Semiconductor processing system and its processing method

Abstract

The present application provides a semiconductor processing system and a processing method thereof. The semiconductor processing system includes a transfer device, a pre-processing chamber, at least two process chambers, a main control device, and a handling device. At least two process chambers accommodate pedestals of different sizes. The handling device includes a buffer device for carrying the pedestals, and the buffer device includes a load area with adjustable size. The processing method of the semiconductor processing system includes that after the main control device determines the process chamber to which the pedestal needs to be transferred according to the information of the transfer device or the information of at least one process chamber obtained and received, it controls the buffer device to adjust the size of the load area according to the pedestal size information that the process chamber to which the pedestal needs to be transferred can accommodate, then places the corresponding pedestal on the load area, and the main control device controls the handling device to drive the pedestal into the pre-processing chamber, integrating the transfer process of pedestals of different sizes into one production line, so as to improve the integration degree of the production line.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and more particularly, to a semiconductor processing system and a processing method thereof. Background Art

[0002] As an important component for carrying wafers, the susceptor plays a key role in the semiconductor manufacturing process. To improve the integration density and reduce the occupied space, the prior art usually sets a carrying device adapted to a susceptor of a specific size to carry the susceptor. The carrying device carries the susceptor, and after the susceptor is cleaned and purged, the susceptor is transferred to a pre-processing chamber to load the wafers to be processed, and then transferred to the corresponding process chamber to complete semiconductor processes such as chemical vapor deposition processes.

[0003] For a semiconductor processing system having multiple reaction chambers, according to the process requirements, some reaction chambers are set to have different susceptor sizes from those that can be accommodated in other reaction chambers. For susceptors of different sizes, the sizes of the wafers they carry are different, or they carry the same size but different numbers of wafers, which is beneficial to realizing the parallel processing of multi-size wafers and improving the production capacity. For such a semiconductor processing system, if corresponding carrying devices are separately set for each size of susceptor, it will involve the integrated design of multiple carrying devices in the system, inevitably increasing the space occupation and easily affecting other associated devices in the system. For example, it is necessary to redesign other associated devices to adapt to multiple carrying devices, increasing the cost. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a semiconductor processing system and a processing method thereof, which can be applied to a semiconductor processing system with multiple process chambers having requirements for accommodating susceptors of different sizes, and is beneficial to improving the integration degree of the production line.

[0005] The semiconductor processing system provided by the present application includes: a transfer device, a pre-processing chamber, at least two process chambers, a main control device, and a carrying device. A buffer device for supporting the susceptor is provided on the carrying device. The buffer device includes an adjustable-size carrying area, and at least some of the process chambers are used to accommodate susceptors of different sizes; the main control device is communicatively connected to each process chamber, the carrying device, and the buffer device.

[0006] The semiconductor processing system processing method provided by the present application includes:

[0007] S0. Provide the aforementioned semiconductor processing system;

[0008] S1. The main control device obtains and determines the process chamber where the susceptor needs to be transferred according to the information of the transfer device or the information of at least one process chamber received;

[0009] S2. The master control device obtains the base size information that the process chamber to which the base is to be transferred can accommodate the base, and controls the buffer device of the handling device to adjust the size of the bearing area;

[0010] S3. Place the corresponding base adapted to the size of the bearing area on the bearing area;

[0011] S4. The master control device controls the handling device to transport the base to the pre-treatment chamber;

[0012] S5. The master control device controls the transfer device to transfer the base to the corresponding process chamber.

[0013] Optionally, in step S1, when the master control device obtains and judges based on the information of the transfer device received or the information of at least one process chamber that the number of process chambers to which the base needs to be transferred is at least 2; steps S2 to S4 are repeatedly executed to enable at least two bases to enter the pre-treatment chamber in sequence, and then step S5 is executed.

[0014] Optionally, a vision device communicatively connected to the master control device is provided in the pre-treatment chamber.

[0015] Optionally, in step S1, the master control device obtains and judges the transfer base order of each process chamber to which the base needs to be transferred based on the information of the transfer device received or the information of at least one process chamber; in step S5, the step of controlling the transfer device to transfer the base to the corresponding process chamber by the master control device includes that the master control device controls the transfer device to sequentially transfer each base to the corresponding process chamber in the transfer base order according to the size and position information of each base in the pre-treatment chamber sent by the vision device and the transfer base order.

[0016] Optionally, the buffer device includes a plurality of linear displacement mechanisms distributed radially, each linear displacement mechanism is slidably provided with a support seat, and the buffer device further includes a driving mechanism communicatively connected to the master control device and connected to each support seat.

[0017] Optionally, the step of the master control device obtaining the base size information that the process chamber to which the base is to be transferred can accommodate the base and controlling the buffer device of the handling device to adjust the size of the bearing area includes:

[0018] The master control device obtains the base size information and issues a bearing area size adjustment instruction to the driving mechanism, and the driving mechanism drives at least one support seat to slide along the extending direction of the corresponding linear displacement mechanism in response to the bearing area size adjustment instruction until the tops of the support seats enclose a bearing area for bearing the base.

[0019] Optionally, the buffer device includes a position measuring device communicatively connected to the master control device.

[0020] Optionally, in step S2, the steps for the main control device to obtain and send a load area size adjustment instruction to the drive mechanism according to the base size information include:

[0021] The position measuring device obtains and sends the position information of each support base to the main control device;

[0022] The main control device sends a load area size adjustment instruction to the drive mechanism according to the position information of each support base and the base size information.

[0023] Optionally, the main control device stores a first load lower limit threshold and a load difference reduction threshold range. The buffer device includes a number of linear displacement mechanisms distributed radially. Each linear displacement mechanism slidably sets a support base. Each support base is a liftable support base and is provided with a load sensing device communicatively connected to the main control device.

[0024] Optionally, in step S3, the steps for placing the corresponding base adapted to the load area size on the load area include:

[0025] S31. The main control device controls the transfer device to place the base on the buffer device of the consignment device with the load area size already adjusted, and makes the transfer device maintain a holding relationship with the base;

[0026] S32. The main control device obtains and judges according to the load values sent by each load sensing device received that the load values of each support base are greater than or equal to the first load lower limit threshold, and the difference between the load values of any two support bases is within the load difference reduction threshold range;

[0027] S33. The main control device controls the transfer device to release the holding relationship with the base.

