Automatic impedance matching method, device, system and microwave equipment

Abstract

The present invention provides an automatic impedance matching method, device, system and microwave equipment, which relate to the field of microwave technology. After the impedance of the monitoring system is mismatched, when all pins are located at the initial position, the insertion position of each pin in each pin combination is adjusted according to the preset pin combination joint adjustment sequence, and stops at the position corresponding to the minimum reflection coefficient; if there is no mismatch after the joint adjustment of each pin combination, it stops and returns to monitor whether the impedance of the system is mismatched, otherwise, continue to adjust the next pin combination when the pin combination switching condition is met; if it is not met, adjust each pin according to the single pin setting sequence corresponding to the current pin combination, and stop after reaching the position corresponding to the minimum reflection coefficient; if there is no mismatch after adjusting each pin in the single pin setting sequence, stop and return to monitor whether the impedance of the system is mismatched, otherwise continue to adjust the next pin; after the last pin is adjusted, return to monitor whether the impedance of the system is mismatched. The present invention can cover the impedance matching range of the three-pin matcher and can quickly and accurately match impedance.

Description

Technical Field

[0001] The present invention relates to the field of microwave technology, and in particular to an automatic impedance matching method, device, system and microwave equipment. Background Art

[0002] Microwave plasma has the characteristics of high excitation efficiency, non-polar discharge, and wide working pressure range, and can produce free radicals with high concentration and high energy density. These characteristics make it widely used in the fields of material surface modification and thin film material deposition. However, with the fluctuation of process parameters (such as power, pressure, flow, gas type and its ratio) and environmental conditions (such as temperature), the impedance characteristics of plasma will also change accordingly. Since the energy state change of microwave plasma can be reflected by the impedance change of its transmission line, this requires that the main transmission line must have a characteristic impedance that matches the plasma load to ensure the effective transmission of microwave energy.

[0003] In order to ensure the maximum utilization of microwave energy, a three-pin matcher is usually required between the signal source and the load. The general waveguide three-pin matcher is realized by using waveguide three pins. Metal pins of a certain diameter and depth are inserted along the wide side of the waveguide to achieve impedance matching between the signal source and the load. In the design of the automatic three-pin matcher, the most challenging problem is how to quickly track the change of impedance and provide instant matching. The matching speed depends largely on the time to determine the optimal insertion depth of the three pins. This depth can achieve accurate matching of the system impedance.

[0004] Normally, when the load impedance changes, if the reflection coefficient exceeds the set threshold, an impedance mismatch will be triggered. At this time, the control system will adjust the insertion depth of the pin to adjust the system impedance between the matcher and the load. Subsequently, the system will continue to monitor the modulus of the reflection coefficient and repeat the above adjustment process until the reflection coefficient drops below the threshold. However, due to the extremely large number of combinations of pin insertion positions, sometimes dozens, hundreds or even thousands of adjustments may be required to reduce the reflection coefficient to an impedance matching state that meets the requirements of the equipment. This design is often difficult to meet the needs of practical applications in terms of matching time. Therefore, it is particularly urgent to provide an algorithm that can achieve real-time, fast and accurate impedance automatic matching. Summary of the invention

[0005] One of the purposes of the present invention is to provide an automatic impedance matching method, device, system and microwave equipment, which are used to cover the impedance matching range of a three-pin matcher and realize real-time, fast and accurate impedance automatic matching. The present invention can be implemented as follows:

[0006] In a first aspect, the present invention provides an automatic impedance matching method, which is applied to a main control module in an impedance matching system, wherein the impedance matching system also includes a three-pin matcher, and three pins can be inserted into the waveguide of the three-pin matcher; the method includes: monitoring whether the system impedance is mismatched; if so, when each pin is located at an initial position, sequentially controlling and adjusting the insertion position of each pin in each pin combination in the waveguide according to a preset pin combination joint adjustment sequence until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped; after each pin combination is joint adjusted, if the system impedance is not mismatched, stopping the joint adjustment of the next pin combination and returning to the monitoring system Check whether the impedance is mismatched, otherwise, determine whether the pin combination switching condition is met; if satisfied, continue the joint adjustment of the next pin combination, otherwise, adjust the insertion position of each pin in the waveguide in sequence according to the single pin setting sequence corresponding to the current pin combination, and stop adjusting after reaching the insertion position corresponding to the minimum reflection coefficient; after adjusting one pin each time in the single pin setting sequence, if the system impedance is not mismatched, stop joint adjusting the next pin and return to monitor whether the system impedance is mismatched, otherwise, continue to adjust the next pin; when the last pin in the single pin setting sequence is adjusted, return to monitor whether the system impedance is mismatched.

