Protective plate, battery, electronic equipment and manufacturing method of protective plate

Abstract

The embodiment of the invention provides a protection plate, a battery, electronic equipment and a manufacturing method of the protection plate, the protection plate comprises a substrate, a connecting part, a plastic package layer and a component, the connecting part comprises a first nickel sheet and a second nickel sheet, the first nickel sheet comprises a first connecting piece and a second connecting piece, the first connecting piece is used for being connected with a tab of a battery cell, and the second connecting piece is used for being connected with the tab of the battery cell; the second connecting piece is used for being in welded connection with the second nickel sheet, the component and the second nickel sheet are arranged on the first surface of the substrate, and the overall thickness of the protection plate can be effectively reduced. The plastic package layer wraps the edges of the component and the second nickel sheet, and at least part of the second nickel sheet is exposed out of the plastic package layer and is in welded connection with the second connecting piece. The first nickel sheet can be in welded connection with the second nickel sheet after the plastic packaging layer is formed, the first connecting piece is prevented from being shielded by the plastic packaging layer, so that the protection plate and the battery cell can be electrically connected, the edge of the second nickel sheet is located in the plastic packaging layer, and the structural strength and stability of the protection plate can be enhanced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a protective plate, a battery, an electronic device, and a method for manufacturing the protective plate. Background Art

[0002] With the rapid development of electronic devices, more and more functional modularization has led to increased power consumption and short standby time. Increasing the capacity of battery cells can improve battery life. For batteries with larger capacity, a protection board is required. The protection board and the battery cell are electrically connected. The protection board can play a protective role during the battery charging and discharging process to avoid overcharging, over-discharging, short circuit and other problems, thereby providing protection for batteries and electronic equipment.

[0003] The protection plate includes a substrate, components, a nickel sheet and a plastic sealing layer, wherein the nickel sheet is used to connect with the tabs of the battery cell. In the prior art, the components and the nickel sheet are respectively arranged on different surfaces of the substrate, which is equivalent to protruding from the two surfaces of the substrate to both sides, making the thickness of the protection plate relatively large and the thickness of the battery relatively large, which is not conducive to meeting the thinning requirements of electronic equipment.

[0004] The plastic encapsulation layer covers one side surface of the substrate. The plastic encapsulation layer wraps the components and provides protection for the components, while ensuring the structural stability of the protection plate. If the components and the nickel sheet are arranged on the same side surface of the substrate, the nickel sheet will be wrapped by the plastic encapsulation layer, resulting in the nickel sheet being unable to connect to the tabs of the battery cell.

[0005] Therefore, how to achieve electrical connection between the protection board and the battery cell while realizing protection of components by the plastic sealing layer, strengthening the structural strength of the protection board and reducing the overall thickness of the protection board is a technical problem that technical personnel in this field need to solve. Summary of the invention

[0006] The embodiments of the present application provide a protective board, a battery, an electronic device and a method for manufacturing the protective board, which can realize the electrical connection between the protective board and the battery cell while realizing the protection of the components by the plastic sealing layer, enhancing the structural strength of the protective board and reducing the overall thickness of the protective board.

[0007] A first aspect of an embodiment of the present application provides a protection plate for protecting a battery cell, the protection plate comprising a substrate, a connecting portion, a plastic sealing layer and at least one component; the connecting portion comprises a first nickel sheet and a second nickel sheet, the first nickel sheet comprises a first connector and a second connector, and the first connector is used to connect to the tab of the battery cell; the substrate comprises a first surface, the component and the second nickel sheet are both arranged on the first surface; the plastic sealing layer covers the first surface and wraps the edges of the component and the second nickel sheet, at least a portion of the second nickel sheet is exposed from the plastic sealing layer and is welded to the second connector.

[0008] The connecting part and each component are all arranged on the first surface of the substrate, and the connecting part and each component only protrude from the same side surface of the substrate. In this way, the overall thickness of the protective plate can be effectively reduced, and then the thickness of the battery can be reduced, which is conducive to achieving the goal of thinning the entire electronic device. The connecting part includes a first nickel sheet and a second nickel sheet, wherein the first nickel sheet includes a first connector for connecting to the pole ear of the battery cell, the second nickel sheet and the components are welded to the first surface, the plastic sealing layer can cover the first surface and wrap the components, the edge of the second nickel sheet is located in the plastic sealing layer and at least partially exposed to the plastic sealing layer, and the first connector is welded to the second nickel sheet exposed to the plastic sealing layer. In other words, the first nickel sheet is welded and connected to the second nickel sheet after the plastic sealing layer is formed, and the plastic sealing layer will not block the first nickel sheet. In this way, it is possible to realize that each component and the connecting part are all arranged on the first surface to reduce the overall thickness of the protective plate, while facilitating the welding connection between the first connector of the first nickel sheet and the pole ear of the battery cell. Moreover, after the plastic sealing layer is formed, the edges of the plastic sealing layer and the second nickel sheet are partially overlapped, so that the overall structural strength and stability of the protective plate can be ensured at the edge of the connecting part, avoiding the problem of stress weak areas here. Moreover, when performing the plastic sealing operation, there is no need to set a larger distance between the second nickel sheet and the surrounding components, thereby reducing the distance between the connecting part and the surrounding components, achieving higher integration, and facilitating reduction of the overall width of the protective plate, thereby facilitating miniaturization of the entire machine and facilitating installation operations within a limited space.

