Apparatus for manufacturing display module and method for manufacturing display module

Abstract

The invention relates to an apparatus for manufacturing a display module and a method for manufacturing a display module. An apparatus for manufacturing a display module includes a stage and a mask disposed over the stage. The mask includes a body, a frame at least partially surrounding the body, and a plurality of bridges disposed between the body and the frame and extending from the body toward the frame. A plurality of openings are defined between the bridges.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0096562 filed in the Korean Intellectual Property Office on July 25, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present disclosure described herein relate to an apparatus for manufacturing a display module and a method for manufacturing a display module. Background Art

[0004] Generally, a display device includes a display module for displaying an image. The display module includes a display panel, a cover panel disposed under the display panel, and a window disposed on the display panel. The window protects the display panel from external impact and pollution. The cover panel has electromagnetic shielding function, heat dissipation function, light blocking function, and impact absorption function.

[0005] A mother panel is used when manufacturing a display module. The mother panel includes a plurality of unit panels. The above-mentioned display panel is manufactured by arranging a cover panel on the unit panel and then cutting the unit panel from the mother panel.

[0006] When the cover panel is disposed on the unit panel, a mask having openings corresponding to the cover panel is used. The portion of the mask between the openings is defined as a rib. The openings are relatively large, and thus the ribs are relatively thin. The thin ribs may be easily bent by a small impact, and when the ribs are bent, the cover panel may not be manufactured normally. Summary of the invention

[0007] The device for manufacturing a display module includes a stage and a mask disposed on the stage. The mask includes a main body, a frame at least partially surrounding the main body, and a plurality of bridges disposed between the main body and the frame and extending from the main body toward the frame. A plurality of openings are defined between the bridges.

[0008] A method for manufacturing a display module includes: placing a mother panel on a stage; placing a mask on the mother panel, the mask including a main body, a frame at least partially surrounding the main body, and a plurality of bridge portions extending from the main body toward the frame, and the mask having openings defined between the bridge portions; forming a plurality of dams by setting a first resin in the openings; removing the mask; forming a covering layer by setting a second resin in a first space defined by removing the main body and a second space defined by removing the bridge portions; and forming a covering panel by curing the dams and the covering layer.

[0009] The method for manufacturing a display module includes: placing a mother panel on a stage; forming a dam having a closed loop shape by disposing a first resin on the mother panel; curing the dam using ultraviolet light; forming a cover layer by disposing a second resin in a space defined by the dam, wherein the second resin is disposed to a height greater than a height of the dam; and thermally curing the cover layer. The first resin includes a UV curable resin, and the second resin includes a thermosetting resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and other objects and features of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0011] Figure 1 is an exploded perspective view of a display module manufacturing apparatus according to an embodiment of the present disclosure.

[0012] Figure 2 Is from Figure 1 0 is a plan view of the mother panel when viewed from above the first surface of the mother panel shown in .

[0013] Figure 3 It is along Figure 2 A cross-sectional view taken along line II' shown in FIG.

[0014] Figure 4 It is shown Figure 1 FIG. 4 is a diagram showing a planar layout of a table, a mother panel and a support member as shown in FIG.

[0015] Figure 5 It is shown Figure 1 A diagram showing a planar layout state of a mask and a mask frame as shown in FIG.

[0016] Figure 6 yes Figure 5 Magnified view of area AA shown in FIG.

[0017] Figures 7 to 17 2 is a diagram for explaining a method of manufacturing a display module according to an embodiment of the present disclosure.

[0018] Fig.18 It is used to illustrate that when the dummy layer is not used Fig.15 Diagram of the cutting process.

[0019] Fig.19 It is used to illustrate that when using a dummy layer Fig.15 Diagram of the cutting process.

[0020] Fig. 20 is a diagram showing a mask according to a comparative example.

[0021] Figure 21 to Figure 26 are diagrams illustrating a bridge portion according to various embodiments of the present disclosure.

[0022] Figures 27 to 31 2 is a diagram for explaining a method of manufacturing a display module according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0023] In this specification, when a component (or region, layer, part, etc.) is referred to as being "on", "connected to" or "coupled to" another component, this means that the component can be directly on, directly connected to or directly coupled to another component, or a third component can be present between them.

[0024] The same reference numerals may refer to the same components. Although each of the drawings may represent one or more specific embodiments of the present disclosure drawn to scale, from which relative lengths, relative thicknesses, and relative angles may be inferred, it should be understood that the present invention is not necessarily limited to the relative lengths, relative thicknesses, and relative angles shown. These values ​​may be changed within the spirit and scope of the present disclosure, for example, to allow for manufacturing limitations, etc.

[0025] As used herein, the term "and / or" includes all of one or more combinations defined by the relevant components.

[0026] Various components can be described using terms such as first, second, etc., but these components should not necessarily be limited by these terms. These terms can be used only to distinguish one component from other components. For example, without departing from the scope of the present disclosure, a first component can be referred to as a second component, and similarly, a second component can also be referred to as a first component. Unless otherwise stated, a term in the singular may include a plural form.

[0027] In addition, terms such as "below", "under", "above", and "over" are used to describe the relationship of components shown in the drawings. These terms are relative concepts and are described based on the directions shown in the drawings.

[0028] It should be understood that when used in this document, terms such as "comprises," "includes," and "has" specify the presence of stated features, quantities, steps, operations, components, parts, or a combination thereof, but do not exclude the presence or addition of one or more other features, quantities, steps, operations, components, parts, or a combination thereof.

[0029] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0030] Figure 1 is an exploded perspective view of a display module manufacturing apparatus according to an embodiment of the present disclosure.

[0031] exist Figure 1, a mother panel M-DP as an object to be processed is shown together with a display module manufacturing apparatus DMA.

[0032] refer to Figure 1 , the display module manufacturing apparatus DMA according to an embodiment of the present disclosure may include a stage STG, a plurality of supports SUP, a mask MK, and a mask frame MF.

