Silicon wafer stepping transmission control method and system

Abstract

The invention provides a silicon wafer stepping transmission control method and system, and relates to the technical field of silicon wafer transmission, and the method comprises the steps: receiving a first photoelectric induction signal located at one side of an inlet on a transmission mechanism, controlling the transmission mechanism to execute a first stepping operation, and enabling a silicon wafer to horizontally enter a wafer receiving mechanism from a wafer sending mechanism through the transmission mechanism; and / or receiving a second photoelectric sensing signal located on one side of the outlet on the transmission structure or a feedback signal of the wafer receiving mechanism, and controlling the transmission mechanism to execute a second stepping operation, so that the silicon wafer enters the auxiliary wafer receiving mechanism after ascending / descending, and the problems that existing silicon wafer stepping transmission needs to depend on manual operation and is lack of autonomous control are solved.

Description

Technical Field

[0001] The present invention relates to the field of silicon wafer transmission technology, and in particular to a silicon wafer step transmission control method and system. Background Art

[0002] In the process of screen printing, the transceiver of silicon wafer is a very important link. If there is a problem in this link, it will lead to problems such as fragmentation, hidden cracks in silicon wafers, and uneven wafer collection due to wafer collision, which will greatly affect the production of equipment. A good transceiver transmission logic plays a significant role in the early debugging of the equipment and the stability of the later production.

[0003] Most of the existing silicon wafer transmission is carried out by uninterrupted conveyor belt transmission. Human control is required in this process to ensure the safety of silicon wafer transportation. Some existing equipment also uses lifting modules combined with conveyor belts to achieve step transmission, but manual operation is still required, and misoperation in this process can easily lead to damage to the silicon wafers. Summary of the invention

[0004] In order to overcome the above technical defects, the purpose of the present invention is to provide a silicon wafer step transmission control method and system to solve the problem that the existing silicon wafer step transmission needs to rely on manual operation and lacks autonomous control.

[0005] The present invention discloses a silicon chip step transmission control method, comprising:

[0006] Receiving a first photoelectric sensing signal on the entrance side of the transmission mechanism, controlling the transmission mechanism to perform a first stepping operation, so that the silicon wafer passes from the wafer sending mechanism through the transmission mechanism and enters the wafer receiving mechanism horizontally;

[0007] And / or, receiving a second photoelectric sensing signal located at the exit side of the transmission structure or a feedback signal of the wafer collecting mechanism, and controlling the transmission mechanism to perform a second stepping operation, so that the silicon wafer enters the auxiliary wafer collecting mechanism after being raised / lowered.

[0008] Preferably, before the control transmission mechanism performs the first step operation, the method includes:

[0009] Acquire the transmission distance of the transmission structure and the number of silicon wafers transmitted by moving the transmission distance;

[0010] The transmission distance is equally divided according to the number of silicon wafers to determine the stepping frequency and operation time of the first stepping operation and / or the second stepping operation.

[0011] Preferably, the second photoelectric sensing signal located at the outlet side of the transmission structure is used to monitor whether the silicon wafer transmission process is abnormal;

[0012] If abnormal, the first step operation or the second step operation is stopped.

[0013] Preferably, the first stepping operation and / or the second stepping operation include stepping with material and stepping without material; wherein the stepping frequency of the pre-configured stepping without material does not exceed the number of silicon wafers.

[0014] Preferably, a feedback signal from a chip-issuing mechanism or a second photoelectric sensing signal is received to determine that the stepping without material is executed;

[0015] When the frequency of the material-free stepping operation reaches the number of silicon wafers transmitted under the transmission distance of the transmission structure, the stepping operation is stopped.

[0016] Preferably, the transmission mechanism is controlled to perform the first stepping operation and / or the second stepping operation by outputting a command to control the motor operation mode of the transmission mechanism.

[0017] Preferably, the first photoelectric sensing signal and the second photoelectric sensing signal on the transmission mechanism are acquired to dynamically adjust the stepping frequency and the operation time of the first stepping operation and / or the second stepping operation.