[0009] In one example, the plastic sealing layer further includes a connection space extending through the thickness direction, and the first nickel sheet can be located in the connection space and welded to the second nickel sheet. The connection space is provided so that the second nickel sheet can be exposed from the plastic sealing layer through the connection space, and the welding operation between the first nickel sheet and the second nickel sheet is facilitated.

[0010] In one example, the substrate is provided with connecting circuits, part of which is located in the projection area of ​​the connecting space in the substrate, and the second nickel sheet is fixed to the substrate and shields the connecting circuits in the projection area.

[0011] In one example, the connection space is a space formed by a laser ablation process, which can improve the versatility of the plastic encapsulation mold.

[0012] In one example, the second nickel sheet is a sheet-like structure. With such a configuration, when a shielding mold is used to shield the second nickel sheet and perform a plastic sealing operation, the structure of the shielding structure in the shielding mold can be simplified, the manufacturing cost of the shielding mold can be reduced, the manufacturing process of the shielding mold can be simplified, and the product development progress can be guaranteed. After the first surface is completely plastic sealed, it is also convenient to expose the surface of the second nickel sheet through laser. At the same time, when the second nickel sheet is set as a sheet-like structure, the problem of glue overflow around the connection part can also be avoided.

[0013] In one example, the thickness of the second nickel sheet is 0.1 mm to 0.3 mm, so as to avoid the situation that the overall thickness is affected by the second nickel sheet being too thick, or the situation that the second nickel sheet is too thin and is prone to breakdown during welding, thereby damaging the substrate or the circuit on the substrate surface.

[0014] In one example, the second connecting member and the second nickel sheet are welded by a laser spot welding process.

[0015] In one example, a bending structure is provided between the first connector and the second connector, and when the first connector is connected to the tab, the first connector can be bent by the bending structure and located in the connection space. This can further reduce the space occupied by the connection between the first connector and the tab, increase integration, and facilitate miniaturization.

[0016] In one example, a tin layer is welded between the second nickel sheet and the first surface, so as to facilitate welding the second nickel sheet and the first surface of the substrate.

[0017] In one example, a flexible circuit board is further included, and the flexible circuit board is welded and connected to the substrate. The flexible circuit board is electrically connected to external components to provide protection for the battery cell.

[0018] A second aspect of an embodiment of the present application provides a battery, comprising a battery cell and the protection plate described in the first aspect above, the battery cell is provided with a pole ear, and the nickel sheet of the protection plate is welded to the pole ear.

[0019] The battery includes the protection plate described in the first aspect above, and its technical effect is similar to the technical effect of the above protection plate. To save space, it will not be repeated here.

[0020] A third aspect of the embodiments of the present application provides an electronic device, comprising the battery as described in the second aspect.

[0021] The electronic device includes the battery described in the second aspect, and its technical effect is similar to the technical effect of the above-mentioned battery and protection board. In order to save space, it will not be repeated here.

[0022] In one example, the device further includes a screen assembly, a middle frame, and a back cover which are arranged in sequence, wherein the screen assembly, the middle frame, and the back cover are enclosed to form a shell, and the battery is located in the shell. The shell can provide protection for the battery located inside.

[0023] A fourth aspect of the embodiments of the present application provides a method for manufacturing a protective plate. Based on the protective plate provided in the first aspect and its examples, the method for manufacturing the protective plate includes the following steps:

[0024] Soldering each component and the second nickel sheet to the first surface of the substrate respectively;

[0025] Performing a plastic sealing operation on the first surface to form a plastic sealing layer, so that at least a portion of the second nickel sheet is exposed from the plastic sealing layer;

[0026] The second connecting piece of the first nickel sheet is connected to the second nickel sheet exposed from the plastic sealing layer by welding.

[0027] The method for manufacturing the protective plate is based on the protective plate provided in the first aspect, and its technical effect is similar to the technical effect of the protective plate provided in the first aspect. To save space, it will not be repeated here.

[0028] In one example, the first surface is plastic-sealed to form a plastic-sealed layer, so that at least a portion of the second nickel sheet is exposed from the plastic-sealed layer, including shielding the second nickel sheet by a shielding mold, and the first surface is plastic-sealed to form a plastic-sealed layer and a connection space, the connection space corresponds to the shielding mold, and at least a portion of the second nickel sheet is exposed from the plastic-sealed layer through the connection space. The connection space is formed during the plastic-sealing process by the shielding effect of the shielding mold, and there is no need to perform subsequent processing on the plastic-sealed layer, which can simplify the operation steps.

[0029] In one example, the first surface is plastic-sealed to form a plastic-sealed layer, so that at least part of the second nickel sheet is exposed from the plastic-sealed layer, including plastic-sealing the first surface to form a plastic-sealed layer, each of the components and the second nickel sheet are located in the plastic-sealed layer, and then the plastic-sealed layer is laser-treated to form a connection space, so that at least part of the second nickel sheet is exposed from the plastic-sealed layer from the connection space. The connection space is formed by the laser ablation process, and the position of the connection part is not limited by the plastic-sealed mold. Even for protection plates with different connection parts, a plastic-sealed mold can be shared, and the plastic-sealed mold has strong versatility.

[0030] In one example, welding the second nickel sheet to the first surface of the substrate includes preparing a tin layer on the first surface and welding the second nickel sheet on the surface of the tin layer. The tin layer facilitates welding the nickel sheet to the first surface.

[0031] In one example, the method for manufacturing the protection plate further includes the following step: cutting the assembled panels into a single substrate, thereby improving the manufacturing efficiency of the protection plate.

