Semiconductor wafer electroplating clamp

Abstract

The invention discloses a semiconductor wafer electroplating clamp which comprises a processing carrying part and a positioning mechanism, driving translation mechanisms assembled through bolts are arranged above the two ends of the processing carrying part, a lifting assembly is arranged at the inner end of each driving translation mechanism, and a rotation adjusting assembly is arranged on the inner bottom side of each lifting assembly. And a folding mechanism is arranged at the output end of the rotary adjusting assembly. According to the device disclosed by the invention, a positioning mechanism performs folding operation mainly by utilizing output operation of a folding mechanism, a folding sheet is adjusted to a proper position through output operation of an oil cylinder strip, and a rack and an end block are adjusted to a proper end position through meshing transmission operation of a built-in motor and a built-in gear; through the top inner pasting wheel and the edge inner pasting wheel which are perpendicular to each other, effective rolling pasting can be conducted on the wafer, so that the adaptive effect can be effectively achieved in the wafer machining process, and the wafer inner pasting wheel can be more flexibly adaptive to wafer machining.

Description

Technical Field

[0001] The invention relates to the technical field of oil drilling drill pipes, in particular to a semiconductor wafer electroplating fixture. Background Art

[0002] Semiconductor wafer is a silicon chip used in integrated circuit boards. When processing semiconductor wafers, it is generally necessary to etch the wiring structure. During the processing of semiconductor wafers, it is necessary to transfer the semiconductor wafers. During the transfer, the semiconductor wafers are clamped by the electroplating fixture for transfer. Semiconductor materials (semiconductor Semiconductor material is a kind of electronic material with semiconductor properties (conductivity between conductors and insulators, resistivity is about 1mΩ·cm~1GΩ·cm), which can be used to make semiconductor devices and integrated circuits. Semiconductor materials can be divided according to chemical composition, and amorphous and liquid semiconductors with special structure and performance are listed as a separate category. According to this classification method, semiconductor materials can be divided into elemental semiconductors, inorganic compound semiconductors, organic compound semiconductors, and amorphous and liquid semiconductors. Semiconductor (semiconductor) refers to materials with conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in the application of various semiconductor materials.

[0003] When the existing semiconductor wafer electroplating fixture is in use, such as the application number CN201910435555.1 discloses a semiconductor wafer electroplating fixture, whose structure includes a base, a baffle, and a fixture. The base is provided with an adjusting rod and an adjusting plate. The adjusting rod is connected to the bottom of the adjusting plate by a thread, and the adjusting plate is connected to the baffle by a thread; the baffle is provided with a semiconductor wafer, and the semiconductor wafer is evenly distributed on the surface of the baffle; the fixture is provided with a support rod, a rotating rod, and a chuck, the support rod is vertically welded to the base, the rotating rod is connected to the support rod by a bolt, and the chuck is welded to the rotating rod. The beneficial effects of the present invention are as follows: The result is: the pressure plate can be squeezed to press the air inside the airbag for conduction, the convex point can be pushed up to push the clamp ring, and the clamp ring can be pushed to clamp, so that the semiconductor wafer can be embedded in the rubber pad, and the rubber pad can be used to press and protect the film on the outer edge of the semiconductor wafer to prevent the film from peeling off during the transmission process, thereby reducing the protection effect on the semiconductor wafer; however, in the above technology, the size of the baffle is relatively fixed, and the positioning adaptability of the wafer is poor, which is not convenient for wafer processing with multiple sizes. Therefore, we propose a semiconductor wafer electroplating fixture to solve the above problems. Summary of the invention

[0004] In view of the above problems, the present invention proposes a semiconductor wafer electroplating fixture, which mainly utilizes the output operation of the matching mechanism to enable the positioning mechanism to perform the matching operation, and the matching piece is adjusted to a suitable position through the output operation of the cylinder bar, and the rack and the end block are adjusted to a suitable end position through the meshing transmission operation of the built-in motor and the built-in gear, and the wafer can be effectively rolled and fitted through the mutually perpendicular top inner bonding wheel and the side inner bonding wheel, so that the effect of adaptive adaptation can be effectively achieved during the wafer processing, so that it can be more flexibly adapted to the wafer processing.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A semiconductor wafer electroplating fixture includes a processing mounting component and a positioning mechanism, wherein a driving translation mechanism assembled with bolts is arranged above both ends of the processing mounting component, and a lifting component is arranged at the inner end of the driving translation mechanism, and a rotation adjustment component is arranged on the inner bottom side of the lifting component, and a matching mechanism is arranged at the output end of the rotation adjustment component, and a positioning mechanism is arranged at the lower inner end of the matching mechanism.