[0033] The stage STG may have a rectangular shape having a pair of long sides extending parallel to each other in the first direction DR1 and a pair of short sides extending parallel to each other in the second direction DR2 crossing the first direction DR1. However, the shape of the stage STG is not necessarily limited thereto. The stage STG may have a plane defined by the first direction DR1 and the second direction DR2.

[0034] Hereinafter, a direction intersecting a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. The third direction DR3 may be substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2. As used herein, the expression "when viewed from above a plane" or "in a plan view" may mean viewing in the third direction DR3.

[0035] The mother panel M-DP as an object to be processed may be set on the stage STG. The mother panel M-DP may be fixedly arranged on the upper surface of the stage STG. A plurality of vacuum holes may be defined in the upper surface of the stage STG, and the mother panel M-DP may be fixed to the upper surface of the stage STG by the vacuum pressure in the vacuum holes.

[0036] The mother panel M-DP may have a rectangular shape having a pair of long sides extending parallel to each other in the first direction DR1 and a pair of short sides extending parallel to each other in the second direction DR2. However, the shape of the mother panel M-DP is not necessarily limited thereto. The mother panel M-DP may have a plane defined by the first direction DR1 and the second direction DR2. Basically, the mother panel M-DP may include a plurality of unit panels, and the configuration of the mother panel M-DP will be described in detail below.

[0037] The mother panel M-DP may have a first surface US1 and a second surface US2 opposite to the first surface US1. Each of the first surface US1 and the second surface US2 may have a plane defined by a first direction DR1 and a second direction DR2. In the display module manufacturing apparatus DMA, the first surface US1 may face downward and the second surface US2 may face upward. A plurality of cover panels may be formed on the second surface US2 by the display module manufacturing apparatus DMA, and the process will be described in detail below.

[0038] The support SUP may be disposed on the stage STG. The support SUP may be disposed on the same plane as the mother panel M-DP. The support SUP may be adjacent to an edge of the mother panel M-DP.

[0039] The support SUP may include a support SUP extending in the first direction DR1 and a support SUP extending in the second direction DR2. The support SUP extending in the first direction DR1 may be adjacent to the long side of the mother panel M-DP extending in the first direction DR1. The support SUP extending in the second direction DR2 may be adjacent to the short side of the mother panel M-DP extending in the second direction DR2.

[0040] The mask MK and the mask frame MF may be disposed on the stage STG. The mask MK may be disposed on the mother panel M-DP. The mask frame MF may be disposed on the support SUP. Therefore, the mother panel M-DP and the support SUP may be disposed between the mask MK and the stage STG and between the mask frame MF and the stage STG.

[0041] The first surface US1 of the mother panel M-DP may face toward the stage STG and may face the stage STG. The second surface US2 of the mother panel M-DP may face toward the mask MK and may face the mask MK.

[0042] The mask MK may have a rectangular shape having a pair of long sides extending parallel to each other in the first direction DR1 and a pair of short sides extending parallel to each other in the second direction DR2. However, the shape of the mask MK is not necessarily limited thereto. The mask MK may include a metal / metal alloy. For example, the mask MK may include Invar or stainless steel.

[0043] The mask MK may include a plurality of bodies BD. The bodies BD may be arranged in the first direction DR1 and the second direction DR2. Although six bodies BD arranged in three rows (corresponding to the first direction DR1) and two columns (corresponding to the second direction DR2) are shown as an example, the number and arrangement of the bodies BD are not necessarily limited to Figure 1 The status shown in .

[0044] A plurality of openings OP may be defined around each of the bodies BD. The openings OP may at least partially surround the bodies BD. In addition, a plurality of dummy openings DOP may be defined in the mask MK to be located outside the openings OP. The functions of the openings OP and the dummy openings DOP will be described in detail below.

[0045] The mask frame MF may have a frame shape. The outer edge of the mask frame MF may have a rectangular shape having a pair of long sides extending parallel to each other in the first direction DR1 and a pair of short sides extending parallel to each other in the second direction DR2. However, the shape of the mask frame MF is not necessarily limited thereto.

[0046] The mask frame MF may have an opening M-OP defined therein. The opening M-OP may have a shape corresponding to the mask MK. The mask MK may be disposed in the opening M-OP. Thus, the mask frame MF may at least partially surround the mask MK. The mask frame MF may include a metal / metal alloy. For example, the mask frame MF may include aluminum (Al).

[0047] Figure 2 Is from Figure 1 0 is a plan view of the mother panel when viewed from above the first surface of the mother panel shown in .

[0048] refer to Figure 2 , the mother panel M-DP may include a plurality of unit panels U-DP. For example, the unit panel U-DP is shown by a dotted line. Each of the unit panels U-DP may be defined as a display panel for displaying an image.

[0049] The unit panels U-DP may be cut after the cover panels overlapping the respective unit panels U-DP are disposed on the second surface US2. Figure 2 The edges shown by the dotted lines in FIG. 1 may define cutting lines in a cutting process to be described below. The unit panels U-DP may be separated from each other by cutting the mother panel M-DP along the edges of the unit panels U-DP defined as cutting lines. This process will be described in detail below.

[0050] Each of the unit panels U-DP may have a rectangular shape having a pair of long sides extending in the first direction DR1 and a pair of short sides extending in the second direction DR2 However, the shape of the unit panel U-DP is not necessarily limited thereto.

[0051] refer to Figure 1 and Figure 2 When viewed from above, the unit panel U-DP can be Figure 1 Therefore, the unit panels U-DP may be arranged in the first direction DR1 and the second direction DR2. Although six unit panels U-DP arranged in three rows and two columns are shown as an example, the number and arrangement of the unit panels U-DP are not necessarily limited thereto.

[0052] Figure 3 It is along Figure 2 A cross-sectional view taken along line II' shown in FIG.

[0053] In the following, Figure 3 In the embodiment, the unit panel U-DP is referred to as a display panel DP.

