Rotating electrical feedthrough integration for processing chamber

Abstract

Embodiments disclosed herein include a semiconductor processing tool. In one embodiment, a semiconductor processing tool includes: a chamber; a chuck within the chamber, wherein the chuck is configured to rotate; a base bracket surrounding the chuck; and a common post coupled to the chuck. In one embodiment, the common post includes a magnetic coupler that enables rotation of the chuck and portions of the common post, and a rotating electrical feedthrough.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. patent application No. 17 / 865,255 filed on July 14, 2022, the entire contents of which are hereby incorporated by reference. Technical Field

[0003] Embodiments relate to the field of semiconductor manufacturing, and more particularly to semiconductor processing tools having a rotating electrical feedthrough to enable rotation of a substrate within the semiconductor processing tool. Background Art

[0004] In semiconductor manufacturing processes, process uniformity is a key metric. In the case of deposition processes, such as physical vapor deposition (PVD) processes, the uniformity metric of interest is the thickness uniformity of the deposited film. Currently, there are many different process control variables that can be adjusted to try and improve thickness uniformity. Unfortunately, such controls on stationary wafers (e.g., RF power, gas flow rates, temperature, etc.) do not provide the necessary improvements required for advanced process operations.

[0005] Therefore, it may be desirable to introduce a rotating component into a semiconductor processing tool. Rotating a substrate (e.g., a wafer) can result in an averaging of thickness variations to provide a more uniform thickness value across the surface of the substrate. However, adding rotation to a semiconductor processing tool is not without its problems. For example, existing chuck architectures may require the use of electrical inputs. Therefore, a method of rotating the electrical input is needed. Additionally, providing a rotational force to the chuck may result in the architecture being unable to maintain high vacuum conditions (e.g., 1e -9 support or lower). Summary of the invention

[0006] Embodiments disclosed herein include semiconductor processing tools. In one embodiment, the semiconductor processing tool includes: a chamber; a chuck within the chamber, wherein the chuck is configured to rotate; a base support surrounding the chuck; and a common post coupled to the chuck. In one embodiment, the common post includes a magnetic coupler that enables the chuck and portions of the common post to rotate, and a rotating electrical feedthrough.

[0007] Embodiments disclosed herein include a rotating electrical feedthrough. In one embodiment, the rotating electrical feedthrough includes a stator housing, an electrical transmission component within the stator housing, a first insulator between the electrical transmission component and the stator housing, a rotor electrically coupled to the electrical transmission component, a mechanical bearing between the rotor and the stator housing, and a second insulator between the mechanical bearing and the stator housing.

[0008] Embodiments disclosed herein include a magnetic coupler capable of contactless rotation. In one embodiment, the magnetic coupler includes a tube, a sleeve surrounding the tube, a housing outside the sleeve, a first set of magnets between the tube and the sleeve, a second set of magnets between the sleeve and the housing, a first bearing between the tube and the sleeve, and a second bearing between the sleeve and the housing, wherein the first bearing is electrically insulating.

[0009] BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic diagram of a semiconductor processing tool including a rotatable common column according to one embodiment.

[0011] Figure 2 is a cross-sectional view of a magnetic coupler architecture that may be used to rotate a chuck in a semiconductor processing tool according to one embodiment.

[0012] Figure 3A is a cross-sectional view of a rotary electrical feedthrough according to one embodiment.

[0013] Figure 3B is a cross-sectional view of a rotary electrical feedthrough having enhanced electrical shielding for proper RF return line according to one embodiment.

[0014] Figure 3C is a cross-sectional view of a rotary electrical feedthrough having discrete volumes that can be evacuated to a desired vacuum level according to an embodiment.