[0018] Preferably, before receiving the first photoelectric sensing signal on the transmission mechanism at the entrance side, the method further includes:

[0019] The feedback signal of the film receiving mechanism is received. When the feedback signal is not started, the first step operation is not performed.

[0020] The present invention also provides a silicon chip stepping transmission control system, comprising:

[0021] The wafer sending mechanism is arranged at the entrance side of the transmission mechanism and is used to input the silicon wafer into the transmission mechanism;

[0022] A wafer receiving mechanism is arranged at the outlet side of the transmission mechanism and is used to store the silicon wafers input from the transmission mechanism;

[0023] A transmission mechanism, used for controlling the stepping and transmitting the silicon wafer, wherein a first photoelectric sensor generating a first photoelectric sensor signal is arranged at an inlet side, and a second photoelectric sensor generating a second photoelectric sensor signal is arranged at an outlet side;

[0024] The server side communicates with the transmission mechanism, the film sending mechanism, and the film receiving structure to control the stepping transmission of the transmission mechanism;

[0025] An auxiliary film receiving mechanism, arranged above / below the film receiving mechanism and communicating with the server end;

[0026] The server receives a first photoelectric sensing signal on the entrance side of the transmission mechanism, and controls the transmission mechanism to perform a first stepping operation, so that the silicon wafer enters the wafer receiving mechanism horizontally from the wafer sending mechanism through the transmission mechanism;

[0027] And / or, the server receives a second photoelectric sensing signal located on the exit side of the transmission structure and a feedback signal from the wafer collecting mechanism, and controls the transmission mechanism to perform a second stepping operation, so that the silicon wafer enters the auxiliary wafer collecting mechanism after rising / falling.

[0028] Preferably, the transmission mechanism is configured such that a transmission distance thereon is equally divided by the number of silicon wafers that are transported by moving the transmission distance.

[0029] Preferably, one side of the conveying mechanism outlet extends into the film receiving mechanism.

[0030] Compared with the prior art, the above technical solution has the following beneficial effects:

[0031] The silicon wafer step transmission control method and system provided in the present embodiment establishes communication with the wafer receiving mechanism, the wafer sending mechanism and the transmission mechanism through the server side, receives various feedback signals, and issues control instructions to enable the transmission mechanism to autonomously perform equidistant stepping operations, so that the silicon wafer is equidistantly stepped through the transmission mechanism to be transmitted to the wafer receiving mechanism. In this process, the first photoelectric sensing signal and the second photoelectric sensing signal located in the transmission mechanism are used to monitor the status of the silicon wafer in real time, thereby solving the problem that the existing silicon wafer step transmission requires manual operation, lacks autonomous control, and misoperation can easily lead to damage to the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a flow chart of a silicon wafer stepping transmission control method and system according to the present invention;

[0033] Figure 2 A flowchart embodying specific step control in a silicon wafer step transmission control method and system according to the present invention;

[0034] Figure 3 This is a module schematic diagram of a silicon wafer step transmission control method and system described in the present invention.

[0035] Reference numerals:

[0036] 1-film sending mechanism; 2-film receiving mechanism; 21-auxiliary film receiving mechanism; 3-transmission mechanism; 31-first photoelectric sensor; 32-second photoelectric sensor; 4-server end. DETAILED DESCRIPTION

[0037] The advantages of the present invention are further described below in conjunction with the accompanying drawings and specific embodiments.

[0038] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0039] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0040] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0041] In the description of the present invention, it is necessary to understand that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0042] In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0043] In the following description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention, and have no specific meanings. Therefore, "module" and "component" can be used interchangeably.