[0054] refer to Figure 2 and Figure 3 In an embodiment of the present disclosure, the display panel DP may be an emissive display panel, but is not necessarily particularly limited thereto. For example, the display panel DP may be an organic light emitting diode (OLED) display panel or a quantum dot light emitting display panel. The emissive layer of the organic light emitting diode display panel may include an organic light emitting material. The emissive layer of the quantum dot light emitting display panel may include quantum dots and quantum rods. Hereinafter, the display panel DP will be exemplified as an organic light emitting diode display panel.

[0055] The display panel DP may include a substrate SUB, a circuit element layer DP-CL disposed on the substrate SUB, a display element layer DP-OLED disposed on the circuit element layer DP-CL, a thin film encapsulation layer TFE disposed on the display element layer DP-OLED, a panel protection layer PPL disposed under the substrate SUB, and an adhesive layer ADH disposed between the substrate SUB and the panel protection layer PPL. The substrate SUB, the circuit element layer DP-CL, the display element layer DP-OLED, the thin film encapsulation layer TFE, and the panel protection layer PPL may be defined as components of a mother panel M-DP.

[0056] The substrate SUB may include a display area DA and a non-display area NDA at least partially surrounding the display area DA. The substrate SUB may include glass. However, it is not necessarily limited thereto, and the substrate SUB may include a flexible plastic material such as polyimide. The display element layer DP-OLED may be disposed in the display area DA.

[0057] A plurality of pixels may be provided in the display area DA. Each of the pixels may include a light emitting element connected to a transistor provided in the circuit element layer DP-CL and provided in the display element layer DP-OLED.

[0058] The thin film encapsulation layer TFE may be disposed on the circuit element layer DP-CL and may cover the display element layer DP-OLED. The thin film encapsulation layer TFE may include an inorganic layer and an organic layer between the inorganic layers. The inorganic layer may protect the pixel from moisture / oxygen. The organic layer may protect the pixel from foreign matter such as dust particles.

[0059] The panel protection layer PPL may protect the bottom of the substrate SUB. The panel protection layer PPL may include a flexible plastic material. For example, the panel protection layer PPL may include polyimide or polyethylene terephthalate.

[0060] The adhesive layer ADH may be disposed between the substrate SUB and the panel protection layer PPL. The substrate SUB and the panel protection layer PPL may be bonded to each other by the adhesive layer ADH. The adhesive layer ADH may include a pressure sensitive adhesive (PSA). However, the type of adhesive is not necessarily limited thereto.

[0061] Similar to the mother panel M-DP, the display panel DP may include a first surface US1 and a second surface US2. The first surface US1 may be defined by the upper surface of the thin film encapsulation layer TFE, and the second surface US2 may be defined by the lower surface of the panel protection layer PPL. Therefore, the substrate SUB, the circuit element layer DP-CL, and the display element layer DP-OLED may be disposed between the first surface US1 and the second surface US2.

[0062] The display element layer DP-OLED may be disposed on the substrate SUB facing the first surface US1. Since the unit panels U-DP overlap the respective bodies BD as described above, the display element layer DP-OLED may overlap corresponding ones of the bodies BD when viewed from above the plane.

[0063] exist Figure 3 In FIG. 4 , the first surface US1 has a step between the display area DA and the non-display area NDA. However, in the mother panel M-DP, the first surface US1 is shown to be flat.

[0064] Figure 4 It is shown Figure 1 FIG. 4 is a diagram showing a planar layout of a table, a mother panel and a support member as shown in FIG.

[0065] refer to Figure 4 , when the mother panel M-DP and the support SUP are disposed on the stage STG, the mother panel M-DP and the support SUP may be disposed inside the edge of the stage STG. The mother panel M-DP may be disposed such that its second surface US2 faces upward.

[0066] The supports SUP extending in the first direction DR1 and facing each other in the second direction DR2 may make contact with the long sides of the mother panel M-DP extending parallel to each other in the first direction DR1. The supports SUP extending in the second direction DR2 and facing each other in the first direction DR1 may make contact with the short sides of the mother panel M-DP extending in the second direction DR2.

[0067] The long side and the short side of the mother panel M-DP may define the edge of the mother panel M-DP. The support SUP may be in contact with the edge of the mother panel M-DP. The edge of the mother panel M-DP may be supported by the support SUP, and the position of the mother panel M-DP may be fixed accordingly.

[0068] Although the supports SUP are disposed at all of the four sides of the mother panel M-DP, the embodiments of the present disclosure are not necessarily limited thereto. For example, two supports SUP extending only in the first direction DR1 may contact the long sides of the mother panel M-DP. Alternatively, two supports SUP extending only in the second direction DR2 may contact the short sides of the mother panel M-DP.

[0069] Figure 5 It is shown Figure 1 A diagram showing a planar layout state of a mask and a mask frame as shown in FIG. Figure 6 yes Figure 5 Magnified view of area AA shown in FIG.

[0070] refer to Figure 5 , the mask MK may be disposed in the opening M-OP of the mask frame MF. Therefore, the mask frame MF may at least partially surround the edge of the mask MK. The inner surface of the mask frame MF defining the opening M-OP may make contact with the edge of the mask MK. Therefore, the mask MK may be easily fixed to the mask frame MF.

[0071] The mask MK may include a plurality of bodies BD, a frame FMP, and a plurality of bridges BG. Each of the bodies BD may have a plane defined by the first direction DR1 and the second direction DR2.

[0072] The frame FMP may be defined as a portion of the mask MK surrounding the body BD. For example, the frame FMP may be defined as a portion of the mask MK between the bodies BD. In addition, the frame FMP may be defined as a portion of the mask MK between an edge of the mask MK and an edge of the body BD, the edge of the body BD facing the edge of the mask MK.

[0073] The bridge BG may be disposed between each of the bodies BD and the frame FMP. The bridge BG may be disposed along the edge of the body BD. For example, the bridge BG may at least partially surround the body BD. The frame FMP may be defined as a portion of the mask MK disposed outside the bridge BG and surrounding the body BD. The portion of the frame FMP between the bodies BD may be defined as a rib RB.

