Image forming apparatus

Abstract

An imaging device according to an embodiment of the present disclosure includes a plurality of pixels including photoelectric conversion portions that photoelectrically convert light, a color filter provided for each pixel, a separation portion provided between adjacent photoelectric conversion portions, and a metal compound layer disposed on the photoelectric conversion portion between the color filters and the photoelectric conversion portion. The structure is provided from between adjacent color filters to the metal compound layer and is connected to a separation portion.

Description

Technical Field

[0001] The present disclosure relates to an imaging device. Background Art

[0002] An imaging device is proposed in which a gap having a refractive index lower than that of the color filters is provided between two adjacent color filters (PTL 1).

[0003] Citation list

[0004] Patent Literature

[0005] PTL 1: U.S. Patent Application Publication No. 2019 / 0157329 Summary of the invention

[0006] An imaging device is needed to prevent color mixing between pixels.

[0007] It is desirable to provide an imaging device that can reduce color mixing.

[0008] An imaging device according to an embodiment of the present disclosure includes: a plurality of pixels including a photoelectric conversion unit that performs photoelectric conversion on light, a color filter provided for each pixel, a separation unit provided between adjacent photoelectric conversion units, a structure having a gap provided between adjacent color filters, and a metal compound layer provided on the photoelectric conversion unit between the color filter and the photoelectric conversion unit. The structure is provided from between adjacent color filters to the metal compound layer and connected to the separation unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 : is a block diagram showing an example of a schematic configuration of an imaging device according to a first embodiment of the present disclosure.

[0010] Figure 2 is a diagram illustrating an example of a pixel portion of an imaging device according to the first embodiment of the present disclosure.

[0011] Figure 3 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a first embodiment of the present disclosure.

[0012] Figure 4 : is a diagram illustrating an example of a planar configuration of an imaging device according to a first embodiment of the present disclosure.

[0013] Figure 5 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a first embodiment of the present disclosure.

[0014] Fig. 6A is a diagram illustrating a method of manufacturing an imaging device according to a first embodiment of the present disclosure.

[0015] Figure 6B is a diagram illustrating an example of a method of manufacturing the imaging device according to the first embodiment of the present disclosure.

[0016] Figure 6C is a diagram illustrating an example of a method of manufacturing the imaging device according to the first embodiment of the present disclosure.

[0017] Fig.6D is a diagram illustrating an example of a method of manufacturing the imaging device according to the first embodiment of the present disclosure.

[0018] Figure 7 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a first modification example of the present disclosure.

[0019] Fig. 8A is a diagram illustrating an example of a method of manufacturing an imaging device according to a first modification example of the present disclosure.

[0020] Figure 8B is a diagram illustrating an example of a method of manufacturing an imaging device according to a first modification example of the present disclosure.

[0021] Figure 8C is a diagram illustrating an example of a method of manufacturing an imaging device according to a first modification example of the present disclosure.

[0022] Fig.8D is a diagram illustrating an example of a method of manufacturing an imaging device according to a first modification example of the present disclosure.

[0023] Fig. 9 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a second modification example of the present disclosure.

[0024] Fig. 10A is a diagram illustrating an example of a method of manufacturing an imaging device according to a second modification example of the present disclosure.

[0025] Fig. 10B is a diagram illustrating an example of a method of manufacturing an imaging device according to a second modification example of the present disclosure.

[0026] Fig. 10C is a diagram illustrating an example of a method of manufacturing an imaging device according to a second modification example of the present disclosure.

[0027] Fig. 10D is a diagram illustrating an example of a method of manufacturing an imaging device according to a second modification example of the present disclosure.

[0028] Fig.11 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a third modification example of the present disclosure.

[0029] Fig. 12A is a diagram illustrating an example of a method of manufacturing an imaging device according to a third modification example of the present disclosure.

[0030] Fig. 12B is a diagram illustrating an example of a method of manufacturing an imaging device according to a third modification example of the present disclosure.

[0031] Fig. 12C is a diagram illustrating an example of a method of manufacturing an imaging device according to a third modification example of the present disclosure.

[0032] Fig.12D is a diagram illustrating an example of a method of manufacturing an imaging device according to a third modification example of the present disclosure.

[0033] Fig.13 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a fourth modification example of the present disclosure.

[0034] Fig.14A is a diagram illustrating an example of a method of manufacturing an imaging device according to a fourth modification example of the present disclosure.

[0035] Fig. 14B is a diagram illustrating an example of a method of manufacturing an imaging device according to a fourth modification example of the present disclosure.

[0036] Fig. 14C is a diagram illustrating an example of a method of manufacturing an imaging device according to a fourth modification example of the present disclosure.

[0037] Fig.14D is a diagram illustrating an example of a method of manufacturing an imaging device according to a fourth modification example of the present disclosure.

[0038] Fig.15 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a second embodiment of the present disclosure.

[0039] Fig.16 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a second embodiment of the present disclosure.

[0040] Fig.17 is a diagram illustrating another example of the cross-sectional configuration of the imaging device according to the second embodiment of the present disclosure.

[0041] Fig.18A is a diagram illustrating an example of a method of manufacturing an imaging device according to a second embodiment of the present disclosure.

[0042] Fig.18B is a diagram illustrating an example of a method of manufacturing an imaging device according to a second embodiment of the present disclosure.

[0043] Fig. 18C is a diagram illustrating an example of a method of manufacturing an imaging device according to a second embodiment of the present disclosure.

[0044] Fig.18Dis a diagram illustrating an example of a method of manufacturing an imaging device according to a second embodiment of the present disclosure.

[0045] Fig.19 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a fifth modification example of the present disclosure.

[0046] Fig. 20A is a diagram illustrating an example of a method of manufacturing an imaging device according to a fifth modification example of the present disclosure.

[0047] Fig. 20B is a diagram illustrating an example of a method of manufacturing an imaging device according to a fifth modification example of the present disclosure.

[0048] Fig. 20C is a diagram illustrating an example of a method of manufacturing an imaging device according to a fifth modification example of the present disclosure.

[0049] Fig.20D is a diagram illustrating an example of a method of manufacturing an imaging device according to a fifth modification example of the present disclosure.

[0050] Fig.21 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a sixth modification example of the present disclosure.

[0051] Fig. 22 is a block diagram showing a configuration example of an electronic device including an imaging device.

[0052] Fig.23 is a block diagram showing an example of a schematic configuration of a vehicle control system.

[0053] Fig.24 1 is a diagram for assisting in explaining an example of the installation positions of the vehicle exterior information detection unit and the imaging unit.

[0054] Fig.25 : is a diagram showing an example of a schematic configuration of an endoscopic surgery system.

[0055] Fig.26 is a block diagram showing an example of the functional configuration of a camera head and a camera control unit (CCU). DETAILED DESCRIPTION

[0056] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that the description is given in the following order.

[0057] 1. First Implementation Method

[0058] 2. Second Implementation Method

[0059] 3. Application examples

[0060] 4. Application examples

[0061] <1. First Implementation Method>

[0062] Figure 1 : is a block diagram showing an example of a schematic configuration of an imaging device according to a first embodiment of the present disclosure. Figure 2 1 is a diagram showing an example of a pixel unit of an imaging device according to a first embodiment. The imaging device 1 includes a plurality of pixels P, each of which includes a photoelectric conversion unit and performs photoelectric conversion on incident light to generate a signal. For example, the photoelectric conversion unit is a photodiode and is capable of performing photoelectric conversion on light. Figure 2 As shown, the imaging device 1 has, as an imaging region, a region (pixel portion 100 ) in which a plurality of pixels P are two-dimensionally arranged in a matrix form.

[0063] The imaging device 1 receives incident light (image light) from a subject via an optical system (not shown) including an optical lens. The imaging device 1 images an image of the subject formed by the optical lens. The imaging device 1 performs photoelectric conversion on the received light and generates a pixel signal. For example, the imaging device 1 is a complementary metal oxide semiconductor (CMOS) image sensor. The imaging device 1 can be used in electronic devices such as digital cameras, video cameras, or mobile phones.

[0064] Note that Figure 2 As shown, the incident direction of light from the subject is called the Z-axis direction, the horizontal direction on the paper plane perpendicular to the Z-axis direction is called the X-axis direction, and the vertical direction on the paper plane perpendicular to the Z-axis and the X-axis is called the Y-axis direction. Figure 2 The arrows in the figure indicate the direction.

[0065] like Figure 1 In the illustrated example, the imaging device 1 includes, for example, a vertical drive section 111 , a signal processing section 112 , a horizontal drive section 113 , an output section 114 , a control section 115 , an input / output terminal 116 , and the like in a peripheral area of ​​the pixel section 100 .

