Rotary motion control method and device of chip mounter and angle positioning sheet

Abstract

The invention relates to the technical field of chip mounters, and provides a rotary motion control method and device of a chip mounter and an angle positioning sheet. The motion state of the chip mounter is obtained, and when the motion state of the chip mounter is detected to be a self-detection state, the angle positioning sheet is connected to the output shaft of the mounting head; the rotating shaft driving motor drives the output shaft of the mounting head to perform self-checking rotation, and the output shaft drives the suction nozzle to rotate; detecting the angle of the output shaft by using the angle positioning sheet, namely obtaining the rotation angle data of the angle positioning sheet and detecting the error of the rotation angle data; if the rotation angle error is within the preset range, the self-inspection is passed; if the rotation angle error exceeds the preset range, a rotation angle adjustment value is obtained, according to the driving data of the rotation angle adjustment rotation shaft driving motor, the mounting movement process is monitored, the instability of the mounting process caused by the influence of external force such as gravity is found in time, the rotation stability can be kept, the rotation angle error is avoided, and the mounting efficiency is improved. And the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of chip placement machines, and in particular to a rotational motion control method and device and an angle positioning piece of a chip placement machine. Background Art

[0002] When the placement head of the SMT machine is performing a large number of placement tasks, it is necessary to control the movement of the placement head to place the specified placement components on the preset pad position of the PCB at a preset distance and force. During the placement process, not only the placement movement process is controlled, but also the placement movement process is monitored to promptly detect instabilities in the placement process caused by external forces such as gravity, such as jitter, shaking, posture deviation, posture tilt, etc.

[0003] In particular, when the turntable placement head rotates in the vertical direction, it is necessary to consider the rotation stability, the vertical drive control and the gravity counterweight of the spring at the same time, which makes it difficult to maintain consistent rotation stability and the angle error is easy to accumulate. When the number of placement head systems on the placement machine is large and the placement task volume is large, the placement error is easy to accumulate, causing shutdown for debugging and maintenance, resulting in reduced production efficiency. Summary of the invention

[0004] Based on this, the present application proposes a rotational motion control method, device and angle positioning piece of a placement machine to solve the technical problem that the rotational stability of the prior art is difficult to maintain consistent.

[0005] The first solution of the present invention provides a rotational motion control method of a placement machine, comprising the following steps:

[0006] The motion state of the placement machine is obtained, and when the motion state is detected as a self-check state, the angle positioning sheet is connected to the output shaft of the placement head;

[0007] The output shaft of the placement head is driven by the rotating shaft driving motor to perform self-inspection rotation, and the output shaft drives the suction nozzle to rotate;

[0008] Acquiring rotation angle data of the angle positioning piece and detecting an error in the rotation angle data;

[0009] If the rotation angle error is within the preset range, the self-test passes;

[0010] If the rotation angle error exceeds the preset range, a rotation angle adjustment value is obtained, and the driving data of the rotation axis driving motor is adjusted according to the rotation angle.

[0011] In one implementation, the self-check state of the motion state can be defined according to the operation time of the placement machine or the number of placements performed by the placement head.

[0012] In one implementation manner, the angle positioning piece includes a slot adapted to the output shaft, and the angle positioning piece can be fixed in the positioning slot of the output shaft through the slot.

[0013] In one implementation manner, the angle positioning piece includes a magnetic block, and the angle positioning piece is fixed on the output shaft through the magnetic block.

[0014] In one implementation, a plurality of reflection positioning points or transmission gratings are evenly arranged on the angle positioning sheet.

[0015] The motion state of the placement head is obtained, and when the motion state is switched to the self-test state, the angle positioning piece is transported to the output shaft and / or the suction nozzle of the placement head, the angle positioning piece includes a plurality of reflection positioning points evenly arranged along the direction of the rotation axis, the light source emits detection light to the reflection positioning points, and obtains reflected light signals, the rotation angle of the angle positioning piece is obtained according to the reflected light signals, and the rotation speed or rotation deceleration is obtained according to the rotation angles of the plurality of reflection positioning points.

[0016] In one of the implementation methods, an oscillation needle is provided on the angle positioning plate, and the oscillation range of the oscillation needle is 10-20 times the oscillation range of the output shaft. The oscillation range parameter of the end of the oscillation needle is detected and recorded in the self-test controller, and the oscillation range change parameter is obtained according to the oscillation range parameter stored in the self-test controller each time, and the driving parameter of the rotation drive motor is adjusted according to the oscillation range number parameter.

