A chip packaging device and a packaging method thereof

By designing automated loading and unloading components and cooling components, the problem of low loading and unloading efficiency in chip packaging equipment was solved, realizing automated tray operation and efficient packaging, and ensuring the stability and reliability of the chips.

CN119381315BActive Publication Date: 2025-11-04SYNERGY INNOVATION INST OF GDUT HEYUAN
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Patent Information

Application Number
CN202411557610.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-04
Publication Date
2025-11-04
Estimated Expiration
2044-11-04

AI Technical Summary

Technical Problem

Existing chip packaging equipment is inefficient during the loading and unloading process, requiring manual operation and affecting overall efficiency.

Method used

A chip packaging device was designed, comprising a loading component and a unloading component. The device achieves automated loading and unloading of trays by driving the push plate and positioning seat through the coordinated movement of the threaded rod. It is also equipped with a cooling component and a rotating component to improve efficiency and stability.

Benefits of technology

It improves the efficiency of chip packaging loading and unloading, simplifies the operation process, and ensures the stability and reliability of chips. Through automated loading and unloading and effective cooling measures, it improves the overall packaging efficiency and chip cleanliness.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application belongs to the technical field of packaging devices, and discloses a chip packaging device and a packaging method thereof, which comprises a workbench, a top plate is fixedly installed at the top end of the workbench, a packaging structure is connected to the bottom of the top plate, a tray is arranged below the packaging structure, the tray is arranged at the top end of the workbench, a feeding assembly and a discharging assembly are arranged at the top end of the workbench, the feeding assembly comprises two positioning seats arranged at the top end of the workbench, the bottom end of each positioning seat is provided with a moving seat, a threaded rod is threadedly connected to the inside of one of the moving seats, one end of the threaded rod is provided with a motor, the discharging assembly comprises a push plate arranged at the top end of the workbench, and the bottom end of the push plate is installed on the outer wall of the threaded rod. The device drives the positioning seat and the push plate to move synchronously through the rotation of the threaded rod, so that the tray is fed and discharged, the feeding and discharging efficiency is improved, the operation process of the workers is simplified, and the overall efficiency of chip packaging is improved.
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Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of packaging devices, in particular to a chip packaging device and a packaging method thereof. BACKGROUND

[0002] The chip packaging device plays a crucial role in the semiconductor manufacturing process, which is mainly responsible for tightly combining the semiconductor chip with the external electrical connection, heat dissipation structure and protection device. Through this packaging process, the chip can have the physical and electrical characteristics required for practical application, ensuring its stability and reliability in various working environments.

[0003] After searching, such as patent: CN216849850U, a chip packaging device based on information technology control, including workbench, top plate, packaging device, chip support plate and clamping positioning plate, the corner end between the workbench and the top plate is welded with a fixed column, the packaging device is arranged in the middle of the bottom of the top plate, the chip support plate is arranged in the middle of the top of the workbench, the limit plate is fixedly arranged at the front and rear ends of the top of the workbench, the limit plate is arranged at the front and rear ends of the chip support plate, the clamping positioning plate is arranged on both sides of the chip support plate, the outer end of the mounting plate is fixedly provided with a push rod, and the outer end of the push rod is connected with an electric push rod device. The chip packaging device based on information technology control is convenient for limiting the placement of the chip support plate, automatically controls the extension and retraction of the push rod, stably clamps the chip support plate with the clamping positioning plate, makes the packaging process more accurate, and automatically filters and purifies the smoke impurities generated in the packaging process.

[0004] The current chip packaging equipment needs to place the tray carrying the chip under the packaging structure during operation, and then the packaging structure processes the chip. Although the positioning mechanism can push the tray to be centered on both sides, the operator still needs to manually place the tray between the two limit plates and take it out after processing is completed. This way of feeding and discharging is low in efficiency, which affects the overall efficiency of chip packaging. SUMMARY

[0005] The purpose of the present application is to provide a chip packaging device and a packaging method thereof to solve the problems raised in the background.

[0006] In order to achieve the above purpose, the present application provides the following technical scheme: a chip packaging device, comprising a workbench, a top plate fixedly installed at the top end of the workbench, a packaging structure connected to the bottom of the top plate, a tray arranged below the packaging structure, the tray being arranged at the top end of the workbench, and a feeding assembly and a discharging assembly arranged at the top end of the workbench.

[0007] The feeding assembly comprises positioning seats arranged at the top end of the workbench, the positioning seats are provided in two, the interiors of the two positioning seats are provided with cooling assemblies, the two positioning seats are arranged at the two ends of the tray respectively, the bottom ends of the two positioning seats are installed with moving seats, the moving seats are slidingly installed in the interior of the workbench, the interior of one of the moving seats is threadedly connected with a threaded rod, and one end of the threaded rod is installed with a motor.

[0008] The discharging assembly comprises a push plate arranged at the top end of the workbench, the push plate is arranged at one side of the tray, and the bottom end of the push plate is installed on the outer wall of the threaded rod.

