Preparation method of circuit board and circuit board

Abstract

The invention relates to the field of circuit board preparation, in particular to a preparation method of a circuit board and the circuit board, the circuit board comprises a mounting frame, two groove rods are rotatably connected to the mounting frame, the lower ends of the two groove rods are fixedly connected with glue extruding heads, the upper ends of the two glue extruding heads are fixedly connected with connecting pipes, and the connecting pipes are communicated with the glue extruding heads on the same sides. A double-end electric push rod is fixedly connected to the mounting frame, the two moving ends of the double-end electric push rod are slidably connected into the two groove rods correspondingly, a rubber barrel is fixedly connected to the lower end of the double-end electric push rod, a sliding plug is slidably connected into the rubber barrel, a rubber discharging pipe is arranged at the upper end of the rubber barrel, a push plate is fixedly connected to the lower end of the sliding plug, and two connecting rods are rotatably connected to the push plate; according to the circuit board anti-skidding device, two anti-skidding rubber pads can be machined on the front face and the back face of a circuit board, and the circuit board has the anti-skidding performance and the abrasion resistance when stacked.

Description

Technical Field

[0001] The present invention relates to the field of circuit board preparation, and in particular to a method for preparing a circuit board and a circuit board. Background Art

[0002] Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. In electronic equipment, they are mainly used to connect various electronic components and play the role of structural support. In the prior art, after batch processing of circuit boards, multiple circuit boards are usually stacked together, and the direct contact between the circuit boards is prone to wear due to friction, which affects the quality of the circuit boards. In addition, the stacked circuit boards are not skid-resistant enough, and are prone to tipping over and causing damage to the circuit boards. Therefore, this application is proposed to address the above problems. Summary of the invention

[0003] In view of this, the technical problem to be solved by the present invention is to provide a method for preparing a circuit board and a circuit board. The present invention can process two anti-slip rubber pads on the front and back sides of the circuit board, so that the circuit boards have anti-slip and wear-resistant properties when stacked.

[0004] A circuit board preparation device comprises a mounting frame, which is rotatably connected to two slot rods, the lower ends of the two slot rods are fixedly connected to glue extrusion heads, the upper ends of the two glue extrusion heads are fixedly connected to connecting tubes, the connecting tubes are communicated with the glue extrusion heads on the same side, and a double-headed electric push rod is fixedly connected to the mounting frame, the two moving ends of the double-headed electric push rod are respectively slidably connected to the two slot rods, and the two moving ends of the double-headed electric push rod are respectively located in the middle of the two slot rods.

[0005] The lower end of the double-head electric push rod is fixedly connected with a rubber cylinder, a sliding plug is slidably connected in the rubber cylinder, and a rubber discharge pipe is arranged at the upper end of the rubber cylinder.

[0006] The lower end of the sliding plug is fixedly connected with a push plate, and the push plate is rotatably connected with two connecting rods, and the other ends of the two connecting rods are respectively slidably connected in the grooves of the two groove rods.

[0007] The upper end of the rubber cylinder is fixedly connected with a feed pipe, and both the feed pipe and the rubber discharge pipe are equipped with a one-way valve.

[0008] A circuit board preparation device also includes a base, a turntable is rotatably connected to the base, and a plurality of card slots are fixedly connected to the upper end of the turntable.

[0009] The mounting frame is fixedly connected with a discharge piece, which is arc-shaped.

[0010] The lower end of the base is fixedly connected with a driving motor, and the turntable is fixedly connected to the output shaft of the driving motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0012] Figure 1 and Figure 2 It is a schematic diagram of the overall structure of a circuit board preparation device;

[0013] Figure 3 It is a structural schematic diagram of the unloading piece;

[0014] Figure 4 is a schematic diagram of the structure of the turntable;

[0015] Figure 5 is a schematic diagram of the structure of the mounting frame;

[0016] Figure 6 It is a structural schematic diagram of the rubber extrusion head;

[0017] Figure 7 It is a structural schematic diagram of the push plate;

[0018] Figure 8 It is a schematic diagram of the structure of the rubber cartridge. DETAILED DESCRIPTION

[0019] The present invention is described in detail with reference to the accompanying drawings in the embodiments of the present invention.

[0020] See also Figure 5-8 ,

[0021] A circuit board preparation device includes a mounting frame 201, which is connected to two slot rods 204 by shaft rotation, the lower ends of the two slot rods 204 are fixedly connected to glue extrusion heads 205 by bolts, the upper ends of the two glue extrusion heads 205 are fixedly connected to connecting pipes 206, and the connecting pipes 206 are communicated with the glue extrusion heads 205 on the same side thereof, and a double-headed electric push rod 203 is fixedly connected to the mounting frame 201 by bolts, the two moving ends of the double-headed electric push rod 203 are respectively slidably connected in the two slot rods 204, and the two moving ends of the double-headed electric push rod 203 are respectively located in the middle positions of the two slot rods 204.