[0066] In the imaging device 1, for example, a plurality of pixel drive lines Lread and a plurality of vertical signal lines VSL are provided. For example, in the pixel section 100, a plurality of pixel drive lines Lread are wired for each pixel row including a plurality of pixels P arranged in the horizontal direction (row direction). In addition, in the pixel section 100, a vertical signal line VSL is wired for each pixel column including a plurality of pixels P arranged in the vertical direction (column direction).

[0067] The pixel drive line Lread transmits a drive signal for reading a signal from the pixel P. The vertical signal line VSL is a signal line capable of transmitting a signal from the pixel P. The vertical signal line VSL transmits a signal output from the pixel P.

[0068] The vertical driving section 111 includes a shift register, an address decoder, and the like. The vertical driving section 111 drives each pixel P of the pixel section 100. The vertical driving section 111 is a pixel driving section and generates a signal for driving the pixel P and outputs the signal to each pixel P of the pixel section 100 via a pixel driving line Lread. The vertical driving section 111 generates, for example, a signal for controlling a transfer transistor, a signal for controlling a reset transistor, and the like, and supplies the signal to each pixel P via the pixel driving line Lread.

[0069] The signal processing unit 112 performs signal processing on the input signal of the pixel. The signal processing unit 112 includes, for example, a load circuit unit, an analog-to-digital (AD) converter, a horizontal selection switch, and the like.

[0070] A signal output from each pixel P selectively scanned by the vertical drive section 111 is supplied to the signal processing section 112 through the vertical signal line VSL. The signal processing section 112 performs signal processing such as AD conversion and correlated double sampling (CDS).

[0071] The horizontal driving section 113 includes a shift register, an address decoder, etc. The horizontal driving section 113 drives the horizontal selection switch of the signal processing section 112. The horizontal driving section 113 sequentially drives each horizontal selection switch when scanning each horizontal selection switch of the signal processing section 112. The signal of each pixel P transmitted through each vertical signal line VSL is signal-processed by the signal processing section 112, and the signal is sequentially output to the horizontal signal line 121 through selective scanning of the horizontal driving section 113.

[0072] The output section 114 performs signal processing on the input signal and outputs the signal. The output section 114 performs signal processing on the signals of the pixels sequentially input from the signal processing section 112 via the horizontal signal line 121 and outputs the processed signals. For example, the output section 114 may perform only buffering, or may perform black level adjustment, column variation correction, various types of digital signal processing, and the like.

[0073] The circuit part including the vertical driving part 111, the signal processing part 112, the horizontal driving part 113, the horizontal signal line 121 and the output part 114 can be formed on the semiconductor substrate 11, or can be arranged on an external control integrated circuit (IC). In addition, the circuit part can also be formed on another substrate connected by a cable or the like.

[0074] The control section 115 controls each section of the imaging device 1. The control section 115 receives a clock, data indicating an operation mode, etc. from outside the semiconductor substrate 11 and outputs data such as internal information of the imaging device 1. The control section 115 includes a timing generator that generates various timing signals and drives and controls peripheral circuits such as the vertical driving section 111, the signal processing section 112, and the horizontal driving section 113 based on the various timing signals generated by the timing generator. The input / output terminal 116 exchanges signals with the outside.

[0075] Figure 3 : is a diagram showing an example of a cross-sectional configuration of an imaging device according to the first embodiment. Figure 4 1 is a diagram showing an example of a planar configuration of an imaging device according to the first embodiment. The imaging device 1 includes a light receiving portion 10 and a light guiding portion 20. The light receiving portion 10 includes a semiconductor substrate 11 having a first surface 11S1 and a second surface 11S2 facing each other. Note that Figure 3 An example of a cross-sectional configuration in a region at a longer distance from the center of the pixel section 100 (light receiving section 10 ) (that is, where the image height is high) is shown.

[0076] The light guide portion 20 is provided on the first surface 11S1 of the semiconductor substrate 11. A multilayer wiring layer (not shown) is provided on the second surface 11S2 of the semiconductor substrate 11. The imaging device 1 has a configuration in which the light receiving portion 10, the light guide portion 20, and the multilayer wiring layer are stacked in the Z-axis direction. It can also be said that the light guide portion 20 is provided on the side where light enters from the optical lens system, and the multilayer wiring layer is provided on the side opposite to the side where light enters. The imaging device 1 is a so-called back-illuminated imaging device.

[0077] For example, the semiconductor substrate 11 is composed of a silicon substrate. The photoelectric conversion unit 12 is a photodiode (PD) and has a pn junction in a predetermined region of the semiconductor substrate 11. A plurality of photoelectric conversion units 12 are embedded and formed in the semiconductor substrate 11. In the light receiving unit 10, a plurality of photoelectric conversion units 12 are provided along the first surface 11S1 and the second surface 11S2 of the semiconductor substrate 11.

[0078] For example, the multilayer wiring layer provided on the second surface 11S2 side of the semiconductor substrate 11 has a structure in which a plurality of wiring layers are stacked with an interlayer insulating layer therebetween. For example, the wiring layers of the multilayer wiring layer are formed using aluminum (Al), copper (Cu), tungsten (W), etc. For example, the interlayer insulating layer is formed using silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), etc.

[0079] In the semiconductor substrate 11 and the multi-layer wiring layer, a circuit (e.g., a transfer transistor, a reset transistor, an amplifying transistor, etc.) is formed for reading out a pixel signal based on the charge generated by the photoelectric conversion unit 12. In addition, in the semiconductor substrate 11 and the multi-layer wiring layer, for example, the vertical drive unit 111, the signal processing unit 112, the horizontal drive unit 113, the output unit 114, the control unit 115, and the input / output terminal 116 are also formed.

[0080] The light guide section 20 is stacked on the light receiving section 10 along the thickness direction perpendicular to the first surface 11S1 of the semiconductor substrate 11. The light guide section 20 includes a lens section 21 and a color filter 25 and guides light incident from above into the light receiving section 10. The lens section 21 is an optical component called an on-chip lens and is provided above the color filter 25 for each pixel P, for example. Light from a subject enters the lens section 21 via the optical system of the imaging device 1. The photoelectric conversion section 12 performs photoelectric conversion on light incident via the lens section 21 and the color filter 25.

[0081] The color filter 25 selectively transmits light of a specific wavelength band in the incident light. Figure 4 As shown, the plurality of pixels P provided in the pixel section 100 of the imaging device 1 include a plurality of pixels Pr, a plurality of pixels Pg, and a plurality of pixels Pb. In the pixel section 100, a plurality of pixels Pr, a plurality of pixels Pg, and a plurality of pixels Pb are repeatedly arranged.

[0082] The pixel Pr is a pixel in which a color filter 25 transmitting red (R) light is provided. The red color filter 25 transmits light of a red wavelength band. The photoelectric conversion unit of the pixel Pr receives light of a red wavelength and performs photoelectric conversion. The pixel Pr is a pixel that receives light of a red wavelength band and generates a signal. In addition, the pixel Pg is a pixel in which a color filter 25 transmitting green (G) light is provided. The green color filter 25 transmits light of a green wavelength band. The photoelectric conversion unit of the pixel Pg receives light of a green wavelength and performs photoelectric conversion. The pixel Pg is a pixel that receives light of a green wavelength band and generates a signal.

[0083] Pixel Pb is a pixel in which a color filter 25 transmitting blue (B) light is provided. The blue color filter 25 transmits light of a blue wavelength band. The photoelectric conversion unit of pixel Pb receives light of a blue wavelength and performs photoelectric conversion. Pixel Pb is a pixel that receives light of a blue wavelength band and generates a signal. Pixel Pr, pixel Pg, and pixel Pb generate a pixel signal of an R component, a pixel signal of a G component, and a pixel signal of a B component, respectively. Therefore, the imaging device 1 can obtain pixel signals of RGB.

[0084] In addition, if Figure 3As shown, in the imaging device 1, a separation portion 15, a metal compound layer 30, and an oxide film layer 40 are provided. The separation portion 15 is provided between adjacent photoelectric conversion portions 12 and separates the photoelectric conversion portions 12. The separation portion 15 has a groove structure provided at a boundary between adjacent pixels P (or photoelectric conversion portions 12), and is referred to as an inter-pixel separation portion or an inter-pixel separation wall.

[0085] The separation portion 15 includes a groove 16 (groove portion). The groove 16 of the separation portion 15 is provided in the semiconductor substrate 11 so as to surround the photoelectric conversion portion 12. In the groove 16, for example, an oxide film is provided. Figure 3 In the example shown, a groove 16 (trench) is formed between adjacent photoelectric conversion sections 12 , and an oxide film is embedded in the groove 16 .