[0007] In a second aspect, the present invention provides an automatic impedance matching device, which is applied to a main control module in an impedance matching system, wherein the impedance matching system also includes a three-pin matcher, and three pins can be inserted into the waveguide of the three-pin matcher; the automatic impedance matching device includes a monitoring module and an adjustment module; the monitoring module is used to monitor whether the system impedance is mismatched; the adjustment module is used to control and adjust the insertion position of each pin in each pin combination in the waveguide in sequence according to a preset pin combination joint adjustment sequence when the monitoring result of the monitoring module is yes, until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped; after each pin combination is joint adjusted, if the monitoring module detects that the system impedance is not mismatched, the adjustment module is used to stop joint adjusting the next pin combination The combined return monitors whether the system impedance is mismatched, otherwise, determines whether the pin combination switching condition is met; if met, the adjustment module is used to continue the joint adjustment of the next pin combination, otherwise, the adjustment module is used to adjust the insertion position of each pin in the waveguide in sequence according to the single pin setting sequence corresponding to the current pin combination, until the adjustment is stopped after the insertion position corresponding to the minimum reflection coefficient; after adjusting one pin separately each time in the single pin setting sequence, if the monitoring module detects that the system impedance is not mismatched, the adjustment module is used to stop the joint adjustment of the next pin and return to monitor whether the system impedance is mismatched, otherwise, continue to adjust the next pin; the adjustment module is also used to instruct the monitoring module to continue monitoring after the last pin in the single pin setting sequence is adjusted.

[0008] In a third aspect, the present invention provides an automatic impedance matching system, comprising a main control module and a three-pin matcher; three pins can be inserted into the waveguide of the three-pin matcher; the main control module is used to execute the automatic impedance matching method described in the first aspect.

[0009] In a fourth aspect, the present invention provides a microwave device, comprising a processor and a memory, wherein the memory stores a computer program executable by the processor, and the processor can execute the computer program to implement the automatic impedance matching method described in the first aspect.

[0010] The present invention provides an automatic impedance matching method, device, system and microwave equipment, which monitors the system impedance. Once a mismatch is found, that is, when the three pins are in the initial position, the positions of the pins in the pin combination are adjusted according to the preset pin combination joint adjustment sequence until the position of the minimum reflection coefficient is reached. After each adjustment, if the impedance matches, further adjustment is stopped; if not, it is determined whether the pin combination needs to be switched. If necessary, continue to adjust the next pin combination; if not, adjust each pin one by one according to the single pin setting sequence corresponding to the current pin combination until it matches. After the single pin is adjusted, if the impedance matches, stop and return to monitoring; if not, continue to adjust. The whole process can cover the impedance matching range of the three-pin matcher through the combined control method of the pin combination joint adjustment and the individual adjustment of the three pins, and achieve real-time, fast and accurate impedance automatic matching effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 An architecture diagram of an automatic impedance matching system provided by an embodiment of the present invention;

[0013] Figure 2 A schematic diagram of the structure of a three-pin matcher provided in an embodiment of the present invention;

[0014] Figure 3 A schematic flow chart of an automatic impedance matching method provided by an embodiment of the present invention;

[0015] Figure 4 A schematic diagram of a single pin adjustment process provided by an embodiment of the present invention;

[0016] Figure 5 A schematic diagram of an automatic impedance matching process provided by an embodiment of the present invention;

[0017] Figure 6 A functional module diagram of an automatic impedance matching device provided by an embodiment of the present invention;

[0018] Figure 7 A structural block diagram of a microwave device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0022] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0024] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0025] In the process of automatic impedance matching, the inventors have found through research that the most difficult problem to solve is how to track the impedance changes in a short time and provide real-time matching for it. The matching time depends largely on the time required to find the optimal insertion depth of the three pins, that is, the time required to achieve system impedance matching. However, there are many combinations of matching pin insertion positions, and sometimes it may take dozens, hundreds, or even thousands of adjustments to adjust the reflection coefficient to the impedance matching state required by the device. Such a design is difficult to meet application requirements in terms of matching time, so a real-time, fast, and accurate automatic impedance matching algorithm is needed.

[0026] Before introducing the process of the automatic impedance matching method provided by the embodiment of the present invention, the system architecture involved in the embodiment of the present invention is first introduced. Figure 1 , Figure 1 This is an architecture diagram of an automatic impedance matching system provided by an embodiment of the present invention. The automatic impedance matching system 00 includes a signal source 10, an isolator 20, a detection module 30, a main control module 40, a matching module 50 and a load 60.

[0027] In the embodiment of the present invention, the power operating range and operating frequency of the signal source 10 can be flexibly set according to actual scene requirements to adapt to specific microwave transmission requirements. For example, as an example, the power operating range can be between 500~3000w, and the operating frequency can be 2.45G.

[0028] The main function of the isolator 20 in the system is to prevent unnecessary reflection and interference of the signal during transmission, thereby ensuring the purity and transmission efficiency of the signal.

[0029] The detection module 30 is responsible for real-time signal monitoring and provides necessary feedback information for the stable operation of the system. In one embodiment of the present invention, the detection module 30 is composed of a detection board and an analog-to-digital converter (ADC). The detection board monitors the incident voltage and reflected voltage of the signal source 10, and then transmits these voltage values ​​to the ADC for collection. The ADC converts the collected voltage data into a digital signal for further processing by the main control module 40.

[0030] The main control module 40 is responsible for executing the automatic impedance matching method provided by the embodiment of the present invention. In an optional implementation, the main control module 40 may adopt a field programmable gate array (FPGA). In order to ensure the high efficiency and accuracy of the impedance matching process, the main control module 40 may include three core submodules: a reflection coefficient acquisition and calibration module, an automatic impedance matching device, and a motor drive control module.

