Display panel, display equipment and manufacturing method of display panel

Abstract

The invention provides a display panel, a display device and a manufacturing method of the display panel, the display panel comprises a substrate, a flat layer, a metal layer, a first electrode layer, a second electrode layer and a protective structure, the metal layer is arranged on one side of the substrate; the flat layer is arranged on the side, away from the substrate, of the metal layer, the flat layer is provided with a via hole, and part of the metal layer is exposed in the via hole; the first electrode layer is arranged on one side of the flat layer and is in lap joint with the metal layer through the via hole; the isolation structure is arranged on one side, deviating from the flat layer, of the first electrode layer; the protection structure is arranged on the side, away from the flat layer, of the isolation structure, and the orthographic projection of the via hole on the substrate is located in the orthographic projection range of the protection structure on the substrate.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, in current OLED display products, dark spots may appear due to insufficient process performance. Summary of the invention

[0004] In order to solve the above problems, embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, so as to at least partially solve the above problems.

[0005] In a first aspect, the present application provides a display panel, which includes a substrate, a flat layer, a metal layer, a first electrode layer, a first electrode layer and a protective structure, wherein the metal layer is arranged on one side of the substrate; the flat layer is arranged on the side of the metal layer away from the substrate, the flat layer has a via, and part of the metal layer is exposed in the via; the first electrode layer is arranged on one side of the flat layer and overlaps with the metal layer through the via; the isolation structure is arranged on the side of the first electrode layer away from the flat layer; the protective structure is arranged on the side of the isolation structure away from the flat layer, and the orthographic projection of the via on the substrate is located within the orthographic projection range of the protective structure on the substrate.

[0006] In one embodiment, the material of the protective structure includes an inorganic anti-etching material; preferably, the material of the protective structure includes a metal material; preferably, the material of the protective structure includes crystallized indium tin oxide.

[0007] In one embodiment, the display panel further includes a pixel defining layer; the pixel defining layer is located between the first electrode layer and the isolation structure, the pixel defining layer has a pixel opening, the isolation structure encloses and forms the isolation opening, the orthographic projection of the pixel opening on the planar layer falls within the orthographic projection range of the isolation opening on the planar layer, and a portion of the first electrode layer is exposed in the pixel opening;

[0008] Preferably, the display panel also includes a light-emitting structure and a second electrode, the light-emitting structure and the second electrode are stacked in the pixel opening, and the light-emitting structure is located between the first electrode layer and the second electrode, at least part of the material of the isolation structure includes a metal conductive material, and the second electrode is in conductive contact with the isolation structure.

[0009] In one embodiment, the metal layer includes a plurality of conductive parts arranged at intervals, the conductive parts are arranged corresponding to the light-emitting structure, and the conductive parts are located on the peripheral side corresponding to the light-emitting structure, and the first electrode layer is electrically connected to the conductive parts located on the peripheral side of the light-emitting structure through the via holes.

[0010] In one embodiment, along a direction parallel to the plane where the substrate is located, the isolation structure located on the peripheral side of one of the light-emitting structures includes a first part and a second part connected to each other, wherein the orthographic projection of the conductive portion on the substrate falls within the orthographic projection range of the first part on the substrate, the second part is located between adjacent isolation openings, and the protective structure is provided on a side of the first part away from the substrate;

[0011] Preferably, in the direction from the substrate to the isolation structure, a first height exists between a surface of the first portion facing away from the substrate and the substrate, a second height exists between a surface of the second portion facing away from the substrate and the substrate, and the first height is smaller than the second height;

[0012] Preferably, the orthographic projection area of ​​the protective structure on the substrate is greater than or equal to the orthographic projection area of ​​the conductive portion on the substrate;

[0013] The orthographic projection area of ​​the first part on the substrate is greater than or equal to the orthographic projection area of ​​the protective structure on the substrate;

[0014] Preferably, the orthographic projection of the protection structure on the substrate overlaps with the orthographic projection of the isolation structure on the substrate;

[0015] Preferably, the orthographic projection area of ​​the protection structure on the substrate is equal to the orthographic projection area of ​​the isolation structure on the substrate;

[0016] Preferably, the side wall of the protective structure close to the light emitting structure is protruding relative to the side wall of the isolation structure close to the light emitting structure, and the orthographic projection of the isolation structure on the substrate is located within the orthographic projection range of the protective structure on the substrate;

[0017] Preferably, the protective structure includes a first sub-portion located in the via hole and a second sub-portion located outside the via hole, in a direction perpendicular to the substrate, the thickness of the first sub-portion is greater than the thickness of the second sub-portion, and the surface of the first sub-portion facing away from the substrate is located outside the via hole.

[0018] In one embodiment, the display panel further includes a packaging structure, which is disposed on a side of the second electrode away from the flat layer, the packaging structure overlaps a side wall of the isolation structure on a side close to the light-emitting structure, and a portion of the packaging structure is located on a side of the isolation structure away from the substrate.

[0019] In one embodiment, the isolation structure includes a first structure layer and a second structure layer, the second structure layer is located between the first structure layer and the pixel defining layer, the orthographic projection of the second structure layer toward the flat layer falls within the orthographic projection range of the first structure layer toward the flat layer, and the orthographic projection area of ​​the second structure layer on the flat layer is smaller than the orthographic projection area of ​​the first structure layer on the flat layer, the material of the second structure layer includes a metal conductive material, and the second electrode and the second structure layer overlap.

[0020] In one embodiment, the cross section of the second structure layer in a direction perpendicular to the plane of the planar layer is trapezoidal, and an angle between a side wall of the second structure layer and a surface of the planar layer facing the pixel opening is less than degrees.

[0021] In one embodiment, the isolation structure further includes a third structure layer, the third structure layer is disposed between the second structure layer and the pixel defining layer, the metal material of the third structure layer includes a metal conductive material, and the second electrode and the third structure layer are overlapped.

[0022] In one embodiment, the material of the third structure layer includes molybdenum, the material of the second structure layer includes aluminum, and the material of the first structure layer includes titanium.

[0023] In one embodiment, the orthographic projection of the third structure layer toward the flat layer falls within the orthographic projection range of the first structure layer toward the flat layer, and the orthographic projection area of ​​the third structure layer on the flat layer is smaller than the orthographic projection area of ​​the first structure layer on the flat layer.

[0024] In one embodiment, the display panel also includes a driving circuit layer, which is arranged on a side of the flat layer close to the substrate, and the driving circuit layer includes a plurality of driving circuits. The driving circuit layer is electrically connected to the metal layer, and the driving circuit provides a driving signal to the light-emitting structure through the metal layer.

