Brush detection device of semiconductor wafer cleaning equipment and pressure control method

Abstract

The present invention relates to a brush detection device and a pressure control method for a semiconductor wafer cleaning apparatus, which control the cleaning process of a brush while monitoring the position and initial load of the brush when cleaning a wafer substrate. The invention provides a brush detection device and a pressure control method for a semiconductor wafer cleaning apparatus, which are suitable for controlling the overall operation of a brush such as the pressure and the position of the brush by using a combination of a load unit and a moving coil in a cleaning process for removing impurities on the surface of a wafer substrate. The present invention relates to a novel brush detection device and a pressure control method for a soft landing technology of a brush, which can improve the efficiency of a cleaning process by shortening the process time while performing a better cleaning process on a wafer substrate, can protect the wafer substrate from being damaged, and can reduce the impact of the contact with the wafer substrate. And the cleaning quality of the wafer substrate is ensured.

Description

Technical Field

[0001] The present invention relates to a brush detection device and a pressure control method for semiconductor wafer cleaning equipment, and more particularly, to a brush detection device and a pressure control method for semiconductor wafer cleaning equipment which can control the cleaning process of the brush while monitoring the position and initial load of the brush when cleaning a wafer substrate. Background Art

[0002] Generally, semiconductor devices are manufactured by the following multi-step process: an impurity ion implantation process to implant impurity ions into the interior of a semiconductor; a thin film deposition process to form a material film on a semiconductor substrate; an etching process to form the material film into a prescribed pattern; a flattening process to uniformly grind the wafer surface to eliminate step differences after depositing an interlayer insulating film on the top of the wafer, etc.

[0003] In order to manufacture semiconductor devices in this manner, various processes need to be performed selectively or repeatedly, and many contaminants are generated on the semiconductor devices during the process of performing these processes.

[0004] Therefore, in the preceding and succeeding steps of each process, a wafer substrate cleaning process for removing contaminants is performed.

[0005] Typically, in a wafer substrate cleaning process, a combination of an alkaline cleaning solution and an acidic cleaning solution or other agents are used, and in a rinsing process for removing residues, a large amount of pure water is used, and while the brush is in contact with the wafer substrate, the cleaning liquid is supplied to the brush from the outside of the brush while the wafer substrate and the brush are rotated relative to each other, thereby cleaning the wafer substrate.

[0006] In most wafer substrate cleaning processes, a method of spraying a cleaning liquid onto the surface of the wafer substrate through a cleaning liquid nozzle while wiping the surface of the wafer substrate with a brush may be used.

[0007] However, in the wafer substrate cleaning process using a brush, there is a disadvantage that the brush is difficult to control due to various reasons such as natural degradation of the equipment due to long-term use, errors in the equipment itself, or mistakes made by engineers. If the wafer substrate cleaning process is performed without properly controlling the brush, not only will foreign matter attached to the surface of the wafer substrate not be removed effectively, but scratches and other undesirable phenomena may also occur on the surface of the wafer substrate.

[0008] Currently, since there is no system that can detect the exact state of the brush (such as the brush position or pressure) before the cleaning process, the process can only rely on the naked eye confirmation of engineers. However, relying solely on the uncertain confirmation work of engineers has limitations in implementing an effective cleaning process. Summary of the invention

[0009] Problems to be solved by the invention

[0010] The present invention is proposed in consideration of this point, and its purpose is to provide a brush detection device and a pressure control method for semiconductor wafer cleaning equipment. In the cleaning process for removing impurities on the surface of the wafer substrate, a new brush detection device and a pressure control method are used to control the overall movement of the brush such as the pressure and position of the brush by a combination of a load unit and a moving coil to minimize the contact impact with the wafer substrate. The brush soft landing technology can improve the efficiency of the cleaning process while performing a better cleaning process on the wafer substrate, and can protect the wafer substrate from damage and ensure the cleaning quality of the wafer substrate.

[0011] Solutions for solving problems

[0012] In order to achieve the above-mentioned purpose, the brush detection device of the semiconductor wafer cleaning equipment provided by the present invention has the following characteristics.

[0013] The brush detection device of the above-mentioned semiconductor wafer cleaning equipment is characterized in that it includes: a substrate; upper and lower rotating cups and a rotating chuck, which are arranged on the upper surface of the above-mentioned substrate to fix the wafer substrate while lifting and rotating the wafer substrate; a brush motor module and a brush arm, which are arranged on the upper surface of the above-mentioned substrate to use a brush to clean the wafer substrate; at least one deionized (DI) water rinsing nozzle, which is arranged on the upper surface of the above-mentioned substrate and provides cleaning water to the wafer substrate; and a brush cleaning port, which is arranged on the upper surface of the above-mentioned substrate and cleans the brush.