[0007] As a further technical solution, the processing mounting component includes a mounting plate, a processing trough pool, a middle chassis, a middle base block, a bottom screw rod, an extension base block and a side guard plate. A processing trough pool is arranged at one end of the mounting plate, a middle chassis is arranged on the inner side of the mounting plate, and a middle base block is arranged on the top of the middle chassis. A bottom screw rod is arranged at the output end of the middle chassis, and the output end of the bottom screw rod is threadedly connected to the extension base block, and a side guard plate is arranged on the upper side of the extension base block.

[0008] As a further technical solution, the driving translation mechanism includes an end lifting frame, a top base, a long chassis, a translation motor, a meshing gear group, a transmission wheel group, a top screw group and a translation base. The end lifting frame is bolted above the two ends of the processing mounting component, and a top base is provided at the top of the end lifting frame, and a long chassis is provided at one end of the top base, a translation motor is provided on the outer side of the long chassis, and a meshing gear group is provided at the output end of the translation motor, a transmission wheel group is provided at the output end of the meshing gear group, and a top screw group is provided at the output end of the transmission wheel group, and the output end of the top screw group is provided with a translation base threadedly connected.

[0009] As a further technical solution, the lifting assembly includes a crossbeam frame, a top box, a top motor, a first gear group, a second gear group, a drum, a connecting plate base frame, a positioning bar, a steel cable and a binding node seat. The crossbeam frame is arranged on the inner end side of the translation base, and a top box assembled with bolts is arranged on the inner top side of the crossbeam frame, and a top motor is arranged on the outer end of the top box, a first gear group is arranged at the output end of the top motor, and a second gear group is arranged at the output end of the first gear group.

[0010] As a further technical solution, a drum is provided at the output end of the second gear group, and a connecting plate base frame is provided at the outer end of the drum, a positioning strip is provided on the inner side of the outer end of the connecting plate base frame, a steel cable is wound around the drum, and a binding node seat is provided on the outer side of the steel cable.

[0011] As a further technical solution, the rotation adjustment assembly includes a gear plate, a connecting frame, a shaft sleeve plate, an electric rotating seat, a main gear, a driven gear, a brake cylinder, a brake gear, a bearing base and a rotating shaft. The gear plate is arranged at the bottom end of the binding joint seat, a connecting frame is arranged below both ends of the gear plate, and a shaft sleeve plate assembled with bolts is arranged at the bottom end of the connecting frame, an electric rotating seat is arranged on the inner side of one end of the gear plate, and a main gear is arranged at the output end of the electric rotating seat.

[0012] As a further technical solution, a driven gear meshingly connected is provided on one side of the main gear, and a brake gear is provided on the outer side of the driven gear, an output end connected to a brake cylinder is provided on the lower side of the brake gear, a bearing base is provided on the output end of the driven gear, and a rotating shaft is provided on the output end of the bearing base.

[0013] As a further technical solution, the matching mechanism includes a double-open box, a double-open motor, a double-open screw rod, a movable hinged seat, a connecting strip, a hinged rod, a hinged end seat, an assembly end strip, a swinging strip and a fixed connecting rod. The double-open box is arranged at the bottom end of the rotating shaft, and double-open motors are arranged at both ends of the double-open box, and a double-open screw rod is arranged at the output end of the double-open motor, the double-open screw rod is threadedly connected with a movable hinged seat, and a hinged connecting strip is arranged at the bottom end of the movable hinged seat, a hinged rod is arranged at the bottom end of the connecting strip, and an hinged end seat is arranged at the upper inner end of the hinged rod, an assembly end strip assembled with bolts is arranged at the bottom end of the hinged rod, and a swinging strip is arranged on the inner end side of the assembly end strip, and fixed connecting rods are hinged at both ends of the swinging strip.

