Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel, a manufacturing method thereof and a display device. The display panel comprises a substrate; the at least one inorganic packaging layer is made of an inorganic material, and the inorganic packaging layer is arranged on one side of the substrate; the at least one repair packaging layer is arranged on one side, far away from the substrate, of the at least one inorganic packaging layer, and the repair packaging layer is in contact with the adjacent inorganic packaging layer close to one side of the substrate; materials of the repair packaging layer comprise an inorganic material and an organic material. The reliability of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous development of display technology, organic light-emitting diode (OLED) display devices have been widely used in many fields such as flat panel displays, flexible displays, automotive displays and solid-state lighting due to their advantages such as wide color gamut, high contrast, energy saving and foldability. Summary of the invention

[0003] Based on this, it is necessary to provide a display panel and a manufacturing method thereof, and a display device, aiming to solve the problem of reduced reliability caused by defects in the encapsulation layer of the display panel in the related art.

[0004] In a first aspect, an embodiment of the present application provides a display panel, including:

[0005] substrate;

[0006] at least one inorganic encapsulation layer, the inorganic encapsulation layer is an inorganic material, and the inorganic encapsulation layer is disposed on one side of the substrate;

[0007] At least one repair encapsulation layer, the repair encapsulation layer is arranged on a side of at least one of the inorganic encapsulation layers away from the substrate, and the repair encapsulation layer is in contact with the inorganic encapsulation layer that is close to the substrate and arranged adjacently;

[0008] The material of the repair encapsulation layer includes inorganic material and organic material.

[0009] In a second aspect, an embodiment of the present application further provides a method for manufacturing a display panel, comprising:

[0010] providing a substrate;

[0011] forming at least one inorganic encapsulation layer on one side of the substrate by a vapor deposition process, wherein the inorganic encapsulation layer is an inorganic material;

[0012] At least one repair encapsulation layer is formed on a side of at least one of the inorganic encapsulation layers away from the substrate by a solution method, and the repair encapsulation layer is in contact with the inorganic encapsulation layer adjacent to the substrate, and the material of the repair encapsulation layer includes inorganic material and organic material.

[0013] In a third aspect, an embodiment of the present application further provides a display device, which includes the display panel provided in the first aspect.

[0014] The display panel provided by the embodiment of the present application is provided with a repair encapsulation layer on the side of the inorganic encapsulation layer away from the substrate, and the repair encapsulation layer contacts the inorganic encapsulation layer which is close to the substrate and arranged adjacently; the material of the repair encapsulation layer includes inorganic material and organic material, and in the manufacturing process of the repair encapsulation layer, the material of the repair encapsulation layer can fill the defects such as depressions on the surface of the inorganic encapsulation layer, and the material of the repair encapsulation layer can penetrate into and fill the defects such as cavities inside the inorganic encapsulation layer, thereby repairing the defects of the inorganic encapsulation layer and blocking the diffusion path of water and oxygen, thereby improving the encapsulation performance and reliability of the display panel. At the same time, in the process of forming the repair encapsulation layer (in the curing process), when the repair encapsulation layer repairs the defects of the inorganic encapsulation layer, the material in the repair encapsulation layer can combine with the atoms of the material in the inorganic encapsulation layer, so that the defects are further filled, and the water vapor path can be better blocked, thereby better improving the encapsulation performance and the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 A schematic diagram of a first cross-sectional structure of a display panel provided in some embodiments of the present application;

[0017] Figure 2 A schematic diagram of a second cross-sectional structure of a display panel provided in some embodiments of the present application;

[0018] Figure 3 A schematic diagram of a third cross-sectional structure of a display panel provided in some embodiments of the present application;

[0019] Figure 4 A schematic diagram of a fourth cross-sectional structure of a display panel provided in some embodiments of the present application;

[0020] Figure 5 A schematic diagram of a fifth cross-sectional structure of a display panel provided in some embodiments of the present application;

[0021] Figure 6 A schematic diagram of a sixth cross-sectional structure of a display panel provided in some embodiments of the present application;

[0022] Figure 7 A schematic diagram of a first process step of a method for manufacturing a display panel provided in some embodiments of the present application;

[0023] Figure 8 A schematic diagram of a second process step of a method for manufacturing a display panel provided in some embodiments of the present application;

[0024] Fig. 9 A schematic diagram of a third process step of a method for manufacturing a display panel provided in some embodiments of the present application;

[0025] Fig.10 A schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application;

[0026] Fig.11 A schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application;

[0027] Fig.12 A schematic diagram of a display device provided in some embodiments of the present application.

[0028] Description of reference numerals:

[0029] Display panel 100; display device 200; substrate 10;

[0030] Inorganic encapsulation layer 20; first inorganic encapsulation layer 201; second inorganic encapsulation layer 202; third inorganic encapsulation layer 203;

[0031] Repair packaging layer 30; first repair packaging layer 301; second repair packaging layer 302; third repair packaging layer 303;

[0032] Organic encapsulation layer 40; first organic encapsulation layer 401; second organic encapsulation layer 402;

[0033] Recess 20 a ; first surface 30 a ; first sub-portion 20 b ; first thickness d1 ; second thickness d2 ; third thickness d3 ; touch layer 50 . DETAILED DESCRIPTION

[0034] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0036] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there may be intervening elements. Further, when a layer is referred to as being "under" another layer, it can be directly under or there may be one or more intervening elements. It is also understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there may be one or more intervening elements.

[0037] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0038] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.

[0039] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" can mean within one or more standard deviations, which are not limited here.