[0031] (1) Reflection coefficient acquisition and calibration module: This module is responsible for acquiring the incident voltage and reflected voltage of the signal source 10, performing precise calibration, and converting these values ​​into the modulus of the reflection coefficient to detect changes in the load.

[0032] (2) Automatic impedance matching device: This device is a functional module corresponding to the automatic impedance matching method described in the embodiment of the present invention. When it is detected that the load change causes the system impedance to be mismatched, the impedance is adjusted through algorithm control to ensure that the system impedance matches the load, so that the load can receive the maximum effective power.

[0033] (3) Motor drive control module: This module is mainly responsible for generating PWM signals to control the operation of the motor and achieving precise impedance matching by controlling the movement of the pin in the waveguide (forward and backward).

[0034] In the embodiment of the present invention, the matching module 50 is composed of a three-pin matching device composed of a motor driving chip, a stepping motor, and a rectangular waveguide. The three-pin matching device is provided with three pins. Figure 2 As shown, Figure 2 The schematic diagram of the structure of the three-pin matcher provided by the embodiment of the present invention can achieve the effect of changing the system impedance by controlling the depth of the three pins inserted into the rectangular waveguide. The motor drive chip is used to respond to the PWM control signal generated by the main control module, drive the stepper motor to control the insertion depth of each pin in the three-pin matcher, and can reversely run, quickly, accurately, continuously and smoothly output torque.

[0035] The load 60 is the final receiver of the signal in the system. The design of the load 60 fully considers the impedance matching with the signal source 10 to ensure the effective transmission and reception of the signal.

[0036] The following will be combined Figure 1 The system architecture diagram of the automatic impedance matching system 00 shown in the figure provides a detailed introduction to the process of the automatic impedance matching method provided by an embodiment of the present invention. This method does not need to detect the phase value of the system, but only needs to detect the modulus value of the reflection coefficient to achieve a fast and accurate impedance matching process.

[0037] See also Figure 3 , Figure 3 A schematic flow chart of an automatic impedance matching method provided by an embodiment of the present invention, wherein the execution subject of the method is Figure 1 The main control module 40 in the embodiment includes the following processes:

[0038] S101: monitor whether the system impedance is mismatched;

[0039] S102: If yes, when all the pins are located at the initial position, the insertion position of each pin in each pin combination in the waveguide is controlled and adjusted in sequence according to the preset pin combination joint adjustment sequence until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped;

[0040] S103: After each pin combination is adjusted, if the system impedance is not mismatched, stop adjusting the next pin combination and return to monitor whether the system impedance is mismatched, otherwise, determine whether the pin combination switching condition is met;

[0041] S104: If the conditions are met, continue the joint adjustment of the next pin combination; otherwise, adjust the insertion positions of the pins in the waveguide in sequence according to the single pin setting sequence corresponding to the current pin combination until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped;

[0042] S105: After adjusting one pin individually each time in the single pin setting sequence, if the system impedance is not mismatched, stop adjusting the next pin and return to monitor whether the system impedance is mismatched, otherwise, continue to adjust the next pin;

[0043] S106: After the last pin in the single pin setting sequence is adjusted, return to monitor whether the system impedance is mismatched.

[0044] Steps S101 to S106 provided in the embodiment of the present invention monitor the impedance of the system. Once a mismatch is found, that is, when the three pins are in the initial position, the positions of the pins in the pin combination are adjusted according to the preset pin combination joint adjustment sequence until the position of the minimum reflection coefficient is reached. After each adjustment, if the impedance matches, stop further adjustment; if not, determine whether it is necessary to switch the pin combination. If necessary, continue to adjust the next pin combination; if not, adjust each pin one by one according to the single pin setting sequence corresponding to the current pin combination until it matches. After the single pin is adjusted, if the impedance matches, stop and return to monitoring; if not, continue to adjust. The entire process can cover the impedance matching range of the three-pin matcher through the combined control method of the pin combination joint adjustment and the individual adjustment of the three pins, and achieve real-time, fast and accurate impedance automatic matching effect.

[0045] It should be noted that Figure 3 This is not a limitation on the execution order of steps S101 to S106. In the actual implementation process, if a certain step involves confirming whether the system impedance is mismatched, it is still necessary to return to S101 if the system is not mismatched, and to continue to execute subsequent steps if it is still mismatched. Similarly, the situation of confirming whether the pin combination switching conditions are met is similar.

[0046] The following is a detailed introduction to each of the above steps.

[0047] In step S101, Figure 1 It can be seen that the main control module 40 in the system can collect the incident voltage and the reflected voltage collected at the detection module 10, and then calculate the ratio of the two to obtain the current reflection coefficient of the system, and compare the reflection coefficient with the preset threshold to determine whether the current system has impedance mismatch. In other words, if the reflection coefficient is monitored to exceed the preset threshold, the subsequent matching process can be executed. Therefore, the implementation method of step S101 is as follows:

[0048] Step a1: obtaining the current incident voltage and reflected voltage of the signal source, and taking the ratio of the incident voltage to the reflected voltage as the current reflection coefficient;

[0049] Step a2: If the current reflection coefficient exceeds the preset threshold, it is determined that the system impedance is mismatched, otherwise the system impedance is not mismatched.