[0025] In the second aspect, the present application also provides a display panel, including a substrate, a metal layer, a flat layer, an isolation structure, a light-emitting structure and a protective structure, the metal layer is arranged on one side of the substrate; the flat layer is arranged on the side of the metal layer away from the substrate, the flat layer has a via, and part of the metal layer is exposed in the via; the isolation structure is arranged on the side of the flat layer away from the substrate, the via is located on the side of the isolation structure facing the substrate, the orthographic projection of the via on the substrate falls within the orthographic projection range of the isolation structure on the substrate, and the isolation structure encloses a plurality of isolation openings; at least part of the light-emitting structure is located in the isolation opening, and the light-emitting structure is electrically connected to the metal layer through the via; the protective structure is arranged on the side of the isolation structure away from the flat layer, and the orthographic projection of the protective structure on the substrate overlaps with the orthographic projection of the isolation structure on the substrate.

[0026] In one embodiment, the material of the protective structure includes an inorganic anti-etching material; preferably, the material of the protective structure includes a metal material; preferably, the material of the protective structure includes crystallized indium tin oxide.

[0027] In one embodiment, along a direction parallel to the plane where the substrate is located, the isolation structure located on the peripheral side of one of the light-emitting structures includes a first part and a second part connected to each other, and the metal layer includes a conductive part, and the conductive part is exposed in the via hole; wherein the orthographic projection of the conductive part on the substrate falls within the orthographic projection range of the first part on the substrate, the second part is located between adjacent isolation openings, and the protective structure is provided on a side of the second part away from the substrate;

[0028] Preferably, in the direction from the substrate to the isolation structure, a first height exists between the surface of the first part facing away from the substrate and the substrate, a second height exists between the surface of the second part facing away from the substrate and the substrate, and the first height is greater than the second height;

[0029] Preferably, the orthographic projection area of ​​the protective structure on the substrate is greater than or equal to the orthographic projection area of ​​the conductive portion on the substrate;

[0030] The orthographic projection area of ​​the second part on the substrate is greater than or equal to the orthographic projection area of ​​the protective structure on the substrate;

[0031] Preferably, the orthographic projection of the protection structure on the substrate overlaps with the orthographic projection of the isolation structure on the substrate;

[0032] Preferably, the orthographic projection area of ​​the protection structure on the substrate is equal to the orthographic projection area of ​​the isolation structure on the substrate;

[0033] Preferably, the side wall of the protection structure close to the light emitting structure is protruding relative to the side wall of the isolation structure close to the light emitting structure, and the orthographic projection of the isolation structure on the substrate is within the orthographic projection range of the protection structure on the substrate.

[0034] In one embodiment, the display panel further comprises a first electrode layer and a pixel defining layer, and along the direction from the substrate to the isolation structure, the first electrode layer and the pixel defining layer are sequentially stacked on a side of the flat layer away from the substrate, and the isolation structure is arranged on a side of the pixel defining layer away from the substrate;

[0035] The pixel definition layer has a pixel opening, and the orthographic projection of the pixel opening on the planar layer falls within the orthographic projection range of the isolation opening on the planar layer;

[0036] A portion of the first electrode layer is exposed in the pixel opening and overlapped with the metal layer through the via hole; the light emitting structure is overlapped on a side of the first electrode layer away from the substrate.

[0037] In a third aspect, the present application provides a display device, wherein the display device comprises the above-mentioned display panel.

[0038] In a fourth aspect, the present application provides a method for manufacturing a display panel, the manufacturing method comprising:

[0039] A backplane is provided, the backplane comprising a substrate and a metal layer, a flat layer, and a first electrode layer stacked in sequence on one side of the substrate, the flat layer having a via hole, the metal layer being arranged on one side of the flat layer and partially exposed in the via hole, and the first electrode layer being arranged on one side of the flat layer and overlapping the metal layer exposed in the via hole;

[0040] forming an isolation material layer on a side of the first electrode layer away from the planar layer;

[0041] forming a protective material layer, wherein the protective material layer covers a side of the isolation material layer facing away from the flat layer;

[0042] patterning the protective material layer to form a protective portion;

[0043] The protection portion is processed by a crystallization process to form the protection structure.

[0044] In one embodiment, the manufacturing method further comprises: after processing the protection portion through a crystallization process, patterning the isolation material layer to form an isolation structure.

[0045] In one embodiment, the isolation material layer includes a first structural material layer, a second structural material layer, and a third structural material layer stacked in sequence along a direction toward the substrate; the back panel also includes a pixel defining material layer, and the pixel defining material layer is arranged between the first electrode layer and the isolation material layer; the manufacturing method also includes: after forming the protective structure, patterning the first structural material layer, the second structural material layer, and the third structural material layer in sequence to form an isolation structure and an isolation opening; after forming the isolation opening, patterning the pixel defining material layer to form a pixel opening.

[0046] Based on the above-mentioned display panel provided by the present application, since the protective structure is arranged on the side of the isolation structure away from the flat layer, the orthographic projection of the via on the substrate is located within the orthographic projection range of the protective structure on the substrate. Therefore, the protective structure is arranged on the side of the isolation structure away from the flat layer, and the orthographic projection of the via on the substrate is located within the orthographic projection range of the protective structure on the substrate. Although the thickness of the portion of the isolation structure located in the via is relatively thin due to the presence of the via, the protective structure can be provided to protect the isolation structure and prevent the isolation structure from being etched through in the subsequent etching process of the display panel, thereby ensuring that the first electrode layer will not be affected by the subsequent etching process, so that the first electrode layer can maintain good conductive contact with the metal layer, and reduce the probability of dark spots on the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The following drawings are intended only to illustrate and explain the present application, and do not limit the scope of the present application.

[0048] Figure 1a It is a structural schematic diagram of a state of a display panel during the manufacturing process in the related art;

[0049] Figure 1b It is a structural schematic diagram of a state of a display panel during the manufacturing process in the related art;

[0050] Figure 1c It is a structural schematic diagram of a state of a display panel during the manufacturing process in the related art;

[0051] Figure 1d It is a structural schematic diagram of a state of a display panel during the manufacturing process in the related art;

[0052] Figure 1e It is a structural schematic diagram of a state of a display panel during the manufacturing process in the related art;

[0053] Figure 2a This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0054] Figure 2b This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0055] Figure 3a This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0056] Figure 3b This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0057] Figure 4 This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0058] Figure 5 This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0059] Figure 6 This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0060] Figure 7 This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0061] Figure 8 This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0062] Fig. 9 This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0063] Fig.10 This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0064] Fig.11 is a flow chart of a method for manufacturing a display panel provided by the present application;

[0065] Fig.12a is based on Fig.11 A manufacturing method, a schematic diagram showing a structure of a panel in a state during the manufacturing process;

[0066] Figure 12b is based on Fig.11 A manufacturing method, a schematic diagram showing a structure of a panel in a state during the manufacturing process;

[0067] Fig.12c is based on Fig.11 A manufacturing method is provided, and a structural schematic diagram showing a state of the panel during the manufacturing process.