[0040] Furthermore, in the specification, the phrase “planar distribution schematic diagram” refers to a drawing when a target portion is viewed from above, and the phrase “cross-sectional schematic diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0041] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0042] As described in the background technology section, the packaging layer of the display panel in the related art has defects, resulting in reduced reliability. The inventors found that the reason for the above phenomenon is that although the packaging structure of the display panel in the related art can block water and oxygen to a certain extent, it still has certain shortcomings. There are defects on the surface or inside of the inorganic packaging layer, and the water and oxygen barrier capacity has certain limitations, resulting in reduced reliability of the display panel. In certain cases, it cannot meet commercial needs, especially for medium and large-sized display panels, which have higher packaging performance requirements and the existing packaging structure cannot meet the needs.

[0043] Based on the above technical problems, the inventors have found that by setting a repair encapsulation layer on the side of the inorganic encapsulation layer away from the substrate, the encapsulation performance and reliability of the display panel can be improved. Based on this, the inventors have further studied the technical solution of the embodiment of the present application. Specifically, the display panel provided by the embodiment of the present application includes a substrate, at least one inorganic encapsulation layer and at least one repair encapsulation layer, the inorganic encapsulation layer is an inorganic material, and the inorganic encapsulation layer is arranged on one side of the substrate; the repair encapsulation layer is arranged on the side of at least one inorganic encapsulation layer away from the substrate, and the repair encapsulation layer is in contact with the inorganic encapsulation layer close to the side of the substrate and arranged adjacently; the material of the repair encapsulation layer includes inorganic materials and organic materials. By adopting the above technical solution, a repair encapsulation layer is arranged on the side of the inorganic encapsulation layer away from the substrate, and the repair encapsulation layer contacts the inorganic encapsulation layer close to the substrate and arranged adjacently. The material of the repair encapsulation layer includes inorganic material and organic material. The material in the repair encapsulation layer can fill defects such as depressions on the surface of the inorganic encapsulation layer. The material in the repair encapsulation layer can penetrate into defects such as voids inside the inorganic encapsulation layer to repair the defects in the inorganic encapsulation layer, fill and block the water and oxygen diffusion path, and enhance the water and oxygen blocking capacity of the display panel. Thus, the reliability of the display panel can be improved.

[0044] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be described clearly and completely below in conjunction with the drawings in the embodiments of this application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0045] See also Figures 1 to 6 , Figure 1 A schematic diagram of a first cross-sectional structure of a display panel provided in some embodiments of the present application; Figure 2 A schematic diagram of a second cross-sectional structure of a display panel provided in some embodiments of the present application; Figure 3 A schematic diagram of a third cross-sectional structure of a display panel provided in some embodiments of the present application; Figure 4 A schematic diagram of a fourth cross-sectional structure of a display panel provided in some embodiments of the present application; Figure 5 A schematic diagram of a fifth cross-sectional structure of a display panel provided in some embodiments of the present application; Figure 6 A schematic diagram of a sixth cross-sectional structure of a display panel provided in some embodiments of the present application.

[0046] First, see Figures 1 to 6The present application provides a display panel 100, which includes a substrate 10, at least one inorganic encapsulation layer 20 and at least one repair encapsulation layer 30; the inorganic encapsulation layer 20 is an inorganic material, and the inorganic encapsulation layer 20 is arranged on one side of the substrate 10; the repair encapsulation layer 30 is arranged on a side of at least one inorganic encapsulation layer 20 away from the substrate 10, and the repair encapsulation layer 30 is in contact with the inorganic encapsulation layer 20 close to the side of the substrate 10 and arranged adjacently; the material of the repair encapsulation layer 30 includes inorganic materials and organic materials.

[0047] For example, the substrate 10 may be a glass substrate or a flexible substrate. For example, the material of the substrate 10 includes polyimide, which is not limited here.

[0048] By way of example, the display panel 100 may include an array composite film layer and a plurality of light-emitting devices located between the substrate 10 and the packaging structure / packaging layer. The display panel 100 may include an array composite film layer located between the substrate 10 and the inorganic packaging layer 20 closest to the substrate 10. The array composite film layer may include a plurality of driving circuits and a plurality of driving traces.

[0049] For example, in some embodiments, Figure 1 and Figure 2 As shown, the display panel 100 may include an inorganic encapsulation layer 20 and a repair encapsulation layer 30 . The repair encapsulation layer 30 is disposed on a side of the inorganic encapsulation layer 20 away from the substrate 10 , and the repair encapsulation layer 30 contacts the inorganic encapsulation layer 20 .

[0050] For example, in some other embodiments, Figures 3 to 6 As shown, the display panel 100 may include at least one inorganic encapsulation layer 20 and at least one repair encapsulation layer 30, that is, the display panel 100 may include two or more inorganic encapsulation layers 20, and the display panel 100 may include two or more repair encapsulation layers 30. By way of example, the display panel 100 may also include other film layers, such as at least one organic encapsulation layer 40.

[0051] For example, in some embodiments, the inorganic encapsulation layer 20 can be manufactured using a chemical vapor deposition (CVD) process. The inorganic encapsulation layer 20 has excellent barrier properties against water vapor and oxygen. However, the surface of the inorganic encapsulation layer may have defects such as depressions, and the interior of the inorganic encapsulation layer may easily have defects such as voids. These defects will form channels for water vapor and oxygen to invade the display panel, thereby reducing the water and oxygen barrier capacity of the encapsulation layer / encapsulation structure and reducing the reliability of the display panel.

[0052] For example, in some other embodiments, the inorganic encapsulation layer 20 may be formed by other methods other than the solution method, such as forming the inorganic encapsulation layer 20 by a sputtering process.

[0053] By way of example, the material of the inorganic encapsulation layer 20 may include at least one of silicon nitride, silicon oxide, aluminum oxide, titanium oxide, zinc oxide, tin oxide, and zinc tin oxide.

