Wafer substrate positioning device

Abstract

The invention relates to the field of wafer production equipment, and provides a wafer substrate positioning device which comprises a device body, a deviation rectifying assembly and an adjusting mechanism, the deviation rectifying assembly comprises a deviation rectifying mounting frame, a rotating disc and a deviation rectifying sensor, the deviation rectifying mounting frame is mounted on the device body, and the rotating disc is rotationally connected to the deviation rectifying mounting frame; the rotating disc is used for placing a wafer substrate to be positioned, and the deviation correction sensor is installed on the deviation correction installation frame and used for obtaining the center deviation value of the wafer substrate and a rotating shaft of the rotating disc. The angle deviation value of the connecting line of the center of the wafer substrate and the rotating center of the rotating disc and the preset position of the rotating disc and the azimuth deviation value of the machining groove of the wafer substrate and the preset position of the rotating disc are calculated; the rotating disc rotates the wafer substrate based on the angle deviation value; the adjusting mechanism is installed on the device body, the adjusting mechanism and the deviation correcting assembly are oppositely arranged, and the adjusting mechanism moves the wafer substrate based on the center deviation value; and the rotating disc rotates the wafer substrate based on the azimuth deviation value.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer production equipment, and in particular to a wafer substrate positioning device. Background Art

[0002] In the semiconductor manufacturing industry, wafer substrates are the basic materials for manufacturing chips, and their processing accuracy and quality control are crucial. Before the wafer substrate is chamfered, accurately determining the center position of the wafer substrate and the position of the processing groove (V-groove or flat groove) on the wafer substrate is a key link to ensure the smooth progress of subsequent processing steps and product quality.

[0003] At present, there are many technical solutions for determining the center of the wafer substrate and the position of the processing groove on the market. Among them, a common method is to use three cameras to sample the wafer substrate multiple times. The basic process of this method is as follows: first, the wafer substrate is photographed from different angles or positions by three cameras to obtain images of the wafer substrate; then, these images are converted into grayscale images to simplify subsequent processing; then, the grayscale image is edge detected to extract the edge contour of the wafer substrate and obtain a series of edge pixel points; finally, these edge pixel points are further processed and analyzed to determine the center of the wafer substrate and the accurate position of the processing groove.

[0004] However, this method based on multiple camera image sampling has some obvious problems and limitations in practical applications. First, since this method relies on image processing and edge detection algorithms, it is easily affected by environmental factors such as light changes, camera lens contamination, or wafer surface defects, which can lead to image quality degradation and affect the accuracy and stability of edge detection. Summary of the invention

[0005] The present application aims to solve at least one of the technical problems existing in the related art. To this end, the present application proposes a wafer substrate positioning device to solve the defects of low accuracy of the center position of the wafer substrate and the position of the processing groove on the wafer substrate in the existing wafer substrate processing.

[0006] A wafer substrate positioning device proposed in an embodiment of the present application includes: Device body; A deflection correction component, the deflection correction component is installed on the device body, the deflection correction component includes a deflection correction mounting frame, a rotating disk and a deflection correction sensor, the deflection correction mounting frame is installed on the device body, the rotating disk is rotatably connected to the deflection correction mounting frame, the rotating disk is used to place a wafer substrate to be positioned, the deflection correction sensor is installed on the deflection correction mounting frame, the deflection correction sensor is used to obtain a center deviation value between the wafer substrate and the rotating axis of the rotating disk, an angular deviation value between a line connecting the center of the wafer substrate and the rotation center of the rotating disk and a preset position of the rotating disk, and an azimuth deviation value between a machined groove of the wafer substrate and a preset position of the rotating disk; the rotating disk rotates the wafer substrate based on the angular deviation value; An adjustment mechanism is installed on the device body, the adjustment mechanism and the correction component are arranged relative to each other, the adjustment mechanism moves the wafer substrate based on the center deviation value; and the rotating disk rotates the wafer substrate based on the azimuth deviation value.

