Wafer overturning clamping jaw and wafer overturning device thereof

Abstract

The invention relates to a wafer overturning clamping jaw and a wafer overturning device thereof, the wafer overturning clamping jaw comprises an overturning motor, a chuck, an auxiliary clamping jaw and a wafer overturning clamping jaw, the wafer overturning clamping jaw comprises a clamping jaw main body and a base, the clamping jaw main body is provided with a fixed clamping groove along the length direction to clamp a wafer, the bottom wall of the fixed clamping groove is arc-shaped, and the clamping jaw main body is provided with an arc-shaped clamping groove; when the wafer is contacted and stressed, the stress angle is changed, the abrasion of the fixed clamping groove is reduced, and the material of the clamping jaw main body is improved to be carbon-doped PEEK, so that the hardness of the wafer overturning clamping jaw is improved, and the abrasion of the clamping groove of the wafer overturning clamping jaw is reduced. Moreover, the overturning piece rotates towards the outside of the clamping jaw main body along with the rotation of the chuck in the vertical direction, the wafer is pushed to quickly slide in the fixed clamping groove, and the situation that the wafer is clamped in the fixed clamping groove, and consequently the position of the wafer deviates is avoided.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular to a wafer flipping claw and a wafer flipping device thereof. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. In the manufacturing process of wafers, chemical mechanical polishing is an indispensable process. In chemical mechanical polishing, the flipping action of the wafer is one of the most common actions.

[0003] In the prior art, a wafer flip chuck is used in conjunction with a clamping claw to turn the wafer from a vertical state to a horizontal state. However, the clamping groove of the clamping claw is a right-angled surface. When the wafer is grasped and subjected to force, indentations are easily generated, causing wear of the clamping claw, resulting in the position of the wafer being shifted, thereby causing the wafer flipping device to alarm and making production impossible. Summary of the invention

[0004] In view of this, the present application proposes a wafer flipping claw and a wafer flipping device thereof.

[0005] According to one aspect of the present application, there is provided a wafer flipping claw, comprising: a claw body and a base;

[0006] One end of the claw body in the length direction is a suspended end, and the other end is a fixed end, and the fixed end is connected to the base; and

[0007] The claw body is provided with a fixed slot along the length direction, the bottom wall cross-section of the fixed slot is arc-shaped, and when the length direction of the claw body is kept horizontal, the vertical height of the fixed slot away from the rotating part is higher than the vertical height of the fixed slot away from the fixed part.

[0008] In a possible implementation, a side of the fixed slot away from the fixing portion is a first abutting side, a cross section of the first abutting side is an arc-shaped structure, and the first abutting side is smoothly connected to the bottom wall of the fixed slot;

[0009] A side of the fixed slot away from the first rotating portion is a second abutting side, and a cross section of the first abutting side is a straight structure.

[0010] In a possible implementation, the curvature angle of the bottom wall of the fixed slot is in the range of 40 degrees to 50 degrees.

[0011] In a possible implementation, the jaw body is made of carbon-doped PEEK material.

[0012] In a possible implementation, the base is a columnar structure as a whole, one end of which is connected to the fixed end in the length direction, and the other end is suitable for connecting to one side of the chuck; and

[0013] The body length of the base is in the range of 2cm-3cm;

[0014] A first magnet is embedded in the side wall of the base.

[0015] In a possible implementation, the invention further comprises: a flipping piece; the flipping piece is sleeved on the outside of the claw body, and the flipping piece is rotatably connected to the claw body around the suspended end;

[0016] Wherein, the side of the flip member adjacent to the claw body is a push side, and the push side is provided with a mounting groove, and the mounting groove matches the claw body; and

[0017] When the flipping member rotates to the outside of the claw body, the bottom wall of the mounting slot abuts against the claw body, and the pushing side covers the bottom wall of the fixed slot.

[0018] In a possible implementation, one end of the flip member and the claw body that rotates is a rotating end, and the other end is a magnetic end, and the rotating end and the magnetic end are respectively located at two ends of the flip member in the length direction;

[0019] The magnetic end is provided with an avoidance hole, and the avoidance hole is adapted to the base; and

[0020] A second magnet is embedded in the magnetic end near the avoidance hole, and the flip part is magnetically connected to the base.