[0050] If the system impedance matching is detected in step S101, then S101 can be continued, otherwise S102 is executed. In step S102, when it is determined that all pins are located at the initial position, the insertion position of each pin in each pin combination in the waveguide is controlled and adjusted in sequence according to the preset pin combination joint adjustment sequence until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped.

[0051] Combination Figure 3 As shown in the figure, each pin is in the initial position when it is just inserted into the waveguide and the length is the shortest. If all pins are in the initial position, the subsequent joint adjustment process can be performed. However, if any pin is not in the initial position, a single pin adjustment process needs to be performed to improve the current system impedance mismatch.

[0052] In the embodiment of the present invention, if all three pins are in the initial position, the joint adjustment process of the pin combination is started; if not, the single pin adjustment process is performed. Regardless of which adjustment process is performed, it is necessary to continuously monitor whether the system impedance is still in a mismatched state during the adjustment process. If the impedance is still mismatched, continue to adjust the position of a single pin or each pin in the pin combination; if the system impedance has been matched, return to step S101.

[0053] For ease of description, in the embodiment of the present invention, the three pins are named as the first pin, the second pin and the third pin. The first pin is located at the inlet end of the three-pin matcher, and the third pin is close to the outlet end. The inlet end acts as an excitation source, and the outlet end is connected to the load. The second pin is located between the first pin and the third pin. It should be emphasized that this naming method is only used to distinguish the pins and does not impose any restrictions on the specific positions of the pins.

[0054] In the process of joint adjustment of multiple pins, in one embodiment of the present invention, the combination categories of pins are first defined, specifically including a double pin combination and a triple pin combination. The double pin combination is further subdivided into a first pin and a second pin combination, and a second pin and a third pin combination. For these different pin combinations, the present embodiment also plans an adjustment sequence, that is, first adjusting the second pin and the third pin combination, followed by the first pin and the second pin combination, and finally adjusting the triple pin combination.

[0055] For each pin combination, the embodiment of the present invention also formulates a corresponding single pin setting sequence, which helps to deal with the situation where the system still has an impedance mismatch problem after the joint adjustment of a certain pin combination, and the system impedance does not change much after the joint adjustment. In the embodiment of the present invention, the degree of change in system impedance can be quantified by the reduction of the reflection coefficient, thereby ensuring the accuracy and effectiveness of the adjustment process.

[0056] Therefore, in the embodiment of the present invention, for the three-pin combination and the first pin and the second pin combination in the double-pin combination, the corresponding single pin setting order is: first pin, second pin, third pin, second pin, first pin; and the single pin setting order corresponding to the second pin and the third pin combination in the double-pin combination is: second pin, third pin, second pin, first pin.

[0057] Based on the above work, when executing step S102, when all pins are not located at the initial position, the embodiment of the present invention adjusts the insertion position of each pin in the waveguide in sequence according to the single pin setting sequence corresponding to the combination of the second pin and the third pin, that is, the second pin, the third pin, the second pin, the first pin, until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped.

[0058] An embodiment of the present invention also provides a method for determining whether a pin has reached the insertion position corresponding to the minimum reflection coefficient. First, the maximum position of each forward or reverse movement of the pin is defined as the "twice the minimum reflection coefficient position". When the pin moves to this position in a certain direction, it will stop moving further in that direction and start moving in the opposite direction. Here, "forward" refers to the direction in which the insertion depth of the pin increases, and "reverse" refers to the direction in which the insertion depth of the pin decreases. In this way, the pin can be accurately positioned to achieve the purpose of minimizing the reflection coefficient.

[0059] In one embodiment of the present invention, the single pin adjustment process is as follows Figure 4 As shown, Figure 4 Schematic diagram of a single pin adjustment process provided by an embodiment of the present invention:

[0060] Step b1: when the pin is not at the initial position of the pin, control the pin to move in a direction of shortening the insertion depth, and record the minimum reflection coefficient and the insertion position corresponding to the minimum reflection coefficient during the movement;

[0061] Step b2: determining whether the pin has reached the insertion position corresponding to twice the minimum reflection coefficient;

[0062] If not, return to step b1, otherwise go to step b3;

[0063] Step b3: When the pin is not at the maximum position of the pin, the pin is controlled to move in a direction where the insertion depth increases, and during the movement, the minimum reflection coefficient and the insertion position corresponding to the minimum reflection coefficient are recorded;

[0064] Step b4: determining whether the pin has reached the insertion position corresponding to four times the minimum reflection coefficient;

[0065] If so, execute step b5, otherwise return to step b3;

[0066] Step b5: Control the pin to move in a direction of shortening the insertion depth until it reaches the insertion position corresponding to the minimum reflection coefficient.

[0067] That is to say, for the adjustment of a single pin, the pin can be controlled to move in the opposite direction to reduce its length, and the minimum reflection coefficient and its corresponding position can be recorded in the process. Next, it is determined whether the pin has reached the maximum position of its movement, which is the so-called double minimum reflection coefficient position. If the pin has not reached this position, it will continue to be adjusted; if it has reached it, the pin will start to move forward, increase its length, and record the minimum reflection coefficient and its position again in the process. When the pin reaches the insertion position corresponding to four times the minimum reflection coefficient, the pin is controlled to move in the opposite direction again to the insertion position corresponding to the minimum reflection coefficient. Through this continuous process, the insertion position corresponding to the minimum reflection coefficient can be accurately located, and it is ensured that the pin stops precisely at this position, thereby achieving precise control of the pin position.