[0007] According to the wafer substrate positioning device of the embodiment of the present application, the accurate positioning of the wafer substrate is achieved through the coordinated work of the correction component and the adjustment mechanism. The correction component can collect the edge data of the wafer substrate and detect the deviation value, and the adjustment mechanism and the correction component can accurately adjust the wafer substrate according to these data, which effectively improves the accuracy and stability of the wafer substrate positioning, simplifies the structure and complexity of the positioning process, and reduces the production cost and maintenance difficulty.

[0008] According to one embodiment of the present application, the adjustment mechanism includes: a height moving component, a horizontal moving component, a mounting table, a driving component, a suction cup mounting plate, an adsorption component and a rotating component, wherein the height moving component is vertically mounted on the device body and can move along the Z direction of the device body; the mounting table is fixedly mounted on the first flange of the height moving component, the driving component is fixedly mounted on the mounting seat, and the rotating component is mounted on the second flange of the driving component; the horizontal moving component is horizontally fixedly mounted on the rotating component, and the horizontal moving component can move radially along the center of rotation of the driving component; the suction cup mounting plate is fixedly mounted on the third flange of the horizontal moving component, and the adsorption component is mounted on the suction cup mounting plate for adsorbing wafer substrates.

[0009] According to an embodiment of the present application, the preset position is arranged on a line between a rotating shaft of the rotating component and a rotating shaft of the rotating disk.

[0010] According to one embodiment of the present application, the adsorption component includes: An upper tooth fork suction cup, wherein the upper tooth fork suction cup is provided with an air suction port for adsorbing the wafer substrate; A middle tooth fork suction cup, wherein a suction groove is provided in the middle of the middle tooth fork suction cup; A lower tooth fork suction cup, wherein the lower tooth fork suction cup is provided with an air inlet; The air inlet is connected to the air source hole on the suction cup mounting plate, and the air inlet is connected to the air suction port through the air suction groove; after negative pressure air is introduced into the air source hole, a negative pressure state is present between the air inlet, the air suction groove and the air suction port.

[0011] According to one embodiment of the present application, a first sealant is provided between the lower fork suction cup and the middle fork suction cup, and a second sealant is provided between the middle fork suction cup and the upper fork suction cup.

[0012] According to one embodiment of the present application, the deviation correction assembly includes a direct drive motor, the direct drive motor is mounted on the deviation correction mounting frame, and the rotating disk is mounted on the fourth flange of the direct drive motor.

[0013] According to one embodiment of the present application, the correction assembly includes a rotary joint, an annular air groove is provided on the upper end surface of the rotating disk, an air vent is provided in the middle of the rotating disk, the rotary joint includes a rotary joint part and an air inlet part, the rotary joint part is rotatably connected to the air inlet part, the rotary joint part is fixedly connected to the air vent, the direct drive motor is provided with a hollow hole, the air inlet part is arranged in the hollow hole, the air inlet part, the rotary joint part, the air vent and the annular air groove are connected in sequence, and when negative pressure air is introduced into the air inlet part, the rotary joint part, the air vent and the annular air groove are in a negative pressure state.

[0014] According to one embodiment of the present application, the correction sensor has a transmitting end and a receiving end, the setting position of the transmitting end is higher than the setting position of the receiving end, and the wafer substrate is arranged between the transmitting end and the receiving end.

[0015] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the assembly structure of the wafer substrate positioning device provided in an embodiment of the present application.

[0018] Figure 2It is a schematic cross-sectional structural diagram of the rotating disk and the direct drive motor provided in the embodiment of the present application.

[0019] Figure 3 It is a schematic diagram of the explosion structure of the adsorption component provided in the embodiment of the present application.

[0020] Figure 4 It is a schematic diagram of the structure of the adsorption component provided in an embodiment of the present application.