[0074] The bridge portion BG may extend from each of the main bodies BD toward the frame FMP. Although twelve bridge portions BG extending from the main bodies BD are shown as an example, more bridge portions BG may extend from the main bodies BD.

[0075] The bridge BG may connect the body BD and the frame FMP. For example, the body BD, the bridge BG, and the frame FMP may be formed integrally. However, this is not necessarily limited to the present invention, and the bridge BG may be manufactured separately and may be connected to the body BD and the frame FMP. For example, the bridge BG may be connected to the body BD and the frame FMP by a welding process.

[0076] A plurality of openings OP may be defined between the bridges BG. Basically, the openings OP may be defined between the bridges BG, the body BD, and the frame FMP. The openings OP may be arranged along each of the bodies BD.

[0077] The body BD may have a pair of long sides extending parallel to each other in the first direction DR1 and a pair of short sides extending parallel to each other in the second direction DR2. An opening OP defined along the long sides of the body BD may extend in the first direction DR1, and an opening OP defined along the short sides of the body BD may extend in the second direction DR2.

[0078] A plurality of dummy openings DOP may be defined in the frame FMP. The dummy openings DOP may be disposed outside the bridge BG and the opening OP. The dummy openings DOP may at least partially surround the bridge BG. The dummy openings DOP may be adjacent to the bridge BG and the opening OP.

[0079] The dummy openings DOP may extend along the long and short sides of the body BD. The dummy openings DOP adjacent to the long sides of the body BD may extend in the first direction DR1, and the dummy openings DOP adjacent to the short sides of the body BD may extend in the second direction DR2.

[0080] refer to Figure 5 and Figure 6 , each of the bridge portions BG may have a curved shape. Figure 6 In the embodiment of the present invention, the bridge portion BG may extend in the first direction DR1, the second direction DR2, and the first direction DR1, and may be bent twice. The bridge portion BG may have a width of 0.5 mm to 1.5 mm. The width of the bridge portion BG may be defined as a value measured in a direction intersecting the extending direction of the bridge portion BG.

[0081] Figures 7 to 17 2 is a diagram for explaining a method of manufacturing a display module according to an embodiment of the present disclosure. Figure 7 It is along Figure 5 A cross-sectional view taken along line II-II' shown in FIG.

[0082] exist Figure 7 , a cross section of the stage STG, the mother panel M-DP, the support SUP, the mask MK, and the mask frame MF are shown together. The unit panel U-DP is shown by a dotted line.

[0083] refer to Figure 7 , a mother panel M-DP including a unit panel U-DP may be disposed on the stage STG, and a mask MK may be disposed on the mother panel M-DP. As described above, the support SUP may be brought into contact with the edge of the mother panel M-DP, and the mother panel M-DP may be fixed accordingly. In addition, a mask MK may be disposed in the opening M-OP of the mask frame MF, and the mask MK may be fixed accordingly.

[0084] When viewed from above a plane, an opening OP may be provided on the inner side of an edge of each of the unit panels U-DP. When viewed from above a plane, a dummy opening DOP may be provided on the outer side of an edge of the unit panel U-DP. Therefore, when viewed from above a plane, an edge of the unit panel U-DP may be provided between an opening OP adjacent to an edge of the unit panel U-DP and the dummy opening DOP.

[0085] refer to Figure 8 , a squeegee SQZ may be provided on the mask MK. In addition, a first resin RIN1 may be provided on the mask MK. The first resin RIN1 may be provided on an upper surface of the mask MK adjacent to one side of the mask MK.

[0086] The squeegee SQZ may be moved in the first direction DR1 to push the first resin RIN1 from one side of the mask MK to the opposite side of the mask MK. When the squeegee SQZ pushes the first resin RIN1, the first resin RIN1 may be disposed in the opening OP and the dummy opening DOP. This process using the mask MK and the squeegee SQZ may be defined as a metal mask screen printing process.

[0087] A first resin RIN1 may be provided in the opening OP to form a plurality of dams DAM. A first resin RIN1 may be provided in the dummy opening DOP to form a plurality of dummy layers DUM. Therefore, a dam DAM and a dummy layer DUM may be provided on the mother panel M-DP. The dam DAM may be provided on the unit panel U-DP to be adjacent to an edge of the unit panel U-DP. The dummy layer DUM may be provided on the outside of the unit panel U-DP.

[0088] refer to Fig. 9 , the mask MK and the mask frame MF may be removed from the mother panel M-DP. Therefore, the dam DAM and the dummy layer DUM may remain on the mother panel M-DP.

[0089] Fig.10 It shows that the setting Fig. 9 A plan view of the dam and dummy layers on a unit panel is shown in FIG.

[0090] exist Fig.10, the edge of the unit panel U-DP is shown by a dotted line. The edge of the unit panel U-DP may be used as a cutting line in a cutting process to be described below.

[0091] refer to Fig.10 , the dam DAM may be arranged along the edge of the unit panel U-DP. The dam DAM may be provided inside the edge of the unit panel U-DP. The dam DAM may have a shape corresponding to the opening OP.

[0092] The dam DAM adjacent to the long side of the unit panel U-DP extending in the first direction DR1 may extend in the first direction DR1 and may be arranged in the first direction DR1. The dam DAM adjacent to the short side of the unit panel U-DP extending in the second direction DR2 may extend in the second direction DR2 and may be arranged in the second direction DR2.

[0093] The first resin RIN1 may be provided in the opening OP and the dummy opening DOP and may be blocked by the body BD and the bridge BG. When the mask MK is removed, a first space SP1 may be defined in a region overlapping the body BD. For example, the first space SP1 may be defined as a space formed by removing the body BD. In addition, the first space SP1 may be defined as a space surrounded by the dam DAM.

[0094] When the mask MK is removed, the second space SP2 may be defined in the region overlapping the bridge portion BG. For example, the second space SP2 may be defined as a space formed by removing the bridge portion BG. In addition, each of the second spaces SP2 may be defined as a space between two dams DAM adjacent to each other.