[0022] When using the preparation device, first place the circuit board to be processed vertically between the two glue extruding heads 205. At this time, the two moving ends of the double-headed electric push rod 203 are controlled to extend to push the two slot rods 204 outward to rotate respectively. The lower ends of the two slot rods 204 respectively drive the two glue extruding heads 205 to move toward the middle, so that the two glue extruding heads 205 are buckled on the front and back sides of the circuit board. At the same time, quick-drying glue is respectively introduced into the two glue extruding heads 205 through the two connecting tubes 206, and the quick-drying glue is evenly applied to the edge of the circuit board in the form of thin strips through the two glue extruding heads 205. Then, the two moving ends of the double-headed electric push rod 203 are controlled to contract, so that the two glue extruding heads 205 are separated from the circuit board at the same time. The quick-drying glue on the circuit board automatically solidifies after encountering air to form a thin strip of anti-slip rubber pad.

[0023] The device can process two anti-skid rubber pads on both the front and back sides of the circuit board, so that a gap is generated in the middle when the processed circuit boards are stacked together, thereby preventing the circuit boards from contacting and causing wear, which would affect the normal use of the circuit boards. At the same time, the anti-skid rubber pads play an anti-skid role. When the circuit boards are stacked together, the friction between the circuit boards can be increased, thereby preventing the circuit boards from sliding and tipping over, and preventing the circuit boards from being damaged by bumps.

[0024] See also Figure 8 ,

[0025] The lower end of the double-headed electric push rod 203 is fixedly connected to a rubber cylinder 301 through bolts, a sliding plug 304 is slidably connected inside the rubber cylinder 301, and a rubber discharge pipe 303 is arranged at the upper end of the rubber cylinder 301.

[0026] The rubber cylinder 301 is used to store quick-drying glue. The glue discharge pipe 303 on the rubber cylinder 301 is connected to the two connecting pipes 206 through a hose. When the two groove rods 204 rotate outward, the sliding plug 304 is controlled to slide upward, so that pressure is generated inside the rubber cylinder 301, and the quick-drying glue can be discharged through the glue discharge pipe 303, and finally discharged through the two glue extruding heads 205, thereby realizing the glue supply function.

[0027] See also Figure 5-8 ,

[0028] The lower end of the sliding plug 304 is fixedly connected to a push plate 305 by bolts, and the push plate 305 is rotatably connected to two connecting rods 306 by an axis, and the other ends of the two connecting rods 306 are slidably connected in the grooves of the two groove rods 204 respectively.

[0029] When the two slot rods 204 rotate outward, the two slot rods 204 pull the push plate 305 upward through the two connecting rods 306 respectively, so that the push plate 305 drives the sliding plug 304 to move upward to achieve the function of glue discharge. By utilizing the cooperation of the two connecting rods 306 and the push plate 305, the function of glue discharge when the two glue extruding heads 205 are engaged is achieved, without the need to control the sliding plug 304 separately, thereby simplifying the operation steps.

[0030] See also Figure 8 ,

[0031] A feed pipe 302 is welded to the upper end of the rubber cylinder 301 , and both the feed pipe 302 and the rubber discharge pipe 303 are installed with a one-way valve.

[0032] The feed pipe 302 is used to connect with the container filled with quick-drying glue. When the sliding plug 304 slides upward, the one-way valve in the glue discharge pipe 303 opens, and the one-way valve in the feed pipe 302 closes, thereby realizing the glue discharge function. When the sliding plug 304 slides downward, negative pressure is generated inside the glue cylinder 301. At this time, the one-way valve in the glue discharge pipe 303 is closed, and the one-way valve in the feed pipe 302 is opened. The glue cylinder 301 extracts the quick-drying glue through the feed pipe 302, thereby realizing the function of automatically extracting the quick-drying glue.

[0033] See also Figure 1-4 ,

[0034] The preparation device further comprises a base 101 , on which a turntable 103 is rotatably connected via a middle bearing, and a plurality of slots 104 are fixedly connected to the upper end of the turntable 103 via bolts.

[0035] When processing a circuit board, the circuit board to be processed is inserted into the card slot 104 on the turntable 103. The card slot 104 serves to limit the circuit board and can keep the circuit board in a vertical state. When the circuit board moves to the middle of the two glue extruding heads 205, the function of gluing is achieved by controlling the two glue extruding heads 205 to buckle. After the gluing is completed, the two glue extruding heads 205 are controlled to open and the turntable 103 continues to rotate so that the circuit board enters the next process.

[0036] See also Figure 3 ,

[0037] A discharge piece 202 is fixedly connected to the mounting frame 201 by bolts, and the discharge piece 202 is arc-shaped.

[0038] When the glue-coated circuit board continues to move with the turntable 103, the circuit board comes into contact with the unloading piece 202. As the turntable 103 gradually moves, the circuit board gradually begins to separate from the slot 104. When the circuit board completely separates from the slot 104, the automatic unloading function is realized.