[0068] It should be noted that during the adjustment process, whether it is a single pin or a combination of pins, the minimum reflection coefficient changes dynamically and is not a constant value. This means that if a pin has been adjusted to the position corresponding to the current minimum reflection coefficient, then when adjusting the insertion position of another or more pins, the insertion position corresponding to the minimum reflection coefficient may change accordingly. Therefore, the adjustment process needs to constantly monitor and adapt to these changes to ensure that the system always remains in the optimal impedance matching state.

[0069] Next, the embodiment of the present invention will introduce the process of implementing the pin assembly joint adjustment when all three pins are not in the initial position.

[0070] Based on the above preparations, the joint adjustment is performed in the order of first joint adjustment of the second pin and the third pin combination, then joint adjustment of the first pin and the second pin combination, and finally joint adjustment of the three pin combinations. The end condition of the joint adjustment of each group of pin combinations is to reach the insertion position corresponding to the minimum reflection coefficient, which is similar to the single pin adjustment process, and the embodiment of the present invention will not be repeated.

[0071] In the embodiment of the present invention, after each pin combination is coordinated, it is necessary to first determine whether the system impedance is still in a mismatched state. If the system impedance is matched at this time, that is, the current reflection system does not exceed the threshold, it returns to S101, otherwise it is determined whether the pin combination switching condition is triggered. If not triggered, the single pin setting sequence corresponding to the pin combination is executed to perform single pin adjustment, otherwise continue with the coordinated adjustment of the next pin combination.

[0072] In one embodiment of the present invention, determining whether a pin combination switching condition is met includes: after jointly adjusting the current pin combination, determining a reduction amplitude of the reflection coefficient before and after this joint adjustment; if the reduction amplitude is less than a preset amplitude, the pin combination switching condition is met, otherwise the pin combination switching condition is not met.

[0073] That is to say, the embodiment of the present invention can pre-set a specific amplitude. After completing the joint adjustment of a pin combination, if the system impedance still shows mismatch, the reduction amount of the current reflection coefficient after adjustment will be determined based on the reflection coefficient before adjustment. If this reduction amount is less than the preset amplitude, the condition for switching the pin combination is met; if the reduction amount does not meet this condition, the pin combination will not be switched, but the single pin setting sequence corresponding to the pin combination will be followed. Continue to execute the single pin adjustment process to ensure the accuracy and effectiveness of the system impedance adjustment.

[0074] The impedance matching range of the three-pin matcher can be covered by a combination control method of joint adjustment of the first pin and the second pin, joint adjustment of the second pin and the third pin, simultaneous joint adjustment of the three pins, and individual adjustment of the three pins.

[0075] In combination with the above-mentioned single pin adjustment process and the pin combination joint adjustment process, in order to understand the impedance matching process provided by the embodiment of the present invention as a whole, please refer to Figure 5 , Figure 5 The process diagram of the automatic impedance matching method provided by the embodiment of the present invention mainly includes the following contents:

[0076] After the system starts automatic matching, it first determines whether the reflection coefficient exceeds the threshold: if not, it jumps back to the step of determining whether the reflection coefficient exceeds the threshold; if so, it determines whether the three pins are all in the initial position. If so, it controls the second pin and the third pin to synchronously complete a pin adjustment; if not, it jumps to the step of controlling the second pin to complete a pin adjustment.

[0077] After the second pin and the third pin are controlled to synchronously complete a pin adjustment, it is determined whether the reflection coefficient exceeds the threshold value: if not, it is jumped back to the step of determining whether the reflection coefficient exceeds the threshold value; if so, it is determined whether the reduction of the reflection coefficient is less than 50%: if so, the first pin and the second pin are controlled to synchronously complete a pin adjustment; if not, it is jumped to the step of controlling the second pin to complete a pin adjustment process;

[0078] After controlling the first pin and the second pin to synchronously complete a pin adjustment, determine whether the reflection coefficient exceeds the threshold: if not, jump back to the step of determining whether the reflection coefficient exceeds the threshold; if so, determine whether the reduction in the reflection coefficient is less than 50%: if so, control the first pin, the second pin and the third pin to synchronously complete a pin adjustment; if not, jump to the step of controlling the first pin to complete a pin adjustment.

[0079] After controlling the first pin, the second pin and the third pin to synchronously complete a pin adjustment, determine whether the reflection coefficient exceeds the threshold: if not, jump back to the step of determining whether the reflection coefficient exceeds the threshold; if yes, jump to the step of controlling the first pin to complete a pin adjustment.

[0080] The above process is repeated until the reflection coefficient does not exceed the threshold. The embodiment of the present invention can effectively reduce the reflection coefficient to below the preset threshold by accurately controlling the adjustment range, adjustment sequence and combination of each pin, thereby significantly improving the quality and reliability of microwave transmission, which not only optimizes the signal transmission efficiency, but also enhances the robustness of the entire system.