[0014] The brush detection device of the semiconductor wafer cleaning equipment may also include: a two-fluid cleaning nozzle and a nozzle arm, which are arranged on the upper surface of the substrate and spray cleaning water evenly and finely to further clean the wafer substrate.

[0015] In addition, the brush detection device of the semiconductor wafer cleaning equipment may further include: a wafer tilt detection sensor and a wafer detection sensor, which are arranged on the upper surface of the substrate and detect installation defects of the wafer substrate and the presence or absence of the wafer substrate.

[0016] In particular, the brush motor module as a unit for cleaning a wafer substrate using a rotating and up-and-down moving brush may include: a module housing; a voice coil motor disposed on one side of the interior of the module housing to control the brush by applying pressure or to cancel the control by releasing the pressure; a moving block connected to the coil side of the voice coil motor and moving up and down, a brush rotating motor configured to be supported by the moving block side and providing power for the rotation of the brush; a brush mounted on the lower end of the shaft of the brush rotating motor and located below the bottom surface of the module housing; a load unit disposed on one side of the interior of the module housing and in contact with a sensor dog and detecting the load of the brush, the sensor dog rising and falling together with the moving block.

[0017] As a preferred embodiment, the brush detection device of the above-mentioned semiconductor wafer cleaning equipment may also include: a controller, which serves as a unit for controlling the position and pressure of the brush, and such controller controls the brush pressing pressure by controlling the current of the voice coil motor, and corrects the pressure control current of the voice coil motor based on the load provided by the load unit.

[0018] In addition, in order to achieve the above-mentioned purpose, the brush pressure control method of the semiconductor wafer cleaning equipment provided by the present invention has the following characteristics.

[0019] The brush pressure control method of the above-mentioned semiconductor wafer cleaning equipment includes: a preparation step, making the brush wait at the origin position outside the wafer; a first step, making the brush located at the center of the wafer; a second step, starting the rotation of the brush and the preset pressing pressure of the brush, while making the brush descend to the center of the wafer for the first time, and then continuing to softly land at a speed relatively slower than the first descent speed, so that the brush contacts the surface of the wafer; a third step, in a state where the brush is in contact with the wafer, moving the brush from the center of the wafer to the end at a preset speed and cleaning the wafer; a fourth step, making the brush rise to be located at the starting point of the end of the wafer; a completion step, after repeatedly executing the above-mentioned first to fourth steps for multiple times, making the brush wait at the origin position outside the wafer with the pressing pressure released and the rotation stopped.

[0020] The second step may include: after the first descent of the brush, by utilizing feedback from pressure measurement of the load cell, when the preset pressing pressure is normal, a process of making the brush land softly.

[0021] In addition, in the above second step, the preset pressing pressure of the brush can be controlled by current control of the voice coil motor.

[0022] As a preferred embodiment, in the above second step, after converting the control current of the voice coil motor into weight (g) units, the reference data is used to set and control the brush pressing pressure, and it can be set and controlled to about 10g to 80g in units of 1g.

[0023] As a preferred embodiment, in the pressure setting step, the process of installing weights and using a scale to set the basic pressing pressure to set the brush pressing pressure may also include: removing the basic rotating chuck and replacing it with a pressure measuring fixture, using a scale to compare the simultaneously input values ​​of the brush pressing pressure used when performing the process in the equipment, and storing them after correcting the fine values.

[0024] Effects of the Invention

[0025] The brush detection device and pressure control method of semiconductor wafer cleaning equipment provided by the present invention have the following effects.

[0026] Provided is a brush detection device and pressure control method equipped with the following technology: when cleaning the surface of a semiconductor substrate, a combination of a voice coil motor (VCM), a load unit, a moving coil, etc. is used to control the overall movement of the brush, such as the pressure and position of the brush, and by automatically correcting the brush pressing pressure, and the brush softly landing at a specific distance and speed, contacting the wafer substrate, etc., so that a better cleaning process for the wafer substrate can be performed and the efficiency of the cleaning process can be improved, thereby not only protecting the wafer substrate, but also ensuring the cleaning quality of the wafer substrate and improving the reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 FIG. 1 is a perspective view showing a rotating chamber unit in a brush detection device of a semiconductor wafer cleaning apparatus according to an embodiment of the present invention.

