Circuit board chamfer cutting equipment, method and device and medium
By comprehensively considering the thickness of the copper layer, cutting angle and first distance, determining the safe cutting distance and cutting depth, and controlling the cutting knife for tilt cutting, the problem of cutting the cutting knife cutting to the gold finger during the chamfering cutting of the circuit board is solved, and the more High cutting accuracy and safety.
Patent Information
- Application Number
- CN202411522311.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-29
- Publication Date
- 2025-02-07
AI Technical Summary
During the chamfering cutting process of circuit boards, it is difficult for the prior art to avoid cutting the cutting knife to the gold finger, resulting in problems such as copper exposure, copper pulling, finger short circuit, and circuit board scrapping.
By comprehensively considering the thickness of the copper layer, the cutting angle and the first distance, the safe cutting distance and the cutting depth are determined, and the cutting knife is controlled to perform inclined cutting to prevent the cutting knife from touching the copper layer.
It effectively avoids the cutting knife cutting to the copper layer during chamfering cutting, reduces the scrap rate of the circuit board, and improves cutting accuracy and safety.
Smart Images
Figure CN119403040A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to but is not limited to the field of circuit board cutting, and in particular to a circuit board chamfer cutting device, method, apparatus and medium. Background Art
[0002] When designing a PCB board with gold fingers, in order to facilitate the smooth insertion of the gold fingers into the connector slots, the board edges at the gold fingers will be chamfered. However, due to the influence of the chamfering angle, the copper thickness of the gold fingers, the chamfering depth, the accuracy of the gold finger beveling machine, etc., the gold fingers are often cut during processing, resulting in problems such as exposed copper, pulled copper, and finger short circuits, which will cause the circuit board to be scrapped. Summary of the invention
[0003] The embodiments of the present application provide a circuit board chamfer cutting device, method, apparatus and medium, which can effectively avoid the situation where gold fingers are cut during the chamfer cutting process.
[0004] In the first aspect, an embodiment of the present application provides a circuit board chamfer cutting method, which is applied to a circuit board chamfer cutting device, wherein the circuit board chamfer cutting device includes a clamping device for clamping a circuit board to be cut, a first cutting knife and a second cutting knife symmetrically arranged, and a parameter acquisition device for acquiring parameters of the circuit board to be cut, wherein the circuit board to be cut includes a substrate, and at least one surface of the substrate is provided with a copper layer, and the circuit board chamfer cutting method includes:
[0005] Obtaining the thickness of the copper layer, a preset cutting angle, and a first distance of the substrate;
[0006] Determining a safe cutting distance according to the copper layer thickness and the cutting angle;
[0007] The cutting depth and the cutting distance are determined according to the safe cutting distance and the first distance, and the first cutting knife and / or the second cutting knife are controlled to cut the substrate according to the cutting depth and the cutting distance.
[0008] The circuit board chamfer cutting method according to the first aspect of the present application has at least the following beneficial effects: the chamfer cutting of the circuit board is an inclined cutting, not a vertical cutting. During the inclined cutting process, since the tool is inclined, if the cutting is too deep, the tool may touch the copper layer. Therefore, by comprehensively considering the copper layer thickness, cutting angle and the first distance, the cutting depth and cutting distance are determined, and then cutting is performed to effectively avoid the cutting tool from cutting the copper layer during the chamfer cutting process.
[0009] According to some embodiments of the first aspect of the present application, the safe cutting distance is determined according to the copper layer thickness and the cutting angle by the following formula:
[0010] H / tan(a)=L;
[0011] Wherein, H is the thickness of the copper layer, a is the cutting angle, and L is the safe cutting distance.
[0012] According to some embodiments of the first aspect of the present application, an upper surface copper layer is provided on the upper surface of the substrate, and a lower surface copper layer is provided on the lower surface of the substrate. Before obtaining the thickness of the copper layer, the preset cutting angle, and the first distance between the copper layer and the substrate, the method further includes:
[0013] Obtaining a first copper layer thickness of the upper surface copper layer and a second copper layer thickness of the lower surface copper layer;
[0014] When the thickness of the first copper layer is greater than or equal to the thickness of the second copper layer, determining the thickness of the first copper layer as the copper layer thickness;
[0015] or,
[0016] When the thickness of the first copper layer is less than the thickness of the second copper layer, the thickness of the second copper layer is determined to be the thickness of the copper layer.