[0095] The dummy layer DUM may be located outside the unit panel U-DP and may be adjacent to the four sides of the unit panel U-DP, respectively. Although four dummy layers DUM adjacent to the four sides of the unit panel U-DP are shown as an example, the number of dummy layers DUM is not necessarily limited thereto, and more than four dummy layers DUM may be provided.

[0096] The dummy layer DUM adjacent to the long side of the unit panel U-DP extending in the first direction DR1 may extend in the first direction DR1. The dummy layer DUM adjacent to the short side of the unit panel U-DP extending in the second direction DR2 may extend in the second direction DR2.

[0097] refer to Fig.11, a nozzle NZ may be provided above the mother panel M-DP, and the second resin RIN2 may be applied from the nozzle NZ toward the mother panel M-DP. The second resin RIN2 may be provided on the mother panel M-DP. The second resin RIN2 may be provided in the first space SP1. For example, the second resin RIN2 may be provided on each of the unit panels U-DP.

[0098] The process of providing the resin on the processing target using the nozzle NZ can be defined as a dispensing printing process. An inkjet method, a jet valve method, and a slit coating method can be used as the dispensing printing process.

[0099] Fig.12 The second resin is shown in Fig.11 A floor plan showing the status of a unit panel is shown in FIG. Fig.13 It shows that the setting Fig.12 An enlarged view of the second resin in one second space is shown in FIG.

[0100] refer to Fig.12 and Fig.13 , after the second resin RIN2 is disposed in the first space SP1, the second resin RIN2 may be disposed from the first space SP1 to the second space SP2 according to the flow of the second resin RIN2. When the second resin RIN2 is disposed in the second space SP2, the second resin RIN2 may not overflow the dam DAM. For example, the second resin RIN2 may not be disposed outside the second space SP2.

[0101] For example, the second resin RIN2 may have a viscosity of 1000 cps to 100000 cps, for example, a viscosity of 35000 cps. As the viscosity of the second resin RIN2 increases, the fluidity of the second resin RIN2 may decrease. Since each of the bridge portions BG has a width of 0.5 mm to 1.5 mm as described above, each of the second spaces SP2 may also have a relatively small width of 0.5 mm to 1.5 mm.

[0102] refer to Fig.13 , when the second resin RIN2 has a high viscosity (e.g., 35000 cps) and the second space SP2 has a relatively small width of 0.5 mm to 1.5 mm, the second resin RIN2 can be set all the way to the second space SP2 and can not overflow the dam DAM. In addition, because each of the bridge portions BG has a curved shape, the second space SP2 can also have a curved shape.

[0103] The second space SP2 having a curved shape may hinder the flow of the second resin RIN2. For example, the fluidity of the second resin RIN2 having high viscosity may be further reduced in the second space SP2. Therefore, the second resin RIN2 having high viscosity and low fluidity may be disposed only in the second space SP2, and not outside the second space SP2.

[0104] refer to Fig.11 and Fig.12 , a second resin RIN2 may be disposed in the first space SP1 and the second space SP2 to form a cover layer COV. A dam DAM and a cover layer COV may be disposed inside the edge of the unit panel U-DP. The cover layer COV and the dam DAM on each of the unit panels U-DP may be in contact with each other.

[0105] According to the above process, the first resin RIN1 and the second resin RIN2 may be directly applied to the second surface US2 of the mother panel M-DP to form the dam DAM and the cover layer COV. The first resin RIN1 and the second resin RIN2 may include the same material. The first resin RIN1 and the second resin RIN2 may include a thermosetting resin.

[0106] refer to Fig.14 , the first resin RIN1 and the second resin RIN2 may be cured by the same method. For example, the dam DAM, the dummy layer DUM, and the cover layer COV may be cured by heat applied to the dam DAM, the dummy layer DUM, and the cover layer COV. For example, the dam DAM, the dummy layer DUM, and the cover layer COV may be thermally cured.

[0107] Thermosetting resins may shrink during thermal curing. Since the first resin RIN1 and the second resin RIN2 include the same material, the first resin RIN1 and the second resin RIN2 may have the same shrinkage rate. Therefore, even after thermal curing, the dummy layer DUM and the cover layer COV formed by the first resin RIN1 and the second resin RIN2 may have the same thickness.

[0108] The solidified dummy layer DUM and the solidified cover layer COV may form a cover panel CPN. The cover panel CPN may be disposed on the mother panel M-DP. The cover panels CPN may be disposed on the unit panels U-DP, respectively. The cover panel CPN may be disposed on the second surface US2. Each of the cover panels CPN may include a cover layer COV and a dam DAM in contact with the cover layer COV.

[0109] The first resin RIN1 and the second resin RIN2 may include a polymer resin, graphite and carbon fiber. The polymer resin may include silicone or rubber. Graphite and carbon fiber may be dispersed in the polymer resin as fillers in the form of solid particles. The graphite particles may have a size of 5 to 30 microns. The carbon fiber particles may have a size of 50 to 200 microns.

[0110] Graphite may have a heat dissipation function. Carbon fiber may be black in color and may have a light blocking function and an electromagnetic shielding function. Polymer resin may have an impact absorbing function.

[0111] According to the constituent materials of the first resin RIN1 and the second resin RIN2, each of the cover panels CPN can have a heat dissipation function, a light blocking function, an electromagnetic shielding function, and an impact absorption function. By directly coating the second surface US2 of the unit panel U-DP with the first resin RIN1 and the second resin RIN2 and curing the first resin RIN1 and the second resin RIN2, a cover panel CPN can be set on the unit panel U-DP.

[0112] When the cover panel CPN is not formed of the first resin RIN1 and the second resin RIN2, a layer having a heat dissipation function, a layer having a light blocking function, a layer having an electromagnetic shielding function, and a layer having an impact absorption function must be respectively provided on the unit panel U-DP. For example, a black light blocking film is provided on each of the unit panels U-DP, a buffer layer for absorbing external impact is provided on the light blocking film, and a metal layer for shielding electromagnetic and having a heat dissipation function is provided on the buffer layer.