[0021] Reference numerals: 1. Adjustment mechanism; 2. Direct drive motor; 21. Fourth flange; 22. Hollow hole; 3. Rotating disk; 31. Annular air groove; 32. Ventilation hole; 4. Deflection correction sensor; 41. Transmitter; 42. Receiving end; 5. Device body; 6. Deflection correction mounting frame; 7. Sensor fixing plate; 8. Wafer substrate; 81. Processing groove; 9. Rotary joint; 91. Rotary joint part; 92. Air inlet part; 11. Height moving component; 111. First flange; 12. Horizontal moving component; 121. Third flange; 13. Mounting platform; 14. Driving component; 141. Second flange; 15. Suction cup mounting plate; 151. Air source hole; 16. Adsorption component; 161. Upper tooth fork suction cup; 1611. Air suction port; 162. Middle tooth fork suction cup; 1621. Air suction groove; 163. Lower tooth fork suction cup; 1631. Air inlet; 164. First sealant; 165. Second sealant; 17. Rotating component. DETAILED DESCRIPTION

[0022] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0023] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0024] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, wherein the fixed connection can include an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0025] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0026] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0027] Combine the following Figures 1 to 4 The wafer substrate positioning device of the present application is described.

[0028] According to a wafer substrate positioning device proposed in an embodiment of the present application, please refer to Figures 1 to 4The wafer substrate positioning device includes: a device body 5, a deflection correction component and an adjustment mechanism 1, the deflection correction component is installed on the device body 5, the deflection correction component includes a deflection correction mounting frame 6, a rotating disk 3 and a deflection correction sensor 4, the deflection correction mounting frame 6 is installed on the device body 5, the rotating disk 3 is rotatably connected to the deflection correction mounting frame 6, the rotating disk 3 is used to place the wafer substrate 8 to be positioned, the deflection correction sensor 4 is installed on the deflection correction mounting frame 6, the deflection correction sensor 4 is used to obtain the center deviation value of the wafer substrate 8 and the rotating axis of the rotating disk 3, the angle deviation value of the connection line between the center of the wafer substrate and the rotation center of the rotating disk and the preset position of the rotating disk, and the azimuth deviation value of the processing groove 81 (V-shaped groove or flat groove) of the wafer substrate 8 and the preset position of the rotating disk 3; the rotating disk 3 rotates the wafer substrate 8 based on the angle deviation value; the adjustment mechanism 1 is installed on the device body 5, the adjustment mechanism 1 and the deflection correction component are arranged relatively, the adjustment mechanism 1 moves the wafer substrate 8 based on the center deviation value; the rotating disk 3 then rotates the wafer substrate 8 to the preset position based on the azimuth deviation value.

[0029] According to the wafer substrate positioning device of the embodiment of the present application, the accurate positioning of the wafer substrate 8 is achieved through the coordinated work of the correction component and the adjustment mechanism 1. The correction component can collect edge data of the wafer substrate 8 and detect the deviation value, and the adjustment mechanism 1 and the correction component can accurately adjust the wafer substrate 8 according to these data, which effectively improves the accuracy and stability of the positioning of the wafer substrate 8, simplifies the structure and complexity of the positioning process, and reduces the production cost and maintenance difficulty.

[0030] The device body 5 is the basic support structure of the entire wafer substrate positioning device, which can provide a stable working environment for the entire positioning process. The device body 5 can be one of the supporting mechanisms such as a base plate, a mounting base or a mounting platform 13.

[0031] The deflection correction mounting frame 6 is installed on the device body 5, and is used to fix and support other components in the deflection correction assembly (such as the rotating disk 3 and the deflection correction sensor 4). The rotating disk 3 is used to place the wafer substrate 8 to be positioned. The rotating disk 3 can rotate freely around its axis so that the deflection correction sensor 4 can obtain the data of the wafer substrate 8, and can also adjust the rotation angle of the wafer substrate 8 according to the data of the deflection correction sensor 4, thereby changing the position of the processed groove 81.

[0032] It should be noted that the processed groove 81 can be a V-groove (ie, Notch) or a flat groove. The wafer substrate positioning device of the present application can position both wafers with V-grooves and wafers with flat grooves.