[0021] In a possible implementation, the cross section of the pushing side is a straight structure;

[0022] The push side is arranged to be tilted downward from the magnetic end toward the second rotating part; and

[0023] When the flip member is magnetically connected to the base, the length direction of the push probe is inclined to the length direction of the base, and a preset first angle between the length direction of the push probe and the length direction of the base is greater than the arc angle of the bottom wall of the fixed slot.

[0024] A wafer flipping device comprises the wafer flipping claws described above, and further comprises: a flipping motor, a chuck and an auxiliary claw;

[0025] The output end of the flip motor is arranged horizontally;

[0026] The chuck is a hollow annular structure suitable for matching wafers; the edge of the chuck is connected to the output end of the flip motor and rotates in the vertical direction around the output end of the flip motor;

[0027] The auxiliary claw is arranged on the chuck and is located on the same side as the wafer flipping claw, and the auxiliary claw and the wafer flipping claw are symmetrically arranged on both sides of the chuck in the vertical direction, and the number of the auxiliary claws is set to more than two, and the number of the wafer flipping claws is equal to the number of the auxiliary claws.

[0028] In a possible implementation, the wafer flipping claw comprises: a claw body, a base and a flipping member;

[0029] The length direction of the base is perpendicular to the plate surface of the chuck;

[0030] The claw body is provided with a fixed slot along the length direction, the bottom wall of the fixed slot is arc-shaped, and the connecting line of the two ends of the fixed slot in the length direction has an angle with the plate surface of the chuck, and is tilted toward the outside of the chuck; and

[0031] When the chuck is flipped to a vertical state and the wafer flip claw is located at the bottom of the chuck, the first magnet is magnetically connected to the second magnet, the flipping member rotates to the outside of the claw body, and the pushing side of the claw body covers the bottom wall of the fixed slot.

[0032] The beneficial effects of the wafer flip claw of the embodiment of the present application are as follows: 1. The material of the wafer flip claw is improved from PVC (polyvinyl chloride) to carbon-doped PEEK (polyetheretherketone) material, which improves the hardness of the wafer flip claw and reduces the wear of the wafer flip claw. 2. The wafer flip claw is used to clamp the bottom wall of the fixed slot for wafer flipping, which is optimized from a flat surface to a curved surface with an arc, and the wear of the fixed slot is reduced by changing the force angle when the wafer is in contact with the force. 3. A flip piece is provided at one end of the claw body away from the chuck, and the flip piece rotates toward the outside of the claw body as the chuck rotates in the vertical direction, pushing the wafer to slide quickly in the fixed slot, avoiding the wafer from getting stuck in the fixed slot, causing the position of the wafer to shift. In this way, by improving the material of the wafer flip claw to increase the hardness, optimizing the fixed slot structure of the wafer flip claw, changing the force angle between the wafer and the fixed slot, adding a flip piece to accelerate the sliding of the wafer on the wafer flip claw to avoid getting stuck.

[0033] Other features and aspects of the present application will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the present application and, together with the description, serve to explain the principles of the present application.

[0035] Figure 1 A schematic diagram showing the main structure of the wafer flipping claw of an embodiment of the present application is shown;

[0036] Figure 2 Another schematic diagram of the main structure of the wafer flipping claw according to an embodiment of the present application is shown;

[0037] Figure 3 Another schematic diagram of the main structure of the wafer flipping claw according to an embodiment of the present application is shown;

[0038] Figure 4 A schematic diagram showing the main structure of the wafer flipping device when the chuck of the embodiment of the present application is in a vertical state;

[0039] Figure 5 A schematic diagram showing the main structure of the wafer flipping device when the chuck of the embodiment of the present application is in a flipped state;

[0040] Figure 6 A schematic diagram showing the main structure of the wafer flipping device when the chuck of the embodiment of the present application is in a horizontal state. DETAILED DESCRIPTION

[0041] Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0042] Among them, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention or simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0045] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0046] Figure 1 A schematic diagram showing the main structure of the wafer flipping claw of an embodiment of the present application is shown. Figure 2 Another main structural diagram of the wafer flipping claw of the embodiment of the present application is shown, Figure 3 Another schematic diagram of the main structure of the wafer flipping claw of the embodiment of the present application is shown. Figure 1 , Figure 2 and Figure 3 As shown, the wafer flipping claw of the embodiment of the present application includes: a claw body 110 and a base 120, one end of the claw body 110 in the length direction is a suspended end 114, and the other end is a fixed end 115, and the fixed end 115 is connected to the base 120. The claw body 110 is provided with a fixed card slot 111 along the length direction, and the bottom wall cross section of the fixed card slot 111 is arc-shaped, and when the length direction of the claw body 110 is kept in a horizontal state, the vertical height of the fixed card slot 111 away from the rotating part is higher than the vertical height of the fixed card slot 111 away from the fixed part.