[0014] As a further technical solution, the positioning mechanism includes a cylinder bar, a mating piece, an electric rotating rod, a tube shell, a built-in motor, a built-in gear, a rack, an end block, a bite piece, a top inner wheel, a duct compartment and an edge inner wheel. The cylinder bar is arranged on the inner side of both ends of the swing bar, a mating piece is arranged at the output end of the cylinder bar, and an electric rotating rod is arranged on the inner side of the mating piece, a tube shell is arranged on the side side of the electric rotating rod, and a built-in motor is arranged on the inner side of one end of the tube shell, and a built-in gear is arranged at the output end of the built-in motor, and the built-in gear is meshed and connected with a rack.

[0015] As a further technical solution, an end block is provided on the outer end side of the rack, and a bite plate is provided on the outer end of the end block, a top inner wheel is provided on the inner side of the outer end of the bite plate, a duct chamber is provided on the inner side of the end block, and an edge inner wheel is provided on the output end of the duct chamber.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The device of the invention mainly utilizes the output operation of the matching mechanism to enable the positioning mechanism to perform the matching operation, and adjusts the matching piece to a suitable position through the output operation of the cylinder bar. The built-in motor and the built-in gear are meshed and driven to adjust the rack and the end block to a suitable end position. The top inner contact wheel and the side inner contact wheel that are perpendicular to each other can effectively roll and fit the wafer, so that the effect of adaptive adaptation can be effectively achieved during the wafer processing, so that it can be more flexibly adapted to the wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a semiconductor wafer electroplating fixture;

[0019] Figure 2 It is a schematic diagram of the structure of the present invention from a side view;

[0020] Figure 3 It is a structural schematic diagram of the driving translation mechanism in the present invention;

[0021] Figure 4 It is a structural schematic diagram of the lifting assembly in the present invention;

[0022] Figure 5 It is a schematic diagram of the structure of the steel cable and the binding joint seat in the present invention;

[0023] Figure 6 It is a structural schematic diagram of the rotation adjustment component in the present invention;

[0024] Figure 7 It is a structural schematic diagram of the coupling mechanism in the present invention;

[0025] Figure 8It is a structural schematic diagram of the positioning mechanism in the present invention;

[0026] Fig. 9 It is a schematic diagram of the structure of the built-in gear and rack in the present invention;

[0027] Fig.10 It is a schematic diagram of the structure of the duct cabin and the inner side wheel in the present invention.

[0028] In the figure: 1. Processing mounting components; 101. Mounting plate; 102. Processing tank; 103. Middle chassis; 104. Middle base block; 105. Bottom screw rod; 106. Extension base block; 107. Side guard plate; 2. Driving translation mechanism; 201. End lifting frame; 202. Top base; 203. Long chassis; 204. Translation motor; 205. Meshing gear set; 206. Transmission wheel set; 2 07, top screw rod group; 208, translation base; 3, lifting assembly; 301, crossbeam frame; 302, top box; 303, top motor; 304, first gear group; 305, second gear group; 306, reel; 307, connecting plate base frame; 308, positioning strip; 309, steel cable; 3010, binding joint seat; 4, rotation adjustment assembly; 401, gear plate; 402, connecting frame; 40 3. Shaft sleeve plate; 404. Electric rotating seat; 405. Main gear; 406. Driven gear; 407. Brake cylinder; 408. Brake gear; 409. Bearing base; 4010. Rotating shaft; 5. Matching mechanism; 501. Double-opening box; 502. Double-opening motor; 503. Double-opening screw rod; 504. Mobile articulated seat; 505. Connecting bar; 506. Articulated rod; 507. Articulated end seat; 508, assembly end bar; 509, swing bar; 5010, fixed connecting rod; 6, positioning mechanism; 601, cylinder bar; 602, mating piece; 603, electric rotating rod; 604, tube shell; 605, built-in motor; 606, built-in gear; 607, rack; 608, end block; 609, bite piece; 6010, top inner wheel; 6011, duct cabin; 6012, side inner wheel. DETAILED DESCRIPTION