[0028] Figure 2 1 is a perspective view showing a brush arm module in a brush detection device of a semiconductor wafer cleaning apparatus according to an embodiment of the present invention.

[0029] Figure 3 and Figure 4 1 is a perspective view and a cross-sectional view showing a brush motor module in a brush detection device of a semiconductor wafer cleaning apparatus according to an embodiment of the present invention.

[0030] Figure 5 Schematic diagram showing a brush force control structure in a brush detection device of a semiconductor wafer cleaning device according to an embodiment of the present invention.

[0031] Figure 6Schematic diagram showing a brush cleaning process in a brush pressure control method of a semiconductor wafer cleaning device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0032] The brush detection device of the semiconductor wafer cleaning equipment is characterized in that it includes: a substrate; upper and lower rotating cups and a rotating chuck, which are arranged on the upper surface of the above-mentioned substrate to fix the wafer substrate while lifting and rotating the wafer substrate; a brush motor module and a brush arm, which are arranged on the upper surface of the above-mentioned substrate to use a brush to clean the wafer substrate; at least one deionized (DI) water rinsing nozzle, which is arranged on the upper surface of the above-mentioned substrate and provides cleaning water to the wafer substrate; and a brush cleaning port, which is arranged on the upper surface of the above-mentioned substrate and cleans the brush.

[0033] Best Mode for Carrying Out the Invention

[0034] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings as follows.

[0035] Figure 1 FIG. 1 is a perspective view showing a rotating chamber unit in a brush detection device of a semiconductor wafer cleaning apparatus according to an embodiment of the present invention.

[0036] like Figure 1 As shown, the brush detection device of the semiconductor wafer cleaning equipment includes a base plate 10, and the base plate 10 is a unit for supporting each component of the equipment.

[0037] In the upper surface portion of the base plate 10, an upper and lower rotating cup 11 and a spin rotation chuck 12 for loading wafer substrates are arranged in the central area, and a brush motor module 14 and a brush arm 15, a brush cleaning port 17, a two-fluid cleaning nozzle 18 and a nozzle arm 19, etc. are arranged in the outer contour area, that is, the peripheral area of ​​the upper and lower rotating cups 11 and the spin chuck 12.

[0038] In addition, a driving unit (not shown) for operating the upper and lower rotating cups 11 and the rotating chuck 12, a brush arm driving unit 30 for operating the brush arm 15, and a nozzle arm driving unit 31 for operating the nozzle arm 19 are respectively provided on the bottom surface of the above-mentioned bottom plate 10.

[0039] Therefore, when the brush arm driving unit 30 is operating, the brush arm 15 can be rotated to place the brush 13 in the specified standby area and the working area on the wafer substrate, and when the nozzle arm driving unit 31 is operating, the nozzle arm 19 can be rotated to place the two-fluid cleaning nozzle 18 in the specified working area.

[0040] In addition, the brush detection device of the semiconductor wafer cleaning equipment includes: upper and lower rotating cups 11 and a rotating chuck 12 as units for loading wafer substrates.

[0041] The upper and lower rotating cups 11 and the rotating chuck 12 are disposed at the central area of ​​the upper surface of the base plate 10 , and play the role of fixing the wafer substrate while lifting and rotating the wafer substrate.

[0042] The upper and lower rotating cups 11 and the rotating chuck 12 are arranged in a coaxial structure inside and outside. At this time, the rotating chuck 12 on the inside is placed slightly protruding upward compared to the upper and lower rotating cups 11, and the wafer substrate can be placed and installed on the upper surface of the rotating chuck 12 protruding in this way.

[0043] Thus, when the upper and lower rotating cups 11 and the rotating chuck 12 are in motion, the wafer substrate can not only be raised and lowered for loading and unloading, but also be rotated for cleaning.

[0044] In addition, the brush detection device of the semiconductor wafer cleaning equipment actually includes a brush motor module 14 and a brush arm 15 as a unit for cleaning the wafer substrate.

[0045] The brush arm 15 is provided on one side of the upper surface of the base plate 10 , for example, on the side around the spin chuck 12 on which the wafer substrate is placed, and a brush motor module 14 having a brush 13 is provided on the brush arm 15 provided in this manner.