[0047] The length direction of the base 120 is perpendicular to the plate surface direction of the chuck 200 .

[0048] In this specific embodiment, the bottom wall of the fixed slot 111 opened on the claw body 110 is changed from a straight cross-section structure to a curved structure, so that when the claw body 110 flips the wafer 400, the plate surface of the wafer 400 and the bottom wall of the fixed slot 111 are changed from a vertical angle of 90 degrees to an acute angle less than 90 degrees, thereby dispersing the force perpendicular to the bottom wall of the fixed slot 111 into a force perpendicular to the bottom wall of the fixed slot 111 and a force parallel to the bottom wall of the fixed slot 111, thereby reducing the force applied by the wafer 400 to the fixed slot 111, reducing the wear on the claw body 110, extending the service life of the wafer flipping claw 100, and avoiding the wafer 400 from shaking and deflecting inside the fixed slot 111 opened in the wafer flipping claw 100 during the flipping process of the wafer 400.

[0049] When the plate surface of the chuck 200 is in a vertical state, the length direction of the claw body 110 of the wafer flip claw 100 is perpendicular to the plate surface of the chuck 200. At this time, the vertical height of the fixed card slot 111 away from the rotating part is higher than the vertical height of the fixed card slot 111 away from the fixed part, so that the wafer 400 is located on the side of the fixed card slot 111 away from the fixed part. When the chuck 200 is flipped and the plate surface is in a horizontal state, at this time, the side of the fixed card slot 111 away from the rotating part is located above the side of the fixed card slot 111 away from the fixed part, so that the wafer 400 slides from the side of the fixed card slot 111 away from the fixed part to the side away from the rotating part, completing the flipping of the wafer 400.

[0050] Example 1

[0051] See also Figure 1 , Figure 2 and Figure 3 In a specific embodiment, the side of the fixed slot 111 away from the fixed portion is the first abutting side 112, and the cross section of the first abutting side 112 is an arc-shaped structure, and is smoothly connected to the bottom wall of the fixed slot 111 with an arc-shaped cross section. In this way, when the chuck 200 is installed with the wafer 400 and is in a vertical state, the edge of the wafer 400 is clamped at the connection position of the first abutting side 112 and the bottom wall of the fixed slot 111 which is lower in the vertical direction. Since the cross section of the first abutting side 112 is an arc-shaped, and the cross section of the connection position of the first abutting side 112 and the bottom wall of the fixed slot 111 is also an arc-shaped, at this time, the gravity direction of the wafer 400 is decomposed into the tangent direction of the connection position of the first abutting side 112 and the bottom wall of the fixed slot 111, and the direction perpendicular to the tangent. In this way, the gravity of the wafer 400 is also decomposed into two parts, namely the force pressing on the fixed slot 111 in the tangential direction and the force pressing on the fixed slot 111 in the vertical direction, thereby reducing the force exerted on the wafer 400 on the fixed slot 111 and reducing the wear on the claw body 110.

[0052] Furthermore, in this specific embodiment, the first abutting side 112 is smoothly connected to the connection position of the fixed slot 111, and the cross-section is arc-shaped, which can enable the wafer 400 to slide quickly from the connection position of the first abutting side 112 and the fixed slot 111 to the bottom wall of the fixed slot 111, ensuring that the wafer 400 will not get stuck.

[0053] In a specific embodiment, the cross-section of the second abutting side 113 is a flat structure. When the wafer flipping claw 100 and the wafer 400 are flipped from a vertical state to a horizontal state along with the chuck 200, the wafer 400 slides from the position where the first abutting side 112 is connected to the bottom wall of the fixed slot 111 to the second abutting side 113. The second abutting side 113 with a flat structure in cross-section can enable the wafer 400 to be stably placed on the first wafer flipping claw 100 in a horizontal state.

