 As shown in FIG. 1 , the reverse chuck 43 is raised to the locking height HP3. As a result, the lower edge of the side lower portion of the end surface of the substrate W clamped by the reverse chuck 43 abuts and locks. In addition, while the reverse chuck 43 is temporarily raised to the receiving height HP1, the 25-piece chuck TFC is moved to the second delivery position P2. As a result, the 25-piece chuck TFC is ready to receive the plurality of substrates W constituting another batch placed on the lifter LF0.

[0135] like Figure 8 As shown in FIG. 1 , the inverted chuck 43 is lowered to the immersion height HP4. Thus, the plurality of substrates W held by the inverted chuck 43 are immersed in the processing liquid in the immersion tank DB. The plurality of substrates W are all immersed in the processing liquid in the immersion tank DB. In the posture conversion block 15, the plurality of substrates W constituting one batch are exposed from the liquid only in a short period of time from when they are raised from the standby tank BB0 to when they are immersed in the immersion tank DB.

[0136] For example, the inverted chuck 43 is rotated 90°. More specifically, in the example described above, it is rotated 90° counterclockwise. The direction of rotation can be determined based on the direction in which the processing surface (front surface) of the substrate W is located. In other words, the direction of rotation can be determined so that the processing surface of the substrate W faces upward. In this way, the plurality of substrates W are converted to a horizontal posture.

[0137] The inversion chuck 43 is raised. Specifically, the inversion chuck 43 is raised in such a manner that only the substrate W clamped by the groove portion 47 of the uppermost section of the inversion chuck 43 is exposed from the liquid in the immersion tank DB. The height of the inversion chuck 43 is such that the hand 71 of the bridge robot BR enters as far as possible to a position slightly away from the lower surface of the substrate W exposed from the liquid.

[0138] The hand 71 of the bridge robot BR is caused to enter the posture conversion unit 41. The hand 71 enters a position slightly away from the lower surface of the substrate W downward.

[0139] The inversion chuck 43 is moved downward. The substrate W is transferred to the hand 71 by the movement of the inversion chuck 43 .

[0140] The bridge robot BR moves the hand 71 to the right direction Y to extract the uppermost substrate W from the inversion chuck 43 .

[0141] The bridge robot BR rotates the hand 71 to position the substrate W in the right direction Y. Specifically, the hand 71 is rotated to move the substrate W to the delivery portion 93 side. Then, one substrate W is delivered to the delivery portion 93 .

[0142] By the operation of the posture conversion block 15 , one substrate W is transported from the batch processing apparatus 3 to the single-wafer processing apparatus 5 in a horizontal posture.

[0143] <18. Detailed operations of posture transition processing>

[0144] Here, the detailed operation of the posture conversion process is described. FIG. 11A to FIG. 11D and FIG. 12A to FIG. 12D . FIG. 11A to FIG. 11D and FIG. 12A to FIG. 12D 3. Here, the batch BL1 described with reference to FIG3 is used as an example for explanation. The batch BL1 combines the batch LT1 and the batch LT2 in the front-to-face alignment FTF.

[0145] like Fig.11A , Fig. 11B As shown, the 25-piece chuck TFC receives a plurality of substrates W constituting a batch LT1 from the batch BL1 held by the lift LF0. The processing surface of each substrate W constituting the batch LT1 faces the right direction Y, for example. Fig. 11C As shown, the counter chuck 43 receives the respective substrates W constituting the lot LT1 from the 25-piece chuck TFC.

[0146] Next, the control unit 101 operates the rotating mechanism 65 based on the combination of the batches associated with the process recipe at this time. In this case, since the batch BL1 is the front-aligned FTF, the control unit 101 can know the orientation of the processing surface of each substrate W constituting the batch LT1 held on the inversion chuck 43. The control unit 101 operates the rotating mechanism 65 so that the processing surface faces upward.

[0147] Specifically, if Fig.11D As shown, the control unit 101 rotates the rotating mechanism 65 counterclockwise by a predetermined angle when viewed from the rear X. The predetermined angle is, for example, 90 degrees. That is, the control unit 101 rotates the rotating mechanism 65 by only 90 degrees in one direction.

[0148] The control unit 101 performs posture conversion on the remaining batch LT2 of the batch BL1. Fig. 12A , Fig. 12B As shown, the 25-piece chuck TFC receives a plurality of substrates W constituting the batch LT2 held by the lift LF0. Fig. 12C As shown, the reverse chuck 43 receives the substrates W constituting the lot LT2 from the 25-piece chuck TFC. The lot LT2 is in a state where the processing surface faces the left direction Y.

[0149] Next, the control unit 101 operates the rotating mechanism 65 so that the processing surface of the batch LT2 faces upward. Fig.12D As shown, the control unit 101 rotates the rotating mechanism 65 clockwise by a predetermined angle when viewed from the rear X. The predetermined angle is, for example, 90 degrees. That is, the control unit 101 rotates the rotating mechanism 65 by 90 degrees in another direction opposite to the one direction.