[0046] Therefore, when the above-mentioned brush arm driving unit 30 is in operation, the brush arm 15 rotates in the horizontal direction. As a result, the brush 13 of the brush motor module 14 is a structure arranged to be supported by the brush arm 15. For the purpose of cleaning, it can not only freely move back and forth between the area where the wafer substrate is located, but also freely move back and forth between areas outside the wafer substrate, such as the standby area outside the wafer substrate, the area where the brush cleaning port 17 is located, etc., and perform cleaning work.

[0047] In addition, the brush detection device of the semiconductor wafer cleaning equipment includes a DI water rinse nozzle 16 as a unit for providing cleaning water when cleaning the wafer substrate.

[0048] The DI water rinse nozzle 16 is disposed on one side of the upper surface of the base plate 10 , for example, on one side of the periphery of the rotating chuck 12 on which the wafer substrate is placed, and plays the role of spraying cleaning water onto the wafer substrate when the wafer substrate is cleaned by the brush 13 .

[0049] Preferably, two DI water flushing nozzles 16 are provided and placed at opposite positions.

[0050] In addition, the brush detection device of the semiconductor wafer cleaning apparatus includes a brush cleaning port 17 as a unit for cleaning the contaminated brush 13 .

[0051] The brush washing port 17 is provided at one side of the upper surface portion of the bottom plate 10 and washes the brush bristles using a pure water jet method and an ultrasonic cleaning method.

[0052] For example, the brush cleaning port 17 can clean the brush 13 by applying ultrasonic vibration while the brush 13 is immersed in the cleaning liquid in the port, and can also clean the brush 13 by spraying pure water to the brush 13 through the nozzle.

[0053] In addition, the brush detection device of the semiconductor wafer cleaning equipment includes a two-fluid cleaning nozzle 18 and a nozzle arm 19 as a unit for further performing a final cleaning on the wafer substrate after the main cleaning of the wafer substrate.

[0054] The nozzle arm 19 is provided on one side of the upper surface of the base plate 10 , for example, on the side around the spin chuck 12 on which the wafer substrate is placed, and the two-fluid cleaning nozzle 18 is provided on the nozzle arm 19 provided in this manner.

[0055] Therefore, when the brush arm driving unit 31 is operating, the nozzle arm 19 rotates in the horizontal direction. As a result, the two-fluid cleaning nozzle 18, which is a structure supported by the nozzle arm 19, can move freely back and forth not only to the area where the wafer substrate is located, but also to the area outside the wafer substrate for cleaning.

[0056] For example, the two-fluid cleaning nozzle 18 can be moved to an area where a wafer substrate is placed, and can evenly and finely spray cleaning water onto the surface of the wafer substrate while further cleaning the wafer substrate.

[0057] In addition, the brush detection device of the semiconductor wafer cleaning apparatus includes a wafer tilt detection sensor 20 and a wafer detection sensor 21 as units for detecting the loading state of the wafer substrate.

[0058] The wafer tilt detection sensor 20 and the wafer detection sensor 21 are respectively provided on one side of the upper surface portion of the base plate 10 , for example, on one side of the periphery of the spin chuck 12 on which the wafer substrate is placed.

[0059] The wafer tilt detection sensor 20 is used to detect mounting defects of the wafer substrate on the rotary chuck 12 , and the wafer detection sensor 21 is used to detect the presence or absence of the wafer substrate on the rotary chuck 12 .

[0060] Figure 2is a perspective view showing a brush arm module in a brush detection device of a semiconductor wafer cleaning device according to an embodiment of the present invention, Figure 3 and Figure 4 1 is a perspective view and a cross-sectional view showing a brush motor module in a brush detection device of a semiconductor wafer cleaning apparatus according to an embodiment of the present invention.

[0061] like Figures 2 to 4 As shown, the brush motor module 14 is a combination of a linear motor and a rotary motor, and realizes the pressure control of the brush through the operation of the moving coil, and is responsible for the function of using the rotating and up and down moving brush 13 to clean the wafer substrate.

[0062] To this end, the brush motor module 14 can be supported by the brush arm 15 and rotated in the horizontal direction according to the movement of the brush arm 15, so as to move the position to the area where the wafer substrate is located, and the brush 13 can be used to clean the surface of the wafer substrate while moving on the wafer substrate.

[0063] This brush motor module 14 includes a module housing 22 in the shape of a square shell. At this time, a voice coil motor 23, a moving block 24, a brush rotation motor 25 and a load unit 28 can be arranged in the module housing 22, and a brush 13 can be placed on the outside of the bottom surface of the module housing 22.