[0028] Optionally, the main control device also stores a second load lower limit threshold smaller than the first load lower limit threshold, and the second load lower limit threshold is not lower than 5% of the first load lower limit threshold.

[0029] Optionally, after step S31 is completed, the main control device obtains and judges according to the received load values that the load values of M support bases are greater than or equal to the second load lower limit threshold and less than the first load lower limit threshold, and the load values of the remaining support bases are greater than or equal to the first load lower limit threshold. Then step S33 is executed, and then the main control device performs fine lifting and lowering adjustment on the M support bases until step S32 is satisfied; where M is an integer greater than or equal to 1 and less than the number of support bases.

[0030] Optionally, after step S31 is completed, when the main control device obtains and judges according to the received load values that the load value of at least one support base is less than the second load lower limit threshold, it controls the transfer device to carry the base away from the consignment device, and then the main control device performs lifting and lowering adjustment on at least one support base.

[0031] Optionally, the support base includes a lifting body and a support body movably sleeved around the lifting body. The heights of the support bodies are the same. Each lifting body is provided with a load sensing device. Each lifting body and each load sensing device are communicatively connected to the main control device.

[0032] Optionally, the steps for the main control device to perform lifting adjustment on at least one support base include:

[0033] The main control device performs lifting control on each lifting body until the heights of the lifting bodies are the same as those of the corresponding support bodies or the lifting bodies are received in the corresponding support bodies.

[0034] Optionally, the semiconductor processing system further includes a transfer chamber, and the transfer chamber is provided with at least one buffer device.

[0035] Optionally, the semiconductor processing system processing method further includes:

[0036] The main control device obtains and determines, based on the information sent by at least one process chamber received, the process chamber that needs to perform the base transfer-out step;

[0037] The main control device controls the transfer device to transfer the base in the process chamber to the transfer chamber, and the main control device obtains and controls, based on the size information of the base, the buffer device in the transfer chamber to adjust the size of the bearing area to be adapted to the size of the base;

[0038] The main control device controls the transfer device to place the base on the buffer device in the transfer chamber with the bearing area size adjusted.

[0039] Compared with the prior art, the beneficial effects of the present application at least include the following.

[0040] In the semiconductor processing system and its processing method of the present application, the shipping device of the semiconductor processing system includes a buffer device for carrying the base. The buffer device includes an adjustable-size bearing area. After the main control device determines the process chamber that needs to transfer in the base based on the information of the transfer device or at least one process chamber obtained and received, it controls the buffer device to adjust the size of the bearing area according to the base size information that the process chamber to be transferred in can accommodate the base, and then places the corresponding base on the bearing area. The main control device controls the shipping device to drive the base into the pre-processing chamber, which can integrate the transfer process of bases of different sizes to the pre-processing chamber on one production line, reduce the number of production lines, and reduce the site occupation and equipment cost expenditure. Description of the Drawings

[0041] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0042] Figure 1 It is a schematic flowchart of a processing method for a semiconductor processing system shown in an embodiment of the present application.

[0043] Figure 2 It is a schematic diagram of the composition of a semiconductor processing system shown in an embodiment of the present application.

[0044] Figure 3 It is a schematic structural diagram of a process chamber shown in an embodiment of the present application.

[0045] Figure 4 It is a three-dimensional structure diagram of a buffer device shown in an embodiment of the present application.

[0046] Figure 5 For Figure 4 The top view of the buffer device shown.

[0047] Figure 6 For Figure 4 The schematic diagram of the working state where the size of the carrying area of the buffer device shown becomes larger.

[0048] Figure 7 For Figure 4 The schematic diagram of the working state where the size of the carrying area of the buffer device shown becomes smaller.

[0049] Figure 8 It is a structural diagram of a buffer device with a positioning device shown in an embodiment of the present application.

[0050] Figure 9 It is a schematic diagram of the composition of a semiconductor processing system with a transfer chamber shown in an embodiment of the present application.

[0051] Figure 10 It is a schematic diagram of the working state when the buffer devices in the transfer chamber do not carry the base.

[0052] Figure 11 It is a schematic diagram of the working state when some buffer devices in the transfer chamber have carried the base.

[0053] The reference numerals in the figures are as follows: 1, transfer device; 11, clamping device; 2, pre-treatment chamber; 3, process chamber; 31, gas injection device; 32, heating device; 33, rotation device; 34, isolation device; 35, exhaust device; 4, vision device; 5, main control device; 6, transfer chamber; 7, handling device; 100, buffer device; 101, linear displacement mechanism; 102, support base; 1021, lifting body; 1022, support body; 103, positioning device; S, loading area; 01, base; 02, wafer. Detailed implementation manners

[0054] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. The components of the embodiments of the present application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0055] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0056] The embodiments of the present application provide a method for transferring a base and a semiconductor processing system. The technical solutions of the present application will be described in detail below with reference to the accompanying drawings of the specification.

[0057] Embodiment 1

[0058] As Figure 2 shown, this embodiment provides a semiconductor processing system, including a transfer device 1, a pre-treatment chamber 2, at least two process chambers 3, a handling device 7, and a main control device 5. The handling device 7 is provided with a buffer device 100 for supporting the base. The buffer device includes a loading area with adjustable size; at least part of the process chambers 3 accommodate bases of different sizes; the main control device 5 is communicatively connected to each of the process chambers 3, the handling device 7, and the buffer device 100. Specifically, Figure 2 the two process chambers 3 shown can accommodate bases 01 of different sizes. After the base 01 enters the pre-treatment chamber 2 to load the wafer 02, the main control device 5 controls the transfer device 1 to transfer it to the corresponding process chamber 3 that needs to receive the base 01.

[0059] In some embodiments, the number of process chambers 3 is at least 2, and the sizes of the susceptors 01 accommodated in some of the process chambers 3 are different. For susceptors 01 with different sizes, the sizes of the wafers 02 carried thereon are different, or the wafers 02 carried have the same size but different quantities, which is conducive to realizing parallel processing of multiple quantities or multiple sizes of wafers and improving production capacity.