[0086] The metal compound layer 30 is provided on the photoelectric conversion section 12 between the color filter 25 and the photoelectric conversion section 12. The metal compound layer 30 is composed of a metal compound. For example, the metal compound layer 30 is a layer made of a metal oxide or a metal nitride.

[0087] The metal compound layer 30 includes a fixed charge film 31 and an antireflection film 32. The fixed charge film 31 is a film having fixed charges and is formed using a high dielectric. For example, the fixed charge film 31 is composed of a metal oxide such as hafnium oxide and is provided on the photoelectric conversion unit 12. The fixed charge film 31 is formed between the photoelectric conversion unit 12 and the separation unit 15.

[0088] exist Figure 3 In the example shown, the fixed charge film 31 is provided to cover the photoelectric conversion portion 12. For example, the fixed charge film 31 is a film having negative fixed charge and prevents dark current from being generated at the interface of the semiconductor substrate 11. The fixed charge film 31 is formed to include at least one of oxides of elements such as hafnium (Hf), zirconium (Zr), aluminum (Al), titanium (Ti), tantalum (Ta), magnesium (Mg), yttrium (Y), lanthanum (La), and the like.

[0089] Note that the fixed charge film 31 may be composed of praseodymium oxide, cerium oxide, neodymium oxide, promethium oxide, samarium oxide, europium oxide, gadolinium oxide, terbium oxide, dysprosium oxide, holmium oxide, thulium oxide, ytterbium oxide, lutetium oxide, yttrium oxide, or the like. In addition, the fixed charge film 31 may be composed of a metal nitride or metal oxynitride such as an aluminum nitride film, a hafnium oxynitride film, or an aluminum oxynitride film. As the fixed charge film 31, a film having a positive fixed charge may be provided.

[0090] The anti-reflection film 32 is made of a metal oxide such as tantalum oxide and is provided on the fixed charge film 31. The anti-reflection film 32 is provided between the fixed charge film 31 and the oxide film layer 40 and reduces reflection. The anti-reflection film 32 may be made of a metal oxide film other than tantalum oxide, or may be made of a metal nitride film or a metal oxynitride film. In the separation portion 15, as Figure 3 In the example shown in , the fixed charge film 31 and the anti-reflection film 32 may be formed to cover the side surfaces of the trench 16 .

[0091] The oxide film layer 40 is provided between the color filter 25 and the metal compound layer 30. The oxide film layer 40 is formed using silicon oxide (SiOx), for example. The oxide film layer 40 is composed of a silicon dioxide film, a silicon oxynitride film, etc. Note that the oxide film layer 40 is also called a planarization layer (planarization film).

[0092] In addition, if Figure 3 As shown, the imaging device 1 includes a structure 50. A portion of the structure 50 is located between adjacent color filters 25 and separates the color filters 25. The structure 50 is also referred to as a partition wall (or partition) having a gap (cavity) disposed between adjacent color filters 25 and utilizing the gap (cavity).

[0093] The structure 50 is provided from between the adjacent color filters 25 to the metal compound layer 30 and connected to the separation portion 15. Figure 3 As shown, the structure 50 extends between the oxide film layer 40 and the metal compound layer 30. A portion of the structure 50 is formed on the metal compound layer 30 and in contact with the metal compound layer 30. Figure 4 As shown, structure 50 is disposed around color filter 25 .

[0094] like Figure 3 As shown, the structure 50 includes a first portion 51 disposed between adjacent color filters 25 and a second portion 52 disposed along the metal compound layer 30 to the separation portion 15. The first portion 51 of the structure 50 is located between adjacent color filters 25 and has a refractive index lower than that of the surrounding medium.

[0095] The refractive index of the first portion 51 of the structure 50 is lower than the refractive index of the color filter 25. In the present embodiment, the first portion 51 has air (voids). The first portion 51 of the structure 50 is a light guide portion and changes the traveling direction of incident light according to the difference in refractive index between the first portion 51 and the surrounding medium. It can also be said that the imaging device 1 has a waveguide structure that guides light using the first portion 51 of the structure 50.

[0096] The second portion 52 of the structure 50 is composed of a light shielding member and is provided on the metal compound layer 30. The second portion 52 of the structure 50 is composed of, for example, titanium nitride (TiN) and connects the first portion 51 and the separation portion 15. It can also be said that the second portion 52 is a connecting portion (or a connecting portion) connecting the first portion 51 and the groove 16 of the separation portion 15.

[0097] The second portion 52 of the structure 50 connects the first portion 51 and the separator 15 and prevents light from leaking to the surrounding pixels P. Note that the second portion 52 of the structure 50 may be composed of a metal film that absorbs light. For example, the second portion 52 may be composed of tungsten (W).

[0098] Light from the optical lens enters the center portion of the pixel section 100 of the imaging device 1 almost vertically. Figure 3 In the example shown by the arrow in the middle, light obliquely enters the peripheral portion located outside the central portion, that is, the region away from the center of the pixel section 100. Therefore, in the imaging device 1, the positions of the lens section 21 and the color filter 25 in each pixel P are set to be different according to the distance (that is, height) from the center of the pixel section 100 (light receiving section 10).

[0099] like Figure 3 As shown, the lens section 21 and the color filter 25 of the pixel P are arranged to be offset toward the center side of the pixel section 100 (light receiving section 10) relative to the photoelectric conversion section 12 of the pixel P. The size of the second portion 52 of the structure 50 varies depending on the distance from the center of the light receiving section 10. For example, as the distance of a region from the center of the pixel section 100 increases, the width (area) of the second portion 52 of the structure 50 in the region increases.

[0100] Note that in the central region of the pixel portion 100, for example, the pixels P are Figure 5 In the pixel P at the center of the pixel portion 100, as shown in FIG. Figure 5 As shown in the example in FIG. 1 , the center positions of the lens portion 21 , the color filter 25 , and the photoelectric conversion portion 12 substantially coincide with each other.

[0101] In this way, in the imaging device 1, the position of each of the lens section 21 and the color filter 25 is adjusted according to the height, and pupil correction can be performed appropriately. It is possible to suppress a reduction in the amount of light incident on the photoelectric conversion section 12 and prevent a decrease in the sensitivity of the incident light.

[0102] Furthermore, in the imaging device 1 according to the present embodiment, light leakage to surrounding pixels and occurrence of color mixing can be prevented by providing the structure 50. The structure 50 can propagate incident light to the photoelectric conversion unit 12 side and improve the sensitivity of the incident light.

[0103] FIG. 6A to FIG. 6D1 is a diagram showing an example of a method for manufacturing an imaging device according to a first embodiment. Fig. 6A As shown, a metal compound layer 30 is formed on a semiconductor substrate 11 on which elements such as a photoelectric conversion unit 12 are formed. In addition, a titanium nitride film is formed as a second portion 52 of the structure 50, and a silicon dioxide film is formed as an oxide film layer 40. Then, the excess silicon dioxide film is removed by CMP or an etch-back process.

[0104] Next, if Figure 6B As shown in FIG. 1 , an a-silicon film 53 (amorphous silicon film) is formed, and a silicon dioxide film is formed around the a-silicon film 53 as a protective film. Figure 6C As shown, the color filter 25 is formed. Then, a hole (opening) is formed in a portion of the silicon dioxide film on the a-silicon film 53, and the a-silicon film 53 is etched through the hole. Thus, a void of the first portion 51 of the structure 50 is formed. Note that the hole on the silicon dioxide film may be arranged at the corners (corners) of the pixel P, for example, at four corners in a plan view.

[0105] After the voids have been formed, the pores are closed, for example, by a silicon dioxide membrane. Fig.6D As shown, a structure 50 having a gap of the first portion 51 is formed. According to the above manufacturing method, a Figure 3 The imaging device 1 shown in the figure, etc. Note that the above-mentioned manufacturing method is only an example, and other manufacturing methods can also be used.

[0106] [Function and Effect]

[0107] The imaging device (imaging device 1) according to the present embodiment includes a plurality of pixels (pixels P), the pixels P including a photoelectric conversion unit (photoelectric conversion unit 12) that performs photoelectric conversion on light, a color filter (color filter 25) provided for each pixel, a separation unit (15) provided between adjacent photoelectric conversion units, a structure (structure 50) having a gap provided between adjacent photoelectric conversion units, and a metal compound layer (metal compound layer 30) provided on the photoelectric conversion unit between the color filter and the photoelectric conversion unit. The structure is provided from between adjacent color filters to the metal compound layer and connected to the separation unit.

[0108] In the imaging device 1 according to the present embodiment, the structure 50 having a gap is provided from between the adjacent color filters 25 to the metal compound layer 30 and connected to the separation portion 15. Therefore, the occurrence of color mixing between pixels can be prevented. The imaging device 1 capable of reducing color mixing can be realized.