[0054] Furthermore, in this specific embodiment, the second abutting side 113 is tilted downward toward one end of the original fixed slot 111. When the chuck 200 is flipped to a horizontal state, the second abutting side 113 of a straight structure is tilted downward toward the center point of the chuck 200, so that the gravity direction of the wafer 400 is decomposed into a direction along the plate surface of the second contact side and a direction perpendicular to the plate surface of the second abutting side 113. In this way, the force decomposed into the direction perpendicular to the plate surface of the second abutting side 113 makes the wafer 400 have a tendency to slide toward the center point of the chuck 200, which plays a role in fixing the wafer 400 after the chuck 200 is flipped to a horizontal state, and ensures that the plate surface of the wafer 400 remains in a horizontal state at this time.

[0055] In a specific embodiment, the claw body 110 is made of PEEK material doped with carbon to increase the hardness of the claw body 110 , thereby reducing the wear of the wafer 400 on the fixed slot 111 .

[0056] In a specific embodiment, the fixing portion of the jaw body 110 is connected to the chuck 200 through the base 120, so that the fixing slot 111 provided on the jaw body 110 is spaced apart from the plate surface of the chuck 200. In this way, when the wafer 400 is mounted inside the fixing slot 111 on the chuck 200, a gap is left between the plate surface of the wafer 400 and the plate surface of the chuck 200, so that the wafer 400 can be easily mounted and removed from the chuck 200.

[0057] The flipping process of the wafer 400: 1. When the plate surface of the chuck 200 is in a vertical state, the wafer 400 is clamped in the fixed slot 111 of the wafer flipping claw 100. At this time, the edge of the wafer 400 is located at the connection position between the first abutting side 112 and the bottom wall of the fixed slot 111. 2. When the plate surface of the chuck 200 is flipped from a vertical state to a horizontal state, the chuck 200 and the wafer 400 are both in an inclined state. At this time, the edge of the wafer 400 is located on the bottom wall of the fixed slot 111. 3. When the plate surface of the chuck 200 is in a horizontal position, the edge of the wafer 400 slides to the second abutting side 113.

[0058] Example 2

[0059] Also included is a turning piece 130 .

[0060] See also Figure 1 , Figure 2 and Figure 3In a specific embodiment, the flip member 130 is sleeved on the outside of the claw body 110, and the flip member 130 can be rotatably connected with the claw body 110 around the suspended end 114 of the claw body 110, and the flip member 130 is used to push the wafer 400 to slide from the first abutting side 112 of the fixed slot 111 to the second abutting side 113. Specifically, a mounting groove 131 is opened on one side of the length direction of the flip member 130, which can be sleeved on the outside of the claw body 110, and the side of the flip member 130 with the mounting groove 131 is the pushing side. When the flip member 130 rotates to the outside of the claw body 110, the pushing side of the flip member 130 can push the edge of the wafer 400 to slide from the first abutting side 112 of the fixed slot 111 to the second abutting side 113, so as to prevent the wafer 400 from being stuck inside the fixed slot 111, causing the position of the wafer 400 to be offset, thereby causing the wafer 400 flip device to alarm and unable to produce.

[0061] Furthermore, in this specific embodiment, the distance between the bottom wall of the fixed slot 111 and the side of the claw body 110 away from the pushing side is less than the opening depth of the installation slot 131. In this way, when the plate surface of the chuck 200 is flipped from the vertical state to the horizontal state, the flip member 130 flips toward the claw body 110, and the pushing side of the flip member 130 gradually covers the outside of the bottom wall of the fixed slot 111, pushing the wafer 400 to slide from the first abutting side 112 of the fixed slot 111 to the second abutting side 113, accelerating the movement of the wafer 400 inside the fixed slot 111, avoiding jamming, and ensuring that the wafer 400 can slide from the first abutting side 112 of the fixed slot 111 to the second abutting side 113.

[0062] In a specific embodiment, one end of the flip member 130 that is rotatably connected to the claw body 110 is a rotating end 133, a first rotating hole is provided at the rotating end 133 of the flip member 130, and a second rotating hole is provided at the suspended end 114 of the claw body 110, and the first rotating hole matches the second rotating hole. In this way, the use shaft is embedded in the first rotating hole and the second rotating hole, so that the flip member 130 can rotate around the suspended end 114 of the claw body 110.