[0009] As a further technical scheme of the present application, one side of the positioning seat is installed with a connecting block, the outer wall of the connecting block is fixedly installed with a magnetic block, one side of the magnetic block is provided with a wedge block, the lower side of the wedge block is provided with a magnetic plate, and the wedge block and the magnetic plate are fixedly installed on the inner wall of the workbench.

[0010] As a further technical scheme of the present application, the top end of the connecting block is fixedly connected with a connecting shaft, the top end of the connecting shaft is fixedly installed with a limiting plate, the limiting plate is slidingly installed in the interior of the positioning seat, and a second spring is arranged between the limiting plate and the positioning seat.

[0011] As a further technical scheme of the present application, the bottom of the positioning seat is slidingly connected with a limiting rod, the limiting rod is fixedly installed in the interior of the moving seat, and the outer wall of the limiting rod is provided with a first spring.

[0012] As a further technical scheme of the present application, the top end of the workbench is fixedly installed with a guide plate, and the guide plate is symmetrically provided with two.

[0013] As a further technical scheme of the present application, the interior of the guide plate is rotatably installed with rollers, and the rollers are uniformly distributed.

[0014] As a further technical scheme of the present application, the cooling assembly comprises first dust suction pipes arranged in the interiors of the positioning seats, the first dust suction pipes are uniformly arranged, the first dust suction pipes are fixedly connected through connecting pipes, the outer wall of the connecting pipe is installed with an air pump, the end, away from the air pump, of the connecting pipe is provided with a filter cavity, the filter cavity is arranged in the interior of the positioning seat, the upper side of the filter cavity is provided with a maintenance plate, and the interior of the maintenance plate is uniformly provided with air outlet holes.

[0015] As a further technical scheme of the present application, the outer wall of the connecting pipe is installed with a one-way valve.

[0016] As a further technical scheme of the present application, the maintenance plate is connected with the positioning seat through bolts.

[0017] As a further technical scheme of the present application, the filter cavity is internally provided with a filter plate.

[0018] As a further technical scheme of the present application, the positioning seat is provided with side plates on both sides through rotating assemblies, and the two side plates are internally and uniformly provided with second dust collection pipes.

[0019] As a further technical scheme of the present application, the rotating assembly comprises a rotating shaft fixedly installed on the inner wall of the side plate, a gear fixedly installed on the outer wall of the rotating shaft, a rack plate engagedly connected to one side of the gear, a connecting plate fixedly installed at one end of the rack plate, a sliding block fixedly installed at the bottom end of the connecting plate, and a sliding slot internally provided with the sliding block and formed at the top end of a fixing seat fixedly installed at the top end of the workbench.

[0020] A packaging method of a chip packaging device, comprising the following steps:

[0021] S1: when packaging the chip, first place the tray carrying the chip on one side of the push plate, so that the side wall of the tray is attached to the side wall of the push plate, then drive the threaded rod to rotate through the motor, the rotation of the threaded rod drives the movement of the push plate, the push plate pushes the tray towards the positioning seat, the tray moves to the lower side of the packaging structure, the push plate is reset by reversing the threaded rod, and finally the chip carried on the top of the tray is packaged through the packaging structure;

[0022] S101: when packaging, another tray can be placed on the side wall of the push plate, when the chip in the tray under the packaging structure is packaged, the threaded rod is driven to rotate again through the motor, the rotation of the threaded rod drives the movement of the moving seat, the movement of the moving seat drives the movement of the positioning seat, and the two positioning seats holding the packaged tray are moved away:

[0023] S102: when the positioning seat holding the tray moves to the unloading area, the movement of the positioning seat drives the movement of the connecting block, the movement of the connecting block drives the movement of the magnetic block, when the magnetic block moves to one end of the wedge, the magnetic block is pressed downward through the inclined surface of the wedge, so that the magnetic block is parallel to the magnetic plate, the magnetic force between them drives the magnetic block to move to the side of the magnetic plate, at the same time, the movement of the magnetic block drives the movement of the connecting block, the movement of the connecting block drives the movement of the positioning seat through the connecting shaft, so that the positioning seat moves a distance away from the tray, thereby the two positioning seats holding the tray are released after moving to the unloading area;

[0024] S103: at the same time, the rotation of the threaded rod drives the push plate to push a new tray to the lower side of the packaging structure;

[0025] S104: When the positioning seat clamps the tray reaches the unloading area, the push plate pushes the new tray to the lower side of the packaging structure, the push plate moves back by reversing the threaded rod, and the positioning seat moves back to the side of the packaging structure, when the magnetic block moves away from the magnetic plate, the limiting plate moves up by releasing the elastic potential energy of the second spring, so that the magnetic block moves up and resets, when the magnetic block moves away from the magnetic plate, the positioning seat moves back to the side of the tray by releasing the elastic potential energy of the first spring, so that the two positioning seats move inward after moving to the lower side of the packaging structure to clamp the tray, and finally the packaging structure is used to package the chips carried on the top of the tray, the above steps are repeated, and continuous operation is carried out.

[0026] A packaging method of a chip packaging device further comprises the following steps:

[0027] S2: When the chip is packaged, when the push plate pushes the tray to move to the side of the packaging structure, the position of the tray is adjusted by the two guide plates, so that the tray moves horizontally to the lower side of the packaging structure.