[0015] Figure 4 A block diagram of an exemplary computer system that may be used in conjunction with a processing tool is shown according to one embodiment. DETAILED DESCRIPTION

[0016] The system described herein includes a semiconductor processing tool having a rotating electrical feedthrough to enable a substrate within the semiconductor processing tool to rotate. In the following description, many specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent to those skilled in the art that the embodiments can be implemented without these specific details. In other cases, well-known aspects are not described in detail in order not to unnecessarily obscure the embodiments. In addition, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0017] As described above, it is desirable to provide a rotational motion to a substrate in a semiconductor processing tool. Rotational motion can improve parameter uniformity, such as thickness uniformity. However, existing rotational architectures are limited because they may not provide sufficient vacuum pressure environments and containment for utilities (e.g., electrical paths and gas paths) that need to be connected to the chuck.

[0018] Thus, embodiments disclosed herein include semiconductor processing tools with advanced rotating components. In one case, an embodiment includes a magnetic coupling portion that enables rotation outside a vacuum environment to be transmitted to components within the vacuum environment. Thus, a low pressure environment can be maintained. Additionally, embodiments include a rotating electrical feedthrough that enables utilities leading to the chuck to rotate freely. For example, in some embodiments, up to seven or more electrical paths can be provided via the rotating electrical feedthrough.

[0019] In addition, the embodiments disclosed herein implement a high efficiency RF return path. This enables closed loop control of the plasma circuit, and the return path provides a connection between the chamber ground shield and the internal ground surface of the feed-through connector, and ultimately connects to the RF matching / power supply in the atmosphere to complete the circuit loop. In particular, the RF return path is electrically isolated from other conductive components (e.g., using an insulating layer, insulating bearings, etc.) to improve the efficiency of the RF return path.

[0020] Reference now Figure 1 , a schematic diagram of a semiconductor processing tool 100 according to one embodiment is shown. The semiconductor processing tool 100 can be any type of tool useful in a semiconductor manufacturing process. For example, the semiconductor processing tool 100 can be a deposition tool (e.g., a chemical vapor deposition (CVD) tool, a physical vapor deposition (PVD) tool, an atomic layer deposition (ALD) tool, etc.) or an etching tool. The semiconductor processing tool 100 can include a chamber 110. For simplicity, the chamber 110 is Figure 1 105. As shown as a single structure, it should be understood that the chamber 110 may include any number of discrete components. In one embodiment, a baffle 111 may be used to allow vertical displacement of the chuck 105.

[0021] In one embodiment, the chuck 105 can support a substrate 115. The substrate 115 can be any suitable substrate, such as a silicon wafer or other semiconductor wafer. However, substrates 115 formed of other materials (e.g., glass, ceramic, etc.) can also be processed in the semiconductor processing tool 100. The substrate 115 can have any suitable form factor (e.g., a 300 mm wafer, a 450 mm wafer, any other standard wafer form factor, or any non-wafer form factor).

[0022] In one embodiment, the chuck 105 may include heaters 117 and 118. The heaters may be divided into an internal heater 117 and an external heater 118. The chuck 105 may also be an electrostatic chuck (ESC). In such an embodiment, the chuck 105 may include features for applying electrostatic forces to the substrate 115. For example, an electrode 116 may be disposed in the chuck 105. The electrode 116 may include a left electrode, a right electrode, and a center tap. In one embodiment, an electrical connection 135 for the heaters 117 and 118 and the electrode 116 may be provided via a common post 113. The electrical path 135 may include connections for RF power, AC power, and / or DC power.

[0023] The ends of the electrical connections 135 may be disposed at the inputs 132 of the rotating electrical feedthroughs 130. The rotating electrical feedthroughs 130 take the fixed electrical inputs 132 and route them to the rotor 131 which is capable of rotating. Figure 1 As shown, the chuck 105, magnetic coupler 120, and rotor 131 are all shown with the same shading to indicate that they are part of a rotation system of the semiconductor processing tool 100. The rotational force may be provided by the magnetic system 122. The rotation system is described in more detail below.