[0017] In one implementation, the step of detecting the oscillation range parameter of the end of the oscillation needle includes:

[0018] A photoelectric displacement sensor is arranged at the end of the oscillation needle, and at least one reflection point is arranged at the end of the oscillation needle, and the oscillation range parameter is obtained by detecting the reflected light at the reflection point.

[0019] The second solution of the present application provides a rotational motion control device for a placement machine, comprising:

[0020] The state monitoring module is used to obtain the motion state of the placement machine. When the motion state is detected as a self-check state, the angle positioning piece is connected to the output shaft of the placement head;

[0021] A self-check driving module, used for driving the output shaft of the placement head to rotate for self-checking through a rotating shaft driving motor, and the output shaft drives the suction nozzle to rotate;

[0022] An error detection module, used for acquiring the rotation angle data of the angle positioning piece and detecting the rotation angle data error;

[0023] The self-check judgment module is used to check if the rotation angle error is within a preset range, and if the rotation angle error exceeds the preset range, obtain the rotation angle adjustment value, and adjust the driving data of the rotation axis driving motor according to the rotation angle.

[0024] The third scheme of the present application is to provide an angle positioning plate for a placement machine, including a positioning plate body, on which a slot adapted to the output shaft is provided, and at least one reflection point is evenly arranged on the circumference of the positioning plate body, and the reflection point can reflect the detection light of the light source back to the light source or reflect it to a specified angle.

[0025] In one of the implementations, the positioning piece body is also provided with an extended oscillation needle, the oscillation needle is flexible or rigid, and the oscillation needle can expand the oscillation range of the output shaft to 10-20 times.

[0026] Compared with the prior art, the rotational motion control method, device and angle positioning piece of a placement machine provided by the present invention have the following beneficial effects: the motion state of the placement machine is obtained, and when the motion state of the placement machine is detected as a self-test state, the angle positioning piece is connected to the output shaft of the placement head; the output shaft of the placement head is driven by the rotating shaft driving motor to rotate for self-test, and the output shaft drives the suction nozzle to rotate; the angle of the output shaft is detected by the angle positioning piece, that is, the rotation angle data of the angle positioning piece is obtained and the rotation angle data error is detected; if the rotation angle error is within the preset range, the self-test is passed; if the rotation angle error exceeds the preset range, the rotation angle adjustment value is obtained, and the driving data of the rotating shaft driving motor is adjusted according to the rotation angle, and the placement motion process is monitored to timely discover the instability of the placement process caused by external forces such as gravity, such as jitter, shaking, posture deviation, posture tilt, etc. It can maintain rotation stability, avoid angle errors, and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic flow chart of a rotational motion control method of a chip mounter in one embodiment;

[0029] Figure 2 This is a schematic diagram of the structure of an output shaft and an angle positioning piece in one embodiment;

[0030] Figure 3 This is a schematic diagram of the structure of an angle positioning piece in one embodiment;

[0031] Figure 4 This is a schematic diagram of the structure of an oscillating needle in one embodiment;

[0032] Figure 5 It is a schematic diagram of the flow chart of a rotary motion control device of a chip mounter in an example;

[0033] Figure numerals: 10, output shaft; 20, angle positioning piece; 21, reflection positioning point; 22, oscillation needle. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of this application.

[0035] When the placement head of the SMT machine is performing a large number of placement tasks, it is necessary to control the movement of the placement head to place the specified placement components on the preset pad position of the PCB at a preset distance and force. During the placement process, not only the placement movement process is controlled, but also the placement movement process is monitored to promptly detect instabilities in the placement process caused by external forces such as gravity, such as jitter, shaking, posture deviation, posture tilt, etc.

[0036] In particular, when the turntable placement head rotates in the vertical direction, it is necessary to consider the rotation stability, the vertical drive control and the gravity counterweight of the spring at the same time, which makes it difficult to maintain consistent rotation stability and the angle error is easy to accumulate. When the number of placement head systems on the placement machine is large and the placement task volume is large, the placement error is easy to accumulate, causing shutdown for debugging and maintenance, resulting in reduced production efficiency.