[0109] Furthermore, in the present embodiment, the structure 50 includes a first portion 51 disposed between adjacent color filters 25 and a second portion 52 disposed along the metal compound layer 30 to the separation portion 15. The first portion 51 is composed of a void, and the second portion 52 is composed of a metal film. By providing the structure 50 in which the first portion 51 having a void and the second portion 52 composed of a metal film are stacked, the occurrence of color mixing can be effectively prevented. The image quality of the image can be prevented from being degraded.

[0110] Next, a modification of the present disclosure is described. Hereinafter, components similar to those in the above-described embodiment are denoted by the same reference numerals, and description thereof is appropriately omitted.

[0111] (1-1. First Modification)

[0112] Figure 7 1 is a diagram showing an example of a cross-sectional configuration of an imaging device according to a first modification of the present disclosure. The second portion 52 of the structure 50 may be composed of a void and a metal film. Figure 7 In the example shown, the second portion 52 of the structure 50 includes a metal film (eg, titanium nitride film) stacked on the metal compound layer 30 and a void stacked on the metal film. In the case of this modification, the same effects as those of the above-described embodiment can be achieved.

[0113] FIG. 8A to FIG. 8D 1 is a diagram showing an example of a method for manufacturing an imaging device according to a first modification. Fig. 8A As shown, a metal compound layer 30 is formed on a semiconductor substrate 11 on which elements such as a photoelectric conversion unit 12 are formed. In addition, a titanium nitride film and an a-silicon film 53a are formed as a second portion 52 of the structure 50, and a silicon dioxide film is formed as an oxide film layer 40. Then, the excess silicon dioxide film is removed by CMP or an etch-back process.

[0114] Then, if Figure 8B As shown in FIG. 1 , an a-silicon film 53b is formed, and a silicon dioxide film is formed around the a-silicon films 53a and 53b as a protective film. Then, as shown in FIG. Figure 8C As shown, a color filter 25 is formed.

[0115] Next, a hole (opening) is formed in a portion of the silicon dioxide film on the a-silicon film 53b, and the a-silicon film 53b and the a-silicon film 53a are etched through the hole. Thus, a void is formed as the first portion 51 of the structure 50. Fig.8D As shown in FIG. 5 , after the voids are formed, the pores are sealed with a silicon dioxide film to form a structure 50 having voids. According to the above-mentioned manufacturing method, a Figure 7 The imaging device 1 is shown.

[0116] (1-2. Second Modification)

[0117] Fig. 9 1 is a diagram showing an example of a cross-sectional configuration of an imaging device according to a second modification. The second portion 52 of the structure 50 may be composed of a variety of metal films. Fig. 9 As shown, the second portion 52 of the structure 50 may have a configuration in which a first metal film 54 a and a second metal film 54 b are stacked.

[0118] For example, the first metal film 54a is composed of a titanium nitride film and is provided on the metal compound layer 30. In addition, the second metal film 54b is composed of a tungsten film and is provided on the first metal film 54a. Note that the first metal film 54a and the second metal film 54b may be composed of other metal materials.

[0119] FIG. 10A to FIG. 10D 1 is a diagram showing an example of a method for manufacturing an imaging device according to a second modification. Fig. 10A As shown, a metal compound layer 30 is formed on a semiconductor substrate 11 on which elements such as a photoelectric conversion unit 12 are formed. In addition, a titanium nitride film is formed as a first metal film 54a, a tungsten film is formed as a second metal film 54b, and a silicon dioxide film is formed as an oxide film layer 40. Then, the excess silicon dioxide film is removed by CMP or an etch-back process.

[0120] Then, if Fig. 10B As shown in FIG. 5 , an a-silicon film 53 is formed, and a silicon dioxide film is formed around the a-silicon film 53 as a protective film. Then, as shown in FIG. Fig. 10C As shown, a color filter 25 is formed.

[0121] Next, a hole is formed in a portion of the silicon dioxide film on the a-silicon film 53, and the a-silicon film 53 is etched through the hole. Thus, a void of the first portion 51 of the structure 50 is formed. Fig. 10D As shown in FIG. 5 , after the voids are formed, the pores are sealed with a silicon dioxide film to form a structure 50 having voids. According to the above-mentioned manufacturing method, a Fig. 9 The imaging device 1 is shown.

[0122] (1-3. Third Modification)

[0123] Fig.11 is a diagram showing an example of a cross-sectional configuration of an imaging device according to a third modification. The second portion 52 of the structure 50 may be composed of a void and a plurality of metal films. Fig.11 In the illustrated example, the second portion 52 of the structure 50 includes a first metal film 54 a stacked on the metal compound layer 30 , a second metal film 54 b stacked on the first metal film 54 a , and a void stacked on the second metal film 54 b .

[0124] FIG. 12A to FIG. 12D1 is a diagram showing an example of a method for manufacturing an imaging device according to a third modification. Fig. 12A As shown, a metal compound layer 30 is formed on a semiconductor substrate 11 on which elements such as a photoelectric conversion unit 12 are formed. In addition, a first metal film 54a, a second metal film 54b, and an a-silicon film 53a are formed as a second portion 52 of the structure 50, and a silicon dioxide film is formed as an oxide film layer 40. Then, the excess silicon dioxide film is removed by CMP or an etch-back process.

[0125] Next, if Fig. 12B As shown in FIG. 1 , an a-silicon film 53b is formed, and a silicon dioxide film is formed around the a-silicon films 53a and 53b as a protective film. Then, as shown in FIG. Fig. 12C As shown, a color filter 25 is formed.

[0126] Next, a hole is formed in a portion of the silicon dioxide film on the a-silicon film 53b, and the a-silicon film 53b and the a-silicon film 53a are etched through the hole. Thus, a void of the structure 50 is formed. Fig.12D As shown in FIG. 5 , after the voids are formed, the pores are sealed with a silicon dioxide film to form a structure 50 having voids. According to the above-mentioned manufacturing method, a Fig.11 The imaging device 1 is shown.

[0127] (1-4. Fourth Modification)

[0128] Fig.13 1 is a diagram showing an example of a cross-sectional configuration of an imaging device according to a fourth modification. Fig.13 As shown, a portion of the structure 50 may be disposed in the separation portion 15. Fig.13 In the example shown, a part of the second portion 52 of the structure 50 is embedded and formed in the separation portion 15. In the case of this modification, the same effects as those of the above-described embodiment can be achieved.

[0129] FIG. 14A to FIG. 14D 1 is a diagram showing an example of a method for manufacturing an imaging device according to a fourth modification. Fig.14A As shown, on the semiconductor substrate 11 on which elements such as the photoelectric conversion portion 12 are formed, the metal compound layer 30 is formed. In addition, a titanium nitride film as the second portion 52 of the structure 50 and a silicon dioxide film as the oxide film layer 40 are formed. A portion of the second portion 52 of the structure 50 is embedded and formed in the separation portion 15. Then, the excess silicon oxide film is removed by CMP or an etch-back process.

[0130] Then, if Fig. 14B As shown in FIG. 5 , an a-silicon film 53 is formed, and a silicon dioxide film is formed around the a-silicon film 53 as a protective film. Then, as shown in FIG. Fig. 14C As shown, a color filter 25 is formed.

[0131] Next, a hole is formed in a portion of the silicon dioxide film on the a-silicon film 53, and the a-silicon film 53 is etched through the hole. Thus, a void of the first portion 51 of the structure 50 is formed. Fig.14D As shown in FIG. 5 , after the voids are formed, the pores are sealed with a silicon dioxide film to form a structure 50 having voids. According to the above-mentioned manufacturing method, a Fig.13 The imaging device 1 is shown.

[0132] <2. Second Implementation Method>

[0133] Next, a second embodiment according to the present disclosure is described. Hereinafter, components similar to those in the above-described embodiment are denoted by the same reference numerals, and description thereof is appropriately omitted.

[0134] Fig.15 : is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to a second embodiment of the present disclosure. Fig.15 An example of a cross-sectional configuration in a region at a relatively long distance from the center of the pixel portion 100 (light receiving portion 10) (i.e., a high image height) is shown. In the present embodiment, the second portion 52 of the structure 50 is composed of air (gap). Both the first portion 51 and the second portion 52 are composed of gaps, and it can also be said that the first portion 51 and the second portion 52 are continuously arranged.

[0135] The second portion 52 of the structure 50 is a light guide and changes the traveling direction of incident light according to the refractive index difference between the second portion 52 and the surrounding medium. It can also be said that the imaging device 1 has a waveguide structure that guides light using the first and second portions 51 and 52 of the structure 50.