[0044] Embodiment: This embodiment discloses a silicon wafer stepping transmission control method, which is applied to a server side and is used to output instructions to control a transmission mechanism for transmitting silicon wafers to perform a stepping operation. In this embodiment, a program is pre-configured to autonomously control the execution of the stepping operation according to a first photoelectric sensing signal and / or a first photoelectric sensing signal on the transmission mechanism, thereby eliminating the need for manual operation and reducing safety hazards caused by misoperation, such as Figure 1-Figure 3 ,in Figure 2 The upstream and midstream are the wafer-emitting mechanism, and the downstream is the wafer-collecting mechanism. Taking the example that each step control includes 3 steps (each step controls the transmission of 3 silicon wafers), the silicon wafer transmission monitoring sensor 1 is the following first photoelectric sensing sensor (outputting the first photoelectric sensing signal); the silicon wafer sensing detection sensor 2 is the second photoelectric sensing sensor (outputting the second photoelectric sensing signal).

[0045] Specifically, the control method is applied to the server side, including the following:

[0046] S1: receiving a first photoelectric sensing signal on the entrance side of the transmission mechanism, and controlling the transmission mechanism to perform a first stepping operation, so that the silicon wafer enters the wafer receiving mechanism horizontally from the wafer sending mechanism through the transmission mechanism;

[0047] And / or, S2: receiving a second photoelectric sensing signal on the exit side of the transmission structure and / or a feedback signal from the wafer collecting mechanism, and controlling the transmission mechanism to perform a second stepping operation, so that the silicon wafer is raised / lowered and enters the auxiliary wafer collecting mechanism.

[0048] As an illustration, the first stepping operation and the second stepping operation may both include steps of different frequencies ( Figure 2 The example in the figure is 3 times), each frequency of stepping corresponds to the movement of a silicon wafer on it, and the first and second are used to distinguish and represent different operations on the silicon wafer. The first stepping operation causes the silicon wafer to enter the wafer collection mechanism, and the second stepping operation causes the silicon wafer to enter the auxiliary wafer collection mechanism. In other words, stepping operations of different frequencies or moving directions / moving distances can be executed through different instructions, so that the silicon wafer can be collected accordingly. It can be understood that the following stepping operation includes the above-mentioned first stepping operation and / or second stepping operation, which includes multiple frequencies of stepping.

[0049] In this embodiment, the above-mentioned first stepping operation, when the wafer-emitting mechanism starts feeding (determining that there are silicon wafers at the entrance of the transmission mechanism through the first photoelectric sensing signal), the silicon wafers start to enter the transmission mechanism, which can be a transmission or other existing mechanical structure to assist the movement of the silicon wafers. At this time, the first stepping operation is performed, so that the silicon wafers enter the wafer collecting mechanism horizontally. It should be noted that each frequency of stepping in the stepping operation here corresponds to one movement of the silicon wafer. The steps in the first stepping operation can be achieved by stepping motor control. Each step does not necessarily have a rising and falling step, which can be dynamically adjusted according to the position of the wafer collecting mechanism; the above-mentioned second stepping operation, according to the second photoelectric sensing signal located on the side of the outlet, determines that there are silicon wafers at the outlet of the transmission mechanism, and then controls the silicon wafers to enter the auxiliary wafer collecting mechanism. The second stepping operation can be performed autonomously according to the control instruction, or according to the feedback signal of the wafer collecting mechanism. If the amount of silicon wafers collected in the wafer collecting mechanism reaches the upper limit, then the second stepping operation is controlled to be performed at this time.

[0050] Therefore, based on the above, Figure 2 As shown, the transmission control of this embodiment can realize the following three application scenarios: after the transmission mechanism is fed, the first stepping operation is performed according to the control instruction, so that the silicon wafer is horizontal (or approximately horizontal, that is, the relative horizontal position has a certain offset within a preset range) and enters the wafer collecting mechanism (after the silicon wafer transmission monitoring sensor 1 monitors and outputs yes, the stepping time is 100ms (operating time) to execute the stepping); after the transmission mechanism is fed, the second stepping operation is performed according to the control instruction, so that the silicon wafer is raised / lowered and enters the auxiliary wafer collecting mechanism (after the silicon wafer transmission monitoring sensor 2 monitors and outputs yes, the stepping time is 100ms (operating time) to execute the stepping); after the transmission mechanism is fed, the first stepping operation is performed, and when the feedback signal of the wafer collecting mechanism shows that the silicon wafer collection amount has reached the upper limit, the first stepping operation is switched to the second stepping operation, that is, the above two steps can be executed separately or sequentially according to the application scenario.