[0028] A packaging method of a chip packaging device further comprises the following steps:

[0029] S3: When the device is unloaded, the air pump is started and connected through the connecting pipe, so that the first dust suction pipe generates suction force to suck the heat above the tray into the filter cavity, and then discharges from the air outlet after filtration;

[0030] S31: At the same time, the positioning seat moves to one side to drive the sliding block to slide in the sliding groove, the sliding block is guided to move to one side through the inclined portion in the sliding groove, the connecting plate moves away from the positioning seat, the movement of the connecting plate drives the movement of the rack plate, the movement of the rack plate drives the rotation of the gear, the rotation of the gear drives the rotation of the rotating shaft, the rotation of the rotating shaft drives the rotation of the side plate to be perpendicular to the positioning seat, and the side plates at both ends of the two positioning seats are rotated to form a rectangle above the tray, and the packaged chips are fully cooled.

[0031] The beneficial effects of the present application are as follows:

[0032] The application is characterized in that the upper feeding assembly and the lower feeding assembly are matched, when the chip is packaged, the tray carrying the chip is placed on one side of the push plate, the side wall of the tray is attached to the side wall of the push plate, then the threaded rod is driven to rotate by the motor, the rotation of the threaded rod drives the movement of the push plate, the push plate pushes the tray to the direction of the positioning seat, the tray is moved to the lower side of the packaging structure, the push plate is moved to reset through the reverse rotation of the threaded rod, finally the chip carried on the top of the tray is packaged by the packaging structure, when packaging, another tray can be placed on the side wall of the push plate, when the chip in the tray below the packaging structure is packaged, the threaded rod is driven to rotate by the motor again, the rotation of the threaded rod drives the movement of the moving seat, the movement of the moving seat drives the movement of the positioning seat, so that the two positioning seats clamp the tray after packaging and move away, the push plate pushes the new tray to the lower side of the packaging structure, and the packaging is continued, the device drives the positioning seat and the push plate to move synchronously through the rotation of the threaded rod, the tray is fed and discharged, the feeding and discharging efficiency is improved, the operation process of the workers is simplified, and the overall efficiency of the chip packaging is improved.

[0033] The application is characterized in that the lower feeding assembly and the lower feeding assembly are matched, when the chip is packaged, the tray carrying the chip is placed on one side of the push plate, the side wall of the tray is attached to the side wall of the push plate, then the threaded rod is driven to rotate by the motor, the rotation of the threaded rod drives the movement of the push plate, the push plate pushes the tray to the direction of the positioning seat, the tray is moved to the lower side of the packaging structure, the push plate is moved to reset through the reverse rotation of the threaded rod, finally the chip carried on the top of the tray is packaged by the packaging structure, when packaging, another tray can be placed on the side wall of the push plate, when the chip in the tray below the packaging structure is packaged, the threaded rod is driven to rotate by the motor again, the rotation of the threaded rod drives the movement of the moving seat, the movement of the moving seat drives the movement of the positioning seat, so that the two positioning seats clamp the tray after packaging and move away, the push plate pushes the new tray to the lower side of the packaging structure, and the packaging is continued, the device drives the positioning seat and the push plate to move synchronously through the rotation of the threaded rod, the tray is fed and discharged, the feeding and discharging efficiency is improved, the operation process of the workers is simplified, and the overall efficiency of the chip packaging is improved.

[0034] The application is characterized in that the lower feeding assembly and the lower feeding assembly are matched, when the chip is packaged, the tray carrying the chip is placed on one side of the push plate, the side wall of the tray is attached to the side wall of the push plate, then the threaded rod is driven to rotate by the motor, the rotation of the threaded rod drives the movement of the push plate, the push plate pushes the tray to the direction of the positioning seat, the tray is moved to the lower side of the packaging structure, the push plate is moved to reset through the reverse rotation of the threaded rod, finally the chip carried on the top of the tray is packaged by the packaging structure, when packaging, another tray can be placed on the side wall of the push plate, when the chip in the tray below the packaging structure is packaged, the threaded rod is driven to rotate by the motor again, the rotation of the threaded rod drives the movement of the moving seat, the movement of the moving seat drives the movement of the positioning seat, so that the two positioning seats clamp the tray after packaging and move away, the push plate pushes the new tray to the lower side of the packaging structure, and the packaging is continued, the device drives the positioning seat and the push plate to move synchronously through the rotation of the threaded rod, the tray is fed and discharged, the feeding and discharging efficiency is improved, the operation process of the workers is simplified, and the overall efficiency of the chip packaging is improved. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 It is a schematic diagram of the overall structure of the application;

[0036] Figure 2 It is a schematic diagram of the overall structure of the application;

[0037] Figure 3 It is a schematic diagram of the overall structure of the application; Figure 2 It is a schematic diagram of the overall structure of the application;

[0038] Figure 4 It is a schematic diagram of the overall structure of the application; Figure 2 It is a schematic diagram of the overall structure of the application;

[0039] Figure 5 It is the overall structure of the application;

[0040] Figure 6 It is the structure of the application at the moving seat;

[0041] Figure 7 It is the structure of the application at the positioning seat;

[0042] Figure 8 It is the application Figure 7 The structure of the application at C is enlarged and schematically shown;

[0043] Figure 9 It is the structure of the application at the positioning seat;

[0044] Figure 10 It is the application Figure 9 The structure of the application at D is enlarged and schematically shown;

[0045] Figure 11 It is the structure of the application at the guide plate.