[0017] According to some embodiments of the first aspect of the present application, the circuit board chamfering cutting method further includes:
[0018] When the safe cutting distance is greater than the first distance, the first cutting knife and / or the second cutting knife is controlled to stop cutting, and a first alarm signal is issued.
[0019] According to some embodiments of the first aspect of the present application, the circuit board chamfering cutting method further includes:
[0020] When the cutting depth is greater than the thickness of the substrate, the first cutting knife and / or the second cutting knife is controlled to stop cutting, and a second alarm signal is issued.
[0021] According to some embodiments of the first aspect of the present application, determining a safe cutting distance according to the copper layer thickness and the cutting angle includes:
[0022] Obtaining an error value of the circuit board chamfering cutting device;
[0023] A safe cutting distance is determined according to the error value, the copper layer thickness and the cutting angle.
[0024] According to some embodiments of the first aspect of the present application, the safe cutting distance is determined according to the error value, the copper layer thickness and the cutting angle by the following formula:
[0025]
[0026] Wherein, H is the thickness of the copper layer, a is the cutting angle, and L is the safe cutting distance. is the error value.
[0027] In a second aspect, an embodiment of the present application provides an operation control device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the circuit board chamfer cutting method as described in the first aspect is implemented.
[0028] In a third aspect, an embodiment of the present application provides a circuit board chamfer cutting device, comprising an operation control device as described in the embodiment of the second aspect.
[0029] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the circuit board chamfer cutting method as described in the embodiment of the first aspect.
[0030] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.
[0032] Figure 1 A partial schematic diagram of a circuit board chamfering cutting device provided in an embodiment of the present application;
[0033] Figure 2 A flow chart of a circuit board chamfering cutting method provided in an embodiment of the present application;
[0034] Figure 3 A flow chart of a circuit board chamfering cutting method provided in another embodiment of the present application;
[0035] Figure 4 for Figure 2 Specific flow chart of step S200;
[0036] Figure 5 An embodiment of the present application provides an operation control device. DETAILED DESCRIPTION
[0037] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0038] It is understood that although the functional modules are divided in the device schematic diagram and the logical order is shown in the flow chart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flow chart. The terms "first", "second", etc. in the specification, claims or the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0039] When designing a PCB board with gold fingers, in order to facilitate the smooth insertion of the gold fingers into the connector slots, the board edges at the gold fingers will be chamfered. However, due to the influence of the chamfering angle, the copper thickness of the gold fingers, the chamfering depth, the accuracy of the gold finger beveling machine, etc., the gold fingers are often cut during processing, resulting in problems such as exposed copper, pulled copper, and finger short circuits, which will cause the circuit board to be scrapped.
[0040] Based on this, the embodiments of the present application provide a circuit board chamfer cutting device, method, apparatus and medium. The chamfer cutting of the circuit board is inclined cutting, not vertical cutting. During the inclined cutting process, since the tool is inclined, if the cutting is too deep, the tool may touch the copper layer. Therefore, by comprehensively considering the copper layer thickness, cutting angle and the first distance, the cutting depth and cutting distance are determined, and then cutting is performed to effectively avoid the cutting tool from cutting the copper layer during the chamfer cutting process.
[0041] Reference Figure 1 , Figure 1 A partial schematic diagram of a circuit board chamfering cutting device provided in an embodiment of the present application.
[0042] It can be understood that the circuit board chamfer cutting equipment includes a clamping device for clamping the circuit board to be cut, a first cutting knife and a second cutting knife symmetrically arranged, and a parameter acquisition device for acquiring parameters of the circuit board to be cut, wherein, when the circuit board to be cut is clamped in the clamping device, the first cutting knife is located above the circuit board to be cut, and the second cutting knife is located below the circuit board to be cut, so that the first cutting knife and the second cutting knife can cut the upper surface and the lower surface of the circuit board to be cut.
