Broad-spectrum flash connection method for ceramics

Abstract

The invention discloses a broad-spectrum flash connection method for ceramics, which is characterized in that ceramic chips are butted and then are connected by adding a heat source, and specifically comprises the following steps: butting and fixing the joint cross sections of a first ceramic chip and a second ceramic chip; the first graphite paper strip and the second graphite paper strip are tightly attached to the cross section of the joint respectively, and electrode chucks are clamped at the two ends of the first graphite paper strip and the two ends of the second graphite paper strip respectively; applying a heat source to quickly heat the joint cross section of the ceramic wafer, melting the graphite paper strip and connecting the joint cross section; cutting off the power supply, and disassembling the electrode chuck after the ceramic wafer is cooled to room temperature; the method can reduce the connection temperature and the connection time, and can be widely applied to the fields of electronic packaging, cultural relic repair, oversized electric porcelain and the like.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic material connection, and in particular to a broad-spectrum flash connection method for ceramics. Background Art

[0002] Flash connection technology is a connection process under the coupling of force, heat and electricity. The external electric field is mainly a DC electric field or a pulsed DC electric field with a large field strength, which can promote the "Flash" phenomenon and connect ceramic materials in an extremely short time (seconds) with a low connection temperature.

[0003] For the electric field assisted connection technology of ceramic materials, the electric field assisted diffusion connection technology, spark plasma sintering technology and flash connection technology have been developed. Electric field assisted diffusion connection technology is a connection technology that uses low voltage and small current. The connection temperature is low, but the connection time is long, and the requirements for the electrical conductivity of ceramics are high. It is mainly suitable for the connection of high-temperature ion conductive glass, ion conductive ceramics and semiconductors or metals. Spark plasma sintering technology is a connection technology that uses low voltage and high current. The connection time is shorter than that of electric field assisted diffusion connection, but the connection temperature is higher. Compared with electric field assisted diffusion connection technology and spark plasma sintering technology, flash connection technology can use direct current or pulsed direct current to achieve low-temperature instantaneous connection under the action of high voltage and small current field, which can truly realize the "seamless" connection of ceramic base materials.

[0004] The existing flash connection technology is used in the electric field assisted connection of ceramic materials. Under the action of the electric field, the contact impedance causes Joule heat to accumulate near the bonding interface, which increases the diffusion coefficient and promotes the formation of Schottky defects. At the same time, the defects migrate rapidly along the direction of the electric field to achieve interface connection. This process consumes a lot of energy to overcome the contact impedance and generate enough Joule heat, which promotes the diffusion and connection of materials. Summary of the invention

[0005] In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the present invention is to propose a broad-spectrum flash connection method for ceramics, applying the flash connection technology to the "seamless" connection of ceramic sheets, which has the characteristics of simple connection process, low connection temperature, short connection time and low energy consumption.

[0006] The technical solution adopted by the present invention is:

[0007] A broad-spectrum flash connection method for ceramics, wherein ceramic pieces are connected by heat source after being butted, and specifically include the following steps:

[0008] Step 1: Butt and fix the cross sections of the joints of the first ceramic sheet and the second ceramic sheet;

[0009] Step 2: Place the first graphite paper strip and the second graphite paper strip close to the cross section of the joint, and clamp the electrode chucks at both ends of the first graphite paper strip and the second graphite paper strip;

[0010] Step 3: applying a heat source to rapidly heat the cross section of the joint of the ceramic sheet, melting the graphite paper strip and connecting the cross section of the joint;

[0011] Step 4: Cut off the power supply and remove the electrode chuck after the ceramic sheet cools to room temperature.

[0012] The cross-section of the joint in step 1 should be two identical joint planes or complementary surfaces of the ceramic sheet.

[0013] In step 2, the width of the first graphite paper strip and the second graphite paper strip is greater than the width of the cross section of the joint.

[0014] In the step 2, the width of the first graphite paper strip and the second graphite paper strip is 3-10 mm, and the thickness is 0.1-0.5 mm.

[0015] In step 3, the electrode chuck is located 0.8-1.5 cm away from the joint surface of the first ceramic sheet and the second ceramic sheet.

[0016] The heat source applied in step 3 is a constant voltage DC power supply, a DC pulse power supply or Joule heat generated by a supercapacitor.

[0017] The heat source applied in step 3 has a preset electric field strength of 10-2000 V / cm and a preset current density of 5-4000 mA / mm 2 .