[0033] When the wafer substrate 8 is placed on the rotating disk 3, there is a center deviation between the center of the wafer substrate 8 and the rotating axis of the rotating disk 3. The correction sensor 4 can detect the center deviation value between the wafer substrate 8 and the rotating axis of the rotating disk 3, and the angle deviation value between the center of the wafer substrate and the rotation center line of the rotating disk and the preset position of the rotating disk. The rotating disk 3 rotates the wafer substrate 8 based on the angle deviation value, and the adjustment mechanism 1 moves the wafer substrate 8 to the position of the rotating axis of the rotating disk 3 based on the center deviation value, so that the center positioning of the wafer substrate 8 is accurate.

[0034] When the wafer substrate 8 is placed on the rotating shaft of the rotating disk 3, there is an azimuth deviation value between the position of the processed groove 81 of the wafer substrate 8 and the preset position of the rotating disk 3. The correction sensor 4 can detect the azimuth deviation value between the processed groove 81 and the preset position, and the rotating disk 3 can rotate the wafer substrate 8 to the preset position based on the azimuth deviation value.

[0035] According to one embodiment of the present application, the adjustment mechanism 1 includes: a height movement component 11, a horizontal movement component 12, a mounting table 13, a driving component 14, a suction cup mounting plate 15, an adsorption component 16 and a rotating component 17. The height movement component 11 is vertically mounted on the device body 5 and can move along the Z direction of the device body 5; the mounting table 13 is fixedly mounted on the first flange 111 of the height movement component 11, the driving component 14 is fixedly mounted on the mounting seat 13, and the rotating component 17 is mounted on the second flange 141 of the driving component 14; the horizontal movement component 12 is horizontally fixedly mounted on the rotating component 17, and the horizontal movement component 12 can move radially along the rotation center of the driving component 14; the suction cup mounting plate 15 is fixedly mounted on the third flange 121 of the horizontal movement component 12, and the adsorption component 16 is mounted on the suction cup mounting plate 15 for adsorbing the wafer substrate 8.

[0036] The horizontal moving assembly 12 is responsible for moving the wafer substrate 8 in the horizontal direction, and the suction cup mounting plate can smoothly slide on the predetermined track of the horizontal moving assembly 12 .

[0037] The adsorption component 16 can firmly adsorb the wafer substrate 8 so as to maintain its stability and accuracy during the movement. At the same time, the adsorption component 16 also needs to have the ability to quickly release the wafer substrate 8 so that the wafer substrate 8 can be smoothly delivered to the next process after positioning is completed.

[0038] In this embodiment, the adsorption component 16 adopts vacuum adsorption, wherein the vacuum adsorption adsorbs the wafer substrate 8 by generating negative pressure.

[0039] It is understandable that the cooperation between the horizontal moving assembly 12 and the adsorption component 16 can realize the precise horizontal movement and positioning of the wafer substrate 8. This helps to ensure the stability and accuracy of the wafer substrate 8 during the processing, thereby improving product quality and production efficiency.

[0040] The adjustment mechanism 1 includes a height moving component 11 and a rotation component, which can realize the precise movement and positioning of the wafer substrate 8 in three-dimensional space. The height moving component 11 is responsible for moving the wafer substrate 8 in the vertical direction. The rotation component is responsible for rotating the wafer substrate 8 in the horizontal plane to adjust its direction or angle.

[0041] The mounting platform 13 is mounted on the first flange 111 of the height moving component 11. The driving component 14 is the power source of the rotating component. It is mounted on the mounting platform 13 and drives the rotating component 17 to rotate. The rotating component 17 is connected to the output shaft 141 of the driving component 14 and can rotate relative to the mounting platform 13. The horizontal moving component 12 is horizontally mounted on the rotating component 17 so that the adsorption component 16 can slide along the radial direction of the rotating component 17.

[0042] It can be understood that, through the coordinated operation of the height moving component 11 and the rotating component, the adjustment mechanism 1 can achieve precise movement and positioning of the wafer substrate 8 in three-dimensional space.

[0043] It can be understood that the height moving assembly 11, the rotating assembly and the horizontal moving assembly 12 are connected by flanges, so that the connection between the components is more stable and reliable, avoiding problems such as reduced positioning accuracy or equipment damage caused by loose connections or misalignment. At the same time, the flange connection also ensures precise alignment between the components, thereby improving the accuracy and stability of the positioning of the wafer substrate 8.