[0054] For example, in some embodiments, the material of the repair encapsulation layer 30 includes an inorganic material and an organic material. The repair encapsulation layer 30 can be manufactured using a solution process, such as a printing process, a spin coating process, a printing process, or a spraying process. During the manufacturing process of the repair encapsulation layer 30, the material of the repair encapsulation layer 30 can fill defects such as depressions on the surface of the inorganic encapsulation layer, and the material of the repair encapsulation layer 30 can penetrate into and fill defects such as voids inside the inorganic encapsulation layer, thereby repairing the defects of the inorganic encapsulation layer 20 and blocking the diffusion path of water and oxygen, thereby improving the reliability of the display panel.

[0055] In summary, in the embodiment of the present application, by setting a repair encapsulation layer on the side of the inorganic encapsulation layer away from the substrate, the repair encapsulation layer 30 contacts the inorganic encapsulation layer 20 which is close to the substrate 10 and is adjacent to the repair encapsulation layer 30; the material of the repair encapsulation layer 30 includes inorganic materials and organic materials. During the manufacturing process of the repair encapsulation layer 30, the material of the repair encapsulation layer 30 can fill the defects such as depressions on the surface of the inorganic encapsulation layer, and the material of the repair encapsulation layer 30 can penetrate and fill the defects such as cavities inside the inorganic encapsulation layer 20, thereby repairing the defects of the inorganic encapsulation layer 20 and blocking the diffusion path of water and oxygen, thereby improving the encapsulation performance and reliability of the display panel. At the same time, during the formation process of the repair encapsulation layer 30 (during the curing process), when the repair encapsulation layer 30 repairs the defects of the inorganic encapsulation layer 20, the material in the repair encapsulation layer 30 can be combined with the atoms of the material in the inorganic encapsulation layer 20, so that the defects are further filled, and the water vapor path can be better blocked, thereby better improving the encapsulation performance and the reliability of the display panel.

[0056] In some embodiments, Figure 1 As shown, at least one inorganic encapsulation layer 20 includes at least one recess 20 a , at least one repair encapsulation layer 30 fills the recess 20 a , and a surface of the repair encapsulation layer 30 away from the recess 20 a is a flat surface.

[0057] For example, Figure 1 As shown, the surface of the inorganic encapsulation layer 20 is prone to defects such as depressions 20a, and the repair encapsulation layer 30 fills the depressions 20a and keeps the surface of the repair encapsulation layer 30 away from the depressions 20a (the first surface 30a) as a flat surface, as shown in FIG. Figure 1The first surface 30a shown is a flat surface, and the surface of the repair encapsulation layer 30 away from the substrate 10 is not prone to defects. The material of the repair encapsulation layer 30 can fill defects such as the depression 20a on the surface of the inorganic encapsulation layer, thereby repairing the depression 20a of the inorganic encapsulation layer 20 and blocking the diffusion path of water and oxygen, thereby improving the reliability of the display panel.

[0058] In some embodiments, Figure 1 As shown, the display panel 100 further includes at least one first sub-portion 20 b , at least part of which is located inside the inorganic encapsulation layer 20 , and the material of the first sub-portion 20 b is the same as that of the repair encapsulation layer 30 .

[0059] For example, part of the first sub-portion 20b is located inside the inorganic encapsulation layer 20, or the entire first sub-portion 20b is located inside the inorganic encapsulation layer 20. After the repair encapsulation layer 30 penetrates and fills defects such as voids inside the inorganic encapsulation layer, the first sub-portion 20b is formed. The material of the first sub-portion 20b is the same as that of the repair encapsulation layer 30.

[0060] For example, Figure 1 As shown, defects such as voids are easily present inside the inorganic encapsulation layer 20, and the material of the repair encapsulation layer 30 can penetrate into and fill the voids and other defects inside the inorganic encapsulation layer 20, forming a first sub-portion 20b. The material of the first sub-portion 20b is the same as that of the repair encapsulation layer 30, thereby repairing the defects of the inorganic encapsulation layer 20 and blocking the diffusion path of water and oxygen, thereby improving the reliability of the display panel.

[0061] In some embodiments, the inorganic material in the repair encapsulation layer 30 includes at least one of silicon nitride, silicon oxide, aluminum oxide, titanium oxide, zinc oxide, tin oxide, and zinc tin oxide.

[0062] For example, silicon nitride, silicon oxide, aluminum oxide, titanium oxide, zinc oxide, tin oxide and zinc tin oxide have excellent water and oxygen barrier capabilities, which can improve the water and oxygen barrier capabilities of the repaired parts (the repaired recess 20a and the first sub-portion 20b) in the inorganic encapsulation layer 20. At the same time, the repaired encapsulation layer 30 also has a certain water and oxygen barrier capability.

[0063] In some embodiments, the organic material in the repair encapsulation layer 30 includes at least one of pure hydrocarbons, hexamethylcyclotrisilazane, cyclopentasiloxane, dibutyl ether, toluene, and xylene.

[0064] For example, the repair encapsulation layer 30 is formed by a solution method, and the solution used in the solution method includes at least one of a precursor solution of perhydropolysilazane, a precursor solution of aluminum oxide, a precursor solution of titanium oxide, a precursor solution of zinc oxide, a precursor solution of tin oxide, and a precursor solution of zinc tin oxide. After removing the solvent and / or curing, the organic material in the repair encapsulation layer 30 includes at least one of pure hydrocarbon, hexamethylcyclotrisilazane, cyclopentasiloxane, dibutyl ether, toluene and xylene.

