High-thermal-conductivity PCB substrate and processing method thereof

Abstract

The invention discloses a high-thermal-conductivity PCB substrate and a processing method thereof. The PCB substrate belongs to the technical field of electronics, the heat conduction base material layer can quickly conduct heat generated by electronic elements, and the heat dissipation performance of the PCB substrate is improved; the insulating layer is arranged on the surface of the metal conducting layer and used for preventing short circuit; a heat-conducting filler is added into the insulating layer, so that the heat-conducting property of the PCB base material is further improved; the high-thermal-conductivity PCB substrate provided by the invention can quickly conduct out heat generated when an electronic element works, effectively reduce the temperature of the electronic element, can reduce the problems of performance reduction, short service life and the like of the electronic element caused by too high temperature, and improves the stability and reliability of electronic equipment.

Description

Technical Field

[0001] The invention belongs to the field of electronic technology, and specifically refers to a high thermal conductivity PCB substrate and a processing method thereof. Background Art

[0002] In the environment of rapid development of high-tech such as artificial intelligence, robots, semiconductors, aerospace, etc., printed circuit boards (PCB) manufacturing, as a basic industry of high-tech, plays an important role in the development of various high-tech industries. The manufacturing and processing quality of PCB is very important. It is directly related to the cost and quality of the entire electronic product, and even affects the success or failure of the entire business competition. The production process of PCB mainly includes material cutting, drill grinding, numerical control drilling (NC drilling), electroplating, circuit formation, intermediate inspection, lamination stamping, surface printing, character printing, surface treatment, shape processing, power-on test, final inspection, etc. Each process has its indispensable role and is an important guarantee for PCB to maintain good quality and performance. Any small mistake in any process may have a fatal impact on the reliability application of PCB. With the rapid development of modern science and technology, PCB processing procedures are also constantly improving, gradually moving towards simplification, refinement, high quality, automation, and efficiency.

[0003] PCB drilling is a key process in the entire circuit board production process. When PCB is mechanically drilled, in order to protect the PCB board and improve the quality of drilling, it is often necessary to put a layer of cover material, which has the following functions: fix the drill bit, buffer the impact of the drill bit, and assist the substrate in dissipating the heat of the drill bit, so as to reduce the deviation and displacement of the drill bit, reduce the wear and breakage of the brick, reduce the temperature of the drill bit, and improve the hole position accuracy and hole wall quality. Resin-coated aluminum-based cover plates are a new type of cover plate material that has emerged in recent years. Compared with other cover plates, resin-coated aluminum-based cover plates have many unique advantages. Due to the presence of surface coating resin, it has the effects of heat absorption, lubrication and buffering on the drill bit, which can not only effectively improve the quality of the drilled hole and extend the service life of the drill bit, but also can be used in drilling operations with increased number of stacked plates, greatly improving the efficiency of drilling.

[0004] With the rapid development of electronic technology, the integration of electronic devices is getting higher and higher, and the power density is increasing. Heat dissipation has become a key factor affecting the performance and reliability of electronic devices. Traditional PCB substrates have poor thermal conductivity and are difficult to meet the heat dissipation requirements of high-power electronic components. Therefore, the development of high thermal conductivity PCB substrates has important practical significance. Summary of the invention

[0005] The purpose of the present invention is to provide a high thermal conductivity PCB substrate and a processing method thereof. The thermal conductive base material layer used in the present invention can quickly conduct the heat generated by electronic components and improve the heat dissipation performance of the PCB substrate; the insulating layer is arranged on the surface of the metal conductive layer to prevent circuit short circuit; the present invention also adds a thermal conductive filler in the insulating layer to further improve the thermal conductivity of the PCB substrate; the high thermal conductivity PCB substrate improved by the present invention can quickly conduct away the heat generated by the electronic components when working, effectively reduce the temperature of the electronic components, reduce the problems of performance degradation and shortened life of the electronic components caused by excessive temperature, and improve the stability and reliability of electronic equipment.

[0006] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: a high thermal conductivity PCB substrate and a processing method thereof, wherein the high thermal conductivity PCB substrate is composed of a thermal conductive base material layer, a metal conductive layer and an insulating layer.