[0051] Specifically, as an option, the motor operation mode of the transmission mechanism is controlled by outputting instructions to control the transmission mechanism to perform the first step operation and / or the second step operation. A stepper motor or a servo motor can be used for precise control. Specifically, the motor operation mode is set to include a positive output mode and an absolute mode. When the motor is in the positive output mode, the first step operation or the second step operation is performed. When the motor is in the absolute mode, the position of the motor is determined relative to a fixed reference point (usually the zero position). Regardless of when the motor is powered off or restarted, it can accurately know its position, so that no offset will occur when the positive output mode is started again, thereby reducing the risk of damage to the silicon wafer during transmission.

[0052] In this embodiment, it should be noted that when the server outputs corresponding control instructions based on the first photoelectric sensing signal and the second photoelectric sensing signal on the wafer sending mechanism, the wafer receiving mechanism and the transmission mechanism so that the transmission mechanism steps autonomously, the stepping frequency and the distance moved by the silicon wafer will be controlled, thereby reducing the situation where the silicon wafer is damaged during the transmission process. Specifically, as mentioned above, each stepping operation can include steps of different frequencies, and each frequency of stepping corresponds to the movement of a silicon wafer thereon. Assuming that each stepping operation includes three steps, corresponding to the movement of three silicon wafers, for the convenience of control, the transmission distance of the transmission mechanism can be divided into three equal parts, and each time the three silicon wafers move a divided distance, so that the three silicon wafers move a divided distance each time, and the stepping transmission is performed to the wafer receiving mechanism / auxiliary wafer receiving mechanism.

[0053] Therefore, based on the above considerations, before controlling the transmission mechanism to perform the first stepping operation, it includes: obtaining the transmission distance of the transmission structure and the number of silicon wafers to be transmitted by moving the transmission distance; dividing the transmission distance equally by the number of silicon wafers to determine the stepping frequency and operation time of the first stepping operation and / or the second stepping operation, and the operation time will affect the transmission distance under each frequency stepping, that is, the distance under each equal division obtained by equally dividing the transmission distance by the number of silicon wafers mentioned above. Thus, during each stepping operation (the first stepping operation and / or the second stepping operation), multiple frequencies of steps are performed, so that the silicon wafers are moved equally on the transmission mechanism, thereby further reducing the damage to the silicon wafers that may be caused during the autonomous stepping transmission of the silicon wafers, and improving the efficiency and quality of silicon wafer transmission.

[0054] Specifically, in this embodiment, the first stepping operation and / or the second stepping operation include multiple frequencies of steps, and each frequency of steps can be correspondingly divided into steps with material and steps without material; wherein, the frequency of steps pre-configured for steps without material does not exceed the number of silicon wafers. It can be understood that a step with material means that silicon wafers are arranged in the area corresponding to the movement of the step at this frequency, while a step without material means that no silicon wafers are arranged in the area corresponding to the movement of the step at this frequency, that is, "empty stepping". Assuming that the number of silicon wafers transmitted in each stepping operation is 3, as an example, Figure 2 After the silicon wafer transmission monitoring sensor 1 outputs Yes and the silicon wafer transmission monitoring sensor 2 outputs NO, the control stepping time is 50ms. There may be 1 / 2 empty stepping when performing the first stepping operation, and there may also be empty stepping when performing the last stepping operation to ensure that all silicon wafers are transferred to the wafer collecting mechanism / auxiliary wafer collecting mechanism to reduce the risk of equipment jamming.

[0055] Since it is necessary to determine whether the step occurring at this frequency is a material step or a material-free step based on whether a silicon wafer exists, in this embodiment, whether there is a silicon wafer is determined based on the first photoelectric sensing signal / the second photoelectric sensing signal. It can be understood that if there is no silicon wafer or the silicon wafer is damaged, the first photoelectric sensing signal / the second photoelectric sensing signal cannot be triggered. The first photoelectric sensing signal / the second photoelectric sensing signal can only be triggered when the silicon wafer is normally located on the entrance side / exit side of the transmission mechanism.