[0113] Because these layers are stacked on the unit panel U-DP, multiple processes may be required, and thus process efficiency may be reduced. In addition, a separate adhesive layer for bonding these layers may be required.

[0114] However, in the embodiment of the present disclosure, the cover panel CPN may be formed by directly coating the second surface US2 of the unit panel U-DP with the first resin RIN1 and the second resin RIN2. Therefore, the process may be simplified.

[0115] refer to Fig.15 , the mother panel M-DP may be reversed in the third direction DR3. Therefore, the first surface US1 may face upward, and the second surface US2 may face downward. A cutting tool CT may be provided on the mother panel M-DP. A cutting tool CT may be provided on the first surface US1. For example, the cutting tool CT may be a cutter.

[0116] The edges of the unit panels U-DP shown by the dotted lines may define the cutting lines CL of the mother panel M-DP. In each of the unit panels U-DP, the cutting lines CL may be defined between the dummy layer DUM and the cover panel CPN.

[0117] The cutting tool CT may move along the cutting line CL while rotating, and may cut the unit panel U-DP from the mother panel M-DP. Thus, the unit panels U-DP may be separated from each other. The cutting tool CT may apply pressure to the first surface US1 to form a crack on the first surface US1, and thus the mother panel M-DP may be cut into the unit panels U-DP.

[0118] Fig.16 It is shown Fig.15 A diagram of a unit panel and a covering panel coated on the unit panel is shown in FIG. Fig.17 It shows that the setting Fig.16 Figure 2 shows the components on the unit panel.

[0119] In the following, Fig.16 and Fig.17 In the embodiment, the unit panel U-DP is referred to as a display panel DP.

[0120] refer to Fig.16 , a cover panel CPN having a heat dissipation function, a light blocking function, an electromagnetic shielding function, and an impact absorbing function may be disposed under the display panel DP. The display panel DP and the cover panel CPN may be components of the display module DM.

[0121] refer to Fig.17 , the input sensing unit ISP, the anti-reflection layer RPL, and the window WIN may be sequentially stacked on the display panel DP. The input sensing unit ISP may be directly disposed on the display panel DP, and the anti-reflection layer RPL may be directly disposed on the input sensing unit ISP. An adhesive layer AD may be disposed between the window WIN and the anti-reflection layer RPL, and the window WIN and the anti-reflection layer RPL may be bonded to each other through the adhesive layer AD.

[0122] The display module DM may be manufactured by sequentially stacking an input sensing unit ISP, an anti-reflection layer RPL, and a window WIN on the display panel DP. Therefore, the display module DM may include the display panel DP, the cover panel CPN, the input sensing unit ISP, the anti-reflection layer RPL, and the window WIN.

[0123] The input sensing unit ISP may include a plurality of sensors for sensing external input. For example, the input sensing unit ISP may sense external input in a capacitive type. However, the sensing method of the input sensing unit ISP is not necessarily limited thereto. When manufacturing the display module DM, the input sensing unit ISP may be directly formed on the display panel DP.

[0124] An anti-reflection layer RPL may be provided on the input sensing unit ISP. When manufacturing the display module DM, the anti-reflection layer RPL may be directly formed on the input sensing unit ISP. The anti-reflection layer RPL may be defined as a film for preventing reflection of external light. The anti-reflection layer RPL may reduce the reflectivity of external light incident from above the display device toward the display panel DP.

[0125] When external light traveling toward the display panel DP is reflected from the display panel DP and provided back to the user, the user may visually recognize the external light as in a mirror (e.g., the user may see the reflection). To prevent this phenomenon, the anti-reflection layer RPL may include a plurality of color filters displaying the same color as the color of the pixels of the display panel DP.

[0126] The color filter may filter the external light into the same color as the color of the pixel. In this case, the external light may not be visible to the user. However, it is not necessarily limited thereto, and the anti-reflection layer RPL may include a phase retarder and / or a polarizer to reduce the reflectivity of the external light.

[0127] For example, the input sensing unit ISP may be directly formed on the display panel DP, and the anti-reflection layer RPL may be directly formed on the input sensing unit ISP. However, the embodiments of the present disclosure are not necessarily limited thereto. For example, the input sensing unit ISP may be manufactured separately and may be attached to the display panel DP by an adhesive layer, and the anti-reflection layer RPL may be manufactured separately and may be attached to the input sensing unit ISP by an adhesive layer.

[0128] Fig.18 It is used to illustrate that when the dummy layer is not used Fig.15 Diagram of the cutting process. Fig.19 It is used to illustrate that when using a dummy layer Fig.15 Diagram of the cutting process.

[0129] Fig.18 and Fig.19 A portion of the mother panel M-DP adjacent to one side of the cover panel CPN is shown.

[0130] refer to Fig.18, the dummy layer DUM may not be used. A cutting tool CT may be provided on the first surface US1. The cutting tool CT may apply pressure to the mother panel M-DP along the cutting line CL to form a crack CRK' in the mother panel M-DP. However, due to the asymmetry of stress between a portion of the mother panel M-DP on which the cover panel CPN is provided and a portion of the mother panel M-DP on which the cover panel CPN is not provided, an inclined crack CRK' may be generated.

[0131] The cover panel CPN disposed under the mother panel M-DP may be used as a support member for supporting a portion of the mother panel M-DP that overlaps with the cover panel CPN. However, the cover panel CPN is not disposed under a portion of the mother panel M-DP that does not overlap with the cover panel CPN, and thus there is no component used as a support member. In this case, according to the above-mentioned stress asymmetry phenomenon, when the cutting tool CT applies pressure to the cutting line CL, an inclined crack CRK' may be generated. Therefore, the cutting process may not be performed normally.

[0132] refer to Fig.19 , the cover panel CPN may support a portion of the mother panel M-DP on the left side relative to the cutting line CL, and the dummy layer DUM may support a portion of the mother panel M-DP on the right side relative to the cutting line CL. In this case, when the cutting tool CT applies pressure to the cutting line CL, a crack CRK extending in the third direction DR3 may be normally formed along the cutting line CL. Therefore, due to the dummy layer DUM, the cutting process may be normally performed.