[0150] In addition, the correspondence relationship between the present invention and each configuration of the above-described embodiment is as follows.

[0151] The batch processing device 3 is equivalent to the "batch processing unit" of the present invention. The single-wafer processing device 5 is equivalent to the "single-wafer processing unit" of the present invention. The posture conversion groove 33 is equivalent to the "posture conversion unit" of the present invention. The 25-piece chuck TFC is equivalent to the "first conveying unit" of the present invention. The bridge robot BR is equivalent to the "second conveying unit" of the present invention. The driving mechanism 63 is equivalent to the "opening and closing driving mechanism" of the present invention. The rotating mechanism 65 is equivalent to the "rotation driving mechanism" of the present invention. The first interval WD1 is equivalent to the "open position" of the present invention. The second interval WD2 is equivalent to the "holding position" of the present invention.

[0152] According to the present embodiment, the control section 101 operates the driving mechanism 63 to hold the plurality of substrates W in a vertical posture on the inversion chuck 43. Thereafter, when the control section 101 changes the posture of the plurality of substrates W from the vertical posture to the horizontal posture, the control section 101 operates the rotating mechanism 65 so that the processing surfaces of the plurality of substrates W face upward. Therefore, regardless of the orientation of the processing surfaces of the substrates W, the posture change can be normally performed so that the processing surfaces of the plurality of substrates W face upward.

[0153] The processing surfaces of the plurality of substrates W in the vertical posture face one direction or the other direction. Therefore, the control unit 101 can face the processing surfaces of the plurality of substrates W upward by operating the rotation mechanism 65 to rotate 90 degrees in the other direction or in the one direction according to the direction of the processing surfaces.

[0154] In addition, when the object of posture conversion is the batch BL2 shown in FIG. 4, that is, when the batch BL2 is aligned with the front and back surfaces of the substrates W facing the left direction Y, first, the control unit 101 operates the rotating mechanism 65 in one direction by 90 degrees so that the processing surface of the substrate W faces upward for the batch LT1. Then, the control unit 101 operates the rotating mechanism 65 in one direction by 90 degrees so that the processing surface of the substrate W faces upward for the batch LT2. In addition, when the processing surface of each substrate W of the batch BL2 faces the right direction Y, the control unit 101 operates the rotating mechanism 65 in the other direction by 90 degrees so that the processing surface of the substrate W faces upward.

[0155] The present invention is not limited to the above-described embodiment, and can be implemented in various ways as described below.

[0156] (1) In the above embodiment, the control unit 101 operates the rotation mechanism 65 in the opposite directions between the batch BL1 and the batch BL2 when the posture of the batch BL1 is changed. However, the present invention is not limited to such rotation control. For example, the rotation mechanism 65 may be operated as follows.

[0157] Here, reference FIG. 13A to FIG. 13D . FIG. 13A to FIG. 13D It is a schematic diagram showing another example of posture transition.

[0158] In the above example, the control unit 101 operates the rotating mechanism 65 in one direction or in the opposite direction, that is, in the other direction, according to the orientation of the processing surface of the lots LT1 and LT2. However, the control unit 101 may operate the rotating mechanism 65 as follows.

[0159] The control unit 101 operates the rotating mechanism 65 for batch LT2 so that it also rotates in only one direction. That is, the control unit 101 operates the rotating mechanism 65 for batch LT1 so that it rotates in one direction by a first angle. The first angle is, for example, 90 degrees. The control unit 101 operates the rotating mechanism 65 for batch LT2 so that the processing surface of the substrate W faces upward and so that it also rotates in one direction by a second angle. The second angle is greater than the first angle. The second angle is, for example, 270 degrees. That is, the control unit 101 rotates the rotating mechanism 65 in only the same direction so that the processing surface of the substrate W faces upward, regardless of batches LT1 and LT2.

[0160] In this way, the control unit 101 can make the processing surfaces of the plurality of substrates W face upward by operating the rotating mechanism 65 to rotate 90 degrees or 270 degrees in one direction. Therefore, the control of the rotating mechanism 65 by the control unit 101 can be simplified.

[0161] (2) In the above-mentioned embodiment, the substrate processing apparatus includes a control unit 101, and the control unit 101 comprehensively controls each unit. However, the present invention is not limited to this control method. Fig.14 . Fig.14 It is a block diagram showing a modified example of the control system.

[0162] That is, the substrate processing apparatus 1A includes: a control unit 101 for controlling the entirety; a sub-control unit 101A for controlling the batch processing apparatus 3 ; a sub-control unit 101B for controlling the posture conversion block 15 ; and a sub-control unit 101C for controlling the single-wafer processing apparatus 5 .