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figure 1-10 In an embodiment of the present invention, a semiconductor wafer electroplating fixture includes a processing mounting component 1 and a positioning mechanism 6. A driving translation mechanism 2 assembled with bolts is arranged above both ends of the processing mounting component 1, and a lifting component 3 is arranged at the inner end of the driving translation mechanism 2. A rotation adjustment component 4 is arranged on the inner bottom side of the lifting component 3, and a matching mechanism 5 is arranged at the output end of the rotation adjustment component 4. A positioning mechanism 6 is arranged at the lower inner end of the matching mechanism 5.

[0033] The processing mounting component 1 includes a mounting plate 101, a processing trough pool 102, a middle chassis 103, a middle base block 104, a bottom screw rod 105, an extension base block 106 and a side guard plate 107. A processing trough pool 102 is arranged at one end of the mounting plate 101, the middle chassis 103 is arranged on the inner side of the mounting plate 101, and the middle base block 104 is arranged on the top of the middle chassis 103. A bottom screw rod 105 is arranged at the output end of the middle chassis 103, and the output end of the bottom screw rod 105 is threadedly connected to the extension base block 106, and a side guard plate 107 is arranged on the upper side of the extension base block 106.

[0034] In an embodiment of the present invention, when multiple groups need to be placed, the middle chassis 103 is used to output and run, and the bottom screw 105 drives the expansion base block 106 to adjust to a suitable expansion position, and finally the processed wafers are temporarily placed through the expansion base block 106, the side guard plate 107 and the middle base block 104.

[0035] The driving translation mechanism 2 includes an end lifting frame 201, a top base 202, a long chassis 203, a translation motor 204, a meshing gear set 205, a transmission wheel set 206, a top screw set 207 and a translation base 208. The end lifting frame 201 is bolted above the two ends of the processing mounting component 1. The top base 202 is arranged at the top of the end lifting frame 201, and the long chassis 203 is arranged at one end of the top base 202. The translation motor 204 is arranged on the outer side of the long chassis 203, and the output end of the translation motor 204 is provided with a meshing gear set 205, the output end of the meshing gear set 205 is provided with a transmission wheel set 206, and the output end of the transmission wheel set 206 is provided with a top screw set 207, and the output end of the top screw set 207 is provided with a translation base 208 threadedly connected.

[0036] In an embodiment of the present invention, when the wafer is clamped, the output power of the translation motor 204 on the outer side of the long chassis 203 is used to operate with the output end, so that the output power of the translation motor 204 drives the meshing gear group 205 in the long chassis 203 to operate. After the long chassis 203 operates, the output operation of the transmission wheel group 206 drives the output operation of the top screw rod group 207 to drive the translation base 208 to move to a suitable target angle.

[0037] The lifting assembly 3 includes a crossbeam frame 301, a top box 302, a top motor 303, a first gear set 304, a second gear set 305, a drum 306, a connecting plate base frame 307, a positioning bar 308, a steel cable 309 and a binding joint seat 3010. The crossbeam frame 301 is arranged on the inner end side of the translation base 208, and a top box 302 assembled with bolts is arranged on the inner top side of the crossbeam frame 301, and a top motor 303 is arranged on the outer end of the top box 302, and a first gear set 304 is arranged at the output end of the top motor 303, and a second gear set 305 is arranged at the output end of the first gear set 304.

[0038] In an embodiment of the present invention, when electroplating is required, the top motor 303 is used to output power to drive the output end to operate, so that after the top motor 303 outputs power to operate, the first gear set 304 in the top box 302 performs output operation, and then the second gear set 305 is used to achieve the effect of transmitting the output power.