[0044] According to one embodiment of the present application, the preset position is set on the line between the rotation axis of the rotating component 17 and the rotation axis of the rotating disk 3. It can be understood that the preset position in the adjustment mechanism 1 is set on the line between the rotation axis of the rotating component 17 and the rotation axis of the rotating disk 3, which can ensure that the processing groove 81 of the wafer substrate 8 is accurately positioned.

[0045] According to one embodiment of the present application, the adsorption component 16 includes: an upper fork suction cup 161, a middle fork suction cup 162 and a lower fork suction cup 163. The upper fork suction cup 161 is provided with an air suction port 1611 for adsorbing the wafer substrate 8; the middle fork suction cup 162 is provided with an air suction groove 1621 in the middle; the lower fork suction cup 163 is provided with an air inlet 1631; the air inlet 1631 is connected to the air source hole 151 on the suction cup mounting plate 15, and the air inlet 1631 is connected to the air suction port 1611 through the air suction groove 1621; after negative pressure air is introduced into the air source hole 151, a negative pressure state is present between the air inlet 1631, the air suction groove 1621 and the air suction port 1611.

[0046] It is understandable that the upper fork suction cup 161 is located at the top of the adsorption component 16 and directly contacts the wafer substrate 8. A plurality of suction ports 1611 are provided thereon, and these suction ports 1611 can generate a strong adsorption force under the action of negative pressure gas, and firmly adsorb the wafer substrate 8 on the upper fork suction cup 161. The number and distribution of the suction ports 1611 can be optimized and designed according to the size and weight of the wafer substrate 8 to ensure uniformity and stability of adsorption.

[0047] The middle tooth fork suction cup 162 is located between the upper tooth fork suction cup 161 and the lower tooth fork suction cup 163, and plays the role of connecting and transmitting negative pressure air. There is an air suction groove 1621 in the middle, and these air suction grooves 1621 are connected to the air suction port 1611 of the upper tooth fork suction cup 161 to form a flow path for negative pressure air.

[0048] The lower fork suction cup 163 is located at the bottom of the suction component 16 and is connected to the suction cup mounting plate 15. An air inlet 1631 is opened thereon, and these air inlet 1631 are connected to the air source hole 151 on the suction cup mounting plate 15. When negative pressure air is passed into the air source hole 151, a negative pressure state is formed between the air inlet 1631, the suction groove 1621 and the suction port 1611, thereby generating a suction force.

[0049] The adsorption component 16 in the embodiment of the present application adopts a three-stage fork suction cup design, and achieves stable adsorption and precise positioning of the wafer substrate 8 by precisely controlling the supply and flow path of the negative pressure gas. This not only improves the stability and reliability of adsorption, but also optimizes the adsorption effect, which can meet the requirements of different processing needs and application scenarios.

[0050] According to an embodiment of the present application, a first sealant 164 is provided between the lower fork suction cup 163 and the middle fork suction cup 162 , and a second sealant 165 is provided between the middle fork suction cup 162 and the upper fork suction cup 161 .

[0051] It can be understood that in the adsorption component 16, the first sealant 164 and the second sealant 165 are respectively arranged between the lower fork suction cup 163 and the middle fork suction cup 162, and between the middle fork suction cup 162 and the upper fork suction cup 161, so as to enhance the sealing performance of the adsorption component 16 and ensure the stable supply of negative pressure gas and the reliability of the adsorption effect.

[0052] The main function of the first sealant 164 and the second sealant 165 is to prevent the negative pressure gas from leaking inside the adsorption component 16, thereby ensuring the stable supply of negative pressure gas and the continuous effect of adsorption force. They can fill the tiny gaps between the adsorption components 16 to form an effective sealing barrier.

[0053] According to one embodiment of the present application, the deviation correction assembly includes a direct drive motor 2 , the direct drive motor 2 is mounted on a deviation correction mounting frame 6 , and the rotating disk 3 is mounted on a fourth flange 21 of the direct drive motor 2 .