[0037] In one implementation, a rotational motion control method of a placement machine is proposed, comprising the following steps:

[0038] S101: Acquire the motion state of the placement machine, and when the motion state is detected as a self-test state, connect the angle positioning sheet 20 to the output shaft 10 of the placement head;

[0039] Specifically, the motion state of the placement machine includes at least a working state and a self-checking state. When the placement machine is in the working state, the rotating shaft driving motor drives the output shaft 10 of the placement head, and the output shaft 10 drives the suction nozzle to work and paste the components onto the PCB board; when the placement machine is in the self-checking state, it detects whether the angle of the output shaft 10 is offset and adjusts and corrects it in time;

[0040] S102: driving the output shaft 10 of the placement head to rotate by self-checking through the rotating shaft driving motor, and the output shaft 10 drives the suction nozzle to rotate;

[0041] Specifically, the nozzle is used to stick the electronic components on the PCB board, and the angle of the nozzle can be adjusted by adjusting the output shaft 10 connected to the nozzle, and the output shaft 10 is driven by the rotating shaft;

[0042] S103: Acquire the rotation angle data of the angle positioning piece 20 and detect the rotation angle data error;

[0043] Specifically, in the self-checking state, the angle positioning piece 20 is connected to the output shaft 10, and the angle error data of the output shaft 10 is determined by the rotation angle data collected by the angle positioning piece 20, and then the angle error data of the rotating shaft is determined;

[0044] S104: If the rotation angle error is within the preset range, the self-test passes;

[0045] Specifically, if the rotation angle error is within the preset range, it means that the rotation angle of the rotation axis is accurate, and the placement machine can continue to enter the working state;

[0046] S105: If the rotation angle error exceeds the preset range, a rotation angle adjustment value is obtained, and driving data of the rotation axis driving motor is adjusted according to the rotation angle.

[0047] Specifically, the rotation angle error data obtained by the angle positioning piece 20 is used to adjust the driving data of the rotation axis driving motor so that the rotation angle is within a preset range.

[0048] The rotational motion control method of a chip mounter provided by the present invention has the beneficial effects of: obtaining the motion state of the chip mounter, and when the motion state of the chip mounter is detected as a self-test state, connecting the angle positioning piece 20 to the output shaft 10 of the mounting head; then driving the output shaft 10 of the mounting head to rotate for self-test by the rotating shaft driving motor, and the output shaft 10 drives the suction nozzle to rotate; using the angle positioning piece 20 to detect the angle of the output shaft 10, that is, obtaining the rotation angle data of the angle positioning piece 20 and detecting the rotation angle data error; if the rotation angle error is within the preset range, the self-test passes; if the rotation angle error exceeds the preset range, obtaining the rotation angle adjustment value, adjusting the driving data of the rotating shaft driving motor according to the rotation angle, monitoring the mounting motion process, and timely discovering the instability of the mounting process caused by external forces such as gravity, such as jitter, shaking, posture deviation, posture tilt, etc. It can maintain rotation stability, avoid angle errors, and improve production efficiency.

[0049] In one implementation, the self-check state of the motion state can be defined according to the operation time of the placement machine or the number of placements performed by the placement head.

[0050] Specifically, a time interval is set, and when the placement machine runs continuously for a preset time, the self-check program is automatically triggered, and the rotation angle can be adjusted in time.

[0051] In one implementation, the angle positioning piece 20 includes a slot adapted to the output shaft 10 , and the angle positioning piece 20 can be fixed in the positioning slot of the output shaft 10 through the slot.

[0052] Specifically, the angle positioning piece 20 is connected to the output shaft 10 through a slot to improve the stability of the connection between the angle positioning piece 20 and the output shaft 10, so as to ensure the accuracy of the rotation angle error detected in each self-test state.

[0053] In one implementation manner, the angle positioning piece 20 includes a magnetic block, and the angle positioning piece 20 is fixed on the output shaft 10 via the magnetic block.

[0054] Specifically, a magnetic block is provided on the angle positioning piece 20, so that the angle positioning piece 20 and the output shaft 10 can be quickly and accurately connected to corresponding positions.

[0055] In one implementation, a plurality of reflection positioning points 21 or transmission gratings are evenly arranged on the angle positioning sheet 20.

[0056] The motion state of the placement head is obtained, and when the motion state is switched to the self-test state, the angle positioning plate 20 is transported to the output shaft 10 and / or the suction nozzle of the placement head, the angle positioning plate 20 includes a plurality of reflection positioning points 21 evenly arranged along the rotation axis direction, the light source emits detection light to the reflection positioning points 21, and obtains reflected light signals, the rotation angle of the angle positioning plate 20 is obtained according to the reflected light signals, and the rotation speed or rotation deceleration is obtained according to the rotation angles of the plurality of reflection positioning points 21.

[0057] Specifically, when the light emitted by the light source hits the reflection positioning point 21, the light will be reflected back to the detector. The detector captures the reflected light signal and converts it into an electrical signal or a digital signal for processing to obtain the rotation angle of the angle positioning plate 20, and obtains the rotation speed based on the rotation angle.

