Crystal bar supporting structure and crystal bar supporting flatness adjusting method

Abstract

The invention relates to a crystal bar supporting structure and a crystal bar supporting flatness adjusting method, the crystal bar supporting structure is applied to a crystal bar cutting device, and the crystal bar supporting structure comprises a base; the supporting groove is formed in the base and used for supporting a crystal bar to be cut off, the supporting groove extends in the first direction, a supporting plate is arranged on the side wall of the supporting groove, and the face, away from the base, of the supporting plate is constructed to be an obliquely-arranged supporting face; the cutting groove is formed in the base, the cutting groove extends in the second direction, and the first direction and the second direction are arranged in a crossed mode; the supporting surface is provided with first areas arranged close to the cutting groove, and each first area is provided with the corresponding pressure sensor; and the processing structure is used for judging whether the crystal bar is flatly placed or not according to the pressure information sensed by the pressure sensor.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor product manufacturing, and in particular to a crystal rod support structure and a method for adjusting the flatness of the crystal rod support. Background Art

[0002] In the production process of wafers widely used in many fields such as the semiconductor industry and the photovoltaic industry, it is first necessary to use the direct pulling method to pull out a crystal rod. Due to the large size of the crystal rod, the crystal rod needs to be cut into multiple segments before use. Each crystal rod segment is then cut into a thin slice of initial wafer by methods such as multi-wire cutting. After the initial wafer undergoes grinding, polishing, and possible epitaxial processing, a finished wafer can be obtained.

[0003] The crystal rod is cut into multiple segments after the rolling process. In the process of the entire crystal rod being segmented into silicon ingots (i.e., cut into multiple segments) after rolling, the cutter is an indispensable device. In the crystal rod cutter, the crystal rod needs to be placed on the support table or cutting table of the crystal rod cutter, and the crystal rod is cut and cut by a cutting device such as a wire cutting device or a band saw cutting device. The support table is generally a V-shaped mechanism, hereinafter referred to as a V-shaped workbench. The V-shaped workbench is the main workbench for the cutter to process the crystal rod after rolling. It is mainly composed of small pieces of V-shaped workbenches that are not directly welded together. The main part of the crystal rod after rolling is a standard cylinder. The unevenness of the V-shaped workbench will cause the crystal rod to have a height difference on both sides of the cutting point during the cutting process, thereby causing the silicon ingot obtained by cutting to collapse, resulting in production capacity loss. The main reasons include: the unevenness of the V-shaped workbench itself, residual silicon slag / debris on the V-shaped workbench, and the warping or damage of the V-shaped workbench tape. This requires us to adjust the V-shaped workbench. However, since most cases are to find the cause and make adjustments after the loss has occurred, the current structure of the V-shaped workbench cannot fully avoid the loss.

[0004] Among them, the common methods for checking the flatness of the V-type workbench are:

[0005] (1) Standard crystal rod pusher measurement: the flatness of the V-shaped workbench is judged based on the traces left by the crystal rod on the V-shaped workbench. The disadvantages of this method are that the pusher process is cumbersome and laborious, and the specific accuracy cannot be controlled.

[0006] (2) Dial indicator test: the flatness of one side of the V-shaped workbench is judged based on the dial indicator. The disadvantage of this method is that it requires high operator operability.

[0007] The disadvantages of the above two methods are that they cannot be monitored in real time. When the edge of the silicon ingot collapses, the abnormality of the V-shaped workbench cannot be discovered in the first time, and the verification and adjustment process is cumbersome and time-consuming. Summary of the invention

[0008] In order to solve the above technical problems, the present invention provides a crystal rod support structure and a method for adjusting the flatness of the crystal rod support to solve the problem of edge collapse of the silicon ingot obtained by cutting due to the height difference on both sides of the crystal rod at the cutting point caused by the unevenness of the V-shaped workbench.

[0009] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present invention is: a crystal rod support structure applied to a crystal rod cutting device, comprising:

[0010] Pedestal;

[0011] A supporting groove is provided on the base and is used to support the crystal rod to be cut, the supporting groove is extended along a first direction, a supporting plate is provided on the side wall of the supporting groove, and a surface of the supporting plate away from the base is constructed as an inclined supporting surface;

[0012] A cutting groove is arranged on the base, the cutting groove is extended along a second direction, and the first direction and the second direction are arranged to intersect;

[0013] A pressure sensor, wherein the support surface has a first area arranged close to the cutting groove, and each of the first areas is provided with the pressure sensor;

[0014] The processing structure is used to determine whether the crystal rod is placed flat according to the pressure information sensed by the pressure sensor.