[0060] When the semiconductor processing system of this embodiment is in use, for the requirement of transferring the susceptor 01 into the process chamber 3, the main control device 5 adjusts the size of the loading area of the buffer device 100 according to the susceptor size information of the susceptor 01 to be transferred into the process chamber 3, so as to load the corresponding susceptor 01. Among them, the susceptor size information can be the information pre-stored in the main control device 5, or imported from a preset database or data file, or sent by other controllers.

[0061] In this embodiment, as Figure 2 shown, the transfer device 1 may include a clamping device 11 for clamping the side wall of the susceptor 01 and with an adjustable clamping size. The transfer device 1 transfers the susceptor 01 by means of the clamping device 11. For example, the clamping device 11 may include two relatively arranged clamping arms and a driving structure. The driving structure may be one or a combination of several of a motor, a servo, a linear module, a cylinder, a link mechanism, etc. By the driving structure, the distance between the two clamping arms can be increased or decreased to change the clamping size of the clamping device 11, so as to be suitable for clamping susceptors of different sizes. The specific implementation method is a conventional technical means in the art. In other embodiments, the transfer device 1 may also transfer the susceptor 01 in a supporting manner, and the specific implementation means is a conventional technical means in the art.

[0062] In some embodiments, a vision device 4 is provided in the pre-processing chamber 2, and the main control device 5 is communicatively connected to the vision device 4. The vision device 4 acquires and feeds back the information in the pre-processing chamber 2 to the main control device 5, including whether there is a susceptor 01, and the size and position information of each susceptor 01.

[0063] In some embodiments, the vision device 4 may at least include a camera. The camera takes pictures of the susceptor 01 in the pre-processing chamber 2 and sends them to the main control device 5, and the main control device 5 analyzes the images to obtain the susceptor size information. Alternatively, the vision device 4 may include a camera and a vision processing device. The vision processing device has independent image processing capabilities. It can analyze the pictures taken by the camera, calculate the susceptor size information, and then send the susceptor size information to the main control device 5.

[0064] In this embodiment, the main control device 5 can be a programmable logic controller (PLC), an industrial personal computer (IPC), a single-board computer (SBC), an embedded system, a digital signal processor (DSP), a field programmable gate array (FPGA), a microcontroller (MCU), a cloud server, etc.

[0065] In this embodiment, a load sensing device (not shown in the figure) for sensing the mass of the object carried on the buffer device 100 can be provided in the buffer device 100. The load sensing device is communicatively connected to the main control device 5. Among them, the main control device 5 determines whether the base 01 has been placed on the buffer device 100 and judges whether stable support is achieved, or determines whether the base 01 has been taken away from the buffer device 100 through the load signal of the load sensing device. Specifically, the load sensing device can be a load cell.

[0066] In this embodiment, as Figure 4 and Figure 5 shown, the buffer device 100 can include linear displacement mechanisms 101 radially distributed around a central position O. At least one support base 102 that can slide and change its position is installed on each linear displacement mechanism 101. The buffer device 100 further includes a driving mechanism communicatively connected to the main control device 5. The buffer device 100 controls the driving mechanism to work to change the position of the support base 102 on the linear displacement mechanism 101.

[0067] As Figure 5 shown, the bearing plane formed by the surfaces of the support bases 102 on all the linear displacement mechanisms 101 is the bearing area S (this bearing area S includes at least a part of the top surfaces of the support bases 102). As Figure 6 shown, when the support bases 102 on all the linear displacement mechanisms 101 move away from the central position O, the size of the bearing area S becomes larger. As Figure 7 shown, when moving closer to the central position O, the size of the bearing area S becomes smaller. Preferably, the positions, movement directions, and movement distances of the respective support bases 102 on the linear displacement mechanism 101 are kept consistent, that is, the respective support bases 102 are synchronously adjusted on the linear displacement mechanism 101.

[0068] In this embodiment, the linear displacement mechanism 101 can be a lead screw module or a timing belt module. At this time, the driving mechanism can be a servo motor that drives the lead screw module, the timing belt module, etc. to work. The driving mechanism drives the linear displacement mechanism 101 to work so that the support base 102 installed on the linear displacement mechanism 101 is displaced to change its position.

[0069] In this embodiment, the linear displacement mechanism 101 can also be a guide rail. The support base 102 can be provided with a chute, and the support base 102 is installed on the guide rail through the cooperation of the chute and the guide rail. The driving mechanism can include a motor and a running wheel driven by the motor. The driving mechanism is installed on the support base 102, and the running wheel contacts the guide rail or the surface near the guide rail. By controlling the rotation of the running wheel by the motor, the support base 102 can slide along the guide rail to change its position.

[0070] In this embodiment, as Figure 8 shown, the buffer device 100 can further include a position measuring device 103. The position measuring device 103 is arranged beside each linear displacement mechanism 101. The position measuring device 103 is used to detect the position of the support base 102 on the linear displacement mechanism 101. The position measuring device 103 is communicatively connected to the main control device 5. The main control device 5 determines whether the size of the loading area is suitable for the size of the base to be transferred through the position signal fed back by the position measuring device 103. The position measuring device 103 can be, but is not limited to, a grating sensor, an ultrasonic sensor, a proximity switch, etc.

[0071] In some embodiments, the pre-treatment chamber 2 can also be used to clean and purge the base 01. After the base 01 is cleaned and purged in the pre-treatment chamber 2, the clean wafer 02 is placed on the base. Since the buffer device 100 supports the base 01 through the loading area S, most of the surface of the base is exposed, improving the effect of cleaning and purging.

[0072] In some embodiments, after loading the wafer 02 on the cleaned and purged base 01, the base 01 can be transported into the pre-treatment chamber 2 by the transportation device 7. In this case, the base 01 is the base carrying the wafer 02.

[0073] In this embodiment, as Figure 9 shown, the semiconductor processing system can further include a transfer chamber 6. The transfer chamber 6 is provided with a buffer device 100 whose loading area size can be adjusted. Therefore, in the face of the buffer requirements of bases 01 of different sizes, the loading area size of the buffer device 100 can be adaptively adjusted to carry bases 01 of different sizes.