[0056] Based on the above, it can be understood that the material-free stepping may occur in the first stepping operation or the last stepping operation. When an unexpected situation occurs during the transmission process (such as when the silicon wafer is damaged), an empty stepping may also occur. However, in order to achieve the purpose of energy saving, it does not need to be executed all the time. Therefore, the feedback signal of the wafer-issuing mechanism is received or the second photoelectric sensing signal is received to determine that the material-free stepping is executed; when the frequency of the material-free stepping operation reaches the number of silicon wafers transmitted under the transmission distance of the transmission structure, the stepping operation is stopped. When the feedback signal of the wafer-issuing mechanism can indicate that the number of silicon wafers in the wafer-issuing mechanism has not increased, it is determined that the material-free stepping is being executed. Therefore, the material-containing stepping will be triggered until the incoming material ends. When the material-free stepping occurs, the device will empty step several times to prevent the device from getting stuck. For example, when the number of empty steps exceeds 3, the stepping will stop to achieve the purpose of energy saving, and wait for the incoming material to be satisfied before stepping again.

[0057] In this embodiment, it can also be understood that before receiving the first photoelectric sensing signal on the entrance side of the transmission mechanism, it is necessary to include: receiving the feedback signal of the film receiving mechanism / film sending mechanism. When the feedback signal is not started, the first stepping operation is not performed, that is, before performing the stepping operation, it is necessary to confirm whether the film sending mechanism, the film receiving mechanism, and the auxiliary film receiving mechanism are in a working state. When any mechanism cannot work, the stepping operation is not performed, or (such as Figure 2 Example) Set the number of steps to 0.

[0058] In a preferred embodiment, the second photoelectric sensing signal located on the outlet side of the transmission structure is used to monitor whether the silicon wafer transmission process is abnormal; if abnormal, the first step operation or the second step operation is stopped. The abnormality includes but is not limited to silicon wafer breakage, material jamming, etc. As mentioned above, when the silicon wafer is abnormal, the second photoelectric sensing signal cannot be triggered, and thus the server cannot monitor the second photoelectric sensing signal. As a supplement, the first photoelectric sensing signal can also be combined for monitoring, so that silicon wafer fragments and blockages can be monitored for timely processing.

[0059] In a preferred embodiment, the first photoelectric sensing signal and the second photoelectric sensing signal on the transmission mechanism can also be obtained to dynamically adjust the stepping frequency and running time of the first stepping operation and / or the second stepping operation. Specifically, the dynamic adjustment includes but is not limited to controlling the first stepping operation to be converted into the second stepping operation, etc., such as the various application scenarios that can be realized by the above-mentioned transmission control. In this process, the moving distance of each stepping frequency under the stepping operation, or the stepping frequency under each operation can also be dynamically adjusted, such as executing 3 steps in the first number of stepping operations and 4 steps in the latter number of stepping operations. The intervals between each silicon wafer are synchronously adjusted to improve the transmission efficiency, so that each silicon wafer can also be dynamically adjusted to reduce the error caused by photoelectric sensing, meet the requirements of continuous wafer feeding, and reduce the problem of wafer collision.

[0060] This embodiment further provides a silicon wafer stepping transmission control system, which is used to execute the above silicon wafer stepping transmission method, specifically including:

[0061] The wafer sending mechanism is arranged at the entrance side of the transmission mechanism and is used to input the silicon wafer into the transmission mechanism;

[0062] A wafer receiving mechanism is arranged at the outlet side of the transmission mechanism and is used to store the silicon wafers input from the transmission mechanism;

[0063] A transmission mechanism, used for controlling the stepping and transmitting the silicon wafer, wherein a first photoelectric sensor generating a first photoelectric sensor signal is arranged at an inlet side, and a second photoelectric sensor generating a second photoelectric sensor signal is arranged at an outlet side;

[0064] It can be understood that the specific structures of the above-mentioned wafer sending mechanism, wafer receiving mechanism and transmission mechanism can apply the structure in the existing general silicon wafer transmission system, which is not elaborated here. It can realize the input of silicon wafers to the transmission mechanism and the storage of silicon wafers. For example, the wafer receiving mechanism can include an existing general flower basket, etc.