[0068] Description of reference numerals:

[0069] 11-planar layer, 12-metal layer, 13-first electrode layer, 14-pixel defining layer, 15-isolation structure, 16-light emitting structure, 171-first encapsulation layer, 172-second encapsulation layer;

[0070] 21-flat layer, 211-via hole, 22-metal layer, 221-conductive portion, 23-first electrode layer, 24-pixel defining layer, 241-pixel opening, 30-isolation structure, 31-isolation opening, 301-first part, 302-second part, 32-first structure layer, 33-second structure layer, 34-third structure layer;

[0071] 40 - protection structure, 41 - first sub-section, 42 - second sub-section, 51 - light-emitting structure, 52 - second electrode, 60 - packaging structure, 70 - substrate, 80 - driving circuit layer, 81 - driving circuit, 82 - insulation structure. DETAILED DESCRIPTION

[0072] In order to have a clearer understanding of the technical features, purposes and effects of the embodiments of the present application, the specific implementation methods of the embodiments of the present application are now described with reference to the accompanying drawings.

[0073] In this document, “exemplary” means “serving as an example, instance or illustration”, and any diagram or implementation described in this document as “exemplary” should not be interpreted as a more preferred or more advantageous technical solution.

[0074] In order to simplify the drawings, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one or more of the parts with the same structure or function are schematically drawn or only one or more of them are marked.

[0075] The corresponding structural parts mentioned below, such as the isolation structure, are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783,

[0076] Further description in PCT / CN2024 / 098217.PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, CN117500332A for reference.

[0077] In the related art, reference Figure 1b The display panel includes a flat layer 11, a metal layer 12, a first electrode layer 13, a pixel defining layer 14, an isolation structure 15, a light emitting structure 16 and an encapsulation layer. The flat layer 11 includes a via 111, the metal layer 12 is exposed in the via 111, and the first electrode layer 13 is arranged on one side of the flat layer 11 and overlaps the metal layer 12 exposed in the via 111. The pixel defining layer 14 is arranged on the side of the metal layer 12 away from the flat layer 11, and the isolation structure is arranged on the side of the pixel defining layer 14 away from the flat layer 11. The pixel defining layer 14 has a pixel opening, and the light emitting structure 16 is arranged in the pixel opening 141. The encapsulation layer 17 covers the light emitting structure 16 and overlaps the isolation structure 15 to isolate water and oxygen and protect the light emitting structure 16. Among them, the pixel opening is formed by wet etching, and the process of forming the encapsulation layer is to first deposit a film layer on the entire surface, and then remove the excess part by dry etching. For details, please refer to Figure 1a and Figure 1b .

[0078] The display panel may include a plurality of light-emitting structures 16, and different light-emitting structures 16 can emit light of different colors. In one manufacturing process, a first pixel opening is first formed on the pixel definition layer 14 by wet etching, and then a first light-emitting structure and a first encapsulation layer 171 corresponding to the first pixel opening are formed in sequence. Then, a second pixel opening is formed on the pixel definition layer 14 by etching, and then a second light-emitting structure and a second encapsulation layer 172 corresponding to the second pixel opening are formed in sequence; then, a third pixel opening is formed on the pixel definition layer 14 by etching, and then a third light-emitting structure and a third encapsulation layer corresponding to the third pixel opening are formed in sequence. However, referring to Figure 1c and 1d When etching the pixel defining layer 14 to form the second pixel opening, the isolation structure 15 corresponding to the via hole 111 will be etched, and when dry etching is performed to form the second encapsulation layer 18, the isolation structure 15 corresponding to the via hole 111 will also be etched. Figure 1eDue to the presence of the via hole 111, the portion of the isolation structure 15 located in the via hole 111 is recessed. When the third pixel opening and the third encapsulation layer are formed, the isolation structure 15 corresponding to the via hole 111 is easily etched through, thereby causing the first electrode layer 13 to be etched. After the first electrode layer 13 is etched, the conductive contact between the first electrode layer 13 and the metal layer 12 fails, causing the corresponding light-emitting structure 16 to be difficult to emit light, and the display panel has a dark spot problem.

[0079] To solve the above problems, refer to Figure 2a and Figure 2b The present application provides a display panel, comprising a substrate 70, a flat layer 21, a metal layer 22, a first electrode layer 23, an isolation structure 30 and a protective structure 40. The metal layer 22 is arranged on one side of the substrate 70, the flat layer 21 is arranged on the side of the metal layer 22 away from the substrate 70, the flat layer 21 has a via 211, and part of the metal layer 22 is exposed in the via 211. The first electrode layer 23 is arranged on one side of the flat layer 21 and overlaps with the metal layer 22 through the via 211. The isolation structure 30 is arranged on the side of the first electrode layer 23 away from the flat layer 21. The protective structure 40 is arranged on the side of the isolation structure 30 away from the flat layer 21, and the orthographic projection of the via 211 on the substrate 70 is located within the orthographic projection range of the protective structure 40 on the substrate 70.

[0080] It can be known from the above technical solution that since the protective structure 40 is arranged on the side of the isolation structure 30 away from the flat layer 21, the orthographic projection of the via 211 on the substrate 70 is located within the orthographic projection range of the protective structure 40 on the substrate 70. Therefore, the protective structure 40 is arranged on the side of the isolation structure 30 away from the flat layer 21, and the orthographic projection of the via 211 on the substrate 70 is located within the orthographic projection range of the protective structure 40 on the substrate 70. Although the portion of the isolation structure 30 located at the via 211 has a relatively thin thickness due to the presence of the via 211, the protective structure 40 can protect the isolation structure 30 and prevent the isolation structure 30 from being etched through in the subsequent etching process of the display panel, thereby ensuring that the first electrode layer 23 will not be affected by the subsequent etching process, so that the first electrode layer 23 can maintain good conductive contact with the metal layer 22, and reduce the probability of dark spots on the display panel.

[0081] It can be understood that the substrate plays the role of supporting the entire panel in the display panel. The substrate is generally divided into two types: hard substrate and soft substrate. The hard substrate is usually made of rigid materials such as glass or plastic, has good stability and durability, and is suitable for large-size displays and professional displays; while the soft substrate is usually made of soft plastic or metal foil and other materials, and is suitable for flexible displays and wearable devices.

[0082] Among them, the material of the protective structure 40 includes an inorganic anti-etching material, so as to prevent the isolation structure 30 from being etched. Preferably, the material of the protective structure 40 includes a metal material. Preferably, the material of the protective structure 40 includes crystallized indium tin oxide. That is, indium tin oxide can be used to form a protective structure, and then the indium tin oxide is crystallized, so that a protective structure with strong anti-etching performance can be obtained. Crystallized indium tin oxide can resist most etching materials, so as to protect the isolation structure 30. Specifically, in the crystallized indium tin oxide, the grains are arranged in an orderly manner, and the increase in grain size makes the arrangement of the grains denser, so as to have better anti-etching performance.