[0133] Fig. 20 is a diagram showing a mask according to a comparative example.

[0134] Fig. 20 is a plan view of a mask according to a comparative example.

[0135] refer to Fig. 20 , a plurality of openings OP' may be defined in the mask MK' according to the comparative example. Portions between the openings OP' of the mask MK' may be defined as ribs RB'. Figure 5 Unlike the mask MK shown in , the mask MK′ may not include the body BD and the bridge BG.

[0136] Overlay panels can be created by using Fig. 20 The mask MK' shown in FIG. is formed by a mask screen printing process. For example, similar to Figure 8 As shown in FIG. 1 , the squeegee SQZ may push the resin disposed on the mask MK', and the resin may be disposed on the mother panel M-DP through the opening OP'. The resin disposed in the opening OP' may be cured to form a cover panel.

[0137] Because a large opening OP' is defined in the mask MK', the width of the rib RB' may be particularly narrow. Therefore, the rib RB' may be susceptible to impact. When the mask MK' moves, the rib RB' may be bent due to a collision with an external object. When the rib RB' is bent, the resin may not be set in a predetermined area. Therefore, the cover panel CPN may have defects.

[0138] refer to Figure 5 and Fig. 20 , unlike the mask MK', the mask MK may not include a large opening OP', and may include a body BD and a bridge BG. The body BD and the bridge BG may be connected to the rib RB.

[0139] Since the bridge portion BG is connected to the rib portion RB, the bridge portion BG can serve to more firmly fix the rib portion RB. Therefore, even if an external impact is applied to the mask MK, the rib portion RB may not be deformed.

[0140] Figure 21 to Figure 26 are diagrams illustrating a bridge portion according to various embodiments of the present disclosure.

[0141] Figure 21 to Figure 26 Shown with Figure 6 The following description will focus on the corresponding enlarged figure. Figure 6 The bridge BG shown in Figure 21 to Figure 26 Therefore, to the extent that no element is described in detail with respect to this figure, it is understood that the element is at least similar to corresponding elements that have been described elsewhere within the present disclosure.

[0142] refer to Fig.21 , the bridge portion BG-1 may have a trapezoidal shape from the body BD to the frame FMP. Therefore, the width of the bridge portion BG-1 in the second direction DR2 may gradually decrease in the first direction DR1. For example, the width of the bridge portion BG-1 may gradually decrease toward the outside.

[0143] When the mask MK is removed, as described above with reference to Figures 10 to 13 As described above, the second space SP2 may be formed in the portion where the bridge portion BG-1 is provided. Fig.21 The reference sign “SP2” of the second space SP2 shown in FIG. 1 is shown on the assumption that the bridge portion BG- 1 is removed.

[0144] Since the bridge portion BG-1 has a trapezoidal shape, the second space SP2 may also have a trapezoidal shape toward the frame FMP. Therefore, the width of the second space SP2 may also gradually decrease toward the outside. For example, the second space SP2 may become narrower toward the exit of the frame FMP.

[0145] When the second resin RIN2 is disposed from the first space SP1 into the second space SP2, the fluidity of the second resin RIN2 may be reduced because the outlet of the second space SP2 is narrowed. Therefore, the second resin RIN2 may not overflow outside the second space SP2.

[0146] refer to Figure 22 to Figure 24 , the bridge BG-2 may have a curved shape from the body BD toward the frame FMP. The bridge BG-3 may have a wave shape extending in a curve from the body BD toward the frame FMP. The bridge BG-4 may have a curved shape in which ridges are repeated from the body BD toward the frame FMP.

[0147] refer to Fig.25 and Fig.26 , the bridge portion BG-5 may extend in a straight line from the body BD toward the frame FMP. The bridge portion BG-6 may extend obliquely from the body BD toward the frame FMP.

[0148] Figures 27 to 31 2 is a diagram for explaining a method of manufacturing a display module according to an embodiment of the present disclosure.

[0149] exist Fig. 27 as well as Figure 29 to Figure 31 , a cross section of a unit panel U-DP of a mother panel M-DP is shown. Fig.28 yes Fig. 27 A plan view of the dam DAM' shown in FIG.

[0150] refer to Fig. 27 and Fig.28 , a mother panel M-DP may be set on the stage STG, and a first nozzle NZ1 may be set above the mother panel M-DP. The above-mentioned mask MK may not be used. The first resin RIN1' may be set on the mother panel M-DP from the first nozzle NZ1. The first resin RIN1' may be set in a quadrilateral closed loop shape on the mother panel M-DP. For example, the first nozzle NZ1 may be moved along the quadrilateral closed loop shape, and the first resin RIN1' may be set on the mother panel M-DP.

[0151] The dam DAM' having a quadrilateral closed loop shape may be formed by the first resin RIN1'. The first space SP1 may be defined by the dam DAM'. The first space SP1 may be substantially the same as the space defined by removing the body BD. Fig.10 Therefore, the first space SP1 defined by the dam DAM' is given Fig.10 The reference numerals of the first space SP1 shown in FIG. 1 are the same as those of FIG.

[0152] The dummy layer DUM may be formed by the first resin RIN1′, and for the convenience of description, Figures 27 to 31 The dummy layer DUM is omitted.

[0153] The first resin RIN1' may include an ultraviolet curable resin (hereinafter, referred to as a UV curable resin). In addition, the first resin RIN1' may be black in color. Therefore, the dam DAM' may have a light blocking function and an impact absorbing function.

[0154] refer to Fig.29 , the dam DAM' can be cured by ultraviolet (UV) light. Since the UV curable resin does not shrink even when cured by ultraviolet (UV) light, the thickness of the dam DAM' can be maintained.

[0155] refer to Fig.30 , the second resin RIN2' may be disposed in the first space SP1 through the second nozzle NZ2. The second resin RIN2' may have a height greater than that of the dam DAM'. For example, the second resin RIN2' may be disposed on the mother panel M-DP to be thicker than the first resin RIN1'. A cover layer COV' may be formed by the second resin RIN2'.