[0039] A drum 306 is provided at the output end of the second gear set 305, and a connecting plate base frame 307 is provided at the outer end of the drum 306, a positioning strip 308 is provided on the inner side of the outer end of the connecting plate base frame 307, a steel cable 309 is wound around the drum 306, and a binding node seat 3010 is provided on the outer side of the steel cable 309.

[0040] In an embodiment of the present invention, when the second gear set 305 transmits output power, it can enable the drum 306 to output and run to drive the steel cable 309 wound around the drum 306 to bind the node seat 3010 so that the rotating adjustment component 4 runs into the processing tank pool 102 to achieve a falling effect.

[0041] The rotation adjustment component 4 includes a gear plate 401, a connecting frame 402, a shaft sleeve plate 403, an electric rotating seat 404, a main gear 405, a driven gear 406, a brake cylinder 407, a brake gear 408, a bearing base 409 and a rotating shaft 4010. The gear plate 401 is arranged at the bottom end of the binding joint seat 3010, and a connecting frame 402 is arranged below both ends of the gear plate 401, and a shaft sleeve plate 403 assembled with bolts is arranged at the bottom end of the connecting frame 402, an electric rotating seat 404 is arranged on the inner side of one end of the gear plate 401, and a main gear 405 is arranged at the output end of the electric rotating seat 404.

[0042] In the embodiment of the present invention, since the gear plate 401, the connecting frame 402, and the shaft sleeve plate 403 are assembled by bolts, a certain height can be ensured, thereby avoiding corrosion by the electroplating solution.

[0043] A driven gear 406 is meshingly connected to one side of the main gear 405, and a brake gear 408 is provided on the outer side of the driven gear 406. An output end connected to the brake cylinder 407 is provided on the lower side of the brake gear 408. A bearing base 409 is provided at the output end of the driven gear 406, and a rotating shaft 4010 is provided at the output end of the bearing base 409.

[0044] In an embodiment of the present invention, when rotational operation is required, the brake cylinder 407 is used to output power to drive the brake gear 408 to disengage from the driven gear 406, and the electric rotating seat 404 outputs power to drive the main gear 405 to drive the driven gear 406 to rotate, thereby driving the bearing base 409 and the rotating shaft 4010 to rotate to achieve efficient electroplating processing.

[0045] The matching mechanism 5 includes a double-opening box 501, a double-opening motor 502, a double-opening screw rod 503, a movable hinge seat 504, a connecting bar 505, a hinge rod 506, a hinge end seat 507, an assembly end bar 508, a swing bar 509 and a fixed connecting rod 5010. The double-opening box 501 is arranged at the bottom end of the rotating shaft 4010, and the double-opening motor 502 is arranged at both ends of the double-opening box 501. The output end of the double-opening motor 502 is provided with a double-opening screw rod 503, and the double-opening screw rod 503 is arranged at the output end of the double-opening motor 502. A movable hinge seat 504 is threadedly connected, and a hinged connecting bar 505 is provided at the bottom end of the movable hinge seat 504, a hinged rod 506 is provided at the bottom end of the connecting bar 505, and a hinged end seat 507 is provided at the upper inner end of the hinged rod 506, an assembly end strip 508 assembled with bolts is provided at the bottom end of the hinged rod 506, and a swinging bar 509 is provided on the inner end side of the assembly end strip 508, and hinged fixed connecting rods 5010 are provided at both ends of the swinging bar 509.

[0046] In the embodiment of the present invention, when in use, the double-opening motor 502 on the double-opening box 501 outputs power to drive the output end to operate, so that after the double-opening motor 502 outputs power, it drives the double-opening screw rod 503 on the double-opening box 501 to output and operate, and after the double-opening screw rod 503 outputs and operates, the movable hinge seat 504 slides, so that the connecting bar 505, the hinged rod 506, and the hinged end seat 507 run in opposite directions, so that the swing bar 509 and the fixed connecting rod 5010 can achieve balanced opposite operation under the action of the positioning mechanism 6 to run in opposite directions.