[0043] It should be noted that when a copper layer is provided on the upper surface of the substrate, the first cutting knife can be controlled to perform chamfer cutting on the upper surface of the circuit board to be cut; when a copper layer is provided on the lower surface of the substrate, the second cutting knife can be controlled to perform chamfer cutting on the lower surface of the circuit board to be cut; when copper layers are provided on both the upper and lower surfaces of the substrate, the first cutting knife and the second cutting knife can be controlled to perform chamfer cutting on the upper and lower surfaces of the circuit board to be cut at the same time.
[0044] First, refer to Figure 2 , Figure 2 A flowchart of a circuit board chamfering method provided in an embodiment of the present application is applied to Figure 1 The circuit board chamfering cutting device and the circuit board chamfering cutting method shown include but are not limited to the following steps:
[0045] Step S100, obtaining the thickness of the copper layer, a preset cutting angle and a first distance of the substrate;
[0046] Step S200, determining a safe cutting distance according to the copper layer thickness and the cutting angle;
[0047] Step S300, determining a cutting depth and a cutting distance according to the safe cutting distance and the first distance, and controlling the first cutting knife and / or the second cutting knife to cut the substrate according to the cutting depth and the cutting distance.
[0048] It can be understood that the circuit board to be cut includes a substrate and a copper layer, the substrate includes a first end and a second end, the distance between the first end and the second end is the width of the substrate, one end of the copper layer is flush with the first end, and the distance between the other end of the copper layer and the second end is the first distance, and the cutting knife cuts the second end of the substrate according to a preset cutting angle to form a chamfer. During the cutting process, since the cutting knife cuts according to the preset cutting angle, if the cutting distance is too deep, the cutting knife will contact the copper layer, resulting in damage to the copper layer. Therefore, the safe cutting distance can be determined first according to the thickness of the copper layer and the cutting angle. During the cutting process, the distance between the second end of the substrate and the other end of the copper layer will continue to decrease. When the distance between the second end of the substrate and the other end of the copper layer cut by the cutting knife is greater than the safe cutting distance, the cutting knife will not contact the copper layer. Then, according to the safe cutting distance and the first distance, the cutting depth and cutting distance are determined, and then the first cutting knife and / or the second cutting knife are controlled to cut the substrate according to the cutting depth and cutting distance, which can effectively avoid the situation where the cutting knife cuts the copper layer during the chamfering cutting process.
[0049] It should be noted that when the substrate is only provided with an upper surface copper layer, the first cutting knife is controlled to cut the substrate; when the substrate is only provided with a lower surface copper layer, the second cutting knife is controlled to cut the substrate.
[0050] It should be noted that the safe cutting distance is determined by the following formula: H / tan(a)=L, where H is the thickness of the copper layer, a is the cutting angle, and L is the safe cutting distance.
[0051] Specifically, when the safe cutting distance is greater than the first distance, it means that the cutting knife may touch the copper layer as long as it cuts. Therefore, when the safe cutting distance is greater than the first distance, the substrate cannot be cut any further to avoid damage to the copper layer, and a first alarm signal is issued to remind the user to make timely adjustments. The first alarm signal can also be sent to the user's mobile device based on pre-set user mobile device contact information. The first alarm signal includes but is not limited to text message reminders, telephone voice reminders, etc. The circuit board chamfering cutting equipment can also send the first alarm signal by directly issuing a sound warning signal or an optical prompt signal.
[0052] Specifically, when the cutting depth is greater than the thickness of the substrate, it means that the cutting knife over-cuts, which leads to poor chamfering effect. Therefore, when the cutting depth is greater than the thickness of the substrate, the substrate cannot be cut any further to avoid over-cutting, and a second alarm signal is issued to remind the user to make timely adjustments. The second alarm signal can also be sent to the user's mobile device based on pre-set user mobile device contact information. The second alarm signal includes but is not limited to text message reminders, telephone voice reminders, etc. The circuit board chamfer cutting equipment can also send the second alarm signal by directly issuing a sound warning signal or an optical prompt signal.