[0136] In the imaging device 1 according to the present embodiment, by providing the first portion 51 and the second portion 52 formed of the gap, it is possible to prevent light from leaking to the surrounding pixels P and prevent color mixing from occurring. In addition, the structure 50 formed of the gap can effectively guide light to the photoelectric conversion unit 12 and can improve the sensitivity of incident light.

[0137] Furthermore, the second portion 52 of the structure 50 is composed of a void and is formed in contact with the metal compound layer 30. Compared with the case where the low refractive index material is formed within the oxide film layer, the difficulty of manufacturing the imaging device 1 can be reduced.

[0138] Note that in the central area of ​​the pixel portion 100, for example, the pixel P is Fig.16 In the pixel P at the center of the pixel unit 100, the center positions of the lens unit 21, the color filter 25 and the photoelectric conversion unit 12 are substantially coincident. Fig.16 as shown in the example.

[0139] In addition, the width w1 of the second portion 52 of the structure 50 in the central portion of the pixel portion 100 (see Fig.16 ) is smaller than the width w2 of the second portion 52 of the structure 50 in the peripheral portion located outside the central portion (see Fig.15 ). Note that if Fig.17 As shown, the width w1 of the second portion 52 of the structure 50 in the central portion of the pixel portion 100 may be substantially equal to Fig.15 The second portion 52 is shown to have a width w2.

[0140] [Function and Effect]

[0141] The imaging device (imaging device 1) according to the present embodiment includes a plurality of pixels (pixels P), the pixels P including a photoelectric conversion unit (photoelectric conversion unit 12) that performs photoelectric conversion on light, a color filter (color filter 25) provided for each pixel, a separator (separator 15) provided between adjacent photoelectric conversion units, a structure (structure 50) having a gap (first portion 51, second portion 52) provided between adjacent color filters, and a metal compound layer (metal compound layer 30) provided on the photoelectric conversion unit between the color filter and the photoelectric conversion unit. The structure is provided from between adjacent color filters to the metal compound layer and connected to the separator.

[0142] In the imaging device 1 according to the present embodiment, the structure 50 is provided from between the adjacent color filters 25 to the metal compound layer 30 and connected to the separation portion 15. Therefore, the occurrence of color mixing can be prevented. The imaging device 1 capable of reducing color mixing can be realized.

[0143] In addition, in the present embodiment, the structure 50 includes a first portion 51 disposed between adjacent color filters 25 and a second portion 52 disposed along the metal compound layer 30 to the separation portion 15. The first portion 51 and the second portion 52 are formed by a gap. By providing the structure 50 formed by the gap, the occurrence of color mixing can be effectively prevented. In addition, light can be effectively guided to the photoelectric conversion portion 12, and the sensitivity of the incident light can be improved. Deterioration of image quality can be prevented.

[0144] 18A to 18D 1 is a diagram showing an example of a method for manufacturing an imaging device according to a second embodiment. Fig.18A As shown, on the semiconductor substrate 11 on which elements such as the photoelectric conversion unit 12 are formed, the metal compound layer 30 is formed. In addition, as the oxide film layer 40, a silicon dioxide film is formed.

[0145] Next, if Fig.18B As shown, for example, an a-silicon film 53 (amorphous silicon film) is formed by chemical vapor deposition (CVD), and a silicon dioxide film is formed around the a-silicon film 53 as a protective film. Fig. 18C As shown, the color filter 25 is formed. Then, holes (through holes) are formed in a portion of the silicon dioxide film on the a-silicon film 53, for example, at the four corners of the pixel P, and the a-silicon film 53 is etched through the holes. Thus, a void of the first portion 51 of the structure 50 is formed.

[0146] After the voids are formed, the pores are closed, for example, by a silicon dioxide film. Fig.18D As shown in FIG. 5 , a structure 50 having a gap of the first portion 51 is formed. Then, by forming the lens portion 21 and the like, the Fig.15 The imaging device 1 shown in the figure, etc. Note that the above-mentioned manufacturing method is only an example, and other manufacturing methods can also be used.

[0147] Next, a modification of the present disclosure will be described. Hereinafter, components similar to those in the above-described embodiment are denoted by the same reference numerals, and description thereof will be appropriately omitted.

[0148] (2-1. Fifth Modification)

[0149] Fig.19 1 is a diagram showing an example of a cross-sectional configuration of an imaging device according to a fifth modification of the present disclosure. Fig.19 In the example shown, a portion of the structure 50 may be disposed in the separation portion 15. Fig.19 In the example shown, a part of the second portion 52 (ie, the gap) of the structure 50 is formed in the separation portion 15. In the case of this modification, the same effects as those of the above-described embodiment can be achieved.

[0150] FIG. 20A to FIG. 20D 1 is a diagram showing an example of a method for manufacturing an imaging device according to a fifth modification. Fig. 20A As shown, on the semiconductor substrate 11 on which elements such as the photoelectric conversion unit 12 are formed, the metal compound layer 30 is formed. In addition, as the oxide film layer 40, a silicon dioxide film is formed.

[0151] Next, in Fig. 20B As shown in FIG. 1 , an a-silicon film 53 is formed by CVD, and a silicon dioxide film is formed as a protective film around the a-silicon film 53. Then, as shown in FIG. Fig. 20C As shown, a color filter 25 is formed.

[0152] Next, a hole is formed in a portion of the silicon dioxide film on the a-silicon film 53, and the a-silicon film 53 is etched through the hole. Thus, a gap is provided, and the first portion 51 and the second portion 52 of the structure 50 are formed. After the gap is formed, the hole is sealed with a silicon dioxide film, such as Fig.20D As shown, a structure 50 having a gap is formed. According to the above manufacturing method, a structure such as Fig.19 The imaging device 1 is shown.

[0153] (2-2. Sixth Modification Example)

[0154] Fig.21 1 is a diagram showing an example of a cross-sectional configuration of an imaging device according to a sixth modification. Fig.21 In the example shown, the structure 50 of the imaging device 1 may include a protective film 45 disposed between the color filter 25 and the gap. Fig.21 In the example shown, the protective film 45 is provided between the first portion 51 and the color filter 25 .

[0155] The protective film 45 is composed of at least one of an oxide film and a nitride film. The protective film 45 can be composed of a silicon dioxide film, a silicon nitride film, a silicon nitride oxide film, a metal oxide film (such as aluminum oxide, magnesium oxide), or the like.

[0156] <3. Application Examples>

[0157] The imaging device 1 and the like are applicable to various types of electronic equipment having an imaging function, for example, a camera system such as a digital camera or a video camera, a mobile phone having an imaging function, and the like. Fig. 22 The schematic structure of the electronic device 1000 is shown.

[0158] For example, the electronic device 1000 includes a lens group 1001, an imaging device 1, a digital signal processor (DSP) circuit 1002, a frame memory 1003, a display unit 1004, a recording unit 1005, an operation unit 1006 and a power supply unit 1007, and they are interconnected via a bus 1008.

[0159] The lens group 1001 absorbs incident light (image light) from a subject and forms an image on an imaging surface of the imaging device 1. The imaging device 1 converts the light amount of the incident light that forms an image on the imaging surface through the lens group 1001 into an electrical signal in units of pixels and supplies it to the DSP circuit 1002 as a pixel signal.

[0160] The DSP circuit 1002 is a signal processing circuit that processes a signal supplied from the imaging device 1. The DSP circuit 1002 outputs image data obtained by processing the signal from the imaging device 1. The frame memory 1003 temporarily stores the image data processed by the DSP circuit 1002 in units of frames.

[0161] The display section 1004 includes a panel-type display device such as a liquid crystal panel or an organic electroluminescence (EL) panel, and records image data of a moving image or a still image captured by the imaging device 1 in a recording medium such as a semiconductor memory or a hard disk.

[0162] The operation section 1006 outputs operation signals for various functions of the electronic device 1000 according to the user's operation. The power supply section 1007 supplies various power sources as operation power sources for the DSP circuit 1002, the frame memory 1003, the display section 1004, the recording section 1005, and the operation section 1006 to these supply targets as appropriate.

[0163] <4. Application Examples>

[0164] (Application example of mobile object)

[0165] The technology according to the present disclosure (the present technology) can also be applied to various products. For example, the technology of the present disclosure can be implemented as a device installed on any type of mobile body such as a car, an electric car, a hybrid electric car, a motorcycle, a bicycle, a personal mobile device, an airplane, an unmanned aerial vehicle, a ship, a robot, etc.

[0166] Fig.23 : is a block diagram showing an example of a schematic configuration of a vehicle control system as an example of a moving body control system to which the technology according to the embodiment of the present disclosure can be applied.