[0046] In the figure: 1, workbench; 2, top plate; 3, packaging structure; 4, tray; 5, positioning seat; 6, moving seat; 7, threaded rod; 8, motor; 9, limiting rod; 10, first spring; 11, push plate; 12, guide plate; 13, connecting block; 14, magnetic block; 15, connecting shaft; 16, limiting plate; 17, second spring; 18, wedge block; 19, magnetic plate; 20, connecting pipe; 21, air pump; 22, first dust suction pipe; 23, check valve; 24, filter cavity; 25, maintenance plate; 26, air outlet; 27, filter plate; 28, side plate; 29, second dust suction pipe; 30, rotating shaft; 31, gear; 32, rack plate; 33, connecting plate; 34, sliding block; 35, sliding groove; 36, fixed seat; 37, roller. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the application.

[0048] As Figures 1 to 11 shown, in the embodiments of the application, a chip packaging device comprises a workbench 1, a top plate 2 is fixedly installed at the top end of the workbench 1, a packaging structure 3 is connected to the bottom of the top plate 2, a tray 4 is arranged below the packaging structure 3, the tray 4 is arranged at the top end of the workbench 1, and a feeding assembly and a discharging assembly are arranged at the top end of the workbench 1;

[0049] The feeding assembly comprises two positioning seats 5 arranged at the top end of the workbench 1, the inside of each of the two positioning seats 5 is provided with a cooling assembly, the two positioning seats 5 are arranged at the two ends of the tray 4 respectively, the bottom end of each of the two positioning seats 5 is installed with a moving seat 6, the inside of one of the two moving seats 6 is threadedly connected with a threaded rod 7, one end of the threaded rod 7 is installed with a motor 8.

[0050] The discharging assembly comprises a push plate 11 arranged at the top end of the workbench 1, the push plate 11 is arranged at one side of the tray 4, and the bottom end of the push plate 11 is installed on the outer wall of the threaded rod 7.

[0051] The existing CN216849850U discloses a chip packaging device based on information technology control, which discloses a workbench, a top plate, a packaging device and a chip tray plate, and the workbench 1, the top plate 2, the packaging structure 3, the tray 4 and the specific packaging mode in the present application file all adopt the same technical means as in the prior art, which will not be described here.

[0052] Through the cooperation of the feeding assembly and the discharging assembly, when the chip is packaged, first, the tray 4 carrying the chip is placed on one side of the push plate 11, so that the side wall of the tray 4 is attached to the side wall of the push plate 11, then the threaded rod 7 is driven to rotate by the motor 8, the rotation of the threaded rod 7 drives the movement of the push plate 11, so that the push plate 11 pushes the tray 4 to the direction of the positioning seat 5, and then the tray 4 moves to the lower side of the packaging structure 3, and then the push plate 11 is moved back to the original position by reversing the threaded rod 7, and finally the chip on the top of the tray 4 is packaged by the packaging structure 3.

[0053] When packaging, another tray 4 can be placed on the side wall of the push plate 11, and when the chip in the tray 4 below the packaging structure 3 is packaged, the threaded rod 7 is driven to rotate by the motor 8 again, the rotation of the threaded rod 7 drives the movement of the moving seat 6, the movement of the moving seat 6 drives the movement of the positioning seat 5, so that the two positioning seats 5 clamp the tray 4 with the packaged chip and move away, and then the push plate 11 pushes the new tray 4 to the lower side of the packaging structure 3 for packaging.

[0054] The device drives the positioning seat 5 and the push plate 11 to move synchronously by the rotation of the threaded rod 7, so that the tray 4 is fed and discharged, the feeding and discharging efficiency is improved, the operation process of the workers is simplified, and the overall efficiency of the chip packaging is improved.

[0055] As shown in Figure 2 and Figure 3 It is shown that one side of the positioning seat 5 is installed with a connecting block 13, the outer wall of the connecting block 13 is fixedly installed with a magnetic block 14, one side of the magnetic block 14 is provided with a wedge block 18, the lower side of the wedge block 18 is provided with a magnetic plate 19, and the wedge block 18 and the magnetic plate 19 are both fixedly installed on the inner wall of the workbench 1.