[0053] It should be noted that the first alarm signal and the second alarm signal are different alarm signals. For example, the first alarm signal and the second alarm signal are both sound warning signals. The first alarm signal may be a beep, and the second alarm signal may be an intermittent voice prompt (such as: there is a risk of overcutting, etc.).
[0054] Reference Figure 3 , Figure 3 A flowchart of a circuit board chamfering cutting method provided in another embodiment of the present application includes but is not limited to the following steps:
[0055] Step S400, obtaining a first copper layer thickness of the upper surface copper layer and a second copper layer thickness of the lower surface copper layer;
[0056] Step S410, when the first copper layer thickness is greater than or equal to the second copper layer thickness, determining the first copper layer thickness as the copper layer thickness;
[0057] Step S420: when the first copper layer thickness is less than the second copper layer thickness, determine the second copper layer thickness as the copper layer thickness.
[0058] It is understandable that when both the upper and lower surfaces of the substrate are provided with a copper layer, if the safe cutting distance is calculated according to the thickness of the upper copper layer or the lower copper layer, the cutting knife may touch the copper layer on the other surface. Therefore, when the thickness of the first copper layer is greater than or equal to the thickness of the second copper layer, the thickness of the first copper layer is determined as the copper layer thickness; or, when the thickness of the first copper layer is less than the thickness of the second copper layer, the thickness of the second copper layer is determined as the copper layer thickness. That is, the side with the larger copper layer thickness is selected as the copper layer thickness, and the safe cutting distance is calculated to avoid the cutting knife touching the copper layer.
[0059] It should be noted that when the substrate is provided with an upper surface copper layer and a lower surface copper layer, the first cutting knife and the second cutting knife are controlled to cut the substrate simultaneously.
[0060] Reference Figure 4 , Figure 4 for Figure 2 The specific flow chart of step S200 includes but is not limited to the following steps:
[0061] Step S210, obtaining an error value of a circuit board chamfer cutting device;
[0062] Step S220, determining a safe cutting distance according to the error value, the copper layer thickness and the cutting angle.
[0063] It is understandable that due to the cutting accuracy of the circuit board chamfer cutting equipment, the calculated safe cutting distance may deviate from the actual safe cutting distance. Therefore, the safe cutting distance can be determined based on the error value, copper layer thickness and cutting angle to avoid the cutting knife touching the copper layer during the cutting process.
[0064] Specifically, the safe cutting distance can be determined by the following formula Among them, H is the thickness of the copper layer, a is the cutting angle, and L is the safe cutting distance. is the error value.
[0065] Second, refer to Figure 5 The present application embodiment provides an operation control device 500, including a memory 510, a processor 520, and a computer program stored in the memory 510 and executable on the processor 520. The processor 520 executes the program to implement the circuit board chamfering cutting method of the first embodiment, for example, Figure 2 The method steps S100 to S300, Figure 3 Steps S400 to S420 and Figure 4 Step S210 to step S220.
[0066] The memory 510 is a non-transitory computer-readable storage medium that can be used to store non-transitory software programs and non-transitory computer executable programs, such as the circuit board chamfer cutting method in the above embodiment of the present application. The processor 520 implements the circuit board chamfer cutting method in the above embodiment of the present application by running the non-transitory software program and instructions stored in the memory 510.
[0067] The memory 510 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data required to execute the circuit board chamfering cutting method in the above embodiment, etc. In addition, the memory 510 may include a high-speed random access memory 510, and may also include a non-transitory memory 510, such as at least one disk storage device, a flash memory device, or other non-transitory solid-state storage device. It should be noted that the memory 510 may optionally include a memory 510 remotely arranged relative to the processor 520, and these remote memories 510 may be connected to the terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.