[0064] The voice coil motor 23 is disposed on one side of the module housing 22 as a motor for applying pressure to the brush 13 to control the brush 13 or canceling the control by releasing the pressure. The brush pressing pressure can be controlled by controlling the motor current.

[0065] That is, the pressing pressure of the brush 13 can be controlled by the movement of the voice coil motor 23 .

[0066] The moving block 24 is connected by a structure that can be linked with the coil side of the voice coil motor 23, so that when the voice coil motor 23 is running, it can realize rising and falling movements. Through the movement of the moving block 24, not only the brush rotating motor 25 but also the brush 13 can be raised and lowered together.

[0067] In addition, one side of the moving block 24 is provided with an electronic dog sensor 27 in a shape extending horizontally along one side. At this time, the electronic dog sensor 27 can provide the pressure of the voice coil motor 23, that is, the current pressing pressure of the brush 13, to the load cell 28 side while contacting (pressing) the load cell 28 when the moving block 24 descends.

[0068] The brush rotating motor 25 is provided so as to vertically penetrate the moving block 24 and be supported by the upper end of a hollow rod 32 coupled to the moving block 24 .

[0069] The shaft 26 of the brush rotating motor 25 thus provided extends vertically downward along the inside of the rod 32 so as to be located below the bottom surface portion of the module housing 22 , and at this time, the shaft 26 can be coupled to the brush 13 .

[0070] Therefore, when the brush rotating motor 25 is operated, the brush 13 can rotate along with the rotation of the shaft 26 .

[0071] The brush 13 may be installed at the lower end of the shaft 26 of the brush rotating motor 25 and may be arranged to be located below the bottom surface of the module housing 22 .

[0072] The brush 13 is made of a material such as water-soluble polyvinyl alcohol (PVA), and can clean the surface of the wafer substrate while contacting the surface of the wafer substrate with a preset pressing pressure provided by the voice coil motor 23 .

[0073] The load unit 28 is arranged on one side of the module housing 13 and plays a braking function. The load unit 28 arranged in this way can detect the load of the brush while contacting the electronic dog sensor 27 extending horizontally from the moving block 24 side and rising and falling together.

[0074] For example, the pressing pressure of the brush 13 is controlled by the movement of the voice coil motor 23, so that the brush 13 descending in a pressure-controlled state can contact the load unit 28 through the electronic dog sensor 27, thereby determining the final downward position and realizing feedback control.

[0075] That is, the position where the brush 13 contacts the wafer substrate is realized by the voice coil motor 23 , and the force pressing the wafer substrate is controlled by the voice coil motor 23 receiving feedback from the load unit 28 .

[0076] Among them, due to the characteristics of its metal material, the above-mentioned load unit 28 is fixed while bearing the pressure of the voice coil motor 23, so it can provide feedback to the voice coil motor 23 by determining the braking effect of the final process position and the characteristics of changing the physical force into the current value when pressure is applied.

[0077] In addition, the brush detection device of the semiconductor wafer cleaning apparatus includes a controller 29 as a unit for controlling the position and pressure of the brush 13 .

[0078] The controller 29 controls the brush pressing pressure by controlling the current of the voice coil motor 23 , and can calibrate the pressure control current of the voice coil motor 23 based on the load provided by the load unit 28 , and then control the brush pressing pressure based on this.

[0079] Figure 5 Schematic diagram showing a brush force control structure in a brush detection device of a semiconductor wafer cleaning device according to an embodiment of the present invention.

[0080] like Figure 5 As shown, here is shown the hardware and program system for automatically adjusting the pressing pressure of the PVA brush in contact with the wafer substrate when cleaning the wafer substrate.

[0081] That is, a brush force control structure is shown which controls the pressing pressure of the brush 13 based on the cleaning process recipe data and performs control such as correcting the pressing pressure of the brush 13.

[0082] The above-mentioned hardware and programs include: a host controller and control program as a driving element, a voice coil motor 23 and a voice coil motor driver 33 for pressing pressure control, a brush rotating motor (BLDC servo motor) 25 and a brush rotating motor driver 34 for rotation control, a load unit 28 for feedback control (maximum 200g), etc.