[0167] The vehicle control system 12000 includes a plurality of electronic control units connected to each other via a communication network 12001. Fig.23 In the example shown, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. In addition, a microcomputer 12051, a sound / image output unit 12052, and an in-vehicle network interface (I / F) 12053 are shown as the functional configuration of the integrated control unit 12050.

[0168] The drive system control unit 12010 controls the operation of devices related to the drive system of the vehicle according to various programs. For example, the drive system control unit 12010 serves as a control device for the following devices: a drive force generating device such as an internal combustion engine or a drive motor for generating a drive force for the vehicle; a drive force transmitting mechanism for transmitting the drive force to the wheels; a steering mechanism for adjusting the steering angle of the vehicle; and a braking device for generating a braking force for the vehicle, etc.

[0169] The body system control unit 12020 controls the operation of various devices provided to the vehicle body according to various programs. For example, the body system control unit 12020 is used as a control device for a keyless entry system, a smart key system, a power window device, or various lights such as a headlight, a taillight, a brake light, a turn signal light, or a fog light. In this case, radio waves transmitted from a portable device as a substitute for a key or signals of various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these input radio waves or signals, and controls the door lock device, the power window device, and lights of the vehicle.

[0170] The vehicle exterior information detection unit 12030 detects information about the exterior of the vehicle having the vehicle control system 12000. For example, the vehicle exterior information detection unit 12030 is connected to the imaging unit 12031. The vehicle exterior information detection unit 12030 causes the imaging unit 12031 to image the exterior of the vehicle and receives the captured image. Based on the received image, the vehicle exterior information detection unit 12030 can perform detection processing on objects such as people, vehicles, obstacles, signs, or symbols on the road surface, or detection processing of the distance to these objects.

[0171] The imaging unit 12031 is an optical sensor for receiving light and outputting an electrical signal corresponding to the amount of light received. The imaging unit 12031 may output the electrical signal as an image, or may output the electrical signal as information about the measured distance. In addition, the light received by the imaging unit 12031 may be visible light, or may be invisible light such as infrared rays.

[0172] The in-vehicle information detection unit 12040 detects information about the interior of the vehicle. For example, the in-vehicle information detection unit 12040 is connected to a driver state detection unit 12041 that detects the driver's state. The driver state detection unit 12041 includes, for example, a camera that images the driver. Based on the detection information input from the driver state detection unit 12041, the in-vehicle information detection unit 12040 can calculate the driver's fatigue level or the driver's concentration level, or can determine whether the driver is dozing off.

[0173] The microcomputer 12051 can calculate the control target value of the driving force generating device, the steering mechanism or the braking device based on the information about the inside or outside of the vehicle (the information is obtained by the outside information detection unit 12030 or the inside information detection unit 12040), and output the control command to the driving system control unit 12010. For example, the microcomputer 12051 can perform the coordinated control aimed at realizing the functions of the advanced driver assistance system (ADAS), which includes: collision avoidance or collision mitigation of the vehicle, following driving based on the vehicle-to-vehicle distance, vehicle speed maintenance driving, vehicle collision warning or vehicle lane departure warning, etc.

[0174] In addition, the microcomputer 12051 can perform collaborative control intended for autonomous driving, which enables the vehicle to drive autonomously by controlling a driving force generating device, a steering mechanism, or a braking device, etc. based on information about the interior or exterior of the vehicle (the information is obtained by the exterior information detection unit 12030 or the interior information detection unit 12040), without relying on the driver's operation.

[0175] In addition, the microcomputer 12051 can output a control command to the body system control unit 12020 based on information about the exterior of the vehicle, which is obtained by the exterior information detection unit 12030. For example, the microcomputer 12051 can perform cooperative control aimed at preventing glare by controlling the headlights to change from high beam to low beam according to the position of the preceding vehicle or the oncoming vehicle detected by the exterior information detection unit 12030.

[0176] The sound / image output unit 12052 transmits an output signal of at least one of sound and image to an output device that can visually or auditorily notify the vehicle's passengers or the outside of the vehicle of information. Fig.23 In the example of FIG. 1 , an audio speaker 12061, a display portion 12062, and an instrument panel 12063 are shown as output devices. For example, the display portion 12062 may include at least one of an in-vehicle display and a head-up display.

[0177] Fig.24 12031 is a diagram showing an example of the installation position of the imaging unit 12031.

[0178] exist Fig.24 In the figure, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104 and 12105.

[0179] The imaging units 12101, 12102, 12103, 12104 and 12105 are, for example, disposed at positions on the front nose, side mirrors, rear bumper and rear door of the vehicle 12100 and at positions on the upper portion of the windshield inside the vehicle. The imaging unit 12101 disposed on the front nose and the imaging unit 12105 disposed on the upper portion of the windshield inside the vehicle mainly obtain images in front of the vehicle 12100. The imaging units 12102 and 12103 disposed on the side mirrors mainly obtain images on the sides of the vehicle 12100. The imaging unit 12104 disposed on the rear bumper or rear door mainly obtains images of the rear of the vehicle 12100. The imaging unit 12105 disposed on the upper portion of the windshield inside the vehicle is mainly used to detect vehicles ahead, pedestrians, obstacles, signals, traffic signs or lanes, etc.

[0180] By the way, Fig.24 An example of the shooting range of the imaging units 12101 to 12104 is shown. Imaging range 12111 represents the imaging range of the imaging unit 12101 provided to the front nose. Imaging ranges 12112 and 12113 respectively represent the imaging ranges of the imaging units 12102 and 12103 provided to the side mirrors. Imaging range 12114 represents the imaging range of the imaging unit 12104 provided to the rear bumper or the rear door. For example, by superimposing the image data captured by the imaging units 12101 to 12104, a bird's-eye view image of the vehicle 12100 viewed from above is obtained.

[0181] At least one of the imaging units 12101 to 12104 may have a function of obtaining distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera composed of a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.

[0182] For example, the microcomputer 12051 can determine the distance to each three-dimensional object within the imaging range 12111 to 12114 and the time change of the distance (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104, thereby extracting the nearest three-dimensional object as the front vehicle, in particular, the three-dimensional object exists on the driving path of the vehicle 12100 and travels in the same direction as the vehicle 12100 at a predetermined speed (e.g., equal to or greater than 0 km / h). In addition, the microcomputer 12051 can set the following distance to be maintained between the vehicle in front and the front vehicle, and perform automatic braking control (including follow-up stop control) or automatic acceleration control (including follow-up start control), etc. Therefore, it is possible to perform cooperative control intended for automatic driving, which allows the vehicle to travel autonomously without relying on the driver's operation, etc.

[0183] For example, the microcomputer 12051 can classify the three-dimensional object data about the three-dimensional object into three-dimensional object data of two-wheeled vehicles, standard-sized vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on the distance information obtained from the imaging units 12101 to 12104, extract the classified three-dimensional object data, and use the extracted three-dimensional object data to automatically avoid obstacles. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 as obstacles that can be visually identified by the driver of the vehicle 12100 and obstacles that are difficult for the driver of the vehicle 12100 to visually identify. Then, the microcomputer 12051 determines a collision risk representing the risk of collision with each obstacle. When the collision risk is equal to or higher than the set value and therefore there is a possibility of collision, the microcomputer 12051 outputs a warning to the driver via the audio speaker 12061 or the display unit 12062, and performs forced deceleration or evasive steering through the drive system control unit 12010. The microcomputer 12051 can thereby assist driving to avoid collision.

[0184] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 may identify a pedestrian by determining whether there is a pedestrian in the captured images of the imaging units 12101 to 12104. For example, such identification of pedestrians is performed by a program that extracts feature points in the captured images of the imaging units 12101 to 12104 as infrared cameras and a program that determines whether it is a pedestrian by performing pattern matching processing on a series of feature points representing the outline of an object. When the microcomputer 12051 determines that there is a pedestrian in the captured images of the imaging units 12101 to 12104 and thus identifies the pedestrian, the sound / image output unit 12052 controls the display unit 12062 so that a square contour line for emphasis is displayed in a manner superimposed on the identified pedestrian. The sound / image output unit 12052 may also control the display unit 12062 so that an icon or the like representing a pedestrian is displayed at a desired position.

[0185] As described above, an example of a mobile body control system to which the technology of the present disclosure can be applied has been described. For example, the technology of the present disclosure can be applied to the imaging unit 12031 among the above-mentioned components. Specifically, for example, the imaging device 1 and the like are applied to the imaging unit 12031. By applying the technology of the present disclosure to the imaging unit 12031, a high-definition captured image can be obtained, and the mobile body control system can perform high-precision control using the captured image.

[0186] [Application examples of endoscopic surgery systems]

[0187] The technology disclosed herein (the present technology) can be applied to various products. For example, the technology disclosed herein can be applied to an endoscopic surgery system.