[0054] It can be understood that the direct drive motor 2 is a driving device that directly converts electrical energy into mechanical energy, and has the advantages of high precision, high efficiency, low noise and low maintenance cost. In this embodiment, the direct drive motor 2 is mounted on the deviation correction mounting frame 6, and the rotating disk 3 is mounted on the fourth flange 21 of the direct drive motor 2. The rotation and deviation correction functions are realized by the drive of the direct drive motor 2, and the precise deviation correction of the wafer substrate 8 during the rotation process is realized.

[0055] According to one embodiment of the present application, the correction component includes a rotary joint 9, an annular air groove 31 is provided on the upper end surface of the rotating disk 3, and an air vent 32 is provided in the middle of the rotating disk 3. The rotary joint 9 includes a rotary joint part 91 and an air inlet part 92. The rotary joint part 91 is rotatably connected to the air inlet part 92, and the rotary joint part 91 is fixedly connected to the air vent 32. The direct drive motor 2 is provided with a hollow hole 22, and the air inlet part 92 is arranged in the hollow hole 22. The air inlet part 92, the rotary joint part 91, the air vent 32 and the annular air groove 31 are connected in sequence. When negative pressure air is introduced into the air inlet part 92, the rotary joint part 91, the air vent 32 and the annular air groove 31 are in a negative pressure state.

[0056] It is understandable that the rotary joint 9 is a device capable of maintaining fluid (such as gas, liquid) transmission during rotation. In this embodiment, the rotary joint 9 is used in the deviation correction component to achieve stable transmission of negative pressure gas and negative pressure adsorption of the wafer substrate 8.

[0057] The rotary joint part 91 is fixedly connected to the vent hole 32 on the rotating disk 3, and is used to transmit the negative pressure gas from the air inlet part 92 to the vent hole 32. The design of the rotary joint part 91 needs to take into account the sealing performance and transmission efficiency during the rotation process. The air inlet part 92 is located in the hollow hole 22 of the direct drive motor 2 and is rotatably connected to the rotary joint part 91. The air inlet part 92 is connected to an external negative pressure gas source to transmit the negative pressure gas to the rotary joint part 91. The annular air groove 31 is an annular groove arranged on the upper end surface of the rotating disk 3, which is connected to the vent hole 32. When negative pressure gas is passed into the air inlet part 92, a negative pressure state is formed in the annular air groove 31, which is used to adsorb the wafer substrate 8.

[0058] When the external negative pressure gas source introduces negative pressure gas into the rotary joint 9 through the air inlet 92, the negative pressure gas sequentially passes through the air inlet 92, the rotary joint 91, the vent hole 32 and the annular air groove 31 to form a negative pressure state. Under the action of the negative pressure gas, a strong adsorption force is formed in the annular air groove 31, which firmly adsorbs the wafer substrate 8 on the rotating disk 3, which not only improves the positioning accuracy and stability, but also simplifies the structure, reduces the cost, and optimizes the processing efficiency.

[0059] According to an embodiment of the present application, the correction sensor 4 has a transmitting end 41 and a receiving end 42 , the transmitting end 41 is arranged at a position higher than the receiving end 42 , and the wafer substrate 8 is arranged between the transmitting end 41 and the receiving end 42 .

[0060] It can be understood that the deflection correction sensor 4 has a transmitting end 41 and a receiving end 42, which are arranged at a certain height difference in the vertical direction, and the wafer substrate 8 is arranged between the transmitting end 41 and the receiving end 42. The transmitting end 41 is responsible for transmitting the laser signal, and the receiving end 42 is responsible for receiving the laser signal that is not blocked by the wafer substrate. The transmitting end 41 is arranged at a higher position than the receiving end 42.

[0061] In one embodiment, the correction assembly includes a sensor fixing plate 7, which is installed on the upper side of the correction mounting frame 6, the transmitting end 41 of the correction sensor 4 is installed on the upper end of the sensor fixing plate 7, and the receiving end 42 of the correction sensor 4 is installed on the lower end of the sensor mounting plate.