[0032] In one example, the protection board further includes a flexible circuit board, and the method for manufacturing the protection board further includes the following steps: welding the flexible circuit board to the substrate, and electrically connecting the flexible circuit board to external components to provide protection for the battery cell. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic diagram of the structure of an electronic device;

[0034] Figure 2It is a schematic diagram of the battery structure;

[0035] Figure 3 It is a schematic diagram of the structure of the protection board, wherein the components and the connection parts are respectively arranged on the two side surfaces of the substrate;

[0036] Figure 4 It is a schematic diagram of the structure of the protection board, wherein the components and the connection parts are arranged on the same side surface of the substrate, and the connection parts are covered by a covering mold during plastic packaging;

[0037] Figure 5 It is a schematic diagram of the structure of the protection board, wherein the components and the connection parts are arranged on the same side surface of the substrate, and the protection layer is formed by dispensing glue;

[0038] Figure 6 is a schematic structural diagram of a protection plate, wherein the components and the connecting portion are arranged on the same side surface of the substrate, and the connecting portion includes a first nickel sheet and a second nickel sheet;

[0039] Figure 7 is a schematic diagram of the structure of the protection board, wherein the flexible circuit board is welded to the second surface of the substrate;

[0040] Figure 8 It is a schematic diagram of the structure in which the protection board is not provided with a flexible circuit board;

[0041] Fig. 9 yes Figure 8 Bottom view of

[0042] Fig.10 yes Figure 8 A schematic diagram of the structure of the connecting part in FIG.

[0043] Fig.11 yes Figure 8 Schematic diagram of the structure of the tin layer and the connecting part;

[0044] Fig.12 is a schematic diagram of the structure when various components and the second nickel sheet are welded to the first surface;

[0045] Fig.13 It is a schematic diagram of the structure of the protection plate when part of the second nickel sheet is exposed from the plastic sealing layer;

[0046] Fig.14 It is a schematic diagram of the structure when the protective plate forms a plastic sealing layer on the entire surface of the first surface, and the second nickel sheet is located in the plastic sealing layer;

[0047] Fig.15 It is a flowchart of a method for manufacturing a first protective plate provided in an embodiment of the present application;

[0048] Fig.16 It is a detailed flowchart of the first method for manufacturing a protective plate provided in an embodiment of the present application;

[0049] Fig.17 It is a flowchart of a method for manufacturing a second protective plate provided in an embodiment of the present application;

[0050] Fig.18 It is a detailed flowchart of the second method for manufacturing a protective plate provided in an embodiment of the present application.

[0051] Attached Figure 1-Figure 18 In the figure, the reference numerals are described as follows:

[0052] 100 batteries, 110 cells, 111 tabs, 120 protection plates; 200 display components; 300 middle frame; 400 back cover;

[0053] 1 substrate, 11 first surface, 12 second surface;

[0054] 2 components;

[0055] 3 connecting part, 31 first nickel sheet, 311 first connecting piece, 312 second connecting piece, 32 second nickel sheet;

[0056] 4 tin layer;

[0057] 5. Plastic sealing layer;

[0058] 6. Connecting space;

[0059] 7. Soft circuit board;

[0060] 8 protection layers. DETAILED DESCRIPTION

[0061] The embodiments of the present application provide an electronic device, including but not limited to a mobile phone, a tablet computer, a laptop computer, a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a driving recorder, a wearable device, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker / headphone, or a vehicle-mounted device with a battery.

[0062] Take the mobile phone as an example, Figure 1 As shown, the mobile phone includes a display component 200, a middle frame 300 and a back cover 400, wherein the display component 200, the middle frame 300 and the back cover 400 are arranged in sequence and enclosed to form a shell, and the battery 100 is located in the shell and is used to power the mobile phone.

[0063] like Figure 2As shown, the battery 100 includes a battery cell 110 and a protection board 120. Among them, the battery cell 110 is provided with an electrode tab 111. The protection board 120 includes a substrate 1 and a connection part 3. The connection part 3 is used for welding connection with the electrode tab 111 to achieve electrical connection between the protection board 120 and the battery cell 110.

[0064] As Figure 2-Figure 6 shown, the protection board 120 further includes at least one component 2. The component 2 specifically includes any one or more of devices such as chips (such as control chips, security chips, fuel gauge chips, etc.), capacitors, resistors, MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors). Each component 2 is respectively connected to the substrate 1 by welding. And after welding each component 2 to one side surface of the substrate 1 is completed, a plastic encapsulation layer 5 is formed on the surface of the substrate 1. The plastic encapsulation layer 5 covers this side surface, and each component 2 is located within the plastic encapsulation layer 5. The plastic encapsulation layer 5 can provide protection for the components 2 to prevent dust and moisture from affecting each component 2. At the same time, the setting of the plastic encapsulation layer 5 is also beneficial to the heat dissipation of each component 2, and the plastic encapsulation layer 5 can also ensure the connection stability between each component 2 and the substrate 1 and ensure the structural strength of the protection board 120.