[0015] Optionally, the processing structure is used to determine that the crystal rod is unevenly placed when the pressure sensed by at least one of the pressure sensors is zero.

[0016] Optionally, the processing structure is used to determine that the crystal ingot is unevenly placed when the pressure values ​​sensed by the pressure sensors on two first areas located on the same support surface are different.

[0017] Optionally, in the second direction, the pressure sensor is located in the middle of the first area.

[0018] Optionally, the depth of the cutting groove is greater than the depth of the supporting groove.

[0019] Optionally, the first direction and the second direction are arranged perpendicular to each other.

[0020] Optionally, a recovery groove is provided on the base, and the recovery groove is formed by extending from the bottom of the supporting groove toward the direction close to the base.

[0021] Optionally, the depth of the cutting groove is greater than or equal to the sum of the depths of the supporting groove and the recovery groove.

[0022] Optionally, the pressure sensor is embedded in the supporting surface, and a sensing surface of the pressure sensor is flush with the supporting surface.

[0023] An embodiment of the present invention further provides a crystal rod cutting device, comprising the above-mentioned crystal rod supporting structure.

[0024] An embodiment of the present invention provides a method for adjusting the flatness of a crystal rod support, which is applied to the above-mentioned crystal rod support structure, and includes:

[0025] The crystal ingot is placed on the above-mentioned crystal ingot supporting structure;

[0026] Receiving pressure information sensed by a pressure sensor disposed on the support surface;

[0027] Whether the crystal rod is placed flat is determined according to the pressure information, and when the crystal rod is placed unevenly, the position information of the uneven first area is obtained, a gap piece is added to the uneven first area, or a gap piece is set at a position corresponding to the first area on a side of the support plate close to the base to level the first area.

[0028] Optionally, judging whether the crystal ingot is placed flat according to the pressure information specifically includes:

[0029] When the pressure sensed by at least one of the pressure sensors is zero, it is determined that the crystal rod is unevenly placed, and / or when the pressure values ​​sensed by the pressure sensors on the two first areas on the same support surface are different, it is determined that the crystal rod is unevenly placed.

[0030] The beneficial effect of the present invention is as follows: a pressure sensor is arranged on the first area of ​​the support surface close to the cutting groove, and after the crystal rod is placed on the support groove, the pressure provided by the crystal rod is sensed by the pressure sensor. If there is a gap between the crystal rod and the support surface of the support groove, the pressure sensed by the corresponding pressure sensor is zero. If a height difference occurs on different sides of the cutting groove, the pressure values ​​sensed by the pressure sensors on different sides of the cutting groove are different. Therefore, the flatness of the crystal rod placement can be judged according to the pressure information sensed by the pressure sensor, thereby avoiding the occurrence of poor crystal rod cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram showing a crystal rod support structure in an embodiment of the present invention;

[0032] Figure 2 A schematic diagram showing a crystal rod support structure in an embodiment of the present invention. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0034] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0035] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0036] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0037] refer to Figure 1 and Figure 2 The embodiment of the present invention provides a crystal rod support structure, which is applied to a crystal rod cutting device, including:

[0038] Base 1;

[0039] A support groove 2 is provided on the base 1 and is used to support the crystal rod to be cut, the support groove 2 is extended along a first direction, a support plate 4 is provided on the side wall of the support groove 2, and a side of the support plate 4 away from the base 1 is configured as an inclined support surface 5;

[0040] A cutting groove 3 is provided on the base 1, wherein the cutting groove 3 extends along a second direction, and the first direction intersects with the second direction;

[0041] The pressure sensor 10, the support surface 5 has a first area arranged close to the cutting groove 3, and each of the first areas is provided with the pressure sensor 10;

[0042] The processing structure is used to determine whether the crystal rod is placed flat according to the pressure information sensed by the pressure sensor 10.

[0043] A pressure sensor 10 is arranged on the support surface 5 , and pressure information sensed by the pressure sensor 10 can be used to determine whether the crystal rod is in contact with the support surface 5 .