[0062] The wafer substrate positioning device of the present application is described below in conjunction with a specific embodiment: Negative pressure gas is introduced into the gas source hole 151 on the adjustment mechanism 1 to adsorb the wafer substrate 8; the driving component 14 of the adjustment mechanism 1 rotates, and the moving direction of the horizontal moving component 12 is adjusted to the line connecting the rotation center of the driving component 14 and the rotation center of the rotating disk 3, so that the wafer substrate 8 is located between the rotation center of the driving component 14 and the rotation center of the rotating disk 3; the height moving component 11 moves upward, and the horizontal moving component 12 moves toward the direction of the rotation center of the rotating disk 3, and the wafer substrate 8 is moved to the top of the rotating disk 3, and the height moving component 11 descends to place the wafer substrate 8 on the rotating disk 3; Negative pressure gas is introduced into the air inlet 92 of the rotary joint 9 to adsorb the wafer substrate 8; the negative pressure gas on the air source hole 151 on the adjustment mechanism 1 is disconnected, and the height moving component 11 descends to disengage the adsorption component 16 from the wafer substrate 8; the horizontal moving component 12 retracts; the direct drive motor 2 rotates to drive the wafer substrate 8 to rotate, and at the same time, the correction sensor 4 starts to collect edge data of the wafer substrate 8, processes the data, and obtains the center position deviation and angle deviation of the wafer substrate 8 and the rotation center of the rotating disk 3, as well as the bottom angle position of the processing groove 81 of the wafer substrate 8; According to the measurement results, the direct drive motor 2 rotates to turn the center of the wafer substrate 8 to the line connecting the rotation center of the driving component 14 and the rotation center of the rotating disk 3, and between the rotation center of the driving component 14 and the rotation center of the rotating disk 3; the horizontal moving component 12 moves to the direction of the rotation center of the rotating disk 3 to the bottom of the wafer substrate 8, and the height moving component 11 moves upward, so that the upper fork suction cup 161 of the adsorption component 16 contacts the wafer substrate 8, and the air source hole 151 passes negative pressure air to adsorb the wafer substrate 8; The air inlet 92 of the rotary joint 9 disconnects the negative pressure gas; the height moving component 11 moves upward to disengage the wafer substrate 8 from the rotating disk 3; the horizontal moving component 12 moves in the direction of the rotation center of the rotating disk 3 by the above-mentioned center position deviation value to adjust the wafer substrate 8 and the rotating disk 3 concentrically, the height moving component 11 descends, and the wafer substrate 8 is placed on the rotating disk 3; the air inlet 92 of the rotary joint 9 introduces negative pressure gas to adsorb the wafer substrate 8; the negative pressure gas on the air source hole 151 on the adjustment mechanism 1 is disconnected, the height moving component 11 descends, and the adsorption component 16 is disengaged from the wafer substrate 8; the horizontal moving component 12 retreats; according to the measurement result, the direct drive motor 2 rotates to turn the bottom of the processing groove 81 of the wafer substrate 8 of the wafer substrate 8 to the line connecting the rotation center of the driving component 14 and the rotation center of the rotating disk 3, thereby completing the center and angle adjustment of the wafer substrate 8.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer substrate positioning device, characterized in that: include: Device body (5); A deflection correction component, the deflection correction component is mounted on the device body (5), the deflection correction component comprises a deflection correction mounting frame (6), a rotating disk (3) and a deflection correction sensor (4), the deflection correction mounting frame (6) is mounted on the device body (5), the rotating disk (3) is rotatably connected to the deflection correction mounting frame (6), the rotating disk (3) is used to place a wafer substrate (8) to be positioned, the deflection correction sensor (4) is mounted on the deflection correction mounting frame (6), the deflection correction sensor (4) is used to obtain a center deviation value between the wafer substrate (8) and a rotating shaft of the rotating disk (3), an angular deviation value between a line connecting the center of the wafer substrate (8) and the rotation center of the rotating disk (3) and a preset position of the rotating disk (3), and an azimuth deviation value between a machined groove (81) of the wafer substrate (8) and a preset position of the rotating disk (3); the rotating disk (3) rotates the wafer substrate (8) based on the angular deviation value; An adjustment mechanism (1), the adjustment mechanism (1) being mounted on the device body (5), the adjustment mechanism (1) and the deviation correction component being arranged relative to each other, the adjustment mechanism (1) moving the wafer substrate (8) based on the center deviation value; and the rotating disk (3) rotating the wafer substrate (8) based on the azimuth deviation value.