[0065] The substrate 1 includes a first surface 11 and a second surface 12 arranged opposite to each other. As Figure 2 shown, when the connection part 3 is arranged on the first surface 11 and each component 2 is arranged on the second surface 12 at the same time, it is equivalent to protruding from both sides of the two surfaces of the substrate 1 respectively. The thickness of this protection board is t1. As Figure 3-Figure 5 shown, when the connection part 3 and each component 2 are both arranged on the first surface 11 of the substrate 1, and the first surface 11 is the side surface facing the battery cell 110, it is equivalent to that the component 2 and the connection part 3 only protrude from the same side surface of the substrate 1. At this time, the thickness of this protection board 120 is t2. Obviously, t2 < t1. Therefore, arranging the component 2 and the connection part 3 on the same side surface of the substrate 1 can effectively reduce the overall thickness of this protection board 120, and further reduce the thickness of the battery 100, which is beneficial to achieving the goal of thinning the whole electronic device.

[0066] The connection part 3 is provided with a first connecting piece 311. The first connecting piece 311 is used for connecting with the electrode tab 111. When the connection part 3 and each component 2 are both arranged on the first surface 11 of the substrate 1, after forming the plastic encapsulation layer 5 covering the first surface 11, the first connecting piece 311 of the connection part 3 used for connecting with the electrode tab 111 needs to be exposed from the plastic encapsulation layer 5 to achieve electrical connection with the battery cell 110.

[0067] In this article, "located in the plastic layer 5" means being wrapped or covered by the plastic layer 5, and "exposed to the plastic layer 5" means not being wrapped or covered by the plastic layer 5. The first connector 31 is exposed to the plastic layer 5, so that the subsequent plastic layer 5 will not hinder the welding operation between the first connector 311 and the tab 111.

[0068] Specifically, during the plastic encapsulation operation, the position of the connecting portion 3 can be shielded by a shielding mold, so that the first connector 311 of the connecting portion 3 is not covered by the plastic encapsulation layer 5 but is exposed from the plastic encapsulation layer 5 and is welded to the tab 111 .

[0069] When the position of the connection portion 3 is shielded by a shielding mold, after plastic packaging, the structure of the protection plate 120 is as follows: Figure 4 As shown, a gap is left between the edge of the connecting portion 3 and the plastic sealing layer 5, and then a glue dispensing operation can be performed at the gap position to ensure the overall structural strength of the protection plate 120 and avoid the occurrence of a stress weak area in the gap. The manufacturing process of the protection plate 120 is relatively complicated and the production efficiency is low.

[0070] Moreover, during the encapsulation process, when the position of the connecting part 3 is blocked by a blocking mold, in order to ensure that all components 2 are located in the encapsulation layer 5, a certain distance (such as 0.3 mm) must be left between the blocking mold and the surrounding components 2. At the same time, a certain distance (such as 0.3 mm) must be left between the blocking mold and the connecting part 3, and the blocking mold also has a certain thickness. As a result, after the encapsulation, the distance between the connecting part 3 and the surrounding components 2 is relatively large (about 1.8 mm), and the overall width of the protection plate 120 is relatively large, which is not conducive to the miniaturization and integration of the whole machine.

[0071] like Figure 5 As shown, a protective layer 8 is formed on the first surface 11 of the substrate 1 by dispensing glue, so that each component 2 is located in the protective layer 8, and each component 2 is protected by the protective layer 8. The connecting portion 3 is located outside the protective layer 8, which is convenient for connecting with the tab 111 of the battery cell 110. However, this process has poor consistency. When the glue coverage is insufficient, the device protection effect and substrate strength cannot be guaranteed. When the glue coverage is more, the thickness and width of the protective plate are increased, and the miniaturization effect of the protective plate is poor. .

[0072] For this reason, in this embodiment, Figure 6-Figure 10 As shown, the connecting portion 3 is set to include a first nickel sheet 31 and a second nickel sheet 32, wherein the first nickel sheet 1 includes a first connecting piece 311 and a second connecting piece 312, and the first nickel sheet 31 and the second nickel sheet 32 ​​are welded to form a structure as shown in FIG. Fig.10 The connecting portion 3 shown has the same function as the nickel sheet in the prior art, and realizes the electrical connection between the protection plate 120 and the tab 111 of the battery cell 110 .

[0073] The second nickel sheet 32 ​​and each component 2 are welded to the first surface 11. After the plastic sealing layer 5 is formed on the first surface 11, the plastic sealing layer 5 can cover the first surface 11 and wrap each component 2, and the second nickel sheet 32 ​​can be at least partially exposed from the plastic sealing layer 5, and then the second connecting piece 312 of the first nickel sheet 31 is welded to the second nickel sheet 32.

[0074] That is to say, the first nickel sheet 31 is welded to the second nickel sheet 32 ​​after the plastic encapsulation layer 5 is formed, and the plastic encapsulation layer 5 will not block the first nickel sheet 31. In this way, it can be ensured that the first connecting part 311 of the first nickel sheet 31 is located outside the plastic encapsulation layer 5, which is convenient for welding with the pole ear 111. At the same time, each component 2 and the connecting part 3 are arranged on the first surface 11, which can effectively reduce the overall thickness of the protective plate 120.

[0075] Moreover, after the plastic sealing forms the plastic sealing layer 5, only a part of the second nickel sheet 32 ​​needs to be located outside the plastic sealing layer 5, and then the first nickel sheet 31 and the second nickel sheet 32 ​​are welded and connected on the partial surface outside the plastic sealing layer 5. The partial surface of the second nickel sheet 32 ​​exposed from the plastic sealing layer 5 is a regular plane, and the position accuracy requirement for welding the second nickel sheet 32 ​​on the first surface 11 is relatively low. The second nickel sheet 32 ​​will not have an irregular vertical surface exposed and with fluctuating position accuracy, which increases the difficulty of shielding the mold and laser cleaning, thereby reducing process requirements and costs.