[0083] In one possible embodiment, reference Figure 3a The display panel may further include a pixel defining layer 24. The pixel defining layer 24 is located between the first electrode layer 23 and the isolation structure 30. The pixel defining layer 24 has a pixel opening 241, and the isolation structure 30 surrounds the isolation opening 31. The orthographic projection of the pixel opening 241 on the planar layer 21 falls within the orthographic projection range of the isolation opening 31 on the planar layer 21, and a portion of the first electrode layer 23 is exposed in the pixel opening 241.

[0084] Preferably, reference Figure 3b , the display panel may further include a light emitting structure 51 and a second electrode 52. The light emitting structure 51 and the second electrode 52 are stacked in the pixel opening 241, and the light emitting structure 51 is located between the first electrode layer 23 and the second electrode 52. The material of at least part of the isolation structure 30 includes a metal conductive material, and the second electrode 52 is in conductive contact with the isolation structure 30. Based on this technical solution, in each pixel opening 241, a pixel unit can be formed by the second electrode 52, the light emitting structure 51 and a part of the first electrode layer 23 exposed in the pixel opening 241, and the second electrodes 52 in adjacent pixel openings 241 can be conductively connected through the isolation structure 30. By setting the isolation structure 30, the second electrodes 52 can be connected in a mesh, which is beneficial to the uniformity of the second electrodes 52.

[0085] Among them, the light-emitting structure may include: one or more of: HIL (Hole Injection Layer), HTL (Hole Transfer Layer), EML (Emitting Layer) and ETL (Electron Transfer Layer). Among them, the organic light-emitting materials in the light-emitting structure are generally divided into: high molecular polymers, small molecule organic substances and complex light-emitting materials; high molecular polymers are usually conductive conjugated polymers or semiconductor conjugated polymers, which can be formed into films by spin coating, are simple to make and low in cost, but their purity is not easy to improve, and they are inferior to small molecule organic compounds in terms of durability, brightness and color. Organic small molecule light-emitting materials are mainly organic dyes, which have the advantages of strong chemical modification, wide selection range, easy purification, high quantum efficiency, and can produce various color emission peaks such as red, green, blue, and yellow, but most of them have concentration quenching problems in the solid state. Complex light-emitting materials are between organic and inorganic substances, with both high fluorescence quantum efficiency of organic substances and high stability of inorganic substances, and are regarded as a type of light-emitting material with great application prospects. In different pixel openings 241 , light emitting structures 51 capable of emitting different colors may be disposed, so that the display panel can present a variety of display colors and effects.

[0086] In one possible embodiment, reference Figure 4 The metal layer 22 includes a plurality of conductive portions 221 arranged at intervals, the conductive portions 221 are arranged corresponding to the light emitting structure 51, and the conductive portions 221 are located on the peripheral side of the corresponding light emitting structure 51, and the first electrode layer 23 is electrically connected to the conductive portions 221 located on the peripheral side of the light emitting structure 51 through the vias 211. In this way, the conductive portions 221 and the light emitting structure 51 are electrically connected one by one, so that the light emitting structure 51 can be controlled to emit light through the conductive portions 221. Specifically, the metal layer 22 also includes a signal line, and the signal line is electrically connected to the first electrode layer 23, so that it can be electrically connected to the light emitting structure 51. The signal line is not shown in the figure.

[0087] In one possible embodiment, reference Figure 4, along the direction parallel to the plane where the substrate 70 is located, the isolation structure 30 located on the side of a light emitting structure 51 includes a first part 301 and a second part 302 connected to each other. Among them, the orthographic projection of the conductive part 221 on the substrate 70 falls within the orthographic projection range of the first part 301 on the substrate 70, the second part 302 is located between adjacent isolation openings 31, and a protective structure 40 is arranged on the side of the first part 302 away from the substrate 70. Obviously, the conductive part 221 corresponds to the first part 301, and because the orthographic projection of the via 21 on the substrate 70 is located within the orthographic projection range of the protective structure 40 on the substrate, the protective structure 40 is arranged on the side of the first part 301 away from the substrate 70. The protective structure 40 can also be arranged on the side of the second part 302 away from the flat layer 21, and the protective structure 40 can not only protect the first part 301 corresponding to the conductive part 221, but also protect the second part 302 of the isolation structure 30.

[0088] Preferably, in the direction from the substrate 70 to the isolation structure 30, the surface of the first part 301 on the side facing away from the substrate 70 has a first height with the substrate 70, and the surface of the second part 302 on the side facing away from the substrate 70 has a second height with the substrate 70, and the first height is less than the second height. In this way, there is a height difference between the first part 301 and the second part 302, the first part 301 is recessed relative to the second part 302, and the packaging structure 60 of the display panel has a greater thickness in the area corresponding to the second part 302, which can more effectively block the intrusion of water vapor. In one example, the difference between the first height and the second height is less than the height of the isolation structure 30 itself, and greater than one quarter of the height of the isolation structure 30 itself.

[0089] Preferably, the orthographic projection area of ​​the protection structure 40 on the substrate 70 is greater than or equal to the orthographic projection area of ​​the conductive portion 221 on the substrate. In this way, the protection structure 40 can correspondingly protect the conductive portion 221.

[0090] Preferably, the orthographic projection area of ​​the first portion 301 on the substrate 70 is greater than or equal to the orthographic projection area of ​​the protection structure 40 on the substrate 70 .

[0091] Preferably, the orthographic projection of the protective structure 40 on the substrate 70 overlaps with the orthographic projection of the isolation structure 30 on the substrate 70. In this way, the surface of the isolation structure 30 on the side facing away from the substrate 70 can be covered and protected by the protective structure 40. The first part 301 and the second part 302 can be provided with the protective structure 40, and a part of the surface of the first part 301 on the side facing away from the substrate 70 is covered by the protective structure 40, or the surface of the first part 301 on the side facing away from the substrate 70 is completely covered by the protective structure 40. Similarly, a part of the surface of the second part 302 on the side facing away from the substrate 70 is covered by the protective structure 40, or the surface of the second part 302 on the side facing away from the substrate 70 is completely covered by the protective structure 40.

[0092] Preferably, the orthographic projection area of ​​the protection structure 40 on the substrate 70 is equal to the orthographic projection area of ​​the isolation structure 30 on the substrate 70 .

[0093] Preferably, the side wall of the protective structure 40 close to the light emitting structure 51 is arranged to protrude relative to the side wall of the isolation structure 30 close to the light emitting structure 51, and the orthographic projection of the isolation structure 30 on the substrate 70 is located within the orthographic projection range of the protective structure 40 on the substrate 70. In other words, the surface of the side of the isolation structure 30 facing away from the substrate 70 can not only be fully covered by the protective structure 40, but the protective structure 40 can also extend from the area where the isolation structure 40 is located.