[0056] The magnetic block 14 and the magnetic plate 19 are magnetically connected;

[0057] The initial position of the magnetic block 14 is above the magnetic plate 19, and the two are staggered;

[0058] When the positioning seat 5 clamps the tray 4 to move to unload, the movement of the positioning seat 5 drives the movement of the connecting block 13, the movement of the connecting block 13 drives the movement of the magnetic block 14, when the magnetic block 14 moves to one end of the wedge block 18, the magnetic block 14 is pressed downward through the inclined surface guidance of the wedge block 18, so that the magnetic block 14 is parallel to the magnetic plate 19, and the magnetic force between the two makes the magnetic block 14 move to one side of the magnetic plate 19 and adhere, at the same time, the movement of the magnetic block 14 drives the movement of the connecting block 13, the movement of the connecting block 13 drives the movement of the positioning seat 5 through the connecting shaft 15, so that the positioning seat 5 moves a distance away from the tray 4, so that the two positioning seats 5 clamp the tray 4 to move to the unloading area and then release the tray 4;

[0059] The magnetic plate 19 is located on the left side of the positioning seat 5, and the length of the magnetic plate 19 is slightly shorter than the distance of the left movement of the positioning seat 5, so that the positioning seat 5 keeps the state of outward opening when it moves right to reset.

[0060] As shown in Figure 9 and Figure 10 , the top end of the connecting block 13 is fixedly connected with the connecting shaft 15, the top end of the connecting shaft 15 is fixedly installed with the limiting plate 16, the limiting plate 16 is slidingly installed in the inside of the positioning seat 5, and the second spring 17 is arranged between the limiting plate 16 and the positioning seat 5.

[0061] When the magnetic block 14 is guided downward through the wedge block 18, the movement of the magnetic block 14 drives the movement of the connecting shaft 15, the movement of the connecting shaft 15 drives the movement of the limiting plate 16, and the downward movement of the limiting plate 16 makes the second spring 17 deform to store elastic potential energy, when the magnetic block 14 moves away from the magnetic plate 19, the elastic potential energy of the second spring 17 is released to drive the upward movement of the limiting plate 16, so that the magnetic block 14 moves upward to reset.

[0062] As shown in Figure 7 and Figure 8 , the bottom of the positioning seat 5 is slidingly connected with the limiting rod 9, the limiting rod 9 is fixedly installed in the inside of the moving seat 6, and the outer wall of the limiting rod 9 is provided with the first spring 10.

[0063] When the magnetic block 14 is connected with the magnetic plate 19 to drive the positioning seat 5 to move away from the side of the tray 4, the positioning seat 5 is simultaneously slid on the outer wall of the limiting rod 9, so that the first spring 10 is deformed to store elastic potential energy, and when the magnetic block 14 is separated from the magnetic plate 19, the elastic potential energy is released through the first spring 10 to drive the positioning seat 5 to move to the side of the tray 4 to reset, so that the two positioning seats 5 are moved inward after moving to the lower side of the packaging structure 3 to clamp the tray 4, which can not only ensure the stability during discharging, but also improve the stability of the chips on the top of the tray 4 during processing.

[0064] As shown in Figure 1 , Figure 2 and Figure 11 , the top end of the workbench 1 is fixedly provided with a guide plate 12, and the guide plate 12 is symmetrically provided with two.

[0065] The side of the guide plate 12 close to the push plate 11 is inclinedly arranged;

[0066] When the push plate 11 pushes the tray 4 to move to the side of the packaging structure 3 to load, the tray 4 is guided by the two guide plates 12, so that the position of the tray 4 is conveniently adjusted.

[0067] As shown in Figure 11 , the inside of the guide plate 12 is rotatably provided with a roller 37, and the rollers 37 are uniformly distributed.

[0068] The rollers 37 reduce the friction between the tray 4 and the guide plate 12.

[0069] As shown in Figure 9 , the cooling assembly comprises a first dust suction pipe 22 arranged in the positioning seat 5, the first dust suction pipes 22 are uniformly arranged, and each first dust suction pipe 22 is fixedly connected through a connecting pipe 20, the outer wall of the connecting pipe 20 is provided with an air pump 21, one end of the connecting pipe 20 away from the air pump 21 is provided with a filter cavity 24, the filter cavity 24 is arranged in the inside of the positioning seat 5, and the upper side of the filter cavity 24 is provided with a maintenance plate 25, and the inside of the maintenance plate 25 is uniformly provided with an air outlet hole 26.

[0070] The first dust suction pipe 22 is downwardly inclinedly arranged;

[0071] Through the arrangement of the cooling assembly, when the device is discharged, the air pump 21 is started and connected through the connecting pipe 20, so that the first dust suction pipe 22 generates suction force, which can not only effectively remove the pollutants such as particles, dust, organic matter and the like attached to the surface of the chip, but also ensure the cleanliness of the surface of the chip, and can also suck away the heat on the surface of the tray 4, so as to reduce the temperature of the chip, so as to ensure the stability and reliability of the chip after packaging.

[0072] As shown in Figure 9 , the outer wall of the connecting pipe 20 is provided with a one-way valve 23.

[0073] The inside of the filter cavity 24 is provided with water for cooling the gas;

[0074] The water in the filter cavity 24 is prevented from flowing out of the connecting pipe 20 by the one-way valve 23.

[0075] As shown in Figure 7 and Figure 9 , the maintenance plate 25 is connected to the positioning seat 5 by bolts.

[0076] The maintenance plate 25 is convenient to disassemble and maintain the inside of the filter cavity 24.

[0077] As shown in Figure 9 , the filter plate 27 is installed in the inside of the filter cavity 24.

[0078] The impurities in the inside of the filter cavity 24 are filtered, the production environment is purified, and the concentration of pollutants in the air is reduced.