[0058] In one of the implementation methods, an oscillation needle 22 is provided on the angle positioning plate 20, and the oscillation range of the oscillation needle 22 is 10-20 times the oscillation range of the output shaft 10. The oscillation range parameter of the end of the oscillation needle 22 is detected and recorded in the self-test controller, and the oscillation range change parameter is obtained according to the oscillation range parameter stored in the self-test controller each time, and the driving parameter of the rotating drive motor is adjusted according to the oscillation range number parameter.

[0059] Specifically, in a further solution, an oscillation needle 22 is provided on the angle positioning sheet 20, which can more sensitively capture slight changes of the output shaft 10 and adjust the driving parameters of the rotary drive motor accordingly, thereby improving the overall performance and stability of the rotary shaft.

[0060] In one implementation, the step of detecting the oscillation range parameter of the end of the oscillation needle 22 includes:

[0061] A photoelectric displacement sensor is arranged at the end of the oscillation needle 22, and at least one reflection point is arranged at the end of the oscillation needle 22, and the oscillation range parameter is obtained by detecting the reflected light at the reflection point.

[0062] Specifically, the oscillation range parameters are obtained by detecting the reflected light at the reflection point, providing important data support for the self-inspection and maintenance of the rotating shaft.

[0063] The second solution of the present application provides a rotational motion control device for a placement machine, comprising:

[0064] The state monitoring module 100 is used to obtain the motion state of the placement machine, and when the motion state is detected as a self-check state, the angle positioning sheet 20 is connected to the output shaft 10 of the placement head;

[0065] The self-check driving module 200 is used to drive the output shaft 10 of the placement head to rotate for self-checking through the rotating shaft driving motor, and the output shaft 10 drives the suction nozzle to rotate;

[0066] An error detection module 300 is used to obtain the rotation angle data of the angle positioning piece 20 and detect the rotation angle data error;

[0067] The self-check judgment module 400 is used to check if the self-check is passed if the rotation angle error is within a preset range; if the rotation angle error exceeds the preset range, obtain the rotation angle adjustment value, and adjust the driving data of the rotation axis driving motor according to the rotation angle.

[0068] Specifically, the rotational motion control device of a chip mounter provided by the present invention has the following beneficial effects: the motion state of the chip mounter is obtained, and when the motion state of the chip mounter is detected as a self-test state, the angle positioning piece 20 is connected to the output shaft 10 of the mounting head; the output shaft 10 of the mounting head is driven by the rotating shaft driving motor to rotate for self-test, and the output shaft 10 drives the suction nozzle to rotate; the angle of the output shaft 10 is detected by the angle positioning piece 20, that is, the rotation angle data of the angle positioning piece 20 is obtained and the rotation angle data error is detected; if the rotation angle error is within the preset range, the self-test is passed; if the rotation angle error exceeds the preset range, the rotation angle adjustment value is obtained, and the driving data of the rotating shaft driving motor is adjusted according to the rotation angle, and the mounting motion process is monitored to timely discover the instability of the mounting process caused by external forces such as gravity, such as jitter, shaking, posture deviation, posture tilt, etc. It can maintain rotation stability, avoid angle errors, and improve production efficiency.

[0069] The third solution provided in the present application is an angle positioning plate 20 for a placement machine, including a positioning plate body, on which is provided a slot adapted to the output shaft 10, and at least one reflection point is evenly arranged on the circumference of the positioning plate body, and the reflection point can reflect the detection light of the light source back to the light source or reflect it to a specified angle.

[0070] Specifically, the angle positioning piece 20 of a chip placement machine provided by the present invention has the following beneficial effects: obtaining the motion state of the chip placement machine, and when the motion state of the chip placement machine is detected as a self-test state, connecting the angle positioning piece 20 to the output shaft 10 of the placement head; then driving the output shaft 10 of the placement head to rotate for self-test by the rotating shaft driving motor, and the output shaft 10 drives the suction nozzle to rotate; using the angle positioning piece 20 to detect the angle of the output shaft 10, that is, obtaining the rotation angle data of the angle positioning piece 20 and detecting the rotation angle data error; if the rotation angle error is within the preset range, the self-test passes; if the rotation angle error exceeds the preset range, obtaining the rotation angle adjustment value, adjusting the driving data of the rotating shaft driving motor according to the rotation angle, monitoring the placement motion process, and timely discovering the instability of the placement process caused by external forces such as gravity, such as jitter, shaking, posture deviation, posture tilt, etc. It can maintain rotation stability, avoid angle errors, and improve production efficiency.