[0047] The positioning mechanism 6 includes a cylinder bar 601, a mating piece 602, an electric rotating rod 603, a tube shell 604, a built-in motor 605, a built-in gear 606, a rack 607, an end block 608, a bite piece 609, a top inner wheel 6010, a duct compartment 6011 and an edge inner wheel 6012. The cylinder bar 601 is arranged on the inner sides of both ends of the swing bar 509, the output end of the cylinder bar 601 is provided with a mating piece 602, and the inner side of the mating piece 602 is provided with an electric rotating rod 603, the side of the electric rotating rod 603 is provided with a tube shell 604, and the inner side of one end of the tube shell 604 is provided with a built-in motor 605, the output end of the built-in motor 605 is provided with a built-in gear 606, and the built-in gear 606 is meshed and connected with a rack 607.

[0048] In an embodiment of the present invention, when the positioning mechanism 6 performs opposite operation, the cylinder bar 601 is used to output power to drive the output end to make the matching piece 602 perform opposite operation and make the electric rotating rod 603 output and operate to allow the tube shell 604 to run to a suitable angle position, so that the built-in motor 605 can output and operate during the operation of the tube shell 604 so that the built-in gear 606 is meshed and transmitted to the rack 607 to allow the end block 608 to run to a suitable expansion position.

[0049] An end block 608 is arranged on the outer end side of the rack 607, and a bite piece 609 is arranged on the outer end of the end block 608, a top inner wheel 6010 is arranged on the inner side of the outer end of the bite piece 609, a duct chamber 6011 is arranged on the inner side of the end block 608, and an edge inner wheel 6012 is arranged on the output end of the duct chamber 6011.

[0050] In an embodiment of the present invention, the built-in gear 606 is then used to mesh with the rack 607 to allow the end block 608 to move to a position suitable for the wafer, so that the top inner bonding wheel 6010 cooperates with the upper inner bonding wheel 6012 to roll and bond the wafer, so that the wafer can be clamped after the output of the matching mechanism 5 is operated.

[0051] The working principle of the present invention is: when in use, the double-opening motor 502 on the double-opening box 501 outputs power to drive the output end to operate, so that the double-opening motor 502 outputs power and drives the double-opening screw rod 503 on the double-opening box 501 to output and operate, and after the double-opening screw rod 503 outputs and operates, the movable hinge seat 504 slides and operates, so that the connecting bar 505, the hinged rod 506, and the hinged end seat 507 operate in opposite directions, so that the swing bar 509 and the fixed connecting rod 5010 operate in opposite directions to achieve balance, so that the positioning mechanism 6 operates in opposite directions, and when the positioning mechanism 6 operates in opposite directions, the oil cylinder bar 601 is used to output power to drive the output end to make the matching piece 602 operate in opposite directions and make the electric rotating rod 603 output and operate. After the operation, the tube shell 604 is allowed to run to a suitable angle position, so that the built-in motor 605 outputs and runs during the operation of the tube shell 604, so that the built-in gear 606 is meshed and transmitted to the rack 607 to allow the end block 608 to run to a suitable extended position, and then the built-in gear 606 is used to mesh and transmit to the rack 607 to allow the end block 608 to run to a position suitable for the wafer, so that the top inner sticking wheel 6010 cooperates with the upper inner sticking wheel 6012 to roll and stick the wafer, so that the output of the matching mechanism 5 can clamp the wafer, and when the wafer is clamped, the output power of the translation motor 204 on the outer side of the long chassis 203 is operated with the output end, so that the output power of the translation motor 204 drives the meshing gear set 205 in the long chassis 203 to Output operation, when the long chassis 203 performs output operation, the output operation of the transmission wheel group 206 drives the top screw group 207 to drive the translation base 208 to move to a suitable target angle. When electroplating is required, the top motor 303 is used to output power to drive the output end to operate, so that after the top motor 303 outputs power and runs, the first gear group 304 in the top chassis 302 performs output operation and drives the second gear group 305 to achieve the effect of transmitting output power. When the second gear group 305 transmits output power, the drum 306 can drive the steel cable 309 wound around the drum 306 to bind the node seat 3010 so that the rotation adjustment component 4 runs into the processing tank pool 102 to achieve the falling. The effect is achieved, because the gear plate 401, the connecting frame 402, and the shaft sleeve plate 403 are assembled by bolts, so a certain height can be guaranteed to avoid corrosion by the electroplating solution. When rotation operation is required, the brake cylinder 407 is used to output power to drive the brake gear 408 to disengage from the driven gear 406, and the electric rotating seat 404 outputs power to drive the main gear 405 to drive the driven gear 406 to rotate, thereby driving the bearing base 409 and the rotating shaft 4010 to rotate to achieve efficient electroplating processing. When the wafer is clamped, the translation motor 204 on the outer side of the long chassis 203 outputs power to the output end to operate, so that the translation motor 204 outputs power to drive the meshing gear set 205 in the long chassis 203 to output operation.When the long chassis 203 is running, the transmission wheel group 206 is running, which drives the top screw group 207 to drive the translation base 208 to move to a suitable target angle. When multiple groups are needed, the middle chassis 103 is used to run, and the bottom screw 105 drives the expansion base 106 to adjust to a suitable expansion position. Finally, the processed wafers are temporarily placed through the expansion base 106, the side guard 107 and the middle base 104.