[0083] In addition, the settings are as follows: the pressing pressure range is 10g~80g (set in units of 1g), the self-rotation speed is 100rpm~300rpm, the pressing pressure reproducibility (Force repeatability) is ±3g, the pressing pressure control distance is 3mm (soft landing 2mm), the pressing pressure control method is current output control based on the process recipe (standard value and correction value specified setting) and automatic current output control and correction program control based on the load unit feedback method (control range specified setting), and the alarm is a monitoring of the output status of the set pressure.

[0084] Therefore, the signal of the rotation motor driver 34 that controls the operation of the brush rotation motor 25 will be input into the controller 29, and the signal of the voice coil motor driver 33 that controls the operation of the voice coil motor 23 will also be input into the controller 29. After the brush pressing pressure (load) detected by the load unit 28 is input into the voice coil driver 33 through the load unit converter 35, the signal of the voice coil motor driver 33 at this time will also be input into the controller 29.

[0085] The controller 29 that receives such a signal controls the operation of the brush rotating motor 25 and the operation of the voice coil motor 23 , and at the same time controls the operation of the voice coil motor 23 based on the preset pressing pressure data, thereby controlling the brush pressing pressure and correcting the brush pressing pressure.

[0086] Among them, the above-mentioned controller 29 is provided with basic data for the brush pressing pressure, such as reference pressing pressure data (converting the current value into grams), pressing pressure correction (correction of the difference between the set value and the measured value) data, basic normal data when the equipment is started, and cleaning process formula data.

[0087] Such a controller 29 provides an optimal brush pressing pressure (e.g., an optimal brush pressing pressure that combines a preset brush pressing pressure and a calibrated brush pressing pressure obtained from a load unit) when cleaning a wafer substrate, and performs control for an effective cleaning process through control of the voice coil motor 23.

[0088] For example, the controller 29 may control the brush pressing pressure by controlling the motor current of the voice coil motor 23 , and may perform control using reference data by converting the control current of the voice coil motor 23 into a unit of weight (g).

[0089] At the same time, the controller 29 can automatically correct the pressure control current of the voice coil motor 23 through the load unit 28 with a stop function, and can control the brush 13 in the pressure-controlled state to softly land at a specific distance and speed to contact the wafer substrate, and can also measure and correct the pressure at a specified specific position, and can set the brush command pressure in units of 1g to 10g~80g.

[0090] Figure 6 Schematic diagram showing a brush cleaning process in a brush pressure control method of a semiconductor wafer cleaning device according to an embodiment of the present invention.

[0091] like Figure 6 As shown, position 1 (Initial) represents the origin standby position of the brush 13, position 2 (Nearedge) represents the end position of the wafer substrate, position 3 (Center) represents the center point position of the wafer substrate, and position 4 (Measurement) represents the position for calibrating the difference between the set value and the actual value of the pressure of the brush 13 using a clamp and an electronic scale in the calibration program mode.

[0092] First, as a preparatory step, a step of making the brush 13 wait at an origin position outside the wafer is performed.

[0093] In this standby position, the brush 13 may be controlled to a preset pressing pressure value.

[0094] That is, at the standby position, the brush 13 is raised through the process, and when the raising action is completed, the brush 13 may be controlled to a preset pressure value.

[0095] At this time, the brush 13 can wait in the rotating state.

[0096] Next, as a first step, a step of positioning the brush 13 at the center of the wafer substrate 100 is performed.

[0097] That is, the brush 13 is moved to above the center position of the wafer substrate 100 in a state where the rotation is stopped.

[0098] At this time, moving the brush 13 to the center position of the wafer substrate can be achieved by driving the rotating motor of the brush arm module.

[0099] Next, as a second step, while starting the brush rotation and the preset brush pressing pressure, the brush 13 is lowered toward the center of the wafer for the first time, and continues to softly land at a speed relatively slower than the first lowering speed so that the brush contacts the wafer surface.

[0100] That is, the voice coil motor makes the brush 13 move vertically downward for the first time to the soft landing starting position at a speed of about 27.26 m / s and a distance (height) of about 3 mm, and continues to softly land at a speed of about 1.75 m / s and a distance (height) of about 2 mm.

[0101] During the above-mentioned downward movement, the brush rotation and pressing pressure output action are started.

[0102] Next, the brush 13 is brought into contact with the wafer substrate 100 in a soft landing manner (at a programmed position and speed) by a voice coil motor.

[0103] At this time, the brush 13 performs a first descent under a pressure-controlled state and then performs a second soft landing, so that the wafer contacts the brush.