[0065] The server side communicates with the transmission mechanism, the film sending mechanism, and the film receiving structure to control the stepping transmission of the transmission mechanism;

[0066] An auxiliary film receiving mechanism, which is optionally arranged above or below the film receiving mechanism, or one or more of them may be arranged, and communicates with the server end;

[0067] The server receives a first photoelectric sensing signal on the entrance side of the transmission mechanism, and controls the transmission mechanism to perform a first stepping operation, so that the silicon wafer enters the wafer receiving mechanism horizontally from the wafer sending mechanism through the transmission mechanism;

[0068] And / or, the server receives a second photoelectric sensing signal located on the exit side of the transmission structure and a feedback signal from the wafer collecting mechanism, and controls the transmission mechanism to perform a second stepping operation, so that the silicon wafer enters the auxiliary wafer collecting mechanism after rising / falling.

[0069] Based on the above-mentioned silicon wafer step transmission control system, the server side receives the first photoelectric sensing signal and the second photoelectric sensing signal from the wafer sending mechanism, the wafer receiving mechanism and the transmission mechanism, and starts the step transmission according to the start signal fed back by the wafer sending mechanism and the wafer receiving mechanism. Specifically, when the first photoelectric sensing signal detects the silicon wafer, the first step operation / the second step operation is executed to transmit the silicon wafer. Each step operation can include multiple step frequencies so that multiple silicon wafers can be transmitted at one time.

[0070] In this embodiment, in order to reduce the damage of silicon wafers caused by the stepping process, the transmission mechanism is configured so that the transmission distance is equally divided by the number of silicon wafers that are transported by moving the transmission distance. By stepping at equal intervals by the equipment (transmission mechanism) itself, the error caused by photoelectric sensing can be reduced, the requirements of continuous wafer feeding can be met, the problem of wafer collision can be reduced, silicon wafer fragments and blockages can be monitored, and the efficiency and quality of silicon wafer transmission can be improved.

[0071] In this embodiment, as an option, one side of the transmission mechanism outlet can be arranged to extend into the wafer collecting mechanism so that the second photoelectric sensing sensor is located in the wafer collecting mechanism, thereby improving the safety of the silicon wafer transfer process from the transmission mechanism to the wafer collecting mechanism and improving the transmission efficiency.

[0072] The silicon wafer step transmission control method and silicon wafer step transmission control system provided in the present embodiment establish communication with the wafer receiving mechanism, the wafer sending mechanism and the transmission mechanism through the server side, receive feedback signals from each device, and issue control instructions to make the transmission mechanism perform stepping operations, so that the silicon wafer is equidistantly stepped and transmitted to the wafer receiving mechanism through the transmission mechanism. In this process, the first photoelectric sensing signal located on the entrance side of the transmission mechanism and the second photoelectric sensing signal located on the exit side of the transmission mechanism are used to monitor the silicon wafer status in real time, and the stepping frequency and stepping operation time can also be dynamically adjusted to perform the first stepping operation or the second stepping operation. The length of the transmission mechanism meets the requirement of equal stepping, reduces the error caused by photoelectric sensing, and meets the requirement of continuous wafer feeding, reduces the problem of wafer collision, and silicon wafer abnormalities can also be processed immediately, realizing autonomous step transmission control of silicon wafers and improving transmission efficiency and quality.