[0076] In this embodiment, the edge of the second nickel sheet 32 ​​may be wrapped in the plastic sealing layer 5, and specifically, may be as follows: Figure 6-Figure 9 The edges of both ends of the second nickel sheet 32 ​​along the length direction of the substrate 1 are wrapped in the plastic layer 5, or the circumferential edges of the second nickel sheet 32 ​​are all wrapped in the plastic layer 5. In this way, after the plastic layer 5 is formed, the edges of the plastic layer 5 and the second nickel sheet 32 ​​are partially overlapped to avoid the formation of a gap between the two. The overall structural strength of the protective plate 120 can be ensured at the edge of the nickel sheet 3 without the need for subsequent glue dispensing treatment, avoiding the problem of a stress weak area at this location.

[0077] At the same time, since the edge of the second nickel sheet 32 ​​is wrapped in the plastic sealing layer 5, there is no need to set a larger distance between the second nickel sheet 32 ​​and the surrounding components 2 during the plastic sealing operation, thereby reducing the distance between the nickel sheet 3 and the surrounding components 2, specifically, it can be reduced to 0.3mm, with higher integration, which is convenient for reducing the overall width of the protection plate 120, and is conducive to miniaturization of the whole machine, and is convenient for installation operations within a limited space.

[0078] Specifically, the second nickel sheet 32 ​​is welded to the first surface 11 before the plastic sealing layer 5 is formed. When the material of the substrate 1 is copper, the second nickel sheet 32 ​​can be welded to the substrate 1 through the tin layer 4. The structure of the connecting portion 3 and the tin layer 4 is as follows: Fig.11Specifically, the tin layer 4 is preformed on the first surface 11 of the substrate 1 before the plastic encapsulation layer 5 is formed and before the second nickel sheet 32 ​​is welded to the substrate 1 .

[0079] The second connector 312 and the second nickel sheet 32 ​​may be connected by solder paste spot welding or without solder paste spot welding. For example, the two may be directly connected by laser spot welding, which simplifies the welding process, improves the manufacturing efficiency of the protection plate 120, and the welding process is mature and the complexity is controllable.

[0080] like Figure 6-Figure 9 As shown, the plastic sealing layer 5 is provided with a connection space 6 , the second nickel sheet 32 ​​can be exposed from the plastic sealing layer 5 through the connection space 6 , and the second connecting piece 312 of the first nickel sheet 31 can be located in the connection space 6 and welded to the second nickel sheet 32 ​​.

[0081] Specifically, during the process of plastic encapsulating the first surface 11, the connection space 6 is formed by the shielding effect of the shielding mold. The connection space 6 corresponds to the shielding mold, and there is no need to perform subsequent processing on the plastic encapsulation layer 5, which can simplify the operation steps. Alternatively, a fully covered plastic encapsulation layer 5 is first formed on the first surface 11, and then a laser ablation process is performed to form the connection space 6. The position of the connection part 3 is not limited by the plastic encapsulation mold. Even for the protection plates 120 with different positions of the connection parts 3, a plastic encapsulation mold can be shared, and the plastic encapsulation mold has strong versatility.

[0082] Whether the connection space 6 is formed by shielding the shielding mold or by laser ablation, the number of the connection spaces 6 is the same as the number of the connection parts 3. The protection plate 120 is connected to the pole ear 111 of the battery cell 110 through the connection part 3. Therefore, when the connection part 3 is provided with two positive and negative electrodes, the number of the connection spaces 6 is also two. The two connection spaces 6 can divide the plastic sealing layer 5 covering the first surface 11 into Fig.13 The three-block structure is shown.

[0083] The substrate 1 is provided with connecting circuits, part of which is located in the projection area of ​​the connecting space 6 on the substrate 1. The plastic sealing layer 5 does not cover this part of the connecting circuit, so it cannot provide protection for this part of the connecting circuit. After the second nickel sheet 32 ​​is welded and fixed to the substrate 1, it can block this part of the connecting circuit located in the projection area and provide protection for this part of the connecting circuit.

[0084] Furthermore, the second connection member 312 is welded to the second nickel sheet 32, which can avoid damage to the substrate 1 or the connection line due to breakdown during welding, compared with the solution of directly welding the second connection member 312 to the first surface 11 of the substrate 1. In the process of forming the connection space 6 by the laser ablation process, the second nickel sheet 32 ​​can also prevent the laser ablation process from damaging the connection line.

[0085] This embodiment provides two methods for manufacturing protection plates, and the following will describe the two methods for manufacturing protection plates in detail.

[0086] like Fig.15 As shown, the first method for manufacturing a protective plate provided in the embodiment of the present application comprises the following steps:

[0087] S11: Soldering each component 2 and the second nickel sheet 32 ​​to the first surface 11 of the substrate 1 respectively;

[0088] S12: shielding the second nickel sheet 32 ​​by a shielding mold, and performing a plastic sealing operation on the first surface 11 to form a plastic sealing layer 5 and a connecting space 6, wherein the connecting space 6 corresponds to the shielding mold, and at least a portion of the second nickel sheet 32 ​​is exposed from the plastic sealing layer 5 through the connecting space 6;

[0089] S13 : welding the second connecting piece 312 of the first nickel sheet 31 to the second nickel sheet 32 ​​exposed from the plastic packaging layer 5 .