[0188] Fig.25 : is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to an embodiment of the present disclosure (the present technology) can be applied.

[0189] exist Fig.25 , a state is shown in which an operator (doctor) 11131 is using an endoscopic surgery system 11000 to perform surgery on a patient 11132 on a bed 11133. As shown in the figure, the endoscopic surgery system 11000 includes an endoscope 11100, other surgical tools 11110 such as a pneumoperitoneum tube 11111 and an energy device 11112, a support arm device 11120 supporting the endoscope 11100 thereon, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0190] The endoscope 11100 includes a lens barrel 11101, a region of a predetermined length from the distal end of the lens barrel is inserted into the body cavity of a patient 11132, and a camera head 11102, the camera head being connected to the proximal end of the lens barrel 11101. In the example shown, the endoscope 11100 configured as a rigid endoscope having a rigid lens barrel 11101 is shown. However, the endoscope 11100 may also be configured as a flexible endoscope having a flexible lens barrel 11101.

[0191] The lens barrel 11101 has an opening at its distal end in which an objective lens is mounted. The light source device 11203 is connected to the endoscope 11100 so that the light generated by the light source device 11203 is introduced into the distal end of the lens barrel 11101 through a light guide extending into the interior of the lens barrel 11101, and irradiated through the objective lens onto an observation target in the body cavity of the patient 11132. It should be noted that the endoscope 11100 may be a straight-view endoscope or may be an oblique-view endoscope or a side-view endoscope.

[0192] The optical system and the imaging element are arranged inside the camera head 11102 so that the reflected light (observation light) from the observation target is gathered on the imaging element through the optical system. The observation light is photoelectrically converted by the imaging element to generate an electric signal corresponding to the observation light, that is, an image signal corresponding to the observation image. The image signal is transmitted to the CCU 11201 as raw (RAW) data.

[0193] The CCU 11201 includes a central processing unit (CPU), a graphics processing unit (GPU), etc., and centrally controls the operations of the endoscope 11100 and the display device 11202. Further, for example, the CCU 11201 receives an image signal from the camera head 11102, and performs various image processing such as development processing (demosaic processing) on ​​the image signal to display an image based on the image signal.

[0194] The display device 11202 displays thereon an image based on an image signal that has been image-processed by the CCU 11201 under the control of the CCU 11201 .

[0195] For example, the light source device 11203 includes a light source such as a light emitting diode (LED) and provides the endoscope 11100 with illumination light for imaging the surgical area.

[0196] The input device 11204 is an input interface of the endoscopic surgery system 11000. The user can input various information or instructions to the endoscopic surgery system 11000 through the input device 11204. For example, the user may input instructions to change the imaging conditions (type of irradiation light, magnification, focal length, etc.) of the endoscope 11100.

[0197] The treatment tool control device 11205 controls the driving of the energy device 11112 to burn or cut tissue, seal blood vessels, etc. The pneumoperitoneum device 11206 supplies gas into the body cavity of the patient 11132 through the pneumoperitoneum tube 11111 to expand the body cavity in order to ensure the field of view of the endoscope 11100 and to ensure the working space of the operator. The recorder 11207 is a device capable of recording various information related to the operation. The printer 11208 is a device capable of printing various information related to the operation in various forms such as text, images, or graphics.

[0198] It should be noted that the light source device 11203 that provides irradiation light when imaging the surgical area to the endoscope 11100 can be composed of a white light source, for example, a white light source composed of an LED, a laser light source, or a combination thereof. In the case where the white light source is composed of a combination of red, green, and blue (RGB) laser light sources, since the output intensity and output timing of each color (each wavelength) can be controlled with high precision, the white balance of the captured image can be adjusted by the light source device 11203. Further, in this case, if the laser beams from the respective RGB laser light sources are irradiated on the observation target in a time-division manner, the driving of the imaging element of the camera head 11102 is controlled synchronously with the irradiation timing. Then, images corresponding to the R, G, and B colors, respectively, can also be captured in a time-division manner. According to this method, a color image can be obtained even if a color filter is not configured for the imaging element.

[0199] Furthermore, the drive of the light source device 11203 can be controlled so as to change the intensity of the light to be output at predetermined intervals. By controlling the drive of the imaging element of the camera head 11102 in synchronization with the timing of the change in light intensity to acquire images in a time-division manner and synthesize the images, a high dynamic range image can be created without underexposed shadows and overexposed highlights.

[0200] Further, the light source device 11203 can be configured to provide light of a predetermined wavelength band corresponding to special light observation. For example, in special light observation, by utilizing the wavelength dependence of light absorption of body tissue, light of a narrow band compared to the irradiation light (i.e., white light) during ordinary observation is irradiated, and narrow-band observation (narrow-band imaging) is performed on predetermined tissues such as blood vessels in the surface layer of the mucosa with high contrast. Alternatively, in special light observation, fluorescence observation for obtaining an image from fluorescence generated by irradiating excitation light can be performed. In fluorescence observation, fluorescence observation (autofluorescence observation) of body tissue can be performed by irradiating excitation light on body tissue, or a fluorescent image can be obtained by locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating excitation light corresponding to the fluorescence wavelength of the reagent on the body tissue. The light source device 11203 can be configured to provide such narrow-band light and / or excitation light suitable for special light observation as described above.

[0201] Fig.26 It is shown Fig.25 A block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown.

[0202] The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a driving unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected by a transmission cable 11400 so as to communicate with each other.

[0203] The lens unit 11401 is an optical system provided at a connection position with the lens barrel 11101. Observation light entering from the distal end of the lens barrel 11101 is guided to the camera head 11102 and introduced into the lens unit 11401. The lens unit 11401 is composed of a combination of a plurality of lenses including a zoom lens and a focus lens.

[0204] The number of imaging elements included in the imaging unit 11402 can be one (single-board type) or multiple (multi-board type). For example, when the imaging unit 11402 is configured as a multi-board type, image signals corresponding to each R, G and B are generated by the imaging element, and the image signals can be synthesized to obtain a color image. The imaging unit 11402 can also be configured to have a pair of imaging elements for acquiring a right-eye image signal and a left-eye image signal corresponding to a three-dimensional (3D) display. If a 3D display is performed, then the operator 11131 can more accurately grasp the depth of the living tissue in the surgical area. It should be noted that when the imaging unit 11402 is configured as a stereoscopic type, a plurality of lens unit 11401 systems are set corresponding to each imaging element.

[0205] Further, the imaging unit 11402 may not necessarily be disposed on the camera head 11102. For example, the imaging unit 11402 may be disposed just behind the objective lens inside the lens barrel 11101.

[0206] The driving unit 11403 is composed of an actuator, and moves the zoom lens and the focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. Therefore, the magnification and focus of the image captured by the imaging unit 11402 can be appropriately adjusted.

[0207] The communication unit 11404 is constituted by a communication device for sending and receiving various information to and from the CCU 11201. The communication unit 11404 transmits the image signal acquired from the imaging unit 11402 to the CCU 11201 through the transmission cable 11400 as RAW data.

[0208] In addition, the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201, and supplies the control signal to the camera head control unit 11405. For example, the control signal includes information related to imaging conditions, such as information specifying a frame rate of a captured image, information specifying an exposure value when capturing an image, and / or information specifying a magnification and a focus of a captured image.

[0209] It should be noted that imaging conditions such as frame rate, exposure value, magnification or focus may be specified by the user or may be automatically set based on the acquired image signal by the control unit 11413 of the CCU 11201. In the latter case, an automatic exposure (AE) function, an automatic focus (AF) function, and an automatic white balance (AWB) function are provided in the endoscope 11100.

[0210] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 through the communication unit 11404 .

[0211] The communication unit 11411 is constituted by a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted thereto from the camera head 11102 through the transmission cable 11400.

[0212] Further, the communication unit 11411 transmits a control signal for controlling the driving of the camera head 11102 to the camera head 11102. The image signal and the control signal may be transmitted through electrical communication, optical communication, or the like.

[0213] The image processing unit 11412 performs various image processing on the image signal in the form of RAW data transmitted thereto from the camera head 11102 .

[0214] The control unit 11413 performs various controls related to image capturing of the operation area, etc. through the endoscope 11100 and display of captured images obtained by image capturing of the operation area, etc. For example, the control unit 11413 creates a control signal for controlling the driving of the camera head 11102 .