[0065] For example, when the solution used in the solution method is a precursor solution of perhydropolysilazane, the precursor solution includes at least one of a pure hydrocarbon solvent, hexamethylcyclotrisilazane, cyclopentasiloxane, dibutyl ether, toluene and xylene.

[0066] For example, when the solution used in the solution method is a precursor solution of aluminum oxide, the precursor solution includes a polymer aluminum hexaoxide complex.

[0067] For example, when the solution used in the solution method is a precursor solution of zinc tin oxide, the precursor solution includes at least one of zinc acetate dihydrate, anhydrous zinc acetate and tin 2-ethylhexanoate.

[0068] In some embodiments, the inorganic material in at least one repair encapsulation layer 30 is the same as the material of at least one inorganic encapsulation layer 20; in the repair encapsulation layer 30 and the inorganic encapsulation layer 20 having the same inorganic material, the refractive index of the repair encapsulation layer 30 is less than the refractive index of the inorganic encapsulation layer 20.

[0069] For example, the inorganic material in the repair encapsulation layer 30 is the same as the material of the inorganic encapsulation layer 20. The repair encapsulation layer 30 is in contact with the inorganic encapsulation layer 20, which can enhance the adhesion or film layer bonding strength between the repair encapsulation layer 30 and the inorganic encapsulation layer 20 and prevent peeling between the film layers.

[0070] For example, in some embodiments, the inorganic encapsulation layer 20 can be manufactured using a chemical vapor deposition (CVD) process, and the repair encapsulation layer 30 can be manufactured using a solution process. Compared with the repair encapsulation layer 30, the inorganic material in the inorganic encapsulation layer 20 is denser. When the inorganic material in the repair encapsulation layer 30 is the same as that of the inorganic encapsulation layer 20, the refractive index of the repair encapsulation layer 30 is less than that of the inorganic encapsulation layer 20.

[0071] In some embodiments, the refractive index of the repair encapsulation layer 30 is 1.6 to 2; in some embodiments, the refractive index of the inorganic encapsulation layer 20 is 1.5 to 1.9.

[0072] For example, the refractive index of the repair encapsulation layer 30 is 1.6 to 2, for example, the refractive index of the repair encapsulation layer 30 is any one of 1.6, 1.7, 1.8, 1.9 and 2.

[0073] For example, the refractive index of the inorganic encapsulation layer 20 is 1.5 to 1.9, for example, the refractive index of the inorganic encapsulation layer 20 is any one of 1.5, 1.6, 1.7, 1.8 and 1.9.

[0074] For example, the refractive index difference between the inorganic encapsulation layer 20 and the organic encapsulation layer 40 is relatively large, and the light emitted by the display panel 100 is easily reflected at the interface between the inorganic encapsulation layer 20 and the organic encapsulation layer 40, resulting in a decrease in light extraction efficiency. The repair encapsulation layer 30 is set to have a suitable refractive index, and the repair encapsulation layer 30 plays a role of refractive index transition between the inorganic encapsulation layer 20 and the organic encapsulation layer 40 (for example, the refractive index of the repair encapsulation layer 30 is between the inorganic encapsulation layer 20 and the organic encapsulation layer 40; for example, the refractive index of the repair encapsulation layer 30 is less than the refractive index of the inorganic encapsulation layer 20, and the refractive index of the repair encapsulation layer 30 is greater than the refractive index of the organic encapsulation layer). The repair encapsulation layer 30 can further reduce the refractive index gradient difference between the inorganic encapsulation layer 20 and the organic encapsulation layer 40, thereby improving the light extraction efficiency of the display panel.

[0075] In some embodiments, the thickness of the repair encapsulation layer 30 is less than the thickness of the inorganic encapsulation layer 20 .

[0076] For example, in some embodiments, the inorganic encapsulation layer 20 has excellent water and oxygen barrier capabilities, and the function of the repair encapsulation layer 30 is to repair defects in the inorganic encapsulation layer 20 and block water and oxygen intrusion channels formed by the defects in the inorganic encapsulation layer 20. Therefore, the thickness of the repair encapsulation layer 30 is less than the thickness of the inorganic encapsulation layer 20, so that the inorganic encapsulation layer 20 can be repaired, while preventing the thickness of the encapsulation layer / encapsulation structure from being too large.

[0077] For example, as shown in FIG4 , the thickness of the repair encapsulation layer 30 is a first thickness d1 , and the thickness of the inorganic encapsulation layer 20 is a second thickness d2 , and the first thickness d1 is less than the second thickness d2 .

[0078] In some embodiments, the ratio of the thickness of the repair encapsulation layer 30 to the thickness of the inorganic encapsulation layer 20 is 0.1 to 0.2.

[0079] For example, the ratio of the first thickness d1 to the second thickness d2 is in the range of 0.1 to 0.2. For example, the ratio of the first thickness d1 to the second thickness d2 is any one of 0.1, 0.12, 0.14, 0.15, 0.17, 0.19 and 0.2.

[0080] For example, by setting a suitable ratio of the first thickness d1 to the second thickness d2, the repair encapsulation layer 30 can repair the inorganic encapsulation layer 20 while preventing the encapsulation layer / encapsulation structure from being too thick.

[0081] In some embodiments, the repair encapsulation layer 30 has a thickness of 10 nanometers to 300 nanometers.

[0082] Illustratively, the first thickness d1 is any one of 10 nanometers, 50 nanometers, 100 nanometers, 150 nanometers, 200 nanometers, 250 nanometers and 300 nanometers.

[0083] For example, the inventors have verified that when the thickness of the repair encapsulation layer 30 is 10 nanometers to 300 nanometers, the repair encapsulation layer 30 can repair the inorganic encapsulation layer 20 while preventing the encapsulation layer / encapsulation structure from being too thick.