[0024] In one embodiment, a backside gas conduit 119 is also provided via the common post 113 and the rotating electrical feedthrough 130. For example, a dynamic seal (not shown) that allows rotation around the backside gas conduit 119 can be provided at the bottom of the rotating electrical feedthrough 130. The backside gas conduit 119 can be axially aligned with the common post 113. This allows the chuck 105, magnetic coupler 120, and rotating electrical feedthrough 130 to rotate freely around the fixed backside gas conduit 119.

[0025] In one embodiment, the structure of the semiconductor processing tool 100 may further include an RF return path 101. The RF return 101 path allows for closed-loop control of the plasma circuit. In a specific embodiment, the RF return path 101 is provided along the fixed conductive features in the common post 113 and the rotating electrical feedthrough 130. For example, the RF return path 101 can start from the fixed base support 112. The base support 112 can be coupled to the chamber ground shield (not shown) with a conductive tape. The conductive tape is flexible so that the electrical connection can be maintained when the vertical position of the chuck 105 changes within the chamber 100. In one embodiment, the base support 112 can be electrically coupled to the common post 113. Therefore, the RF return path 101 can pass along the fixed portion of the common post 113 until it reaches the rotating electrical feedthrough 130. The RF return path 101 continues on the fixed housing of the rotating electrical feedthrough 130. As will be described in more detail below, the RF return path 101 may be electrically isolated from other conductive features of the semiconductor processing tool 100. Thus, interference with the RF return path 101 is minimal.

[0026] It should also be understood that the rotating mechanism (i.e., magnetic rotation) allows for high vacuum conditions. Specifically, the magnetic coupler and the rotating electrical feedthrough 130 may include an internal volume that is maintained at or below the vacuum pressure within the chamber 110. In a specific embodiment, the pressure in the rotating electrical feedthrough 130 is reduced to push the conditions to the far left of the Paschen curve, thereby preventing the ignition of plasma within the rotating electrical feedthrough 130.

[0027] Reference now Figure 2 , a cross-sectional view of a magnetic coupler 220 according to one embodiment is shown. In one embodiment, the magnetic coupler 220 may include a sleeve 240. The sleeve 240 may be a fixed component in the semiconductor processing tool 100. For example, the sleeve 240 may be bolted or otherwise coupled to a chamber (not shown) and a rotating electrical feedthrough (not shown). O-rings 245 and 246 may be provided at the interface with other components. The O-ring 245 provides a seal to maintain the vacuum pressure within the sleeve 240 relative to the external atmospheric pressure.

[0028] In one embodiment, the sleeve 240 may include a conductive material, such as a metal. The conductive material may be used as part of the electrical path of the RF return path 101 described in more detail above. In particular, the RF return path 101 may be along the inner surface of the sleeve 240. In addition, since magnetic force is used to enable the system to rotate, the sleeve 240 is a non-magnetic conductor. For example, the sleeve 240 may include aluminum or a similar material.

[0029] In one embodiment, the tube 241 can be disposed inside the sleeve 240. The tube 241 can be a housing surrounding a utility (not shown) passing through the magnetic coupler 220. In some embodiments, the interior of the tube 241 can be configured to be maintained under vacuum pressure. In one embodiment, the tube 241 can be mechanically coupled to one or more first magnets 243. The first magnets 243 can be disposed inside the sleeve 240. In a specific embodiment, six or more first magnets 243 are axially disposed around the interior of the sleeve 240. The first magnets 243 can be mechanically coupled to the tube 241 so that movement of the first magnets 243 causes movement of the tube 241.

[0030] In one embodiment, the tube 241 may be engaged with the sleeve 240 via a bearing 247. The bearing 247 may be disposed above and / or below the first magnet 243. The bearing 247 allows the tube 241 to move smoothly relative to the sleeve 240. In a specific embodiment, the bearing 247 is an electrically insulating bearing 247. Electrically insulating the bearing 247 helps the efficiency of the RF return path 101 passing along the inner surface of the sleeve 240. If the bearing 247 is conductive, the RF return path 101 may be degraded because the bearing 247 directly contacts the RF return path 101. For example, the non-conductive bearing 247 may include a ceramic bearing or a similar bearing. In one embodiment, the bearing 247 may be configured for use in a vacuum environment.