[0104] That is, the brush 13 is raised in the standby state for the process, and then is usually controlled by using the feedback of the pressure measurement of the load unit. At this time, the current control of the voice coil motor can be used to control the preset pressing pressure of the brush 13 to make it meet the pressure specified in the process recipe.

[0105] At this time, after converting the control current of the voice coil motor into a weight (g) unit, the reference data can be used to set and control the pressing pressure of the brush (for example, in units of 1g, set and control to 10g to 80g).

[0106] The reason for making the brush 13 softly land after the first descending movement is that, in order to minimize the process time, when the brush 13 is descending quickly, the speed is reduced when the brush 13 is about to contact the wafer substrate 100, thereby minimizing the impact of the wafer substrate 100 contacting the brush bristles.

[0107] At this time, the height for starting soft landing is about 2 mm in front of the wafer substrate 100 .

[0108] Next, as a third step, a step of cleaning the wafer substrate 100 while moving the brush 13 from the center to the end of the wafer substrate at a preset speed is performed in a state where the brush 13 is in contact with the wafer substrate 100 .

[0109] The brush 13 at this time can move at a preset speed according to the program recipe.

[0110] At this time, moving the brush 13 to the end position of the wafer substrate can be achieved by driving the rotary motor of the brush arm module.

[0111] Next, as a fourth step, a step is performed in which the brush 13 is raised using a voice coil motor at the end position of the wafer substrate so that the brush is located at a starting point set just above the end of the wafer substrate.

[0112] Next, as a finishing step, after repeatedly executing the first to fourth steps a number of times according to the program recipe setting, the brush 13 is placed on standby at the origin position outside the wafer with the pressing pressure released and the rotation stopped when the cleaning work is completed.

[0113] As a preferred embodiment, the brush cleaning process as described above may include a step of setting a brush pressing pressure.

[0114] For example, as the above-mentioned pressure setting step, the process of installing weights and using a scale to set the basic pressing pressure to set the pressing pressure of the brush is achieved through the following process: after removing the basic rotating chuck and replacing it with a pressure measuring fixture, a scale is used to compare the simultaneously input values ​​of the pressing pressure of the brush used when performing the process in the equipment, and the fine values ​​are corrected and stored.

[0115] In such a cleaning process, the steps of the brush rotation process recipe are as follows.

[0116] Step 1: While the brush 13 is rotating at about 1000 rpm, DI water rinse liquid is sprayed from two water rinse nozzles 16, and the brush 13 is moved to the center position of the wafer substrate.

[0117] From this moment until the brush reaches the standby position, when the feedback control range of the pressure set in the brush is exceeded, all movements of the chamber will be urgently stopped together with the alarm.

[0118] Step 2: The brush 13 rotates at about 1000 rpm, and only one water flushing nozzle 16 sprays DI water flushing liquid. Under the start-up and pressing pressure control action of the brush 13, it descends 3 mm to the starting position of the soft landing.

[0119] Next, it is lowered 2 mm in a soft landing manner to contact the wafer substrate, and then scanned and moved to the end position of the wafer substrate at a set speed, and then the same action is repeated according to the set scanning times (time) of the program recipe.

[0120] Step 3: While the brush 13 is rotating at about 1000 rpm, DI water rinse liquid is sprayed from the two water rinse nozzles 16, and the brush 13 moves to the standby position.

[0121] Step 4: The wafer substrate is rotated at about 2500 rpm to dry the DI water rinse solution.

[0122] Step 5: The rotation of the wafer substrate is completed and the process is completed.

[0123] As described above, the present invention provides a new type of brush detection device and pressure control method, which is suitable for controlling the overall movement of the brush such as the pressing pressure of the brush, the position of the brush, and the pressing pressure correction of the brush by using a combination of a load unit and a moving coil in the wafer substrate cleaning process, and a soft landing technology that minimizes the contact impact with the wafer substrate. Therefore, not only can a better cleaning process be performed on the wafer substrate, but the process time can also be shortened, etc., thereby improving the efficiency of the cleaning process, protecting the wafer substrate from damage, and ensuring good cleaning quality of the wafer substrate.

[0124] Industrial Applicability

[0125] The present invention relates to a brush detection device and a pressure control method for semiconductor wafer cleaning equipment. Since it can be used in semiconductor processes that are core processes in the electronics industry, it can be used in the semiconductor manufacturing industry, the electronic equipment manufacturing industry, the AI ​​industry, etc.