[0156] The second resin RIN2' may include a material different from that of the first resin RIN1'. The second resin RIN2' may include a thermosetting resin. The second resin RIN2' may include the same material as the first resin RIN1 and the second resin RIN2 described above. Therefore, the cover layer COV' may have a heat dissipation function, a light blocking function, an electromagnetic shielding function, and an impact absorption function.

[0157] refer to Fig.31 , the cover layer COV' may be thermally cured. The cover layer COV' may shrink during thermal curing. The cover layer COV' shrunk by thermal curing may have a thickness similar to that of the dam DAM'. A cover panel CPN' may be formed from the cured dam DAM' and the cured cover layer COV'. Subsequent processes may be the same as those of reference Figures 15 to 17 The process described is essentially the same. Thus, it is possible to manufacture Fig.31 The display module of the cover panel CPN' shown in FIG.

[0158] The dam DAM' may have a light blocking function and an impact absorbing function, and in addition to the light blocking function and the impact absorbing function, the cover layer COV' may additionally have a heat dissipation function and an electromagnetic shielding function. Because the area of ​​the cover layer COV' is much larger than the area of ​​the dam DAM', the cover panel CPN' may be basically defined as a structure having heat dissipation function, light blocking function, electromagnetic shielding function and impact absorbing function.

[0159] In the embodiment of the present disclosure, the cover panel CPN′ may be manufactured by using the first resin RIN1 ′ and the second resin RIN2 ′ having different materials without using the mask MK.

[0160] According to an embodiment of the present disclosure, the mask does not have a large opening and includes a body disposed therein. The body and ribs of the frame are connected by a bridge. Therefore, due to the bridge, the ribs of the frame may not be curved. Therefore, defects in a cover panel manufactured by the mask may be reduced.

[0161] Although the present disclosure has been described with reference to the embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made thereto without departing from the spirit and scope of the present disclosure.

Claims

1. A device for manufacturing a display module, the device comprising: tower; as well as a mask disposed on the stage, Wherein, the mask comprises: main body; a frame surrounding the body; and a plurality of bridge portions disposed between the body and the frame and extending from the body toward the frame, and Wherein, a plurality of openings are defined between the bridge portions.

2. The device according to claim 1, wherein The bridge portion is disposed along an edge of the body.

3. The device according to claim 1, wherein: The frame includes a plurality of dummy openings defined therein, and the dummy openings are disposed outside both the bridge portion and the opening.

4. The device according to claim 3, wherein: The dummy opening at least partially surrounds the bridge portion.

5. The device according to claim 1, wherein: The body, the frame, and the bridge portion are formed integrally with each other.

6. The device according to claim 1, wherein: Each of the bridge portions has a width of 0.5 mm to 1.5 mm, inclusive.

7. The apparatus according to claim 1, further comprising: a mask frame surrounding the mask; as well as A plurality of support members are disposed on the table, adjacent to edges of the mother panel, and are positioned on an upper surface of the table.

8. The device according to claim 7, wherein: The mother panel comprises: a first surface; a second surface, opposite to the first surface; a substrate disposed between the first surface and the second surface; and a display element layer provided on the substrate between the first surface and the second surface, facing the first surface and overlapping the body, and wherein the first surface of the mother panel faces the stage, and the second surface of the mother panel faces the mask.

9. The device according to claim 1, wherein: Each of the bridge portions has a bent shape, a curved shape, and / or a trapezoidal shape from the body toward the frame.

10. The device according to claim 1, wherein: Each of the bridge portions extends from the body toward the frame in a straight line and / or an oblique line.

11. A method for manufacturing a display module, the method comprising: Place the mother panel on the stage; placing a mask on the mother panel, the mask comprising a main body, a frame at least partially surrounding the main body, and a plurality of bridge portions each extending from the main body toward the frame, wherein the mask has openings defined between the bridge portions; forming a plurality of dams by disposing a first resin in the openings; removing the mask; forming a cover layer by providing a second resin in a first space defined by removing the main body and a second space defined by removing the bridge portion; and A cover panel is formed by curing the dam and the cover layer.

12. The method according to claim 11, wherein: The mother panel comprises: a first surface; a second surface, opposite to the first surface; a substrate disposed between the first surface and the second surface; and A display element layer is disposed on the substrate between the first surface and the second surface, faces the first surface and overlaps the body, wherein the first surface of the mother panel faces the stage, and the second surface of the mother panel faces the mask, and Wherein, the cover panel is arranged on the second surface of the mother panel.

13. The method according to claim 12, further comprising: A plurality of dummy layers are formed by additionally providing the first resin in a plurality of dummy openings defined in the frame and provided outside the bridge portion and the opening.

14. The method according to claim 13, further comprising: The mother panel is cut along a cutting line of the mother panel defined between the dummy layer and the cover layer by using a cutting tool disposed on the first surface of the mother panel.

15. The method according to claim 13, wherein: The bridge portion is arranged along an edge of the main body, the dummy opening at least partially surrounds the bridge portion, and the main body, the frame, and the bridge portion are formed integrally with each other.

16. The method according to claim 12, wherein: The first resin and the second resin include the same material.

17. The method according to claim 12, wherein: The first resin and the second resin are each heat-curable.

18. The method according to claim 12, wherein: The second resin has a viscosity of 1,000 cps to 100,000 cps.

19. The method according to claim 12, wherein: Each of the bridge portions has a bent shape, a curved shape, and / or a trapezoidal shape from the body toward the frame.

20. A method for manufacturing a display module, the method comprising: Place the mother panel on the stage; forming a dam having a closed loop shape by providing a first resin on the mother panel; curing the dam using ultraviolet light; forming a cover layer by providing a second resin in a space defined by the dam, wherein the second resin is provided to have a height greater than a height of the dam; and thermally curing the cover layer, Wherein, the first resin includes a UV curable resin, and the second resin includes a thermosetting resin.

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