[0031] In one embodiment, the housing 242 may be disposed around the sleeve 240. The housing 242 may rotate around the sleeve 240. For example, the bearing 248 may be disposed between the housing 242 and the sleeve 240. In one embodiment, the bearing 248 may be any type of bearing. In particular, since the bearing 248 does not contact the inner surface of the sleeve 240, there is no problem of the conductive bearing 248 interfering with the RF return path 101. In addition, the bearing 248 is disposed under atmospheric conditions, as opposed to the vacuum conditions to which the bearing 247 is exposed.

[0032] In one embodiment, a plurality of second magnets 244 are disposed between the housing 242 and the sleeve 240. The number of the second magnets 244 may match the number of the first magnets 243. In particular, each first magnet 243 may be magnetically coupled to a different magnet in the second magnets 244. The second magnets 244 may also be mechanically coupled to the housing 242. Thus, when the housing 242 rotates, the second magnets 244 will also rotate. In addition, the rotation of the second magnets 244 will result in the rotation of the first magnets 243 and the tube 241. In some embodiments, the tube 241 may be mechanically coupled to the rotating components (e.g., rotors) of the chuck 105 and the rotating electrical feedthrough 130. Thus, the rotation of the housing 242 results in the desired rotation of the system. In one embodiment, the housing 242 may be coupled to an actuator or the like (not shown). The actuator may be used to enable the housing 242 to rotate.

[0033] Reference now Figure 3A , a cross-sectional view of a rotating electrical feedthrough 330 according to an embodiment is shown. In addition, a lower portion of a sleeve 340 of a magnetic coupler 320 is shown as a background. The bottom of the sleeve 340 can be coupled to a stationary housing 351 (sometimes referred to as a stator housing 351). An O-ring 346 or other gasket material can be used to provide a vacuum seal between the sleeve 340 and the stator housing 351. Bolts 338 or other fasteners can secure the sleeve 340 to the stator housing 351.

[0034] In one embodiment, the stator housing 351 may include a feedthrough or input 332. The input 332 may be hermetically sealed so that a vacuum may be maintained in the interior volume 358 of the stator housing 352. The input 332 may be suitable for any type of power or signal (e.g., RF, AC, and / or DC). In a particular embodiment, the input 332 may include an HN connector or the like. The input 332 allows a signal 335 to be transmitted from outside the vacuum environment to the vacuum interior in the interior volume 358 of the rotating electrical feedthrough 330. In some embodiments, a plurality of inputs 332 are provided. For example, in some embodiments, up to seven or more electrical inputs 332 may be provided.

[0035] In one embodiment, the bridge 364 can connect the input 332 to the electric transmission assembly 353. The electric transmission assembly 353 allows the fixed input 332 to rotate freely. The electric transmission assembly 353 can include any architecture suitable for providing a rotation function to the static input 332. For example, the electric transmission assembly 353 can be a slip ring, a brush, a liquid metal interconnect, or a roller ring structure. The output 354 can be directly coupled to the rotor 355.

[0036] The rotor 355 can be mechanically coupled to a connector 339 extending into the magnetic coupler 320. For example, the connector 339 can be coupled to the rotating inner tube 241. That is, the rotation in the magnetic coupler 320 can be transmitted to the rotating electrical feedthrough 330 via the connector 339. In one embodiment, the rotor 355 can be coupled to the stator housing 351 through a bearing 356 that allows the rotor 355 to rotate freely within the stator housing 351.

[0037] As described above, the interior 357 and the interior volume 358 of the magnetic coupler 320 can be maintained at a vacuum pressure. In some embodiments, the interior 357 of the magnetic coupler 320 can be fluidly coupled to the interior volume 358 so that both are maintained at substantially the same pressure. In other embodiments (described in more detail below), there can be a pressure differential between the interior 357 and the interior volume 358 of the magnetic coupler 320.