[0044] The support groove 2 includes two oppositely arranged side walls, and the support plate 4 is arranged on each side wall. The two side walls are defined as a first side wall and a second side wall, the support plate 4 arranged on the first side wall is defined as a first support plate, and the support plate 4 arranged on the second side wall is defined as a second support plate. The support surface 5 on the first support plate is defined as a first support surface, and the support surface 5 on the second support plate is defined as a second support surface. In the extension direction of the support groove 2, the first support surface includes two first areas located on opposite sides of the cutting groove 3, and the pressure sensor 10 is arranged on these two first areas. The pressure information sensed by the pressure sensor 10 can be used to determine whether the crystal rod is in contact with the two first areas of the first support surface, and the pressure information sensed by the pressure sensor 10 can be used to determine whether there is a height difference between the first areas of the first support surface located on opposite sides of the cutting groove 3. Similarly, the second supporting surface includes two first areas located on opposite sides of the cutting groove 3, and the pressure sensor 10 is arranged on these two first areas. The pressure information sensed by the pressure sensor 10 can be used to determine whether the crystal rod is in contact with the two first areas of the second supporting surface, and the pressure information sensed by the pressure sensor 10 can be used to determine whether there is a height difference between the first areas of the second supporting surface located on opposite sides of the cutting groove 3.

[0045] In summary, by setting the pressure sensor 10, the flatness of the support surface 5 of the support groove 2 can be determined, that is, whether the crystal rod is placed flat, so that the staff can promptly discover the problem of uneven support of the crystal support structure and make corresponding adjustments, thereby avoiding the occurrence of problems such as edge collapse of the crystal rod when the crystal rod is cut due to the height difference on both sides of the cutting groove 3.

[0046] It should be noted that the support plate 4 and the support groove 2 may be an integral structure formed in one piece, or the support plate 4 and the support groove 2 may be separate structures connected and fixed together by a connector.

[0047] It should be noted that the reference Figure 1 The position indicated by the circle is the cutting groove 3. At the cutting groove 3, four first regions are formed, that is, four pressure sensors 10 are arranged on the two support surfaces 5. Due to the display angle problem, Figure 1 Only two pressure sensors 10 are shown in FIG. 1 , but it should be understood that a pressure sensor 10 is also arranged on the corresponding first area of ​​the other support surface.

[0048] In the embodiment in which the support plate 4 and the support slot 2 are separate structures, the support plate 4 may be fixedly connected to the support slot 2 or detachably connected. In the embodiment in which the support plate 4 and the support slot 2 are separate structures, preferably, the support plate 4 and the support slot 2 are detachably connected to facilitate replacement and maintenance of the support plate 4.

[0049] In an exemplary embodiment, the processing structure is used to determine that the crystal rod is unevenly placed when the pressure sensed by at least one of the pressure sensors 10 is zero.

[0050] The pressure sensed by the pressure sensor 10 is zero, indicating that the crystal rod is not in contact with the supporting surface 5 , that is, there is a gap between the crystal rod and the corresponding supporting surface 5 , that is, the crystal rod is not placed flat, which can easily lead to poor cutting.

[0051] The gap may be caused by external force, for example, there are debris such as silicon slag on one of the first regions, in which case it is sufficient to remove the debris. The gap may also be caused by the structure of the two first regions, in which case a gap sheet (a stainless steel sheet with a thickness of 0.1 mm) or other structure may be added to the first region where the gap is generated, so that the heights of the first regions on opposite sides of the cutting groove 3 on the same support surface 5 are the same, but the invention is not limited thereto.

[0052] In an exemplary embodiment, the processing structure is used to determine that the crystal ingot is unevenly placed when the pressure values ​​sensed by the pressure sensors 10 located in two first areas of the same support surface 5 are different.

[0053] It should be noted that the cutting groove 3 and the supporting groove 2 are arranged to intersect, that is, the same supporting surface 5 is divided into two parts at the cutting groove 3, and the same supporting surface 5 has two first areas on opposite sides of one cutting groove 3.

[0054] When the pressure values ​​sensed by the pressure sensor 10 on the two first regions located on the same support surface 5 are different, it indicates that there is a height difference between the two first regions and the crystal rod is not placed flat.

[0055] When there is a height difference between the two first regions of the same support surface 5 , the height difference between the two first regions can be compensated by adding a gap sheet on the first region with a lower height.

[0056] In an exemplary embodiment, when the pressure information sensed by the two pressure sensors 10 located on the same side of the cutting groove 3 in the extension direction perpendicular to the cutting groove 3 is different, it means that the inclination angles of the two supporting surfaces 5 are different.

[0057] Exemplarily, the inclination angles of the two support surfaces need to be in opposite directions and have the same angle, for example, both can be 15 degrees, but this is not limited to this.

[0058] Exemplarily, in a direction perpendicular to the extending direction of the support groove, the minimum width of the support groove is 55 mm, but is not limited thereto.

[0059] In an exemplary embodiment, in the second direction, the pressure sensor 10 is located in the middle of the first area.

[0060] By adopting the above solution, it is ensured that after the crystal rod is supported on the supporting groove 2, the crystal rod is above the pressure sensor 10, and when the supporting surface 5 of the supporting groove 2 remains flat, the crystal rod can contact the pressure sensor 10 to ensure the sensing accuracy.