[0074] In one embodiment, the number of buffer devices 100 in the transfer chamber 6 is 1. When the susceptor 01 to be transferred in a process chamber 3 is transferred to the buffer device 100 and cooled to room temperature, the susceptor 01 is transferred out of the transfer chamber 6. At this time, the size of the bearing area of the buffer device 100 is adapted to the susceptor 01. When a susceptor 01 to be transferred with a different size in another process chamber 3 needs to be transferred to the buffer device 100, since the bearing area of the buffer device 100 can be flexibly adjusted, adjusting the size of the bearing area of the buffer device 100 can enable the buffer device 100 to still be used to buffer the susceptors 01 with different sizes transferred out of another process chamber 3, so that the buffer device 100 is fully utilized, and the buffering flexibility for susceptors 01 of different sizes is improved.

[0075] In this embodiment, as Figure 9 、 10 and 11 show, the number of buffer devices 100 in the transfer chamber 6 is at least 2, which further improves the buffering capacity of the transfer chamber 6. And since the size of the bearing area of the empty buffer device 100 can be adaptively adjusted according to the size of the susceptor to be transferred, the buffer device 100 has more flexible adaptability and the utilization rate is improved. At the same time, the buffer device 100 with an adjustable bearing area size cooperates with the transfer device 1 and the main control device 5, and can realize the integration of the transfer processes of susceptors of different sizes on one production line, reduce the number of production lines, reduce the space occupation and equipment cost expenditure, reduce the idle rate of the buffer device 100, and improve the utilization rate.

[0076] In some embodiments, the pre-treatment chamber 2, the transfer chamber 6 and the process chamber 3 are arranged around the transfer device 1.

[0077] In some embodiments, when the main control device 5 receives the information that the process in the process chamber 3 has ended, it judges that it is necessary to transfer the susceptor carrying the wafer from the process chamber 3 to the transfer chamber 6. The main control device 5 controls the transfer device 1 to transfer the corresponding susceptor carrying the coated wafer from the process chamber 3 to the transfer chamber 6 for storage. After each susceptor carrying the coated wafer is cooled to a suitable temperature (such as room temperature), the susceptor carrying the coated wafer is removed from the transfer chamber 6, and the coated wafer is taken off.

[0078] In some embodiments, a vision device 4 may also be provided in each process chamber 3. Then the main control device 5 can obtain the size information of the susceptor to be transferred through the vision device 4 in a process chamber 3, and obtain and judge according to the information received from the process chamber 3 that it is necessary to execute the step of transferring the susceptor out of the process chamber 3. The main control device 5 controls the empty buffer device 100 in the transfer chamber 6 to adjust the bearing area size to be adapted to the size of the susceptor to be transferred according to the susceptor size information. The main control device 5 controls the transfer device 1 to transfer the susceptor in the process chamber 3 to the transfer chamber 6 and place it on the buffer device 100 with the bearing area size adjusted.

[0079] In this embodiment, as Figure 10 and Figure 11 shown, the support base 102 of the buffer device 100 can be configured as a liftable structure.

[0080] In some embodiments, the buffer device 100 is configured as a liftable buffer device. As Figure 11 shown, in the transfer room 6, after the buffer device 100 carries the base to be transferred, the main control device 5 controls the corresponding buffer device 100 to rise so that the support base 102 rises to the set upper limit position. Wherein, after the support base 102 rises to the set upper limit position, the height of the empty space at the top of the base can prevent other bases from entering again.

[0081] Furthermore, Figure 11 shown, each support base 102 includes a lifting body 1021 and a support body 1022. The support body 1022 is movably sleeved outside the lifting body 1021 around the lifting body 1021. The support body 1022 is installed on the linear displacement mechanism 101 in a form that can slide to change its position. Each lifting body 1021 is communicatively connected to the main control device 5. The top of the lifting body 1021 is used to support the base 01. The main control device 5 controls the lifting body 1021 to perform lifting movement relative to the support body 1022.

[0082] Embodiment Two

[0083] As Figure 1 shown, the embodiment of the present application provides a semiconductor processing system processing method, which is implemented using the semiconductor processing system in Embodiment One.

[0084] The semiconductor processing system processing method of this embodiment at least includes:

[0085] S1. The main control device obtains and judges the process chamber that needs to transfer the base according to the information of the transfer device or at least one process chamber received;

[0086] S2. The main control device obtains and controls the buffer device of the consignment device to adjust the size of the loading area according to the base size information that the process chamber to which the base is to be transferred can accommodate the base;

[0087] S3. Place the corresponding base adapted to the size of the loading area on the loading area;

[0088] S4. The main control device controls the consignment device to transport the base to the pre-processing chamber;

[0089] S5. The main control device controls the transfer device to transfer the base to the corresponding process chamber.

[0090] In step S1 of this embodiment, the main control device 5 acquires and determines the process chamber 3 that needs to be transferred to the susceptor based on the information of at least one received process chamber 3. Specifically, referring to Figure 3 , the process chamber 3 is provided with a gas injection device 31, a heating device 32, a pressure control device (not labeled in the figure), an exhaust device 35, a rotation device 33, and an isolation device 34, all of which are communicatively connected to the main control device 5. The main control device 5 pre-stores process program information. The susceptor 01 is disposed on the rotation device 33 inside the process chamber 3, the heating device 32 is disposed below the susceptor 01, the gas injection device 31 is disposed at the top of the process chamber 3 and faces the surface of the susceptor 01 carrying the substrate, and the exhaust device 35 is disposed at the bottom of the process chamber 3. The main control device 5 controls the isolation device 34 to close, the heating device 32 generates heat to make the temperature inside the process chamber 3 meet the process temperature requirement, controls the pressure control device (not labeled in the figure) and the exhaust device (not labeled in the figure) to make the pressure inside the process chamber 3 meet the process pressure requirement, controls the gas injection device 31 to provide the type, flow rate, etc. of the process gas into the process chamber 3 to cause a vapor deposition reaction on the surface of the substrate, and controls the rotation device 33 to drive the substrate to rotate to grow a semiconductor material layer that meets the process requirements. After the vapor deposition reaction is completed, the main control device 5 controls the gas injection device 31 to inject an inert purge gas (such as nitrogen) into the process chamber 3, controls the rotation device 33 to gradually decelerate to a stop state and then move axially in the process chamber 3 to a suitable position to facilitate the transfer device 1 in the subsequent process chamber 3 to transfer the susceptor 01, and makes the pressure difference between the inside and outside of the process chamber 3 meet the transfer requirement (such as the pressure inside the process chamber 3 is the same as the pressure in the area where the transfer device 1 is located) by controlling the pressure control device and the exhaust device 35, and then controls the isolation device to be in an open state. The main control device 5 can determine the process chamber that needs to be transferred to the susceptor based on the time node of controlling the gas injection device 31 to inject an inert purge gas (such as nitrogen) into the corresponding process chamber 3 and controlling the rotation device 33 to gradually decelerate to a stop state and then move axially in the process chamber 3 to a suitable position, or can also determine the process chamber that needs to be transferred to the susceptor based on the time node of controlling the pressure control device and the exhaust device 35 to make the pressure difference between the inside and outside of the process chamber 3 meet the transfer requirement. The specific judgment node can be reasonably set according to the efficiency requirements of the process for processing different batches of materials.