[0079] As shown in Figure 2 , Figure 6 , Figure 7 and Figure 9 , the positioning seat 5 is provided with side plates 28 on both sides through rotating assemblies, and the inside of each of the two side plates 28 is uniformly provided with a second dust suction pipe 29.

[0080] Each of the second dust suction pipes 29 in the inside of the side plate 28 is fixedly connected, and the second dust suction pipe 29 is connected with the connecting pipe 20 in the inside of the positioning seat 5 through the connecting pipe 20;

[0081] The heat is sucked away by the negative pressure in the inside of the positioning seat 5 and the side plate 28, which can improve the cooling range and reduce the risk of damage of the chip due to overheating as much as possible.

[0082] As shown in Figure 4 , Figure 6 and Figure 7 , the rotating assembly comprises a rotating shaft 30 fixedly installed in the inner wall of the side plate 28, a gear 31 fixedly installed on the outer wall of the rotating shaft 30, a rack plate 32 engagedly connected on one side of the gear 31, a connecting plate 33 fixedly installed at one end of the rack plate 32, a sliding block 34 fixedly installed at the bottom end of the connecting plate 33, the sliding block 34 being slidingly installed in the inside of a sliding groove 35, the sliding groove 35 being opened at the top end of a fixed seat 36, and the fixed seat 36 being fixedly installed at the top end of the workbench 1.

[0083] One end of the sliding groove 35 is inclinedly arranged;

[0084] Through the setting of the rotating assembly, when the positioning seat 5 moves to unload, the sliding block 34 slides in the inside of the sliding groove 35, the position of the sliding block 34 is guided through the inclined surface in the inside of the sliding groove 35, the connecting plate 33 moves to the side away from the positioning seat 5, the movement of the connecting plate 33 drives the movement of the rack plate 32, the movement of the rack plate 32 drives the rotation of the gear 31, the rotation of the gear 31 drives the rotation of the rotating shaft 30, the rotation of the rotating shaft 30 drives the inward rotation of the side plate 28 to be perpendicular to the positioning seat 5, through the rotation of the side plates 28 at the two ends of the two positioning seats 5, a rectangle is surrounded above the tray 4, the cooling range is as large as possible, and the cooling efficiency and effect are improved.

[0085] A packaging method of a chip packaging device, comprising the following steps:

[0086] S1: when the chip is packaged, first, the tray 4 carrying the chip is placed on one side of the push plate 11, the side wall of the tray 4 is attached to the side wall of the push plate 11, then the threaded rod 7 is driven to rotate by the motor 8, the rotation of the threaded rod 7 drives the movement of the push plate 11, the push plate 11 pushes the tray 4 to the direction of the positioning seat 5, the tray 4 moves to the lower side of the packaging structure 3, the push plate 11 is moved to reset through the reverse rotation of the threaded rod 7, and finally the chip carried on the top of the tray 4 is packaged by the packaging structure 3;

[0087] S101: when packaged, another tray 4 can be placed on the side wall of the push plate 11, when the chip in the tray 4 below the packaging structure 3 is packaged, the threaded rod 7 is driven to rotate again by the motor 8, the rotation of the threaded rod 7 drives the movement of the moving seat 6, the movement of the moving seat 6 drives the movement of the positioning seat 5, and the two positioning seats 5 clamp the tray 4 that is packaged to move away:

[0088] S102: when the positioning seat 5 clamps the tray 4 to move to unload, the movement of the positioning seat 5 drives the movement of the connecting block 13, the movement of the connecting block 13 drives the movement of the magnetic block 14, when the magnetic block 14 moves to one end of the wedge block 18, the magnetic block 14 is pressed downward through the inclined surface guidance of the wedge block 18, the magnetic block 14 is parallel to the magnetic plate 19, the magnetic block 14 moves to the side of the magnetic plate 19 through the magnetic force, and meanwhile the movement of the magnetic block 14 drives the movement of the connecting block 13, the movement of the connecting block 13 drives the movement of the positioning seat 5 through the connecting shaft 15, the positioning seat 5 moves to the side away from the tray 4 by a distance, so that the two positioning seats 5 clamp the tray 4 to move to the unloading area and then release the tray 4;

[0089] S103: meanwhile, the rotation of the threaded rod 7 drives the push plate 11 to push a new tray 4 to the lower side of the packaging structure 3;

[0090] S104: When the positioning seat 5 clamps the tray 4 reaches the unloading area, the push plate 11 pushes the new tray 4 to the lower side of the packaging structure 3, the push plate 11 is moved back by reversing the threaded rod 7, and the positioning seat 5 is moved back to one side of the packaging structure 3, when the magnetic block 14 is separated from the magnetic plate 19, the elastic potential energy of the second spring 17 is released to drive the limiting plate 16 to move upwards, so that the magnetic block 14 moves upwards and resets, when the magnetic block 14 is separated from the magnetic plate 19, the elastic potential energy of the first spring 10 is released to drive the positioning seat 5 to move to one side of the tray 4, so that the two positioning seats 5 move inward after moving to the lower side of the packaging structure 3 to clamp the tray 4, and finally the packaging structure 3 is used to package the chips carried on the top of the tray 4, and the above steps are repeated to perform continuous operation.