[0018] The beneficial effects of the present invention are:

[0019] The present invention adopts flash connection technology to connect two ceramic sheets. By clamping the electrode chuck at both ends of the graphite strip to provide a heat source, the graphite in the cross section of the joint is heated and melted to connect, which can significantly reduce the connection temperature and shorten the connection time. The method of the present invention can achieve the connection of two ceramic sheets in seconds with low energy consumption. The present invention can be widely used in the fields of electronic packaging, cultural relic restoration and super-large-sized power porcelain. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a flow chart of the method of the present invention;

[0021] Figure 2 A cross-sectional AA structural schematic diagram of a ceramic broad-spectrum flash connection method proposed by the present invention;

[0022] Figure 3 A schematic structural diagram of a ceramic broad-spectrum flash connection method proposed by the present invention;

[0023] Figure 4 The COMSOL body potential diagram obtained in Example 1 of the present invention;

[0024] Figure 5 This is a schematic diagram of the fracture and displacement of the original ceramic sheet obtained in Example 1 of the present invention;

[0025] Figure 6 This is a schematic diagram of the fracture displacement of the connected ceramic sheets obtained in Example 1 of the present invention.

[0026] Figure numerals: 1 - first ceramic sheet; 2 - first graphite paper strip; 3 - second graphite paper strip; 4 - second ceramic sheet; 5 - cross section of joint. DETAILED DESCRIPTION

[0027] Refer to the attached Figure 1 The present invention provides a ceramic broad-spectrum flash connection method, comprising the following steps:

[0028] Step 1: Figure 2 As shown, the joint cross sections 5 of the first ceramic sheet 1 and the second ceramic sheet 4 are butt-jointed and fixed, and the joint cross sections 5 should be two identical joint planes or complementary surfaces of the ceramic sheets;

[0029] Step 2: If Figure 3 As shown, the first graphite paper strip 2 and the second graphite paper strip 3 are respectively close to the joint cross section 5, and the electrode clamps are respectively clamped at the two ends of the first graphite paper strip 2 and the second graphite paper strip 3; wherein the width of the first graphite paper strip 2 and the second graphite paper strip 3 is greater than the width of the joint cross section 5, the width of the first graphite paper strip 2 and the second graphite paper strip 3 is 3-10mm, and the thickness is 0.1-0.5mm; the electrode clamp is located 0.8-1.5cm away from the joint surface of the first ceramic sheet 1 and the second ceramic sheet 4;

[0030] Step 3: applying a heat source to rapidly heat the joint cross section 5 of the ceramic sheet, so that the graphite paper strip melts and connects the joint cross section 5;

[0031] Step 4: Cut off the power supply and wait for the ceramic piece to cool to room temperature before disassembling the device.

[0032] The present invention splices two broken ceramic sheets with complementary surfaces, places the joint parallel to two graphite paper strips, and then applies an electrode head to both ends of the graphite paper strips, about 1 cm away from the cross-section of the ceramic, to connect into a complete circuit; finally, a DC power supply or a pulsed DC power supply is applied to use the generated Joule heat to connect the joints of the broken ceramic sheets.

[0033] Example 1

[0034] Step 1: butt joints and fixes the joint cross sections 5 of the first ceramic sheet 1 and the second ceramic sheet 4, wherein the joint cross sections 5 are two identical joint planes of the ceramic sheets;

[0035] Step 2: Place the first graphite paper strip 2 and the second graphite paper strip 3 close to the joint cross section 5, and clamp the electrode chucks at both ends of the first graphite paper strip 2 and the second graphite paper strip 3; wherein the width of the first graphite paper strip 2 and the second graphite paper strip 3 is greater than the width of the joint cross section 5, the width of the first graphite paper strip 2 and the second graphite paper strip 3 is 3 mm, and the thickness is 0.5 mm; the electrode chuck is located 0.8 cm away from the joint surface of the first ceramic sheet 1 and the second ceramic sheet 4;

[0036] Step 3: Apply a constant voltage DC power supply, the applied heat source preset electric field strength is 1000V / cm, and the preset current density is 2000mA / mm 2 The joint cross section 5 of the ceramic sheet is rapidly heated, the graphite paper strip is melted and connected at the joint cross section 5;

[0037] Step 4: Cut off the power supply and wait for the ceramic piece to cool to room temperature before disassembling the device.

[0038] like Figure 4 As shown in the figure, it can be seen from the body potential diagram of COMSOL that ceramic connection using flash connection is achievable.

[0039] Figure 5 is a schematic diagram of the combined displacement of the middle part of a ceramic sample that was originally broken when the same pressure was applied. Figure 6 This is the combined displacement diagram of the middle part of the broken ceramic piece after flash connection under the same pressure conditions. It can be found that the combined displacement after flash connection is smaller than that of the original ceramic, indicating that after flash connection, the strength of the ceramic is improved, the time is short, and it is more convenient.