[0068] In a third aspect, an embodiment of the present application provides an electronic device, comprising an operation control device 500 as described in the embodiment of the second aspect above.
[0069] In a fourth aspect, the present application provides a computer-readable storage medium, wherein the computer-executable instructions are used to cause a computer to execute the circuit board chamfering cutting method according to the first aspect of the present application, for example, to execute Figure 2 The method steps S100 to S300, Figure 3 Steps S400 to S420 and Figure 4 Step S210 to step S220.
[0070] It will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed methods above may be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium or a non-transitory medium and a communication medium or a temporary medium. As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information such as computer-readable instructions, data structures, program modules or other data. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disk DVD or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that may be used to store desired information and may be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.
[0071] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present application.
Claims
1. A circuit board chamfering cutting method, characterized in that: Applied to a circuit board chamfer cutting device, the circuit board chamfer cutting device comprises a clamping device for clamping a circuit board to be cut, a first cutting knife and a second cutting knife symmetrically arranged, and a parameter acquisition device for acquiring parameters of the circuit board to be cut, the circuit board to be cut comprises a substrate, at least one surface of the substrate is provided with a copper layer, and the circuit board chamfer cutting method comprises: Obtaining the thickness of the copper layer, a preset cutting angle, and a first distance of the substrate; Determining a safe cutting distance according to the copper layer thickness and the cutting angle; Determining a cutting depth and a cutting distance according to the safe cutting distance and the first distance, and controlling the first cutting knife and / or the second cutting knife to cut the substrate according to the cutting depth and the cutting distance; The first distance is the distance between the copper layer and the edge of the substrate.
2. The circuit board chamfering cutting method according to claim 1, characterized in that: The safe cutting distance is determined according to the copper layer thickness and the cutting angle by the following formula: H / tan(a)=L; Wherein, H is the thickness of the copper layer, a is the cutting angle, and L is the safe cutting distance.
3. The circuit board chamfering cutting method according to claim 1, characterized in that: The upper surface of the substrate is provided with an upper surface copper layer, and the lower surface of the substrate is provided with a lower surface copper layer. Before obtaining the thickness of the copper layer, the preset cutting angle, and the first distance between the copper layer and the substrate, the method further includes: Obtaining a first copper layer thickness of the upper surface copper layer and a second copper layer thickness of the lower surface copper layer; When the thickness of the first copper layer is greater than or equal to the thickness of the second copper layer, determining the thickness of the first copper layer as the copper layer thickness; or, When the thickness of the first copper layer is less than the thickness of the second copper layer, the thickness of the second copper layer is determined to be the thickness of the copper layer.
4. The circuit board chamfering cutting method according to claim 1, characterized in that: The circuit board chamfering cutting method further comprises: When the safe cutting distance is greater than the first distance, the first cutting knife and / or the second cutting knife is controlled to stop cutting, and a first alarm signal is issued.
5. The circuit board chamfering cutting method according to claim 1, characterized in that: The circuit board chamfering cutting method further comprises: When the cutting depth is greater than the thickness of the substrate, the first cutting knife and / or the second cutting knife is controlled to stop cutting, and a second alarm signal is issued.
6. The circuit board chamfering cutting method according to claim 1, characterized in that: The step of determining a safe cutting distance according to the copper layer thickness and the cutting angle comprises: Obtaining an error value of the circuit board chamfering cutting device; A safe cutting distance is determined according to the error value, the copper layer thickness and the cutting angle.
7. The circuit board chamfering cutting method according to claim 6, characterized in that: The safe cutting distance is determined according to the error value, the copper layer thickness and the cutting angle by the following formula: Wherein, H is the thickness of the copper layer, a is the cutting angle, and L is the safe cutting distance. is the error value.
8. An operation control device, characterized in that: The invention comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the circuit board chamfer cutting method according to any one of claims 1 to 7 when executing the computer program.
9. A circuit board chamfering cutting device, characterized in that: Comprising the operation control device as claimed in claim 8.
10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the circuit board chamfering cutting method according to any one of claims 1 to 7.