[0063] In a specific embodiment, the body length of the flip member 130 is greater than the body length of the claw body 110. Therefore, an avoidance hole 132 matching the base 120 is opened at the end of the flip member 130 away from the rotating end 133 to prevent the flip member 130 from contacting the base 120 in advance and failing to push the wafer 400 to slide.

[0064] Further, in this specific embodiment, the opening direction of the avoidance hole 132 is perpendicular to the opening direction of the installation groove 131, and the avoidance hole 132 is connected to the installation groove 131. Specifically, the avoidance hole 132 is a square hole, which matches the base 120 of the columnar structure, can avoid the base 120, prevent the flip member 130 from contacting the base 120, and block the rotation of the flip member 130.

[0065] In a specific embodiment, the end of the flip member 130 away from the rotating end 133 is a magnetic end 134, and a magnet is embedded in the magnetic end 134 of the flip member 130 to magnetically connect the flip member 130 to the base 120. In this way, during the rotation of the chuck 200, the flip member 130 and the base 120 attract each other, which can accelerate the pushing of the flip member 130 and the sliding of the wafer 400.

[0066] Furthermore, in this specific embodiment, a second magnet 135 is embedded on the magnetic end 134 at a position where an avoidance hole 132 is opened, and a first magnet is embedded on the side wall of the base 120 and adjacent to the flip member 130. When the flip member 130 rotates toward the claw body 110, the first magnet and the second magnet 135 attract each other, thereby accelerating the rotation speed of the flip member 130 toward the claw body 110, so that the wafer 400 can quickly slide from the first abutting side 112 of the fixed slot 111 to the second abutting side 113 of the fixed slot 111.

[0067] In a specific embodiment, the cross section of the push side of the flip member 130 is a straight structure. When the flip member 130 flips the outside of the straight claw body 110 and the claw body 110 abuts against the bottom wall of the mounting slot 131 opened by the flip member 130, the two ends of the push side of the flip member 130 are respectively located at the connection position of the first abutting side 112 and the bottom wall of the fixed slot 111, and the connection position of the second abutting side 113 and the bottom wall of the fixed slot 111. In this way, the push side of the flip member 130 can completely cover the bottom wall of the fixed slot 111, and push the wafer 400 to the second abutting side 113 of the straight claw body 110.

[0068] Furthermore, in this specific embodiment, when the chuck 200 is flipped to a horizontal state, the flip member 130 rotates and is sleeved on the outside of the claw body 110. At this time, the bottom wall of the mounting groove 131 is perpendicular to the plate surface of the chuck 200, and the angle between the two ends of the body rectangle of the fixed slot 111 and the plate surface of the chuck 200 is in the range of 70 degrees to 80 degrees, so that the center of gravity of the wafer 400 is located at the center point, reducing the wafer 400 from being shifted on the second abutting side 113 of the fixed slot 111.

[0069] Furthermore, in this specific embodiment, when the chuck 200 is flipped to a horizontal state, the flip member 130 rotates and is sleeved on the outside of the claw body 110. At this time, the push side of the flip member 130 is tilted relative to the plate surface of the chuck 200, and the angle between the plate surface of the push side and the plate surface of the chuck 200 is within the range of 80 degrees to 85 degrees, which is greater than the angle between the two ends of the body of the fixed slot 111 and the plate surface of the chuck 200. In this way, during the rotation of the flip member 130 toward the claw body 110, the flip member 130 always pushes the edge position of the wafer 400, sliding from the first abutting side 112 of the fixed slot 111 toward the second abutting side 113, accelerating the sliding speed of the wafer 400 inside the fixed slot 111 to avoid getting stuck.

[0070] It should be noted that the gravity of the flip member 130 is greater than the magnetic attraction between the first magnet and the second magnet 135. When the chuck 200 flips from the horizontal state to the vertical state, the flip member 130 is separated from the base 120 and the claw body 110 due to the greater gravity of the flip member 130. In addition, the curvature of the bottom wall of the fixed card slot 111 is 45 degrees. When the chuck 200 flips from the vertical state to the horizontal state, the flip member 130 rotates toward the claw body 110 by its own gravity, and in the process of transfer, the flip member 130 first relies on its own gravity, and when the flip member 130 flips to 45 degrees, it cooperates with the magnetic attraction between the first magnet and the second magnet 135 to accelerate the sliding of the wafer 400 inside the fixed card slot 111.