[0038] The illustrated embodiment also shows the path of the RF return path 301. As shown, the RF return path 301 is disposed along the inner surface of the sleeve 340 and continues on the inner surface of the stator housing 351. The RF return path 301 can follow the interior of the stator housing 351 until it reaches one of the inputs 332. The RF ground path 301 then propagates outside the vacuum environment and can be connected back to the RF matching / power supply (not shown) to complete the RF circuit to achieve closed-loop control of the plasma.

[0039] Now refer to Figure 3B , shows a cross-sectional view of a rotary electrical feedthrough 330 according to another embodiment. In one embodiment, in addition to the RF return path 301, Figure 3B The rotating electrical feedthrough 330 in may be substantially similar to Figure 3A The rotating electrical feedthrough 330 in FIG. As described above, the presence of conductive features along the RF return path 301 can reduce the effectiveness of the return path. Therefore, care is taken to avoid the presence of conductive materials along the return path 301.

[0040] For example, the bearing 356 can be separated from the inner surface of the stator housing 351 by an insulating liner 361. The insulator liner 361 can be any electrically insulating material, such as plastic, rubber, or the like. When the insulating liner 361 is present, the bearing 356 can be any type of bearing 356, including a conductive bearing 356. In some embodiments, the insulating liner 361 can be an integral part of the bearing 356, or the insulating liner 361 is a discrete component between the bearing 356 and the stator housing 351. In another embodiment, the bearing 356 can be an insulating bearing 356, such as a ceramic bearing 356. In such an embodiment, a discrete insulating liner 361 may not be required.

[0041] Additionally, in some cases, the surface of the electrical transmission component 353 may be conductive. In such an embodiment, an insulating gasket 362 may be disposed between the electrical transmission component 353 and the stator housing 351. When the bearing 356 and the electrical transmission component 353 are both electrically isolated from the stator housing 351, the RF return path 301 is improved.

[0042] Now refer to Figure 3C , shows a cross section of a rotary electrical feedthrough 330 according to another embodiment. In one embodiment, Figure 3C The rotating electrical feedthrough 330 in may be substantially similar to Figure 3B The rotating electrical feedthrough 330 in FIG. 1 is different from the rotating electrical feedthrough 330 in FIG. 1 and the magnetic coupler 320 in FIG.

[0043] The interior 357 of the magnetic coupler 320 can be separated from the interior volume 358 of the rotating electrical feedthrough 330, rather than the two components being fluidly coupled to each other. For example, an O-ring 336 or the like can be disposed between the connector 339 and the sleeve 340. In a particular embodiment, the O-ring 336 is a dynamic seal that allows the connector 339 to rotate.

[0044] Separating the two volumes 357 and 358 allows volume 358 to be maintained at a pressure different from the pressure of volume 357. For example, the pressure in interior volume 358 can be lower than the pressure in volume 357. For example, the pressure in volume 357 can be 1e -6 Torr, while the pressure in the internal volume 358 may be 1e -9 In a particular embodiment, a dedicated pump (not shown) may be coupled to the opening 334 in the stator housing 351. Reducing the pressure in the stator housing 351 pushes the position of the Paschen curve further to the left. This reduces the risk of igniting a plasma within the stator housing 351. In addition, it should be understood that the pressure difference at the interface between the volume 357 and the internal volume 358 is not significantly high. This allows the dynamic seal 336 to function effectively. That is, the dynamic seal 336 does not need to support the difference between the vacuum pressure and the atmospheric pressure.