[0215] Further, the control unit 11413 controls the display device 11202 to display a captured image in which the surgical area, etc., is photographed based on the image signal that has been image-processed by the image processing unit 11412. At this time, the control unit 11413 can use various image recognition technologies to recognize various objects in the captured image. For example, the control unit 11413 can recognize surgical tools such as surgical forceps, specific living body areas, bleeding, fog when the energy device 11112 is used, etc. by detecting the shape, color, etc. of the edge of the object contained in the captured image. When the control unit 11413 controls the display device 11202 to display the captured image, it can use the recognition result to display various surgical support information in an overlapping manner with the image of the surgical area. In the case where the surgical support information is displayed in an overlapping manner and presented to the operator 11131, the burden of the operator 11131 can be reduced and the operator 11131 can reliably perform the operation.

[0216] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 to each other is an electric signal cable for electric signal communication, an optical fiber for optical communication, or a composite cable for electric communication and optical communication.

[0217] Here, although in the illustrated example, communication is performed by wired communication using the transmission cable 11400, communication between the camera head 11102 and the CCU 11201 may be performed by wireless communication.

[0218] As described above, an example of an endoscopic surgical system to which the technology of the present disclosure can be applied has been described. The technology of the present disclosure can be preferably applied to, for example, the imaging unit 11402 provided in the camera head 11102 of the endoscope 11100 among the above-mentioned components. By applying the technology of the present disclosure to the imaging unit 11402, the sensitivity of the imaging unit 11402 can be improved, and a high-definition endoscope 11100 can be provided.

[0219] Although the present disclosure has been described above using embodiments, variations, applicable examples, and application examples, the present disclosure is not limited to the embodiments, etc., and various variations are possible. For example, although the above-mentioned variations have been described as variations of the embodiments, the components of each variation can be appropriately combined.

[0220] The imaging device according to the embodiment of the present disclosure includes a plurality of pixels, the pixels including a photoelectric conversion unit for photoelectrically converting light; a color filter provided for each pixel, a separation unit provided between adjacent photoelectric conversion units; a structure having a gap provided between adjacent color filters, and a metal compound layer provided on the photoelectric conversion unit between the color filter and the photoelectric conversion unit. The structure is provided from between adjacent color filters to the metal compound layer and connected to the separation unit. Therefore, the occurrence of color mixing can be prevented.

[0221] Note that the effects described here are merely examples and are not restrictive, and other effects may be present. In addition, the present disclosure may also have the following configurations.

[0222] (1) An imaging device comprising:

[0223] A plurality of pixels including a photoelectric conversion unit for photoelectrically converting light;

[0224] a color filter provided for each of the pixels;

[0225] A separation section provided between adjacent photoelectric conversion sections;

[0226] A structure having a gap disposed between adjacent color filters; and

[0227] A metal compound layer is provided on the photoelectric conversion section between the color filter and the photoelectric conversion section, wherein

[0228] The structure is provided from between the adjacent color filters to the metal compound layer and is connected to the separation portion.

[0229] (2) The imaging device according to (1), wherein the metal compound layer includes a layer made of a metal oxide or a metal nitride.

[0230] (3) The imaging device according to (1) or (2), wherein the structure is in contact with the metal compound layer.

[0231] (4) The imaging device according to any one of (1) to (3), further including an oxide film layer provided between the color filter and the metal compound layer.

[0232] (5) The imaging device according to any one of (1) to (4), wherein the structure extends between the oxide film layer and the metal compound layer.

[0233] (6) The imaging device according to any one of (1) to (5), wherein the metal compound layer includes a film having a fixed charge.

[0234] (7) The imaging device according to any one of (1) to (5), wherein the metal compound layer includes a film having a fixed charge and an antireflection film.

[0235] (8) The imaging device according to (7), wherein

[0236] The film having fixed charges is provided on the photoelectric conversion unit, and

[0237] The antireflection film is provided on the film having fixed charges.

[0238] (9) The imaging device according to any one of (1) to (8), wherein

[0239] The structure includes a first portion disposed between adjacent color filters and a second portion disposed along the metal compound layer to the separation portion.

[0240] The first portion is constituted by a void, and

[0241] The second portion is composed of a metal film.

[0242] (10) The imaging device according to (9), wherein the second portion includes a first metal film provided on the metal compound layer and a second metal film provided on the first metal film.

[0243] (11) The imaging device according to (9) or (10), further comprising:

[0244] An oxide film layer is provided between the color filter and the metal compound layer, wherein

[0245] A portion of the first portion is disposed in the oxide film layer.

[0246] (12) The imaging device according to any one of (9) to (11), wherein a part of the second portion is provided in the separation section.

[0247] (13) The imaging device according to any one of (9) to (12), further comprising:

[0248] A plurality of light receiving parts of the pixels are provided, wherein:

[0249] The structure includes the second portion having different sizes according to the distance from the center of the light receiving portion.

[0250] (14) The imaging device according to any one of (1) to (8), wherein

[0251] The structure includes a first portion disposed between adjacent color filters and a second portion disposed along the metal compound layer to the separation portion, and

[0252] The first portion and the second portion are formed by a void.

[0253] (15) The imaging device according to (14), wherein a part of the second portion is provided in the separation portion.

[0254] (16) The imaging device according to (14) or (15), wherein the structure includes a protective film provided between the color filter and the space.

[0255] (17) The imaging device according to (16), wherein the protective film includes at least one of an oxide film and a nitride film.

[0256] (18) The imaging device according to any one of (14) to (17), further comprising:

[0257] A plurality of light receiving parts of the pixels are provided, wherein

[0258] The structure includes the second portion having different sizes according to the distance from the center of the light receiving portion.

[0259] (19) The imaging device according to any one of (1) to (18), wherein the structure is provided so as to surround the color filter.

[0260] (20) The imaging device according to any one of (1) to (19), wherein the separation portion includes a groove provided around the photoelectric conversion portion.

[0261] This application claims the benefit of Japanese Priority Patent Application No. 2022-123953 filed with the Japan Patent Office on August 3, 2022, the entire contents of which are incorporated herein by reference.

[0262] It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alterations may occur depending on design requirements and other factors insofar as they are within the scope of the appended claims or the equivalents thereof.

Claims

1. An imaging device, comprising: A plurality of pixels including a photoelectric conversion unit for photoelectrically converting light; a color filter provided for each of the pixels; A separation section provided between adjacent photoelectric conversion sections; A structure having a gap disposed between adjacent color filters; as well as A metal compound layer is provided on the photoelectric conversion section between the color filter and the photoelectric conversion section, wherein The structure is provided from between the adjacent color filters to the metal compound layer and is connected to the separation portion. 2 . The imaging device according to claim 1 , wherein the metal compound layer comprises a layer made of a metal oxide or a metal nitride. 3 . The imaging device according to claim 1 , wherein the structure is in contact with the metal compound layer. 4 . The imaging device according to claim 1 , further comprising an oxide film layer provided between the color filter and the metal compound layer.

5. The imaging device according to claim 4, wherein: The structure extends between the oxide film layer and the metal compound layer.

6. The imaging device according to claim 1, wherein: The metal compound layer includes a film having a fixed charge.

7. The imaging device according to claim 1, wherein: The metal compound layer includes a film having a fixed charge and an antireflection film.

8. The imaging device according to claim 7, wherein The film having fixed charges is provided on the photoelectric conversion unit, and The antireflection film is provided on the film having fixed charges.

9. The imaging device according to claim 1, wherein The structure includes a first portion disposed between adjacent color filters and a second portion disposed along the metal compound layer to the separation portion. The first portion is constituted by a void, and The second portion is composed of a metal film. 10 . The imaging device according to claim 9 , wherein the second portion includes a first metal film provided on the metal compound layer and a second metal film provided on the first metal film.

11. The imaging device according to claim 9, further comprising: An oxide film layer is provided between the color filter and the metal compound layer, wherein A portion of the first portion is disposed in the oxide film layer. 12 . The imaging device according to claim 9 , wherein a portion of the second portion is disposed in the separation portion.

13. The imaging device according to claim 9, further comprising: A plurality of light receiving parts of the pixels are provided, wherein: The structure includes the second portion having different sizes according to the distance from the center of the light receiving portion.

14. The imaging device according to claim 1, wherein The structure includes a first portion disposed between adjacent color filters and a second portion disposed along the metal compound layer to the separation portion, and The first portion and the second portion are formed by a void. 15 . The imaging device according to claim 14 , wherein a portion of the second portion is disposed in the separation portion.

16. The imaging device according to claim 14, wherein the structure comprises a protective film disposed between the color filter and the gap.

17. The imaging device according to claim 16, wherein: The protective film includes at least one of an oxide film and a nitride film.

18. The imaging device according to claim 14, further comprising: A plurality of light receiving parts of the pixels are provided, wherein The structure includes the second portion having different sizes according to the distance from the center of the light receiving portion.

19. The imaging device of claim 1, wherein the structure is disposed to surround the color filter. 20 . The imaging device according to claim 1 , wherein the separation portion includes a groove provided around the photoelectric conversion portion.

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