[0084] In some embodiments, the inorganic material in at least one repair encapsulation layer 30 is the same as the material of the inorganic encapsulation layer 20 located on a side of the repair encapsulation layer 30 close to the substrate 10 and adjacent to the repair encapsulation layer 30 .

[0085] For example, the display panel 100 may include one or more repair encapsulation layers 30, and the display panel 100 may include one or more inorganic encapsulation layers 20, at least one repair encapsulation layer 30 is in contact with the inorganic encapsulation layer 20, and the inorganic encapsulation layer 20 is located on the side of the repair encapsulation layer 30 close to the substrate 10, and the repair encapsulation layer 30 and the inorganic encapsulation layer 20 include the same inorganic material; on the one hand, after the inorganic material in the repair encapsulation layer 30 fills or penetrates into the interior of the inorganic encapsulation layer 20 through organic material, a denser repair structure can be formed, which can improve the water and oxygen barrier capability; on the other hand, the adhesion between the repair encapsulation layer 30 and the inorganic encapsulation layer 20 and the film layer bonding strength can be improved, which can prevent the occurrence of peeling between the film layers.

[0086] In some embodiments, Figure 3 and Figure 4 As shown, the display panel 100 includes a plurality of inorganic encapsulation layers 20, the plurality of inorganic encapsulation layers 20 include a first inorganic encapsulation layer 201 and a second inorganic encapsulation layer 202, and the display panel 100 also includes a first organic encapsulation layer 401; the first organic encapsulation layer 401 is arranged on a side of the first inorganic encapsulation layer 201 away from the substrate 10, and the second inorganic encapsulation layer 202 is arranged on a side of the first organic encapsulation layer 401 away from the substrate 10; at least one repair encapsulation layer 30 includes a first repair encapsulation layer 301, and the first repair encapsulation layer 301 is arranged between the first inorganic encapsulation layer 201 and the first organic encapsulation layer 401, or on a side of the second inorganic encapsulation layer 202 away from the substrate 10.

[0087] For example, the organic encapsulation layer 40 may include an acrylic or epoxy polymer, which may be prepared by coating, spin coating, and the like, which is merely an example and is not intended to be limiting.

[0088] For example, in some embodiments, Figure 3 As shown, the first repair encapsulation layer 301 is arranged between the first inorganic encapsulation layer 201 and the first organic encapsulation layer 401; on one side of the substrate 10, the first inorganic encapsulation layer 201, the first repair encapsulation layer 301, the first organic encapsulation layer 401 and the second inorganic encapsulation layer 202 are stacked in sequence, the first repair encapsulation layer 301 is in contact with the first inorganic encapsulation layer 201, and the first repair encapsulation layer 301 is used to repair defects in the first inorganic encapsulation layer 201.

[0089] For example, in some embodiments, Figure 4 As shown, the first repair encapsulation layer 301 is arranged on the side of the second inorganic encapsulation layer 202 away from the substrate 10; on one side of the substrate 10, the first inorganic encapsulation layer 201, the first organic encapsulation layer 401, the second inorganic encapsulation layer 202 and the first repair encapsulation layer 301 are stacked in sequence, the first repair encapsulation layer 301 is in contact with the second inorganic encapsulation layer 202, and the first repair encapsulation layer 301 is used to repair defects in the second inorganic encapsulation layer 202.

[0090] For example, in Figure 3 and Figure 4 In the example, the display panel 100 includes an inorganic encapsulation layer 20 and an organic encapsulation layer 40 that are alternately arranged. The first repair encapsulation layer 301 repairs defects in the first inorganic encapsulation layer 201 or the second inorganic encapsulation layer 202, which can improve the water and oxygen barrier capability, improve the encapsulation performance, and improve the reliability of the display panel.

[0091] In some embodiments, the thickness of the repair encapsulation layer 30 is smaller than the thickness of the inorganic encapsulation layer 20 and / or the thickness of the first organic encapsulation layer 401 .

[0092] For example, Figure 4 As shown, the thickness of the first organic encapsulation layer 401 or the organic encapsulation layer 40 is a third thickness d3.

[0093] For example, in some embodiments, the thickness of the repair encapsulation layer 30 is less than the thickness of the inorganic encapsulation layer 20, that is, the first thickness d1 is less than the second thickness d2.

[0094] For example, in some embodiments, the thickness of the repair encapsulation layer 30 is less than the thickness of the organic encapsulation layer 40, that is, the first thickness d1 is less than the third thickness d3.

[0095] For example, in some embodiments, the thickness of the repair encapsulation layer 30 is less than that of the inorganic encapsulation layer 20, and the thickness of the inorganic encapsulation layer 20 is less than that of the organic encapsulation layer 40, that is, the first thickness d1 is less than the second thickness d2, and the second thickness d2 is less than the third thickness d3.

[0096] For example, when the thickness of the repair encapsulation layer 30 is a suitable value compared with the inorganic encapsulation layer 20 and / or the organic encapsulation layer 40, on the one hand, the adhesion between the repair encapsulation layer 30 and the adjacent film layer can be enhanced. For example, the inorganic material in the repair encapsulation layer 30 includes silicon, which is convenient for the Si-H bond to form a hydrogen bond with the -OH bond in the organic encapsulation layer 40, thereby enhancing the adhesion. On the other hand, the refractive index difference between the inorganic encapsulation layer 20 and the organic encapsulation layer 40 is relatively large, and the light emitted by the display panel 100 is easily absorbed at the interface between the inorganic encapsulation layer 20 and the organic encapsulation layer 40. Reflection results in a decrease in light extraction efficiency. The repair encapsulation layer 30 plays a role of refractive index transition between the inorganic encapsulation layer 20 and the organic encapsulation layer 40 (for example, the refractive index of the repair encapsulation layer 30 is between the inorganic encapsulation layer 20 and the organic encapsulation layer 40; for example, the refractive index of the repair encapsulation layer 30 is less than the refractive index of the inorganic encapsulation layer 20, and the refractive index of the repair encapsulation layer 30 is greater than the refractive index of the organic encapsulation layer). The repair encapsulation layer 30 can further reduce the refractive index gradient difference between the inorganic encapsulation layer 20 and the organic encapsulation layer 40, thereby improving the light extraction efficiency of the display panel.