[0007] Furthermore, the thermally conductive substrate layer is made of one or more of ceramics, metals and highly thermally conductive polymers.

[0008] Furthermore, the metal conductive layer is composed of one or more of copper, aluminum and silver.

[0009] Furthermore, the insulating layer is made of one or more of polyimide, aluminum oxide and epoxy resin.

[0010] Furthermore, the thermally conductive filler in the insulating layer is made of one or more of aluminum oxide, aluminum nitride and graphite.

[0011] Furthermore, the present invention also provides a method for processing a high thermal conductivity PCB substrate, the processing method comprising the following steps:

[0012] (1) Preparing a thermally conductive substrate layer. According to the selected thermally conductive substrate material, a corresponding processing method is used to prepare the thermally conductive substrate layer;

[0013] (2) preparing a metal conductive layer on the surface of the thermally conductive substrate layer;

[0014] (3) Preparing an insulating layer on the surface of the metal conductive layer;

[0015] (4) Process and test the prepared high thermal conductivity PCB substrate.

[0016] Furthermore, the preparation method of the thermal conductive substrate layer in step (1) is sintering, die casting, rolling, injection molding, or extrusion.

[0017] Furthermore, in step (2), the method for depositing the metal conductive layer on the surface of the thermally conductive substrate layer is electroplating, chemical plating, or sputtering.

[0018] Furthermore, the insulating layer in step (3) is prepared by coating, spraying and dipping.

[0019] The beneficial effects achieved by the present invention using the above structure are as follows: (1) The thermally conductive substrate layer used in the present invention can quickly conduct the heat generated by the electronic components, thereby improving the heat dissipation performance of the PCB substrate; (2) The insulating layer of the present invention is arranged on the surface of the metal conductive layer to prevent circuit short circuit; (3) The present invention also adds thermally conductive fillers in the insulating layer to further improve the thermal conductivity of the PCB substrate; (4) The high thermal conductivity PCB substrate improved by the present invention can quickly conduct away the heat generated by the electronic components during operation, effectively reduce the temperature of the electronic components, reduce the problems of performance degradation and shortened life of the electronic components caused by excessive temperature, and improve the stability and reliability of electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Thermal conductivity of a high thermal conductivity PCB substrate.

[0021] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] Unless otherwise defined, all professional and scientific terms used herein have the same meanings as those familiar to those skilled in the art. In addition, any methods and materials similar or equivalent to those described herein may be applied to the present invention. The preferred implementation methods and materials described herein are for demonstration purposes only and are not intended to limit the content of this application.

[0024] The experimental methods in the following examples are conventional methods unless otherwise specified; the experimental materials and test strains used in the following examples are purchased from commercial channels unless otherwise specified.

[0025] Example 1

[0026] A high thermal conductivity PCB substrate and processing method thereof

[0027] The high thermal conductivity PCB substrate consists of a thermal conductive base material layer, a metal conductive layer and an insulating layer.

[0028] Wherein, the thermally conductive substrate layer is made of ceramic; the metal conductive layer is made of copper; the insulating layer is made of polyimide; and the thermally conductive filler in the insulating layer is made of aluminum oxide.

[0029] The present invention also provides a method for processing a high thermal conductivity PCB substrate, the processing method comprising the following steps:

[0030] (1) Preparing a thermally conductive substrate layer by a sintering method;

[0031] (2) preparing a metal conductive layer on the surface of the thermal conductive substrate layer by electroplating;

[0032] (3) Preparing an insulating layer on the surface of the metal conductive layer by spraying;

[0033] (4) Process and test the prepared high thermal conductivity PCB substrate.

[0034] Example 2

[0035] A high thermal conductivity PCB substrate and processing method thereof

[0036] The high thermal conductivity PCB substrate consists of a thermal conductive base material layer, a metal conductive layer and an insulating layer.

[0037] Wherein, the thermally conductive substrate layer is made of metal; the metal conductive layer is made of aluminum; the insulating layer is made of aluminum oxide; and the thermally conductive filler in the insulating layer is made of aluminum nitride.

[0038] The present invention also provides a method for processing a high thermal conductivity PCB substrate, the processing method comprising the following steps:

[0039] (1) The thermal conductive substrate layer is prepared by die casting and rolling.