[0091] In step S1 of some embodiments, the main control device acquires and makes a judgment based on the information received from the transfer device. Specifically, after the main control device 5 controls the transfer device 1 to move the susceptor 01 in the process chamber 3 out of the process chamber 3, it will receive the corresponding information fed back by the transfer device 1, and the main control device 5 determines that the process chamber 3 needs to be transferred to the susceptor 01 based on the corresponding information fed back by the transfer device 1.

[0092] In some embodiments, such as Figure 4As shown, the buffer device 100 includes a number of linear displacement mechanisms 101 distributed radially. Each linear displacement mechanism 101 is slidably provided on a support base 102. The buffer device 100 further includes a driving mechanism communicatively connected to the main control device 5 and connected to each support base 102.

[0093] In step S2 of this embodiment, the steps for the main control device 5 to obtain and control the buffer device 100 of the handling device 7 to adjust the size of the bearing area according to the base size information that the process chamber 3 to which the base is to be transferred can accommodate the base include:

[0094] The main control device 5 obtains and issues a bearing area size adjustment instruction to the driving mechanism according to the base size information. The driving mechanism drives at least one support base 102 to slide along the extension direction of the corresponding linear displacement mechanism 101 in response to the bearing area size adjustment instruction until the tops of the support bases 102 enclose the bearing area of the base.

[0095] In one embodiment, the "until the tops of the support bases 102 enclose the bearing area of the base" means that the main control device 5 obtains the bottom surface size information of the base 01 to be transferred, and adjusts the size of the bearing area S of the buffer device 100 according to this size information (as Figure 6 and Figure 7 shown), so that the size of the bearing area S is less than or equal to the bottom surface size of the base 01 to achieve stable bearing.

[0096] In some embodiments, as Figure 8 shown, the buffer device 100 may include a position measuring device 103 communicatively connected to the main control device 5, and a position measuring device 103 is provided beside each linear displacement mechanism 101. Therefore, in step S2, the steps for the main control device 5 to obtain and issue a bearing area size adjustment instruction to the driving mechanism according to the base size information include:

[0097] The position measuring device 103 obtains and sends the position information of each support base 102 to the main control device 5;

[0098] The main control device 5 issues a bearing area size adjustment instruction to the driving mechanism according to the position information of each support base 102 and the base size information.

[0099] In some embodiments, the main control device 5 may pre-store the base size information of the base 01 adapted to each process chamber 3. Then, before the step of "the main control device 5 issues a bearing area size adjustment instruction to the driving mechanism according to the position information of each support base 102 and the base size information" in step S2, it may include:

[0100] The main control device 5 obtains the base size information of the base 01 adapted to the process chamber 3 according to the information of the process chamber 3 determined in step S1 that needs to transfer the base 01.

[0101] In some embodiments, each support base 102 of the buffer device 100 can be a liftable support base, and a load-bearing sensing device can be provided on each support base 102 of the buffer device 100 of the shipping device 7. The load-bearing sensing device is communicatively connected to the main control device 5. The main control device 5 pre-stores a first load-bearing lower limit threshold and a load-bearing difference subtraction threshold range. In step S3 of some embodiments, the step of placing the base 01 adapted to the size of the bearing area on the bearing area includes:

[0102] S31. The main control device 5 controls the transfer device 1 to place the base to be transferred on the buffer device 100 of the shipping device 7 with the bearing area size adjusted, and enables the transfer device 1 to maintain a holding relationship with the base 01;

[0103] S32. The main control device 5 obtains and judges, according to the load-bearing values sent by each load-bearing sensing device received, that the load-bearing values of each support base 102 are greater than or equal to the first load-bearing lower limit threshold, and the difference between the load-bearing values of any two support bases 102 is within the load-bearing difference subtraction threshold range;

[0104] S33. The main control device 5 controls the transfer device 1 to release the holding relationship with the base 01.

[0105] Since each support base 102 of the buffer device 100 of the present application involves height adjustment in height and size adjustment of the bearing area in the plane direction, to further ensure that after the main control device 5 controls the transfer device 1 to transfer the base 01 to the bearing area, the bearing area can stably support the base 01, in step S31 of the present application, after the main control device 5 controls the transfer device 1 to place the base 01 to be transferred on the buffer device 100 with the bearing area size adjusted, the transfer device 1 also maintains a holding relationship with the base 01, which is equivalent to forming a target bearing position relationship of holding the base 01 on the buffer device 100 through the transfer device 1, and judging whether the bearing area meets the condition of stable support for the base 01 in the case of S31 through step S32.

[0106] In some embodiments, the first load-bearing lower limit threshold N0 is obtained by measuring the base 01 with the smallest weight borne by the buffer device 100, that is: after the load-bearing device with the smallest weight is stably placed on the buffer device 100, the load-bearing values of each support base 102.

[0107] In some embodiments, the first load-bearing lower limit threshold N0 is related to the weight of the base 01 held by the transfer device. The main control device 5 pre-stores the corresponding relationship data of the base 01 that each process chamber 3 can accommodate, its weight, and the first load-bearing lower limit threshold N0. After the main control device 5 judges the information of the base 01 that the corresponding process chamber 3 needs to transfer in through step S2, the first load-bearing lower limit threshold N0 is obtained from the corresponding relationship data according to this information.

[0108] In some embodiments, a load sensing device is provided on the transfer device 1, which can acquire the weight of the held base 01 and feedback it to the main control device 5. The main control device 5 acquires the base weight sent by the transfer device 1 and obtains the corresponding first load lower limit threshold according to the corresponding relationship data between the base weight and the first load lower limit threshold stored in advance.