[0091] A packaging method of a chip packaging device further comprises the following steps:

[0092] S2: When the chip is packaged, the push plate 11 pushes the tray 4 to move to one side of the packaging structure 3, and the tray 4 is guided by the two guide plates 12 to adjust the position of the tray 4, so that the tray 4 moves horizontally to the lower side of the packaging structure 3.

[0093] A packaging method of a chip packaging device further comprises the following steps:

[0094] S3: When the device is unloaded, the air pump 21 is started and connected through the connecting pipe 20, so that the first dust suction pipe 22 generates suction to suck the heat above the tray 4 into the filter cavity 24, and then the filtered air is discharged from the air outlet 26;

[0095] S301: At the same time, the positioning seat 5 moves to one side to drive the sliding block 34 to slide in the sliding groove 35, the sliding groove 35 guides the position of the sliding block 34 to move, the connecting plate 33 moves away from the positioning seat 5, the movement of the connecting plate 33 drives the movement of the rack plate 32, the movement of the rack plate 32 drives the rotation of the gear 31, the rotation of the gear 31 drives the rotation of the rotating shaft 30, the rotation of the rotating shaft 30 drives the side plate 28 to rotate inwardly and vertically to the positioning seat 5, and the side plates 28 at both ends of the two positioning seats 5 are rotated to form a rectangle above the tray 4, and the packaged chips are fully cooled.

[0096] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A chip packaging device comprising a table (1), characterized in that: The top end of the workbench (1) is fixedly provided with a top plate (2), the bottom of the top plate (2) is connected with an encapsulation structure (3), the lower portion of the encapsulation structure (3) is provided with a tray (4), the tray (4) is arranged on the top end of the workbench (1), and the top end of the workbench (1) is provided with a feeding assembly and a discharging assembly. The feeding assembly comprises positioning seats (5) arranged on the top end of the workbench (1), the positioning seats (5) are provided in two, the positioning seats (5) are provided with cooling assemblies inside, the positioning seats (5) are arranged at two ends of the tray (4) respectively, the bottom ends of the positioning seats (5) are provided with moving seats (6), the moving seats (6) are slidingly arranged inside the workbench (1), the inside of one of the moving seats (6) is threadedly connected with a threaded rod (7), and one end of the threaded rod (7) is provided with a motor (8). The discharging assembly comprises a push plate (11) arranged on the top end of the workbench (1), the push plate (11) is arranged on one side of the tray (4), and the bottom end of the push plate (11) is arranged on the outer wall of the threaded rod (7).

2. The chip package device of claim 1, wherein: One side of the positioning seat (5) is provided with a connecting block (13), the outer wall of the connecting block (13) is fixedly provided with a magnetic block (14), one side of the magnetic block (14) is provided with a wedge block (18), the lower portion of the wedge block (18) is provided with a magnetic plate (19), and the wedge block (18) and the magnetic plate (19) are fixedly arranged on the inner wall of the workbench (1).

3. The chip package apparatus of claim 2, wherein: The top end of the connecting block (13) is fixedly connected with a connecting shaft (15), the top end of the connecting shaft (15) is fixedly provided with a limiting plate (16), the limiting plate (16) is slidingly arranged inside the positioning seat (5), and the limiting plate (16) and the positioning seat (5) are provided with a second spring (17).

4. The chip package device of claim 1, wherein: The bottom of the positioning seat (5) is slidingly connected with a limiting rod (9), the limiting rod (9) is fixedly arranged inside the moving seat (6), and the outer wall of the limiting rod (9) is provided with a first spring (10).

5. The chip package device of claim 1, wherein: The top end of the workbench (1) is fixedly provided with a guide plate (12), and the guide plate (12) is symmetrically provided with two.

6. The chip package device of claim 5, wherein: The inside of the guide plate (12) is rotatably provided with a plurality of rollers (37), and the rollers (37) are uniformly distributed.

7. The chip package device of claim 1, wherein: The cooling assembly comprises a first dust suction pipe (22) arranged inside the positioning seat (5), the first dust suction pipes (22) are uniformly arranged, the first dust suction pipes (22) are fixedly connected through connecting pipes (20), the outer wall of the connecting pipe (20) is provided with an air pump (21), one end of the connecting pipe (20) away from the air pump (21) is provided with a filter cavity (24), the filter cavity (24) is arranged in the inside of the positioning seat (5), the upper portion of the filter cavity (24) is provided with a maintenance plate (25), and the inside of the maintenance plate (25) is uniformly provided with a plurality of air outlet holes (26).

8. The chip package device of claim 7, wherein: The outer wall of the connecting pipe (20) is provided with a one-way valve (23).

9. The chip package device of claim 7, wherein: The maintenance plate (25) is connected with the positioning seat (5) through bolts.

10. The chip package device of claim 7, wherein: The inside of the filter cavity (24) is provided with a filter plate (27).

11. The chip package device of claim 1, wherein: Two sides of the positioning seat (5) are provided with side plates (28) through rotating assemblies.