[0073] It should be noted that the embodiments of the present invention have better practicability and do not impose any form of limitation on the present invention. Any technician familiar with the field may use the technical content disclosed above to change or modify it into an equivalent effective embodiment. However, any modification or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A silicon wafer stepping transmission control method, characterized in that: include: Receiving a first photoelectric sensing signal on the entrance side of the transmission mechanism, controlling the transmission mechanism to perform a first stepping operation, so that the silicon wafer passes from the wafer sending mechanism through the transmission mechanism and enters the wafer receiving mechanism horizontally; And / or, receiving a second photoelectric sensing signal located at the exit side of the transmission structure or a feedback signal of the wafer collecting mechanism, and controlling the transmission mechanism to perform a second stepping operation, so that the silicon wafer enters the auxiliary wafer collecting mechanism after being raised / lowered.

2. The silicon wafer transmission control method according to claim 1, characterized in that: Before controlling the transmission mechanism to perform the first step operation, including: Acquire the transmission distance of the transmission structure and the number of silicon wafers transmitted by moving the transmission distance; The transmission distance is equally divided according to the number of silicon wafers to determine the stepping frequency and operation time of the first stepping operation and / or the second stepping operation.

3. The silicon wafer transmission control method according to claim 1, characterized in that: Monitoring whether the silicon wafer transmission process is abnormal according to a second photoelectric sensing signal located on the exit side of the transmission structure; If abnormal, the first step operation or the second step operation is stopped.

4. The silicon wafer transmission control method according to claim 2, characterized in that: The first stepping operation and / or the second stepping operation include stepping with material and stepping without material; wherein the stepping frequency of the pre-configured stepping without material does not exceed the number of silicon wafers.

5. The silicon wafer transmission control method according to claim 4, characterized in that: Receive the feedback signal of the film-sending mechanism or receive the second photoelectric sensing signal to determine the execution of the material-free step; When the frequency of the material-free stepping operation reaches the number of silicon wafers transmitted under the transmission distance of the transmission structure, the stepping operation is stopped.

6. The silicon wafer transmission control method according to claim 2, characterized in that: The transmission mechanism is controlled to perform the first stepping operation and / or the second stepping operation by outputting a command to control the motor operation mode of the transmission mechanism.

7. The silicon wafer transmission control method according to claim 2, characterized in that: The first photoelectric sensing signal and the second photoelectric sensing signal on the transmission mechanism are obtained, and the stepping frequency and the operation time of the first stepping operation and / or the second stepping operation are dynamically adjusted.

8. The silicon wafer transmission control method according to claim 1, characterized in that: Before receiving the first photoelectric sensing signal on the transmission mechanism located at the entrance side, the method further includes: The feedback signal of the film receiving mechanism is received. When the feedback signal is not started, the first step operation is not performed.

9. A silicon chip stepping transmission control system, characterized in that: include: The wafer sending mechanism is arranged at the entrance side of the transmission mechanism and is used to input the silicon wafer into the transmission mechanism; A wafer receiving mechanism is arranged at the outlet side of the transmission mechanism and is used to store the silicon wafers input from the transmission mechanism; The transmission mechanism is used to control the stepping transmission of the silicon wafer, and a first photoelectric sensor generating a first photoelectric sensor signal is arranged on the entrance side, and a second photoelectric sensor generating a second photoelectric sensor signal is arranged on the exit side; the server side communicates with the transmission mechanism, the wafer sending mechanism, and the wafer receiving structure, and is used to control the stepping transmission of the transmission mechanism; An auxiliary film receiving mechanism, arranged above / below the film receiving mechanism and communicating with the server end; The server receives a first photoelectric sensing signal on the entrance side of the transmission mechanism, and controls the transmission mechanism to perform a first stepping operation, so that the silicon wafer enters the wafer receiving mechanism horizontally from the wafer sending mechanism through the transmission mechanism; And / or, the server side receives a second photoelectric sensing signal located on the exit side of the transmission structure or a feedback signal from the wafer collecting mechanism, and controls the transmission mechanism to perform a second stepping operation, so that the silicon wafer enters the auxiliary wafer collecting mechanism after rising / falling.

10. The silicon chip stepping transmission control system according to claim 9, characterized in that: include: The transmission mechanism is configured such that a transmission distance thereon is equally divided by the number of silicon wafers that are transported by moving the transmission distance.

Images