[0040] Example 2

[0041] Step 1: butt joints and fixes the joint cross sections 5 of the first ceramic sheet 1 and the second ceramic sheet 4, wherein the joint cross section 5 is a complementary surface of the ceramic sheets;

[0042] Step 2: Place the first graphite paper strip 2 and the second graphite paper strip 3 close to the joint cross section 5, and clamp the electrode chucks at both ends of the first graphite paper strip 2 and the second graphite paper strip 3; wherein the width of the first graphite paper strip 2 and the second graphite paper strip 3 is greater than the width of the joint cross section 5, the width of the first graphite paper strip 2 and the second graphite paper strip 3 is 6 mm, and the thickness is 0.3 mm; the electrode chuck is located 1 cm away from the joint surface of the first ceramic sheet 1 and the second ceramic sheet 4;

[0043] Step 3: Apply a DC pulse power supply, the applied heat source preset electric field strength is 10V / cm, and the preset current density is 5A / mm 2 The joint cross section 5 of the ceramic sheet is rapidly heated, the graphite paper strip is melted and connected at the joint cross section 5;

[0044] Step 4: Cut off the power supply and wait for the ceramic piece to cool to room temperature before disassembling the device.

[0045] Example 3

[0046] Step 1: butt and fix the joint cross sections 5 of the first ceramic sheet 1 and the second ceramic sheet 4. The joint cross sections 5 should be two identical joint planes of the ceramic sheets.

[0047] Step 2: Place the first graphite paper strip 2 and the second graphite paper strip 3 close to the joint cross section 5, and clamp the electrode chucks at both ends of the first graphite paper strip 2 and the second graphite paper strip 3; wherein the width of the first graphite paper strip 2 and the second graphite paper strip 3 is greater than the width of the joint cross section 5, the width of the first graphite paper strip 2 and the second graphite paper strip 3 is 10 mm, and the thickness is 0.1 mm; the electrode chuck is located 1.5 cm away from the joint surface of the first ceramic sheet 1 and the second ceramic sheet 4;

[0048] Step 3: Apply supercapacitor to generate Joule heat, with the preset electric field strength of 2000V / cm and the preset current density of 4000mA / mm 2 , so that the joint cross section 5 of the ceramic sheet is rapidly heated and melted, the graphite paper strip is melted and the joint cross section 5 is connected;

[0049] Step 4: Cut off the power supply and wait for the ceramic piece to cool to room temperature before disassembling the device.

[0050] Combination of the above Figure 1-6 However, it should be noted that these specific embodiments are only illustrative explanations of the present invention and do not constitute any limitation on the protection scope of the present invention.

Claims

1. A broad-spectrum flash connection method for ceramics, characterized in that: The specific steps include: Step 1: butting and fixing the joint cross sections (5) of the first ceramic sheet (1) and the second ceramic sheet (4); Step 2: placing the first graphite paper strip (2) and the second graphite paper strip (3) close to the joint cross section (5), and clamping the electrode clamps at both ends of the first graphite paper strip (2) and the second graphite paper strip (3); Step 3: applying a heat source to rapidly heat the cross section of the joint of the ceramic sheet (5), so that the graphite paper strip melts and connects the cross section of the joint (5); Step 4: Cut off the power supply and remove the electrode chuck after the ceramic sheet cools to room temperature.

2. A ceramic broad-spectrum flash connection method according to claim 1, characterized in that: The joint cross section (5) in step 1 should be two identical joint planes or complementary planes of the ceramic sheet.

3. A ceramic broad-spectrum flash connection method according to claim 1, characterized in that: In step 2, the width of the first graphite paper strip (2) and the second graphite paper strip (3) is greater than the width of the joint cross section (5).

4. A ceramic broad-spectrum flash connection method according to claim 3, characterized in that: In step 2, the width of the first graphite paper strip (2) and the second graphite paper strip (3) is 3-10 mm, and the thickness is 0.1-0.5 mm.

5. A ceramic broad-spectrum flash connection method according to claim 1, characterized in that: In step 3, the electrode chuck is located 0.8-1.5 cm away from the joint surface of the first ceramic sheet (1) and the second ceramic sheet (4).

6. A ceramic broad-spectrum flash connection method according to claim 1, characterized in that: The heat source applied in step 3 is a constant voltage DC power supply, a DC pulse power supply or Joule heat generated by a supercapacitor.

7. A ceramic broad-spectrum flash connection method according to claim 6, characterized in that: The heat source applied in step 3 has a preset electric field strength of 10-2000 V / cm and a preset current density of 5-4000 mA / mm 2 .

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