[0090] In step S11, each component 2 is welded to the first surface 11 of the substrate 1. This is a well-known prior art to those skilled in the art. To save space, the welding between each component 2 and the substrate 1 will not be described in detail herein.

[0091] When a tin layer 4 is welded between the second nickel sheet 32 ​​and the first surface 11, in step S11, the tin layer 4 is prefabricated on the first surface 11, and then the second nickel sheet 32 ​​is welded on the surface of the tin layer 4 to obtain Fig.12 The structure shown.

[0092] In step S12, when the first surface 11 is plastic-sealed by the plastic-sealing mold, the shielding mold can shield the second nickel sheet 32. After the plastic-sealing layer 5 corresponding to the plastic-sealing mold is formed, a connection space 6 is formed corresponding to the position of the shielding mold. At least part of the second nickel sheet 32 ​​can be exposed from the plastic-sealing layer 5 through the connection space 6 without being shielded by the plastic-sealing layer 5. The specific structure is as follows: Fig.13 In this embodiment, the shielding mold and the plastic sealing mold can be an integrated structure or two independent structures.

[0093] Since the edge of the second nickel sheet 32 ​​can be located inside the plastic packaging layer 5, only a portion of the surface needs to be exposed and used for welding connection with the second connecting piece 312 of the first nickel sheet 31, thereby reducing the precision requirements for the shielding mold, simplifying the processing technology of the shielding mold and reducing costs.

[0094] In step S13, the second connecting piece 312 of the first nickel sheet 31 is welded to the second nickel sheet 32 ​​from the connecting space 6, and the Figure 8The structure shown.

[0095] In this embodiment, the substrate 1 may be formed by cutting a jigsaw puzzle, that is, a jigsaw puzzle is cut to form a plurality of individual substrates 1 , and each substrate 1 is used to make a protective plate 120 .

[0096] It can be that before the panel is cut, multiple substrates 1 are assembled simultaneously on the surface of the entire panel, or the panel is cut into a single substrate 1 first, and then assembled on the first surface 11 of each single substrate 1, and the assembly specifically includes at least one of welding the components 2 and the second nickel sheet 32 ​​on the first surface 11 and performing a plastic sealing operation on the first surface 11 to form a plastic sealing layer 5. Moreover, it is not difficult to understand that after the multiple substrates 1 are assembled simultaneously on the surface of the entire panel, when the panel is cut into multiple single substrates 1, the production efficiency of the protection plate 120 can be effectively improved.

[0097] Therefore, the manufacturing method of the protection plate further includes step S14: cutting the assembled panels to form a single substrate 1. In this embodiment, there is no limitation on when to perform step S14, such as it can be performed simultaneously with any of the above steps or before or after any of the above steps.

[0098] like Figure 6 As shown, the protection board 120 also includes a soft circuit board 7, which is a flexible circuit board (FPC board) for electrically connecting to external components to protect the battery cell 110. Specifically, there is no restriction on the electrical connection method between the soft circuit board 7 and the external components, which can be set according to the specific situation.

[0099] The flexible circuit board 7 can be as follows Figure 6 As shown, it is integrally formed with the substrate 1 to achieve electrical connection, or it can also be as shown Figure 7 As shown, the flexible circuit board 7 and the substrate 1 are independent structures, and the flexible circuit board 7 is welded to the second surface 12 of the substrate 1 to achieve electrical connection. At this time, the manufacturing method of the protection plate further includes step S15: welding the flexible circuit board 7 to the substrate 1. In this embodiment, a plurality of welding points can be formed between the substrate 1 and the flexible circuit board 7 by spot welding to achieve welding between the two.

[0100] like Fig.16 As shown, the manufacturing method of the first protection plate specifically includes the following steps:

[0101] S11: Soldering each component 2 and the second nickel sheet 32 ​​to the first surface 11 of the substrate 1 respectively;

[0102] S12: shielding the second nickel sheet 32 ​​by a shielding mold, and performing a plastic sealing operation on the first surface 11 to form a plastic sealing layer 5 and a connecting space 6, wherein the connecting space 6 corresponds to the shielding mold, and at least a portion of the second nickel sheet 32 ​​is exposed from the plastic sealing layer 5 through the connecting space 6;

[0103] S13: welding the second connecting piece 312 of the first nickel sheet 31 to the second nickel sheet 32 ​​exposed from the plastic sealing layer 5;

[0104] S14: cutting the panel into a single substrate 1;

[0105] S15: Connect the flexible circuit board 7 to the substrate 1 by welding.

[0106] like Fig.17 As shown, the second method for manufacturing a protective plate provided in the embodiment of the present application includes the following steps:

[0107] S21: Soldering each component 2 and the second nickel sheet 32 ​​to the first surface 11 of the substrate 1 respectively;

[0108] S22: performing a plastic sealing operation on the first surface 11 to form a plastic sealing layer 5, wherein each component 2 and the second nickel sheet 32 ​​are located in the plastic sealing layer 5;

[0109] S23: performing a laser operation on the plastic sealing layer 5 to form a connection space 6, wherein at least a portion of the second nickel sheet 32 ​​is exposed from the plastic sealing layer 5 through the connection space 6;

[0110] S24 : welding the second connecting piece 312 of the first nickel sheet 31 to the second nickel sheet 32 ​​exposed from the plastic packaging layer 5 .

[0111] When a tin layer 4 is welded between the second nickel sheet 32 ​​and the first surface 11, in step S21, the tin layer 4 is prefabricated on the first surface 11, and then the second nickel sheet 32 ​​is welded on the surface of the tin layer 4 to obtain Fig.12 The structure shown.