[0109] To reduce or avoid the unstable center of gravity of the base 01 caused by too large a height difference between the support seats 102, the main control device 5 controls the transfer device 1 to place the base 01 to be transferred on the buffer device 100 with the load area size adjusted in the consignment device 7 through step S31. After maintaining the holding relationship between the transfer device 1 and the base 01, step S32 is executed to judge the first load lower limit threshold and the load difference subtraction threshold range, so as to ensure that the center of gravity of the base 01 is stable after step S33 is executed. Specifically, Figure 4 the first load lower limit thresholds of the four support seats 102 in are all N0 and the heights are the same. When the base 01 is stably supported by the support seats 102, the weights borne by the support seats 102 are N1, N2, N3, and N4. N1, N2, N3, and N4 are all greater than or equal to N0, and the difference between the load-bearing values of any two support seats 102, such as the absolute value of (N1 - N2), (N4 - N1), etc., are all within the load difference subtraction threshold range, then it is considered that the load area plays a role in stably supporting the base 01.

[0110] Furthermore, the stable support of the base 01 by the support seats 102 is the result of the joint action of the support seats 102, and the base 01 is not completely flat in some cases. Therefore, it is more time-saving, safe and reliable to judge and adjust the stable support of the base 01 by the support seats 102 together through the load-bearing value.

[0111] In some embodiments, the master control device 5 further stores a second lower load threshold that is less than the first lower load threshold, and the second lower load threshold is not lower than 5% of the first lower load threshold. After step S31 is completed, the master control device 5 obtains and determines, based on each load value, that the load values of the M support seats 102 are greater than or equal to the second lower load threshold and less than the first lower load threshold, and the load values of the remaining support seats 102 are greater than or equal to the first lower load threshold, then step S33 is executed, and then the master control device 5 performs a fine lifting adjustment on the M support seats 102 until the requirements of step S32 are met. Wherein, M is an integer greater than or equal to 1 and less than the number of support seats. Since the load values of each support seat 102 are greater than or equal to the second lower load threshold, and the second lower load threshold is not lower than 5% of the first lower load threshold, it indicates that a load-bearing relationship is formed between each support seat 102 and the bottom surface of the bearing device. There will be no risk that the base 01 will fall due to the mismatch between the load-bearing area and the bottom surface size of the bearing base 01 when the base 01 is placed towards the load-bearing area, or the risk of slipping due to significant unevenness after placement. In this case, only the support seats 102 corresponding to the first lower load threshold and the second lower load threshold need to be adjusted. Therefore, the transfer device 1 can be disengaged from the holding relationship with the base 01 through step S33 first. At this time, the base 01 can be supported by each support seat 102 and will not fall. In this case, for further facilitating the stable support of the base 01, the master control device 5 performs a fine lifting adjustment until the master control device 5 determines that the load-bearing values of each support seat 102 meet the requirements of step S32. The fine lifting adjustment can use the height of one support seat 102 with a load value greater than the first lower load threshold as a reference height, and sequentially adjust the heights of the M support seats 102 to be adjusted. In some embodiments, the height adjustment order of the support seats 102 is based on the diagonal principle. For example, taking the height of one support seat 102 (denoted as the first support seat) as a reference, the next support seat 102 to be adjusted is the support seat that is in a diagonal relationship with the first support seat. In some embodiments, during the fine adjustment of the target support seat 102, appropriate step-by-step control can be performed, that is, adjusting a part of the height each time, which is more conducive to the stable placement of the base 01 without slipping during the fine adjustment process.

[0112] In some embodiments, after step S31 is completed, when the main control device 5 obtains and determines, based on the load-bearing values of the support bases, that the load-bearing value of at least one support base 102 is less than the second lower load-bearing threshold, it controls the transfer device 1 to maintain the holding relationship with the base 01, controls the transfer device 1 to clamp the base 01 and move away from the consignment device 7 together, and then the main control device 5 adjusts the height of at least one support base 102. When the main control device 5 determines that the load-bearing value of a support base 102 is less than the second lower load-bearing threshold, it indicates that the load-bearing relationship between this support base 102 and the base 01 is not strong or there is no contact relationship, and it is easy for the base 01 to have the risk of falling from the load-bearing area due to unstable support. In this case, if the base 01 is placed first and then the height adjustment is directly carried out, it is easy for the base 01 to be unable to be stably supported on the load-bearing area.

[0113] In some embodiments, as Figure 11 shown, the support base 102 includes a lifting body 1021 and a support body 1022 movably sleeved around the lifting body 1021. The heights of the support bodies 1022 are the same, and each lifting body 1021 is provided with a load-bearing sensing device, and each lifting body 1021 is communicatively connected to the main control device 5. The steps for the main control device 5 to adjust the height of at least one support base 102 include: the main control device 5 controls the lifting of each lifting body 1021 on the buffer device 100 until the heights of the lifting bodies 1021 are the same as those of the corresponding support bodies 1022. In another embodiment, the steps for the main control device 5 to adjust the height of at least one support base 102 include: the main control device 5 controls the lifting of each lifting body 1021 on the buffer device 100 until the lifting bodies 1021 are received in the corresponding support bodies 1022, so that the base 01 can be stably supported by the support bodies 1022 with the same height. Compared with the scheme of readjusting the heights of the lifting bodies 1021 to be the same, the above control method does not need to judge whether the heights of the lifting bodies 1021 are the same, and it saves time for realizing the stable support of the base 01.

[0114] In step S4 of some embodiments, the main control device 5 controls the consignment device 7 to transport the base 01 into the pre-processing chamber 2. In some more specific embodiments, the consignment device 7 is a movable tray, such as a tray supported by a robotic arm.

[0115] In step S5 of some embodiments, the wafer 02 is placed on the base 01 in the pre-processing chamber 2, and then the main control device 5 controls the transfer device 1 to transfer the base to the corresponding process chamber 3. In some specific embodiments, the pre-processing chamber 2 is a glove box.

[0116] In step S5 of some embodiments, the main control device 5 controls the consignment device 7 to carry the base 01 into the pre-processing chamber 2.

[0117] In some embodiments, such as Figure 9 shown, the semiconductor processing system may further include at least one transfer chamber 6.

[0118] In some embodiments, the pre - processing chamber 2, the transfer chamber 6, and the process chamber 3 are arranged around the transfer device 1.