[0040] (2) preparing a metal conductive layer on the surface of the thermal conductive substrate layer by chemical plating;

[0041] (3) Preparing an insulating layer on the surface of the metal conductive layer;

[0042] (4) Process and test the prepared high thermal conductivity PCB substrate.

[0043] Example 3

[0044] A high thermal conductivity PCB substrate and processing method thereof

[0045] The high thermal conductivity PCB substrate consists of a thermal conductive base material layer, a metal conductive layer and an insulating layer.

[0046] The thermally conductive substrate layer is made of a highly thermally conductive polymer; the metal conductive layer is made of copper; the insulating layer is made of epoxy resin; and the thermally conductive filler in the insulating layer is made of graphite.

[0047] The present invention also provides a method for processing a high thermal conductivity PCB substrate, the processing method comprising the following steps:

[0048] (1) Preparing a thermally conductive substrate layer by injection molding;

[0049] (2) preparing a metal conductive layer on the surface of the thermally conductive substrate layer;

[0050] (3) Preparing an insulating layer on the surface of the metal conductive layer;

[0051] (4) Process and test the prepared high thermal conductivity PCB substrate.

[0052] Experimental Example 1

[0053] Thermal conductivity test of a high thermal conductivity PCB substrate

[0054] The PCB substrates prepared in Example 1, Example 2 and Example 3 were used as samples, recorded as Example 1-3 groups, with three samples in each group. During the test, 0°C and 10°C were applied between the two sides of the sample to form a temperature gradient, which caused the heat flow to pass through the sample vertically without lateral heat diffusion. By measuring the area of ​​the sample, the heat flow passing through the sample, the hot surface temperature and the cold surface temperature, the thermal resistance of the sample can be calculated, and then the thermal conductivity coefficient can be obtained.

[0055] Result analysis: Figure 1 As shown, the samples of Example 1 to Example 3 groups all have higher thermal conductivity, among which the thermal conductivity of the samples of Example 2 group is the highest, followed by Example 1 group and Example 3 group.

[0056] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0057] The present invention and its embodiments are described above, and such description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A high thermal conductivity PCB substrate and a processing method thereof, characterized in that: The high thermal conductivity PCB substrate consists of a thermal conductive base material layer, a metal conductive layer and an insulating layer.

2. A high thermal conductivity PCB substrate and a processing method thereof according to claim 1, characterized in that: The thermally conductive substrate layer is made of one or more of ceramic, metal and highly thermally conductive polymer.

3. A high thermal conductivity PCB substrate and a processing method thereof according to claim 2, characterized in that: The metal conductive layer is composed of one or more of copper, aluminum and silver.

4. A high thermal conductivity PCB substrate and a processing method thereof according to claim 3, characterized in that: The insulating layer is made of one or more of polyimide, aluminum oxide and epoxy resin.

5. A high thermal conductivity PCB substrate and a processing method thereof according to claim 4, characterized in that: The thermal conductive filler in the insulating layer is made of one or more of aluminum oxide, aluminum nitride and graphite.

6. A method for processing a high thermal conductivity PCB substrate according to claim 5, characterized in that: The processing method comprises the following steps: (1) preparing a thermally conductive substrate layer, and preparing the thermally conductive substrate layer by using a corresponding processing method according to the selected thermally conductive substrate material; (2) preparing a metal conductive layer on the surface of the thermally conductive substrate layer; (3) Preparing an insulating layer on the surface of the metal conductive layer; (4) Process and test the prepared high thermal conductivity PCB substrate.

7. The method for processing a high thermal conductivity PCB substrate according to claim 6, characterized in that: The preparation method of the thermal conductive substrate layer in step (1) is sintering, die casting, rolling, injection molding, or extrusion.

8. The method for processing a high thermal conductivity PCB substrate according to claim 7, characterized in that: The method for depositing the metal conductive layer on the surface of the thermally conductive substrate layer in step (2) is electroplating, chemical plating, or sputtering.

9. The method for processing a high thermal conductivity PCB substrate according to claim 8, characterized in that: The preparation method of the insulating layer in step (3) is coating, spraying and dipping.

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