[0071] The flipping process of the wafer 400: 1. When the plate surface of the chuck 200 is in a vertical state, the wafer 400 is clamped in the fixed slot 111 of the wafer flip claw 100. At this time, the edge of the wafer 400 is located at the connection position between the first abutting side 112 and the bottom wall of the fixed slot 111, and the body length direction of the flip member 130 is perpendicular to the body length direction of the claw body 110. 2. When the plate surface of the chuck 200 is flipped from a vertical state to a horizontal state, the chuck 200 and the wafer 400 are both in an inclined state. At this time, the edge of the wafer 400 is located on the bottom wall of the fixed slot 111, and the flip member 130 rotates toward the claw body 110 by its own gravity and magnetic attraction, and the push side of the flip member 130 pushes the wafer 400 to slide. 3. When the plate surface of the chuck 200 is in a horizontal position, the flip member 130 is sleeved on the outside of the claw body 110, and the push side of the flip member 130 covers the bottom wall of the fixed slot 111, and the edge of the wafer 400 slides to the second abutting side 113.

[0072] Example 3

[0073] The invention also includes a turning motor 10 , a chuck 200 and an auxiliary clamping claw 300 .

[0074] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In a specific embodiment, the flip motor 10 is used to provide flipping power for the chuck 200, and an output end is provided in the horizontal direction of the flip motor 10, and the output end is an output shaft 11 that can rotate in the vertical direction. The chuck 200 is a hollow annular structure, which is adapted to the size of the wafer 400, and the edge position of the chuck 200 is connected to the output shaft 11 of the motor and can rotate with the output shaft 11. The auxiliary claw 300 and the wafer flip claw 100 are arranged on the same side of the chuck 200 to assist in fixing the wafer 400.

[0075] Further, in this specific embodiment, the number of auxiliary claws 300 is the same as the number of wafer flip claws 100, both of which are two. When the chuck 200 is in a vertical state, the horizontal positions of the two auxiliary claws 300 relative to the rotation axis are set at the top position of the chuck 200, and the horizontal positions of the two wafer flip claws 100 relative to the rotation axis are set at the bottom position of the chuck 200. In this way, the gravity of the wafer 400 is always pressed on the wafer flip claws 100, and the auxiliary claws 300 abut against the edge position of the wafer 400 to prevent the wafer 400 from falling, and the wafer and wafer flip claws cooperate to keep the plate surface of the wafer 400 parallel to the plate surface of the chuck 200.

[0076] Furthermore, in this specific embodiment, two wafer flipping claws 100 are arranged on the chuck 200, symmetrically located on both sides of the vertical direction, to stabilize the wafer 400 and prevent it from slipping. In addition, two auxiliary claws 300 are arranged on the chuck 200, symmetrically located on both sides of the vertical direction, and any one of the auxiliary claws 300 is symmetrical with the wafer flipping claw 100 with the center point of the chuck 200 as the symmetry point.

[0077] The flipping process of the wafer 400: 1. Move the flipping device so that the plate surface of the chuck 200 is in a vertical state, and clamp the wafer 400 on the fixed slot 111 and the auxiliary claw 300 of the wafer flip claw 100. At this time, the edge of the wafer 400 is located at the connection position between the first abutting side 112 and the bottom wall of the fixed slot 111, and the length direction of the flipping member 130 is perpendicular to the length direction of the claw body 110. 2. Turn on the flipping device, when the plate surface of the chuck 200 is flipped from a vertical state to a horizontal state, the chuck 200 and the wafer 400 are both in an inclined state. At this time, the edge of the wafer 400 is located on the bottom wall of the fixed slot 111, and the flipping member 130 rotates toward the claw body 110 by its own gravity and magnetic attraction, and the push side of the flipping member 130 pushes the wafer 400 to slide. 3. When the plate surface of the chuck 200 is in a horizontal position, the flip member 130 is sleeved on the outside of the claw body 110, and the push side of the flip member 130 covers the bottom wall of the fixed slot 111, and the edge of the wafer 400 slides to the second abutting side 113.