[0081] Based on Figure 3 With the same inventive concept, the embodiment of the present invention also provides an automatic impedance matching device 401. Figure 6 , Figure 6 This is a functional module diagram of the automatic impedance matching device provided by an embodiment of the present invention. Figure 6 In the embodiment, the automatic impedance matching device 401 includes a monitoring module 4011 and an adjustment module 4012;

[0082] Monitoring module 4011, used to monitor whether the system impedance is mismatched;

[0083] The adjustment module 4012 is used for, if the monitoring result of the monitoring module 4011 is yes, then when all the pins are located at the initial position, sequentially controlling and adjusting the insertion position of each pin in each pin combination in the waveguide according to a preset pin combination joint adjustment sequence, until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped;

[0084] After each pin combination is adjusted, if the monitoring module 4011 detects that the system impedance is not mismatched, the adjustment module 4012 is used to stop adjusting the next pin combination and return to monitor whether the system impedance is mismatched, otherwise, determine whether the pin combination switching condition is met;

[0085] If satisfied, the adjustment module 4012 is used to continue the joint adjustment of the next pin combination; otherwise, the adjustment module 4012 is used to sequentially adjust the insertion positions of the pins in the waveguide according to the single pin setting sequence corresponding to the current pin combination until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped;

[0086] After adjusting one pin each time in the single pin setting sequence, if the monitoring module 4011 detects that the system impedance is not mismatched, the adjustment module 4012 is used to stop the joint adjustment of the next pin and return to monitor whether the system impedance is mismatched, otherwise, continue to adjust the next pin;

[0087] The adjustment module 4012 is also used to instruct the monitoring module 4011 to continue monitoring after the last pin in the single pin setting sequence has been adjusted.

[0088] It is understandable that the adjustment module 4012 and the monitoring module 4011 can be executed in coordination. Figure 3 Each step in the process is performed to achieve the corresponding technical effect.

[0089] In an optional embodiment, the three pins are, in sequence, a first pin, a second pin and a third pin; the first pin is close to an inlet port of the three-pin matcher; the third pin is close to an outlet port of the three-pin matcher; the second pin is located between the first pin and the third pin; the pin combination includes a double-pin combination and a three-pin combination; the double-pin combination includes: a first pin and a second pin combination, a second pin and a third pin combination; the pin combination adjustment sequence is, in sequence: a second pin and a third pin combination, a first pin and a second pin combination, a three-pin combination; the single pin setting sequence corresponding to the first pin and the second pin combination in the three-pin combination and the double-pin combination is: a first pin, a second pin, a third pin, a second pin, and a first pin; the single pin setting sequence corresponding to the second pin and the third pin combination in the double-pin combination is: a second pin, a third pin, a second pin, and a first pin.

[0090] In an optional embodiment, the adjustment module 4012 is also used to adjust the insertion position of each pin in the waveguide in sequence according to the single pin setting sequence corresponding to the second pin and the third pin combination when not all pins are in the initial position, and stop adjusting after reaching the insertion position corresponding to the minimum reflection coefficient.

[0091] In an optional embodiment, the adjustment module 4012 is also used to control the pin to move in the direction of shortening the insertion depth when the pin is not in the initial position of the pin, and record the minimum reflection coefficient and the insertion position corresponding to the minimum reflection coefficient during the movement; determine whether the pin has reached the insertion position corresponding to twice the minimum reflection coefficient; if not, return to the step of controlling the pin to move in the direction of shortening the insertion depth when the pin is not in the initial position of the pin, and record the minimum reflection coefficient and the insertion position corresponding to the minimum reflection coefficient during the movement; if so, when the pin is not in the maximum position of the pin, control the pin to move in the direction of increasing the insertion depth, and record the minimum reflection coefficient and the insertion position corresponding to the minimum reflection coefficient during the movement; determine whether the pin has reached the insertion position corresponding to four times the minimum reflection coefficient; if not, control the pin to move in the direction of shortening the insertion depth; if so, return to the step of controlling the pin to move in the direction of increasing the insertion depth when the pin is not in the maximum position of the pin, and record the minimum reflection coefficient and the insertion position corresponding to the minimum reflection coefficient during the movement.

[0092] In an optional embodiment, the monitoring module 4011 is specifically used to obtain the current incident voltage and reflected voltage of the signal source, and use the ratio of the incident voltage to the reflected voltage as the current reflection coefficient; if the current reflection coefficient exceeds a preset threshold, the system impedance is determined to be mismatched, otherwise the system impedance is not mismatched.

[0093] In an optional embodiment, the adjustment module 4012 is also used to determine whether the pin combination switching condition is met, including: after the current pin combination is adjusted, determining the reduction amplitude of the reflection coefficient before and after this adjustment; if the reduction amplitude is less than the preset amplitude, the pin combination switching condition is met, otherwise the pin combination switching condition is not met.

[0094] It should be noted that the division of modules in the above embodiments of the present application is schematic and is only a logical function division. There may be other division methods in actual implementation. In addition, each functional unit in each embodiment of the present application may be integrated into a processing unit, or may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of a software functional unit.

[0095] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a microwave device (which can be a personal computer, server, or network device, etc.) or a processor (Processor) to perform all or part of the steps of each embodiment method of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only memory, ROM), random access memory (Random Access Memory, RAM), disk or optical disk and other media that can store program codes.