[0039] See also Figure 2 ,

[0040] The lower end of the base 101 is fixedly connected to the driving motor 102 via bolts, and the turntable 103 is fixedly connected to the output shaft of the driving motor 102 via a coupling.

[0041] The driving motor 102 is used to drive the turntable 103 to rotate, thereby realizing the function of transporting the circuit board.

[0042] See also Figure 3 ,

[0043] The surface of the stripping piece 202 is bonded with wear-resistant rubber, which plays a role in protecting the circuit board and preventing the stripping piece 202 from wearing the circuit board when in contact with the circuit board.

[0044] A method for preparing a circuit board using a circuit board preparation device, the method comprising the following steps:

[0045] Step 1: inserting the circuit board to be processed into the card slot 104 on the turntable 103;

[0046] Step 2: Control the turntable 103 to rotate so that the circuit board to be processed moves to the middle position between the two glue extrusion heads 205;

[0047] Step 3: By controlling the two glue extruding heads 205 to buckle on the front and back sides of the circuit board, the two glue extruding heads 205 evenly apply the quick-drying glue in thin strips on the edge of the circuit board;

[0048] Step 4: Control the two moving ends of the double-headed electric push rod 203 to contract, so that the two glue extruding heads 205 are separated from the circuit board at the same time, and the quick-drying glue on the circuit board automatically solidifies to form a thin strip of anti-slip rubber pad after encountering air;

[0049] Step 5: Use the unloading piece 202 to remove the glue-coated circuit board from the card slot 104 .

[0050] The circuit board prepared by the circuit board preparation device and the preparation method has two anti-skid rubber pads on both the front and back sides of the circuit board.

Claims

1. A circuit board preparation device, characterized in that: The utility model comprises a mounting frame (201), two slotted rods (204) are rotatably connected to the mounting frame (201), the lower ends of the two slotted rods (204) are fixedly connected to a rubber extrusion head (205), the upper ends of the two rubber extrusion heads (205) are fixedly connected to a connecting pipe (206), the connecting pipe (206) is communicated with the rubber extrusion head (205) on the same side, a double-headed electric push rod (203) is fixedly connected to the mounting frame (201), the two movable ends of the double-headed electric push rod (203) are respectively slidably connected in the two slotted rods (204), and the two movable ends of the double-headed electric push rod (203) are respectively located in the middle of the two slotted rods (204).

2. A circuit board preparation device according to claim 1, characterized in that: The lower end of the double-headed electric push rod (203) is fixedly connected to a rubber cylinder (301), a sliding plug (304) is slidably connected inside the rubber cylinder (301), and a rubber discharge pipe (303) is arranged at the upper end of the rubber cylinder (301).

3. A circuit board preparation device according to claim 2, characterized in that: The lower end of the sliding plug (304) is fixedly connected to a push plate (305), and two connecting rods (306) are rotatably connected to the push plate (305). The other ends of the two connecting rods (306) are respectively slidably connected in the grooves of the two groove rods (204).

4. A circuit board preparation device according to claim 3, characterized in that: The upper end of the rubber cylinder (301) is fixedly connected to a feed pipe (302), and both the feed pipe (302) and the rubber discharge pipe (303) are installed with a one-way valve.

5. A circuit board preparation device according to claim 4, characterized in that: It also comprises a base (101), a rotating disk (103) is rotatably connected to the base (101), and a plurality of slots (104) are fixedly connected to the upper end of the rotating disk (103).

6. A circuit board preparation device according to claim 5, characterized in that: The mounting frame (201) is fixedly connected with a material discharge piece (202), and the material discharge piece (202) is arc-shaped.

7. A circuit board preparation device according to claim 6, characterized in that: The lower end of the base (101) is fixedly connected to a driving motor (102), and the rotating disk (103) is fixedly connected to the output shaft of the driving motor (102).

8. A circuit board preparation device according to claim 6, characterized in that: The surface of the discharge sheet (202) is bonded with wear-resistant rubber.

9. A method for preparing a circuit board using the circuit board preparation device according to claim 7, characterized in that: The method comprises the following steps: Step 1: inserting the circuit board to be processed into the card slot (104) on the rotating disk (103); Step 2: The circuit board to be processed is moved to the middle position between the two glue extrusion heads (205) by controlling the rotation of the turntable (103); Step 3: by controlling the two glue extruding heads (205) to buckle onto the front and back sides of the circuit board, the two glue extruding heads (205) evenly apply the quick-drying glue in the form of thin strips on the edge of the circuit board; Step 4: Control the two moving ends of the double-headed electric push rod (203) to contract, so that the two glue extruding heads (205) are separated from the circuit board at the same time, and the quick-drying glue on the circuit board automatically solidifies to form a thin strip of anti-slip rubber pad after encountering air; Step 5: Use the unloading sheet (202) to remove the glue-coated circuit board from the card slot (104).

10. The circuit board prepared by the circuit board preparation device and preparation method according to claim 9 is characterized in that: Two anti-skid rubber pads are arranged on the front and back sides of the circuit board.

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