[0097] In some embodiments, Figure 5 As shown, the display panel 100 includes a plurality of repair encapsulation layers 30, and the plurality of repair encapsulation layers 30 include a first repair encapsulation layer 301 and a second repair encapsulation layer 302; one of the first repair encapsulation layer 301 and the second repair encapsulation layer 302 is disposed between the first inorganic encapsulation layer 201 and the first organic encapsulation layer 401, and the other of the first repair encapsulation layer 301 and the second repair encapsulation layer 302 is disposed on a side of the second inorganic encapsulation layer 202 away from the substrate 10.

[0098] For example, in some embodiments, Figure 5 As shown, the first repair encapsulation layer 301 is arranged on the side of the first inorganic encapsulation layer 201 away from the substrate 10, and the second repair encapsulation layer 302 is arranged on the side of the second inorganic encapsulation layer 202 away from the substrate 10; on one side of the substrate 10, the first inorganic encapsulation layer 201, the first repair encapsulation layer 301, the first organic encapsulation layer 401, the second inorganic encapsulation layer 202 and the second repair encapsulation layer 302 are stacked in sequence; the first repair encapsulation layer 301 is in contact with the first inorganic encapsulation layer 201, and the first repair encapsulation layer 301 is used to repair defects in the first inorganic encapsulation layer 201, and the second repair encapsulation layer 302 is in contact with the second inorganic encapsulation layer 202, and the second repair encapsulation layer 302 is used to repair defects in the second inorganic encapsulation layer 202.

[0099] For example, in Figure 5 In the example, the display panel 100 includes an inorganic encapsulation layer 20 and an organic encapsulation layer 40 that are alternately arranged. A plurality of repair encapsulation layers 30 are arranged to respectively repair the plurality of inorganic encapsulation layers 20 , which can improve the water and oxygen barrier capabilities of the plurality of inorganic encapsulation layers 20 . Therefore, the encapsulation performance can be better improved, and the reliability of the display panel can be better improved.

[0100] For example, Figure 6 As shown, it is illustrated that the plurality of inorganic encapsulation layers 20 include a first inorganic encapsulation layer 201, a second inorganic encapsulation layer 202, and a third inorganic encapsulation layer 203, the plurality of repair encapsulation layers 30 include a first repair encapsulation layer 301, a second repair encapsulation layer 302, and a third repair encapsulation layer 303, and the plurality of organic encapsulation layers 40 include a first organic encapsulation layer 401 and a second organic encapsulation layer 402. On one side of the substrate 10, the first inorganic encapsulation layer 201, the first repair encapsulation layer 301, the first organic encapsulation layer 401, the second inorganic encapsulation layer 202, the second repair encapsulation layer 302, the second organic encapsulation layer 402, the third inorganic encapsulation layer 203, and the third repair encapsulation layer 303 are sequentially stacked.

[0101] For example, in some embodiments, Figures 2 to 6 As shown, the display panel 100 may further include other film layers or structures. For example, the display panel 100 may further include a touch layer 50 or a polarizer located on a side of the encapsulation layer away from the substrate 10 .

[0102] See also Figures 7 to 11 , Figure 7 A schematic diagram of a first process step of a method for manufacturing a display panel provided in some embodiments of the present application; Figure 8 A schematic diagram of a second process step of a method for manufacturing a display panel provided in some embodiments of the present application; Fig. 9 A schematic diagram of a third process step of a method for manufacturing a display panel provided in some embodiments of the present application; Fig.10 A schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application; Fig.11 A schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application.

[0103] In a second aspect, the present application further provides a method for manufacturing a display panel, and any of the display panels 100 described above can be manufactured using the method for manufacturing a display panel. The method for manufacturing a display panel includes: step S100, step S200, and step S300.

[0104] In step S100 , a substrate 10 is provided.

[0105] Step S200 , forming at least one inorganic encapsulation layer 20 on one side of the substrate 10 by a vapor deposition process, wherein the inorganic encapsulation layer 20 is an inorganic material.

[0106] For example, the inorganic encapsulation layer 20 formed by the vapor deposition process has good water and oxygen barrier capabilities.

[0107] By way of example, the material of the inorganic encapsulation layer 20 may include at least one of silicon nitride, silicon oxide, aluminum oxide, titanium oxide, zinc oxide, tin oxide, and zinc tin oxide.

[0108] For example, Fig.10 As shown, the surface of the inorganic encapsulation layer 20 may have defects such as depressions 20a, and the interior of the inorganic encapsulation layer 20 may easily have defects such as voids. These defects may form channels for water vapor and oxygen to invade the display panel, thereby reducing the water and oxygen barrier capacity of the encapsulation layer / encapsulation structure and reducing the reliability of the display panel.

[0109] In step S300, at least one repair encapsulation layer 30 is formed on a side of at least one inorganic encapsulation layer 20 away from the substrate 10 by a solution method. The repair encapsulation layer 30 is in contact with the inorganic encapsulation layer 20 which is adjacent to the substrate 10. The material of the repair encapsulation layer 30 includes inorganic material and organic material.