[0112] In step S22, during the plastic encapsulation operation, only the plastic encapsulation mold is used without the shielding mold, so the first surface 11 of the substrate 1 can be completely plastic encapsulated to form a completely covered plastic encapsulation layer 5 on the first surface 11, such as Fig.14 As shown, each component 2 and the second nickel sheet 32 ​​are wrapped in the plastic layer 5, and then in step S23, the plastic layer 5 is subsequently processed by laser ablation process to form a connection space 6, as shown in FIG. Fig.13 As shown, at least a portion of the second nickel sheet 32 ​​can be exposed from the plastic sealing layer 5 through the connection space 6 without being wrapped or covered by the plastic sealing layer 5 .

[0113] This embodiment does not limit the subsequent processing of the plastic layer 5. For example, in step S23, the plastic layer 5 can also be processed by machining to form the connection space 6. When the connection space 6 is set as a space formed in the plastic layer 5 by laser ablation, the subsequent processing can be simplified, the processing accuracy requirements can be reduced, and the cost can be reduced. At the same time, foreign matter such as debris can be avoided during the processing to ensure cleanliness.

[0114] Moreover, in step S23, when the connection space 6 is formed by laser operation, the provision of the second nickel sheet 32 ​​can facilitate the cleaning of the connection space 6, and can also provide protection for the circuit of the first surface 11, thereby reducing the probability of the circuit of the first surface 11 being damaged due to the laser operation.

[0115] The manufacturing method of the protection plate further includes step S25: cutting the assembled panels to form a single substrate 1. In this embodiment, there is no limitation on when to perform step S25, such as it can be performed simultaneously with any of the above steps or before or after any of the above steps.

[0116] The method for manufacturing the protection plate may further include S26: welding the flexible circuit board 7 to the substrate 1 .

[0117] like Fig.18 As shown, the manufacturing method of the second protection plate specifically includes the following steps:

[0118] S21: Soldering each component 2 and the second nickel sheet 32 ​​to the first surface 11 of the substrate 1 respectively;

[0119] S22: performing a plastic sealing operation on the first surface 11 to form a plastic sealing layer 5, wherein each component 2 and the second nickel sheet 32 ​​are located in the plastic sealing layer 5;

[0120] S23: performing a laser operation on the plastic sealing layer 5 to form a connection space 6, wherein at least a portion of the second nickel sheet 32 ​​is exposed from the plastic sealing layer 5 through the connection space 6;

[0121] S24: welding the second connecting piece 312 of the first nickel sheet 31 to the second nickel sheet 32 ​​exposed from the plastic sealing layer 5;

[0122] S25: cutting the panel into a single substrate 1;

[0123] S26: Connect the flexible circuit board 7 to the substrate 1 by welding.

[0124] The second nickel sheet 32 ​​is welded to the first surface of the substrate 1 before the plastic sealing layer 5 is formed. When the second connecting piece 312 of the first nickel sheet 31 is welded to the second nickel sheet 32, at least part of the second nickel sheet 32 ​​needs to be exposed from the plastic sealing layer 5. As for how the second nickel sheet 32 ​​is exposed from the plastic sealing layer 5, when the plastic sealing operation is performed on the first surface 11, the second nickel sheet 32 ​​is shielded by a shielding mold so that a connecting space 6 corresponding to the shielding mold is formed while the plastic sealing layer 5 is formed, or after the plastic sealing layer 5 is formed, a connecting space 6 is formed by a laser operation, and the second nickel sheet 32 ​​can be exposed from the plastic sealing layer 5 through the connecting space 6.

[0125] In this embodiment, the first connector 31 and the second connector 32 can be bent. After the first connector 31 is connected to the pole lug 111, the first nickel sheet 31 is bent at the connection between the first connector 31 and the second connector 32, and the bent nickel sheet 3 and the connection between the nickel sheet 3 and the pole lug 111 are both located in the connection space 6, and do not exceed the side surface of the plastic sealing layer 5 away from the first surface 11, which is equivalent to hiding the connection between the connecting part 3 and the pole lug 111 in the connection space 6, thereby not increasing the overall thickness of the protective plate 120. The provision of the first connector 31 and the second connector 32 facilitates the welding connection of the first nickel sheet 31 with the second nickel sheet 32 ​​and the pole lug 111, and facilitates the bending and hiding operation after the welding connection with the pole lug 111.

[0126] In this embodiment, the second nickel sheet 32 ​​is a sheet structure, which can be laid flat on the first surface 11 of the substrate 1, one side surface of the second nickel sheet 32 ​​is in contact with the first surface 11 of the substrate 1, and the other side surface of the second nickel sheet 32 ​​is welded to the second connector 312 of the first nickel sheet 31. In addition, the surface of the second nickel sheet 32 ​​exposed from the plastic sealing layer 5 is a regular plane, which is convenient for welding the second connector 312 thereto. At the same time, when a shielding mold is used to shield the second nickel sheet 32 ​​and perform a plastic sealing operation, the structure of the shielding mold can be simplified, the manufacturing cost of the shielding mold can be reduced, and the manufacturing process of the shielding mold can be simplified, so that the product development progress is guaranteed.

[0127] Furthermore, when the second nickel sheet 32 ​​is configured as a sheet structure, after the first surface 11 is completely plastic-sealed, it is also convenient to expose the surface of the second nickel sheet 32 ​​through a laser ablation process. At the same time, when the second nickel sheet 32 ​​is configured as a sheet structure, the problem of glue overflow around the connecting portion 3 can also be avoided.