[0052] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0053] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor wafer electroplating fixture, comprising a processing mounting component (1) and a positioning mechanism (6), characterized in that: A driving translation mechanism (2) assembled with bolts is arranged above both ends of the processing mounting component (1), and a lifting component (3) is arranged at the inner end of the driving translation mechanism (2), a rotation adjustment component (4) is arranged on the inner bottom side of the lifting component (3), a matching mechanism (5) is arranged at the output end of the rotation adjustment component (4), and a positioning mechanism (6) is arranged at the lower inner end of the matching mechanism (5).

2. A semiconductor wafer electroplating fixture according to claim 1, characterized in that: The processing mounting component (1) comprises a mounting plate (101), a processing tank pool (102), a middle chassis (103), a middle base block (104), a bottom screw rod (105), an extension base block (106) and a side guard plate (107); one end of the mounting plate (101) is provided with a processing tank pool (102); the inner side of the mounting plate (101) is provided with a middle chassis (103); the top of the middle chassis (103) is provided with a middle base block (104); the output end of the middle chassis (103) is provided with a bottom screw rod (105); the output end of the bottom screw rod (105) is threadedly connected to the extension base block (106); and the upper side of the extension base block (106) is provided with a side guard plate (107).

3. A semiconductor wafer electroplating fixture according to claim 2, characterized in that: The driving translation mechanism (2) comprises an end lifting frame (201), an overhead base (202), a long chassis (203), a translation motor (204), a meshing gear set (205), a transmission wheel set (206), a top screw set (207) and a translation base (208); the end lifting frame (201) is bolted to the top of both ends of the processing mounting component (1); the top of the end lifting frame (201) is provided with an overhead base (202), and the overhead base (202) A long case (203) is provided at one end of the transmission mechanism, a translation motor (204) is provided on the outer side of the long case (203), and an engaging gear set (205) is provided at the output end of the translation motor (204), a transmission wheel set (206) is provided at the output end of the engaging gear set (205), and a top screw rod set (207) is provided at the output end of the transmission wheel set (206), and a translation base (208) is provided at the output end of the top screw rod set (207), and a translation base (208) is threadedly connected to the translation base (208).

4. A semiconductor wafer electroplating fixture according to claim 3, characterized in that: The lifting assembly (3) comprises a crossbeam frame (301), a top case (302), a top motor (303), a first gear set (304), a second gear set (305), a drum (306), a connecting plate base frame (307), a positioning strip (308), a steel cable (309) and a binding joint seat (3010); the crossbeam frame (301) is arranged on the inner end side of the translation base (208); a top case (302) assembled with bolts is arranged on the inner top side of the crossbeam frame (301); a top motor (303) is arranged on the outer end of the top case (302); a first gear set (304) is arranged at the output end of the top motor (303); and a second gear set (305) is arranged at the output end of the first gear set (304).