[0078] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A wafer flipping claw, suitable for being arranged on a chuck of a flipping device, characterized in that: include: The jaw body and base; One end of the claw body in the length direction is a suspended end, and the other end is a fixed end, and the fixed end is connected to the base; and The claw body is provided with a fixed slot along the length direction, the bottom wall cross-section of the fixed slot is arc-shaped, and when the length direction of the claw body is kept horizontal, the vertical height of the fixed slot away from the rotating part is higher than the vertical height of the fixed slot away from the fixed part.

2. The wafer flipping claw according to claim 1, characterized in that: A side of the fixed slot away from the fixing portion is a first abutting side, a cross section of the first abutting side is an arc-shaped structure, and the first abutting side is smoothly connected to the bottom wall of the fixed slot; A side of the fixed slot away from the first rotating portion is a second abutting side, and a cross section of the first abutting side is a straight structure.

3. The wafer flipping claw according to claim 2, characterized in that: The curvature angle of the bottom wall of the fixed slot is in the range of 40 degrees to 50 degrees.

4. The wafer flipping claw according to claim 1, characterized in that: The claw body is made of carbon-doped PEEK material.

5. The wafer flipping claw according to claim 1, characterized in that: The base is a columnar structure as a whole, one end of which is connected to the fixed end in the length direction, and the other end is suitable for connecting to one side of the chuck; and The body length of the base is in the range of 2cm-3cm; A first magnet is embedded in the side wall of the base.

6. The wafer flipping claw according to any one of claims 1 to 5, characterized in that: Also includes: Flip piece; The flipping piece is sleeved on the outside of the claw body, and the flipping piece is rotatably connected to the claw body around the suspended end; Wherein, the side of the flip member adjacent to the claw body is a push side, and the push side is provided with a mounting groove, and the mounting groove matches the claw body; and When the flipping member rotates to the outside of the claw body, the bottom wall of the mounting slot abuts against the claw body, and the pushing side covers the bottom wall of the fixed slot.

7. The wafer flipping claw according to claim 6, characterized in that: One end of the flip member and the claw body that rotates is a rotating end, and the other end is a magnetic end, and the rotating end and the magnetic end are respectively located at two ends of the flip member in the length direction; The magnetic end is provided with an avoidance hole, and the avoidance hole is adapted to the base; and A second magnet is embedded in the magnetic end near the avoidance hole, and the flip part is magnetically connected to the base.

8. The wafer flipping claw according to claim 7, characterized in that: The cross section of the pushing side is a straight structure; The push side is arranged to be tilted downward from the magnetic end toward the second rotating part; and When the flip member is magnetically connected to the base, the length direction of the push probe is inclined to the length direction of the base, and a preset first angle between the length direction of the push probe and the length direction of the base is greater than the arc angle of the bottom wall of the fixed slot.

9. A wafer flipping device, characterized in that: The wafer flipping claw comprises the wafer flipping claw according to any one of claims 1 to 8, and further comprises: a flipping motor, a chuck and an auxiliary claw; The output end of the flip motor is arranged horizontally; The chuck is a hollow annular structure suitable for matching wafers; the edge of the chuck is connected to the output end of the flip motor and rotates in the vertical direction around the output end of the flip motor; The auxiliary claw is arranged on the chuck and is located on the same side as the wafer flipping claw, and the auxiliary claw and the wafer flipping claw are symmetrically arranged on both sides of the chuck in the vertical direction, and the number of the auxiliary claws is set to more than two, and the number of the wafer flipping claws is equal to the number of the auxiliary claws.

10. The wafer flipping device according to claim 9, characterized in that: The wafer flipping claw comprises: a claw body, a base and a flipping piece; The length direction of the base is perpendicular to the plate surface of the chuck; The claw body is provided with a fixed slot along the length direction, the bottom wall of the fixed slot is arc-shaped, and the connecting line of the two ends of the fixed slot in the length direction has an angle with the plate surface of the chuck, and is tilted toward the outside of the chuck; and When the chuck is flipped to a vertical state and the wafer flip claw is located at the bottom of the chuck, the first magnet is magnetically connected to the second magnet, the flipping member rotates to the outside of the claw body, and the pushing side of the claw body covers the bottom wall of the fixed slot.

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