[0128] During the manufacturing process of the second nickel sheet 32 ​​, a plurality of second nickel sheets 32 can be formed by cutting the same jigsaw plate. When the second nickel sheet 32 ​​is set as a sheet structure, the utilization rate of the jigsaw plate can be improved, thereby reducing the cost.

[0129] In this embodiment, the thickness of the second nickel sheet 32 ​​is in the range of 0.1mm-0.3mm, so as to avoid the second nickel sheet 32 ​​being too thick and affecting the overall thickness, or the second nickel sheet 32 ​​being too thin and prone to breakdown during welding, thereby damaging the substrate 1 or the circuit on the surface of the substrate 1.

[0130] Specific examples are used herein to illustrate the principles and implementation methods of the present application, and the description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A protection plate for protecting a battery cell, characterized in that: The protection plate includes a substrate, a connecting portion, a plastic sealing layer and at least one component; The connecting portion includes a first nickel sheet and a second nickel sheet, the first nickel sheet includes a first connector and a second connector, and the first connector is used to connect to the tab of the battery cell; The substrate comprises a first surface, and the components and the second nickel sheet are both arranged on the first surface; The plastic encapsulation layer covers the first surface and wraps the components and the edges of the second nickel sheet. At least a portion of the second nickel sheet is exposed from the plastic encapsulation layer and is welded to the second connector.

2. The protection plate according to claim 1, characterized in that: The plastic sealing layer further comprises a connection space penetrating along the thickness direction, and the first nickel sheet can be welded and connected to the second nickel sheet via the connection space.

3. The protection plate according to claim 2, characterized in that: The substrate is provided with connecting circuits, part of which is located in the projection area of ​​the connecting space on the substrate, and the second nickel sheet is fixed to the substrate and shields the connecting circuits located in the projection area.

4. The protection plate according to claim 2 or 3, characterized in that: The connection space is a space formed by a laser ablation process.

5. The protection plate according to any one of claims 1 to 4, characterized in that: The second nickel sheet is a sheet-like structure.

6. The protection plate according to any one of claims 1 to 5, characterized in that: The thickness of the second nickel sheet is 0.1 mm to 0.3 mm.

7. The protection plate according to any one of claims 1 to 6, characterized in that: The second connecting member and the second nickel sheet are welded by a laser spot welding process.

8. The protection plate according to any one of claims 1 to 7, characterized in that: A bending structure is provided between the first connecting member and the second connecting member. When the first connecting member is connected to the tab, the first connecting member can be bent by the bending structure and located in the connecting space.

9. The protection plate according to any one of claims 1 to 8, characterized in that: A tin layer is also welded between the second nickel sheet and the first surface.

10. The protection plate according to any one of claims 1 to 9, characterized in that: It also includes a flexible circuit board, which is connected to the substrate by welding.

11. A battery, characterized in that: It comprises a battery cell and a protection plate as claimed in any one of claims 1 to 10.

12. An electronic device, characterized in that: Comprising the battery of claim 11.

13. The electronic device according to claim 12, characterized in that: It also includes a screen assembly, a middle frame and a back cover which are arranged in sequence. The screen assembly, the middle frame and the back cover are combined to form a shell, and the battery is located in the shell.

14. A method for manufacturing a protective plate, based on the protective plate according to claim 1, characterized in that: The method for manufacturing the protection plate comprises the following steps: Soldering each component and the second nickel sheet to the first surface of the substrate respectively; Performing a plastic sealing operation on the first surface to form a plastic sealing layer, so that at least a portion of the second nickel sheet is exposed from the plastic sealing layer; The second connecting piece of the first nickel sheet is connected by welding to the second nickel sheet exposed from the plastic sealing layer.

15. The method for manufacturing a protective plate according to claim 14, characterized in that: The first surface is subjected to a molding operation to form a molding layer, so that at least a portion of the second nickel sheet is exposed from the molding layer, including shielding the second nickel sheet by a shielding mold, and the first surface is subjected to a molding operation to form a molding layer and a connecting space, wherein the connecting space corresponds to the shielding mold, and at least a portion of the second nickel sheet is exposed from the connecting space to the molding layer.

16. The method for manufacturing a protection plate according to claim 14, characterized in that: The first surface is subjected to a plastic sealing operation to form a plastic sealing layer, so that at least a portion of the second nickel sheet is exposed from the plastic sealing layer, including performing a plastic sealing operation on the first surface to form a plastic sealing layer, wherein each of the components and the second nickel sheet are located in the plastic sealing layer, and then the plastic sealing layer is subjected to a laser operation to form a connection space, and at least a portion of the second nickel sheet is exposed from the connection space to the plastic sealing layer.

17. The method for manufacturing a protection plate according to any one of claims 14 to 16, characterized in that: The second nickel sheet is welded to the first surface of the substrate, comprising preparing a tin layer on the first surface and welding the second nickel sheet on the surface of the tin layer.

18. The method for manufacturing a protection plate according to any one of claims 14 to 17, characterized in that: The method for manufacturing the protection plate further comprises the following steps: The panels are cut to form individual substrates.

19. The method for manufacturing a protective plate according to claim 18, characterized in that: The protection board also includes a flexible circuit board, and the manufacturing method of the protection board also includes the following steps: The flexible circuit board is connected to the base plate by welding.

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