[0094] Preferably, reference Figure 5 The protective structure 40 includes a first sub-portion 41 located in the via hole 211 and a second sub-portion 42 located outside the via hole 211. In the direction perpendicular to the substrate, the thickness of the first sub-portion 41 is greater than the thickness of the second sub-portion 42, and the surface of the first sub-portion facing away from the substrate is located outside the via hole. In this way, the protective structure 40 is convex relative to the second sub-portion 42 at the first sub-portion 41 corresponding to the via hole 211, thereby avoiding depression and ensuring that no etching liquid remains in the first sub-portion 41. Therefore, when the packaging structure 60 is provided to protect the protective structure 40, the isolation structure 30, etc., the packaging effect can be improved.

[0095] In one possible embodiment, reference Figure 6 The display panel further includes a packaging structure 60, which is disposed on the side of the second electrode 52 away from the flat layer 21, and the packaging structure 60 overlaps the side wall of the isolation structure 30 close to the light emitting structure 51, and part of the packaging structure 60 is located on the side of the isolation structure 30 away from the substrate 70. The packaging structure 60 can isolate water and oxygen and protect the second electrode 52 and the metal conductive material in the isolation structure 30.

[0096] In one possible implementation, reference Figure 7, the isolation structure 30 includes a first structure layer 32 and a second structure layer 33, the second structure layer 33 is located between the first structure layer 32 and the pixel definition layer 24, the orthographic projection of the second structure layer 33 toward the flat layer 21 falls within the orthographic projection range of the first structure layer 32 toward the flat layer 21, and the orthographic projection area of ​​the second structure layer 33 on the flat layer 21 is smaller than the orthographic projection area of ​​the first structure layer 32 on the flat layer 21, the material of the second structure layer 33 includes a metal conductive material, and the second electrode 52 overlaps the second structure layer 33. In this way, the first structure layer 32 can exceed the second structure layer 33 to form an eaves-like structure, so when the second electrode 52 is evaporated, the second electrode 52 will not be continuous near the eaves-like structure, but intermittent. In this way, the isolation structure 30 can reliably separate adjacent second electrodes 52. Adjacent second electrodes 52 are electrically connected through the second structure layer 33 of the isolation structure 30, thereby realizing mutual electrical connection between the second electrodes 52.

[0097] The first structural layer 32 may have insulating properties or conductive properties. The material of the first structural layer 32 may include, but is not limited to, titanium (Ti), silicon monoxide (SiO), silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiNO), and the like.

[0098] Furthermore, the cross section of the second structure layer 33 in the plane direction perpendicular to the planar layer 21 is a trapezoid, and the angle between the side wall of the second structure layer 33 and the surface of the planar layer 21 facing the pixel opening 241 is less than 90 degrees. In this way, the adverse effect on the light extraction efficiency of the light emitting structure 51 can be reduced. It can also facilitate the overlap of the second electrode 52 and the side wall of the second structure layer 33, increase the conductive contact area, and reduce the impedance.

[0099] In one possible embodiment, reference Figure 8 The isolation structure 30 further includes a third structure layer 34 , which is disposed between the second structure layer 33 and the pixel defining layer 24 . The metal material of the third structure layer 34 includes a metal conductive material. The second electrode 52 and the third structure layer 34 are overlapped.

[0100] In one embodiment, the material of the third structure layer 34 includes molybdenum, the material of the second structure layer 33 includes aluminum, and the material of the first structure layer 32 includes titanium.

[0101] In one example, the orthographic projection of the third structure layer 34 toward the flat layer 21 falls within the orthographic projection range of the first structure layer 32 toward the flat layer 21, and the orthographic projection area of ​​the third structure layer 34 on the flat layer 21 is smaller than the orthographic projection area of ​​the first structure layer 32 on the flat layer 21. In this way, the first structure layer 32 can exceed the third structure layer 34, so when the second electrode 52 is evaporated, the second electrode 52 will not be continuous near the eaves-like structure, but will be intermittent. In this way, the isolation structure 30 can reliably separate adjacent second electrodes 52. Adjacent second electrodes 52 are electrically connected through the second structure layer 33 of the isolation structure 30, thereby realizing mutual electrical connection between the second electrodes 52.

[0102] In one possible embodiment, reference Fig. 9 The display panel further includes a driving circuit layer 80, which is disposed on a side of the flat layer 21 close to the substrate 70. The driving circuit layer 80 includes a plurality of driving circuits 81. The driving circuit layer 80 is electrically connected to the metal layer 22. The driving circuit 81 provides a driving signal to the light emitting structure 51 through the metal layer 22. The driving circuit layer is used to drive the light emitting structure 51 to emit light. Specifically, the driving circuit layer 80 further includes an insulating structure 82, which is disposed around the driving circuit 81 to prevent the driving circuit 81 from leaking electricity.

[0103] The present application also provides a display panel, referring to Figure 2a and Fig.10 The display panel includes a substrate 70, a metal layer 22, a flat layer 21, an isolation structure 30, a light-emitting structure 51 and a protective structure 40. The metal layer 22 is arranged on one side of the substrate 70; the flat layer 21 is arranged on the side of the metal layer 22 away from the substrate 70, the flat layer 21 has a via 211, and part of the metal layer 22 is exposed in the via 211; the isolation structure 30 is arranged on the side of the flat layer 21 away from the substrate 70, the via 211 is located on the side of the isolation structure 30 facing the substrate 70, the orthographic projection of the via 211 on the substrate 70 falls within the orthographic projection range of the isolation structure 30 on the substrate 70, and the isolation structure 30 encloses a plurality of isolation openings 31; at least part of the light-emitting structure 51 is located in the isolation opening 31, and the light-emitting structure 51 is electrically connected to the metal layer 22 through the via 211; the protective structure 40 is arranged on the side of the isolation structure 30 away from the flat layer 21, and the orthographic projection of the protective structure 40 on the substrate 70 overlaps with the orthographic projection of the isolation structure 30 on the substrate 70.

[0104] It can be known from the above technical solution that since the protective structure 40 is arranged on the side of the isolation structure 30 away from the flat layer 21, the orthographic projection of the via 211 on the substrate 70 is located within the orthographic projection range of the protective structure 40 on the substrate 70. Therefore, the protective structure 40 is arranged on the side of the isolation structure 30 away from the flat layer 21, and the orthographic projection of the via 211 on the substrate 70 is located within the orthographic projection range of the protective structure 40 on the substrate 70. Although the portion of the isolation structure 30 located in the via 211 has a relatively thin thickness due to the presence of the via 211, the protective structure 40 can be provided to protect the isolation structure 30 and prevent the isolation structure 30 from being etched through in the subsequent etching process of the display panel, thereby ensuring that the first electrode layer 23 will not be affected by the subsequent etching process, so that the first electrode layer 23 can maintain good conductive contact with the metal layer 22, and reduce the probability of dark spots appearing on the display panel. At the same time, the light emitting structure 51 can be controlled to emit light through the metal layer 22, and adjacent light emitting structures 51 can be separated by the isolation structure 30 to avoid mutual interference.