[0096] Based on the above embodiments, the present invention further provides a microwave device, see Figure 7 , Figure 7 A structural block diagram of a microwave device provided in an embodiment of the present invention. Figure 7 In the embodiment, the microwave device 70 includes: a memory 701, a processor 702, and a communication interface 703. The memory 701, the processor 702, and the communication interface 703 are electrically connected to each other directly or indirectly to achieve data transmission or interaction. For example, these components can be electrically connected to each other through one or more communication buses or signal lines.

[0097] Optionally, the bus may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 7 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0098] In the embodiment of the present invention, the processor 702 may be a general-purpose processor, a digital signal processor, an application-specific integrated circuit, a field programmable gate array or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component, and may implement or execute the methods, steps, and logic block diagrams disclosed in the embodiment of the present invention. A general-purpose processor may be a microprocessor or any conventional processor, etc. The steps of the method disclosed in the embodiment of the present invention may be directly embodied as being executed by a hardware processor, or may be executed by a combination of hardware and software modules in the processor. The software module may be located in the memory 701, and the processor 702 reads the program instructions in the memory 701 and completes the steps of the above method in combination with its hardware.

[0099] In the embodiment of the present invention, the memory 701 may be a non-volatile memory, such as a hard disk drive (HDD) or a solid-state drive (SSD), etc., or a volatile memory (Volatile memory), such as RAM. The memory may also be any other medium for carrying or storing the desired program code in the form of instructions or data structures and accessible by a computer, but is not limited thereto. The memory in the embodiment of the present invention may also be a circuit or any other device capable of realizing a storage function, for storing instructions and / or data.

[0100] The memory 701 can be used to store software programs and modules, such as the instructions / modules of the automatic impedance matching device 401 provided in the embodiment of the present invention, which can be stored in the memory 701 in the form of software or firmware or solidified in the operating system (OS) of the microwave device 70. The processor 702 executes various functional applications and data processing by executing the software programs and modules stored in the memory 701. The communication interface 703 can be used to communicate signaling or data with other node devices.

[0101] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described devices and units can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0102] Understandably, Figure 7 The structure shown is for illustration only. The microwave device 70 may also include Figure 7 More or fewer components as shown, or with Figure 7 Different configurations shown. Figure 7 The components shown may be implemented in hardware, software or a combination thereof.

[0103] Based on the above embodiments, the present application further provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a computer, the computer executes the automatic impedance matching method provided in the above embodiments.

[0104] Based on the above embodiments, an embodiment of the present invention further provides a computer program. When the computer program is run on a computer, the computer executes the automatic impedance matching method provided by the above embodiments.

[0105] Based on the above embodiments, an embodiment of the present invention further provides a chip, which is used to read a computer program stored in a memory and to execute the automatic impedance matching method provided in the above embodiments.

[0106] An embodiment of the present invention further provides a computer program product, comprising instructions, which, when executed on a computer, enables the computer to execute the automatic impedance matching method provided in the above embodiment.

[0107] The embodiments of the present invention are described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by instructions. These instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0108] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0109] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An automatic impedance matching method, characterized in that: A main control module applied to an impedance matching system, wherein the impedance matching system further comprises a three-pin matcher, wherein three pins can be inserted into a waveguide of the three-pin matcher; The three pins along the direction from the inlet end to the outlet end of the three-pin matcher are the first pin, the second pin and the third pin in sequence; the method comprises: Monitor system impedance mismatch; If so, when all the pins are located at the initial position, the insertion position of each pin in each pin combination in the waveguide is controlled and adjusted in sequence according to the preset pin combination joint adjustment sequence until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped; After each pin combination is adjusted, if the system impedance is not mismatched, the next pin combination is adjusted and the system impedance is monitored again to see if it is mismatched. Otherwise, it is determined whether the pin combination switching condition is met. If satisfied, continue joint adjustment of the next pin combination; otherwise, adjust the insertion positions of the pins in the waveguide in sequence according to the single pin setting sequence corresponding to the current pin combination until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped; After adjusting one pin individually each time in the single pin setting sequence, if the system impedance is not mismatched, stop adjusting the next pin and return to monitor whether the system impedance is mismatched, otherwise, continue to adjust the next pin; When the last pin in the single pin setting sequence is adjusted, returning to monitor whether the system impedance is mismatched; The pin combination includes a second pin and a third pin combination; the single pin setting sequence corresponding to the second pin and the third pin combination is: second pin, third pin, second pin, first pin; when all pins are not located at the initial position, the insertion position of each pin in the waveguide is adjusted in sequence according to the single pin setting sequence corresponding to the second pin and the third pin combination, and the adjustment is stopped after the insertion position corresponding to the minimum reflection coefficient.

2. The automatic impedance matching method according to claim 1, characterized in that: The first pin is close to the inlet port of the three-pin matcher; the third pin is close to the outlet port of the three-pin matcher; the second pin is located between the first pin and the third pin; The pin combination includes a double pin combination and a triple pin combination; the double pin combination includes: a first pin and a second pin combination, and a second pin and a third pin combination; the pin combination joint adjustment sequence is: the second pin and the third pin combination, the first pin and the second pin combination, and the triple pin combination; The single pin setting sequence corresponding to the first pin and the second pin combination in the three-pin combination and the double-pin combination is: first pin, second pin, third pin, second pin, first pin.