5. The semiconductor wafer electroplating fixture according to claim 4, characterized in that: A drum (306) is provided at the output end of the second gear group (305), and a connecting plate base frame (307) is provided at the outer end of the drum (306), a positioning strip (308) is provided on the inner side of the outer end of the connecting plate base frame (307), a steel cable (309) is wound around the drum (306), and a binding node seat (3010) is provided on the outer side of the steel cable (309).

6. The semiconductor wafer electroplating fixture according to claim 4, characterized in that: The rotation adjustment component (4) comprises a gear plate (401), a connecting frame (402), a shaft sleeve plate (403), an electric rotating seat (404), a main gear (405), a driven gear (406), a brake cylinder (407), a brake gear (408), a bearing base (409) and a rotating shaft (4010), wherein the gear plate (401) is arranged at the bottom end of the binding joint seat (3010), connecting frames (402) are arranged below both ends of the gear plate (401), and a shaft sleeve plate (403) assembled with bolts is arranged at the bottom end of the connecting frame (402), an electric rotating seat (404) is arranged on the inner side of one end of the gear plate (401), and a main gear (405) is arranged at the output end of the electric rotating seat (404).

7. The semiconductor wafer electroplating fixture according to claim 6, characterized in that: A driven gear (406) is meshingly connected to one side of the main gear (405), and a brake gear (408) is provided on the outer side of the driven gear (406). An output end connected to a brake cylinder (407) is provided on the lower side of the brake gear (408), a bearing base (409) is provided at the output end of the driven gear (406), and a rotating shaft (4010) is provided at the output end of the bearing base (409).

8. The semiconductor wafer electroplating fixture according to claim 6, characterized in that: The mating mechanism (5) comprises a double-opening box (501), a double-opening motor (502), a double-opening screw rod (503), a movable hinge seat (504), a connecting bar (505), a hinged rod (506), a hinged end seat (507), an assembly end bar (508), a swing bar (509) and a fixed connecting rod (5010), wherein the double-opening box (501) is arranged at the bottom end of the rotating shaft (4010), the double-opening motor (502) is arranged at both ends of the double-opening box (501), and the output end of the double-opening motor (502) is provided with a double-opening screw rod (503), and the double-opening screw rod (503) is threadedly connected to a movable hinge seat (504), and a hinged connecting bar (505) is provided at the bottom end of the movable hinge seat (504), a hinged rod (506) is provided at the bottom end of the connecting bar (505), and a hinged end seat (507) is provided at the upper inner end of the hinged rod (506), an assembly end bar (508) assembled with bolts is provided at the bottom end of the hinged rod (506), and a swing bar (509) is provided on the inner end side of the assembly end bar (508), and fixed connecting rods (5010) connected by hinges are provided at both ends of the swing bar (509).

9. The semiconductor wafer electroplating fixture according to claim 8, characterized in that: The positioning mechanism (6) comprises an oil cylinder bar (601), a mating piece (602), an electric rotating rod (603), a tube shell (604), a built-in motor (605), a built-in gear (606), a rack (607), an end block (608), a mating piece (609), a top inner wheel (6010), a duct cabin (6011) and an edge inner wheel (6012). The oil cylinder bar (601) is arranged on the inner sides of both ends of the swing bar (509). The output end of the cylinder bar (601) is provided with a mating piece (602), and the inner side of the mating piece (602) is provided with an electric rotating rod (603), the side of the electric rotating rod (603) is provided with a tube shell (604), and the inner side of one end of the tube shell (604) is provided with a built-in motor (605), and the output end of the built-in motor (605) is provided with a built-in gear (606), and the built-in gear (606) is meshedly connected with a rack (607).

10. The semiconductor wafer electroplating fixture according to claim 8, characterized in that: An end block (608) is arranged on the outer end side of the rack (607), and a bite plate (609) is arranged on the outer end of the end block (608), a top inner contact wheel (6010) is arranged on the inner side of the outer end of the bite plate (609), a duct chamber (6011) is arranged on the inner side of the end block (608), and an edge inner contact wheel (6012) is arranged at the output end of the duct chamber (6011).

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