2. The wafer substrate positioning device according to claim 1, characterized in that: The adjustment mechanism (1) comprises: a height moving component (11), a horizontal moving component (12), a mounting platform (13), a driving component (14), a suction cup mounting plate (15), an adsorption component (16) and a rotating component (17); the height moving component (11) is vertically mounted on the device body (5) and can move along the Z direction of the device body (5); the mounting platform (13) is fixedly mounted on a first flange (111) of the height moving component (11); and the driving component (14) is fixedly mounted on the mounting seat ( 13), the rotating component (17) is mounted on the second flange (141) of the driving component (14); the horizontal moving component (12) is horizontally fixedly mounted on the rotating component (17), and the horizontal moving component (12) can move radially along the rotation center of the driving component (14); the suction cup mounting plate (15) is fixedly mounted on the third flange (121) of the horizontal moving component (12), and the adsorption component (16) is mounted on the suction cup mounting plate (15) for adsorbing the wafer substrate (8).

3. The wafer substrate positioning device according to claim 2, characterized in that: The preset position is arranged on a line between the rotating shaft of the rotating component (17) and the rotating shaft of the rotating disk (3).

4. The wafer substrate positioning device according to claim 2, characterized in that: The adsorption component (16) comprises: An upper tooth fork suction cup (161), wherein the upper tooth fork suction cup (161) is provided with an air suction port (1611) for adsorbing the wafer substrate (8); A middle tooth fork suction cup (162), wherein an air suction groove (1621) is provided in the middle of the middle tooth fork suction cup (162); A lower tooth fork suction cup (163), wherein the lower tooth fork suction cup (163) is provided with an air inlet (1631); The air inlet (1631) is in communication with the air source hole (151) on the suction cup mounting plate (15), and the air inlet (1631) is in communication with the air inlet (1611) via the air suction groove (1621); after negative pressure air is introduced into the air source hole (151), a negative pressure state is present between the air inlet (1631), the air suction groove (1621) and the air suction port (1611).

5. The wafer substrate positioning device according to claim 4, characterized in that: A first sealant (164) is provided between the lower tooth fork suction cup (163) and the middle tooth fork suction cup (162), and a second sealant (165) is provided between the middle tooth fork suction cup (162) and the upper tooth fork suction cup (161).

6. The wafer substrate positioning device according to any one of claims 1 to 5, characterized in that: The deviation correction component comprises a direct drive motor (2), the direct drive motor (2) is mounted on the deviation correction mounting frame (6), and the rotating disk (3) is mounted on a fourth flange (21) of the direct drive motor (2).

7. The wafer substrate positioning device according to claim 6, characterized in that: The deviation correction component comprises a rotary joint (9), an annular air groove (31) is provided on the upper end surface of the rotary disk (3), an air vent (32) is provided in the middle of the rotary disk (3), the rotary joint (9) comprises a rotary joint portion (91) and an air inlet portion (92), the rotary joint portion (91) is rotatably connected to the air inlet portion (92), the rotary joint portion (91) is fixedly connected to the air vent (32), the direct drive motor (2) is provided with a hollow hole (22), the air inlet portion (92) is arranged in the hollow hole (22), the air inlet portion (92), the air inlet portion (92), the air vent (32) and the annular air groove (31) are connected in sequence, and when negative pressure air is introduced into the air inlet portion (92), the rotary joint portion (91), the air vent (32) and the annular air groove (31) are in a negative pressure state.

8. The wafer substrate positioning device according to any one of claims 1 to 5, characterized in that: The deflection correction sensor (4) comprises a transmitting end (41) and a receiving end (42); the transmitting end (41) is arranged at a position higher than the receiving end (42); and the wafer substrate (8) is arranged between the transmitting end (41) and the receiving end (42).

Images