3. The automatic impedance matching method according to claim 1 or 2, characterized in that: The process of adjusting the insertion position of each pin in the waveguide until the insertion position corresponding to the minimum reflection coefficient is reached and then stopping the adjustment includes: When the pin is not at the initial position of the pin, the pin is controlled to move in a direction in which the insertion depth is shortened, and during the movement, a minimum reflection coefficient and an insertion position corresponding to the minimum reflection coefficient are recorded; Determine whether the pin has reached the insertion position corresponding to twice the minimum reflection coefficient; If not, returning to the step of controlling the pin to move in a direction of shortening the insertion depth when the pin is not at the initial position of the pin, and recording the minimum reflection coefficient and the insertion position corresponding to the minimum reflection coefficient during the movement; If so, when the pin is not at the maximum position of the pin, the pin is controlled to move in a direction where the insertion depth increases, and during the movement, the minimum reflection coefficient and the insertion position corresponding to the minimum reflection coefficient are recorded; Determine whether the pin has reached the insertion position corresponding to four times the minimum reflection coefficient; If so, control the pin to move in the direction of shortening the insertion depth; otherwise, when the return pin is not at the maximum position of the pin, control the pin to move in the direction of increasing the insertion depth. During the movement, record the minimum reflection coefficient and the insertion position corresponding to the minimum reflection coefficient.

4. The automatic impedance matching method according to claim 1, characterized in that: Monitor system impedance mismatch, including: Acquire the current incident voltage and reflected voltage of the signal source, and use the ratio of the incident voltage to the reflected voltage as the current reflection coefficient; If the current reflection coefficient exceeds a preset threshold, it is determined that the system impedance is mismatched, otherwise the system impedance is not mismatched.

5. The automatic impedance matching method according to claim 4, characterized in that: Determine whether the pin combination switching conditions are met, including: After the current pin combination is adjusted, the reduction amplitude of the reflection coefficient before and after the current adjustment is determined; if the reduction amplitude is less than the preset amplitude, the pin combination switching condition is met, otherwise the pin combination switching condition is not met.

6. An automatic impedance matching device, characterized in that: A main control module applied to an impedance matching system, wherein the impedance matching system further comprises a three-pin matcher, wherein three pins can be inserted into a waveguide of the three-pin matcher; the three pins are sequentially a first pin, a second pin and a third pin along a direction from an inlet end to an outlet end of the three-pin matcher; the automatic impedance matching device comprises a monitoring module and an adjustment module; The monitoring module is used to monitor whether the system impedance is mismatched; The adjustment module is used for, if the monitoring result of the monitoring module is yes, then when all the pins are located at the initial position, sequentially controlling and adjusting the insertion position of each pin in each pin combination in the waveguide according to a preset pin combination joint adjustment sequence, until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped; After each pin combination is adjusted, if the monitoring module detects that the system impedance is not mismatched, the adjustment module is used to stop adjusting the next pin combination and return to monitor whether the system impedance is mismatched, otherwise, determine whether the pin combination switching condition is met; If the conditions are met, the adjustment module is used to continue the joint adjustment of the next pin combination; otherwise, the adjustment module is used to sequentially adjust the insertion positions of the pins in the waveguide according to the single pin setting sequence corresponding to the current pin combination until the insertion position corresponding to the minimum reflection coefficient is reached and the adjustment is stopped; After adjusting one pin individually each time in the single pin setting sequence, if the monitoring module detects that the system impedance is not mismatched, the adjustment module is used to stop adjusting the next pin and return to monitor whether the system impedance is mismatched, otherwise, continue to adjust the next pin; The adjustment module is further used to instruct the monitoring module to continue monitoring after the last pin in the single pin setting sequence is adjusted; The pin combination includes a second pin and a third pin combination; the single pin setting sequence corresponding to the second pin and the third pin combination is: second pin, third pin, second pin, first pin; the adjustment module is also used to adjust the insertion position of each pin in the waveguide in sequence according to the single pin setting sequence corresponding to the second pin and the third pin combination when the pins are not all at the initial position, until the adjustment is stopped after the insertion position corresponding to the minimum reflection coefficient.

7. The automatic impedance matching device according to claim 6, characterized in that: The first pin is close to the inlet port of the three-pin matcher; the third pin is close to the outlet port of the three-pin matcher; the second pin is located between the first pin and the third pin; The pin combination includes a double pin combination and a triple pin combination; the double pin combination includes: a first pin and a second pin combination, and a second pin and a third pin combination; the pin combination joint adjustment sequence is: the second pin and the third pin combination, the first pin and the second pin combination, and the triple pin combination; The single pin setting sequence corresponding to the first pin and the second pin combination in the three-pin combination and the double-pin combination is: first pin, second pin, third pin, second pin, first pin.

8. An automatic impedance matching system, characterized in that: At least comprises a main control module and a three-pin matcher; three pins can be inserted into the waveguide of the three-pin matcher; the main control module is used to execute the automatic impedance matching method as described in any one of claims 1-5.

9. A microwave device, characterized in that: The invention comprises a processor and a memory, wherein the memory stores a computer program executable by the processor, and the processor can execute the computer program to implement the automatic impedance matching method according to any one of claims 1 to 5.

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