[0061] It should be noted that the number of the support grooves 2 provided on the base 1 can be set according to actual needs, and can be one or more. In the embodiment in which a plurality of the support grooves 2 are provided on the base 1, the plurality of the support grooves 2 are arranged side by side.

[0062] In an exemplary embodiment, the number of the cutting grooves 3 can be determined according to the length of the crystal rod and the number of segments that the crystal rod needs to be cut into.

[0063] In an exemplary embodiment, the depth of the cutting groove 3 is greater than the depth of the supporting groove 2 .

[0064] The above solution is adopted to ensure that the crystal rod can be completely cut off and the cutting quality of the product is guaranteed.

[0065] In some embodiments, the cutting groove 3 extends toward the base 1 and penetrates the base 1, that is, the support groove 2 includes at least two sections of sub-support grooves, and the two sections of sub-support grooves are arranged at intervals to form the cutting groove 3 between the two sections of the sub-support grooves. In this way, the width of the cutting groove 3 can be flexibly controlled.

[0066] In an exemplary embodiment, the first direction and the second direction are arranged perpendicular to each other.

[0067] The supporting groove 2 and the cutting groove 3 are arranged perpendicularly, so that the steel wire or band saw for cutting the crystal rod is perpendicular to the axial direction of the crystal rod, and the cutting surface is also perpendicular to the axial direction of the crystal rod, which is convenient for further processing the end face of the crystal rod to a required angle, and the cut waste can also fall completely into the cutting groove 3.

[0068] In an exemplary embodiment, a recovery groove 6 is disposed on the base 1 , and the recovery groove 6 is formed by extending from the bottom of the support groove 2 toward a direction close to the base 1 .

[0069] During the process of cutting the crystal rod, cutting fluid will be sprayed toward the cutting position, and the recovery tank 6 is provided to recover the cutting fluid.

[0070] In an exemplary embodiment, the depth of the cutting groove 3 is greater than or equal to the sum of the depths of the supporting groove 2 and the recovery groove 6 .

[0071] The above solution is adopted to ensure that the crystal rod can be completely cut off and the cutting quality of the product is guaranteed.

[0072] In an exemplary embodiment, the pressure sensor 10 is embedded in the support surface 5 , and the sensing surface of the pressure sensor 10 is flush with the support surface 5 .

[0073] By adopting the above solution, the pressure information sensed by the pressure sensor 10 can be used to accurately determine whether the crystal rod is placed flat.

[0074] In an exemplary embodiment, the crystal rod supporting structure further includes a display screen 11 for displaying pressure information sensed by the pressure sensor 10 .

[0075] The display screen 11 can intuitively display the pressure value information sensed by the pressure sensor 10 , so that the staff can obtain the pressure information sensed by the pressure sensor 10 in a timely manner.

[0076] Exemplarily, a plurality of display screens 11 having the same number as the pressure sensors 10 may be provided, that is, the display screens 11 and the pressure sensors 10 are provided in a one-to-one correspondence, so that the pressure sensor 10 corresponding to the pressure information displayed on the display screen 11 can be intuitively obtained. Of course, one display screen 11 may also be provided, and one display screen 11 displays the pressure information of all the pressure sensors 10. In this case, different pressure sensors 10 may be numbered so that the displayed pressure information may correspond to the corresponding pressure sensor.

[0077] Exemplarily, the processing structure further includes an alarm unit, and the alarm unit is used to issue an alarm when the processing structure determines that the crystal rod is not placed flat.

[0078] Exemplarily, the alarm unit may be a voice alarm; or a display alarm, such as displaying a corresponding red pattern on the display screen 11; or a light alarm, for example, when the processing structure determines that the crystal rod is placed unevenly, the alarm light is on, otherwise, the alarm light is in the off state.

[0079] An embodiment of the present invention further provides a crystal rod cutting device, comprising the above-mentioned crystal rod supporting structure.

[0080] In some embodiments, in order to prevent the crystal rod from shifting during the crystal rod cutting process, the crystal rod cutting device also includes a clamping structure, which includes a pressure plate arranged on the support groove 2, and the pressure plate can be fixed to the top wall of the support groove 2 by bolts.

[0081] Exemplarily, the pressing plate may include an arc-shaped groove, the shape of which matches the shape of the crystal rod, so as to effectively fix the crystal rod.

[0082] Exemplarily, when the pressure plate is disposed on the supporting groove 2 , the orthographic projection of the pressure plate on the base 1 is located on one side of the orthographic projection of the cutting groove 3 on the base 1 , so as to avoid the setting of the pressure plate affecting the truncation of the crystal rod.