[0105] Among them, the material of the protective structure 40 includes an inorganic anti-etching material, so as to prevent the isolation structure 30 from being etched. Preferably, the material of the protective structure 40 includes a metal material. Preferably, the material of the protective structure 40 includes crystallized indium tin oxide. That is, indium tin oxide can be used to form a protective structure, and then the indium tin oxide is crystallized, so that a protective structure with strong anti-etching performance can be obtained. Crystallized indium tin oxide can resist most etching materials, so as to protect the isolation structure 30. Specifically, in the crystallized indium tin oxide, the grains are arranged in an orderly manner, and the increase in grain size makes the arrangement of the grains denser, so as to have better anti-etching performance.

[0106] In one possible embodiment, reference Figure 4 , along the direction parallel to the plane where the substrate 70 is located, the isolation structure 30 located on the side of a light emitting structure 51 includes a first part 301 and a second part 302 connected to each other, and the metal layer 22 includes a conductive part 221, and the conductive part 221 is exposed in the via hole 211. Among them, the orthographic projection of the conductive part 221 on the substrate 70 falls within the orthographic projection range of the first part 301 on the substrate 70, the second part 302 is located between adjacent isolation openings 31, and a protective structure 40 is arranged on the side of the second part 302 away from the substrate 70. Obviously, the conductive part 221 corresponds to the first part 301, and because the orthographic projection of the via hole 21 on the substrate 70 is located within the orthographic projection range of the protective structure 40 on the substrate, the protective structure 40 is arranged on the side of the first part 301 away from the substrate 70. Since the protective structure 40 is arranged on the side of the second part 302 away from the flat layer 21, the protective structure 40 can not only protect the first part 301 corresponding to the conductive part 221, but also protect the second part 302 of the isolation structure 30.

[0107] Preferably, in the direction from the substrate 70 to the isolation structure 30, the surface of the first part 301 on the side facing away from the substrate 70 has a first height with the substrate 70, and the surface of the second part 302 on the side facing away from the substrate 70 has a second height with the substrate 70, and the first height is greater than the second height. In this way, there is a height difference between the first part 301 and the second part 302, and the second part 302 is recessed relative to the first part 301, so the packaging structure 60 of the display panel has a greater thickness in the area corresponding to the second part 302, which can more effectively block the intrusion of water vapor. In one example, the difference between the first height and the second height is less than the height of the isolation structure 30 itself, and greater than one quarter of the height of the isolation structure 30 itself.

[0108] Preferably, the orthographic projection area of ​​the protection structure 40 on the substrate 70 is greater than or equal to the orthographic projection area of ​​the conductive portion 221 on the substrate. The orthographic projection area of ​​the second portion 302 on the substrate 70 is greater than or equal to the orthographic projection area of ​​the protection structure 40 on the substrate 70.

[0109] Preferably, the orthographic projection of the protection structure 40 on the substrate 70 overlaps with the orthographic projection of the isolation structure 30 on the substrate 70 . In this way, the protection structure 40 can correspond to the protective conductive portion 221 .

[0110] Preferably, the orthographic projection area of ​​the protection structure 40 on the substrate 70 is equal to the orthographic projection area of ​​the isolation structure 30 on the substrate 70 .

[0111] Preferably, the side wall of the protection structure 40 close to the light emitting structure 51 is protruding relative to the side wall of the isolation structure 30 close to the light emitting structure 51 , and the orthographic projection of the isolation structure 30 on the substrate 70 is located within the orthographic projection range of the protection structure 40 on the substrate 70 .

[0112] In one possible embodiment, reference Figure 4 The display panel also includes a first electrode layer 23 and a pixel defining layer 24. Along the direction of the substrate 70 toward the isolation structure 30, the first electrode layer 23 and the pixel defining layer 24 are sequentially stacked on the side of the flat layer 21 away from the substrate 70, and the isolation structure 30 is arranged on the side of the pixel defining layer 24 away from the substrate 70; the pixel defining layer 24 has a pixel opening 241, and the orthographic projection of the pixel opening 241 on the flat layer 21 falls within the orthographic projection range of the isolation opening 31 on the flat layer 21; a portion of the first electrode layer 23 is exposed in the pixel opening 241 and overlapped with the metal layer 22 through the via 211; the light-emitting structure 51 is overlapped on the side of the first electrode layer 23 away from the substrate 70.

[0113] The present application also provides a display device, the display device comprising the above display panel. Based on the beneficial effects of the above display panel, the display device has the advantage of good luminous performance.

[0114] The present application also provides a method for manufacturing a display panel, referring to Fig.11 , Fig.12a and Figure 12b , the preparation method comprises:

[0115] Step S91, providing a backplane, the backplane includes a substrate and a metal layer 22, a flat layer 21, and a first electrode layer 23 stacked in sequence on one side of the substrate; the flat layer 21 has a via 211, the metal layer 22 is arranged on one side of the flat layer 21 and is partially exposed in the via 211, and the first electrode layer 23 is arranged on one side of the flat layer 21 and overlapped on the metal layer 22 exposed in the via 211.

[0116] In step S92 , an isolation material layer 300 is formed on a side of the first electrode layer 23 away from the planar layer 21 .

[0117] Step S93, forming a protective material layer 41, wherein the protective material layer 41 covers the side of the isolation material layer 300 away from the flat layer 21. The protective material layer 41 may be an indium tin oxide film layer.

[0118] Step S94 , patterning the protective material layer 41 to form a protective portion. In this way, a protective portion disposed on the side of the isolation material layer 300 away from the planar layer 21 is formed, and the protective portion can protect the isolation material layer 300 .

[0119] Step S95, processing the protective part through a crystallization process to form a protective structure 40. Among them, the protective material layer 41 can be an indium tin oxide film layer, and the material of the protective structure is crystallized indium tin oxide. In this way, the protective structure 40 has a strong anti-etching performance. The protective structure 40 can prevent the isolation structure 30 from being etched in the subsequent manufacturing process, thereby ensuring that the first electrode layer 23 and the metal layer 22 corresponding to the via are well overlapped. Specifically, the indium tin oxide film layer 41 can be baked at a high temperature and then annealed to obtain crystallized indium tin oxide. Among them, the processing temperature range in the crystallization process can be 200°C-400°C.

[0120] In a possible embodiment, the method for manufacturing a display panel further includes: after the protection portion is processed by a crystallization process, patterning the isolation material layer 300 to form an isolation structure 30 .