[0110] For example, Fig.11 As shown, when the precursor film layer of the repair encapsulation layer 30 is formed by the solution method, the precursor film layer includes organic materials and inorganic materials. The organic material can drive the inorganic material to fill defects such as the depression 20a, and the organic material can drive the inorganic material to penetrate into defects such as the void. Therefore, the repair encapsulation layer 30 formed by the solution method can fill defects such as the depression on the surface of the inorganic encapsulation layer, and the material in the repair encapsulation layer can penetrate into defects such as the void inside the inorganic encapsulation layer to repair the defects in the inorganic encapsulation layer, fill and block the water and oxygen diffusion path, thereby improving the water and oxygen blocking ability of the display panel, thereby improving the reliability of the display panel.

[0111] In the manufacturing method of the display panel of the embodiment of the present application, by setting a repair encapsulation layer 30 on the side of the inorganic encapsulation layer 20 away from the substrate, the repair encapsulation layer 30 contacts the inorganic encapsulation layer 20 which is close to the substrate 10 and is adjacent to the inorganic encapsulation layer 20; the material of the repair encapsulation layer 30 includes inorganic materials and organic materials. In the manufacturing process of the repair encapsulation layer 30, the repair encapsulation layer 30 is formed by a solution method, and the material of the repair encapsulation layer 30 can fill the defects such as depressions on the surface of the inorganic encapsulation layer, and the material of the repair encapsulation layer 30 can penetrate and fill the defects such as cavities inside the inorganic encapsulation layer 20, thereby repairing the defects of the inorganic encapsulation layer 20 and blocking the diffusion path of water and oxygen, thereby improving the encapsulation performance and reliability of the display panel. At the same time, in the formation process of the repair encapsulation layer 30 (curing process), when the repair encapsulation layer 30 repairs the defects of the inorganic encapsulation layer 20, the material in the repair encapsulation layer 30 can be combined with the atoms of the material in the inorganic encapsulation layer 20, so that the defects are further filled, and the water vapor path can be better blocked, thereby better improving the encapsulation performance and the reliability of the display panel.

[0112] In some embodiments, the solution used in the solution method includes at least one of a precursor solution of perhydropolysilazane, a precursor solution of aluminum oxide, a precursor solution of titanium oxide, a precursor solution of zinc oxide, a precursor solution of tin oxide, and a precursor solution of zinc-tin oxide.

[0113] For example, silicon nitride, silicon oxide, aluminum oxide, titanium oxide, zinc oxide, tin oxide and zinc tin oxide have excellent water and oxygen barrier capabilities, which can improve the water and oxygen barrier capabilities of the repaired parts (the repaired recess 20a and the first sub-portion 20b) in the inorganic encapsulation layer 20. At the same time, the repaired encapsulation layer 30 also has a certain water and oxygen barrier capability.

[0114] In some embodiments, when the solution used in the solution method is a precursor solution of perhydropolysilazane, the precursor solution includes at least one of a pure hydrocarbon solvent, hexamethylcyclotrisilazane, cyclopentasiloxane, dibutyl ether, toluene and xylene;

[0115] And / or, when the solution used in the solution method is a precursor solution of aluminum oxide, the precursor solution includes a polymer aluminum hexaoxide complex;

[0116] And / or, when the solution used in the solution method is a precursor solution of zinc tin oxide, the precursor solution includes at least one of zinc acetate dihydrate, anhydrous zinc acetate and tin 2-ethylhexanoate.

[0117] In some embodiments, Figure 8As shown, at least one repair encapsulation layer 30 is formed on a side of at least one inorganic encapsulation layer 20 away from the substrate 10 by a solution method, including: S300a, forming a precursor film layer of a precursor solution of the repair encapsulation layer 30; S300b, removing at least part of the solvent in the precursor film layer; S300c, curing the precursor film layer by at least one of heating and UV curing.

[0118] For example, Fig. 9 As shown, after the precursor film layer of the precursor solution of the repair encapsulation layer 30 is formed, the solvent can be removed by drying under reduced pressure, and then cured by ultraviolet irradiation or / and heating to form the repair encapsulation layer 30.

[0119] For example, during the curing process of the repair encapsulation layer 30, when the repair encapsulation layer 30 repairs the defects of the inorganic encapsulation layer 20, the material in the repair encapsulation layer 30 can combine with the atoms of the material in the inorganic encapsulation layer 20, so that the defects are further filled and the water vapor path can be better blocked, thereby better improving the encapsulation performance and the reliability of the display panel.

[0120] For example, the irradiation intensity of the UV radiation may be 20 to 85 mW / cm 2 , the irradiation time is 1 to 10 minutes.

[0121] See also Fig.12 , Fig.12 A schematic diagram of a display device provided in some embodiments of the present application.

[0122] On the third aspect, based on the same application concept, the present application also provides a display device 200, the display device 200 includes any one of the display panels 100 described above, or the display device 200 includes a display panel 100 that combines any several of the features described above.

[0123] For example, the display device 200 also has the beneficial effects of the display panel 100 in the above embodiment. The similarities can be understood by referring to the above explanation of the display panel 100 and will not be described in detail below.

[0124] For example, the display device 200 provided in the embodiment of the present application can be Fig.12 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, industrial control equipment, medical display screens, touch interactive terminals, etc. The embodiments of the present application do not specifically limit this.

[0125] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0126] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: substrate; at least one inorganic encapsulation layer, the inorganic encapsulation layer is an inorganic material, and the inorganic encapsulation layer is disposed on one side of the substrate; At least one repair encapsulation layer, the repair encapsulation layer is arranged on a side of at least one of the inorganic encapsulation layers away from the substrate, and the repair encapsulation layer is in contact with the inorganic encapsulation layer that is close to the substrate and arranged adjacently; The material of the repair encapsulation layer includes inorganic material and organic material.