Claims

1. A method for controlling brush pressure of a semiconductor wafer cleaning device, comprising: A preparation step, wherein the brush is placed on standby at an origin position outside the wafer; In the first step, the brush is positioned at the center of the wafer; In the second step, while starting the brush rotation and the preset pressing pressure of the brush, the brush is made to descend toward the center of the wafer for the first time, and then continues to softly land at a speed relatively slower than the first descent speed, so that the brush contacts the surface of the wafer; The third step is to move the brush from the center of the wafer to the end at a preset speed and clean the wafer while the brush is in contact with the wafer. In the fourth step, the brush is raised to be located at the starting point at the end of the wafer; In the completion step, after the first to fourth steps are repeatedly performed a plurality of times, the brush is made to wait at an origin position outside the wafer in a state where the pressing pressure is released and the rotation is stopped.

2. The brush pressure control method of semiconductor wafer cleaning equipment according to claim 1, wherein: Starting from the first step, by using the feedback of the load cell pressure measurement of the brush, all processes of the brush are driven when the preset pressing pressure is normal.

3. The brush pressure control method of semiconductor wafer cleaning equipment according to claim 1, wherein: In the second step, the preset pressing pressure of the brush is controlled by current control of the voice coil motor.

4. The brush pressure control method of semiconductor wafer cleaning equipment according to claim 3, wherein: In the second step, after converting the control current of the voice coil motor into a weight (g) unit, the reference data is used to set and control the brush pressing pressure, and the pressure can be set and controlled to 10g to 80g in units of 1g.

5. The brush pressure control method of semiconductor wafer cleaning equipment according to claim 1, wherein: The process of installing weights and using a scale to set the basic pressing pressure as a pressure setting step to set the brush pressing pressure also includes: removing the basic rotating chuck and replacing it with a pressure measuring fixture, and then using a scale to compare the simultaneously input values ​​of the brush pressing pressure used when performing the process in the equipment, and storing them after correcting the fine values.

6. A brush detection device for semiconductor wafer cleaning equipment, comprising: Bottom plate (10); An upper and lower rotating cup (11) and a rotating chuck (12) are arranged on the upper surface of the base plate (10) to fix the wafer substrate and simultaneously lift and rotate the wafer substrate; a brush motor module (14) and a brush arm (15) are arranged on the upper surface of the base plate (10) to clean the wafer substrate using a brush (13); wherein: The brush motor module (14) is a unit for cleaning a wafer substrate using a rotating and up-and-down moving brush (13), and includes: a module housing (22); a voice coil motor (23), which is arranged on one side of the interior of the module housing (22) to control the pressing pressure of the brush (13); a moving block (24), which is linked with the coil side of the voice coil motor (23) and moves up and down; a brush rotating motor (25), which is arranged in a structure supported by the moving block (24) and provides power for the rotation of the brush; a brush (13), which is installed at the lower end of the shaft (26) of the brush rotating motor (25) and is located below the bottom surface of the module housing (22); a load unit (28), which is arranged on one side of the interior of the module housing (13) and contacts with an electronic dog sensor (27), and detects the load of the brush, and the electronic dog sensor rises and falls together with the moving block (24).

7. The brush detection device of semiconductor wafer cleaning equipment according to claim 6, further comprising: at least one deionized water rinse nozzle (16), which is disposed on the upper surface of the base plate (10) and provides cleaning water to the wafer substrate; as well as A brush cleaning port (17) is provided on the upper surface of the bottom plate (10) and cleans the brush.

8. The brush detection device of semiconductor wafer cleaning equipment according to claim 7, further comprising: A two-fluid cleaning nozzle (18) and a nozzle arm (19) are arranged on the upper surface of the base plate (10) and spray cleaning water evenly and finely to further clean the wafer substrate.

9. The brush detection device of semiconductor wafer cleaning equipment according to claim 6, further comprising: A wafer tilt detection sensor (20) and a wafer detection sensor (21) are arranged on the upper surface of the base plate (10) and detect mounting defects of a wafer substrate and the presence or absence of a wafer substrate.

10. The brush detection device of semiconductor wafer cleaning equipment according to claim 6 or 9, further comprising: A controller (29) is provided, which serves as a unit for controlling the position and pressure of the brush (13). The controller (29) controls the brush pressing pressure by controlling the current of the voice coil motor (23), and corrects the pressure control current of the voice coil motor (23) based on the load provided by the load unit (28).

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