[0045] Reference now Figure 4, a block diagram of an exemplary computer system 400 of a processing tool according to an embodiment is shown. In one embodiment, the computer system 400 is coupled to the processing tool and controls the processing in the processing tool. The computer system 400 can be connected (e.g., networked) to other machines in a local area network (LAN), an intranet, an extranet, or the Internet. The computer system 400 can operate as a server or client machine in a client-server network environment, or as a peer machine in a peer (or distributed) network environment. The computer system 400 can be a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a cellular phone, a network appliance, a server, a network router, a switch or a bridge, or any machine capable of executing a set of instructions (sequentially or otherwise) that specify the actions to be taken by the machine. Further, while only a single machine is illustrated with respect to computer system 400, the term "machine" shall also be taken to include any collection of machines (e.g., computers) that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies described herein.

[0046] The computer system 400 may include a computer program product or software 422 having a non-transitory machine-readable medium having instructions stored thereon, which may be used to program the computer system 400 (or other electronic device) to perform processing according to an embodiment. A machine-readable medium includes any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computer). For example, a machine-readable (e.g., computer-readable) medium includes a machine (e.g., computer) readable storage medium (e.g., read only memory (read only memory; "ROM"), random access memory (random access memory; "RAM"), magnetic disk storage medium, optical storage medium, flash memory device, etc.), a machine (e.g., computer) readable transmission medium (electrical, optical, acoustic or other form of propagation signal (e.g., infrared signal, digital signal, etc.)), etc.

[0047] In one embodiment, the computer system 400 includes a system processor 402, a main memory 404 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM)), a static memory 406 (e.g., flash memory, static random access memory (SRAM), etc.), and an auxiliary memory 418 (e.g., a data storage device), which communicate with each other via a bus 430.

[0048] The system processor 402 represents one or more general-purpose processing devices, such as a microsystem processor, a central processing unit, etc. More specifically, the system processor can be a complex instruction set computing (CISC) microsystem processor, a reduced instruction set computing (RISC) microsystem processor, a very long instruction word (VLIW) microsystem processor, a system processor that implements other instruction sets, or a system processor that implements a combination of instruction sets. The system processor 402 can also be one or more special-purpose processing devices, such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal system processor (DSP), a network system processor, etc. The system processor 402 is configured to execute processing logic 426 for performing the operations described herein.

[0049] The computer system 400 may also include a system network interface device 408 for communicating with other devices or machines. The computer system 400 may also include a video display unit 410 (e.g., a liquid crystal display (LCD), a light emitting diode display (LED), or a cathode ray tube (CRT)), an alphanumeric input device 412 (e.g., a keyboard), a cursor control device 414 (e.g., a mouse), and a signal generating device 416 (e.g., a speaker).

[0050] The secondary memory 418 may include a machine-accessible storage medium 432 (or more specifically, a computer-readable storage medium) on which is stored one or more sets of instructions (e.g., software 422) embodying any one or more of the methods or functions described herein. The software 422 may also reside, in whole or in part, within the main memory 404 and / or within the system processor 402 during execution of the software 422 by the computer system 400, the main memory 404 and the system processor 402 also constituting machine-readable storage media. The software 422 may also be sent or received over the network 420 via the system network interface device 408. In one embodiment, the network interface device 408 may operate using radio frequency coupling, optical coupling, acoustic coupling, or inductive coupling.

[0051] Although the machine-accessible storage medium 432 is shown as a single medium in the exemplary embodiment, the term "machine-readable storage medium" should be understood to include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) that store one or more sets of instructions. The term "machine-readable storage medium" should also be understood to include any medium that can store or encode a set of instructions for execution by a machine and cause the machine to perform any one or more methods. Therefore, the term "machine-readable storage medium" should be understood to include, but is not limited to, solid-state memories and optical and magnetic media.

[0052] In the foregoing description, specific exemplary embodiments have been described. It will be apparent that various modifications may be made thereto without departing from the scope of the following claims. Accordingly, the description and drawings are to be regarded as illustrative rather than restrictive.

Claims

1. A semiconductor processing tool comprising: Chamber; a chuck within the chamber, wherein the chuck is configured to rotate; a base support surrounding the chuck; as well as a common post coupled to the chuck, wherein the common post comprises: a magnetic coupler that enables rotation of portions of the chuck and common post; as well as Rotating electrical feedthrough.