[0163] According to this configuration, the control unit 101 transmits the process recipe information of each batch to the sub-control units 101A, 101B, and 101C. The control unit 101 also transmits information on the combination of the processing surfaces related to the batches. The sub-control unit 101A, for example, operates the rotational movement or linear movement of the push rod PH of the posture conversion block 13 according to the process recipe of the batch constituting the batch received from the control unit 101. The sub-control unit 101B, for example, operates the rotation direction and angle of the rotating mechanism 65 according to the process recipe of the batch constituting the batch received from the control unit 101. The sub-control unit 101C controls each tower TW1 to 3 according to the process recipe of the batch constituting the batch received from the control unit 101.

[0164] According to this configuration, the load of the control unit 101 can be distributed among the sub-control units 101A, 101B, and 101C. Therefore, the load of the control unit 101 can be reduced.

[0165] (3) In the above-described embodiment, the inversion chuck 43 includes a pair of chuck members 45. However, the inversion chuck 43 of the present invention is not limited to such a configuration.

[0166] (4) In the above-described embodiment, the posture conversion tank 33 converts the postures of the plurality of substrates W in pure water. However, the present invention does not necessarily perform posture conversion in liquid. That is, the posture conversion tank 33 may convert the postures of the plurality of substrates W in air or gas such as nitrogen. In this case, since there is less resistance during rotation, the speed of posture conversion can be increased, and the processing volume can be increased.

[0167] (5) In the above embodiment, the substrate processing apparatus 1 is described as an example in which the batch processing apparatus 3 and the single-wafer processing apparatus 5 are connected by the bridge portion 7. However, the present invention can also be applied to a substrate processing apparatus 1 having the batch processing apparatus 3 and the single-wafer processing apparatus 5 in the same housing.

[0168] The present invention can be embodied in other specific forms without departing from its spirit or essential attributes and, accordingly, reference should be made to the appended claims rather than to the specification as indicating the scope of the invention.

Claims

1. A posture conversion device for converting the postures of a plurality of substrates, the device comprising the following elements: Inverting the chuck to hold multiple substrates; an opening and closing driving mechanism for driving the reverse chuck in a radial direction of the substrate between an opening position for receiving the plurality of substrates with the reverse chuck and a holding position for holding the plurality of substrates with the reverse chuck; A rotation drive mechanism drives the inversion chuck around a horizontal axis in order to convert the posture of the plurality of substrates from a vertical posture to a horizontal posture; and The control unit operates the opening and closing drive mechanism to hold the plurality of substrates in a vertical posture on the inversion chuck, and then operates the rotation drive mechanism in a manner that the processing surface of the plurality of substrates faces upward when converting the posture of the plurality of substrates from the vertical posture to the horizontal posture.

2. The posture conversion device according to claim 1, wherein The control unit operates the rotation drive mechanism so as to rotate the processing surfaces of the plurality of substrates in one direction or in another direction opposite thereto, according to the orientation of the processing surfaces of the plurality of substrates.

3. The posture conversion device according to claim 1, wherein The control unit operates the rotation drive mechanism so as to rotate the substrates in only one direction according to the orientation of the processing surfaces of the plurality of substrates.

4. The posture conversion device according to claim 1, wherein The inverted chuck holds only two side surfaces of the plurality of substrates in a direction perpendicular to a direction in which the plurality of substrates are transferred.

5. The posture conversion device according to any one of claims 1 to 4, wherein The control unit operates the rotation drive mechanism based on a process recipe that specifies how to process the plurality of substrates.

6. The posture conversion device according to claim 5, wherein The control unit operates the rotation drive mechanism according to the direction in which the processing surfaces are combined in a batch formed by combining a certain plurality of substrates with another plurality of substrates in the process recipe.

7. A substrate processing device for processing a substrate, the device comprising the following elements: A batch processing section that processes multiple substrates in a vertical position at once; A single-wafer processing section processes a substrate in a horizontal position; a posture conversion unit for converting the plurality of substrates processed by the batch processing unit from a vertical posture to a horizontal posture; A first conveying section conveys the plurality of substrates processed by the batch processing section to the posture conversion section; A second conveying unit conveys the plurality of substrates set to a horizontal posture by the posture conversion unit to the single-wafer processing unit; The posture conversion unit comprises: Inverting the chuck to hold the plurality of substrates; an opening and closing driving mechanism for driving the reverse chuck in a radial direction of the substrate between an opening position for receiving the plurality of substrates with the reverse chuck and a holding position for holding the plurality of substrates with the reverse chuck; and A rotation drive mechanism drives the inverting chuck around a horizontal axis in order to convert the posture of the plurality of substrates from a vertical posture to a horizontal posture; and the substrate processing apparatus comprises: The control unit operates the opening and closing drive mechanism to keep the multiple substrates in a vertical posture on the inversion chuck before transporting the multiple substrates to the single-wafer processing unit after processing the multiple substrates in the batch processing unit, and then operates the rotating drive mechanism in a manner that the processing surface of the multiple substrates faces upward when converting the posture of the multiple substrates from the vertical posture to the horizontal posture.

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