[0119] In some embodiments, the semiconductor processing system processing method further includes:

[0120] The main control device 5 obtains and determines, based on the information received from at least one process chamber 3, the process chamber 3 that needs to execute the step of transferring out the susceptor.

[0121] The main control device 5 controls the transfer device 1 to transfer the susceptor in the process chamber 3 to the transfer chamber 6, and the main control device 5 obtains and controls the buffer device 100 in the transfer chamber 6 to adjust the size of the loading area according to the size information of the susceptor so as to be adapted to the size of the susceptor.

[0122] The main control device 5 controls the transfer device 1 to place the susceptor on the buffer device 100 in the transfer chamber 6 with the adjusted loading area size.

[0123] In some embodiments, referring to Figure 3 shown, after the chemical vapor deposition reaction ends, the main control device 5 controls the gas injection device 31 to inject an inert purge gas (such as nitrogen) into the process chamber 3, controls the rotation device 33 to gradually decelerate to a stop state and then move axially in the process chamber 3 to a suitable position to facilitate the transfer device 1 in the subsequent entry into the process chamber 3 to transfer the susceptor 01, and makes the pressure difference between the inside and outside of the process chamber 3 meet the transfer requirements (for example, the pressure in the process chamber 3 is the same as the pressure in the area where the transfer device 1 is located) by controlling the pressure control device and the exhaust device 35, and then controls the isolation device 34 to be in an open state.

[0124] After the main control device 5 receives the process information that the current wafer processing in the process chamber 3 ends and determines that the step of transferring the susceptor 01 to be transferred to the transfer chamber 6 needs to be executed, the main control device 5 obtains the susceptor size information of the susceptor 01 to be transferred through the vision device 4 in the process chamber 3. Specifically, after the main control device 5 determines that the isolation device 34 is in an open state, it confirms that the corresponding process chamber 3 needs to transfer out the susceptor 01.

[0125] In some embodiments, each process chamber 3 is provided with a vision device 4. The main control device 5 determines the process chamber 3 that needs to transfer in the susceptor 01 according to the information sent by the vision device 4 of each process chamber 3. Specifically, after the transfer device 1 transfers out the susceptor 01 in the process chamber 3, the main control device 5 obtains the image information in the process chamber 3 through the vision device 4 in the process chamber 3; when the main control device 5 determines that there is no susceptor 01 accommodated in the process chamber 3 according to the image information obtained by the vision device 4, it determines that the process chamber 3 is the process chamber that needs to transfer in the susceptor 01.

[0126] In some embodiments, the main control device 5 can judge that it is necessary to transfer to the process chamber 3 of the susceptor 01 according to the time node when the control gas injection device 31 injects an inert purge gas (such as nitrogen) into the corresponding process chamber 3, controls the rotation device 33 to gradually decelerate to a stop state and then moves axially in the process chamber 3 to a suitable position, or can also judge that it is necessary to transfer to the process chamber 3 of the susceptor 01 according to the time node when the control pressure control device and the exhaust device 35 make the pressure difference inside and outside the process chamber 3 meet the transfer requirements, that is, when the susceptor 01 of this process chamber 3 has not been transferred out, judging in advance according to the process rhythm that this process chamber 3 needs to be transferred to other susceptors 01 subsequently can make the time node for subsequently executing the transfer of the susceptor 01 from this process chamber 3 coincide with or be not much different from the time node when the foregoing S04 is completed, improving the efficiency. The specific judgment node can be reasonably set according to the efficiency requirements of the process for processing different batches of materials.

[0127] In step S3 of some embodiments, the main control device 5 controls the transfer device 1 to place the susceptor to be transferred on the buffer device 100 whose load area size has been adjusted on the transfer device 7. The transfer device 1 for executing step S3 and the transfer device 1 for transferring the susceptor 01 in the pre-processing chamber 2 to the corresponding process chamber 3 can be the same transfer device or different transfer devices. The specific selection is necessary for the efficiency of the semiconductor processing system production line.

[0128] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A semiconductor processing system processing method, characterized in that, Including: S0, providing a semiconductor processing system; The semiconductor processing system at least includes a transfer device, a pre-processing chamber, at least two process chambers, a main control device, and a consignment device. A buffer device for supporting a susceptor is provided on the consignment device. The buffer device includes a load-bearing area with adjustable size. The sizes of the susceptors accommodated in at least some of the process chambers are different; the main control device is communicatively connected to each of the process chambers, the consignment device, and the buffer device; S1, the main control device obtains and determines the process chamber into which the susceptor needs to be transferred based on the information of the transfer device or the information of at least one of the process chambers received; S2, the main control device obtains and controls the buffer device of the consignment device to adjust the size of the load-bearing area according to the susceptor size information that the process chamber to which the susceptor needs to be transferred can accommodate; S3, placing the corresponding susceptor adapted to the size of the load-bearing area on the load-bearing area; S4, the main control device controls the consignment device to transport the susceptor into the pre-processing chamber; S5, the main control device controls the transfer device to transfer the susceptor to the corresponding process chamber; Wherein, the main control device stores a first load-bearing lower limit threshold and a load difference subtraction threshold range. The buffer device includes a plurality of linear displacement mechanisms distributed radially. Each linear displacement mechanism is slidably provided with a support seat. Each support seat is a liftable support seat and is provided with a load-bearing sensing device communicatively connected to the main control device; In the step S3, the step of placing the corresponding susceptor adapted to the size of the load-bearing area on the load-bearing area includes: S31, the main control device controls the transfer device to place the susceptor on the buffer device of the consignment device with the load-bearing area size adjusted, and makes the transfer device maintain a holding relationship with the susceptor; S32, the main control device obtains and determines, based on the load-bearing values sent by each of the load-bearing sensing devices received, that the load-bearing values of each support seat are greater than or equal to the first load-bearing lower limit threshold, and the difference between the load-bearing values of any two support seats is within the load difference subtraction threshold range; S33, the main control device controls the transfer device to release the holding relationship with the susceptor.

2. The semiconductor processing system processing method according to claim 1, wherein In the step S1, the main control device obtains and further determines, based on the information of the transfer device or the information of at least one of the process chambers received, that the number of process chambers into which the susceptor needs to be transferred is at least 2; Repeat the steps S2 to S4 to enable at least two susceptors to sequentially enter the pre-processing chamber, and then execute the step S5.