2. The semiconductor processing tool of claim 1 , wherein the magnetic coupler comprises: a casing, wherein said casing is fixed; a first set of magnets external to the casing; a second set of magnets within the casing; as well as A tube is coupled to the second set of magnets.

3. The semiconductor processing tool of claim 2, wherein the rotary electrical feedthrough comprises: stator housing; as well as Rotor.

4. The semiconductor processing tool of claim 3, wherein a radio frequency return path is provided along the susceptor support, the sleeve and the stator housing.

5. The semiconductor processing tool of claim 3, wherein the RF return path is electrically isolated from conductive components other than the susceptor support, the sleeve, and the stator housing, and wherein an outer race of a mechanical bearing inside the sleeve is electrically isolated from the RF return path.

6. The semiconductor processing tool of claim 3, wherein the interior of said tube and said rotating electrical feedthrough are sealed so that chamber vacuum pressure can be maintained in said tube and said rotating electrical feedthrough.

7. The semiconductor processing tool of claim 3 wherein a dynamic seal isolates the rotating electrical feedthrough and an interior of the tube from an exterior fluid of the tube, and wherein the rotating electrical feedthrough and the interior of the tube are configured to be maintained at a pressure different than a pressure in a wafer cavity and a process cavity in the chamber.

8. The semiconductor processing tool of claim 1, wherein the semiconductor processing tool is a physical vapor deposition (PVD) tool.

9. The semiconductor processing tool of claim 1 wherein the rotary electrical feedthrough comprises up to seven electrical inputs.

10. The semiconductor processing tool of claim 9, wherein the electrical input is provided to one or more heaters and one or more clamping electrodes.

11. The semiconductor processing tool of claim 1 , further comprising: a backside gas line for a substrate on the chuck, wherein the backside gas line is located at an axial center of the common post, and wherein a dynamic seal is provided around the backside gas line at a bottom of the rotating electrical feedthrough, and wherein the backside gas thermally couples the substrate to the chuck.

12. A rotary electrical feedthrough comprising: stator housing; an electrical transmission assembly within the stator housing; a first insulator between the power transfer assembly and the stator housing; a rotor electrically coupled to the power transmission assembly; a mechanical bearing between the rotor and the stator housing; as well as A second insulator is between the mechanical bearing and the stator housing.

13. The rotary electrical feedthrough of claim 12, wherein the electrical transmission component comprises a slip ring, a brush, a liquid metal connection, or a roller ring.

14. The rotary electrical feedthrough of claim 12, further comprising: An opening, wherein the opening is configured to be connected to a pump to provide a vacuum pressure inside the stator housing.

15. The rotary electrical feedthrough of claim 12, wherein up to seven electrical paths are provided to the electrical transmission assembly.

16. The rotary electrical feedthrough of claim 15, wherein the seven electrical paths are configured to interface with connectors external to the stator housing, and wherein the connectors contact the electrical paths via a hermetically sealed port through the stator housing.

17. A magnetic coupler capable of achieving contactless rotation, comprising: Tube; a sleeve surrounding the tube; A shell outside the casing; a first set of magnets between the tube and the sleeve; a second set of magnets between the sleeve and the housing; a first bearing between the tube and the sleeve, wherein the first bearing is electrically insulating; as well as A second bearing is provided between the sleeve and the housing.

18. The magnetic coupler of claim 17, wherein the first bearing comprises a ceramic material or a metal bearing having a dielectric liner on an outer race thereof for electrical isolation.

19. The magnetic coupler of claim 17, wherein the magnetic coupler is configured to maintain a vacuum pressure within the sleeve and is configured to be exposed to atmospheric pressure outside the sleeve.

20. The magnetic coupler of claim 17, further comprising: An actuator is provided for rotating the housing, wherein rotation of the housing causes the contactless rotation of the tube.

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