[0121] In one possible embodiment, reference Figure 12b and Fig.12c, the isolation material layer 300 includes a first structural material layer 320, a second structural material layer 330 and a third structural material layer 340 stacked in sequence in the direction toward the substrate 70; the backplane also includes a pixel defining material layer 240, and the pixel defining material layer 240 is arranged between the first electrode layer 23 and the isolation material layer 300. Correspondingly, the method for manufacturing the display panel also includes: after forming the protective structure 40, patterning the first structural material layer 320, the second material layer 330 and the third structural material layer 340 in sequence to form the isolation structure 30 and the isolation opening 31. After forming the isolation opening 31, the pixel defining layer 240 can be patterned to form a pixel opening 241. In this way, the pixel opening 241 corresponds to the isolation opening 31. Then, the light emitting structure 51 and the second electrode 52 can be formed in the pixel opening 241, and the light emitting structure 51, the second electrode 52 and the first electrode can form a pixel unit for emitting light of different colors. Among them, the second structural material layer 330 and the third structural material layer 340 can be patterned by wet etching.

[0122] As can be seen from the above, the protection structure 40 formed by the crystallized indium tin oxide has a strong anti-etching ability, and can protect the isolation structure 30, especially the portion of the isolation structure 30 corresponding to the via hole, so as to avoid the portion of the isolation structure 30 corresponding to the via hole being etched through during the process of patterning the isolation structure 30 and the patterning the pixel defining layer 24.

[0123] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0124] It should be understood that although the specific embodiments of the present application are described in detail in conjunction with the accompanying drawings, it should not be understood as limiting the scope of protection of the present application. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still fall within the scope of protection of the present application. Although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: include: base(70); A metal layer (22) is disposed on one side of the substrate (70); A flat layer (21) is arranged on a side of the metal layer (22) facing away from the substrate (70), the flat layer (21) having a via hole (211), and a portion of the metal layer (22) is exposed in the via hole (211); A first electrode layer (23), arranged on one side of the flat layer (21) and overlapped with the metal layer (22) through the via hole (211); An isolation structure (30) arranged on a side of the first electrode layer (23) facing away from the flat layer (21); A protective structure (40) is arranged on a side of the isolation structure (30) away from the flat layer (21), and an orthographic projection of the via hole (211) on the substrate (70) is located within a range of an orthographic projection of the protective structure (40) on the substrate.

2. The display panel according to claim 1, characterized in that: The material of the protective structure (40) includes an inorganic anti-etching material; Preferably, the material of the protective structure (40) includes a metal material; Preferably, the material of the protection structure (40) comprises crystallized indium tin oxide.

3. The display panel according to claim 1, characterized in that: The display panel further comprises a pixel defining layer (24); the pixel defining layer (24) is located between the first electrode layer (23) and the isolation structure (30); the pixel defining layer (24) has a pixel opening (241); the isolation structure (30) encloses the isolation opening (31); an orthographic projection of the pixel opening (241) on the flat layer (21) falls within the orthographic projection range of the isolation opening (31) on the flat layer (21); and a portion of the first electrode layer (23) is exposed in the pixel opening (241); Preferably, the display panel further comprises a light emitting structure (51) and a second electrode (52), wherein the light emitting structure (51) and the second electrode (52) are stacked in the pixel opening (241), and the light emitting structure (51) is located between the first electrode layer (23) and the second electrode (52), and the material of at least part of the isolation structure (30) comprises a metallic conductive material, and the second electrode (52) is in conductive contact with the isolation structure (30).

4. The display panel according to claim 3, characterized in that: The metal layer (22) comprises a plurality of conductive parts (221) arranged at intervals, the conductive parts (221) being arranged corresponding to the light emitting structure (51), and the conductive parts (221) being located on the peripheral side corresponding to the light emitting structure (51), and the first electrode layer (23) being electrically connected to the conductive parts (221) located on the peripheral side of the light emitting structure (51) through the via holes (211).

5. The display panel according to claim 4, characterized in that: Along a direction parallel to the plane where the substrate (70) is located, the isolation structure (30) located on the peripheral side of one of the light-emitting structures (51) comprises a first part (301) and a second part (302) connected to each other, wherein the orthographic projection of the conductive part (221) on the substrate (70) falls within the orthographic projection range of the first part (301) on the substrate (70), the second part (302) is located between adjacent isolation openings (31), and the protective structure (40) is provided on a side of the first part (301) facing away from the substrate (70); Preferably, in a direction from the substrate (70) toward the isolation structure (30), a first height exists between a surface of the first part (301) facing away from the substrate (70) and the substrate (70), and a second height exists between a surface of the second part (302) facing away from the substrate (70) and the substrate (70), and the first height is smaller than the second height; Preferably, the orthographic projection area of ​​the protective structure (40) on the substrate (70) is greater than or equal to the orthographic projection area of ​​the conductive portion (221) on the substrate (70); The orthographic projection area of ​​the first part (301) on the substrate (70) is greater than or equal to the orthographic projection area of ​​the protective structure (40) on the substrate (70); Preferably, the orthographic projection of the protective structure (40) on the substrate (70) overlaps with the orthographic projection of the isolation structure (30) on the substrate (70); Preferably, the orthographic projection area of ​​the protective structure (40) on the substrate (70) is equal to the orthographic projection area of ​​the isolation structure (30) on the substrate (70); Preferably, a side wall of the protective structure (40) close to the light-emitting structure (51) is arranged to protrude relative to a side wall of the isolation structure (30) close to the light-emitting structure (51), and an orthographic projection of the isolation structure (30) on the substrate (70) is located within the range of an orthographic projection of the protective structure (40) on the substrate (70); Preferably, the protective structure (40) includes a first sub-portion (41) located in the via hole (211) and a second sub-portion (42) located outside the via hole (211), and in a direction perpendicular to the substrate (70), the thickness of the first sub-portion (41) is greater than the thickness of the second sub-portion (42), and a surface of the first sub-portion facing away from the substrate is located outside the via hole.

6. The display panel according to claim 3, characterized in that: The display panel further comprises a packaging structure (60), wherein the packaging structure (60) is arranged on a side of the second electrode (52) away from the flat layer (21), the packaging structure (60) overlaps a side wall of the isolation structure (30) on a side close to the light-emitting structure (51), and a portion of the packaging structure (60) is located on a side of the isolation structure (30) away from the substrate (70).

7. The display panel according to claim 3, characterized in that: The isolation structure (30) comprises a first structure layer (32) and a second structure layer (33); the second structure layer (33) is located between the first structure layer (32) and the pixel definition layer (24); an orthographic projection of the second structure layer (33) toward the flat layer (21) falls within an orthographic projection range of the first structure layer (32) toward the flat layer (21); an orthographic projection area of ​​the second structure layer (33) on the flat layer (21) is smaller than an orthographic projection area of ​​the first structure layer (32) on the flat layer (21); a material of the second structure layer (33) comprises a metal conductive material; and the second electrode (52) and the second structure layer (33) are overlapped.

8. The display panel according to claim 7, characterized in that: The cross section of the second structural layer (33) in a plane direction perpendicular to the planar layer (21) is trapezoidal, and the angle between the side wall of the second structural layer (33) and the surface of the planar layer (21) facing the pixel opening (241) is less than 90 degrees.