3. The semiconductor processing system processing method according to claim 2, characterized in that, A vision device communicatively connected to the main control device is provided in the pre-processing chamber; In the step S1, the main control device obtains and further determines the transfer order of the susceptors to be transferred into each of the process chambers based on the information of the transfer device or the information of at least one of the process chambers received; In the step S5, the step of controlling the transfer device by the main control device to transfer the base to the corresponding process chamber includes: the main control device controls the transfer device to sequentially transfer each base to the corresponding process chamber in the transfer base order according to the size and position information of each base in the pre-processing chamber sent by the vision device and the transfer base order.

4. The semiconductor processing system processing method according to claim 1, characterized in that The buffer device includes a plurality of linear displacement mechanisms distributed radially, each linear displacement mechanism is slidably provided with a support seat, and the buffer device further includes a driving mechanism communicatively connected to the main control device and connected to each support seat; In the step S2, the step of the main control device obtaining and controlling the buffer device of the consignment device to adjust the size of the bearing area according to the base size information that the process chamber capable of accommodating the base to be transferred can accommodate the base includes: The main control device obtains and issues a bearing area size adjustment instruction to the driving mechanism according to the base size information, and the driving mechanism drives at least one support seat to slide along the extension direction of the corresponding linear displacement mechanism in response to the bearing area size adjustment instruction until the tops of the support seats enclose a bearing area for bearing the base.

5. The method for processing a semiconductor processing system according to claim 4, wherein, The buffer device includes a position measuring device communicatively connected to the main control device; In the step S2, the step of the main control device obtaining and issuing a bearing area size adjustment instruction to the driving mechanism according to the base size information includes: The position measuring device obtains and sends the position information of each support seat to the main control device; The main control device issues the bearing area size adjustment instruction to the driving mechanism according to the position information of each support seat and the base size information.

6. The semiconductor processing system processing method according to claim 1, wherein The main control device also stores a second load lower limit threshold smaller than the first load lower limit threshold, and the second load lower limit threshold is not lower than 5% of the first load lower limit threshold; After the step S31 is executed, the main control device obtains and judges according to the received load values that the load values of M support seats are greater than or equal to the second load lower limit threshold and less than the first load lower limit threshold, and the load values of the remaining support seats are greater than or equal to the first load lower limit threshold, then executes the step S33, and then the main control device performs fine lifting adjustment on the M support seats until the step S32 is satisfied; where M is an integer greater than or equal to 1 and less than the number of support seats.

7. The semiconductor processing system processing method according to claim 5, wherein The main control device also stores a second load lower limit threshold smaller than the first load lower limit threshold, and the second load lower limit threshold is not lower than 5% of the first load lower limit threshold; After the step S31 is executed, after the main control device obtains and judges according to the received load values that the load value of at least one support seat is less than the second load lower limit threshold, it controls the transfer device to carry the base away from the consignment device, and then the main control device performs lifting adjustment on at least one support seat.

8. The semiconductor processing system processing method according to claim 7, characterized in that The support base includes a lifting body and a support body movably sleeved around the lifting body. The heights of the support bodies are the same. Each lifting body is provided with the load-bearing sensing device, and each lifting body and each load-bearing sensing device are communicatively connected to the main control device; The steps for the main control device to perform lifting adjustment on at least one of the support bases include: The main control device performs lifting control on each of the lifting bodies until the heights of the lifting bodies are the same as those of the corresponding support bodies or the lifting bodies are received in the corresponding support bodies.

9. The method for processing a semiconductor processing system according to claim 1, wherein It further includes a transfer chamber, and at least one of the buffer devices is provided in the transfer chamber. The semiconductor processing system processing method further includes: The main control device obtains and determines, according to the information sent by at least one of the process chambers received, the process chamber that needs to execute the base transfer-out step; The main control device controls the transfer device to transfer the base in the process chamber to the transfer chamber, and the main control device obtains and controls the buffer device in the transfer chamber to adjust the size of the bearing area to match the size of the base according to the size information of the base; The main control device controls the transfer device to place the base on the buffer device in the transfer chamber with the bearing area size adjusted.

10. A semiconductor processing system, characterized in that, It includes a transfer device, a pre-treatment chamber, at least two process chambers, a main control device and a handling device. The handling device is provided with a buffer device for supporting the base. The buffer device includes an adjustable-size bearing area; at least part of the process chambers accommodate bases of different sizes; the main control device is communicatively connected to each of the process chambers, the handling device and the buffer device; Wherein, the main control device stores a first load-bearing lower limit threshold and a load-bearing difference reduction threshold range. The buffer device includes a plurality of linear displacement mechanisms distributed radially. Each linear displacement mechanism is slidably provided with a support base. Each support base is a liftable support base and is provided with a load-bearing sensing device communicatively connected to the main control device; The semiconductor processing system is at least used to place the corresponding base adapted to the size of the bearing area on the bearing area. The steps include: The main control device controls the transfer device to place the base on the buffer device of the handling device with the bearing area size adjusted, and makes the transfer device maintain a holding relationship with the base; The main control device obtains and determines, according to the load-bearing values sent by each of the load-bearing sensing devices received, that the load-bearing values of each support base are greater than or equal to the first load-bearing lower limit threshold, and the difference between the load-bearing values of any two support bases is within the load-bearing difference reduction threshold range; The main control device controls the transfer device to release the holding relationship with the base.

11. The semiconductor processing system according to claim 10, wherein, The buffer device includes a plurality of linear displacement mechanisms distributed radially. Each linear displacement mechanism is slidably provided with a support base. The buffer device further includes a driving mechanism communicatively connected to the main control device and connected to each support base.

12. The semiconductor processing system according to claim 10, characterized in that, The buffer device includes a position measuring device communicatively connected to the main control device.

13. The semiconductor processing system according to claim 11, wherein The support base includes a lifting body and a support body movably sleeved around the lifting body. Each lifting body is provided with a load sensing device, and each lifting body is communicatively connected to the main control device.

14. The semiconductor processing system according to claim 10, wherein, A vision device communicatively connected to the main control device is provided in the pre-processing chamber.

15. The semiconductor processing system according to claim 10, wherein It further includes at least one transfer chamber provided with the buffer device.

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