[0071] In one implementation, the positioning plate body is also provided with an extended oscillation needle 22, which is flexible or rigid, and can expand the oscillation range of the output shaft 10 to 10-20 times. It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly or indirectly set on the other component; when a component is referred to as being "connected to" another component, it can be directly or indirectly connected to the other component.

[0072] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.

[0073] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0074] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A rotational motion control method for a chip mounter, characterized in that: The steps include: The motion state of the placement machine is obtained, and when the motion state is detected as a self-check state, the angle positioning sheet is connected to the output shaft of the placement head; The output shaft of the placement head is driven by the rotating shaft driving motor to perform self-inspection rotation, and the output shaft drives the suction nozzle to rotate; Acquiring rotation angle data of the angle positioning piece and detecting an error in the rotation angle data; If the rotation angle error is within the preset range, the self-test passes; If the rotation angle error exceeds the preset range, a rotation angle adjustment value is obtained, and the driving data of the rotation axis driving motor is adjusted according to the rotation angle.

2. The rotational motion control method of a chip mounter according to claim 1, characterized in that: The self-checking state of the motion state can be defined according to the operation time of the placement machine or the number of placements by the placement head.

3. The rotational motion control method of a chip mounter according to claim 1, characterized in that: The angle positioning piece includes a clamping slot adapted to the output shaft, and the angle positioning piece can be fixed in the positioning slot of the output shaft through the clamping slot.

4. The rotational motion control method of a chip mounter according to claim 3, characterized in that: The angle positioning piece includes a magnetic block, and the angle positioning piece is fixed on the output shaft through the magnetic block.

5. The rotational motion control method of a chip mounter according to claim 3, characterized in that: A plurality of reflection positioning points or transmission gratings are evenly arranged on the angle positioning sheet. The motion state of the placement head is obtained, and when the motion state is switched to the self-test state, the angle positioning piece is transported to the output shaft and / or the suction nozzle of the placement head, the angle positioning piece includes a plurality of reflection positioning points evenly arranged along the direction of the rotation axis, the light source emits detection light to the reflection positioning points, and obtains reflected light signals, the rotation angle of the angle positioning piece is obtained according to the reflected light signals, and the rotation speed or rotation deceleration is obtained according to the rotation angles of the plurality of reflection positioning points.

6. The rotational motion control method of a chip mounter according to claim 3, characterized in that: An oscillation needle is provided on the angle positioning plate, and the oscillation range of the oscillation needle is 10-20 times the oscillation range of the output shaft. The oscillation range parameter of the end of the oscillation needle is detected and recorded in the self-test controller, and the oscillation range change parameter is obtained according to the oscillation range parameter stored in the self-test controller each time, and the driving parameters of the rotation drive motor are adjusted according to the oscillation range change parameter.

7. The rotational motion control method of a chip mounter according to claim 6, characterized in that: The step of detecting the oscillation range parameters of the end of the oscillation needle comprises: A photoelectric displacement sensor is arranged at the end of the oscillation needle, and at least one reflection point is arranged at the end of the oscillation needle, and the oscillation range parameter is obtained by detecting the reflected light at the reflection point.

8. A rotational motion control device for a chip mounter, characterized in that: include: The state monitoring module is used to obtain the motion state of the placement machine. When the motion state is detected as a self-check state, the angle positioning piece is connected to the output shaft of the placement head; A self-check driving module, used for driving the output shaft of the placement head to rotate for self-checking through a rotating shaft driving motor, and the output shaft drives the suction nozzle to rotate; An error detection module, used for acquiring the rotation angle data of the angle positioning piece and detecting the rotation angle data error; The self-check judgment module is used to check if the rotation angle error is within a preset range, and if the rotation angle error exceeds the preset range, obtain the rotation angle adjustment value, and adjust the driving data of the rotation axis driving motor according to the rotation angle.

9. An angle positioning sheet for a chip mounter, characterized in that: It comprises a positioning piece body, on which a slot adapted to the output shaft is arranged, and at least one reflection point is evenly arranged on the circumference of the positioning piece body, and the reflection point can reflect the detection light of the light source back to the light source or reflect it to a specified angle.

10. The angle positioning sheet of the chip mounter according to claim 9, characterized in that: The positioning piece body is also provided with an extended oscillation needle, which is flexible or rigid and can expand the oscillation range of the output shaft to 10-20 times.

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