9. The display panel according to claim 7, characterized in that: The isolation structure (30) further comprises a third structural layer (34), the third structural layer (34) being arranged between the second structural layer (33) and the pixel defining layer (24), the metal material of the third structural layer (34) comprising a metal conductive material, and the second electrode (52) and the third structural layer (34) being overlapped.

10. The display panel according to claim 9, characterized in that: The material of the third structural layer (34) includes molybdenum, the material of the second structural layer (33) includes aluminum, and the material of the first structural layer (32) includes titanium.

11. The display panel according to claim 9, characterized in that: The orthographic projection of the third structural layer (34) toward the flat layer (21) falls within the orthographic projection range of the first structural layer (32) toward the flat layer (21), and the orthographic projection area of ​​the third structural layer (34) on the flat layer (21) is smaller than the orthographic projection area of ​​the first structural layer (32) on the flat layer (21).

12. The display panel according to claim 3, characterized in that: The display panel further comprises a driving circuit layer (80), the driving circuit layer (80) being arranged on a side of the flat layer (21) close to the substrate (70), the driving circuit layer (80) comprising a plurality of driving circuits (81), the driving circuit layer (80) being electrically connected to the metal layer (22), and the driving circuit (81) providing a driving signal to the light emitting structure (51) through the metal layer (22).

13. A display panel, characterized in that: include: base(70); A metal layer (22) is disposed on one side of the substrate (70); A flat layer (21) is arranged on a side of the metal layer (22) facing away from the substrate (70), the flat layer (21) having a via hole (211), and a portion of the metal layer (22) is exposed in the via hole (211); An isolation structure (30) is arranged on a side of the flat layer (21) facing away from the substrate (70); the via hole (211) is located on a side of the isolation structure (30) facing the substrate (70); an orthographic projection of the via hole (211) on the substrate (70) falls within a range of an orthographic projection of the isolation structure (30) on the substrate (70); and the isolation structure (30) encloses a plurality of isolation openings (31); a light-emitting structure (51), at least a portion of the light-emitting structure (51) being located in the isolation opening (31), and the light-emitting structure (51) being electrically connected to the metal layer (22) through the via hole (211); A protective structure (40) is arranged on a side of the isolation structure (30) facing away from the flat layer (21), and an orthographic projection of the protective structure (40) on the substrate (70) overlaps with an orthographic projection of the isolation structure (30) on the substrate (70).

14. The display panel according to claim 13, characterized in that: The material of the protective structure (40) includes an inorganic anti-etching material; Preferably, the material of the protective structure (40) comprises a metal material; Preferably, the material of the protection structure (40) comprises crystallized indium tin oxide.

15. The display panel according to claim 13, characterized in that: Along a direction parallel to the plane where the substrate (70) is located, the isolation structure (30) located on the peripheral side of one of the light-emitting structures (51) comprises a first part (301) and a second part (302) connected to each other, the metal layer (22) comprises a conductive part (221), and the conductive part (221) is exposed in the via hole (211); wherein the orthographic projection of the conductive part (221) on the substrate (70) falls within the orthographic projection range of the first part (301) on the substrate (70), the second part (302) is located between adjacent isolation openings (31), and the protective structure (40) is provided on a side of the second part (302) facing away from the substrate (70); Preferably, in a direction from the substrate (70) toward the isolation structure (30), a first height exists between a surface of the first part (301) on a side facing away from the substrate (70) and the substrate (70), a second height exists between a surface of the second part (302) on a side facing away from the substrate (70) and the substrate (70), and the first height is greater than the second height; Preferably, the orthographic projection area of ​​the protective structure (40) on the substrate (70) is greater than or equal to the orthographic projection area of ​​the conductive portion (221) on the substrate (70); The orthographic projection area of ​​the second portion (302) on the substrate (70) is greater than or equal to the orthographic projection area of ​​the protective structure (40) on the substrate (70); Preferably, the orthographic projection of the protective structure (40) on the substrate (70) overlaps with the orthographic projection of the isolation structure (30) on the substrate (70); Preferably, the orthographic projection area of ​​the protective structure (40) on the substrate (70) is equal to the orthographic projection area of ​​the isolation structure (30) on the substrate (70); Preferably, the side wall of the protective structure (40) close to the light-emitting structure (51) is arranged to protrude relative to the side wall of the isolation structure (30) close to the light-emitting structure (51), and the orthographic projection of the isolation structure (30) on the substrate (70) is located within the range of the orthographic projection of the protective structure (40) on the substrate (70).

16. The display panel according to claim 13, characterized in that: The display panel further comprises a first electrode layer (23) and a pixel defining layer (24); along a direction from the substrate (70) toward the isolation structure (30), the first electrode layer (23) and the pixel defining layer (24) are sequentially stacked on a side of the flat layer (21) away from the substrate (70); and the isolation structure (30) is arranged on a side of the pixel defining layer (24) away from the substrate (70); The pixel defining layer (24) has a pixel opening (241), and the orthographic projection of the pixel opening (241) on the flat layer (21) falls within the orthographic projection range of the isolation opening (31) on the flat layer (21); Part of the first electrode layer (23) is exposed in the pixel opening (241) and overlaps with the metal layer (22) through the via hole (211); the light-emitting structure (51) overlaps the side of the first electrode layer (23) that is away from the substrate (70).

17. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 16.

18. A method for manufacturing a display panel, characterized in that: The production method comprises: A backplane is provided, the backplane comprising a substrate (70) and a metal layer (22), a flat layer (21), and a first electrode layer (23) stacked in sequence on one side of the substrate, the flat layer (21) having a via hole (211), the metal layer (22) being arranged on one side of the flat layer (21) and partially exposed in the via hole (211), and the first electrode layer (23) being arranged on one side of the flat layer (21) and overlapping the metal layer (22) exposed in the via hole; forming an isolation material layer (300) on a side of the first electrode layer (23) facing away from the flat layer (21); forming a protective material layer (41), wherein the protective material layer covers a side of the isolation material layer (300) facing away from the flat layer (21); patterning the protective material layer to form a protective portion; The protection portion is processed by a crystallization process to form the protection structure (40).

19. The method for manufacturing a display panel according to claim 18, characterized in that: The manufacturing method further comprises: after processing the protection portion through a crystallization process, patterning the isolation material layer (300) to form an isolation structure (30).

20. The method for manufacturing a display panel according to claim 19, characterized in that: The isolation material layer (300) comprises a first structural material layer (320), a second structural material layer (330) and a third structural material layer (340) which are stacked in sequence along a direction toward the substrate (70); the backplane further comprises a pixel defining material layer (240), and the pixel defining material layer (240) is arranged between the first electrode layer (23) and the isolation material layer (300); The manufacturing method also includes: after forming the protective structure (40), patterning the first structural material layer (320), the second structural material layer (330) and the third structural material layer (340) in sequence to form an isolation structure (30) and an isolation opening (31); after forming the isolation opening (31), patterning the pixel defining material layer (240) to form a pixel opening (241).

Images