12. The chip package device of claim 11, wherein: The rotating assembly comprises a rotating shaft (30) fixedly installed on the inner wall of the side plate (28), a gear (31) fixedly installed on the outer wall of the rotating shaft (30), a rack plate (32) engagedly connected to one side of the gear (31), a connecting plate (33) fixedly installed at one end of the rack plate (32), a sliding block (34) fixedly installed at the bottom end of the connecting plate (33), and a sliding groove (35) in which the sliding block (34) is slidingly installed, the sliding groove (35) being formed at the top end of a fixing seat (36) fixedly installed at the top end of the workbench (1).

13. A packaging method of a chip packaging device, the method being applied to a chip packaging device according to any one of claims 1 to 12, characterized in that, The method comprises the following steps: S1: when the chip is encapsulated, first, place the tray (4) carrying the chip on one side of the push plate (11), so that the side wall of the tray (4) is attached to the side wall of the push plate (11), then drive the threaded rod (7) to rotate through the motor (8), the rotation of the threaded rod (7) drives the movement of the push plate (11), the push plate (11) pushes the tray (4) to the direction of the positioning seat (5), the tray (4) is moved to the lower side of the encapsulation structure (3), the threaded rod (7) is reversed to move the push plate (11) to the reset position, and finally the chip carried on the top of the tray (4) is encapsulated through the encapsulation structure (3); S101: when encapsulating, another tray (4) can be placed on the side wall of the push plate (11), when the chip in the tray (4) under the encapsulation structure (3) is encapsulated, the threaded rod (7) is driven to rotate again through the motor (8), the rotation of the threaded rod (7) drives the movement of the moving seat (6), the movement of the moving seat (6) drives the movement of the positioning seat (5), and the two positioning seats (5) clamp the tray (4) and move away: S102: when the positioning seat (5) clamps the tray (4) and moves to the unloading position, the movement of the positioning seat (5) drives the movement of the connecting block (13), the movement of the connecting block (13) drives the movement of the magnetic block (14), when the magnetic block (14) moves to one end of the wedge block (18), the magnetic block (14) is pressed downward through the inclined surface of the wedge block (18), so that the magnetic block (14) is parallel to the magnetic plate (19), the magnetic force between the two causes the magnetic block (14) to move to the side of the magnetic plate (19) and attach to it, meanwhile, the movement of the magnetic block (14) drives the movement of the connecting block (13), the movement of the connecting block (13) drives the movement of the positioning seat (5) through the connecting shaft (15), so that the positioning seat (5) moves a distance away from the tray (4), so that the two positioning seats (5) clamp the tray (4) and move to the unloading area, and then the tray (4) is released; S103: meanwhile, the rotation of the threaded rod (7) drives the push plate (11) to push a new tray (4) to the lower side of the encapsulation structure (3). S104: When the positioning seat (5) clamps the tray (4) reaches the unloading area, the push plate (11) pushes the new tray (4) to the bottom of the packaging structure (3), the push plate (11) is moved back by reversing the threaded rod (7), and the positioning seat (5) is moved back to one side of the packaging structure (3), when the magnetic block (14) moves away from the magnetic plate (19), the elastic potential energy of the second spring (17) is released to drive the limiting plate (16) to move up, so that the magnetic block (14) moves up to reset, when the magnetic block (14) is separated from the magnetic plate (19), the elastic potential energy of the first spring (10) is released to drive the positioning seat (5) to move to one side of the tray (4) to reset, so that the two positioning seats (5) move inward after moving to the bottom of the packaging structure (3) to clamp the tray (4), and finally the packaging structure (3) is used to package the chips carried on the top of the tray (4), and the above steps are repeated to continuously work.

14. The packaging method of a chip package device according to claim 13, wherein: Further comprising the following steps: S2: When the chip is packaged, the push plate (11) pushes the tray (4) to move to one side of the packaging structure (3), and the tray (4) is guided by the two guide plates (12) to adjust the position of the tray (4), so that the tray (4) moves horizontally to the bottom of the packaging structure (3).

15. The packaging method of a chip package device according to claim 13, wherein: Further comprising the following steps: S3: When the device is unloaded, the air pump (21) is started and connected through the connecting pipe (20) to generate suction force in the first dust collection pipe (22), so that the heat above the tray (4) is sucked into the filter cavity (24), and then discharged from the air outlet (26) after filtration; S301: At the same time, the positioning seat (5) moves to one side to drive the sliding block (34) to slide in the sliding groove (35), the sliding block (34) is guided by the inclined part in the sliding groove (35) to move to one side away from the positioning seat (5), the connecting plate (33) is moved to one side away from the positioning seat (5), the movement of the connecting plate (33) drives the movement of the rack plate (32), the movement of the rack plate (32) drives the rotation of the gear (31), the rotation of the gear (31) drives the rotation of the rotating shaft (30), the rotation of the rotating shaft (30) drives the rotation of the side plate (28) to be perpendicular to the positioning seat (5), the two side plates (28) at both ends of the two positioning seats (5) are rotated to form a rectangle above the tray (4), and the packaged chips are fully cooled.

Citation Information

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