2. The display panel according to claim 1, characterized in that: At least one of the inorganic encapsulation layers comprises at least one recess, at least one of the repair encapsulation layers fills the recess, and a surface of the repair encapsulation layer away from the recess is a flat surface.

3. The display panel according to claim 1, characterized in that: The display panel further includes at least one first sub-portion, at least a portion of the first sub-portion is located inside the inorganic encapsulation layer, and the material of the first sub-portion is the same as that of the repair encapsulation layer.

4. The display panel according to claim 1, characterized in that: The inorganic material in the repair encapsulation layer includes at least one of silicon nitride, silicon oxide, aluminum oxide, titanium oxide, zinc oxide, tin oxide and zinc tin oxide.

5. The display panel according to claim 1, characterized in that: The organic material in the repair encapsulation layer includes at least one of pure hydrocarbon, hexamethylcyclotrisilazane, cyclopentasiloxane, dibutyl ether, toluene and xylene.

6. The display panel according to claim 1, characterized in that: The inorganic material in at least one of the repair encapsulation layers is the same as the material of at least one of the inorganic encapsulation layers; In the repair encapsulation layer and the inorganic encapsulation layer having the same inorganic material, a refractive index of the repair encapsulation layer is smaller than a refractive index of the inorganic encapsulation layer.

7. The display panel according to claim 1, characterized in that: The refractive index of the repair encapsulation layer is 1.6 to 2; And / or, the refractive index of the inorganic encapsulation layer is 1.5 to 1.

9.

8. The display panel according to claim 1, characterized in that: The thickness of the repair encapsulation layer is smaller than the thickness of the inorganic encapsulation layer.

9. The display panel according to claim 1, characterized in that: The ratio of the thickness of the repair encapsulation layer to the thickness of the inorganic encapsulation layer is 0.1 to 0.

2.

10. The display panel according to claim 1, characterized in that: The thickness of the repair encapsulation layer is 10 nanometers to 300 nanometers.

11. The display panel according to claim 1, characterized in that: The inorganic material in at least one of the repair encapsulation layers is the same as the material of the inorganic encapsulation layer located on a side of the repair encapsulation layer close to the substrate and adjacent to the repair encapsulation layer.

12. The display panel according to claim 1, characterized in that: The display panel includes a plurality of the inorganic encapsulation layers, the plurality of the inorganic encapsulation layers include a first inorganic encapsulation layer and a second inorganic encapsulation layer, and the display panel further includes a first organic encapsulation layer; The first organic encapsulation layer is disposed on a side of the first inorganic encapsulation layer away from the substrate, and the second inorganic encapsulation layer is disposed on a side of the first organic encapsulation layer away from the substrate; The at least one repair encapsulation layer includes a first repair encapsulation layer, and the first repair encapsulation layer is disposed between the first inorganic encapsulation layer and the first organic encapsulation layer, or is disposed on a side of the second inorganic encapsulation layer away from the substrate.

13. The display panel according to claim 12, characterized in that: The thickness of the repair encapsulation layer is smaller than the thickness of the inorganic encapsulation layer and / or the thickness of the first organic encapsulation layer.

14. The display panel according to claim 12, characterized in that: The display panel comprises a plurality of the repair encapsulation layers, wherein the plurality of the repair encapsulation layers comprises the first repair encapsulation layer and the second repair encapsulation layer; One of the first repair encapsulation layer and the second repair encapsulation layer is disposed between the first inorganic encapsulation layer and the first organic encapsulation layer, and the other of the first repair encapsulation layer and the second repair encapsulation layer is disposed on a side of the second inorganic encapsulation layer away from the substrate.

15. A method for manufacturing a display panel, characterized in that: include: providing a substrate; forming at least one inorganic encapsulation layer on one side of the substrate by a vapor deposition process, wherein the inorganic encapsulation layer is an inorganic material; At least one repair encapsulation layer is formed on a side of at least one of the inorganic encapsulation layers away from the substrate by a solution method, and the repair encapsulation layer is in contact with the inorganic encapsulation layer adjacent to the substrate, and the material of the repair encapsulation layer includes inorganic material and organic material.

16. The method for manufacturing a display panel according to claim 15, characterized in that: The solution used in the solution method includes at least one of a precursor solution of perhydropolysilazane, a precursor solution of aluminum oxide, a precursor solution of titanium oxide, a precursor solution of zinc oxide, a precursor solution of tin oxide, and a precursor solution of zinc-tin oxide.

17. The method for manufacturing a display panel according to claim 16, wherein: When the solution used in the solution method is a precursor solution of the perhydropolysilazane, the precursor solution includes at least one of a pure hydrocarbon solvent, hexamethylcyclotrisilazane, cyclopentasiloxane, dibutyl ether, toluene and xylene; And / or, when the solution used in the solution method is a precursor solution of aluminum oxide, the precursor solution includes a polymer aluminum hexaoxide complex; And / or, when the solution used in the solution method is a precursor solution of zinc tin oxide, the precursor solution includes at least one of zinc acetate dihydrate, anhydrous zinc acetate and tin 2-ethylhexanoate.

18. The method for manufacturing a display panel according to claim 15, characterized in that: The step of forming at least one repair encapsulation layer on a side of at least one of the inorganic encapsulation layers away from the substrate by a solution method comprises: forming a precursor film layer of a precursor solution of the repair encapsulation layer; removing at least a portion of the solvent in the precursor film layer; The precursor film layer is cured by at least one of heating and ultraviolet curing.

19. A display device, characterized in that: The invention comprises the display panel as claimed in any one of claims 1 to 14.

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