[0083] In some embodiments, in order to prevent the crystal rod from shifting during the crystal rod cutting process, the crystal rod cutting device also includes an adsorption structure, and the adsorption structure includes an adsorption hole arranged on the support surface 5. The adsorption hole can pass through the support plate 4 and the side wall of the support groove 2 to fix the crystal rod by adsorption.

[0084] An embodiment of the present invention provides a method for adjusting the flatness of a crystal rod support, which is applied to the above-mentioned crystal rod support structure, and includes:

[0085] The crystal ingot is placed on the above-mentioned crystal ingot supporting structure;

[0086] Receiving pressure information sensed by a pressure sensor 10 disposed on the support surface 5;

[0087] Whether the crystal rod is placed flat is determined based on the pressure information, and when the crystal rod is placed unevenly, the position information of the uneven first area is obtained, and a gap piece is added to the uneven first area, or a gap piece is set at a position corresponding to the first area on one side of the support plate 4 close to the base 1 to level the first area.

[0088] In an exemplary embodiment, judging whether the crystal rod is placed flat according to the pressure information specifically includes:

[0089] When the pressure sensed by at least one of the pressure sensors 10 is zero, it is determined that the crystal rod is unevenly placed, and / or when the pressure values ​​sensed by the pressure sensors 10 located in two first areas on the same support surface 5 are different, it is determined that the crystal rod is unevenly placed.

[0090] There are a few points to note:

[0091] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0092] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0093] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0094] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A crystal rod support structure, applied to a crystal rod cutting device, characterized in that: include: Pedestal; A supporting groove is provided on the base and is used to support the crystal rod to be cut, the supporting groove is extended along a first direction, a supporting plate is provided on the side wall of the supporting groove, and a surface of the supporting plate away from the base is constructed as an inclined supporting surface; A cutting groove is arranged on the base, the cutting groove is extended along a second direction, and the first direction and the second direction are arranged to intersect; A pressure sensor, wherein the support surface has a first area arranged close to the cutting groove, and each of the first areas is provided with the pressure sensor; The processing structure is used to determine whether the crystal rod is placed flat according to the pressure information sensed by the pressure sensor.

2. The crystal rod support structure according to claim 1, characterized in that: The processing structure is used to determine that the crystal rod is unevenly placed when the pressure felt by at least one of the pressure sensors is zero.

3. The crystal rod support structure according to claim 1, characterized in that: The processing structure is used for determining that the crystal ingot is unevenly placed when the pressure values ​​sensed by the pressure sensors on the two first areas on the same support surface are different.

4. The crystal rod support structure according to claim 1, characterized in that: In the second direction, the pressure sensor is located in the middle of the first area.

5. The crystal rod support structure according to claim 1, characterized in that: The depth of the cutting groove is greater than the depth of the supporting groove.

6. The crystal rod support structure according to claim 1, characterized in that: The first direction and the second direction are arranged perpendicularly to each other.

7. The crystal rod support structure according to claim 1, characterized in that: The base is provided with a recovery groove, which is formed by extending from the bottom of the support groove toward the direction close to the base.

8. The crystal rod support structure according to claim 7, characterized in that: The depth of the cutting groove is greater than or equal to the sum of the depths of the supporting groove and the recovery groove.

9. The crystal rod support structure according to claim 1, characterized in that: The pressure sensor is embedded in the supporting surface, and the sensing surface of the pressure sensor is flush with the supporting surface.

10. A crystal rod cutting device, characterized in that: The invention comprises a crystal rod supporting structure as described in any one of claims 1 to 9.

11. A method for adjusting the flatness of a crystal rod support, applied to the crystal rod support structure according to any one of claims 1 to 9, characterized in that: include: The crystal ingot is placed on the crystal ingot supporting structure according to any one of claims 1 to 9; Receiving pressure information sensed by a pressure sensor disposed on the support surface; Whether the crystal rod is placed flat is determined according to the pressure information, and when the crystal rod is placed unevenly, the position information of the uneven first area is obtained, a gap piece is added to the uneven first area, or a gap piece is set at a position corresponding to the first area on a side of the support plate close to the base to level the first area.

12. The method for adjusting the flatness of a crystal rod support according to claim 11, characterized in that: Judging whether the crystal ingot is placed flat according to the pressure information specifically includes: When the pressure sensed by at least one of the pressure sensors is zero, it is determined that the crystal rod is unevenly placed, and / or when the pressure values ​​sensed by the pressure sensors on the two first areas on the same support surface are different, it is determined that the crystal rod is unevenly placed.

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